CN103281878A - Manufacturing method for printed circuit board with penetrating-through holes - Google Patents
Manufacturing method for printed circuit board with penetrating-through holes Download PDFInfo
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- CN103281878A CN103281878A CN2013102330603A CN201310233060A CN103281878A CN 103281878 A CN103281878 A CN 103281878A CN 2013102330603 A CN2013102330603 A CN 2013102330603A CN 201310233060 A CN201310233060 A CN 201310233060A CN 103281878 A CN103281878 A CN 103281878A
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Abstract
The invention discloses a manufacturing method for a printed circuit board with penetrating-through holes. The manufacturing method for the printed circuit board with the penetrating-through holes comprises the following steps that a substrate is cut into small splicing plates according to a splicing plate design size; plate edge locating holes and blind holes of the small splicing plates are processed through lasers; the small splicing plates are turned over to the other face; plate edge locating holes of the other face are processed through the lasers, conducting layers and an insulating layer which correspond to the back side of the positions of the blind holes are processed, and through holes are formed; residues in the through holes are cleared by using a plasma cleaning machine; conductive paste is arranged in the through holes through a silkprint hole filling mode; finally, light curing processing or thermocuring processing is carried out, and the manufacturing process of the guiding circuit board with the through holes is completed. The manufacturing method for the printed circuit board with the through holes can improve the fineness of the penetrating-through holes and the wiring density of the circuit board to a great degree, meanwhile, the manufacturing and processing procedure of the printed circuit board is shortened, using of consumable materials is reduced, producing cost is reduced, the yield of products and quality reliability are improved, a manufacturing process belongs to a dry process and does not relate to any chemical medicine liquid of a wet process, and surroundings cannot be polluted.
Description
Technical field
The present invention relates to a kind of manufacture method of printed circuit board, more specifically is a kind of manufacture method that runs through the via hole printed circuit board.
Background technology
Existing running through in the via hole printed circuit board manufacture craft process, make small via hole and need use mechanical rotary head, numerically controlled drill, consumptive materials such as Aluminum cover, chock plate are finished the machining of via hole.Realize that interconnection then needs to carry out chemical Treatment afterwards to crossing aperture advanced row polish-brush deburring, industry abbreviates etchback as, general liquid medicine adopts potassium permanganate to handle more, carry out the hole wall metallization subsequently, namely the process of chemical depositing copper and electro-coppering is finally finished the making of conducting via hole.Original technology exists can't process small via hole, as the hole below 100 microns; Broken needle rate height in the course of processing, the micropore quality yield is low, generally only is about 85%; And equipment precision and rotating speed aspect are required very high, general positioning accuracy need be less than 15 microns, and the main shaft velocity of rotation generally will surpass more than per minute 200,000 changes; Also need adopt consumptive materials such as special Aluminum cover and chock plate in addition, and can't be recycling, many to the wasting of resources, and manufacturing cost is higher.Before the hole wall metallization, need to adopt the chemical Treatment hole wall, be easy to generate a large amount of industrial wastes, environment is damaged.Hole copper plating process subsequently, not only power consumption and copper utilance are not high, and cost recovery is big, and a large amount of copper ion waste liquids of generation cause severe contamination to environment, and being needs superseded backward technology.
Existing processing blind hole by laser industry also is technology commonly used in the industry, but all be confined to the processing of blind hole, can't process the via that runs through of high aspect ratio, aspect ratio is greater than the via that runs through of 2:1, and the via hole pass after the processing is poor, is unfavorable for follow-up plated-through hole.In addition, the former technological process process-cycle is long, need rig tool edges of boards location hole in advance, paste dry film, development, chemical etching, open the laser window step, and in existing laser drilling technology, conductive layer need be anticipated or attenuate, and the blind hole quality problem is more, the difficult control of bottom, hole machining energy parameter, and pass is poor, and after the blind hole processing, generally also need adopt chemical method to carry out the hole wall etchback and carve and handle and electroplate process for filling hole and could realize conducting.Wherein electroplating filling perforation is inefficient high energy consumption, does not meet the backward technology of environmental requirement, and circuit board downstream client in use complains the defective of bottom, blind hole hole interconnect failure through regular meeting.
(1) Chinese patent application CN200910063179.4 discloses a kind of method of processing blind hole by laser, and its this method UV laser pulse of will fixing a point combines with UV laser helix or concentric circular scans, and multilayer circuit board is carried out single order blind hole or the processing of multistage blind hole.But this method working (machining) efficiency is low, and machining accuracy is not high, is not suitable for rapid batch production, only is confined to blind hole processing, and the end copper of injuring easily.
(2) Chinese patent application CN200410026626.6 discloses a kind of UV method for drilling holes for the lightly conducting hole on the processing printed circuit substrate, scanned along certain track in the position in needs processing lightly conducting hole by the UV laser beam, process several micropores successively, be covered with the area on the whole surface that the lightly conducting hole encloses until the micropore that processes, whole lightly conducting hole is chiseled and carved out.But this method is the processing that is confined to Microvia equally, and working (machining) efficiency is lower, needs multiple pulses processing, is not suitable for rapid batch production.
(3) Chinese patent application CN200810042935.0 discloses a kind of method that adopts the direct drilling blind hole of carbon dioxide laser, adopting two or more different apertures to carry out laser directly holes, i.e. two apertures or many apertures pattern, comprise the steps to be: 1) according to the pore size of wanting machining hole, selected aperture, the size of control laser pulse spot, the copper layer with on the pulse ablation processing plate plate face makes the copper layer form an opening; 2) select another aperture again, change the size of laser pulse spot, this size is less than the size of laser pulse spot in the step 1), adopts ablate on the processing plate plate faces dielectric layer under the copper layer of opening of one or more pulses, so far, form a blind hole on the processing plate.But this method only is confined to the processing of blind hole, does not relate to method for processing through hole.Use chemical method to carry out preliminary treatment and the processing of attenuate copper before the laser drill, what use after boring is that electroplating technology is realized conducting.
(4) Chinese patent application CN200510103274.4 discloses a kind of copper window that need not to etch open, and is cost-saved, improves the direct CO2 method for drilling holes of laser drill precision.But via hole processing use is machine drilling in this method, need mill and bore edges of boards location hole step, and also uses chemical method to carry out preliminary treatment and the processing of attenuate copper before the laser processing, and what use after boring is that electroplating technology is realized conducting.
In sum, the manufacturing technology that present available circuit plate runs through the conducting via hole only is confined to use machine drilling manufacturing, the integrated artistic flow process is tediously long, relates to a plurality of steps, and main flow process is: cutting plate-punching limit location hole-lamination-boring-deburring-etchback-heavy copper-plating.Problems such as the serious chemical pollution that original technology exists, high energy consumption, and can't the adaptive circuit panel products, the development trend of light, thin, little and high density interconnect.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method that runs through the via hole printed circuit board, this method can be processed more small conducting via hole, and its aperture is less than 100 microns, and yield can reach more than 98%, and position, hole precision is provided in 50 microns by original 75 microns.The laser that this method adopts bores and runs through via hole, traditional laser blind hole of having any different, not only realize the effect that conducting runs through, and improve the vertical-horizontal proportion of small via hole, the present invention does not simultaneously adopt traditional chemical etching or brill to mill the contraposition mode of edges of boards location hole, simplify and shorten work flow, also saved production cost.The conducting via hole of this method processing simultaneously all adopts dry process, i.e. plasma gas ablution and conducting objects completion method technology, and whole process does not relate to any chemical industry liquid medicine, i.e. energy-conserving and environment-protective.
For achieving the above object, the invention provides following technical scheme:
A kind of manufacture method that runs through the via hole printed circuit board may further comprise the steps:
(1) earlier substrate is cut into little jigsaw according to the jigsaw design size;
(2) edges of boards location hole and the blind hole by the little jigsaw of laser processing;
(3) little jigsaw is turn to another side;
(4) by the edges of boards location hole of laser processing another side, process conductive layer and the insulating barrier at the back side, corresponding blind hole position then, form via hole, the via hole aperture is 20～100 microns;
(5) use plasma cleaner to remove the interior residue of via hole;
(6) by silk-screen filling perforation mode conductive paste is inserted in the via hole;
(7) carry out photocuring processing or hot curing at last and handle, finish the manufacture process of conducting via hole circuit board.
As the further scheme of the present invention: the substrate in the step (1) comprises the substrate of pottery, resin material class.
As the present invention's further scheme again: substrate thickness is 25～500 microns described in the step (1), and the substrate surface conductive layer thickness is 2～8 microns.
As the further scheme of the present invention: the edges of boards location hole is designed to circular or square in the step (2).
As the further scheme of the present invention: the upset of the medium and small jigsaw of step (3) adopts manual turnover panel or automatic panel-turnover machine to be achieved.
As the further scheme of the present invention: UV laser processing or CO are used in the laser processing in step (2) and the step (4)
2Laser processing.
As the further scheme of the present invention: the aperture of blind hole and via hole is 50 microns in step (2) and the step (4).
As the further scheme of the present invention: step (5) ionic medium cleaning machine is with CF
4N
2O
2The gas matched combined is energized into plasma slurry attitude, and material surface is cleaned decontamination, and the processing time is 2～60 minutes.
As the further scheme of the present invention: silk-screen filling perforation mode is selected common silk-screen or vacuum silk-screen mode in the step (6); Conductive paste comprises copper conductive paste and silver-colored conductive paste.
As the further scheme of the present invention: hot curing is handled and is used vacuum drying oven or nitrogen oven in the step (7), and be 10～30 minutes curing time.
Compared with prior art, the invention has the beneficial effects as follows: the present invention greatly degree improves the wiring density that runs through via hole fineness and circuit board, shorten printed circuit board simultaneously and make work flow, reducing consumptive material uses, reduce production costs, improve product yield and reliability, and the course of processing belongs to dry process, do not relate to any wet chemical soup, surrounding enviroment are not caused any pollution.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the medium and small jigsaw of the embodiment of the invention.
Fig. 2 is the structural representation of little jigsaw after a laser bores in the embodiment of the invention.
Fig. 3 is the structural representation that secondary laser bores the little jigsaw in back in the embodiment of the invention.
Fig. 4 is the structural representation of the little jigsaw in metallization back in the embodiment of the invention mesopore.
Embodiment
The invention discloses a kind of manufacture method that runs through the via hole printed circuit board, this method can be processed more small conducting via hole, and its aperture is less than 100 microns, and yield can reach more than 98%, and position, hole precision is provided in 50 microns by original 75 microns.The laser that this method adopts bores and runs through via hole, traditional laser blind hole of having any different, not only realize the effect that conducting runs through, and improve the vertical-horizontal proportion of small via hole, the present invention does not simultaneously adopt traditional chemical etching or brill to mill the contraposition mode of edges of boards location hole, simplify and shorten work flow, also saved production cost.The conducting via hole of this method processing simultaneously all adopts dry process, i.e. plasma gas ablution and conducting objects completion method technology, and whole process does not relate to any chemical industry liquid medicine, i.e. energy-conserving and environment-protective.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
See also Fig. 1～4, in the embodiment of the invention, a kind of manufacture method that runs through the via hole printed circuit board, may further comprise the steps: earlier substrate is cut into little jigsaw according to the jigsaw design size, edges of boards location hole 3 and blind hole 4 by the little jigsaw of laser processing, little jigsaw is turned the edges of boards location hole 3 of processing another side, by the 3 accurate contrapositions of edges of boards location hole, process conductive layer 1 and the insulating barrier 2 at the back side, corresponding blind hole 4 position then, form via hole 5, use the residue in the plasma cleaner cleaning hole, by silk-screen filling perforation mode conductive paste 6 is inserted in the via hole 5, carry out hot curing at last, finish the manufacture process of conducting via hole circuit board.
Concrete steps are as follows:
(1) prepare an epoxy resin substrate, its conductive layer 1 thickness is 5 microns, and insulating barrier 2 thickness are 100 microns, and are cut into little jigsaw by design size;
(2) use CO
2Laser gets out four square edges of boards location holes 3 in advance on little jigsaw four limits, and processes blind hole 3 in the little jigsaw by this edges of boards location hole 3, and the blind hole aperture is 50 microns;
(3) little jigsaw is turn to another side;
(4) use CO
2Laser processing goes out four square edges of boards location holes 3 of this face, and by edges of boards location hole 3 location, the conductive layer 1 of processing blind hole 4 correspondence positions and insulating barrier 2 form via hole 5, and the via hole aperture is 50 microns;
(5) use plasma apparatus, with gas CF
4/ N
2Mix in the 80:20 ratio, carry out plasma and sting erosion and clean 20 minutes processing times;
(6) use the vacuum screen printer, conductive paste 6 is inserted in the via hole 5;
(7) use baking oven 120 ℃ of bakings 30 minutes, carry out hot curing to running through conducting via hole circuit board.
Substrate in the described step (1) comprises the substrate of pottery, resin material class, can select flexible or rigidity material according to the function needs simultaneously; Four edges of boards location holes 3 can be designed to circular pattern in the step (2), determine concrete position by the little jigsaw size of design, and location hole is regular figure, so that use laser drill recognition and verification center; The medium and small jigsaw upset of step (3) can adopt manual turnover panel or automatic panel-turnover machine to be achieved; Laser processing in step (2) and the step (4) can be used UV laser, but considers working (machining) efficiency, preferentially uses CO here
2Laser processing, its aperture are generally 20～100 microns; The collocation of gaseous species and ratio should be selected appropriate plasma cleaning parameters according to concrete resinous type and aspect ratio in the step (5); Use plasma cleaner, with CF
4N
2O
2Deng the gas matched combined, be energized into plasma slurry attitude, and material surface cleaned a kind of technology of decontamination; The filling perforation mode of conductive paste in the step (6), size according to its aspect ratio, the common silk-screen of corresponding selection or vacuum silk-screen mode, conductive paste is expressed in the via hole by the external force effect, guarantee that the vias inside filling is complete, conductive paste comprises the conductive material in the technical field, as fillers such as copper or silver-colored conductive paste and conductive nano-particles; In the step (7), hot curing is handled and is preferably used vacuum drying oven or nitrogen oven, to guarantee that conductive paste can be not oxidized.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and under the situation that does not deviate from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, therefore is intended to include in the present invention dropping on the implication that is equal to important document of claim and all changes in the scope.Any Reference numeral in the claim should be considered as limit related claim.
In addition, be to be understood that, though this specification is described according to execution mode, but be not that each execution mode only comprises an independently technical scheme, this narrating mode of specification only is for clarity sake, those skilled in the art should make specification as a whole, and the technical scheme among each embodiment also can form other execution modes that it will be appreciated by those skilled in the art that through appropriate combination.
Claims (10)
1. a manufacture method that runs through the via hole printed circuit board is characterized in that, may further comprise the steps:
Earlier substrate is cut into little jigsaw according to the jigsaw design size;
Edges of boards location hole and blind hole by the little jigsaw of laser processing;
Little jigsaw is turn to another side;
By the edges of boards location hole of laser processing another side, process conductive layer and the insulating barrier at the back side, corresponding blind hole position then, form via hole, the via hole aperture is 20～100 microns;
Use plasma cleaner to remove the interior residue of via hole;
By silk-screen filling perforation mode conductive paste is inserted in the via hole;
Carry out photocuring processing or hot curing at last and handle, finish the manufacture process of conducting via hole circuit board.
2. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, the substrate in the step (1) comprises the substrate of pottery, resin material class.
3. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, substrate thickness is 25～500 microns described in the step (1), and the substrate surface conductive layer thickness is 2～8 microns.
4. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, the edges of boards location hole is designed to circular or square in the step (2).
5. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, the upset of the medium and small jigsaw of step (3) adopts manual turnover panel or automatic panel-turnover machine to be achieved.
6. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, UV laser processing or CO are used in the laser processing in step (2) and the step (4)
2Laser processing.
7. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, the aperture of blind hole and via hole is 50 microns in step (2) and the step (4).
8. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, step (5) ionic medium cleaning machine is with CF
4N
2O
2The gas matched combined is energized into plasma slurry attitude, and material surface is cleaned decontamination, and the processing time is 2～60 minutes.
9. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, silk-screen filling perforation mode is selected common silk-screen or vacuum silk-screen mode in the step (6); Conductive paste comprises copper conductive paste and silver-colored conductive paste.
10. the manufacture method that runs through the via hole printed circuit board according to claim 1 is characterized in that, hot curing is handled and used vacuum drying oven or nitrogen oven in the step (7), and be 10～30 minutes curing time.
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| CN2013102330603A CN103281878A (en) | 2013-06-13 | 2013-06-13 | Manufacturing method for printed circuit board with penetrating-through holes |
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|---|---|---|---|
| CN2013102330603A CN103281878A (en) | 2013-06-13 | 2013-06-13 | Manufacturing method for printed circuit board with penetrating-through holes |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104144571A (en) * | 2014-06-18 | 2014-11-12 | 四川深北电路科技有限公司 | High-density interconnection integrated circuit board manufacturing method |
| CN105592632A (en) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | Method for improving ionic migration of PCB |
| CN108153991A (en) * | 2018-01-11 | 2018-06-12 | 郑州云海信息技术有限公司 | A kind of Quick platy clamp keyline layout method based on Cadence skill |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| WO2021248612A1 (en) * | 2020-06-08 | 2021-12-16 | 瑞声声学科技(深圳)有限公司 | Circuit substrate preparation method and circuit substrate |
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| CN102159034A (en) * | 2011-04-02 | 2011-08-17 | 惠州市绿标光电科技有限公司 | Method for making printed circuit board (PCB) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080277146A1 (en) * | 2007-05-07 | 2008-11-13 | Samsung Electro-Mechanics Co., Ltd. | Radiant heat printed circuit board and method of fabricating the same |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104144571A (en) * | 2014-06-18 | 2014-11-12 | 四川深北电路科技有限公司 | High-density interconnection integrated circuit board manufacturing method |
| CN105592632A (en) * | 2015-12-18 | 2016-05-18 | 景旺电子科技(龙川)有限公司 | Method for improving ionic migration of PCB |
| CN105592632B (en) * | 2015-12-18 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | A method of improving pcb board Ion transfer |
| CN108153991A (en) * | 2018-01-11 | 2018-06-12 | 郑州云海信息技术有限公司 | A kind of Quick platy clamp keyline layout method based on Cadence skill |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| CN111295052B (en) * | 2020-03-25 | 2021-06-01 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
| WO2021248612A1 (en) * | 2020-06-08 | 2021-12-16 | 瑞声声学科技(深圳)有限公司 | Circuit substrate preparation method and circuit substrate |
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Application publication date: 20130904 |