CN1674765A - UV laser drilling hole method - Google Patents
UV laser drilling hole method Download PDFInfo
- Publication number
- CN1674765A CN1674765A CN 200410026626 CN200410026626A CN1674765A CN 1674765 A CN1674765 A CN 1674765A CN 200410026626 CN200410026626 CN 200410026626 CN 200410026626 A CN200410026626 A CN 200410026626A CN 1674765 A CN1674765 A CN 1674765A
- Authority
- CN
- China
- Prior art keywords
- hole
- processing
- conducting hole
- lightly conducting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The present invention relates to an UV laser drilling method for making microconductive through-hole one printed circuit base board. Said method includes the following steps: utilizing UV laser beam to scan the position having need of making microconductive through-hole along a certain pathway, then successively making several microholes until the area of whole surface around the microconductive through-hole in covered with the made microholes all over, and then carving the whole microconductive through-hole. Said invention adopts the ring sawing process, so that it can raise the making quality of the microconductive through-hole.
Description
Affiliated technical field
The present invention relates to a kind of method of on tellite, carrying out laser drill, particularly a kind of method that adopts the UV laser drill.
Background technology
Along with miniaturization, the portability of electronic equipment, more and more require the circuit densification on printed circuit board (PCB).Adapt with above-mentioned requirements, occurred in recent years on conventional high-density printed circuit board the one or both sides sequential lamination laminated multi-layer tellite of high density conductive layer (being generally 2～4 layers) more, has littler lightly conducting hole on this plate, thinner thickness of insulating layer and meticulous more short and small live width/spacing.Between the tellite of the stacked on top of one another in aforesaid multilayer printed board, need carry out electric connection to conductive layer, wherein conductive layer generally is made up of copper figure (pattern), and insulating barrier is generally made by organic materials such as insulating resin layers.Aforesaid being electrically connected in the following way finished, at first on the relevant position of tellite, process the lightly conducting hole, electroplate last layer copper at the hole wall in lightly conducting hole then, this copper layer can be realized the electric interconnection of the electroconductive copper patterning layer of levels tellite.
(can reach 100 along with the hole count in the lightly conducting hole of the laminated multi-layer tellite of high interconnection density is more and more, 000 hole/layer), aperture more and more littler (less than Φ 0.1mm) utilizes laser drill to obtain using widely as a kind of not only economy but also the mode of processing the lightly conducting hole efficiently.
In the procedure for processing of whole tellite, the crudy in lightly conducting hole is that the problem thought is taken a lot of trouble very much by manufacturer always on the tellite, its reason mainly contains two aspects, the quantity that on the one hand is the hole that processes on the tellite is quite huge, wherein have the processing existing problems in a hole promptly can cause certain loss, therefore requiring has advantages of higher stability on the crudy of laser drill; On the other hand because the particularity of the operation of machining hole, the crudy in lightly conducting hole can't effectively detect after this operation, final detection will be electroplated by the time and electrical just can be known afterwards, if therefore boring goes wrong, will cause bigger loss, this just has higher requirement to the crudy of laser drill.
General at present employing carbon dioxide laser is processed the lightly conducting hole, the wavelength of carbon dioxide laser is at 9.4～10.6um, be a kind of far infrared laser, most organic materials have the ultrared characteristics of strong absorption, organic material is after having absorbed high infrared laser power, fusing rapidly, vaporization and burning, thereby between the copper patterning layer of multilayer printed board, form the lightly conducting hole, the hole wall in lightly conducting hole can couple together the copper patterning layer of adjacent layer after cleaning and electro-coppering, realizes highdensity electric interconnection.
In the process in carbon dioxide laser processing lightly conducting hole, in order to process the aperture of a certain size and the degree of depth, the normal pulse impact mode that adopts is processed, its processing light path principle as shown in Figure 1, a mask plate 3 is placed on condenser lens the place ahead, a plurality of light holes not of uniform size are arranged on it, need the aperture in the lightly conducting hole that processes to become the object-image conjugate relation by condenser lens on these light holes and the tellite, the size that changes light hole can change the size in processing aperture.Carbon dioxide laser can not the worked copper graph layer, the position that needs to need earlier to process the lightly conducting hole on tellite adopts the method for chemical etching to remove copper patterning layer, leave " window " identical with the aperture size in lightly conducting hole, and then go out corresponding lightly conducting hole with laser processing.
The Energy distribution of laser on the diametric(al) of light beam is Gaussian, and promptly the beam center energy is the highest, reduces gradually along the radial direction energy.See also Fig. 2, transverse axis is represented aperture R, the longitudinal axis is represented laser energy E, adopting pulse impact mode to add man-hour, the energy at hole wall place and center, hole has than big-difference, therefore work in-process is in order to form certain hole wall quality (mainly being the pointed cone angle), the energy operated by rotary motion of laser beam bigger, and the laser energy of center, hole is then bigger.When the laser energy at center, hole shone on the copper patterning layer of internal layer, part energy was reflexed to by the internal layer copper patterning layer on the insulating barrier of lightly conducting hole sidewall, and part energy is absorbed by the internal layer copper patterning layer.Reflex to energy on the sidewall in lightly conducting hole and be insulated layer and absorb, cause lateral erosion and form cydariform hole (be that port size is little, hole waist size is big).The energy that is absorbed by the internal layer copper patterning layer makes internal layer copper patterning layer temperature raise and the generation buckling deformation, and then causes internal layer copper patterning layer and insulating barrier to be separated, and forms layering or foaming phenomenon.
Can there be serious hidden danger in the lightly conducting hole that has these quality problems in follow-up processing with in using, if residual at the bottom of the hole have an insulating material, the hole by electro-coppering after, there is insulating barrier between copper layer of electroplating and the internal layer copper patterning layer, very easily cause electrical open, even residue is less, electrically conducting, but because that copper electroplating layer and internal layer copper patterning layer connect true area is little, adhesive strength is poor, in follow-up soldering processing or product use,, electric path is disconnected because thermal shock stress or distortional stress very easily cause the copper electroplating layer fracture.Equally, because layering or the bubble problem that excessively causes of ablating also can cause similar consequence.And the cydariform hole that occurs because of lateral erosion (is that port size is little, hole waist size is big), in the metallization operation in the lightly conducting hole of back, easily cause poor plating, this bad electrodeposited coating is prone to fracture and comes off in follow-up processing and use phenomenon causes the bad problem of serious electrically conducting.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, a kind of UV method for drilling holes of crudy of the lightly conducting hole that can obviously improve tellite is provided.
The technical solution adopted for the present invention to solve the technical problems is: scanned along certain track in the position in needs processing lightly conducting hole by the UV laser beam, process several micropores successively, be covered with the area on the whole surface that the lightly conducting hole enclosed until the micropore that is processed, whole lightly conducting hole is chiseled and carved out.
The present invention with respect to the advantage that prior art had is: the processing mode that adopts the trepan formula in the UV method for drilling holes of the present invention, process flexibility is increased, it is very succinct that light path system becomes, and because each pulsed laser energy is smaller, be evenly distributed, solve the problem that produces too greatly owing to laser energy in the conventional carbon dioxide laser processing mode effectively, improved the crudy in lightly conducting hole.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic diagram of existing pulse carbon dioxide laser boring method related to the present invention.
Fig. 2 is the schematic diagram that laser energy distributes in the existing pulse carbon dioxide laser boring method related to the present invention.
Fig. 3 a is the schematic diagram of the track while scan of laser beam when adopting trepan method processing mode in the UV method for drilling holes of the present invention.
Fig. 3 b is the schematic diagram of the hot spot scanning process of laser beam when adopting trepan method processing mode in the UV method for drilling holes of the present invention.
Fig. 4 is the schematic diagram that laser energy distributes when adopting trepan method processing mode in the UV method for drilling holes of the present invention.
Fig. 5 a adopt to divide the two-layer design sketch that adds after the ground floor completion of processing in man-hour in the UV method for drilling holes of the present invention.
Fig. 5 b adopt to divide the two-layer design sketch that adds after the second layer completion of processing in man-hour in the UV method for drilling holes of the present invention.
Fig. 6 is that UV method for drilling holes of the present invention adopts the schematic diagram that divides three layers of processing.
Embodiment
See also Fig. 3 a, Fig. 3 b, Fig. 4, Fig. 5 a, Fig. 5 b and Fig. 6, the present invention adopts the method for UV laser drill to process lightly conducting hole 4 on the high density interconnect tellite.As everyone knows; UV optical maser wavelength very short (less than 400nm); it is high to focus on the back energy density; and most of materials to the absorptivity of UV laser all than higher; various materials are after absorbing UV laser; can destroy organic molecular link, the metallic bond of metallic crystal and the ionic bond of inorganic matter, its formation suspended particulate or loss such as atom, micel be gone out, thereby between the inside and outside copper patterning layer of multilayer printed board, form connective blind hole.This hole hole wall can couple together internal layer and outer field copper patterning layer 1 after cleaning and copper facing, reaches the highdensity electric interconnection of ectonexine tellite.As can be seen, it is nonmetal that UV laser not only can be processed organic material etc., all right processing metal (as copper), and its processing mechanism is not " ablation ", thereby can not produce burn and the carbonization that " heat " processing causes, " cold " processing mode of this uniqueness is very beneficial to forming micropore.
Because UV optical maser wavelength is very short, spot diameter after the focusing is in theory about 10um, when the lightly conducting hole 4 that processes about 100um, can adopt the trepan method to process, UV laser can worked copper in addition, it does not need out " window ", can directly process required lightly conducting hole 4, has reduced the operation of laser drill.
Trepan method processing mode schematic diagram is shown in Fig. 3 a and Fig. 3 b, the UV laser beam is offered the local of lightly conducting hole 4 at needs and is all scanned one time, diameter according to institute's machining hole, automatically calculate the track while scan 5 of laser beam by the inner setting program of UV laser drilling machine, the setting laser energy parameter is controlled laser beam at last at high speed along calculating good track 5 scannings one time then.Simultaneously, the hot spot of laser beam processes a micropore every a specific step pitch in the process of scanning, step by step needed lightly conducting hole 4 is chiseled and carved out.In Fig. 3 a, shown the track while scan 5 of laser beam, in Fig. 3 b, shown laser beam in scanning process, the track that the hot spot 6 of laser beam is moved.The hot spot 6 of laser beam constantly processes micropore one by one in the process of operation, be covered with the area on the whole surface that lightly conducting hole 4 enclosed up to all micropores, just whole lightly conducting hole 4 is chiseled and carved out.
In the present embodiment, the track while scan 5 of laser beam is the concentric circless of several radiuses less than lightly conducting hole 4, certainly, for the needs of processing, can adopt the track of any other shape, as long as the hot spot 6 of laser beam is in the process of operation, the micropore that is processed can be covered with the area on the whole surface that lightly conducting hole 4 enclosed.
This processing mode of chiseling and carving is compared with the processing mode of routine has characteristics significantly: first, the size in processing aperture is by program control, process flexibility is increased, and removed laser facula diameter changing mechanism complicated in the conventional processing mode, make light path system become very succinct, reliability obviously increases; Second, lightly conducting hole 4 adopts the mode of chiseling and carving to process, see also Fig. 4, transverse axis is represented aperture R, the longitudinal axis is represented laser energy E, owing to be a plurality of pulse processing, each pulsed laser energy E1 is smaller, and certain change in location arranged between the laser pulse, can make the synthetic machining energy E2 in the range of work of whole aperture be evenly distributed on the whole, solve the problem that produces too greatly owing to laser energy in the conventional carbon dioxide laser processing mode so effectively, improved the crudy in lightly conducting hole 4.
When directly processing lightly conducting hole 4 with UV laser, because the laser-damaged threshold value of metallic copper graph layer 1 will be much larger than the material of insulating barrier 2, therefore worked copper graph layer 1 needed laser energy density is greater than the material of insulating barrier 2, this moment is under the individual layer processing mode, residual in order to guarantee not have, need to select bigger laser energy.If each pulsed laser energy E1 is too big, superfluous energy easily causes the damage of internal layer copper patterning layer 1.May occur residual and reduce each pulsed laser energy E1.Adopt the mode of multilayer processing to address this problem effectively this moment, promptly repeatedly cyclic process adopted in same lightly conducting hole 4.On laser controlling, the processing number of plies (cycle-index) is the highest to be set at 7 simultaneously, every layer of independent setting laser energy parameter, and the energy of laser pulse can be set by parameters such as pulse periods.
In the process in the processing lightly conducting hole 4 of reality, the processing number of plies and the machining energy different according to the material selection of different insulating barrier 2, consider working (machining) efficiency (productivity ratio) problem simultaneously, can adopt two layers of method to process, ground floor is set higher laser energy, and copper patterning layer 1 is removed, and it is smaller that the second layer can be set laser energy, processing insulating barrier 2, less laser energy can not damage the copper patterning layer 1 of internal layer.Two layers of concrete round-robin method processing effect are shown in Fig. 5 a and Fig. 5 b, and wherein Fig. 5 a is ground floor processing, and it finishes the removal of copper patterning layer 1, and Fig. 5 b is second layer processing, and it finishes the processing of insulating barrier 2.
In order to control the hole shape quality better, except setting the processing number of plies, also can set the pore size of every layer of processing, process schematic diagram as shown in Figure 6, if divide three layers to process, ground floor forms port size a, the second layer reduces to process aperture size, forms hole waist size b, and the 3rd layer reduces to process aperture size once more, size c at the bottom of the formation hole makes hole shape fairly regular, neat.
In the UV method for drilling holes of the present invention, because UV laser can worked copper, it does not need out " window ", can directly process needed lightly conducting hole 4, has reduced the operation of laser drill.
In addition, adopt processing of trepan method in the UV method for drilling holes of the present invention, process flexibility is increased, it is very succinct that light path system becomes, and because each pulsed laser energy E1 is smaller, be evenly distributed, solved the problem that produces too greatly owing to laser energy in the conventional carbon dioxide laser processing mode effectively, improved the crudy in lightly conducting hole 4.
Moreover, in the UV method for drilling holes of the present invention, can adopt the layering method for processing, make hole shape rule, neat more.
UV method for drilling holes of the present invention has solved the particular problem during printed circuit board (PCB) is produced for the processing that solves lightly conducting hole 4 on the tellite provides new method, has also enlarged the application of UV laser in printed circuit board industry simultaneously.
Claims (7)
1. UV method for drilling holes that is used for the lightly conducting hole on the processing printed circuit substrate, it is characterized in that: scan along certain track in the position in needs processing lightly conducting hole by the UV laser beam, process several micropores successively, be covered with the area on the whole surface that the lightly conducting hole enclosed until the micropore that is processed, whole lightly conducting hole is chiseled and carved out.
2. UV method for drilling holes according to claim 1 is characterized in that: the UV laser beam scans twice at least to each lightly conducting hole, adopts the mode of the lightly conducting hole being carried out layering processing, and the parameter of wherein each pulsed laser energy is set separately.
3. UV method for drilling holes according to claim 2 is characterized in that: each lightly conducting hole adopts the number of plies of layering processing more than or equal to 2, and is less than or equal to 7.
4. UV method for drilling holes according to claim 3, it is characterized in that: it is 2 o'clock that the number of plies of layering processing is adopted in each lightly conducting hole, the laser energy that ground floor is set is wanted and copper patterning layer can be removed, the second layer with laser energy set less than ground floor, make it can finish processing just to insulating barrier.
5. UV method for drilling holes according to claim 2 is characterized in that: each lightly conducting hole adopts layering to add man-hour, sets the size in the aperture of every layer of processing respectively, processes needed hole shape at last.
6. UV method for drilling holes according to claim 5 is characterized in that: each lightly conducting hole is adopted and is divided three layers of processing, and ground floor forms port size, the second layer reduces to process aperture size, form hole waist size, the 3rd layer reduces to process aperture size once more, size at the bottom of the formation hole.
7. UV method for drilling holes according to claim 1 is characterized in that: the track while scan of UV laser beam is the concentric circles of several radiuses less than the lightly conducting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410026626 CN1674765A (en) | 2004-03-24 | 2004-03-24 | UV laser drilling hole method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410026626 CN1674765A (en) | 2004-03-24 | 2004-03-24 | UV laser drilling hole method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1674765A true CN1674765A (en) | 2005-09-28 |
Family
ID=35046939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410026626 Pending CN1674765A (en) | 2004-03-24 | 2004-03-24 | UV laser drilling hole method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1674765A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101610643B (en) * | 2009-07-14 | 2010-12-01 | 华中科技大学 | Method for processing blind hole by laser |
| CN102770945A (en) * | 2010-02-11 | 2012-11-07 | 应用材料公司 | Gas distribution showerhead with coating material for semiconductor processing |
| CN103231177A (en) * | 2013-04-19 | 2013-08-07 | 苏州光韵达光电科技有限公司 | Laser cutting method for printed circuit board (PCB) in ball grid array structure |
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
| CN104722932A (en) * | 2015-03-28 | 2015-06-24 | 大族激光科技产业集团股份有限公司 | Laser drilling method for amorphous silicon solar cell glass substrate |
| CN105025669A (en) * | 2015-07-28 | 2015-11-04 | 维嘉数控科技（苏州）有限公司 | UV laser drilling method and printed circuit board with blind hole |
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN105436718A (en) * | 2014-08-26 | 2016-03-30 | 安捷利电子科技（苏州）有限公司 | UV laser drilling method for preparing blind holes controllable in taper |
| CN105728949A (en) * | 2016-04-18 | 2016-07-06 | 江苏博敏电子有限公司 | Laser cutting method |
| CN107971753A (en) * | 2017-07-28 | 2018-05-01 | 南昌正业科技有限公司 | A kind of automation control method, system and storage device |
| CN108282959A (en) * | 2017-12-28 | 2018-07-13 | 广州美维电子有限公司 | A kind of sheet metal layer group micro through hole processing method |
| CN109922601A (en) * | 2019-03-14 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of processing method of route board blind hole |
| CN112188740A (en) * | 2020-10-13 | 2021-01-05 | 安捷利（番禺）电子实业有限公司 | Drilling method for 5G high-frequency MPI material |
| CN112333918A (en) * | 2020-10-27 | 2021-02-05 | 定颖电子（昆山）有限公司 | Manufacturing method of printed circuit board 8-shaped blind hole |
-
2004
- 2004-03-24 CN CN 200410026626 patent/CN1674765A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101610643B (en) * | 2009-07-14 | 2010-12-01 | 华中科技大学 | Method for processing blind hole by laser |
| CN102770945A (en) * | 2010-02-11 | 2012-11-07 | 应用材料公司 | Gas distribution showerhead with coating material for semiconductor processing |
| CN103231177A (en) * | 2013-04-19 | 2013-08-07 | 苏州光韵达光电科技有限公司 | Laser cutting method for printed circuit board (PCB) in ball grid array structure |
| CN105436718A (en) * | 2014-08-26 | 2016-03-30 | 安捷利电子科技（苏州）有限公司 | UV laser drilling method for preparing blind holes controllable in taper |
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
| CN104722932A (en) * | 2015-03-28 | 2015-06-24 | 大族激光科技产业集团股份有限公司 | Laser drilling method for amorphous silicon solar cell glass substrate |
| CN105025669B (en) * | 2015-07-28 | 2018-08-10 | 维嘉数控科技（苏州）有限公司 | The method of UV laser drill and printed circuit board with blind hole |
| CN105025669A (en) * | 2015-07-28 | 2015-11-04 | 维嘉数控科技（苏州）有限公司 | UV laser drilling method and printed circuit board with blind hole |
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
| CN105728949A (en) * | 2016-04-18 | 2016-07-06 | 江苏博敏电子有限公司 | Laser cutting method |
| CN107971753A (en) * | 2017-07-28 | 2018-05-01 | 南昌正业科技有限公司 | A kind of automation control method, system and storage device |
| CN108282959A (en) * | 2017-12-28 | 2018-07-13 | 广州美维电子有限公司 | A kind of sheet metal layer group micro through hole processing method |
| CN109922601A (en) * | 2019-03-14 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of processing method of route board blind hole |
| CN112188740A (en) * | 2020-10-13 | 2021-01-05 | 安捷利（番禺）电子实业有限公司 | Drilling method for 5G high-frequency MPI material |
| CN112188740B (en) * | 2020-10-13 | 2021-12-07 | 安捷利（番禺）电子实业有限公司 | Drilling method for 5G high-frequency MPI material |
| CN112333918A (en) * | 2020-10-27 | 2021-02-05 | 定颖电子（昆山）有限公司 | Manufacturing method of printed circuit board 8-shaped blind hole |
| CN112333918B (en) * | 2020-10-27 | 2022-07-01 | 定颖电子（昆山）有限公司 | Manufacturing method of printed circuit board 8-shaped blind hole |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1674765A (en) | UV laser drilling hole method | |
| CN101610643B (en) | Method for processing blind hole by laser | |
| US6631558B2 (en) | Blind via laser drilling system | |
| US6657159B2 (en) | Method for laser drilling | |
| JP5587769B2 (en) | Method and apparatus for laser drilling holes with improved taper shape | |
| CN1248555C (en) | Method for drilling microholes using laser beam | |
| KR930004135B1 (en) | Method for forming through holes in a polyimide substrate | |
| KR100276270B1 (en) | Method for manufacturing multi-layer printed circuit board | |
| US20040112881A1 (en) | Circle laser trepanning | |
| CN110695549B (en) | Method, system, device and equipment for laser drilling through hole | |
| WO1997046349A1 (en) | Blind via laser drilling system | |
| JP2012069924A (en) | Printed wiring board and manufacturing method therefor | |
| JP2020108904A5 (en) | ||
| KR20030027750A (en) | Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board | |
| Kestenbaum et al. | Laser drilling of microvias in epoxy-glass printed circuit boards | |
| CN1674766A (en) | CO2 laser drilling hole method | |
| CN103281878A (en) | Manufacturing method for printed circuit board with penetrating-through holes | |
| JP7170915B2 (en) | Method for manufacturing high density vias | |
| JP4186926B2 (en) | Laser processing method | |
| CN1267237C (en) | Circle laser trepanning | |
| CN112188740B (en) | Drilling method for 5G high-frequency MPI material | |
| CN116723640B (en) | Multilayer PCB blind hole punching method | |
| Morrison et al. | A Large Format Modified TEA CO/sub 2/Laser Based Process for Cost Effective Small Via Generation | |
| JPS6197995A (en) | Making of through hole type circuit board | |
| CN102833962A (en) | Interconnected circuit board and method for manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |