CN102636464A - Femtosecond laser film micro-nanomachining real-time monitoring device - Google Patents
Femtosecond laser film micro-nanomachining real-time monitoring device Download PDFInfo
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- CN102636464A CN102636464A CN2012101059304A CN201210105930A CN102636464A CN 102636464 A CN102636464 A CN 102636464A CN 2012101059304 A CN2012101059304 A CN 2012101059304A CN 201210105930 A CN201210105930 A CN 201210105930A CN 102636464 A CN102636464 A CN 102636464A
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Abstract
The invention relates to a femtosecond laser film micro-nanomachining real-time monitoring device. The device comprises a laser generating system, an external light path system, a PC (poly carbonate) machine and a three-dimensional mobile platform, wherein laser sent by the laser generating system is focused on a focusing mirror through the external light path system; the device is also provided with a spectrum focusing mirror, a fiber optic probe, a spectrometer, an enlargement mode CCD (charge coupled device) and a time delay controller, wherein the spectrum focusing mirror and the fiber optic probe are fixed on the three-dimensional mobile platform; the spectrometer is connected with the fiber optic probe through data lines, and the spectrometer is also connected with the time delay controller through the data lines; and the time delay controller is connected with a femtosecond laser through a signal wire, and the femtosecond laser, the enlargement mode CCD, an optical gate and the three-dimensional mobile platform are connected with the PC machine through the signal lines. The device provided by the invention has the advantages that the equipment is simple, the operation is easy and simple, the applicability is wide, the film micromachining rapid detection is realized, the accuracy for detecting element is very high, the device almost can detect any element, and the detection efficiency and the reliability are greatly improved.
Description
Technical field
The invention belongs to the micromachining device of spectral technique, particularly a kind of femtosecond laser film micro-nano processing real-time monitoring device.
Background technology
The LIBS technology is an important instrument in element identification and quantitative test.It has washability, and is destructive little, and resolution is high and can be to solid-state, liquid state, and gaseous state and aerosol material carry out real-time analysis, and it is extensive more to make this The Application of Technology scope come approximately.
1962, Fred Brech at first proposed to induce the spectrochemical method that produces plasma with ruby maser; Runge in 1964 and nineteen sixty-five Rasberry set up the reference curve of quantitative test constituent content.Kenneth used ruby laser activated plasma on ore to survey content of elements in the ore through the control reference curve in 1967, and detection limit reaches 1000ppm.Development LIBS through four more than ten years has experienced following process: the sixties emphasis be research and development a kind of commercial can be with on the stripped instrument such as light spark source generation.Mainly study spectroscopy the seventies and directly melt and excite, study the physical mechanism that atmosphere punctures simultaneously.The starting point people in spectrochemistries, studied the LIBS technical application to improve detection accuracy and reliability the eighties.This so far technology just was used widely and was studied the mid-90, was applied to reality, like the monitoring of environmental pollution, and the cleaning of the artwork and the control of materials processing etc.
Appearance along with femtosecond laser; Because femtosecond laser has the energy density of superelevation; When rapidoprint, has certain threshold value that melts; Simultaneously material is made to have higher repeatability by very level and smooth of the pattern that processes by direct boiling, and that these are traditional nanosecond laser processing institutes is incomparable.Therefore femtosecond laser parallel micromachining has very consequence in the MEMS device fabrication.But having a problem is exactly under so high pulse energy, because the little manufacturing of ultrafast laser is insensitive for institute's material processed, when processing micro element on film, how to stop the fusing of host material.Along with raising to the precise treatment of device and microminiaturized requirement, prior art laser processing device can't satisfy new precise treatment and microminiaturized needs.And traditional processing is through manually-operated, processing the back through manual observation, and this will have influence on the efficient and the continuity of processing.
Summary of the invention
The technical matters that the present invention will solve is the deficiency to prior art, and the femtosecond laser film micro-nano processing unit (plant) that a kind of structure setting is more reasonable, can realize monitoring in real time and high-precision processing is provided.
Technical matters to be solved by this invention is to realize through following technical scheme.The present invention is a kind of femtosecond laser film micro-nano processing unit (plant), and this device comprises laser generating system, outside optical system, PC and three-dimensional mobile platform; Described laser generating system is made up of pumping source, femto-second laser and regenerative amplifier successively; Described outside optical system is made up of total reflective mirror, optical gate, decay mirror, semi-transparent semi-reflecting lens and focus lamp successively; The laser that laser generating system sends focuses on the focus lamp through outside optical system; Be characterized in: this device also is provided with spectrum focus lamp, fibre-optical probe, spectrometer, enhancement mode CCD and time delay controller; Described spectrum focus lamp and fibre-optical probe are fixed on the three-dimensional mobile platform; Spectrometer is connected with fibre-optical probe through data line; Spectrometer also is connected with the time delay controller through signal wire; The time delay controller is connected with femto-second laser through signal wire, and femto-second laser, enhancement mode CCD, optical gate and three-dimensional mobile platform all are connected with PC through signal wire.
In a kind of femtosecond laser film micro-nano processing unit (plant) technical scheme of the present invention: can also be provided with energy meter in the reflection direction side of semi-transparent semi-reflecting lens.
In a kind of femtosecond laser film micro-nano processing unit (plant) technical scheme of the present invention: preferably adopting response wave band is that 200nm～980nm, resolution are the spectrometer of 0.1nm.
Apparatus of the present invention are based on the LIBS technology, and it can realize that real-time online detects the function of multiple element.It is a kind of processing pick-up unit that integrates ultrafast laser technique, high precision scanning technique, spectrum detection technique, software controlling technique.It adopts femtosecond laser film processed material surface, thereby monitors working depth and crudy in real time through accepting plasma spectrometry, is applicable to the real-time monitoring of MEMS device manufacturing processes.
When apparatus of the present invention are used, at first open pumping source, the laser of its generation be incorporated in the resonator cavity of femto-second laser, through the femtosecond ultra-short pulse laser of vibration back generation through regenerative amplifier with the energy amplification to satisfy micro-machined needs.Pulse laser can suspend process through optical gate through optical gate and decay mirror; After overdamping mirror convenient adjusting laser energy and paired pulses carry out shaping, pass through semi-transparent semi-reflecting lens then, realize beam splitting, a branch of undulating quantity that is used for monitoring in real time pulse energy, another bundle focuses on processed sample surfaces through focus lamp and processes.The solid target is placed on the three-dimensional mobile platform; On PC, finish the mobile alignment of platform; Regulate distance and angle between spectrum focus lamp, fibre-optical probe and the sample three; Make the intensity of spectral signal for maximum, be fixed at last on the three-dimensional mobile platform, thereby guarantee in the process static relatively between the three.Regulate the time delay between laser instrument bright dipping and the spectrometer detection signal through time delay controller (preferably DG535).In this process, can test the optimizing delay time, obtain the strongest spectral signal.Drive the motion of 3-D scanning platform through the software control system of setting in the PC; Control optical gate switch; Also carry out element identification and ultimate analysis simultaneously; And through the processing real-time control software laser instrument is controlled, thereby can realize detection and the control of processing and the timely adjustment of parameter of the little processing of film surface, spectral line.
The PC of apparatus of the present invention can be installed the spectra database of various elements, can carry out automatic recognition element to the spectrum that obtains through software.Film is added man-hour, the breakdown phenomenon of film is taking place, matrix is being produced melt, thereby causing the processing inefficacy, in spectrogram, can produce the signal of matrix element this moment.At this moment, two kinds of selections can be arranged, the first is suspended process through auto-control software; It two is translational speeds of finely tuning or increase three-dimensional mobile platform through decay mirror pulsed energy, to satisfy processing needs, just can hand inspection after this is effectively avoided the whole machining process process to finish to the processing inefficacy.This has not only practiced thrift working (machining) efficiency, also can guarantee crudy simultaneously.
LIBS (LIBS) technology can be collected the working depth of laser from the processing fragment under the laser ablation, thereby can adjust the quality that machined parameters guarantees processing timely.When laser is focused on the testee; The power density that arrives material surface reaches 1Gw/cm2; Under bombardment with pulse laser of high power density very; Laser ablation the sub-fraction of material surface, simultaneously a life-span very short, the luminous plasma with superelevation Shun attitude temperature (10000 ℃) forms at material surface.In this bundle plasma, exfoliation material is broken down into excited ion and atom; Laser pulse last, because plasma spreads with supersonic speed towards periphery, and cooling fast.Ion that in this process, excites and atom give off characteristic spectrum when low-energy state changes.Spectrometer through sensitivity is surveyed and analyzing radiation spectrum just can obtain being melted the kind of element in the material.And the characteristic of femtosecond laser has determined that the repeatability of the plasma that it excites generation is high, and detection accuracy has greatly improved than nanosecond laser.Can little processing of processing femtosecond laser be detected in real time and control through this method.
Compared with prior art, apparatus of the present invention equipment is simple, and is applied widely.Can realize the fast detecting of little crudy.Kind and precision that this device is surveyed element are very high, almost can detect any element, have improved detection efficiency and reliability greatly.This device is easy and simple to handle, adjusts light path and after time delay, whole operation is exactly simple automation mechanized operation, and the translational speed through laser energy and three-dimensional mobile platform directly determines the quality of processing.
Description of drawings
Fig. 1 is the structural representation of apparatus of the present invention;
Fig. 2-3 is for adopting the experimental result picture of apparatus of the present invention film processed sample.
Embodiment
Following with reference to accompanying drawing, further describe concrete technical scheme of the present invention, so that those skilled in the art understands the present invention further, and do not constitute restriction to its right.
Embodiment 1, with reference to Fig. 1, and a kind of femtosecond laser film micro-nano processing unit (plant), this device comprises laser generating system, outside optical system, PC 15 and three-dimensional mobile platform 11; Described laser generating system is made up of pumping source 1, femto-second laser 2 and regenerative amplifier 3 successively; Described outside optical system is made up of total reflective mirror 4, optical gate 5, decay mirror 7, semi-transparent semi-reflecting lens 8 and focus lamp 9 successively; The laser that laser generating system sends focuses on the focus lamp 9 through outside optical system; It is characterized in that: this device also is provided with spectrum focus lamp 10, fibre-optical probe 12, spectrometer 13, enhancement mode CCD14 and time delay controller 16; Described spectrum focus lamp 10 is fixed on the three-dimensional mobile platform 11 with fibre-optical probe 12; Spectrometer 13 is connected with fibre-optical probe 12 through data line; Spectrometer 13 also is connected with time delay controller 16 through signal wire; Time delay controller 16 is connected with femto-second laser 2 through signal wire, and femto-second laser 2, enhancement mode CCD14, optical gate 5 and three-dimensional mobile platform 11 all are connected with PC 15 through signal wire.
Embodiment 3, and in embodiment 1 or the 2 described femtosecond laser film micro-nano processing unit (plant)s: the response wave band of described spectrometer is 200nm～980nm, and resolution is 0.1nm.
Use the femtosecond laser film micro-nano processing unit (plant) of present embodiment to carry out the experiment of film processed sample.Process before the monitoring, at first open optical gate 5, regulate decay mirror 7, detect pulse energies, and the position of manual adjustments focus lamp 9, make light beam focus on to place the sample surfaces of three-dimensional mobile platform 11 through energy meter 6.Regulate distance and angle between spectrum focus lamp 10 and fibre-optical probe 12 and the sample; In the time can obtaining to add the strongest plasma spectral line through spectrometer 13, enhancement mode CCD14, time delay controller (DG535) 16 and PC 15; Be fixed on three-dimensional mobile platform 11 surfaces to spectrum focus lamp 10 and fibre-optical probe 12; Keep in the process static relatively between sample, spectrum focus lamp 10 and fibre-optical probe 12 threes, thereby avoid moving the fluctuation that causes line strength because of the position.
Because the life-span of plasma has only tens microseconds, so the time of control spectrometer 13 acquired signal is key issues.The sequential of whole acquired signal is: PC 15 is being controlled the first trigger pip of spectrometer 13; Import an external trigger signal by Ext Trig interface to DG535, and DG535 links to each other with the Lamp Sync of spectrometer 13 and the Ext Trig interface of femto-second laser 2 respectively.And the signal of these two ports is being controlled the time of spectrometer 13 acquired signal and the time of femto-second laser 2 bright dippings respectively; Through the time delay between time delay controller (DG535) 16 adjusting spectrometers 13, enhancement mode CCD14, the femto-second laser 2, to obtain the higher elemental characteristic spectral line of signal to noise ratio (S/N ratio).
Set suitable line strength threshold value through the element identification software in the PC 15, through processing real-time control software control femto-second laser 2, optical gate 5, three-dimensional mobile platform 11, thus the real-time monitoring of realization processing.
Fig. 2 and Fig. 3 are the preliminary experiment figure as a result of Laser Processing film sample.Laser through different-energy comes processed sample, can find that spectral signal is responsive to the material that laser melted, thereby little process can effectively monitored and control to explanation apparatus of the present invention.Fig. 2 is the Au film of matrix for adopting apparatus of the present invention processing with Si, and this moment, excitation energy was 7.5mJ, did not find the Si element in the spectral line, and it is breakdown to have reflected that film does not have, and processing is normal.When Fig. 3 is 20mJ for excitation energy, occurred the Si element in the spectral line, the processing inefficacy is described, matrix is ablated, and can pass through the native system device this moment, in time adjusts the machining energy of laser, avoids processing the continuity of inefficacy.
Claims (3)
1. a femtosecond laser film micro-nano is processed real-time monitoring device, and this device comprises laser generating system, outside optical system, PC and three-dimensional mobile platform; Described laser generating system is made up of pumping source, femto-second laser and regenerative amplifier successively; Described outside optical system is made up of total reflective mirror, optical gate, decay mirror, semi-transparent semi-reflecting lens and focus lamp successively; The laser that laser generating system sends focuses on the focus lamp through outside optical system; It is characterized in that: this device also is provided with spectrum focus lamp, fibre-optical probe, spectrometer, enhancement mode CCD and time delay controller; Described spectrum focus lamp and fibre-optical probe are fixed on the three-dimensional mobile platform; Spectrometer is connected with fibre-optical probe through data line; Spectrometer also is connected with the time delay controller through signal wire; The time delay controller is connected with femto-second laser through signal wire, and femto-second laser, enhancement mode CCD, optical gate and three-dimensional mobile platform all are connected with PC through signal wire.
2. a kind of femtosecond laser film micro-nano processing real-time monitoring device according to claim 1, it is characterized in that: the reflection direction side at semi-transparent semi-reflecting lens is provided with energy meter.
3. a kind of femtosecond laser film micro-nano processing unit (plant) according to claim 1, it is characterized in that: the response wave band of described spectrometer is 200nm～980nm, resolution is 0.1nm.
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| CN103317228A (en) * | 2013-07-09 | 2013-09-25 | 北京工业大学 | Simultaneous monitoring device for femtosecond laser micromachining |
| CN103900895A (en) * | 2014-03-31 | 2014-07-02 | 中国科学院上海光学精密机械研究所 | Laser ablation system applicable to laser plasma mass spectrometer |
| CN104972124A (en) * | 2015-06-25 | 2015-10-14 | 武汉大学 | Real-time monitoring rapid prototyping device and method based on femtosecond laser composite technology |
| CN105014769A (en) * | 2015-06-25 | 2015-11-04 | 武汉大学 | 3D printing preparation method based on nanosecond-picosecond-femtosecond laser compound technology for NOx sensor |
| CN105671628A (en) * | 2016-02-01 | 2016-06-15 | 昝育德 | Device and method for growing sliced or special-shaped warped single crystal through melting in laser heating area |
| CN105954055A (en) * | 2016-04-27 | 2016-09-21 | 中国科学院合肥物质科学研究院 | Femtosecond excimer laser ablation sampling system |
| CN106290310A (en) * | 2016-09-27 | 2017-01-04 | 华中科技大学 | A kind of low cost highly sensitive laser microprobe elemental analyser |
| CN106451047A (en) * | 2016-06-16 | 2017-02-22 | 光惠（上海）激光科技有限公司 | Novel intelligent self-test optical fiber laser device and power-on self-test method for same |
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| CN107971647A (en) * | 2017-12-27 | 2018-05-01 | 中国科学院西安光学精密机械研究所 | Femtosecond laser processing method and device for blade air film hole with thermal barrier coating |
| CN108012352A (en) * | 2017-11-21 | 2018-05-08 | 上海卫星装备研究所 | The preparation method and electric heater of carbon nano-tube film electric heater |
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| CN113063736A (en) * | 2019-12-31 | 2021-07-02 | 韩国科学技术院 | Femtosecond laser-based ultrasonic measuring device for 3D printing process and 3D printing system with femtosecond laser-based ultrasonic measuring device |
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| CN115198226A (en) * | 2022-08-16 | 2022-10-18 | 中国人民解放军空军工程大学 | Method for improving metal corrosion resistance based on femtosecond laser induced surface oxidation layer |
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Application publication date: 20120815 |