The content of the invention
It is an object of the present invention to provide a kind of work realized using femtosecond laser and directly processed with thermal barrier coating blade air film hole
Process and device, solve the blade cavity opposite walls damage problem produced in femtosecond laser blade air film hole process, together
When avoid the technical problems such as shrinkage cavity, plug-hole that first drilling resurfacing brings.
The technical solution of the present invention is to provide a kind of band thermal barrier coating blade air film hole femtosecond laser processing method, its
It is characterized in that, comprises the following steps:
Step 1: blade processing region is divided into different processing sections according to machining area material character;
Step 2: the femtosecond laser process parameter of different processing sections is set;
Step 3: in process, the reflection light of spectrometer collection machined surface, by analyzing machined surface reflection light
Spectral characteristic judges the processing sections residing for drilling, automatic to call the femtosecond laser process parameter for adapting to current processing sections.
Preferably, the step of step 3 is further included using CCD shooting machined surface imagings, by imaging results and spectral characteristic knot
Close, analyze processing sections where current processing, it is automatic to call the femtosecond laser process parameter for adapting to current processing sections.
The present invention is in band thermal barrier coating blade air film hole femtosecond laser process, using coaxial spectral detection and CCD
The function of imaging.Band coating air film hole process is divided into three sections automatically:Coating and transition interval, before air film hole is not punched
Single crystal substrate section, and air film hole punch after single crystal substrate stub segment, according to analysis spectrometer and CCD gather data and figure
Picture, calls different drill processes in the different stages automatically respectively, realizes the not damaged of drilling process floating coat and transition zone
Processing and the processing of blade cavity opposite walls not damaged.
Preferably, in step 1 by blade processing region be divided into coating and transition interval, air film hole do not punch before blade
Matrix section and air film hole punch after three processing sections of blade base stub segment.
Preferably, above-mentioned steps three are specially:
The femtosecond laser process parameter of coating and transition interval is called first, is processed coating and transition interval, is worked as light
Spectrometer catches the spectral signal less than coating material, and the image of CCD shooting machined surfaces is when be circular, when lasting processing is set
Between after, terminate the processing of coating and transition interval;
Call air film hole do not punch before blade base section femtosecond laser process parameter, processing air film hole do not punch
Preceding blade base section, when spectrometer captures the spectral signal of the packing material in blade, before end air film hole is not punched
Blade base section processing;
Call air film hole punch after blade base stub segment femtosecond laser process parameter, processing air film hole punch
Blade base stub segment afterwards, stablizes when spectrometer captures packing material spectral signal, and the image of CCD shooting machined surfaces is
During the circular of sharpness of border, terminate process.
Preferably, femtosecond laser process parameter when processing coating and transition interval is as follows:Femtosecond laser pulsewidth is
100-800, power 1-5W, scanning overlap coefficient 30-50%, scan mode are concentric circular scans, and the Z axis amount of feeding is 0.01-
0.1mm;
Femtosecond laser process parameter when processing the blade base section before air film hole is not punched is as follows:Femtosecond laser arteries and veins
Width is 100-800, power 15-20W, scanning overlap coefficient 60-80%, and helical scanning, the Z axis amount of feeding is 0.01-0.1mm;
Femtosecond laser process parameter when processing the blade base stub segment after air film hole is punched is as follows:Femtosecond laser
Pulsewidth is 100-800, and power is reduced to 4-6W, scanning overlap coefficient 50-70%, and scan mode scans for concentric ring, the Z axis amount of feeding
For 0.01-0.05mm.
Preferably, when processing the blade base stub segment after air film hole is punched, concentric ring width is the 1/ of air film pore radius
2-1/3。
The above-mentioned device with thermal barrier coating blade air film hole femtosecond laser processing method is realized the present invention also provides a kind of,
Including optical beam scanning system, beam detection imaging system and control system;
Above-mentioned optical beam scanning system includes femto-second laser, scanning system and the focus lamp set gradually along light path;
Above-mentioned beam detection imaging system includes spectrometer and CCD;Further include the first pellicle mirror in the light path and the
Two pellicle mirrors;Spectrometer is located in the reflected light path of the second pellicle mirror, and CCD is located in the reflected light path of the first pellicle mirror;
Above-mentioned femto-second laser, scanning system spectrometer and CCD are connected with control system, and above-mentioned control system is used to connect
Receive and analyze spectrometer and the data of CCD, according to analysis data point reuse femto-second laser and the working process parameter of scanning system.
Preferably, in the light path of above-mentioned first pellicle mirror and the second pellicle mirror between scanning system and focus lamp.
Preferably, above-mentioned control system is industrial personal computer.
The beneficial effects of the invention are as follows:
1st, the present invention is in band thermal barrier coating blade air film hole femtosecond laser process, using coaxial spectral detection and
The method of CCD imagings, by analyzing the data and image of spectrometer and CCD collections, judges current processing sections, in the different stages
Call different drill processes, ensure thermal barrier coating process floating coat without obvious damage and single crystal substrate and coating without opening
Split, while ensure that air film hole punches moment and can effectively control technique to ensure blade cavity opposite walls not damaged;
2nd, process using the present invention and device are, it can be achieved that band thermal boundary painting is completed in the autonomous switching of multistage processing technology
The processing of layer blade air film hole, every section of processing sections have corresponding machined parameters, ensure the efficiently high-quality completion of drilling.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention will be further described.
The present invention relates to being monitored in real time using spectrometer and CCD, the real time data fed back according to spectrometer and CCD is adaptive
Answer carrying out step by step femtosecond laser air film hole process process and device, it can be achieved that thermal barrier coating process floating coat
Without obvious damage and single crystal substrate and coating are without cracking, and ensure the undamaged process of blade cavity opposite walls and dress
Put.
It can specifically be realized by following methods:
It is first according to machining area material character and blade processing region is divided into different processing sections;Painting can be specifically divided into
Layer and transition interval, air film hole do not punch before blade base section and air film hole punch after blade base stub segment;
Secondly the femtosecond laser process parameter of different processing sections is set;Different processing sections correspond to different technique ginsengs
Number;
Machining area with thermal barrier coating blade mainly includes thermal barrier coating 10, transition zone 11, blade base 12, blade cavity
Body and internal Protection material 13, and blade air film hole opposite walls 14.Blade processing requirement is process floating coat not damaged,
Matrix without re cast layer, it is non-microcracked, without heat affected area, and opposite walls not damaged, while drilling efficiency can be accelerated.
Based on the requirement of each processing sections, using following femtosecond laser process parameter:
Processed in thermal barrier coating and transition interval section using the small-power of 1-5W, by sweep speed, power and frequency
Matching, laser scanning Duplication control between 30-50%, scan mode uses concentric circular scans;Before air film hole is punched
Blade base section Duplication be promoted to 60-80%, power 15-20W, scan mode can use from the center to the periphery and from
The alternate spiral scan pattern in center is arrived in periphery;Blade base stub segment Duplication after air film hole is punched is reduced to 50-
70%, power is reduced to 4-6W, and scan mode uses concentric ring scan mode, and intermediate region is no longer scanned.
Finally, processing is completed.In process, the reflection light of spectrometer collection machined surface, by analyzing machined surface
The spectral characteristic of reflection light, it is automatic to call the femtosecond laser process parameter for adapting to current processing sections.
Adaptive segmentation in air film hole process is to analyze spectral signal and imaging letter by processing in drill process
Number complete:Spectrometer is by the reflection light in collection analysis drill process so that it is determined that drilling is to apply interval, blade
Matrix section, which has still penetrated, have been got on packing material, this is because coating material, basis material and packing material property
Difference, the spectral characteristic occurred under laser action is different, once being worked into different materials, spectral characteristic reflects rapidly,
So at the time of quickly can providing three phases according to spectral characteristic and each start;CCD passes through according to shooting machined surface
The stage that imaging contexts can be punched with assistant analysis, due to CCD image stabilizations, it is possible to carried with reference to Spectroscopic analysis results control
At the time of each end for three phases processing.
The beginning and end of specific each processing sections are determined by following signal:
(1) coating and transition interval
Start:Spectrometer captures the spectral signal of coating material, and CCD starts machined surface imaging, since machined surface tilts,
So the image that CCD is captured is irregular semicircle, and there is obvious flicker;
Terminate:The image that CCD is captured is circular, and spectrometer catches the spectral signal less than coating material, when continuing
Between 3-5 seconds;
(2) the blade base section before air film hole is not punched
Start:The image that CCD is captured is circular, and spectrometer catches the spectral signal less than coating material, when continuing
Between 3-5 seconds;
Terminate:Spectrometer captures the spectral signal of packing material;
(3) the blade base stub segment after air film hole is punched
Start:Spectrometer captures the spectral signal of packing material, does not postpone;
Terminate:The image that CCD is captured is the circular of sharpness of border, and it is steady that spectrometer captures packing material spectral signal
Fixed, blade base fret signal is most weak.
In order to realize the above method, the present invention provides the processing of corresponding band thermal barrier coating blade air film hole femtosecond laser to fill
Put, it will be seen from figure 1 that the present apparatus mainly includes 3 parts, optical beam scanning system, beam detection imaging system and control system
System;
Optical beam scanning system includes femto-second laser 3, and the scanning system 5 being arranged in 3 emitting light path of femto-second laser
With focus lamp 9;Focus lamp 9 is located at the surface in blade processing region;
Beam detection imaging system mainly includes spectrometer 7 and CCD2, in order to which spectrometer 7 can gather machined surface reflection
Spectral information, is coaxially disposed the second pellicle mirror 8, spectrometer 7 is located at second pellicle mirror 8 in the optical path and with scanning system 5
In reflected light path, the spectral information for the reflection collection machined surface that spectrometer 7 passes through the second pellicle mirror 8;In order to which CCD2 can be shot
The image information of machined surface, is coaxially disposed the first pellicle mirror 6, CCD2 is located at the first pellicle mirror 6 in the optical path and with scanning system 5
Reflected light path in, CCD2 pass through the first pellicle mirror 6 reflection collection machined surface image information;
Machine 1, femto-second laser 3, scanning system 5, spectrometer 7 and CCD2 connect control system with the control machine 1 in order to control
Connect, 1 primary recipient of control machine and the spectral information and image information of analysis spectrometer 7 and CCD2, flown according to analysis data point reuse
The working process parameter of second laser 3 and scanning system 5.
When processing blade air film hole using the device, process coating and transition interval first, open optical beam scanning system and
Beam detection imaging system, industrial personal computer, which calls, is adapted to coating and transition interval working process parameter, is flown using pulsewidth 100-800
The low-power laser processing of the 5W of second, by the matching to sweep speed, power and frequency, the control of laser scanning Duplication exists
Between 30-50%, scan mode uses concentric circular scans, and the Z axis amount of feeding is 0.01-0.1mm.Laser, which is scanned coating, to be added
Work, spectrometer catch the spectral information of machined surface, and in real time by the data sending of collection to industrial personal computer, during initial manufacture, spectrum
Instrument 7 captures the spectral signal of coating material, and CCD2 starts machined surface imaging, has obvious flicker, when the figure that CCD2 is captured
As being circular, after spectrometer 7 catches the spectral signal less than coating material, 3-5 seconds are persistently processed to ensure that painting interval is intact
Ground is fallen into thoroughly to machine.Hereafter, industrial personal computer calls second segment technological parameter, before not punched automatically into second segment, that is, air film hole
Blade base section processing.
Due to the use of small-power femtosecond laser, low-frequency processing technology, it is ensured that coating material is without significantly falling
Block, no cracking, no heat affecting;Although coating and transition zone have certain thickness, tilted yet with machined surface originally, so
When the image that CCD2 the is captured coating and machined completion of transition interval for circular and after persistently process 3-5 seconds.
Secondly the blade base section before processing air film hole is not punched, the technological parameter of the processing sections are:Processing Duplication is
70%, power 15W, using from the center to the periphery and from periphery to center, alternate spiral scan pattern, the Z axis amount of feeding are
0.01-0.1mm.Laser is scanned blade base processing, and spectrometer catches the spectral information of machined surface, and in real time will collection
Data sending to industrial personal computer, the image that originally CCD2 is captured is circular, and what spectrometer 7 captured is single crystal substrate material
Spectrum, Continuous maching, until spectrometer 7 captures the spectral signal of packing material, industrial personal computer calls the 3rd segment process immediately
Parameter, the blade base stub segment after being punched without delay automatically into the 3rd section i.e. air film hole are processed.
In second segment process, although employing high power processing method and having reached the filling inside blade cavity
Material 13, there is certain safeguard function yet with packing material 13, simultaneously because spectral signal transmission is sensitive, in this stage
The hole very little that bottom hole portion is punched, so protective materials is enough to protect blade opposite walls 14 without any damage.
The blade base stub segment processing after air film hole is punched finally is carried out, the machined parameters of this section are:Duplication is reduced to
To 50-70%, power is reduced to 2-6W, and scan mode uses concentric ring scan mode, and intermediate region is no longer scanned, concentric ring width
For the 1/2-1/3 of air film pore radius, the Z axis amount of feeding is 0.01-0.05mm;Laser, which is scanned blade base nubbin, to be added
Work, spectrometer catch the spectral information of machined surface, and in real time by the data sending of collection to industrial personal computer, until what CCD2 was captured
Image is the circular of sharpness of border, and spectrometer 7 captures packing material spectral signal stabilization, and single crystal substrate fret signal is most weak
Stop processing.
In the 3rd section of process, working power is relatively low, and machinable depth of focus is very short, and the damage of selected protective materials
Threshold value is very high, it is possible to ensures that blade opposite walls 14 are without any damage in process.