CN1946266B - Method of manufacturing a printed circuit board - Google Patents
Method of manufacturing a printed circuit board Download PDFInfo
- Publication number
- CN1946266B CN1946266B CN2006101421338A CN200610142133A CN1946266B CN 1946266 B CN1946266 B CN 1946266B CN 2006101421338 A CN2006101421338 A CN 2006101421338A CN 200610142133 A CN200610142133 A CN 200610142133A CN 1946266 B CN1946266 B CN 1946266B
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- Prior art keywords
- copper
- circuit board
- printed circuit
- pcb
- copper foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
A method of manufacturing a printed circuit board by multi-layers laminated plate. Firstly forming a processing layer (5a) with a absorbance of more than 0.05 under a wavelength between 9.3 mum to 10.6 mum on the surface of copper foil (4a), Irradiating with CO2 laser from the processing layer (5a) to form a hole (6) on the copper foil (4a) and on the inner layer below the copper foil. Therefore,a hole (6) with prescribed diameter is formed with lower processing energy, the damage on the copper foil is reduced, and the processability of the printed circuit board is improved.
Description
Technical field
The present invention relates to the manufacture method of printed circuit board (PCB).Relate in particular to from the Copper Foil side irradiation carbon dioxide (CO of the multilayer laminate of the formation of stacked prepreg layer (prepreg) and Copper Foil on the copper plating film plywood
2) laser, thereby the nexine (prepreg layer) below Copper Foil and its forms the manufacture method of the printed circuit board (PCB) in hole.
Background technology
Along with miniaturization, densification and the high performance of in recent years electronic equipment, in printed circuit board (PCB), also require to form high-density circuit.In order to satisfy this requirement, in multilayer board, be formed for the BVH (blind hole that interlayer connects; Build Via hole) through hole such as.As the method for punching of this moment, consider from working (machining) efficiency and cost aspect, use CO mostly
2Laser.
In the past, in order to use CO
2Laser forms the hole on the copper plating film plywood, adopt conformal-mask means usually, and in the method, at first, the Copper Foil of the part that will bore a hole is removed by etching in advance, then, only the resin part that is positioned at the copper interlayer is bored a hole with laser.In this conformal-mask means, not only need to spend etched cost, but also exist etching to remove the reliability of copper or the technical problems such as positioning accuracy of copper interlayer circuit.
Recently, except above-mentioned conformal-mask means, also consider by shining CO from Copper Foil
2Laser forms the direct method in hole.
For this reason, proposed copper plating film plywood irradiation carbon dioxide (CO
2) laser such as laser and YAG laser forms the scheme (reference example such as spy open 2004-154843 communique, spy open 2004-154844 communique, spy are opened the 2004-273911 communique, the spy opens the 2004-281872 communique) of through hole.In addition, also proposed on the copper surface, to form in advance the scheme (opening the 2004-006611 communique) of the Copper Foil that contains high-carbon of particular range with reference to the spy.
But, if in direct method, use CO
2Laser is then at CO
2The Wavelength of Laser zone, promptly near 9.3 μ m, laser reflects on copper foil surface, can not bore a hole well.Therefore, by copper foil surface is carried out surface treatment, for example on the copper surface, coat color and reduce CO by carrying out melanism to handle
2The reflection of laser etc., but compare with the situation of only resin being bored a hole, and the energy height that needs is also worried damage nexine Copper Foil.
In addition, as another problem of above-mentioned direct method, exist perforation back copper to be splashed to the copper surface and at the residual copper billet of the periphery in hole, be the problem of so-called burr.Usually, to the hole that forms carry out electroless plating copper, electro-coppering makes its conducting, but when aforesaid burr remained near the periphery in hole, it was poor to produce plating, the problem of electric reliability decrease.
Summary of the invention
The present invention provides a kind of when using CO in order to solve above-mentioned problem in the past
2When laser forms the hole on the copper plating film plywood, can form the manufacture method of the printed circuit board (PCB) in hole well with low machining energy.
The manufacture method of printed circuit board (PCB) of the present invention is to use multilayer laminate to make printed circuit board (PCB), it is characterized in that, the absorbance that is formed on wavelength in advance and is the scope of 9.3 μ m～10.6 μ m on the copper foil surface on top layer is the machined layer more than 0.05, from above-mentioned machined layer side irradiation CO
2Laser, thus on the Copper Foil on above-mentioned top layer and the nexine below it, form the hole.
Description of drawings
Figure 1A～D is the profile of each operation of manufacture method of the printed circuit board (PCB) of expression one embodiment of the invention.
Fig. 2 is summarized in together chart with the surface treatment of embodiments of the invention 1～4 and comparative example 1～2 and total machining energy.
Fig. 3 A, B are respectively in the upper surface photo and the cross sectional photograph of removing the plywood before burr are handled in the embodiments of the invention 5.
Fig. 4 A, B are respectively in the upper surface photo and the cross sectional photograph of removing the plywood after burr are handled in the embodiments of the invention 5.
Fig. 5 is the cross sectional photograph after the plating in the embodiments of the invention 5 is handled.
Fig. 6 A, B are respectively upper surface photo and the cross sectional photograph after decontamination is handled in the embodiments of the invention 6.
Fig. 7 is the cross sectional photograph after the plating in the embodiments of the invention 6 is handled.
Embodiment
(1) general introduction of the present invention
The present invention is suitable for using multilayer laminate to make the manufacture method of printed circuit board (PCB), and described multilayer laminate is for example to be laminated with stacked prepreg layer on the copper plating film plywood of copper on the surface of substrate, and has formed Copper Foil on its surface and obtain.Be that absorbance under 9.3 μ m～10.6 μ m is the machined layer that (is preferably more than 0.07) more than 0.05 being formed on wavelength on the copper foil surface on above-mentioned top layer in advance, from above-mentioned machined layer side irradiation CO
2Laser, thus the formation hole gone up at the Copper Foil and the nexine (prepreg layer) below it on above-mentioned top layer.According to the present invention, owing to can form the hole of specified diameter exactly with low machining energy, so can provide the damage that can reduce, the manufacture method of the printed circuit board (PCB) of excellent in workability to the nexine Copper Foil.
As substrate, use the dipping of glass fiber reinforced epoxy resin for example substrate (glass epoxy substrate), aramid fibre to strengthen epoxy resin impregnated substrate (aromatic polyamides epoxy substrate) etc. and contain the substrate (resin substrate) of resin or ceramic substrate etc.Stacked copper on the surface of aforesaid substrate and form the copper plating film plywood, stacked thereon then prepreg layer forms Copper Foil in its surface and becomes multilayer laminate.The prepreg layer can use for example resin bed and fiber-reinforced resin layer such as epoxy resin.
Figure 1A～D is the profile of each operation of manufacture method of the printed circuit board (PCB) of expression one embodiment of the invention.At first as shown in Figure 1A, laminated copper foil 2a on two surfaces of nexine base material 1,2b and form the copper plating film plywood.Then as shown in Figure 1B, stacked prepreg layer 3a, 3b, laminated copper foil 4a in its surface, 4b and form multilayer laminate.Then as shown in Fig. 1 C, the Copper Foil 4a on the top layer of multilayer laminate is formed on wavelength and is absorbance under 9.3 μ m～10.6 μ m and be the machined layer 5a more than 0.05,5b on the surface of 4b.Then as shown in Fig. 1 D, from outer field machined layer 5a side irradiation CO
2Laser, thus hole 6 on the Copper Foil 4a on machined layer 5a, top layer and prepreg layer 3a, formed.
(2) Surface Machining of copper
The absorbance that is formed on wavelength and is the scope of 9.3 μ m～10.6 μ m on the copper foil surface on top layer is that the surface treatment method of the machined layer that (is preferably more than 0.07) more than 0.05 has no particular limits, can list methods such as for example following Surface Machining 1,2.
(a) Surface Machining 1
In the method, the processing on above-mentioned copper surface is to use the Surface Machining that the etching solution (for example microetch liquid) that comprises sulfuric acid, hydrogen peroxide, phenyltetrazole or derivatives thereof and chloride ion carries out.
The concentration of sulfuric acid is adjusted according to the copper dissolution allowance of etching speed and etching solution in the above-mentioned etching solution, is generally 60～220g/L, is preferably 90～220g/L.When the concentration of sulfuric acid is lower than 60g/L, has the slack-off trend of etching speed.On the other hand, if surpass 220g/L, then not only do not have the increase of the etching speed that conforms to the concentration increase, and have the trend that is easy to separate out copper sulfate crystal.
The concentration of hydrogen peroxide is adjusted according to etching speed and surface coarsening ability, is generally 5～70g/L, is preferably 7～56g/L.When the concentration of hydrogen peroxide was lower than 5g/L, etching speed was slack-off, had the possibility that can not carry out alligatoring to the copper surface fully.On the other hand, if surpass 70g/L, not only etching speed becomes too fast and might be able to not carry out uniform etching, and can not carry out alligatoring fully to the copper surface.
In etching solution, except the host of forming by above-mentioned sulfuric acid and hydrogen peroxide,, also to mix phenyltetrazole or derivatives thereof and chloride ion as auxiliary agent, so that suppress the decomposition of hydrogen peroxide, and make the surface carry out alligatoring.In the present invention, in various azoles such as imidazoles, triazole, tetrazolium,, can obtain the effect that the copper surface is significantly suppressed by the decomposition of fully alligatoring, hydrogen peroxide especially by using the phenyltetrazole or derivatives thereof.
As above-mentioned phenyltetrazole, can list for example 1-phenyltetrazole, 5-phenyltetrazole etc., from being easy to be dissolved in the angle consideration of water, preferred 5-phenyltetrazole.In addition, as above-mentioned phenyltetrazole derivative,, also can have-NH as long as show above-mentioned effect
2Base ,-substituting groups such as SH base, also can be the slaine that forms with calcium, copper, sodium etc.
The concentration of above-mentioned phenyltetrazole or derivatives thereof is adjusted according to the copper dissolution allowance of alligatoring shape and etching solution, is preferably 0.01～0.4g/L, more preferably 0.03～0.35g/L.When the concentration of phenyltetrazole is lower than 0.01g/L, has the possibility that etching speed can not carry out alligatoring slowly fully.On the other hand, if surpass 0.4g/L, then have and be difficult in solution the possibility of dissolving stably.
As the ion source of above-mentioned chloride ion, can list for example sodium chloride, potassium chloride, ammonium chloride, hydrochloric acid etc.
The concentration of above-mentioned chloride ion is adjusted according to alligatoring shape and etching speed, is preferably 1～60ppm, more preferably 2～10ppm.When chlorine ion concentration is lower than 1ppm, has the possibility that to carry out alligatoring to the copper surface fully.On the other hand, if surpass 60ppm, then etching speed is slack-off, has the possibility that can not carry out alligatoring to the copper surface fully.
In etching solution, preferably add the benzene sulfonic acid class, the decomposition of the hydrogen peroxide when handling a large amount of copper or copper alloy so that suppress to use etching solution continuously.Known above-mentioned benzene sulfonic acid class by hydrogen peroxide oxidation, produces the precipitation (with reference to spy open flat 11-140669 communique) of brown to black in etching solution.But, among the present invention by and with benzene sulfonic acid class and phenyltetrazole, thereby can not produce the precipitation of brown and the effect that shows the inhibition hydrogen peroxide decomposes.As the object lesson of above-mentioned benzene sulfonic acid class, can list for example benzene sulfonic acid, toluenesulfonic acid, meta-xylene sulfonic acid, phenolsulfonic acid, cresol sulfonic acid, sulfosalicylic acid, m-nitrobenzene sulfonic acid, sulfanilic acid etc.
The concentration of above-mentioned benzene sulfonic acid class is adjusted according to stability of peroxide in the solution, is preferably below the 10g/L, more preferably 2～4g/L.There is following trend in the benzene sulfonic acid class, even promptly concentration surpasses 10g/L, also can not observe the raising of the hydrogen peroxide stablizing effect that is consistent with the increase of addition.
In the etching solution that uses among the present invention, also can add various additives such as defoamer, surfactant as required.
The etching solution that uses among the present invention can be by making above-mentioned each composition be dissolved in water and easily adjusting.As above-mentioned water, the preferred ion exchanged water.
As the using method of above-mentioned etching solution, for example can list the method for on copper or copper alloy, spraying etching solution, make copper or copper alloy be immersed in method in the etching solution etc.
Etch quantity can suitably be set according to the resin kind that contacts with copper surface etc., is preferably 0.5～3 μ m, more preferably 1～2.5 μ m.In addition, the etch quantity described in this specification is meant by processed dose of weight change and the surface area of copper, the etch depth that density is calculated before and after the etching.Etch quantity can be adjusted according to composition, temperature, the etching period of etching solution.Temperature when using etching solution is generally 20～40 ℃ scope, and etching period is generally 10～120 seconds scope.
If the copper surface is placed the solution of Surface Machining 1, then on processed surface, forms organic resin coated copper in the etched while.The forming process of organic resin coated copper is as follows: at first, the phenyltetrazole or derivatives thereof in the solution is adsorbed on the copper surface, will have been adsorbed the copper oxidation of phenyltetrazole or derivatives thereof again by hydrogen peroxide, separates out copper in the solution.The part of the copper ion that this is separated out and phenyltetrazole or derivatives thereof form chelate, as organic resin coated copper attached to the copper surface.It is 2～2.5nm that the thickness of organic resin coated copper is preferably formed.
(b) Surface Machining 2
In the method, the processing on copper surface is to use that to comprise bivalent cupric ion source, acid dissociation constant pKa be the Surface Machining that the etching solution (for example microetch liquid) of organic acid below 5 and halogen ion carries out.
The bivalent cupric ion source of using in the preferred example of the present invention is as the oxidant of oxidized metal copper etc. and work.Since use the bivalent cupric ion source as oxidant, thus can show suitable etching speed as etching solution, and can have dark concavo-convex shape in the making of copper surface-stable ground.As above-mentioned bivalent cupric ion source, for example can list organic acid mantoquita and copper chloride (II), copper bromide (II), Kocide SD (II) etc.The organic acid that forms above-mentioned mantoquita has no particular limits, and preferred pKa described later is the organic acid below 5.Above-mentioned bivalent cupric ion source also can more than two kinds and be used.
The content in above-mentioned bivalent cupric ion source is converted into metallic copper and is 0.01～20% (weight %, below identical), and more preferably 0.1～10%.If above-mentioned content is very few, then has the slack-off possibility of etching speed.On the other hand,, then there is the trend that is difficult to dissolve, might produces the such material of dirt (smut) if too much.
PKa is that the organic acid below 5 is the material that is mixed by the copper dissolution of bivalent cupric ion source oxidation in order to make, and also is the material that mixes in order to adjust pH in addition.If above-mentioned organic acid pKa surpasses 5, cupric oxide is dissolved fully.As pKa is organic acid object lesson below 5, can list for example formic acid, acetate, propionic acid, acetic acid, valeric acid, saturated fatty acids such as caproic acid, acrylic acid, butenoic acid, unrighted acids such as methacrylate, oxalic acid, malonic acid, butanedioic acid, glutaric acid, adipic acid, pimelic acid aliphat saturated dicarboxylic acids such as (acid of ピ メ ロ Application), aliphat unsaturated dicarboxylic acids such as maleic acid, benzoic acid, phthalandione, aromatic carboxylic acids such as cinnamic acid, glycolic, lactic acid, malic acid, hydroxycarboxylic acids such as citric acid, sulfamic acid, β-chloropropionic acid, nicotinic acid, ascorbic acid, the hydroxyl trimethylace tonitric, levulic acids etc. have substituent carboxylic acid, their derivative etc.Above-mentioned organic acid also can more than two kinds and be used.
Above-mentioned organic acid content is preferably about 0.1～30%.If above-mentioned content is very few, cupric oxide is dissolved fully, and residual material as dirt can not obtain stable etching speed.On the other hand, if too much, the then steady dissolution decline of possible copper reoxidizes in the generation of copper surface.
The halogen ion is the material that mixes for the dissolving of auxiliary copper.As the ion source of above-mentioned halogen ion, chloride ion, bromide ion plasma source are for example arranged.Can list the compound of for example hydrochloric acid, hydrobromic acid, sodium chloride, calcium chloride, potassium chloride, ammonium chloride, KBr, copper chloride, copper bromide, zinc chloride, iron chloride, stannic bromide etc. and the halogen ion that in other solution, can dissociate out.Above-mentioned ion source also can more than two kinds and be used.In addition, for example copper chloride (II) can be as having the ion source of halogen ion and the material of bivalent cupric ion source two aspect effects.
In etching solution, can change and salt such as adding organic acid sodium salt, sylvite or ammonium salt for the pH that reduces in the etch processes, and add complexants such as ethylenediamine, pyridine, aniline, ammonia, monoethanolamine, diethanol amine, triethanolamine, N methyldiethanol amine for the steady dissolution that improves copper, also can add other various additives etc. as required.
The using method of etching solution has no particular limits, for example can list to processed copper or copper alloy spray etching solution and carry out spraying plating method, make copper or copper alloy impregnated in method in the etching solution etc.Under the situation of dipping, because the etching of copper or copper alloy and the cuprous ion that produces is oxidized to bivalent cupric ion, can be blown into air in etching solution by bubbling etc. in order to make.In addition, the liquid waste processing after above-mentioned etching solution uses is easy, for example can handle with common straightforward procedures such as the polymer coagulants that neutralizes, utilizes.
(3) CO
2Laser radiation processing
The present invention relates to use CO
2The direct method of laser.Because CO
2The Wavelength of Laser zone is 9.3 μ m～10.6 μ m, is that the absorbance of 9.3 μ m～10.6 μ m is the machined layer more than 0.05 so be formed on wavelength in advance on the copper surface.
CO
2Laser uses the wavelength of the 9.3 μ m～10.6 μ m in Infrared wavelength zone.Machining energy can for example can be bored a hole with 8～27mJ pulse of irradiation (shot) according to the suitably selections such as copper thickness of perforated surface.More preferably adopt second pulse of 2～5mJ irradiation of low machining energy, remove the through hole bottom surface.Also have, not necessarily will shine two pulses.In addition, if desired, also can shine three above pulses.
Here, described CO
2The machining energy of laser is meant merchant's (machining energy [J]=power output [W]/frequency [Hz]) of needed power output of processing and frequency.
(4) decontamination is handled
Using above-mentioned CO
2Behind the laser beam perforation, also can remove the decontamination of gum residue residual in the hole and handle.
The method that decontamination is handled can suitably adopt known method, for example can list following method etc., promptly at first, carries out swelling treatment with alkaline sweller, carries out the decontamination processing with known permanganic acid detergent, reduces the method for processing etc. then.
(5) remove the processing of burr
Use above-mentioned CO
2During laser beam perforation, produce burr at the peristome periphery sometimes.Wherein said burr, be meant on the copper foil surface that is splashed to the peristome periphery copper billet and at the peristome periphery with the residual copper of overshooting shape or peristome periphery general name with the copper of the residual part of sloping shape.As burr residual reason, be considered to be in CO usually with identical energy
2When laser processing copper and resin, because the machining energy of resin and copper has difference, big than copper so the opening diameter of resin becomes.If under the state of residual this burr, carry out copper plating treatment, then near burr, can produce the space, thereby have the bad possibilities of generation plating such as to obtain uniform plating with following operation.
As the processing that is used to remove burr,, there is the problem of the non-constant of operating efficiency though can consider mechanical lapping etc.As the processing method of removing burr among the present invention, preferred adopt make can dissolved copper treatment fluid with use above-mentioned CO
2The method of the Copper Foil contact behind the laser beam perforation.
As above-mentioned treatment fluid, so long as can make the treatment fluid of copper dissolution, just can suitably select to use, particularly suitable is the copper etchant solution that contains sulfuric acid and hydrogen peroxide.In addition, condition such as time of contact and liquid temperature can suitably be adjusted according to the amount of burr and the thickness of Copper Foil etc.In addition, etching method also can be suitable for any in injecting type, the impregnated.
Though the order that the operation that burr handle was handled and removed in above-mentioned decontamination is without limits, if after carrying out decontamination and handling, the processing of removing burr, then the removing property of the burr of the removing property of burr, particularly sloping shape part is good, so preferably.When removing the processing of burr under the state in residual spot, spot has the trend that the burr effect is removed in reduction.Therefore, if the processing of removing burr after decontamination is handled then can be removed burr more easily.
Embodiment
Below, use embodiment to more specifically describe the present invention.
(1) multilayer laminate
At copper plating film plywood (CCL: gas chemical company of Mitsubishi system trade name " CCL-EL170 ", below identical) (Hitachi changes into system trade name " GEA-679F (FROE) " the 60 μ m of industrial group to go up stacked prepreg, laser-enhanced with) and the Copper Foil (trade name " 3EC-VLP ") of thick 18 μ m, making four is lamination layer by layer.With etching solution and surface conditioning agent described later above-mentioned Copper Foil is handled so that the copper before the laser processing thick be 5 μ m or 10 μ m.Above-mentioned etching solution has no particular limits, and can use for example MEC A/S's system " CB-5612 ".
(2) laser processing condition
Use Hitachi's PVC ア メ カ ニ Network ス corporate system trade name " LC-2G212/2C " as CO
2Laser machine is that the diameter of 100 μ m, bottom surface side is the processing conditions of 80～100 μ m to the diameter of each example setting laser irradiation side (face side), the energy when measuring irradiation.
(3) absorbance
Absorbance is used fourier-transform infrared spectroscopy (Fourier Transform InfraredSpectroscopy is hereinafter referred to as FT-IR).FT-IR is to sample irradiation infrared ray (wavelength 2.5～25 μ m), represents the analytic approach of absorption of light of the corresponding frequency of vibration rotation number of the molecular skeleton that changes with dipole moment with absorbance.
(embodiment 1,3)
As embodiment 1,3, prepare four laminations layer by layer of above-mentioned each copper thickness respectively, use the organic acid microetch liquid (MEC A/S's system trade name " CZ8100 ") of explanation in the above-mentioned Surface Machining 1, to the copper surface on top layer 35 ℃ of following inject process 80 seconds.
(embodiment 2,4)
As embodiment 2,4, prepare four laminations layer by layer of above-mentioned each copper thickness respectively, use the sulfuric acid-hydroperoxide kind microetch liquid (MEC A/S's system trade name " B07770V ") of explanation in the above-mentioned Surface Machining 2, to the copper surface on top layer 25 ℃ of following impregnation process 100 seconds.
(comparative example 1,2)
As a comparative example 1,2, prepare four laminations layer by layer of above-mentioned each copper thickness respectively, handle according to following order.
At first, for to four layer by layer the copper surface of lamination carry out degreasing and remove spot and, wash the about 0.5 μ m of copper surface etching.Then, (5 capacity %) carried out acid elution 50 seconds with 25 ℃ aqueous sulfuric acids, and after the washing, impregnation process is 3 minutes in 95 ℃ melanism treatment fluid, washing then, drying.In addition, the composition of above-mentioned melanism treatment fluid is that NaOH is 30g/L, NaClO
2Be 70g/L, Na
3PO
4Be 10g/L, remainder is a water.
For above embodiment 1～4, comparative example 1～2, the surface diameter in the postradiation hole of Laser Measurement, bottom surface diameter the results are shown in the table 1.
(table 1)
| No. | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Comparative example 1 | Comparative example 2 |
| Copper thickness (μ m) | 5 | 5 | 10 | 10 | 5 | 10 |
| Treatment fluid | CZ8100 | B07770V | CZ8100 | B07770V | The melanism treatment fluid | The melanism treatment fluid |
| Absorbance | 0.08 | 0.15 | 0.08 | 0.15 | 0.01 | 0.01 |
| Machining energy (mJ) | 22.6 | 17.45 | 30.9 | 29.45 | 26.9 | 31.7 |
| Average surface diameter (μ m) | 96.3 | 100.8 | 95.1 | 96.5 | 90.3 | 88.3 |
| Average bottom surface diameter (μ m) | 85.5 | 82.5 | 95.1 | 95.6 | 89.6 | 88.3 |
| State | Good | Very good | Good | Very good | Difference | Difference |
Can confirm that by above result embodiment 1～4 can form good through hole.
Fig. 2 is summarized in together chart to the surface treatment of the embodiment of the invention 1～4 and comparative example 1～2 and total machining energy.Can confirm each embodiment and comparative example 1～2 relatively, can bore a hole with low energy.
(embodiment 5)
As embodiment 5, the plywood that preparation is bored a hole under the condition of embodiment 2 carries out following processing.In addition, the upper surface photo and the cross sectional photograph of the plywood before handling are illustrated respectively in Fig. 3 A, among the B.
(decontamination processing)
At first, with NaOH class sweller (マ Network ダ-ミ Star De corporate system trade name: MACUDAIZAR9204) 60～80 ℃ of following impregnation process 5 minutes, then with permanganic acid class detergent (マ Network ダ-ミ Star De corporate system trade name:, use reductant solution (マ Network ダ-ミ Star De corporate system trade name: after the washing again MACUDAIZAR9279) 45～60 ℃ of following impregnation process 5 minutes MACUDAIZAR9275) 80～85 ℃ of following impregnation process 5～7 minutes.
(removing the processing of burr)
After above-mentioned decontamination is handled, with the plywood of drying in sulfuric acid-hydroperoxide kind etching solution (MEC A/S's system trade name: carry out the etch processes of 3.0 μ m メ Star Network パ ワ-エ Star チ HE7000), wash, drying, remove burr thus.The etch process conditions of this moment is to adopt inject process (expulsion pressure is 0.04MPa), and the liquid temperature is set at 25 ℃.The upper surface photo and the cross sectional photograph of removing after burr are handled are illustrated respectively in Fig. 4 A, among the B.
(plating processing)
After removing the burr processing, carry out electroless plating copper, form the copper plate of thick 30 μ m then by electro-coppering.Cross sectional photograph after plating is handled has been shown among Fig. 5.
(embodiment 6)
As embodiment 6, under the treatment conditions identical with the foregoing description 5, carry out each processing according to the order that the processing of removing burr → decontamination processing → plating is handled. upper surface photo and cross sectional photograph after the decontamination of this moment is handled are illustrated respectively in Fig. 6 A, among the B. in addition, the cross sectional photograph after plating is handled is illustrated among Fig. 7.
As Fig. 4 A, B and Fig. 6 A, shown in the B, with regard to removing the plywood after burr are handled, embodiment 5,6 can both remove the burr such as projection of splashing of copper surface and hole periphery.In embodiment 5, can remove the burr of also giving prominence to the sloping shape about about 20 μ m on the Copper Foil of handling preceding hole periphery than the edge of opening of resin bed fully.In addition, as shown in Figure 5, can form coating layer even and in good conditionly.In embodiment 6, just remove the burr of the sloping shape after burr are handled, also can remove up to overhang is about about 10 μ m.In addition, as shown in Figure 7, though produced some spaces slightly in the edge of opening portion of resin bed, the having good uniformity of coating.
Claims (8)
1. the manufacture method of printed circuit board (PCB), this method use multilayer laminate to make printed circuit board (PCB), it is characterized in that, the absorbance that is formed on wavelength in advance and is the scope of 9.3 μ m～10.6 μ m on the copper foil surface on top layer is the machined layer more than 0.05; From described machined layer side irradiation CO
2Laser, thus on the Copper Foil on described top layer and the nexine below it, form the hole.
2. according to the manufacture method of the printed circuit board (PCB) of claim 1 record, the described absorbance of wherein said machined layer is more than 0.07.
3. according to the manufacture method of the printed circuit board (PCB) of claim 1 record, the Surface Machining that the formation method of wherein said machined layer is to use the etching solution that comprises sulfuric acid, hydrogen peroxide, phenyltetrazole or derivatives thereof and chloride ion to carry out.
4. according to the manufacture method of the printed circuit board (PCB) of claim 1 record, the formation method of wherein said machined layer is to use that to comprise bivalent cupric ion source, acid dissociation constant pKa be the Surface Machining that the etching solution of organic acid below 5 and halogen ion carries out.
5. according to the manufacture method of the printed circuit board (PCB) of any one record in the claim 1～4, wherein said machined layer is organic resin coated copper.
6. according to the manufacture method of the printed circuit board (PCB) of claim 1 record, thereby wherein make the liquid that contains sulfuric acid and hydrogen peroxide contact the burr of removing Copper Foil with the copper foil surface that has formed described hole.
7. according to the manufacture method of the printed circuit board (PCB) of claim 1 record, wherein decontamination is carried out in the inside in described hole and handle.
8. according to the manufacture method of the printed circuit board (PCB) of claim 1 record, wherein decontamination is carried out in the inside in described hole and handle, thereby make the liquid that contains sulfuric acid and hydrogen peroxide contact the burr of removing Copper Foil then with the copper foil surface that has formed described hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP293960/2005 | 2005-10-06 | ||
| JP2005293960 | 2005-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1946266A CN1946266A (en) | 2007-04-11 |
| CN1946266B true CN1946266B (en) | 2010-05-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101421338A Expired - Fee Related CN1946266B (en) | 2005-10-06 | 2006-10-08 | Method of manufacturing a printed circuit board |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20070038882A (en) |
| CN (1) | CN1946266B (en) |
| TW (1) | TW200715928A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101829850A (en) * | 2010-04-01 | 2010-09-15 | 深圳市大族激光科技股份有限公司 | Method for processing blind hole |
| WO2013021750A1 (en) * | 2011-08-11 | 2013-02-14 | 古河電気工業株式会社 | Wiring substrate and method for manufacturing same and semiconductor device |
| CN104755220B (en) * | 2013-10-18 | 2016-11-16 | 三菱电机株式会社 | Processing work platform tool part, the manufacture method of processing work platform tool part and laser processing |
| CN105263266A (en) * | 2015-10-30 | 2016-01-20 | 江苏博敏电子有限公司 | Laser processing method of blind drilling |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1344483A (en) * | 1999-03-16 | 2002-04-10 | 西门子公司 | Method for introducing plated-through holes in electrically insulating base material that is provided with layers on both sides |
| CN1674766A (en) * | 2004-03-24 | 2005-09-28 | 深圳市大族激光科技股份有限公司 | CO2 laser drilling hole method |
-
2006
- 2006-09-26 TW TW095135488A patent/TW200715928A/en unknown
- 2006-09-29 KR KR1020060095698A patent/KR20070038882A/en not_active Application Discontinuation
- 2006-10-08 CN CN2006101421338A patent/CN1946266B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1344483A (en) * | 1999-03-16 | 2002-04-10 | 西门子公司 | Method for introducing plated-through holes in electrically insulating base material that is provided with layers on both sides |
| CN1674766A (en) * | 2004-03-24 | 2005-09-28 | 深圳市大族激光科技股份有限公司 | CO2 laser drilling hole method |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-339531A 2004.12.02 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1946266A (en) | 2007-04-11 |
| TW200715928A (en) | 2007-04-16 |
| KR20070038882A (en) | 2007-04-11 |
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