JPS6197995A - Making of through hole type circuit board - Google Patents

Making of through hole type circuit board

Info

Publication number
JPS6197995A
JPS6197995A JP21995384A JP21995384A JPS6197995A JP S6197995 A JPS6197995 A JP S6197995A JP 21995384 A JP21995384 A JP 21995384A JP 21995384 A JP21995384 A JP 21995384A JP S6197995 A JPS6197995 A JP S6197995A
Authority
JP
Japan
Prior art keywords
making
circuit board
type circuit
hole type
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21995384A
Inventor
Katsumi Aoyanagi
Takao Ito
Hirobumi Makino
Kenji Osawa
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP21995384A priority Critical patent/JPS6197995A/en
Publication of JPS6197995A publication Critical patent/JPS6197995A/en
Pending legal-status Critical Current

Links

JP21995384A 1984-10-19 1984-10-19 Making of through hole type circuit board Pending JPS6197995A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21995384A JPS6197995A (en) 1984-10-19 1984-10-19 Making of through hole type circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21995384A JPS6197995A (en) 1984-10-19 1984-10-19 Making of through hole type circuit board

Publications (1)

Publication Number Publication Date
JPS6197995A true JPS6197995A (en) 1986-05-16

Family

ID=16743626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21995384A Pending JPS6197995A (en) 1984-10-19 1984-10-19 Making of through hole type circuit board

Country Status (1)

Country Link
JP (1) JPS6197995A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350890A (en) * 1989-07-19 1991-03-05 Canon Inc Method of making through hole conductive in printed board
JPH0368194A (en) * 1989-08-05 1991-03-25 Nippon Mektron Ltd Formation of both side connection part of flexible circuit board
JPH0368193A (en) * 1989-08-05 1991-03-25 Nippon Mektron Ltd Both side connection part of flexible circuit board and manufacture thereof
JPH05121873A (en) * 1991-10-25 1993-05-18 Nec Corp Manufacture of printed wiring board
JP2013021628A (en) * 2011-07-14 2013-01-31 Fujitsu Semiconductor Ltd Semiconductor device and manufacturing method of the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0350890A (en) * 1989-07-19 1991-03-05 Canon Inc Method of making through hole conductive in printed board
JPH0368194A (en) * 1989-08-05 1991-03-25 Nippon Mektron Ltd Formation of both side connection part of flexible circuit board
JPH0368193A (en) * 1989-08-05 1991-03-25 Nippon Mektron Ltd Both side connection part of flexible circuit board and manufacture thereof
JPH05121873A (en) * 1991-10-25 1993-05-18 Nec Corp Manufacture of printed wiring board
JP2013021628A (en) * 2011-07-14 2013-01-31 Fujitsu Semiconductor Ltd Semiconductor device and manufacturing method of the same

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