CN106695136A - Laser punching method of multilayer printed circuit board and system using same - Google Patents
Laser punching method of multilayer printed circuit board and system using same Download PDFInfo
- Publication number
- CN106695136A CN106695136A CN201710019561.XA CN201710019561A CN106695136A CN 106695136 A CN106695136 A CN 106695136A CN 201710019561 A CN201710019561 A CN 201710019561A CN 106695136 A CN106695136 A CN 106695136A
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- China
- Prior art keywords
- laser
- femtosecond
- multilayer board
- punching
- laser beam
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a laser punching method of a multilayer printed circuit board and a system using the same. The method comprises a process of punching a through hole in the multi-layer printed circuit board: (A1) the multilayer printed circuit board is placed on a punching worktable, a position to be punched of the multilayer printed circuit board is aligned to a femtosecond/picosecond laser, and the multi-layer printed circuit board is provided with N layers of substrates with different materials from top to bottom in the thickness direction; and the femtosecond/picosecond laser can output N laser beams with different wave lengths in a switching manner for correspondingly etching the N layers of substrates with different materials. The laser punching method of the multilayer printed circuit board comprises the process of punching the through hole in the multilayer printed circuit board and a process of punching a blind hole in the multilayer printed circuit board, realizes intelligent punching of the multilayer printed circuit board, intelligently identifies the punching layer number, automatically, quickly and accurately switches the femtosecond laser punching process parameters, is smooth in cross section of the machined through hole, and improves the punching quality and precision.
Description
Technical field
The present invention relates to printed circuit board (PCB) processing and manufacturing field, more particularly to a kind of laser boring of multilayer board
Method and use its system.
Background technology
With the fast development of electronic technology, multilayer board has obtained widely should in large scale integrated circuit
With.Multilayer board replaces compacting and forms by multilayer conductive substrate and multilayer insulation substrate, i.e. adjacent two layers electrically-conductive backing plate
Between one layer of insulated substrate is set, every layer of electrically-conductive backing plate is arranged different circuits and is separated with insulated substrate；And it is multi-sheet printed
Circuit board is provided with multiple through holes and blind hole for the electrical connection between electrically-conductive backing plate, and these through holes and blind hole are
Micropore of the diameter less than 150 microns.Therefore, in multilayer board manufacturing process, needed after the compacting for completing multilager base plate
Multilayer board is punched.
At present, femtosecond laser because its peak power it is high, easily cause the dissociation of material, fuel factor is small, and machining accuracy is high,
It is used widely in circuit board punching field.But using the femtosecond laser of same drilling technology parameter in existing processing technology
Multilayer board is punched, because the material of adjacent two layers substrate in multilayer board is different, corresponding heat
Conductivity, the absorptivity to femtosecond laser have differences, so that drilling quality and perforating efficiency are reduced, the micropore for processing
Cross section is second-rate.And, need to such as obtain the blind hole of the feature number of plies, then need the instrument of accurate complexity to go scanning probe to punch
Depth, but femtosecond laser processing blind hole the time required to be less than 1 millisecond, even and with the multilayer board of batch, its
Thickness also has different, therefore control difficulty is huge, and the blind hole quality for processing is difficult to keep stabilization.
The content of the invention
It is an object of the invention to propose that a kind of Intelligent Recognition goes out the number of plies of punching, femtosecond laser is rapidly and accurately switched automatically
Drilling technology parameter, blind hole crudy stabilization makes the cross section of micropore smooth, improves the multilayer print of drilling quality and precision
The laser boring method of printed circuit board and use its system.
It is that, up to this purpose, the present invention uses following technical scheme：
A kind of laser boring method of multilayer board, including beat via process to multilayer board：
Step A1, multilayer board is placed in punching workbench, and the multilayer board is to be punctured
Position and femtosecond/picosecond laser alignment, the multilayer board through-thickness is provided with N layers from top to bottom has difference
The substrate of material, N=2,3,4 ..., k, k >=2；
Femtosecond/the picosecond laser switchably exports the laser beam of N kind different wave lengths to be correspondingly used for N layers of etching
Substrate with different materials；
Step A2, the luminescent spectrum feature of each laminar substrate and punching work in industrial computer is input into the multilayer board
Skill parameter, the luminescent spectrum for defining X laminar substrates is characterized as FXAnd its drilling technology parameter is CX；With the definition femtosecond/psec
The drilling technology parameter C with X laminar substrates that laser sendsXCorresponding laser beam is HX, set the initial value of layer X to be punctured
It is 1；
Step A3, the industrial computer sends X layers of base of the multilayer board to the femtosecond/picosecond laser
The drilling technology parameter C of plateX, the femtosecond/picosecond laser sends the drilling technology parameter C with X laminar substratesXIt is corresponding to swash
Light beam HXTo be punched to the multilayer board；
Meanwhile, the laser beam HXInteracted with the multilayer board and produce punching diverging light, spectrometer to hold
It is continuous to obtain and send the luminescent spectrum feature of the punching diverging light to the industrial computer；
Step A4, the luminescent spectrum feature of punching diverging light described in the industry control machine testing whether be X laminar substrates hair
Light spectral signature FX：If then the industrial computer controls the femtosecond/picosecond laser to continue to punch；If not the then industry control
Machine controls the femtosecond/picosecond laser to stop punching, and the industrial computer updates layer X=X+1 to be punctured；
Step A5, repeat step A3 and step A4, until layer X=N to be punctured；
Step A6, the industrial computer sends the n-th layer base of the multilayer board to the femtosecond/picosecond laser
The drilling technology parameter C of plateN；
Femtosecond/the picosecond laser sends the drilling technology parameter C with n-th layer substrateNCorresponding laser beam HNCome to institute
State multilayer board to be punched, until the spectrometer does not get the hair of the punching diverging light in Preset Time
The industrial computer controls the femtosecond/picosecond laser to stop punching during light spectral signature, so as on multilayer board
Form through hole.
Preferably, also including beating blind hole process to multilayer board：
Step B1, multilayer board is placed in punching workbench, and the multilayer board is to be punctured
Position and femtosecond/picosecond laser alignment, the multilayer board are provided with N layer materials from top to bottom, N=2,3,4 ...,
K, k >=2；
Femtosecond/the picosecond laser switchably exports the laser beam of N kind different wave lengths to be correspondingly used for N layers of etching
Substrate with different materials；
Step B2, punching to the M laminar substrates of the multilayer board, wherein M are needed in industrial computer setting<N；And
The luminescent spectrum feature and drilling technology parameter of M laminar substrates, define X layers in industrial computer is input into the multilayer board
The luminescent spectrum of substrate is characterized as FXAnd its drilling technology parameter is CX, and define that the femtosecond/picosecond laser sends with the
The drilling technology parameter C of X laminar substratesXCorresponding laser beam is HX, the initial value for setting layer X to be punctured is 1；
Step B3, the industrial computer sends X layers of base of the multilayer board to the femtosecond/picosecond laser
The drilling technology parameter C of plateX, the femtosecond/picosecond laser sends the drilling technology parameter C with X layer materialsXIt is corresponding to swash
Light beam HXTo be punched to the multilayer board；
Meanwhile, the laser beam and the multilayer board interact and produce punching diverging light, and spectrometer is lasting
The luminescent spectrum feature of the punching diverging light is obtained and sent to the industrial computer；
Step A4, the luminescent spectrum feature of punching diverging light described in the industry control machine testing whether be X laminar substrates hair
Light spectral signature FX：If then the industrial computer controls the femtosecond/picosecond laser to continue to punch；If not the then industry control
Machine controls the femtosecond/picosecond laser to stop punching, and the industrial computer updates layer X=X+1 to be punctured；
Step A5, repeat step A3 and step A4, until layer X=M+1 to be punctured, the industrial computer control femtosecond/
Picosecond laser stops punching, so as to form the blind hole that depth reaches M laminar substrates on multilayer board.
Preferably, the drilling technology parameter includes laser beam repetition rate and laser beam pulses energy, the punching work
Skill parameter is that each laminar substrate of the multilayer board individually carries out laser boring experimental analysis acquisition, the laser
Punching experiment is analyzed to hole wall quality, aperture precision and trepanning velocity.
Preferably, using the multilayer board laser boring method system, including punching workbench, industry control
Machine, femtosecond/picosecond laser, spectrometer, laser projection angle adjuster and installation frame；
The installation frame includes mounting seat and installs vertical rod, and the installation vertical rod is arranged at the side of mounting seat,
Shifting sledge is provided with the top of the mounting seat；
The punching workbench activity is connected in the shifting sledge, and the punching workbench is provided with workbench and drives electricity
Machine, the table drive motor drives the punching workbench to be moved along the shifting sledge；
Laser projection angle adjuster is installed on the top of the installation vertical rod and with the punching workbench same
On one vertical plane, the femtosecond/picosecond laser and laser projection angle adjuster are connected, and the femtosecond/picosecond laser
Laser output it is down-set, laser projection angle adjuster controls the laser beam projects of the femtosecond/picosecond laser
Angle；
The spectrometer is installed on the middle part of the installation vertical rod and is arranged at the lower section of femtosecond/picosecond laser, institute
State the opposite side of the detection optical input of the spectrometer horizontally toward mounting seat；
The industrial computer is installed on the opposite side of mounting seat, the table drive motor, spectrometer and femtosecond/psec
Laser with the industry control mechatronics.
Preferably, also including laser beam shaper, the laser beam shaper is installed on the middle part of installation vertical rod simultaneously
And it is arranged at femtosecond/between picosecond laser and spectrometer, the input port of the laser beam shaper and femtosecond/picosecond laser
The laser output alignment of device, the delivery outlet of the laser beam shaper is set vertically downward；
The laser beam shaper sets gradually along light path and expands unit, shaping unit and condenser lens, and the femtosecond/
The laser beam that picosecond laser sends is expanded after unit expands described in, and flat-top laser beam is shaped as into the shaping unit,
The laser beam obtained for capillary processing is focused on by the condenser lens again.
The laser boring method of the multilayer board includes beating via process and to many to multilayer board
Layer printed circuit board beats blind hole process, is to interact to produce using femtosecond laser and different materials to have different luminescent spectrums
The diverging light of feature this principle, the process punched to multilayer board in femtosecond/picosecond laser passes through spectrum
Instrument simultaneously sends the luminescent spectrum feature of the punching diverging light to the industrial computer；When the industrial computer detects the punching hair
When the luminescent spectrum feature of astigmatism changes, the industrial computer controls the femtosecond/picosecond laser switching drilling technology ginseng
Number, until the multilayer board punches to designated layer or punches；So as to avoid using with single drilling technology parameter
The micropore cross section problem of poor quality that occurs when being punched to the multilayer board of femtosecond laser；Realize to described many
The intelligent punching of layer printed circuit board, Intelligent Recognition goes out the number of plies of punching, the punching of femtosecond laser is rapidly and accurately switched automatically
Technological parameter, makes the cross section of the through hole for processing smooth, improves drilling quality and precision.
The laser drilling system of the multilayer board sets the femtosecond/picosecond laser to be used for multi-sheet printed
Circuit board is punched, and the spectrometer persistently obtains femtosecond laser and different materials interaction generation in drill process to be had
The diverging light of different luminescent spectrum features, controls the femtosecond/picosecond laser rapidly and accurately to cut in order to the industrial computer
Drilling technology parameter is changed, the cross section quality of through hole is improved；The intelligent automation of punching is realized, drill process is without manual switching
The drilling technology parameter of femtosecond/picosecond laser and micropore depth need not be detected.Laser projection angle adjuster control is described
The laser beam projects angle of femtosecond/picosecond laser, then laser beam can vertically beat to the multilayer board in institute
State and straight hole is formed on multilayer board, laser beam can be inclined to beat and printed in the multilayer to the multilayer board
Inclined hole is formed on printed circuit board.Can expand the laser of the multilayer board so as to set laser projection angle adjuster
The scope of application of drilling system uses flexibility with it is improved.
Brief description of the drawings
The present invention will be further described for accompanying drawing, but content in accompanying drawing does not constitute any limitation of the invention.
Fig. 1 is the processing through hole flow chart of one of embodiment of the invention；
Fig. 2 is the processing blind hole flow chart of one of embodiment of the invention；
Fig. 3 is the laser drilling system structure chart of one of embodiment of the invention；
Fig. 4 is the Multilayer printed circuit board structure figure of one of embodiment of the invention.
Wherein：Punching workbench 1；Multilayer board 4；Femtosecond/picosecond laser 3；Spectrometer 5；Industrial computer 2；Peace
Installation frame 6；Laser projection angle adjuster 8；Mounting seat 61；Vertical rod 62 is installed；Shifting sledge 63；Laser beam shaper 7；The
One laminar substrate 42；Third layer substrate 43；Second laminar substrate 44；4th laminar substrate 45；Interface layer 41.
Specific embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
Embodiment 1
The laser boring method of the multilayer board of the present embodiment, as shown in figure 1, including to multilayer board
Beat via process：
Step A1, punching workbench 1 place multilayer board 4, and the multilayer board 4 wait beat
Hole site and femtosecond/picosecond laser 3 are aligned, and the through-thickness of the multilayer board 4 is provided with N layers from top to bottom to be had
The substrate of different materials, N=2,3,4 ..., k, k >=2；
Femtosecond/the picosecond laser 3 switchably exports the laser beam of N kind different wave lengths to be correspondingly used for etching N
Layer has the substrate of different materials；
Step A2, the luminescent spectrum feature of each laminar substrate and punching in industrial computer 2 is input into the multilayer board 4
Technological parameter, the luminescent spectrum for defining X laminar substrates is characterized as FXAnd its drilling technology parameter is CX；With the definition femtosecond/skin
The drilling technology parameter C with X laminar substrates that second laser 3 sendsXCorresponding laser beam is HX, set the initial of layer X to be punctured
Be worth is 1；
Step A3, the industrial computer 2 sends the X of the multilayer board 4 to the femtosecond/picosecond laser 3
The drilling technology parameter C of laminar substrateX, the femtosecond/picosecond laser 3 sends the drilling technology parameter C with X laminar substratesXCorrespondence
Laser beam HXTo be punched to the multilayer board 4；
Meanwhile, the laser beam HXInteracted with the multilayer board 4 and produce punching diverging light, spectrometer 5
The luminescent spectrum feature of the punching diverging light is persistently obtained and sent to the industrial computer 2；
Step A4, the industrial computer 2 detect it is described punching diverging light luminescent spectrum feature whether be X laminar substrates hair
Light spectral signature FX：If then the industrial computer 2 controls the femtosecond/picosecond laser 3 to continue to punch；If not the then work
Control machine 2 controls the femtosecond/picosecond laser 3 to stop punching, and the industrial computer 2 updates layer X=X+1 to be punctured；
Step A5, repeat step A3 and step A4, until layer X=N to be punctured；
Step A6, the industrial computer 2 sends the N of the multilayer board 4 to the femtosecond/picosecond laser 3
The drilling technology parameter C of laminar substrateN；
Femtosecond/the picosecond laser 3 sends the drilling technology parameter C with n-th layer substrateNCorresponding laser beam HNIt is right to come
The multilayer board 4 is punched, until the spectrometer 5 does not get the punching diverging light in Preset Time
Luminescent spectrum feature when the industrial computer 2 control the femtosecond/picosecond laser 3 to stop punching, so as in multi-sheet printed electricity
Through hole is formed on road plate 4.
The laser boring method of the multilayer board includes beating via process and to many to multilayer board
Layer printed circuit board beats blind hole process, is to interact to produce using femtosecond laser and different materials to have different luminescent spectrums
The diverging light of feature this principle, the process punched to multilayer board 4 in femtosecond/picosecond laser 3 passes through light
Spectrometer 5 simultaneously sends the luminescent spectrum feature of the punching diverging light to the industrial computer 2；Described in being detected when the industrial computer 2
When the luminescent spectrum feature of punching diverging light changes, the industrial computer 2 controls the switching of femtosecond/picosecond laser 3 to beat
Hole technological parameter, until the multilayer board 4 punches to designated layer or punches；So as to avoid using with single punching
The micropore cross section problem of poor quality that the femtosecond laser of technological parameter occurs when being punched to the multilayer board 4.
When the laser boring method of the multilayer board goes to calculate the punching of every laminar substrate without complicated algorithm
Between, it is not required that accurate complicated instrument goes scanning probe punching depth, but only detects punching diverging light by spectrometer 5
Luminescent spectrum feature is punched to which layer of the multilayer board 4, so as to both drop recognizing femtosecond/picosecond laser 3
Low punching cost and punching difficulty, can accurately switch the drilling technology parameter of the femtosecond/picosecond laser 3 in time again, realize
Completed to the perforation processing of each laminar substrate of the multilayer board 4 in same station, it is to avoid resetting and cause plus
Work error, prevents from making the micropore cross section out-of-flatness for processing because failing to switch drilling technology parameter in time again.
It is described to beat via process to multilayer board and first in the industrial computer 2 be input into the multilayer board 4
In each laminar substrate luminescent spectrum feature and drilling technology parameter, the femtosecond/picosecond laser 3 is along the multi-sheet printed electricity
The thickness direction of road plate 4 from top to bottom punches each laminar substrate layer by layer；Spectrometer 5 persistently obtains femtosecond described in whole process
Laser and different materials interact and produce the diverging light with different luminescent spectrum features.Between every adjacent two layers substrate
The luminescent spectrum feature of the diverging light can all change during interface layer 41, and now the industrial computer 2 will be described in stop
Femtosecond/picosecond laser 3 simultaneously updates the size of layer X to be punctured for X+1, is flown to described with conveying corresponding drilling technology parameter
Second/picosecond laser 3, enables the femtosecond/picosecond laser 3 correctly to switch punching corresponding with the material of substrate to be punctured
Technological parameter, it is accurate and quick to switch；So repeat, until the industrial computer 2 detects layer X to be punctured for N, that is, depth of punching
Last laminar substrate has been reached, the femtosecond/picosecond laser 3 has now been controlled with drilling technology corresponding with last laminar substrate
Parameter is punched to the multilayer board 4；When the spectrometer 5 does not get the punching hair in Preset Time
During the luminescent spectrum feature of astigmatism, then illustrate that laser beam does not have and interacted with the multilayer board 4, it is described to fly
The laser beam that second/picosecond laser 3 sends comes through the multilayer board 4 without diverging, described multi-sheet printed
Circuit board 4 has formed through hole, therefore now femtosecond/picosecond laser 3 described in the stop of industrial computer 2 completes processing.Due to described many
The integral thickness of layer printed circuit board 4 is no more than 5mm, and punching diameter range is 10 μm~100 μm, and its peak work of femtosecond laser
Rate is high, therefore femtosecond laser can punch the multilayer board 4 within the time no more than 1s, so described default
Time may be configured as 1s.It is described to beat via process to multilayer board and realize intelligence to the multilayer board 4
Energyization is punched, and Intelligent Recognition goes out the number of plies of punching, and the drilling technology parameter of femtosecond laser is rapidly and accurately switched automatically, makes to process
The cross section of the through hole for coming is smooth, improves drilling quality and precision.
Preferably, as shown in Fig. 2 also including beating blind hole process to multilayer board：
Step B1, punching workbench 1 place multilayer board 4, and the multilayer board 4 wait beat
Hole site and femtosecond/picosecond laser 3 are aligned, and the multilayer board 4 is provided with N layer materials from top to bottom, N=2,3,
4th ..., k, k >=2；
Femtosecond/the picosecond laser 3 switchably exports the laser beam of N kind different wave lengths to be correspondingly used for etching N
Layer has the substrate of different materials；
Step B2, punching to the M laminar substrates of the multilayer board 4, wherein M are needed in the setting of industrial computer 2<N；
And in industrial computer 2 is input into the multilayer board 4 M laminar substrates luminescent spectrum feature and drilling technology parameter, definition
The luminescent spectrum of X laminar substrates is characterized as FXAnd its drilling technology parameter is CX, and define the femtosecond/picosecond laser 3 and send
The drilling technology parameter C with X laminar substratesXCorresponding laser beam is HX, the initial value for setting layer X to be punctured is 1；
Step B3, the industrial computer 2 sends the X of the multilayer board 4 to the femtosecond/picosecond laser 3
The drilling technology parameter C of laminar substrateX, the femtosecond/picosecond laser 3 sends the drilling technology parameter C with X layer materialsXCorrespondence
Laser beam HXTo be punched to the multilayer board 4；
Meanwhile, the laser beam 5 and the multilayer board 4 interact and produce punching diverging light, spectrometer 5 to hold
It is continuous to obtain and send the luminescent spectrum feature of the punching diverging light to the industrial computer 2；
Step A4, the industrial computer 2 detect it is described punching diverging light luminescent spectrum feature whether be X laminar substrates hair
Light spectral signature FX：If then the industrial computer 2 controls the femtosecond/picosecond laser 3 to continue to punch；If not the then work
Control machine 2 controls the femtosecond/picosecond laser 3 to stop punching, and the industrial computer 2 updates layer X=X+1 to be punctured；
Step A5, repeat step A3 and step A4, until layer X=M+1 to be punctured, the industrial computer 2 control the femtosecond/
Picosecond laser 3 stops punching, so as to form the blind hole that depth reaches M laminar substrates on multilayer board 4.
It is described to beat blind hole process to multilayer board and first in industrial computer 2 set beating for the multilayer board 4
Aperture layer number and its corresponding luminescent spectrum feature and drilling technology parameter, the femtosecond/picosecond laser 3 print along the multilayer
The thickness direction of the printed circuit board 4 M laminar substrates that from top to bottom punching extremely sets layer by layer；The spectrometer described in whole process
5 persistently obtain femtosecond laser and different materials interaction diverging light of the generation with different luminescent spectrum features.It is every adjacent
The luminescent spectrum feature of the diverging light can all change during interface layer 41 between two-layer substrate, now the industrial computer
2 femtosecond/picosecond laser 3 described in stop and will update the size of layer X to be punctured for X+1, to convey corresponding drilling technology
Parameter gives the femtosecond/picosecond laser 3, the femtosecond/picosecond laser 3 is correctly switched the material with substrate to be punctured
Expect corresponding drilling technology parameter, it is accurate and quick to switch；So repeat, until the industrial computer 2 detects layer X to be punctured being
M+1, that is, punch depth to the interface layer 41 between M laminar substrates and M+1 laminar substrates, described in the stop of the industrial computer 2
Femtosecond/picosecond laser 3, so as to form the blind hole that depth reaches M laminar substrates on multilayer board 4.It is described to many
Layer printed circuit board beat blind hole process realize to the multilayer board 4 intellectuality punching, both can be rapidly and accurately
Switch the drilling technology parameter of femtosecond laser, make the cross section of the through hole for processing smooth；Accurately can intelligently identify again
The punching number of plies, makes the depth of the blind hole for processing precisely and arrives interface layer 41 just, so as to avoiding blind hole depth too small
The electrically-conductive backing plate of blind via bottom is etched not thoroughly, reduce plating area, influence the use quality of multilayer board 4；With
Avoid blind hole depth excessive and etch into the insulated substrate of blind via bottom, have influence on the insulation effect between electrically-conductive backing plate；And i.e.
The polylith multilayer board 4 of processing is there is difference in thickness, can also punch exactly to the specified number of plies, punching stabilization is high.
Preferably, the drilling technology parameter includes laser beam repetition rate and laser beam pulses energy, the punching work
Skill parameter is that each laminar substrate of the multilayer board 4 individually carries out laser boring experimental analysis acquisition, described to swash
Light punching experiment is analyzed to hole wall quality, aperture precision and trepanning velocity.The laser boring experiment is by femtosecond
Laser individually interacts with certain laminar substrate of the multilayer board 4, analyzes its hole wall quality, aperture precision and beats
Hole speed, to obtain the drilling technology parameter of certain laminar substrate of the multilayer board 4, it usually needs carry out repeatedly described
Laser boring experiment could obtain the drilling technology parameter.Femtosecond/picosecond laser is using this drilling technology parameter to institute
When certain laminar substrate for stating multilayer board 4 punches, the capacity usage ratio of laser is high, is difficult diffusion, and machining accuracy is high.
Preferably, using the multilayer board laser boring method system, as shown in figure 3, including punching
Workbench 1, industrial computer 2, femtosecond/picosecond laser 3, spectrometer 5, laser projection angle adjuster 8 and installation frame 6；
The installation frame 6 includes mounting seat 61 and installs vertical rod 62, and the installation vertical rod 62 is arranged at mounting seat
61 side, the top of the mounting seat 61 is provided with shifting sledge 63；
The punching activity of workbench 1 is connected in the shifting sledge 63, and the punching workbench 1 is provided with workbench driving
Motor, the table drive motor drives the punching workbench 1 to be moved along the shifting sledge 63；
Laser projection angle adjuster 8 be installed on it is described installation vertical rod 62 top and with it is described punching workbench 1
On same vertical plane, the femtosecond/picosecond laser 3 and laser projection angle adjuster 8 are connected, and the femtosecond/psec
The laser output of laser 3 is down-set, and laser projection angle adjuster 8 controls swashing for the femtosecond/picosecond laser 3
Light beam crevice projection angle；
The spectrometer 5 is installed on the middle part of the installation vertical rod 62 and is arranged under femtosecond/picosecond laser 3
Side, the opposite side of the detection optical input of the spectrometer 5 horizontally toward mounting seat 61；
The industrial computer 2 is installed on the opposite side of mounting seat 61, and the table drive motor, spectrometer 5 and femtosecond/
Picosecond laser 3 is electrically connected with the industrial computer 2.
The laser drilling system of the multilayer board sets the femtosecond/picosecond laser 3 to be used to print multilayer
Printed circuit board 4 is punched, and the femtosecond/picosecond laser 3 makees lasing light emitter, because femtosecond laser etching energy is in the extremely short time
With in little space and matter interaction, it act as mechanism for Photochemical effects, and chemical bond is directly cut off during lithography,
Fuel factor is nearly free from, the utilization rate of laser energy is greatly increased, greatly weakens the negative effect that fuel factor is brought,
Accomplish micron order retrofit.The spectrometer 5 persistently obtains femtosecond laser in drill process and different materials interact and produce
The raw diverging light with different luminescent spectrum features, controls the femtosecond/picosecond laser 3 quick in order to the industrial computer 2
Switch drilling technology parameter exactly, improve the cross section quality of through hole.The table drive motor drives the punching work
Make platform 1 to be moved along the shifting sledge 63, so that movement is placed on the multilayer board 4 of the punching workbench 1, so that
Punch position is aligned with femtosecond/picosecond laser 3 before punching, and mobile multilayer board 4 is beaten up to next after punching
Hole site is aligned with femtosecond/picosecond laser 3.The table drive motor, spectrometer 5 and femtosecond/picosecond laser 3 by
The industrial computer 2 is controlled, and realizes the intelligent automation of punching, and drill process is beaten without manual switching femtosecond/picosecond laser 3
Hole technological parameter and micropore depth need not be detected.
Femtosecond/the picosecond laser 3 and laser projection angle adjuster 8 are connected, and laser projection angle adjuster 8 is controlled
The laser beam projects angle of the femtosecond/picosecond laser 3, then laser beam can vertically beat to the multilayer board 4
And straight hole is formed on the multilayer board 4, laser beam can be inclined to be beaten to the multilayer board 4 in institute
State and form inclined hole on multilayer board 4.Can expand the multi-sheet printed electricity so as to set laser projection angle adjuster 8
The scope of application of the laser drilling system of road plate uses flexibility with it is improved.
Preferably, as shown in figure 3, also including laser beam shaper 7, the laser beam shaper 7 is installed on installation
The middle part of vertical rod 62 and it is arranged between femtosecond/picosecond laser 3 and spectrometer 5, the input of the laser beam shaper 7
The laser output of mouth and femtosecond/picosecond laser 3 is aligned, and the delivery outlet of the laser beam shaper 7 is set vertically downward；
The laser beam shaper 7 sets gradually along light path and expands unit, shaping unit and condenser lens, and the femtosecond/psec swashs
The laser beam that light device 3 sends is expanded after unit expands described in, and flat-top laser beam is shaped as into the shaping unit, then by institute
State condenser lens and focus on the laser beam obtained for capillary processing.The laser beam shaper 7 is used for femtosecond/picosecond laser
The Gaussian laser beam of the output of device 3 is shaped as flat-top laser beam and is focused treatment, so as to improve the utilization rate of laser beam and add
Work efficiency rate, makes micropore the smooth of the edge, reduces the taper of sky, approximately perpendicular micropore is obtained, while avoid blind via bottom receiving
Damage, obtain the blind hole of bottom flat.
Embodiment 2
Using the laser boring method of the multilayer board described in embodiment 1 one is made a call in multilayer board 4
A diameter of 60 μm of through hole.As shown in figure 4, the number of plies of multilayer board 4 is 4 layers in the present embodiment, gross thickness is
The material of 1.8mm, the first laminar substrate 42 and third layer substrate 43 is the material of red copper, the second laminar substrate 44 and the 4th laminar substrate 45
It is FR-4 epoxy resin；The wavelength of femtosecond/picosecond laser 3 is 800nm, and pulsewidth is 50fs, and highest laser beam repetition rate is
1KHz, maximum laser beam pulse energy is 3mJ.
Comprise the following steps that：
Step one, obtains conductive material red copper and insulating materials FR-4 epoxy resin used by multilayer board 4 and exists
Luminescent spectrum feature under femtosecond laser beam effect, and by these luminescent spectrum characteristic storages in industrial computer 2；
Step 2, it is available by laser boring experiment：When the laser beam repetition rate of femtosecond/picosecond laser 3 is
When 500Hz, laser beam pulses energy are 3mJ, the perforating efficiency of red copper film is high, hole end surface quality is good, and industrial computer 2 is set to ground floor
The drilling technology parameter of substrate 42 and third layer substrate 43；When femtosecond/picosecond laser 3 laser beam repetition rate for 50Hz,
When laser beam pulses energy is 2mJ, the perforating efficiency of FR-4 epoxy resin is high, pore cross section quality, and industrial computer 2 is set to second layer base
The drilling technology parameter of the laminar substrate 45 of plate 44 and the 4th；
Step 3, reads the drilling technology parameter C of the first laminar substrate 42 of multilayer board 4 in industrial computer 21：Fly
The laser beam repetition rate of second/picosecond laser 1 is 500Hz, laser beam pulses energy is 3mJ, and will be punched by industrial computer 2
Technological parameter C1It is sent to femtosecond/picosecond laser 3；
Step 4, the control punching workbench 1 of industrial computer 2 moves to the Working position in hole, opens femtosecond/picosecond laser 3,
The laser beam H that femtosecond/picosecond laser 3 sends1By irradiation after the shaping of laser beam shaper 7 to multilayer board 4
The upper surface of the first laminar substrate 42, until first laminar substrate 42 and second laminar substrate 44 of the punching to multilayer board 4
Interface layer 41；
Step 5, as laser beam H1When being applied to interface layer 41, laser beam H1The hair acted on multilayer board 4
Light spectral signature there occurs change, and industrial computer 2 sends instructions to femtosecond/picosecond laser 3, stop femtosecond/picosecond laser 3
Use drilling technology parameter C1Multilayer board 4 is punched, and by the drilling technology parameter C of the second laminar substrate 442：
Laser beam repetition rate is 50Hz, laser beam pulses energy is 2mJ, is sent to femtosecond/picosecond laser 3, femtosecond/picosecond laser
Device 3 sends laser beam H2The second laminar substrate 44 to multilayer board 4 carries out laser boring, until the second laminar substrate 44 with
The interface layer 41 of third layer substrate 43, so repeats, until punching to the 4th laminar substrate 45.The industrial computer 2 flies to described
Second/picosecond laser 3 sends the drilling technology parameter C of the 4th laminar substrate 45 of the multilayer board 44：Laser beam weight
Complex frequency is 50Hz, laser beam pulses energy is 2mJ, is sent to femtosecond/picosecond laser 3；
Femtosecond/the picosecond laser 3 sends corresponding laser beam H4To be beaten the multilayer board 4
Hole, until the industrial computer 2 is controlled when the spectrometer 5 does not get the luminescent spectrum feature of the punching diverging light in 1s
Femtosecond/the picosecond laser 3 stops punching, so as to form a diameter of 60 μm of through hole on multilayer board 4.Through inspection
Survey, compared with punching is carried out using the femtosecond laser of single parameter, the perforating efficiency of the present embodiment improves 60%, and through hole is cross-section
Face quality is greatly improved.
Embodiment 3
Using the laser boring method of the multilayer board described in embodiment 1 one is made a call in multilayer board 4
A diameter of 80 μm, the blind hole of punching to third layer substrate 43.The number of plies of multilayer board 4 is 4 layers, total thickness in the present embodiment
It is 1.8mm to spend, and the material of the first laminar substrate 42 and third layer substrate 43 is red copper, the second laminar substrate 44 and the 4th laminar substrate 45
Material is FR-4 epoxy resin；The wavelength of femtosecond/picosecond laser 3 is 800nm, and pulsewidth is 50fs, and highest laser beam repeats frequency
Rate is 1KHz, and maximum laser beam pulse energy is 3mJ.
Comprise the following steps that：
Step one, obtains conductive material red copper and insulating materials FR-4 epoxy resin used by multilayer board 4 and exists
Luminescent spectrum feature under the effect of femtosecond laser beam 2, and by these luminescent spectrum characteristic storages in industrial computer 2；
Step 2, it is available by laser boring experiment：When the laser beam repetition rate of femtosecond/picosecond laser 3 is
When 500Hz, laser beam pulses energy are 3mJ, the perforating efficiency of red copper film is high, hole end surface quality is good, and industrial computer 2 is set to ground floor
The drilling technology parameter of substrate 42 and third layer substrate 43；When femtosecond/picosecond laser 3 laser beam repetition rate for 50Hz,
When laser beam pulses energy is 2mJ, the perforating efficiency of FR-4 epoxy resin is high, pore cross section quality, and industrial computer 2 is set to second layer base
The drilling technology parameter of the laminar substrate 45 of plate 44 and the 4th；
Step 3, reads the drilling technology parameter C of the first laminar substrate 42 of multilayer board 4 in industrial computer 21：Fly
The laser beam repetition rate of second/picosecond laser 1 is 500Hz, laser beam pulses energy is 3mJ, and will be punched by industrial computer 2
Technological parameter is sent to femtosecond/picosecond laser 3；
Step 4, the control punching workbench 1 of industrial computer 2 moves to the Working position in hole, opens femtosecond/picosecond laser 3,
The laser beam H that femtosecond/picosecond laser 3 sends1By irradiation after the shaping of laser beam shaper 7 to multilayer board 4
The upper surface of the first laminar substrate 42, until first laminar substrate 42 and second laminar substrate 44 of the punching to multilayer board 4
Interface layer 41；
Step 5, as laser beam H1When being applied to interface layer 41, laser beam H1The hair acted on multilayer board 4
Light spectral signature there occurs change, and industrial computer 2 sends instructions to femtosecond/picosecond laser 3, stop femtosecond/picosecond laser 3
Use drilling technology parameter C1Multilayer board 4 is punched, and by the drilling technology parameter C of the second laminar substrate 442：
Laser beam repetition rate is 50Hz, laser beam pulses energy is 2mJ, is sent to femtosecond/picosecond laser 3, femtosecond/picosecond laser
Device 3 sends laser beam H2The second laminar substrate 44 to multilayer board 4 carries out laser boring, until the second laminar substrate 44 with
The interface layer 41 of third layer substrate 43；
Step 6, when the spectrometer 5 detects laser beam H2Occur with the spectral signature that multilayer board 4 is acted on
During change, industrial computer 2 sends instructions to femtosecond/picosecond laser 3, makes femtosecond/picosecond laser 3 stop using drilling technology to join
Number C2Multilayer board 4 is punched, and by the drilling technology parameter C of third layer substrate 433：Laser beam repetition rate
For 500Hz, laser beam pulses energy are 3mJ, femtosecond/picosecond laser 3 is sent to, femtosecond/picosecond laser 3 sends laser beam
H3Third layer substrate 43 to multilayer board 4 carries out laser boring, until the laminar substrate 45 of third layer substrate 43 and the 4th
Interface layer 41；Now laser beam H3The spectral signature acted on multilayer board 4 changes, the industrial computer 2
Control the femtosecond/picosecond laser 3 to stop punching, third layer base is reached so as to form depth on multilayer board 4
The blind hole of plate 43.After testing, the blind hole cross-drilled hole cross section quality of this implementation is good, and the position in blind hole depth direction is accurate, solves
Existing femtosecond laser drilling method cannot be accurately positioned the problem of blind hole hole depth.
Know-why of the invention is described above in association with specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and can not by any way be construed to limiting the scope of the invention.Based on explanation herein, the technology of this area
Personnel associate other specific embodiments of the invention by would not require any inventive effort, these modes fall within
Within protection scope of the present invention.
Claims (5)
1. a kind of laser boring method of multilayer board, it is characterised in that including getting through hole to multilayer board
Process：
Step A1, punching workbench place multilayer board, and the multilayer board position to be punctured
With femtosecond/picosecond laser alignment, the multilayer board through-thickness is provided with N layers from top to bottom has different materials
Substrate, N=2,3,4 ..., k, k >=2；
The laser beam that the femtosecond/picosecond laser switchably exports N kind different wave lengths has to be correspondingly used for N layers of etching
The substrate of different materials；
Step A2, the luminescent spectrum feature of each laminar substrate and drilling technology ginseng in industrial computer is input into the multilayer board
Number, the luminescent spectrum for defining X laminar substrates is characterized as FXAnd its drilling technology parameter is CX；With the definition femtosecond/picosecond laser
The drilling technology parameter C with X laminar substrates that device sendsXCorresponding laser beam is HX, the initial value for setting layer X to be punctured is 1；
Step A3, the industrial computer sends the X laminar substrates of the multilayer board to the femtosecond/picosecond laser
Drilling technology parameter CX, the femtosecond/picosecond laser sends the drilling technology parameter C with X laminar substratesXCorresponding laser beam
HXTo be punched to the multilayer board；
Meanwhile, the laser beam HXInteracted with the multilayer board and produce punching diverging light, spectrometer persistently to obtain
And the luminescent spectrum feature of the punching diverging light is sent to the industrial computer；
Step A4, the luminescent spectrum feature of punching diverging light described in the industry control machine testing whether be X laminar substrates luminous light
Spectrum signature FX：If then the industrial computer controls the femtosecond/picosecond laser to continue to punch；If not the then industrial computer control
Make the femtosecond/picosecond laser and stop punching, and the industrial computer updates layer X=X+1 to be punctured；
Step A5, repeat step A3 and step A4, until layer X=N to be punctured；
Step A6, the industrial computer sends the n-th layer substrate of the multilayer board to the femtosecond/picosecond laser
Drilling technology parameter CN；
Femtosecond/the picosecond laser sends the drilling technology parameter C with n-th layer substrateNCorresponding laser beam HNCome to described many
Layer printed circuit board is punched, until the spectrometer does not get the luminous light of the punching diverging light in Preset Time
The industrial computer controls the femtosecond/picosecond laser to stop punching during spectrum signature, so as to be formed on multilayer board
Through hole.
2. the laser boring method of multilayer board according to claim 1, it is characterised in that also including to multilayer
Printed circuit board (PCB) beats blind hole process：
Step B1, punching workbench place multilayer board, and the multilayer board position to be punctured
With femtosecond/picosecond laser alignment, the multilayer board is provided with N layer materials from top to bottom, N=2,3,4 ..., k, k >=
2；
The laser beam that the femtosecond/picosecond laser switchably exports N kind different wave lengths has to be correspondingly used for N layers of etching
The substrate of different materials；
Step B2, punching to the M laminar substrates of the multilayer board, wherein M are needed in industrial computer setting<N；And in work
Control machine is input into the luminescent spectrum feature and drilling technology parameter of M laminar substrates in the multilayer board, defines X laminar substrates
Luminescent spectrum be characterized as FXAnd its drilling technology parameter is CX, and define that the femtosecond/picosecond laser sends with X layers
The drilling technology parameter C of substrateXCorresponding laser beam is HX, the initial value for setting layer X to be punctured is 1；
Step B3, the industrial computer sends the X laminar substrates of the multilayer board to the femtosecond/picosecond laser
Drilling technology parameter CX, the femtosecond/picosecond laser sends the drilling technology parameter C with X layer materialsXCorresponding laser beam
HXTo be punched to the multilayer board；
Meanwhile, the laser beam and the multilayer board interact and produce punching diverging light, spectrometer persistently to obtain
And the luminescent spectrum feature of the punching diverging light is sent to the industrial computer；
Step A4, the luminescent spectrum feature of punching diverging light described in the industry control machine testing whether be X laminar substrates luminous light
Spectrum signature FX：If then the industrial computer controls the femtosecond/picosecond laser to continue to punch；If not the then industrial computer control
Make the femtosecond/picosecond laser and stop punching, and the industrial computer updates layer X=X+1 to be punctured；
Step A5, repeat step A3 and step A4, until layer X=M+1 to be punctured, the industrial computer control femtosecond/psec
Laser stops punching, so as to form the blind hole that depth reaches M laminar substrates on multilayer board.
3. the laser boring method of multilayer board according to claim 2, it is characterised in that：The drilling technology
Parameter includes laser beam repetition rate and laser beam pulses energy, and the drilling technology parameter is the multilayer board
Each laminar substrate individually carries out laser boring experimental analysis acquisition, and the laser boring experiment is to hole wall quality, aperture precision
And trepanning velocity is analyzed.
4. the system that usage right requires the laser boring method of the multilayer board described in 2, it is characterised in that：Including beating
Hole workbench, industrial computer, femtosecond/picosecond laser, spectrometer, laser projection angle adjuster and installation frame；
The installation frame includes mounting seat and installs vertical rod, and the installation vertical rod is arranged at the side of mounting seat, described
Shifting sledge is provided with the top of mounting seat；
The punching workbench activity is connected in the shifting sledge, and the punching workbench is provided with table drive motor, institute
Stating table drive motor drives the punching workbench to be moved along the shifting sledge；
Laser projection angle adjuster is installed on the top of the installation vertical rod and is hung down same with the punching workbench
Face directly, the femtosecond/picosecond laser and laser projection angle adjuster are connected, and the femtosecond/picosecond laser swashs
Light output mouthful is down-set, and laser projection angle adjuster controls the laser beam projects angle of the femtosecond/picosecond laser；
The spectrometer is installed on the middle part of the installation vertical rod and is arranged at the lower section of femtosecond/picosecond laser, the light
The opposite side of the detection optical input of the spectrometer horizontally toward mounting seat；
The industrial computer is installed on the opposite side of mounting seat, the table drive motor, spectrometer and femtosecond/picosecond laser
Device with the industry control mechatronics.
5. the laser drilling system of multilayer board according to claim 4, it is characterised in that：Also include laser beam
Apparatus for shaping, the laser beam shaper is installed on the middle part of installation vertical rod and is arranged at femtosecond/picosecond laser and light
Between spectrometer, the input port of the laser beam shaper and the laser output of femtosecond/picosecond laser are aligned, the laser
The delivery outlet of beam apparatus for shaping is set vertically downward；
The laser beam shaper sets gradually along light path and expands unit, shaping unit and condenser lens, the femtosecond/psec
The laser beam that laser sends is expanded after unit expands described in, and flat-top laser beam is shaped as into the shaping unit, then by
The condenser lens focuses on the laser beam obtained for capillary processing.
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| CN107971647A (en) * | 2017-12-27 | 2018-05-01 | 中国科学院西安光学精密机械研究所 | A kind of band thermal barrier coating blade air film hole femtosecond laser processing method and device |
| CN108176928A (en) * | 2017-12-01 | 2018-06-19 | 广东工业大学 | A kind of array micropore laser processing of adjustable angle |
| CN109719400A (en) * | 2017-10-27 | 2019-05-07 | 三星电子株式会社 | Laser processing, method for dividing substrate and the substrate manufacturing system for executing it |
| CN110587159A (en) * | 2019-09-23 | 2019-12-20 | 广东工业大学 | System and method for monitoring laser processing performance in real time |
| CN110695514A (en) * | 2019-09-18 | 2020-01-17 | 广东工业大学 | Method for multi-laser composite processing of layered composite material |
| CN112355482A (en) * | 2020-10-27 | 2021-02-12 | 夏禹纳米科技（深圳）有限公司 | Laser removal method for waterproof material on surface of electronic element |
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| CN117156688B (en) * | 2023-10-27 | 2024-01-12 | 深圳市常丰激光刀模有限公司 | Laser drilling method for multilayer circuit board |
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