CN112872598A - Laser hole making method capable of preventing processing damage - Google Patents
Laser hole making method capable of preventing processing damage Download PDFInfo
- Publication number
- CN112872598A CN112872598A CN202110067364.1A CN202110067364A CN112872598A CN 112872598 A CN112872598 A CN 112872598A CN 202110067364 A CN202110067364 A CN 202110067364A CN 112872598 A CN112872598 A CN 112872598A
- Authority
- CN
- China
- Prior art keywords
- hole
- laser
- scanning
- center
- drilled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a laser hole making method for preventing processing damage, which comprises the following steps: s1, acquiring a target position of a hole to be drilled filled with a protective material workpiece, sequentially presetting a plurality of different annular scanning paths in the target position along the outward direction of the center of the hole to be drilled, scanning the laser with target laser energy along the scanning paths, scanning the laser along the annular scanning paths including the center area of the scanning hole to enable the center of the hole to be drilled to be close to or just penetrated, and then selecting the annular scanning paths at the outer side positions to scan to enable most materials of the hole to be drilled to be removed; and S2, reducing the target laser energy to preset laser energy, and scanning along the annular scanning path at the outer side of the center of the hole to be drilled until the hole to be drilled is completely penetrated. The invention belongs to the technical field of laser application.
Description
Technical Field
The invention relates to the technical field of laser application, in particular to a laser hole making method capable of preventing processing damage.
Background
Laser drilling is the main application of laser machiningOne area of application for laser machining of gas film holes in engine hot end components such as turbine blades is typical of this technique. In the past, milliseconds (10) were mainly used～3s) processing a gas film hole by using pulse laser, but the heat influence is large, so that a recast layer and even a microcrack exist on the wall of the small hole, and the size precision of the hole is not high; due to ultrafast laser (femtosecond with pulse width less than 10ps (10)～15s) laser, picosecond (10)～12s) laser) has very short action time and extremely high laser power density, and the small hole processing can realize no recast layer on the hole wall, and the quality and the dimensional precision of the hole wall are obviously improved. Therefore, ultrafast lasers have been used for precision machining of small holes such as vanes having a cavity structure, oil jets, and the like. Like millisecond laser drilling, picosecond and femtosecond laser drilling also face the problem of damaging the opposite wall of the part cavity after through holes, as shown in fig. 1.
In the prior art, two main technical approaches are available for preventing laser hole-making from damaging the opposite wall of the cavity.
One technical approach is to avoid the direct action of laser on the opposite wall of the cavity by filling a protective material in the cavity of the part. For example, for millisecond laser drilling, the existing mature protective material is polytetrafluoroethylene, and for cavity parts which are not easy to fill with polytetrafluoroethylene, paraffin, SiO2 sand grains and the like are adopted; aiming at ultrafast laser processing small holes such as picoseconds, femtoseconds and the like, foreign countries have a pasty protective material which is formed by mixing solid and liquid doped with ceramic particles, and the protective material flows in the processing process; in addition, glass pills, corundum particles, etc. are also used to fill the cavity.
The invention patent with application number 201610960509.X is a prior patent of the applicant, and discloses a protective material for preventing laser hole-making from damaging the opposite wall of a cavity part and a filling method, wherein granular alumina ceramic particles are used as a base material and mixed with an adhesive to be filled into the cavity of the part, and the protective material is proved to be suitable for ultrafast laser hole-making, so that the protective material is prevented from being punctured by ultrafast laser to further damage the opposite wall of the cavity in a certain time, and the protective material is shown in figure 2.
The other technical approach does not need to fill a protective material, and only reduces the energy of laser for hole making, so that the energy of the laser acting on the opposite wall is less than the ablation threshold of the material, thereby realizing no damage to the wall. For example, the patent with publication number CN108747060A discloses a method for protecting the cavity structural part perforated back wall based on laser energy regulation, that is, a method for regulating laser energy to make the energy density threshold acting on the wall lower than the ablation threshold of the material to avoid damage to the wall; the 'Laser drilling of deep holes with internal protection' patent adopts a similar mechanism, and is characterized in that a hole with a larger depth is machined by applying Laser with a narrower millisecond width (0.1-0.3 ms) and correspondingly smaller pulse energy (2-3J) in a mode of combining an impact drilling hole and a rotary-cut drilling hole, in the machining process, the Laser is focused on the upper surface of a material to be removed, the pulse energy is much smaller than that of an original deep hole to be machined, the size of a cavity of a part is larger (more than 5 mm), and after the hole penetrates through, the energy density is lower than a damage threshold value due to defocusing of the Laser, so that the damage to the opposite surface wall of the cavity can be avoided.
The two methods for preventing the laser hole-making from damaging the opposite wall are mainly suitable for parts with larger cavity sizes. With the further improvement of the requirement on the heat-resistant temperature of the blade, a double-wall cast blade is produced, the size of a cavity of the blade is further reduced, if the gap between the double walls is only 0.5-0.8 mm, the distance between the double walls is reduced, a laser energy regulating and controlling mode is adopted, a process parameter margin window is reduced, the control difficulty is high, and the energy is reduced, so that the removal efficiency is obviously reduced.
By adopting the method of filling the protective material, as the cavity becomes smaller and the effective protective thickness of the protective material is reduced, the common mode of filling and scanning the small hole by ultrafast laser is caused, as shown in fig. 3, the reliability of wall protection is obviously reduced, although the laser energy is reduced, the breakdown-resistant time of the protective material can be prolonged, the processing efficiency is also obviously reduced, and the taper of the small hole is increased.
The test results of the influence of the reduced energy on the aperture and the taper of the processed 2mm deep small hole are as follows:
test parameters are as follows: 50W picosecond laser, and the laser bias focus is 0; processing procedures are as follows: 0,250, 50, 427000, 2000.
Namely, the circular scanning is carried out from the center of the hole, the maximum outer diameter of the concentric circles is 250 micrometers, the interval between the concentric circles is 50 micrometers, the number of the concentric circles is 5 in total, the scanning speed is 427000 micrometers/s, and the cycle number is 2000 times as shown in figure 3.
The energy is selected to be 100%, 80% and 50% of processing holes with the aperture of 0.40mm, 0.38mm and 0.28-0.3 mm respectively, and the aperture is only 0.33mm and the aperture is only 0.35mm after 3000 times of circulation even if the circulation frequency is increased to 2500 under 50% of energy.
It can be seen that in order to obtain a 0.4mm aperture, the number of concentric circles and the diameter of the outermost concentric circle must be increased under 50% energy conditions, which results in a significant decrease in efficiency and an increase in aperture taper.
Accordingly, the present inventors have provided a laser drilling method that prevents machining damage.
Disclosure of Invention
(1) Technical problem to be solved
The embodiment of the invention provides a laser hole making method capable of preventing processing damage, in step S1, the adopted target laser energy does not need to reduce energy value, in step S2, the target laser energy is reduced to preset laser energy, and the technical problem of processing damage caused by hole making in a narrow space is solved.
(2) Technical scheme
In a first aspect, an embodiment of the present invention provides a laser hole drilling method for preventing machining damage, including the following steps:
s1, acquiring a target position of a hole to be manufactured filled with a protective material workpiece, sequentially presetting a plurality of different annular scanning paths in the target position along the outward direction of the center of the hole to be manufactured, scanning the laser with target laser energy along the scanning paths, firstly scanning the laser along the annular scanning paths including the center area of the scanning hole to enable the center of the hole to be manufactured to be close to or just penetrated, and then selecting the annular scanning paths at the outer side positions to scan to enable most materials of the hole to be manufactured to be removed;
and S2, reducing the target laser energy to preset laser energy, and scanning along the annular scanning path at the outer side of the center of the hole to be drilled until the hole to be drilled is completely penetrated.
In a further improvement, the holes to be processed are round holes, and the scanning paths are respectively concentric circles.
In step S1, before scanning, the laser is focused on the surface of the workpiece at the target position of the hole to be made. Such as the depth of the hole to be made is larger, or the laser is focused on the inner position of the workpiece at the target position of the hole to be made in advance.
In a further improvement, in step S1, the laser is first scanned along a circular scanning path including a central region of the hole, the scanning order is that the hole center is scanned first and then the outer side is scanned, and for the cyclic scanning, an appropriate number of cycles is selected to make the hole center to be processed close to or just penetrated.
In a further improvement, in step S1, after the hole center is close to or just penetrated, the laser beam with the target laser energy is scanned along one or more annular scanning paths preset at positions outside the hole center at the target position, so that most of the material in the hole is removed.
In a further modification, in step S2, before scanning, the focal position of the laser light is not changed, or the laser light is focused at a position lower than the focal position of the laser light in step S1, for example, the center or the exit of the hole.
In a further refinement, the preset laser energy is typically 50% of the target laser energy. Depending on the depth of the hole or the distance of the hole outlet from the opposite wall of the workpiece, it can also be higher or lower than 50%.
In a further improvement, the laser with reduced energy scans along one or more preset annular scanning paths at the position outside the center of the hole to be drilled until the hole to be drilled is completely penetrated.
(3) Advantageous effects
In summary, the laser hole making method for preventing processing damage of the invention adopts target laser energy, and makes the hole to be made not completely penetrated or the center of the hole to be made penetrated by controlling and optimizing the scanning path and action time of the hole making process, and most materials of the hole to be made are removed; and then reducing the target laser energy to preset laser energy, forming a complete through hole meeting the aperture requirement by controlling and optimizing the scanning path and the acting time of the scanning path, and filling the protection material in combination, wherein the preset laser energy is still higher than the damage threshold of the protection material and the workpiece material, and the wall damage prevention effect is reliable for small-cavity parts under the conditions of not reducing the processing efficiency and basically ensuring the original taper. The time of laser acting on the protective material in the hole making process is shortened as much as possible, and the breakdown time of the protective material is effectively delayed even if the laser acts on the protective material.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic illustration of a laser drilled damaged part.
FIG. 2 is a graph comparing damage to an ultrafast laser via in the invention patent application Ser. No. 201610960509.X, where a cavity of a larger size blade is filled with a protective material and not filled with the protective material.
FIG. 3 is a schematic view of a scanning path for hole making in accordance with an embodiment of the present invention.
FIG. 4 is a schematic diagram of the scanning path at different stages of hole making according to an embodiment of the present invention.
FIG. 5 is a schematic longitudinal cross-sectional view of a hole at various stages of the process for making the hole in accordance with an embodiment of the present invention.
FIG. 6 is a photomicrograph of a longitudinal cross-section of a hole in a double-walled structure of a blade in accordance with an embodiment of the present invention.
FIG. 7 is a longitudinal section photomicrograph of a hole in a single wall structure of a vane in accordance with an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the invention and are not intended to limit the scope of the invention, i.e., the invention is not limited to the embodiments described, but covers any modifications, alterations, and improvements in the parts, components, and connections without departing from the spirit of the invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1 to 7, a laser drilling method for preventing machining damage includes the following steps:
s1, acquiring a target position of the hole to be manufactured filled with the protective material workpiece, sequentially presetting a plurality of different annular scanning paths along the outward direction of the center of the hole to be manufactured at the target position, and scanning along the scanning paths by laser with target laser energy;
the scanning times of the laser along the scanning path are increased along the direction from the center of the hole to the outside, so that the center of the hole to be manufactured is close to or just penetrated, and most materials of the hole to be manufactured are removed;
and S2, reducing the target laser energy to preset laser energy, and scanning along the scanning path at the outer side of the center of the hole to be drilled until the hole to be drilled is completely penetrated.
In the laser hole drilling method for preventing processing damage in this embodiment, in step S1, the target laser energy is full energy, that is, the laser energy is not reduced, the number of times of scanning the laser along the scanning path is sequentially increased, and since the center position of the hole is easily penetrated, after the laser scanning is performed for a certain number of times, the center of the hole to be drilled is no longer processed, and only the material outside the center area of the hole to be drilled is further removed, so as to ensure that the hole is not completely penetrated, but most of the material is removed, so that the first processing reaches the shape shown in fig. 5 (b).
In step S2, the target laser energy is reduced to a preset laser energy, which is still sufficiently large and does not need to be reduced below a protective material or a damage threshold to the wall material, so as to avoid reducing the processing efficiency, and then the target laser energy is scanned along a scanning path at a position outside the center of the hole to be processed.
In the laser hole making method for preventing processing damage, target laser energy is adopted, and a scanning path and action time of a hole making process are controlled and optimized, so that a hole to be made is not completely penetrated or the center of the hole to be made is penetrated, and most materials of the hole to be made are removed; and then reducing the target laser energy to preset laser energy, forming a complete through hole meeting the aperture requirement by controlling and optimizing the scanning path and the acting time of the scanning path, and filling the protection material in combination, wherein the preset laser energy is still higher than the damage threshold of the protection material and the workpiece material, and the wall damage prevention effect is reliable for small-cavity parts under the conditions of not reducing the processing efficiency and basically ensuring the original taper. The time of laser acting on the protective material in the hole making process is shortened as much as possible, and the breakdown time of the protective material is effectively delayed even if the laser acts on the protective material.
Further, in an embodiment, the laser scans circularly along a scanning path in an outward direction of the center of the hole to be drilled, and the number of times of scanning of the laser along the scanning path increases sequentially along the outward direction of the center of the hole, so that the hole to be drilled is not completely penetrated or the center of the hole to be drilled is just penetrated. Specifically, the laser scans along the outward direction of the center of the hole to be drilled according to the scanning path shown in fig. 4(a), then scans along the outward direction of the center of the hole to be drilled according to the scanning path shown in fig. 4(b), and finally scans according to the scanning path shown in fig. 4 (c). So that the hole to be made is not completely penetrated or the center of the hole to be made is penetrated and most of the material of the hole to be made is removed. Correspondingly, the cross section of the hole to be formed scanned by the scanning path shown in fig. 4(a) is shown in fig. 5(a), and the cross section of the hole to be formed scanned by the scanning paths shown in fig. 4(b) and 4(c) is shown in fig. 5 (b).
In step S2, the scanning paths shown in fig. 4(b) and 4(c) are repeated again to finally reach the desired aperture. Further, the scanning path is generally shown in fig. 4(b), and the laser does not act on the middle area of the hole to be manufactured as much as possible, and is mainly used for penetrating residual thin-layer materials at the hole outlet and removing hole wall materials, so that the hole taper is reduced, and the hole diameter of the outlet is increased; in order to ensure the exit aperture and avoid the laser from being emitted from the center area of the penetrated hole to be processed without blocking as much as possible, after the scanning path is completed, as shown in fig. 4(b), the scanning path is adjusted to be as shown in fig. 4(c), so that the hole to be processed finally reaches the appearance as shown in fig. 5 (c).
Further, in an embodiment, the holes to be processed are circular holes, and the scanning paths are respectively concentric circles.
Further, in an embodiment, in step S1, before the scanning, the laser is focused on the surface of the workpiece at the target position of the hole to be made or the depth of the hole to be made is larger, and the laser is focused on the inner position of the workpiece at the target position of the hole to be made in advance.
Further, in one embodiment, in step S1, after the center of the hole to be drilled is close to or just after being penetrated, the laser beam with the target laser energy is scanned along one or more annular scanning paths preset at positions outside the center of the hole to be drilled at the target position, so that most of the material of the hole to be drilled is removed. When the depth of the hole to be drilled is lower than the preset depth, the scanning path shown in fig. 4(b) may be eliminated.
Further, in an embodiment, in step S2, before scanning, the focal position of the laser is not changed, or the laser is focused at a lower position than the focal position of the laser in step S1, for example, the center or the exit of the hole.
Further, in an embodiment, in step S2, the preset laser energy is 50% of the target laser energy. Depending on the depth of the holes and the distance between the hole outlet and the opposite wall, it may also be higher or lower than 50%.
Further, in one embodiment, in step S2, the laser beam with reduced energy is scanned along one or more annular scanning paths preset at positions outside the center of the hole to be drilled until the hole to be drilled is completely penetrated. When the depth of the hole to be drilled is lower than the preset depth, the scanning path shown in fig. 5(b) can be eliminated, and the scanning path shown in fig. 5(c) can be directly selected.
Specific cycle times (namely time) and specific path setting of each scanning path in different stages can be adjusted according to holes to be manufactured with different depths and apertures, parameters such as concentric circle distance or number, radius and the like, and the selection principle is that laser is not emitted in a penetrated area without shielding as far as possible and acts on a filled protective material, or the action time is as short as possible.
The following is a comparison of the results of the two-step method of the laser drilling method for preventing machining damage in this embodiment, i.e., step S1 and step S2, with the results of the test in the prior art using the one-step method.
TABLE 1 comparison of the protective effects for processing a 1.5mm deep straight hole/1 mm clearance cavity
Table 2 is a comparison of the protective effect of processing 2mm deep inclined holes/protective materials 1.2mm
The above description is only an example of the present application and is not limited to the present application. Various modifications and alterations to this application will become apparent to those skilled in the art without departing from the scope of this invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (9)
1. A laser hole making method for preventing processing damage is characterized by comprising the following steps:
s1, acquiring a target position of a hole to be manufactured filled with a protective material workpiece, sequentially presetting a plurality of different annular scanning paths in the target position along the outward direction of the center of the hole to be manufactured, scanning the laser with target laser energy along the scanning paths, firstly scanning the laser along the annular scanning paths including the center area of the scanning hole to enable the center of the hole to be manufactured to be close to or just penetrated, and then selecting the annular scanning paths at the outer side positions to scan to enable most materials of the hole to be manufactured to be removed;
and S2, reducing the target laser energy to preset laser energy, and scanning along the annular scanning path at the outer side of the center of the hole to be drilled until the hole to be drilled is completely penetrated.
2. The method of claim 1, wherein the holes to be drilled are circular holes, and the scanning paths are concentric circles.
3. The method for laser drilling to prevent processing damage as claimed in claim 1, wherein before scanning, the laser beam is focused on the surface of the workpiece at the target position of the hole to be drilled, or the laser beam is focused on the inner position of the workpiece at the target position of the hole to be drilled in advance in step S1.
4. The method for laser via hole making to prevent processing damage according to claim 1, wherein in step S1, the laser is first scanned along a circular scanning path including a central region of the hole, the scanning order is that the hole center is scanned first and then the outer side is scanned, and for the cyclic scanning, the appropriate number of cycles is selected to make the hole center to be made nearly penetrated or just penetrated.
5. The method for laser via formation to prevent processing damage as claimed in claim 1, wherein in step S1, the laser beam with the target laser energy is scanned along one or more predetermined circular scanning paths outside the center of the hole to be formed at the target position after the center of the hole to be formed is nearly penetrated or just penetrated, so that most of the material in the hole to be formed is removed.
6. The method of claim 1, wherein the laser beam is focused at a lower position than the laser beam in step S1, or the focal position of the laser beam is unchanged before scanning in step S2.
7. The method of claim 6, wherein the laser is focused on the middle or the exit of the hole to be drilled before scanning in step S2.
8. The method for laser via hole making to prevent processing damage according to claim 1, wherein the preset laser energy is 50% of the target laser energy in step S2.
9. The method for laser via formation to prevent processing damage as claimed in claim 1, wherein in step S2, the reduced energy laser is scanned along one or more predetermined circular scanning paths outside the center of the via to be formed until the via to be formed is completely penetrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110067364.1A CN112872598A (en) | 2021-01-19 | 2021-01-19 | Laser hole making method capable of preventing processing damage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110067364.1A CN112872598A (en) | 2021-01-19 | 2021-01-19 | Laser hole making method capable of preventing processing damage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112872598A true CN112872598A (en) | 2021-06-01 |
Family
ID=76049630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110067364.1A Pending CN112872598A (en) | 2021-01-19 | 2021-01-19 | Laser hole making method capable of preventing processing damage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112872598A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115026420A (en) * | 2022-06-07 | 2022-09-09 | 哈尔滨工业大学 | Method for avoiding damage to wall in ultrafast laser processing cavity |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10249565A (en) * | 1997-03-06 | 1998-09-22 | Ishikawajima Harima Heavy Ind Co Ltd | Drilling method of casting using core |
| CN101332559A (en) * | 2008-07-18 | 2008-12-31 | 西安交通大学 | Laser Composite Machining and Modification Method of Micro-deep Hole Without Recasting Layer |
| CN103143841A (en) * | 2013-03-08 | 2013-06-12 | 西北工业大学 | Method for hole machining with picosecond laser |
| CN106312333A (en) * | 2016-10-09 | 2017-01-11 | 中国航空工业集团公司北京航空制造工程研究所 | Method and system for processing hole with laser |
| CN107971647A (en) * | 2017-12-27 | 2018-05-01 | 中国科学院西安光学精密机械研究所 | Femtosecond laser processing method and device for blade air film hole with thermal barrier coating |
| CN108067739A (en) * | 2017-12-08 | 2018-05-25 | 中国航发动力股份有限公司 | A kind of aero-engine air film hole laser high efficiency composition processing method |
| CN108406141A (en) * | 2018-04-18 | 2018-08-17 | 中国科学院西安光学精密机械研究所 | Ultrafast laser micropore processing method and device based on optical coherence tomography |
| CN111001941A (en) * | 2019-12-26 | 2020-04-14 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| CN111250870A (en) * | 2020-01-15 | 2020-06-09 | 武汉理工大学 | Real-time monitoring method for fs laser processing non-single-layer material |
-
2021
- 2021-01-19 CN CN202110067364.1A patent/CN112872598A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10249565A (en) * | 1997-03-06 | 1998-09-22 | Ishikawajima Harima Heavy Ind Co Ltd | Drilling method of casting using core |
| CN101332559A (en) * | 2008-07-18 | 2008-12-31 | 西安交通大学 | Laser Composite Machining and Modification Method of Micro-deep Hole Without Recasting Layer |
| CN103143841A (en) * | 2013-03-08 | 2013-06-12 | 西北工业大学 | Method for hole machining with picosecond laser |
| CN106312333A (en) * | 2016-10-09 | 2017-01-11 | 中国航空工业集团公司北京航空制造工程研究所 | Method and system for processing hole with laser |
| CN108067739A (en) * | 2017-12-08 | 2018-05-25 | 中国航发动力股份有限公司 | A kind of aero-engine air film hole laser high efficiency composition processing method |
| CN107971647A (en) * | 2017-12-27 | 2018-05-01 | 中国科学院西安光学精密机械研究所 | Femtosecond laser processing method and device for blade air film hole with thermal barrier coating |
| CN108406141A (en) * | 2018-04-18 | 2018-08-17 | 中国科学院西安光学精密机械研究所 | Ultrafast laser micropore processing method and device based on optical coherence tomography |
| CN111001941A (en) * | 2019-12-26 | 2020-04-14 | 武汉华工激光工程有限责任公司 | Laser drilling method |
| CN111250870A (en) * | 2020-01-15 | 2020-06-09 | 武汉理工大学 | Real-time monitoring method for fs laser processing non-single-layer material |
Non-Patent Citations (1)
| Title |
|---|
| 刘华等: "航空涡轮叶片气膜孔飞秒激光加工工艺研究", 《金属加工(热加工)》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115026420A (en) * | 2022-06-07 | 2022-09-09 | 哈尔滨工业大学 | Method for avoiding damage to wall in ultrafast laser processing cavity |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7324571B2 (en) | Methods and systems for laser processing a workpiece and methods and apparatus for controlling beam quality therein | |
| EP1349695B1 (en) | Laser machining cooling holes in gas turbine components | |
| KR100321962B1 (en) | Laser piercing method, laser processing nozzle, and laser cutting apparatus | |
| KR101866579B1 (en) | Method and apparatus for drilling using a series of laser pulses | |
| US5837964A (en) | Laser drilling holes in components by combined percussion and trepan drilling | |
| US6362446B1 (en) | Method for drilling hollow components | |
| US8729427B2 (en) | Minimizing thermal effect during material removal using a laser | |
| CN101332559A (en) | Laser Composite Machining and Modification Method of Micro-deep Hole Without Recasting Layer | |
| Olsen et al. | Pulsed laser materials processing, ND-YAG versus CO2 lasers | |
| CN113210893B (en) | Composite laser drilling method and laser drilling device | |
| CN109175732A (en) | Processing special holes method and profiled holes | |
| CN112872598A (en) | Laser hole making method capable of preventing processing damage | |
| CN101100020A (en) | Method for manufacturing perforation in the plate thing | |
| CN111375903A (en) | Method for processing small hole by laser | |
| US20070145024A1 (en) | Laser via drilling apparatus and methods | |
| JP2008515643A (en) | Hard material processing apparatus and processing method using laser having irradiance in the range of 106 to 109 Wcm-2 and repetition rate in the range of 10 to 50 kHz | |
| JP2020157324A (en) | Laser processing method and laser processing device | |
| US10857627B2 (en) | High power fiber laser effusion hole drilling apparatus and method of using same | |
| US20170131556A1 (en) | Laser via drilling apparatus and methods | |
| Dausinger | Precise drilling with short-pulsed lasers | |
| JP3776913B2 (en) | Method for removing material by laser | |
| EP2794179B1 (en) | High power fiber laser effusion hole drilling apparatus and method of using same | |
| Dausinger | Laser drilling with short pulses | |
| French et al. | Laser percussion drilling of aerospace material using a 10kW peak power laser using a 400 µm optical fibre delivery system | |
| KR20180013679A (en) | Method and apparatus for laser processing substrate of brittle material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210601 |