CN1674766A - CO2 laser drilling hole method - Google Patents
CO2 laser drilling hole method Download PDFInfo
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- CN1674766A CN1674766A CN 200410026625 CN200410026625A CN1674766A CN 1674766 A CN1674766 A CN 1674766A CN 200410026625 CN200410026625 CN 200410026625 CN 200410026625 A CN200410026625 A CN 200410026625A CN 1674766 A CN1674766 A CN 1674766A
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Abstract
The present invention relates to a CO2 laser drilling method for making microconductive through-hole on printed circuit base board. It is characterized by that every microconductive through-hole can be stepwise made up by adopting at least two CO2 laser pulses, and the energy parameter of every laser pulse can be individually set. Said invention not only can raise the production efficiency, but also can obviously raise the quality of making microconductive through-hole.
Description
Affiliated technical field
The present invention relates to a kind of method of on tellite, carrying out laser drill, particularly a kind of method that adopts carbon dioxide laser boring.
Background technology
Along with miniaturization, the portability of electronic equipment, more and more require the circuit densification on printed circuit board (PCB).Adapt with above-mentioned requirements, occurred in recent years on conventional high-density printed circuit board the one or both sides sequential lamination laminated multi-layer tellite of high density conductive layer (being generally 2～4 layers) more, has littler lightly conducting hole on this plate, thinner thickness of insulating layer and meticulous more short and small live width/spacing.Between the tellite of the stacked on top of one another in aforesaid multilayer printed board, need carry out electric connection to conductive layer, wherein conductive layer generally is made up of copper figure (pattern), and insulating barrier is generally made by organic materials such as insulating resin layers.Aforesaid being electrically connected in the following way finished, at first on the relevant position of tellite, process the lightly conducting hole, electroplate last layer copper at the hole wall in lightly conducting hole then, this copper layer can be realized the electric interconnection of the electroconductive copper patterning layer of levels tellite.
(can reach 100 along with the hole count in the lightly conducting hole of the laminated multi-layer tellite of high interconnection density is more and more, 000 hole/layer), aperture more and more littler (less than Φ 0.1mm) utilizes laser drill to obtain using widely as a kind of not only economy but also the mode of processing the lightly conducting hole efficiently.
In the procedure for processing of whole tellite, the crudy in lightly conducting hole is that the problem thought is taken a lot of trouble very much by manufacturer always on the tellite, its reason mainly contains two aspects, the quantity that on the one hand is the hole that processes on the tellite is quite huge, wherein have hole processing existing problems promptly can cause certain loss, therefore requiring has advantages of higher stability on the crudy of laser drill; On the other hand because the particularity of the operation of machining hole, the crudy in lightly conducting hole can't effectively detect after this operation, final detection just can be known after will waiting until electro-coppering and electrical, if therefore boring goes wrong, will cause bigger loss, this just has higher requirement to the crudy of boring.
General at present employing carbon dioxide laser is processed the lightly conducting hole, the carbon dioxide laser wavelength is at 9.4～10.6um, be a kind of far infrared laser, most organic materials have the ultrared characteristics of strong absorption, organic material is after having absorbed high infrared laser power, fusing rapidly, vaporization and burning, thereby between the copper patterning layer of multilayer printed board, form the lightly conducting hole, the hole wall in lightly conducting hole can couple together the copper patterning layer of adjacent layer after cleaning and electro-coppering, realizes highdensity electric interconnection.
Carbon dioxide laser can not the worked copper graph layer, the position that needs to need earlier to process the lightly conducting hole on tellite adopts the method for chemical etching to remove copper patterning layer, leave " window " identical with the aperture size in lightly conducting hole, and then process corresponding lightly conducting hole with carbon dioxide laser.As shown in Figure 1, the general at present pulse carbon dioxide laser processing mode that adopts, the Energy distribution of laser on the diametric(al) of light beam is Gaussian, promptly the beam center energy is the highest, reduces gradually along the radial direction energy.Adopting pulse impact mode to add man-hour, the energy at hole wall place and center, hole has than big-difference, therefore work in-process is in order to form certain hole wall quality (mainly being the pointed cone angle), the energy operated by rotary motion of laser beam bigger, and the laser energy of center, hole is then bigger.When the laser energy at center, hole shone on the copper patterning layer of internal layer, part energy was reflexed to by the internal layer copper patterning layer on the insulating barrier of lightly conducting hole sidewall, and part energy is absorbed by the copper patterning layer of internal layer.Reflex to energy on the sidewall in lightly conducting hole and be insulated layer and absorb, cause lateral erosion and form cydariform hole (be that port size is little, hole waist size is big).The energy that is absorbed by the internal layer copper patterning layer makes internal layer copper patterning layer temperature raise and the generation buckling deformation, and then causes internal layer copper patterning layer and insulating barrier to be separated, and forms layering or foaming phenomenon.
Can there be serious hidden danger in the lightly conducting hole that has these quality problems in follow-up processing with in using, if residual at the bottom of the hole have an insulating material, the hole by electro-coppering after, there is insulating barrier between copper layer of electroplating and the internal layer copper patterning layer, very easily cause electrical open, even residue is less, electrically conducting, but because that copper electroplating layer and internal layer copper patterning layer connect true area is little, adhesive strength is poor, in follow-up soldering processing or product use,, electric path is disconnected because thermal shock stress or distortional stress very easily cause the copper electroplating layer fracture.Equally, because layering or the bubble problem that excessively causes of ablating also can cause similar consequence.And the cydariform hole that occurs because of lateral erosion (is that port size is little, hole waist size is big), in the hole metallization operation of back, easily cause poor plating, this bad electrodeposited coating is prone to fracture and comes off in follow-up processing and use phenomenon causes serious quality problems.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, a kind of carbon dioxide laser boring method of crudy of the lightly conducting hole that can obviously improve tellite is provided.
The technical solution adopted for the present invention to solve the technical problems is: it adopts the mode of being carried out substep processing at least by two carbon dioxide laser pulses to each lightly conducting hole, and each pulsed laser energy parameter is set separately.
The present invention with respect to the advantage that prior art had is: the present invention not only makes the easier control of crudy in lightly conducting hole of tellite, improved the crudy in lightly conducting hole significantly, and in the processing process of reality also and find no the problem that production efficiency significantly descends, solved quality and the mutually unified problem of efficient preferably.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic diagram of existing pulse carbon dioxide laser boring method related to the present invention.
Fig. 2 is the schematic diagram of multiple-pulse carbon dioxide laser boring method of the present invention.
Fig. 3 a is the design sketch after first pulse completion of processing in the multiple-pulse carbon dioxide laser boring method of the present invention.
Fig. 3 b is the design sketch after second pulse completion of processing in the multiple-pulse carbon dioxide laser boring method of the present invention.
Fig. 3 c is the design sketch after the 3rd pulse completion of processing in the multiple-pulse carbon dioxide laser boring method of the present invention.
Embodiment
See also Fig. 2, Fig. 3 a, Fig. 3 b and Fig. 3 c, the mode that carbon dioxide laser boring method of the present invention has adopted a plurality of pulses to process step by step, the mode that multiple-pulse is processed step by step is meant and adopts a plurality of laser pulses to carry out substep processing to same lightly conducting hole, on laser controlling, the energy of each pulse is controlled respectively simultaneously.Wherein umber of pulse is the highest is set to 10, and the energy of laser pulse can be by setting pulse duration and setting the pulse period and determine.
In the process in the processing lightly conducting hole of reality, select different processing umber of pulse and pulse energy for use according to different insulating layer materials, consider the problem of working (machining) efficiency (productivity ratio) simultaneously, generally adopt three pulses (1., 2., 3.) to process.See also Fig. 2, first pulse 1. laser energy of usefulness should be maximum in three pulses, and the processing sequence by pulse reduces energy successively then.Multiple pulses can thoroughly be removed the residue on the copper patterning layer t, carry out hole burning because of the pulse that does not adopt a macro-energy simultaneously, so be difficult for producing lateral erosion and the copper patterning layer t layering bubble problem that occurs owing to energy is excessive, the hole shape that processes is controlled easily, the error (for example thickness of insulating layer and the material uniformity) of tellite itself is also had stronger adaptive capacity.The effect of three pulses processing is shown in Fig. 3 a, Fig. 3 b and Fig. 3 c, and wherein Fig. 3 a shows is the 1. design sketch after the completion of processing of first pulse, and it finishes most processing tasks; Fig. 3 b shows is the 2. design sketch after the completion of processing of second pulse, and it is machined to the copper patterning layer t of lower floor; Fig. 3 c shows is the 3. design sketch after the completion of processing of the 3rd pulse, and its effect is to remove residually, forms pointed cone angle (hole wall gradient).
The present invention is the significant improvement to the pulse processing mode, not only make the easier control of crudy in lightly conducting hole of tellite, improved the quality in processing lightly conducting hole significantly, and in the processing process of reality also and find no the problem that production efficiency significantly descends, solved quality and the mutually unified problem of efficient preferably.Simultaneously, owing in actual production, improved the qualification rate of finished product tellite significantly, solved the bottle footpath problem in the tellite processing procedure preferably, also impel the technology in the processing printed circuit substrate lightly conducting of carbon dioxide laser hole ripe and practical more, established the position that the carbon dioxide laser drilling technique is in a leading position in the processing in the lightly conducting hole of tellite.
Claims (5)
1. carbon dioxide laser boring method that is used for the lightly conducting hole of processing printed circuit substrate, it is characterized in that: each lightly conducting hole adopts at least two carbon dioxide laser pulse to carry out substep processing, and each pulsed laser energy parameter is set separately.
2. carbon dioxide laser boring method according to claim 1 is characterized in that: the carbon dioxide laser pulse number that adopt in each lightly conducting hole is more than or equal to 2, and is less than or equal to 10.
3. carbon dioxide laser boring method according to claim 2 is characterized in that: first pulse is with laser energy maximum in all pulses, and the processing sequence by pulse reduces energy successively then.
4. carbon dioxide laser boring method according to claim 1 is characterized in that: each lightly conducting hole adopts three carbon dioxide laser pulses to carry out substep processing.
5. carbon dioxide laser boring method according to claim 4 is characterized in that: first pulse is with laser energy maximum in three pulses, and the processing sequence by pulse reduces energy successively then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410026625 CN1674766A (en) | 2004-03-24 | 2004-03-24 | CO2 laser drilling hole method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410026625 CN1674766A (en) | 2004-03-24 | 2004-03-24 | CO2 laser drilling hole method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1674766A true CN1674766A (en) | 2005-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410026625 Pending CN1674766A (en) | 2004-03-24 | 2004-03-24 | CO2 laser drilling hole method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1946266B (en) * | 2005-10-06 | 2010-05-12 | Mec株式会社 | Method of manufacturing a printed circuit board |
| CN101925268A (en) * | 2010-05-07 | 2010-12-22 | 竞华电子(深圳)有限公司 | Preparation method of sandwich plate |
| CN101372071B (en) * | 2008-09-12 | 2011-06-08 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN102026484B (en) * | 2009-09-22 | 2013-01-02 | 奈电软性科技电子(珠海)有限公司 | Pressing and breakover process and laminating board structure of circuit board |
| CN103596368A (en) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | Improved direct laser drilling processing method |
| CN105722340A (en) * | 2015-12-25 | 2016-06-29 | 惠州中京电子科技有限公司 | Blind hole processing method of PCB |
| CN110035864A (en) * | 2016-12-12 | 2019-07-19 | 住友重机械工业株式会社 | Laser pulse cuts out device and laser processing |
-
2004
- 2004-03-24 CN CN 200410026625 patent/CN1674766A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1946266B (en) * | 2005-10-06 | 2010-05-12 | Mec株式会社 | Method of manufacturing a printed circuit board |
| CN101372071B (en) * | 2008-09-12 | 2011-06-08 | 上海美维科技有限公司 | Method for directly drilling blind hole by laser using carbon dioxide |
| CN102026484B (en) * | 2009-09-22 | 2013-01-02 | 奈电软性科技电子(珠海)有限公司 | Pressing and breakover process and laminating board structure of circuit board |
| CN101925268A (en) * | 2010-05-07 | 2010-12-22 | 竞华电子(深圳)有限公司 | Preparation method of sandwich plate |
| CN101925268B (en) * | 2010-05-07 | 2012-07-04 | 竞华电子(深圳)有限公司 | Preparation method of sandwich plate |
| CN103596368A (en) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | Improved direct laser drilling processing method |
| CN105722340A (en) * | 2015-12-25 | 2016-06-29 | 惠州中京电子科技有限公司 | Blind hole processing method of PCB |
| CN110035864A (en) * | 2016-12-12 | 2019-07-19 | 住友重机械工业株式会社 | Laser pulse cuts out device and laser processing |
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