CN104741798A - Composite focus space-time synchronized drilling system and method - Google Patents
Composite focus space-time synchronized drilling system and method Download PDFInfo
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- CN104741798A CN104741798A CN201510130884.7A CN201510130884A CN104741798A CN 104741798 A CN104741798 A CN 104741798A CN 201510130884 A CN201510130884 A CN 201510130884A CN 104741798 A CN104741798 A CN 104741798A
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Abstract
The invention discloses a composite focus space-time synchronized drilling system and method. By means of the system, a drilling scanning space with the spot light size larger than the size of a drilling laser beam focus, or in other words, a laser heating and cleaning light beam focus (second laser focusing light spot) with time and space synchronized with those of the micro-hole drilling space forever, is arranged below a drilling optical focusing system, the heating and washing light beam conducts time-space synchronized laser preprocessing and laser washing on the scanning area of a scanning movement drilling laser beam focus (first laser focusing light spot), a large amount of laser processing time is saved, frequent phenomena of hole edge residual impurities, hole bottom residual resin and hole wall residual glass fiber of drilling devices especially printed circuit board blind hole devices are thoroughly eliminated, and the drilling finished product rate of micro-holes especially blind holes is greatly ensured. The quality problem of dense blind hole drilling is quite ingeniously solved.
Description
Technical field
The present invention relates to laser drill manufacture field, be specifically related to a kind of complex foci space-time synchronous hole-drilling system and method.
Background technology
Current laser drill, be all only limited to the boring of independent laser spot, the dust that boring produces still is attached to the position such as surrounding, hole wall of bored micropore, rear end operation cleaning is needed to process, add treatment process, reduce working (machining) efficiency, even make product percent defective remain high.Some micropore due to aperture too little, cleaning is a very large difficult problem, and the present invention addresses this problem.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of complex foci space-time synchronous hole-drilling system and method, multiple beam is focused on by same laser focusing system, wherein in multiple beam, scanning motion boring laser beam carries out high-speed, high precision fine hot spot focusing boring, laser beam static in multiple beam carries out large spot focusing and carries out laser pre-treated and laser cleaning, carry out processing the technology such as switching between Kong Yukong in conjunction with vibration mirror scanning, realize high-efficiency high-accuracy high-quality laser drill.
The technical scheme that the present invention solves the problems of the technologies described above is as follows:
On the one hand, the invention provides a kind of complex foci space-time synchronous hole-drilling system, described system comprises scanning motion boring laser instrument, scanning motion boring laser modulator, heating and cleaning laser instrument, laser bundling device, Laser Focusing and focus handover module and workpiece to be processed;
Described scanning motion boring laser instrument, for launching the first scanning motion boring laser beam;
Described scanning motion boring laser modulator, for carrying out space modulation to the first scanning motion boring laser beam of described transmitting, and by the incident described laser bundling device of the first scanning motion boring laser beam after modulation;
Described heating and cleaning laser instrument, for launching the first heating and cleaning laser beam, and the first heating described laser bundling device incident with cleaning laser beam that will launch;
Described laser bundling device, conjunction bundle is carried out for heating the first scanning motion boring laser beam and first of described incidence and clean laser beam, export the second scanning motion boring laser beam and the second heating respectively and clean laser beam, wherein, the optical axis space motion path axis of symmetry of described second scanning motion boring laser beam heats with described second and to clean laser beam optical axis space coaxial or paraxial, the optical axis space motion path axis of symmetry and described second of the described second scanning motion boring laser beam of described paraxial finger heats and cleans laser beam optical axis space angle and is less than 10 °,
Any on the optical axis of described second scanning motion boring laser beam, along with the spatial movement of optical axis, form a geometric locus, and this curve is in a plane; Perpendicular to this plane, and pass the axis of the geometry symmetrical centre of the described geometric locus in described trajectory plane, be the optical axis space motion path axis of symmetry of described second scanning motion boring laser beam.
Described Laser Focusing and focus handover module, for focusing on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtain described complex focusing focus, and control described complex focusing focus and switch between the different machining hole positions of workpiece to be processed, carry out laser drill processing and laser cleaning to make the position, different hole of described complex focusing focus to workpiece to be processed;
Wherein, described complex focusing focus comprises the first Laser Focusing hot spot corresponding to laser beam of holing with described second scanning motion and heats the second Laser Focusing hot spot corresponding with cleaning laser beam with described second, described first Laser Focusing spot size is less than 300 microns, described second Laser Focusing spot diameter is less than 1 millimeter, and described first Laser Focusing spot motion profile is positioned at described second Laser Focusing hot spot scope; Described first Laser Focusing hot spot carries out scanning boring to workpiece to be processed, described second Laser Focusing hot spot before described first Laser Focusing hot spot bright dipping or bright dipping time laser pre-treated is carried out to scanning boring region, include but not limited to LASER HEATING or laser cleaning or laser roughening; Or, when described first Laser Focusing hot spot bright dipping or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate cleaning.
Described space-time synchronous, refer to when holing to particular hole position, spatially, described laser focusing unit is relative with workpiece to be processed dimensional orientation constant, described second Laser Focusing hot spot and laser focusing unit and material geo-stationary to be processed, described first Laser Focusing hot spot and Laser Focusing and the relative motion of focus handover module, described first Laser Focusing hot spot is also only limitted in described second Laser Focusing hot spot scope interscan boring, and described second Laser Focusing hot spot and described first Laser Focusing hot spot are spatially comprise and involved relation, in time, described first Laser Focusing hot spot matches with described second Laser Focusing hot spot and adds man-hour, described two bundle Laser output sequential can adjust according to the needs of Drilling operation technique, when described first Laser Focusing hot spot carries out scanning boring to workpiece to be processed, described second Laser Focusing hot spot can before described first Laser Focusing hot spot bright dipping or bright dipping time to scanning boring region carry out space-time synchronous laser pre-treated, include but not limited to LASER HEATING or laser cleaning or laser roughening, also can when described first Laser Focusing hot spot bright dipping or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate cleaning.Its benefit is, introduces on the one hand space-time synchronous LASER HEATING and cleaning and laser roughening in the intensive boring field of laser, improves the drilling efficiency of laser beam of holing, also improves drilling quality; On the other hand, the relative motion man-hour of laser focusing system and material to be processed during adding laser drill because of introducing laser pre-treated and cleaning light beam is not had yet, because described two bundle laser focuses are space-time synchronous at bore position, as long as described heating and the bright dipping of cleaning laser, laser spot just covers the motion outline scope of described boring laser beam foucing, can carry out spatial synchronization laser cleaning in real time.
Described cleaning refers to laser cleaning, refers to and adopts heating and cleaning laser beam irradiation surface of the work, make attachment generation flash evapn or the stripping such as dirt, particle, rust staining, material burr on surface, thus reach the technical process of Cress.Laser cleaning wherein in laser pre-treated process, is conducive to reducing described scanning drilling beams and carries out in following process plasma to the shielding of scanning boring laser beam; Boring while or boring terminate after laser cleaning, directly can reduce Ultrasonic Cleaning or the chemical cleaning procedure workload of subsequent handling, even cancel follow-up matting, improve the quality of products, reduce product cost.
Described laser roughening, refers to that adopting heating to treat with cleaning light beam region of holing carries out material surface texturing, is conducive to the absorption of material to be processed to described scanning drilling beams, thus improves the effect and quality of follow-up Drilling operation.
Further, described Laser Focusing and focus handover module are vibration mirror scanning focusing unit or platform movement static focus unit;
Described vibration mirror scanning focusing unit comprises scanning f-theta mirror and scanning galvanometer; Described scanning f-theta mirror focuses on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtains complex focusing focus; Described scanning galvanometer switches for controlling the high speed of described complex focusing focus between the different machining hole positions of workpiece to be processed;
Or described vibration mirror scanning focusing unit comprises scanning f-theta mirror and scanning galvanometer and two-dimension moving platform; Described scanning f-theta mirror focuses on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtains complex focusing focus; Described scanning galvanometer switches for controlling the high speed of described complex focusing focus between the different machining hole positions of workpiece to be processed; Described two-dimension moving platform is for carrying the switching of workpiece to be processed and machining area;
Described platform movement static focus unit comprises static focus mirror and linear moving table, described static focus mirror is used for focusing on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtains complex focusing focus; Described linear moving table is for controlling the switching of described complex focusing focus between the different machining hole positions of workpiece to be processed.
Further, described scanning motion boring laser modulator is the combination that acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic speculum or galvanometer drive speculum or electric spindle motor to drive to rotate refraction optical element or wherein both or many persons arbitrarily.
Further, described laser bundling device is polarization beam combiner.
Further, described workpiece to be processed is board substrate or silicon chip or potsherd, and described board substrate comprises substrate for printed circuit board and LTCC or potsherd.
On the other hand, the invention provides a kind of complex foci space-time synchronous boring method, described method comprises:
Laser beam of first heating and cleaning laser beam and the first scanning motion after spatial movement is modulated being holed carries out conjunction and restraints, to hole laser beam with cleaning laser beam and the second scanning motion to export the second heating, to heat with described second to make the described second scanning motion boring laser beam optical axis space motion path axis of symmetry and to clean laser beam optical axis space coaxial or paraxial, described second scanning motion of the described paraxial finger laser beam optical axis space motion path axis of symmetry and described second of holing heats and cleans laser beam optical axis space angle and is less than 10 °;
The second scanning motion boring laser beam after described sharp combiner and the second heating are focused on cleaning laser beam, obtain complex focusing focus, described complex focusing focus is combined by the first Laser Focusing hot spot and the second Laser Focusing hot spot;
Control described complex focusing focus to switch between the position, different hole of workpiece to be processed; When switching to a particular hole position, described first Laser Focusing hot spot carries out scanning boring to workpiece to be processed, described second Laser Focusing hot spot before described first Laser Focusing hot spot bright dipping or bright dipping time to scanning boring region carry out space-time synchronous laser pre-treated, or, when described first Laser Focusing hot spot bright dipping or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate cleaning;
Wherein, in complex focusing focus, described first Laser Focusing spot size is less than 300 microns, and described second Laser Focusing spot diameter is less than 1 millimeter, and described first Laser Focusing spot motion profile is positioned at described second Laser Focusing hot spot scope.
Further, described first scanning motion boring laser beam is pulse laser beam, and described first heating is continuous laser beam or pulse laser beam with cleaning laser beam.
Further, the spatial movement modulation of described first scanning motion boring laser beam is completed by acousto-optic deflection device, or completed by electro-optic deflector, or the mirror deflection driven by Piezoelectric Ceramic or galvanometer completes, or drive rotation refraction optical element to complete by electric spindle motor, or completed by both or multiple combination arbitrarily wherein.
The object of the invention is to, realize a kind of high-effect high-quality method for drilling holes, be mainly used in micropore particularly blind hole boring, in efficient drilling, in the present invention, scanning motion boring laser beam have employed the meticulous modulating method of high speed, such as audio-optical deflection modulation can accomplish the deflection response speed of 371 nanoseconds, and laser deflection completes switching by galvanometer polarization between the Kong Yukong of workpiece to be processed, but, only so be also not enough to meet needs of production, because laser drill can produce a large amount of dust at bore edges, particularly hole inner burr is piled up, and blind via bottom retained material, all directly cause waste product, therefore in high-quality boring, the present invention is ingenious introduces heating and cleaning laser beam, this heating can treat the instantaneous heating of rapidoprint before laser drilling is holed in scanning motion or when holing with cleaning laser beam, remove surface of the work spot, improve material initial surface temperature, improve the drilling efficiency of boring laser beam, in scanning motion boring laser drilling process or at the end of boring, heating and cleaning laser beam can to hole and carries out laser cleaning, residual dust and burr in removal hole, obtain the micropore that quality is very high.Described boring laser beam foucing (i.e. the first Laser Focusing hot spot) is much smaller than heating and laser spot (i.e. the second Laser Focusing hot spot) size of cleaning laser beam, and described boring laser beam foucing scanning profile is less than or equal to described heating and the laser spot size of cleaning laser beam.When Laser Focusing and focus handover module carry out switching between Kong Yukong to laser spot, described scanning motion boring laser beam foucing and described heating are synchronism switching with the laser spot of cleaning laser beam, save time very much, greatly improve production efficiency and the quality of production.
Operation principle of the present invention is as follows: the beam flying action of described scanning motion boring laser beam can be completed by acousto-optic deflection device, also can be completed by electro-optic deflector, the mirror deflection that also can be driven by Piezoelectric Ceramic or galvanometer completes, and also rotation refraction optical element can be driven to complete by electric spindle motor.Be switched to the machining hole bit space switching action of carrying out processing in another position, hole after described scanning motion boring laser beam completes drill tasks to be switched by galvanometer or platform has switched.Described heating and cleaning laser beam are carried out conjunction restrainted by laser bundling device and described scanning motion laser beams of hole, and focus on through same optical focusing system, described scanning drilling beams focussing movement profile is positioned at described heating and cleans beam focus hot spot scope.Described scanning drilling beams focus matches with cleaning beam focus with described heating, described scanning drilling beams focus carries out scanning boring to workpiece to be processed, described heating with cleaning beam focus can described scan focus bright dipping of holing before or bright dipping time carry out laser pre-treated to scanning region of holing, include but not limited to LASER HEATING or laser cleaning or laser roughening, also can when described scanning boring focus bright dipping or Guan Guanghou laser carried out to scanning boring region irradiate cleaning.For flexible PCB, flexible PCB can be divided into two kinds, there are glue flexible board and glue-free flexible board, the a large amount of contaminations being easy to produce in boring procedure not easily remove, particularly all the more so for there being glue flexible PCB, affect so very much the quality in circuit board subsequent metallisation hole, Ultrasonic Cleaning is have employed and chemically treated later process solves these problems in circuit-board industry, the present invention adopts the space-time synchronous laser cleaning first time perfect cleaning problem solving the boring of circuit board laser micropore, greatly save printing board PCB production procedure, decrease the production time, improve production efficiency and product quality, revolutionary impact is had on circuit board micropore drilling industry.The present invention adopts space-time synchronous laser cleaning, and first time, the perfect laser drilling micropore field drilling-workpiece that solves cleaned problem.
The invention has the beneficial effects as follows: the traffic beam scanning of described scanning motion boring laser beam has ensured the high efficiency that micropore is holed, galvanometer deflected beam has ensured the high efficiency of switching action between Kong Yukong, described heating preheats scanning motion laser beam foucing scanning area of holing with cleaning light beam, further increase micropore drilling efficiency, the most important thing is, below same set of boring optical focusing system, be provided with and laser drilling scanning space of holing, in other words with the LASER HEATING of the eternal space-time synchronous of bored microporous space and cleaning light beam, described heating carries out space-time synchronous laser cleaning with cleaning light beam to scanning motion laser beam foucing scanning area of holing, make the rig bore edges residual impurity that particularly printing circuit board blind hole equipment is common, cull bottom hole, the phenomenon of hole wall residual glass fiber thoroughly disappears, the great boring yield rate having ensured micropore particularly blind hole, a circuit board hundreds of thousands micropore, as long as there is a micropore to occur flaw, whole circuit board is just scrapped, Here it is current one of blind holes of circuit board equipment whole world true cause of only having a company's equipment to be approved by market.The present invention solves intensive blind hole drilling quality problem and cleaning problems very cleverly, has started the Laser Micro-Machining New Times that laser micropore processing is mutually unified with laser micro-cleaning space-time synchronous.
Accompanying drawing explanation
Fig. 1 is a kind of complex foci space-time synchronous hole-drilling system structural representation being applicable to printing circuit board blind hole of the embodiment of the present invention 1:
Fig. 2 is a kind of complex foci space-time synchronous hole-drilling system schematic diagram being applicable to Silicon Wafer group hole of the embodiment of the present invention 2;
Fig. 3 and Fig. 4 is that in the embodiment of the present invention 1 and embodiment 2, second scanning motion boring laser beam and second heat and the spatial relation schematic diagram cleaning laser beam process and focus on the complex foci formed;
Fig. 5 is a kind of complex foci space-time synchronous boring method flow chart of the embodiment of the present invention 3.
In accompanying drawing, the list of parts representated by each label is as follows:
1, scanning motion boring laser instrument, 2, scanning motion boring laser modulator, 3, first scanning motion boring laser beam, 4, heating and cleaning laser instrument, 5, first heating and cleaning laser beam, 6, laser bundling device, 7, second sets of beams, 8, first reflecting optics, 9, 3rd sets of beams, 10, second reflecting optics, 11, 4th sets of beams, 12, first motor, 13, the electric machine main shaft of the first motor, 14, telecentric scanning focus lamp, 15, focused beam group, 16, workpiece to be processed, 17, linear moving table, 18, static focus mirror, 19, speculum, 21, first sound light deflector, 22, rising tone light deflector, 30, second Laser Focusing hot spot, 31, first Laser Focusing hot spot.
Detailed description of the invention
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
Embodiment 1, a kind of complex foci space-time synchronous hole-drilling system being applicable to printing circuit board blind hole.Below in conjunction with Fig. 1 and Fig. 3 and Fig. 4, the system that the present embodiment provides is described in detail.
The system schematic that Fig. 1 holes to printing circuit board blind hole for the method that utilization the present embodiment provides, as shown in Figure 1, the system that the present embodiment provides comprises scanning motion boring laser instrument 1, scanning motion boring laser modulator 2, heating and cleaning laser instrument 4, laser bundling device 6, Laser Focusing and focus handover module and workpiece to be processed 16.
Scanning motion boring laser instrument 1 produces the first scanning motion boring laser beam, and carries out spatial movement modulation through scanning motion boring laser modulator 2 to it, and by the first scanning motion boring laser beam 3 incident laser bundling device 6 after modulation.Wherein, scanning motion boring laser modulator 2 can be acousto-optic deflection device, also can be electro-optic deflector, also can be that Piezoelectric Ceramic speculum or galvanometer drive speculum, can also be electric spindle motor drive rotate refraction optical element, or be aforementioned this several in any two or more combine.
Such as, when scanning motion boring laser modulator 2 is acousto-optic deflection device, acousto-optic deflection device regulates the Bragg grating reflection angle of described incident laser by the carrier frequency of the drive source changing acousto-optic deflection device, changes incident laser transmission direction; When scanning motion boring laser modulator 2 is electro-optic deflector, the characteristic that electro-optic deflector utilizes electro-optic crystal refractive index to change with voltage, applied voltage is applied along perpendicular to electro-optical deflection crystal growth direction, electro-optical deflection crystal is made to form the distribution of graded index gradient along the direction of growth, and then electro-optical deflection crystals light wave equiphase surface is deflected, and realize the deflection of beam direction at its output, then continuously change the deflection angle that applied voltage will continuously change light beam.
Heating and cleaning laser instrument 4 produce the first heating and cleaning laser beam 5, and incident laser bundling device 6.Wherein, first scanning motion boring laser beam 3 and first heats can be identical with the optical maser wavelength of cleaning laser beam 5, also can be different, such as, first scanning motion boring laser beam 3 can be pulse laser beam, first heating can be continuous laser beam with cleaning laser beam 5, also can be pulse laser beam.Such as, first scanning motion boring laser beam 3 and first heats the Ultra-Violet Laser being 355nm wavelength with cleaning laser beam 5, or be 1064nm infrared laser, or it be infrared picosecond laser that the first scanning motion boring laser beam 3 and first heat with cleaning laser beam 5, or the first scanning motion boring laser beam 3 and first to heat and clean laser beam 5 be green laser.
First scanning motion boring laser beam 3 of incidence and the first heating are carried out conjunction with cleaning laser beam 5 and restraint by laser bundling device 6, to make through its 6 output, second sets of beams 7 of sharp combiner, wherein, the second sets of beams 7 comprises the second scanning motion corresponding to laser beam 3 of holing with the first scanning motion and to hole laser beam and to heat with cleaning laser beam 5 corresponding second and heat with first and clean laser beam.First scanning motion boring laser beam 3 heat with first and cleans laser beam 5 and carries out conjunction and restraint by laser bundling device 6, make the second scanning motion boring the optical axis space motion path axis of symmetry of laser beam and second of output exported heat with to clean laser beam optical axis space coaxial or paraxial, paraxially refer to that above-mentioned two beam optical axis axial space angles are less than 10 °.
Laser bundling device 6 in the present embodiment is polarization beam combiner, polarization beam combiner at least can adopt following three kinds of technical schemes, the first technical scheme is that polarization beam apparatus (PBS=polarizing beamsplitter) uses conversely, described polarization beam apparatus can make a polarization state light reflection, another polarizing beam transmission, when carrying out two kinds of polarizing beam and closing bundle, a kind of polarizing beam P polarised light and and another kind of polarizing beam S polarised light respectively from the corresponding output input of polarization beam apparatus, so polarization beam apparatus input can export the laser beam of P polarised light and S polarization combiner, the second technical scheme adopts film polarizer (Thin Film Polarizer), also a polarization state light reflection can be made, another polarizing beam transmission, when carrying out two kinds of polarizing beam and closing bundle, a kind of polarizing beam transmission, such as P polarised light is through film polarizer, another kind of polarizing beam, such as S polarised light exports the Position input of P light beam from film polarizer, so film polarizer can be totally reflected this S polarised light, such film polarizer output can export the laser beam of P polarised light and S polarization combiner, the advantage of this scheme is that laser beam conjunction bundle efficiency is high, volume is little, the third technical scheme is a kind of special circumstances, Brewster sheet is adopted to carry out conjunction bundle, when carrying out two kinds of polarizing beam and closing bundle, a kind of polarizing beam transmission, such as P polarised light is through Brewster sheet, another kind of polarizing beam, such as S polarised light exports the Position input of P light beam from Brewster sheet, so film polarizer can reflect this S polarised light part, such film polarizer output can export the laser beam of P polarised light and S polarization combiner, the advantage of this scheme is that the laser beam that can complete phase co-wavelength or different wave length carries out conjunction bundle.
The the second scanning motion boring laser beam exported from laser bundling device 6 and the second heating focus on through Laser Focusing and focus handover module with cleaning laser beam, obtain complex focusing focus, and control this complex focusing focus and switch between the position, different hole of workpiece to be processed 16, carry out laser drill processing and laser cleaning to make the position, different hole of complex focusing focus to workpiece to be processed 16.
In the present embodiment, Laser Focusing and focus handover module comprise vibration mirror scanning focusing unit, and vibration mirror scanning focusing unit comprises scanning galvanometer and scanning f-theta mirror, and scanning f-theta mirror has the types such as the scanning focused mirror of common flat field and telecentric scanning focus lamp.In the present embodiment, scanning f-theta mirror adopts telecentric scanning focus lamp 14, and the focal length of telecentric scanning focus lamp 14 is 100 millimeters, f-theta scope 50 millimeters × 50 millimeters, eyeglass anti-reflection film wavelength 355 nanometer.Scanning galvanometer comprises the first reflecting optics 8 and the second reflecting optics 10.First reflecting optics 8 of described scanning galvanometer is arranged on the electric machine main shaft 13 of the first motor 12 of scanning galvanometer.Second reflecting optics 10 of described scanning galvanometer is arranged on the electric machine main shaft of the second motor of scanning galvanometer.Described workpiece to be processed 16 is 100 micron thickness double-side flexible printed circuit boards, and wherein two-layer layers of copper is 15 micron thickness copper.
Light path flow process in the system construction drawing of the whole printing circuit board blind hole boring of the present embodiment is as follows: exported the second scanning motion boring laser beam by transmission after the first scanning motion boring laser beam 3 incident laser bundling device 6 after scanning motion boring laser modulator 2 high speed spatial movement modulation, first heating exports second with the rear transmission of cleaning laser beam 5 incident laser bundling device 6 and heats and cleaning laser beam, described second scanning motion boring laser beam and the second heating are closed bundle with cleaning laser beam through laser bundling device 6 and are obtained the second sets of beams 7, second sets of beams 7 obtains the 3rd sets of beams 9 through the reflection of scanning galvanometer first reflecting optics 8, described 3rd sets of beams 9 obtains the 4th sets of beams 11 through the second reflecting optics 10 reflection of scanning galvanometer, described 4th sets of beams 11 focuses on through telecentric scanning focus lamp 14, obtain focused beam group 15, described focused beam group 15 directly acts on workpiece to be processed 16.
Described first scanning motion boring laser beam 3 for diameter be the beam-expanding collimation light beam of 6.5 millimeters, its relevant parameter is as follows: optical maser wavelength 355 nanometer, beam quality factor is less than 1.1, hot spot circularity is greater than 90 percent, mean power 10 watts of@200 KHzs, single mode gauss laser (horizontal field intensity is Gaussian Profile), range of pulse repetition frequency 50 to 300 KHz.Scanning motion boring laser modulator 2 is completed by the acousto-optic deflection device (not indicating in figure) of two orthogonal placements, also can be completed by electro-optic deflector, the mirror deflection that also can be driven by Piezoelectric Ceramic or galvanometer completes, also rotation refraction optical element can be driven to complete by electric spindle motor, or be completed by above-mentioned combination of devices.Asking for an interview Fig. 3 and Fig. 4, is 8 microns with the hole spot diameter of the first corresponding Laser Focusing hot spot 31 of laser beam of described second scanning motion, depth of focus 80 microns.
Described first heating with cleaning laser beam 5 for diameter is the laser beam of 0.5 millimeter, its relevant parameter is as follows: optical maser wavelength 355 nanometer, beam quality factor is less than 1.1, hot spot circularity is greater than 90 percent, mean power 4 watts of@5 KHzs, single mode gauss laser (horizontal field intensity is Gaussian Profile), range of pulse repetition frequency 0 to 10 KHz.Ask for an interview Fig. 3 and Fig. 4, the spot diameter heating the second Laser Focusing hot spot 30 corresponding with cleaning laser beam with described second is 100 microns, depth of focus 1300 microns.
Second Laser Focusing hot spot 30 and the first Laser Focusing hot spot 31 form described complex focusing focus.
The present embodiment workflow is as follows: galvanometer makes workpiece to be processed 16 be in correct locus, described first scanning motion boring laser beam 3 carries out scanning motion under high speed Orthogonal places acousto-optic deflection device Deflection modulation, the first corresponding Laser Focusing hot spot 31 gets out blind hole in the position scanning that described workpiece to be processed 16 is correct, ask for an interview broken circle in Fig. 4 and be described first Laser Focusing hot spot 31 partial traces position, when blind hole has been bored, described second Laser Focusing hot spot 30 bright dipping, carries out laser cleaning to described first optically focused focal beam spot 31 drilling blind holes.The present embodiment also can before described first Laser Focusing hot spot 31 goes out optical scanning boring, adopt the second Laser Focusing hot spot 30 pairs of workpieces to be processed 16 to carry out surface and remove spot and heating, be more conducive to described first Laser Focusing hot spot 31 pairs of workpieces to be processed 16 and carry out efficient drilling.It should be noted that, can be overlapping between the Kong Yukong of workpiece to be processed, also can not be overlapping, time overlapping between the Kong Yukong of workpiece to be processed, carry out wide wire casing processing, in process, laser milling and laser cleaning space-time synchronous.
For the present embodiment, described first scanning motion boring laser beam 3 can be infrared picosecond laser, described first heating can be pulse green laser with cleaning laser beam 5, and vibration mirror reflected eyeglass plating dual wavelength reflectance coating, focusing system also adopts dual wavelength to focus on design.In a word, core concept of the present invention is exactly that scanning motion boring laser beam carries out high-speed motion fine focus, complete local micropore high-speed drilling, and under boring focusing system and the constant situation of material relative position to be processed, namely after scanning motion boring laser beam and material to be processed have been located, in laser drilling beams drilling operating, described heating and cleaning laser beam complete cleaning or the heating of front boring sites in curing of holing, or complete the laser cleaning of the boring sites in curing after boring, so do not increase activity time, but be the increase in laser pre-treated and laser cleaning content, significantly improve laser drill efficiency and drilling quality, save rear road matting.
The present embodiment also may be used for laser ceramics boring.When carrying out precise laser boring to pottery, laser is in processing work apparent motion process, the starting point stage always shows more shallow, this is because incipient stage pottery temperature is in the cause of normal temperature, if now adopt the second Laser Focusing hot spot 30 to treat processing ceramic before described first Laser Focusing hot spot 31 goes out optical scanning boring carry out surface removing spot and heating, be more conducive to described first Laser Focusing hot spot 31 and treat processing ceramic plate and carry out efficient drilling.
The present embodiment can be applied to the meticulous laser drill field of majority of material, is the another quantum jump of laser drill FIELD OF THE INVENTIONThe.
Embodiment 2, a kind of complex foci space-time synchronous hole-drilling system being applicable to Silicon Wafer group hole.Below in conjunction with Fig. 2, Fig. 3 and Fig. 4, the system that the present embodiment provides is described.
The compound space-time synchronous hole-drilling system being applicable to printed circuit board (PCB) be applicable in the complex foci space-time synchronous hole-drilling system in Silicon Wafer group hole and embodiment 1 has similarity, can see Fig. 2, the system that the present embodiment provides comprises scanning motion boring laser instrument 1, scanning motion boring laser modulator 2, heating and cleaning laser instrument 4, laser bundling device 6 and Laser Focusing and focus handover module.
Wherein, scanning motion boring laser modulator 2 is the acousto-optic deflection device 21 and 22 of orthogonal placement, also can be electro-optic deflector, also can be the speculum that Piezoelectric Ceramic or galvanometer drive, also can be that electric spindle motor drives rotation refraction optical element, or above-mentioned any two or multiple combination.
Described Laser Focusing and focus handover module are platform movement static focus unit, comprise static focus mirror 18 and linear moving table 17.Described static focus mirror 18 is for focusing on, to obtain complex focusing focus with cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device 6 and the second heating; Described linear moving table 17 is for controlling the switching of complex focusing focus between the different machining hole positions of workpiece to be processed 16.
In the present embodiment, the focal length of static focus mirror 18 is 50 millimeters, and eyeglass anti-reflection film is dual wavelength 532 and 1064 nanometer, and described workpiece to be processed 16 is 100 micron thickness Silicon Wafers.
Light path flow process in whole Silicon Wafer group hole drilling system structure is as follows: scanning motion boring laser instrument 1 exports the first scanning motion boring laser beam 3, through scanning motion boring laser modulator 2, the i.e. spatial movement modulation of the acousto-optic deflection device 21 and 22 of orthogonal placement, obtain the first scanning motion boring laser beam 3 after spatial movement modulation, after described first scanning motion boring laser beam 3 incident laser bundling device 6, transmission exports the second scanning motion boring laser beam, described heating and cleaning laser instrument 4 export the first heating and export second with cleaning laser beam 5 incident laser bundling device 6 back reflection and heat and clean laser beam, described second scanning motion boring laser beam and the second heating are closed bundle with cleaning laser beam and are obtained the second sets of beams 7, second sets of beams 7 obtains the 3rd sets of beams 9 through reflecting optics 19 reflection, described 3rd sets of beams 9 focuses on through described static focus mirror 18, obtain focused beam group 15, described focused beam group 15 directly acts on workpiece to be processed and Silicon Wafer 16, described Silicon Wafer 16 is fixed on described linear moving table 17.
Described first scanning motion boring laser beam 3 for diameter be the beam-expanding collimation light beam of 5 millimeters, its relevant parameter is as follows: optical maser wavelength 532 nanometer, beam quality factor is less than 1.1, hot spot circularity is greater than 90 percent, mean power 10 watts of@150 KHzs, single mode gauss laser (horizontal field intensity is Gaussian Profile), range of pulse repetition frequency 30 to 200 KHz.Asking for an interview Fig. 3 and Fig. 4, is 10 microns with the hole spot diameter of the first Laser Focusing hot spot 31 corresponding to laser beam 3 of described first scanning motion, depth of focus 120 microns.
Described first heats with cleaning laser beam 5 as diameter is 1 millimeter of light beam, its relevant parameter is as follows: optical maser wavelength 1064 nanometer, beam quality factor is less than 1.2, hot spot circularity is greater than 90 percent, mean power 20 watts of@5 KHzs, single mode gauss laser (horizontal field intensity is Gaussian Profile), range of pulse repetition frequency 0 to 10 KHz.Ask for an interview Fig. 3 and Fig. 4, the spot diameter heating the second Laser Focusing hot spot 30 corresponding with cleaning laser beam 5 with described first is 100 microns.
The present embodiment workflow is as follows: linear moving table 17 makes Silicon Wafer 16 (i.e. workpiece to be processed) hole to be drilled be in correct locus, the first scanning motion boring laser beam 3 that described scanning motion boring laser instrument 1 exports is through beam-expanding collimation (not have sign in figure) and modulate through the high speed spatial movement of the acousto-optic deflection device 21 and 22 of orthogonal placement, the first corresponding Laser Focusing hot spot 31 gets out through hole in the position scanning that described Silicon Wafer 16 hole to be drilled is correct, ask for an interview broken circle in Fig. 4 and be described first Laser Focusing hot spot 31 partial traces position, when hole drill is complete, described second Laser Focusing hot spot 30 bright dipping, laser cleaning is carried out to described first Laser Focusing hot spot 31 holes drilled through.
The present embodiment also can before described first Laser Focusing hot spot 31 goes out optical scanning boring, adopt the second Laser Focusing hot spot 30 to treat machine silicon wafer 16 and carry out surface removing spot and heating, be more conducive to described first Laser Focusing hot spot 31 and efficient drilling is carried out to Silicon Wafer 16 hole to be drilled.
In a word, the core concept of the present embodiment is exactly that scanning motion boring laser beam carries out high-speed motion fine focus, complete local micropore high-speed drilling, and heating and cleaning laser beam complete scanning motion hole laser beam workpiece to be processed is holed before the cleaning of boring part or heating, or complete the laser cleaning at position around the interior and hole of the drilling hole after boring.
Embodiment 3, a kind of complex foci space-time synchronous boring method flow chart.Below in conjunction with Fig. 5, the method that the present embodiment provides is described in detail.
See Fig. 5, the method main working process that the present embodiment provides is: laser beam of the first heating and cleaning laser beam and the first scanning motion after spatial movement is modulated being holed carries out conjunction and restraints, laser beam group is formed with cleaning laser beam and the second scanning motion laser beam of holing to export the second heating, to heat with described second to make the second scanning motion boring laser beam optical axis space motion path axis of symmetry and to clean laser beam optical axis space coaxial or paraxial, the described second scanning motion boring laser beam optical axis space motion path axis of symmetry and described second of described paraxial finger heats and cleans laser beam optical axis axial space angle and is less than 10 °.Then the second scanning motion boring laser beam after described sharp combiner and the second heating are focused on cleaning laser beam, obtain complex focusing focus, and control described complex focusing focus and switch between the position, different hole of workpiece to be processed, carry out Drilling operation and cleaning to make the position, different hole of described complex focusing focus to workpiece to be processed.
Wherein, described complex focusing focus comprises the first Laser Focusing hot spot corresponding to laser beam of holing with described second scanning motion and heats the second Laser Focusing hot spot corresponding with cleaning laser beam with described second, described first Laser Focusing spot size is less than 200 microns, described second Laser Focusing spot diameter is less than 1 millimeter, and described first Laser Focusing spot motion profile is positioned at described second Laser Focusing hot spot scope; Described first Laser Focusing hot spot carries out scanning boring to workpiece to be processed, described second Laser Focusing hot spot before described first Laser Focusing hot spot bright dipping or bright dipping time to scanning boring region carry out space-time synchronous laser pre-treated, include but not limited to LASER HEATING or laser cleaning or laser roughening etc.; Or, when described first Laser Focusing hot spot bright dipping or Guan Guanghou to scanning boring region carry out laser space-time synchronous laser irradiate cleaning.
Wherein, first scanning motion boring laser beam can be identical with the optical maser wavelength of cleaning laser beam with the first heating, also can be different, such as, first scanning motion boring laser beam is pulse laser beam, and the first heating is continuous laser beam or pulse laser beam with cleaning laser beam.
In addition, the spatial movement modulation of the first scanning motion boring laser beam is completed by acousto-optic deflection device, or completed by electro-optic deflector, or the mirror deflection driven by Piezoelectric Ceramic or galvanometer completes, or drive rotation refraction optical element to complete by electric spindle motor, or completed by both or multiple combination arbitrarily wherein.
It should be noted that, the whole process utilizing complex foci to carry out space-time synchronous boring of the present embodiment see above-described embodiment 1 and embodiment 2, can not be repeated.
In a word, a kind of complex foci space-time synchronous hole-drilling system that the present invention proposes and method, its important feature is: the traffic beam scanning of scanning motion boring laser beam (referring to the boring of the scanning motion after sharp combiner and Laser Focusing laser beam) has ensured the high efficiency that micropore is holed, the high efficiency of switching action between the Kong Yukong that galvanometer deflected beam has ensured workpiece to be processed, heating and cleaning laser beam (refer to the heating after sharp combiner and Laser Focusing with cleaning laser beam) carry out pretreatment to scanning motion laser beam foucing scanning area of holing, include but not limited to LASER HEATING or laser cleaning or laser roughening, further increase micropore drilling efficiency.The most important thing is, present invention achieves below same set of boring optical focusing system, be provided with laser drilling scanning space of holing with scanning motion, in other words with the heating of the eternal space-time synchronous of bored microporous space and cleaning laser beam, this heating carries out space-time synchronous laser cleaning with cleaning laser beam to scanning motion laser beam foucing scanning area of holing, make rig (i.e. workpiece to be processed) the bore edges residual impurity that particularly printing circuit board blind hole equipment is common, cull bottom hole, the phenomenon of hole wall residual glass fiber thoroughly disappears, the great boring yield rate having ensured micropore particularly blind hole.The present invention solves intensive blind hole drilling quality problem very cleverly.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a complex foci space-time synchronous hole-drilling system, it is characterized in that, described system comprises scanning motion boring laser instrument, scanning motion boring laser modulator, heating and cleaning laser instrument, laser bundling device, Laser Focusing and focus handover module and workpiece to be processed;
Described scanning motion boring laser instrument, for launching the first scanning motion boring laser beam;
Described scanning motion boring laser modulator, for carrying out space modulation to the first scanning motion boring laser beam of described transmitting, and by the incident described laser bundling device of the first scanning motion boring laser beam after modulation;
Described heating and cleaning laser instrument, for launching the first heating and cleaning laser beam, and the first heating described laser bundling device incident with cleaning laser beam that will launch;
Described laser bundling device, conjunction bundle is carried out for heating the first scanning motion boring laser beam and first of described incidence and clean laser beam, export the second scanning motion boring laser beam and the second heating respectively and clean laser beam, wherein, the optical axis space motion path axis of symmetry of described second scanning motion boring laser beam heats with described second and to clean laser beam optical axis space coaxial or paraxial, the optical axis space motion path axis of symmetry and described second of the described second scanning motion boring laser beam of described paraxial finger heats and cleans laser beam optical axis space angle and is less than 10 °,
Described Laser Focusing and focus handover module, for focusing on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtain described complex focusing focus, and control described complex focusing focus and switch between the different machining hole positions of workpiece to be processed, carry out laser drill processing and laser cleaning to make the position, different hole of described complex focusing focus to workpiece to be processed;
Wherein, described complex focusing focus comprises the first Laser Focusing hot spot corresponding to laser beam of holing with described second scanning motion and heats the second Laser Focusing hot spot corresponding with cleaning laser beam with described second, described first Laser Focusing spot size is less than 300 microns, described second Laser Focusing spot diameter is less than 1 millimeter, and described first Laser Focusing spot motion profile is positioned at described second Laser Focusing hot spot scope; Described first Laser Focusing hot spot carries out scanning boring to workpiece to be processed, described second Laser Focusing hot spot before described first Laser Focusing hot spot bright dipping or bright dipping time to scanning boring region carry out space-time synchronous laser pre-treated, or, when described first Laser Focusing hot spot bright dipping or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate cleaning.
2. complex foci space-time synchronous hole-drilling system as claimed in claim 1, it is characterized in that, described Laser Focusing and focus handover module are vibration mirror scanning focusing unit or platform movement static focus unit;
Described vibration mirror scanning focusing unit comprises scanning f-theta mirror and scanning galvanometer; Described scanning f-theta mirror focuses on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtains complex focusing focus; Described scanning galvanometer switches for controlling the high speed of described complex focusing focus between the different machining hole positions of workpiece to be processed;
Or described vibration mirror scanning focusing unit comprises scanning f-theta mirror and scanning galvanometer and two-dimension moving platform; Described scanning f-theta mirror focuses on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtains complex focusing focus; Described scanning galvanometer switches for controlling the high speed of described complex focusing focus between the different machining hole positions of workpiece to be processed; Described two-dimension moving platform is for carrying the switching of workpiece to be processed and machining area;
Described platform movement static focus unit comprises static focus mirror and linear moving table, described static focus mirror is used for focusing on cleaning laser beam the second scanning motion boring laser beam exported from described laser bundling device and the second heating, obtains complex focusing focus; Described linear moving table is for controlling the switching of described complex focusing focus between the different machining hole positions of workpiece to be processed.
3. complex foci space-time synchronous hole-drilling system as claimed in claim 1, it is characterized in that, described scanning motion boring laser modulator is the combination that acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic speculum or galvanometer drive speculum or electric spindle motor to drive to rotate refraction optical element or wherein both or many persons arbitrarily.
4. complex foci space-time synchronous hole-drilling system as claimed in claim 1, it is characterized in that, described laser bundling device is polarization beam combiner.
5. complex foci space-time synchronous hole-drilling system as claimed in claim 1, is characterized in that, described workpiece to be processed is board substrate or silicon chip or potsherd, and described board substrate comprises substrate for printed circuit board and LTCC.
6. a complex foci space-time synchronous boring method, is characterized in that, described method comprises:
S1, laser beam of the first heating and cleaning laser beam and the first scanning motion after spatial movement is modulated being holed carry out conjunction and restraint, to hole laser beam with cleaning laser beam and the second scanning motion to export the second heating, to heat with described second to make the described second scanning motion boring laser beam optical axis space motion path axis of symmetry and to clean laser beam optical axis space coaxial or paraxial, described second scanning motion of the described paraxial finger laser beam optical axis space motion path axis of symmetry and described second of holing heats and cleans laser beam optical axis space angle and is less than 10 °;
S2, the second scanning motion boring laser beam after described sharp combiner and the second heating are focused on cleaning laser beam, obtain complex focusing focus, described complex focusing focus is combined by the first Laser Focusing hot spot and the second Laser Focusing hot spot;
S3, control described complex focusing focus and switch between the position, different hole of workpiece to be processed; When switching to a particular hole position, described first Laser Focusing hot spot carries out scanning boring to workpiece to be processed, described second Laser Focusing hot spot before described first Laser Focusing hot spot bright dipping or bright dipping time to scanning boring region carry out space-time synchronous laser pre-treated, or, when described first Laser Focusing hot spot bright dipping or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate cleaning;
Wherein, in complex focusing focus, described first Laser Focusing spot size is less than 300 microns, and described second Laser Focusing spot diameter is less than 1 millimeter, and described first Laser Focusing spot motion profile is positioned at described second Laser Focusing hot spot scope.
7. complex foci space-time synchronous boring method as claimed in claim 6, is characterized in that, described first scanning motion boring laser beam is pulse laser beam, and described first heating is continuous laser beam or pulse laser beam with cleaning laser beam.
8. complex foci space-time synchronous boring method as claimed in claim 6, it is characterized in that, the spatial movement modulation of described first scanning motion boring laser beam is completed by acousto-optic deflection device, or completed by electro-optic deflector, or the mirror deflection driven by Piezoelectric Ceramic or galvanometer completes, or drive rotation refraction optical element to complete by electric spindle motor, or completed by both or multiple combination arbitrarily wherein.
9. complex foci space-time synchronous boring method as claimed in claim 6, is characterized in that, the hole conjunction bundle of laser beam of described first heating and cleaning laser beam and the first scanning motion after spatial movement is modulated is completed by polarization beam combiner.
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