CN106903428A - A kind of infrared nanosecond laser is closed beam device and its closes Shu Fangfa with infrared picosecond laser - Google Patents
A kind of infrared nanosecond laser is closed beam device and its closes Shu Fangfa with infrared picosecond laser Download PDFInfo
- Publication number
- CN106903428A CN106903428A CN201510964342.XA CN201510964342A CN106903428A CN 106903428 A CN106903428 A CN 106903428A CN 201510964342 A CN201510964342 A CN 201510964342A CN 106903428 A CN106903428 A CN 106903428A
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- infrared
- laser
- module
- nanosecond
- feux rouges
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
Abstract
Beam device being closed the invention discloses a kind of infrared nanosecond laser and infrared picosecond laser and its closing Shu Fangfa, the equipment includes infrared picosecond laser, infrared nanosecond laser, swashs combiner module and laser galvanometer scanning light path module；The infrared picosecond laser and infrared nanosecond laser export infrared psec and infrared nanosecond laser respectively, the sharp combiner module by export infrared picosecond laser and infrared nanosecond laser be combined into it is a branch of and export conjunction Shu Jiguang, the laser galvanometer scanning light path module is received closes Shu Guang, and alternately exports infrared picosecond laser and infrared nanosecond laser；The present invention can quickly remove infrared nanosecond laser that material is small with infrared picosecond laser heat affecting, and slight crack is tiny, and the few advantage of surface debris is combined, and is rapidly completed specific high-quality Laser Processing requirement.
Description
Technical field
The present invention relates to the fields such as laser welding, more particularly to a kind of infrared nanosecond laser and infrared picosecond laser
Close beam device and its close Shu Fangfa.
Background technology
With the fast development of modern age electronic product machining technology, requirement of the client to product is increasingly improved, red
Outer nanosecond laser can quickly remove material, and infrared picosecond laser heat affecting is small, and slight crack is tiny, surface
Chip is few, but the limitation of single Laser Processing progressively manifests under actual conditions.
The content of the invention
In order to overcome all deficiencies of existing Related product, the present invention to propose that a kind of new infrared nanosecond swashs
Light closes beam device and its closes Shu Fangfa with infrared picosecond laser, and the laser equipment can be fast infrared nanosecond laser
The advantage of speed removal material is small with infrared picosecond laser heat affecting, and slight crack is tiny, the few advantage of surface debris
With reference to being rapidly completed specific high-quality infrared laser processing request.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of infrared nanosecond laser provided by the present invention closes beam device with infrared picosecond laser, including：It is infrared
Picosecond laser, infrared nanosecond laser, sharp combiner module and laser galvanometer scanning light path module；Institute
State infrared picosecond laser and infrared nanosecond laser export infrared picosecond laser and infrared nanosecond laser respectively,
The infrared picosecond laser for exporting and infrared nanosecond laser are combined into a branch of and export conjunction beam by the sharp combiner module
Laser, the laser galvanometer scanning light path module is received closes Shu Guang, and alternately exports infrared picosecond laser and red
Outer nanosecond laser.
As a further improvement on the present invention, the infrared picosecond laser include infrared picosecond laser transmitter,
One 45 degree of total reflective mirror and the 2nd 45 degree of total reflective mirror, the infrared picosecond laser transmitter export infrared psec
Laser, infrared picosecond laser is totally reflected laggard twice by the one 45 degree of total reflective mirror and the 2nd 45 degree of total reflective mirror
Enter sharp combiner module.
As a further improvement on the present invention, the infrared nanosecond laser include infrared nanosecond laser transmitter,
3rd 45 degree of total reflective mirror and the 4th 45 degree of total reflective mirror, the infrared nanosecond laser transmitter export infrared nanosecond
Laser, infrared nanosecond laser is totally reflected laggard twice by the 3rd 45 degree of total reflective mirror and the 4th 45 degree of total reflective mirror
Enter sharp combiner module.
As a further improvement on the present invention, described infrared nanosecond laser closes beam device with infrared picosecond laser
Can also include that beam module is closed in a feux rouges preview, beam module is closed in the feux rouges preview includes feux rouges preview laser
Transmitter and feux rouges previewing module, the feux rouges preview generating laser export preview feux rouges, and the feux rouges is pre-
Laser galvanometer scanning light path is arrived in output after infrared psec and infrared nanosecond are closed beam light and reflection to red light by module of looking at
Module.
As a further improvement on the present invention, the sharp combiner module includes light combination mirror piece, school position hole and glass
Piece module, the light combination mirror piece, school position hole and slide module centers are located on same axis, and infrared psec swashs
Light and infrared nanosecond laser close beam and by 45 degree of total reflections at light combination mirror piece, and by school position hole and slide
Module enters feux rouges previewing module.
As a further improvement on the present invention, the laser galvanometer scanning light path module is responsible for receiving feux rouges preview
The conjunction Shu Guang and feux rouges of module output, and system is fed back information to, the output of real-time adjustment laser.
As a further improvement on the present invention, the infrared nanosecond laser closes beam device also with infrared picosecond laser
A rack platform can be included, the rack platform is fixedly installed on infrared picosecond laser side outwardly
Upper edge, the infrared nanosecond laser, sharp combiner module and feux rouges preview are closed the fixation of beam module and are set
Put above rack platform.
A kind of infrared nanosecond laser provided by the present invention closes Shu Fangfa, including following step with infrared picosecond laser
Suddenly：
Step a：The infrared picosecond laser exports infrared picosecond laser；
Step b：The infrared nanosecond laser exports infrared nanosecond laser；
Step c：Be combined into for the infrared picosecond laser for exporting and infrared nanosecond laser a branch of and defeated by the sharp combiner module
Go out to close Shu Jiguang；
Step d：The conjunction Shu Guang of the sharp combiner module output after the reflection of feux rouges previewing module by entering laser galvanometer
Scanning optical path module；
Step e：The laser galvanometer scanning light path module is received closes Shu Guang and feux rouges, and it is sharp alternately to export infrared psec
Light and infrared nanosecond laser.
As a further improvement on the present invention, the infrared nanosecond laser closes Shu Fangfa also with infrared picosecond laser
A step can be included：Beam module output preview feux rouges is closed in the feux rouges preview, and preview feux rouges is by feux rouges
Enter laser galvanometer scanning light path module after previewing module reflection.
Compared with prior art, the invention has the advantages that：
1st, the photothermy of infrared nanosecond laser is acted on infrared picosecond laser photochemical ablation and combined, red
The advantage that outer nanosecond laser quickly removes material is small with infrared picosecond laser heat affecting, and slight crack is tiny, surface
The few advantage of chip is combined, and is rapidly completed specific high-quality infrared laser processing request
2nd, beam optical path is closed by digital scanning light path, it is infrared according to mark Graph Control by laser marking software
The light extraction of nanosecond laser and infrared picosecond laser sequentially, reaches infrared nanosecond laser quick with infrared picosecond laser
The integrated control effect of switching.
3rd, it is easy to board to debug by feux rouges preview, opens feux rouges, you can to judge Laser output center,
Adjust the position of product space preview mark；In the case of no light extraction, the contraposition debugging of product is completed,
The security of debugging is improve, loss of the product in debugging is reduced, quickly, directly, efficiently, safety.
Brief description of the drawings
Fig. 1 is that infrared nanosecond laser of the invention closes beam device overall schematic with infrared picosecond laser；
Fig. 2 is infrared picosecond laser structural representation of the invention；
Fig. 3 is infrared nanosecond laser structural scheme of mechanism of the invention；
Fig. 4 is the sharp combiner modular structure schematic diagram of the present invention；
Fig. 5 is that infrared nanosecond laser of the invention closes beam method flow diagram with infrared picosecond laser；
Reference：The infrared picosecond lasers of 1-；The infrared nanosecond lasers of 2-；3- swashs combiner module；4- is red
Beam module is closed in light preview；5- laser galvanometer scanning light path modules；6- rack platforms；The infrared picosecond laser hairs of 11-
Emitter；The one 45 degree of total reflective mirror of 12-；The 2nd 45 degree of total reflective mirror of 13-；The infrared nanosecond laser transmitters of 21-；
The 3rd 45 degree of total reflective mirror of 22-；The 4th 45 degree of total reflective mirror of 23-；31- light combination mirror pieces；32- schools position hole；33- slides
Module；41- red laser transmitters；42- feux rouges previewing modules；
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.
Presently preferred embodiments of the present invention is given in accompanying drawing.But, the present invention can come real in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to this
The understanding of disclosure of the invention content is more thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article with belong to technology of the invention
The implication that the technical staff in field is generally understood that is identical.The art for being used in the description of the invention herein
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in the limitation present invention.
Refering to shown in Fig. 1, the infrared nanosecond laser closes beam device with infrared picosecond laser includes infrared psec
Laser 1, infrared nanosecond laser 2, sharp combiner module 3, feux rouges preview are closed beam module 4, laser and are shaken
Scarnning mirror light path module 5 and rack platform 6；The rack platform 6 is fixedly installed on infrared picosecond laser
1 side upper edge outwardly, the infrared nanosecond laser 2, sharp combiner module 3 and feux rouges preview
Close beam module 4 and be respectively fixedly disposed at the top of rack platform 6, the laser galvanometer scanning light path module 5 with
Rack platform 6 is located at sustained height.
Refering to shown in Fig. 2, the infrared picosecond laser 1 includes infrared picosecond laser transmitter 11, first
45 degree of total reflective mirrors 12 and the 2nd 45 degree of total reflective mirror 13, the infrared picosecond laser transmitter 11 export infrared
Picosecond laser, the one 45 degree of total reflective mirror 12 and the 2nd 45 degree of total reflective mirror 13 are in relative to light path is injected
45 degree of overturning angles, infrared picosecond laser is by the one 45 degree of total reflective mirror 12 and the 2nd 45 degree of 13 liang of total reflective mirror
Enter laser after secondary total reflection and close beam module 3.
Refering to shown in Fig. 3, the infrared nanosecond laser 2 includes infrared nanosecond laser transmitter the 21, the 3rd
45 degree of total reflective mirrors 22 and the 4th 45 degree of total reflective mirror 23, the infrared nanosecond laser transmitter 21 export infrared
Nanosecond laser, the 3rd 45 degree of total reflective mirror 22 and the 4th 45 degree of total reflective mirror 23 are in relative to light path is injected
45 degree of overturning angles, infrared nanosecond laser is by the 3rd 45 degree of total reflective mirror 22 and the 4th 45 degree of 23 liang of total reflective mirror
Enter laser after secondary total reflection and close beam module 3.
Refering to shown in Fig. 4, the sharp combiner module 3 includes light combination mirror piece 31, school position hole 32 and slide mould
Block 33, light combination mirror piece 31, the school position hole 32 and slide module 33 are centrally located on same axis, described
Light combination mirror piece 31 is 45 degree of total reflective mirrors, and the school position hole 32 and slide module 33 ensure the one of output light path
The infrared picosecond laser and infrared of cause property, the infrared picosecond laser 1 and the output of infrared nanosecond laser 2
Nanosecond laser closes beam and by 45 degree of total reflections at light combination mirror piece 31, by school position hole 32 and slide module
33 enter feux rouges preview closes beam module 4.
Beam module 4 is closed in the feux rouges preview includes feux rouges preview generating laser 41 and feux rouges previewing module 42,
The feux rouges preview generating laser 41 exports preview feux rouges, the feux rouges previewing module 42 and sharp combiner
Module 3 be located at same axis on, the output light path of feux rouges preview generating laser 41 perpendicular to the axis,
The output light path of feux rouges preview generating laser 41 is intersected in feux rouges previewing module 42 a bit with the axis, institute
State preview feux rouges and sharp combiner mould that feux rouges previewing module 42 exports feux rouges preview generating laser 41
The infrared picosecond laser and infrared nanosecond laser of the output of block 3 reflect and export to laser galvanometer scanning light path module
5；It is easy to board to debug by feux rouges preview, opens feux rouges, you can to judge Laser output center, adjusts
Save the position of product space preview mark.
The laser galvanometer scanning light path module 5 receives the conjunction Shu Guang of the output of feux rouges previewing module 42, and output is anti-
After feedforward information, infrared picosecond laser and infrared nanosecond laser are exported in order according to actual requirement through software control.
The infrared nanosecond laser closes the laser galvanometer scanning light path module 5 in beam device with infrared picosecond laser
Could alternatively be laser cutting head and realize same function, be adjusted depending on concrete condition.
Refering to shown in Fig. 5, a kind of infrared nanosecond laser that the present invention is provided closes Shu Fangfa with infrared picosecond laser,
Comprise the following steps：
S1：The feux rouges preview is closed beam module 4 and exports preview feux rouges, and preview feux rouges is anti-by feux rouges previewing module 42
Enter laser galvanometer scanning light path module 5 after penetrating；
S2：The infrared picosecond laser 1 exports infrared picosecond laser；
S3：The infrared nanosecond laser 2 exports infrared nanosecond laser；
S4：Be combined into for the infrared picosecond laser for exporting and infrared nanosecond laser a branch of by the sharp combiner module 3；
S5：The laser galvanometer scanning light path module 5 receives the conjunction beam of infrared picosecond laser, infrared nanosecond laser
Light and feux rouges；
S6：Swashed by the set sequence alternate infrared picosecond laser of output and infrared nanosecond according to actual requirement through software control
Light.
Infrared nanosecond laser has the advantage of quick removal material, and infrared picosecond laser has heat affecting small,
Slight crack is tiny, the few advantage of surface debris, and alternately infrared nanosecond laser and infrared psec are exported by the present apparatus
Laser can combine the Dominant Facies of the two, be rapidly completed specific high-quality infrared laser processing request.
Above-described embodiment is the present invention preferably implementation method, but embodiments of the present invention do not receive above-mentioned reality
Apply the limitation of example, it is other it is any without departing from the change made under Spirit Essence of the invention and principle, modification,
Substitute, combine, simplify, should be equivalent substitute mode, be included within protection scope of the present invention.
Claims (9)
1. a kind of infrared nanosecond laser closes beam device with infrared picosecond laser, it is characterised in that including：
Infrared picosecond laser (1), infrared nanosecond laser (2), sharp combiner module (3) and laser galvanometer are swept
Retouch light path module (5)；The infrared picosecond laser (1) and infrared nanosecond laser (2) export infrared psec respectively
Laser and infrared nanosecond laser, the sharp combiner module (3) by export infrared picosecond laser and infrared nanosecond
Laser is combined into a branch of and exports conjunction Shu Jiguang, and the laser galvanometer scanning light path module (5) receives closes Shu Guang, and
Alternating exports infrared picosecond laser and infrared nanosecond laser.
2. infrared nanosecond laser as claimed in claim 1 closes beam device with infrared picosecond laser, and its feature exists
In：The infrared picosecond laser (1) includes infrared picosecond laser transmitter (11), the one 45 degree of total reflective mirror (12)
With the 2nd 45 degree of total reflective mirror (13), the infrared picosecond laser transmitter (11) exports infrared picosecond laser, infrared
Picosecond laser enters sharp after the one 45 degree of total reflective mirror (12) and the 2nd 45 degree of total reflective mirror (13) are totally reflected twice
Combiner module (3).
3. infrared nanosecond laser as claimed in claim 1 closes beam device with infrared picosecond laser, and its feature exists
In：The infrared nanosecond laser (2) includes infrared nanosecond laser transmitter (21), the 3rd 45 degree of total reflective mirror (22)
With the 4th 45 degree of total reflective mirror (23), the infrared nanosecond laser transmitter (21) exports infrared nanosecond laser, infrared
Nanosecond laser is after the 3rd 45 degree of total reflective mirror (22) and the 4th 45 degree of total reflective mirror (23) are totally reflected twice
Into sharp combiner module (3).
4. infrared nanosecond laser as claimed in claim 1 closes beam device with infrared picosecond laser, and its feature exists
In：Described infrared nanosecond laser closes beam device with infrared picosecond laser can also include that a feux rouges preview is closed
Beam module (4), beam module (4) is closed in the feux rouges preview includes feux rouges preview generating laser (41) and feux rouges preview
Module (42), the feux rouges preview generating laser (41) exports preview feux rouges, the feux rouges previewing module (42)
Laser galvanometer scanning light path module is arrived in output after infrared psec and infrared nanosecond are closed into beam light and reflection to red light
(5)。
5. infrared nanosecond laser as claimed in claim 4 closes beam device with infrared picosecond laser, and its feature exists
In：The sharp combiner module (3) includes light combination mirror piece (31), school position hole (32) and slide module (33),
The light combination mirror piece (31), school position hole (32) and slide module (32) are centrally located on same axis, red
Outer picosecond laser and infrared nanosecond laser close beam and by 45 degree of total reflections at light combination mirror piece (31) place, and lead to
Cross school position hole (32) and slide module (33) enters feux rouges previewing module (42).
6. infrared nanosecond laser as claimed in claim 5 closes beam device with infrared picosecond laser, and its feature exists
In：The laser galvanometer scanning light path module (5) is for receiving the conjunction Shu Guang that feux rouges previewing module (42) is exported
And feux rouges, and system is fed back information to, the output of real-time adjustment laser.
7. the infrared nanosecond laser as described in claim any one of 1-6 closes beam device with infrared picosecond laser,
It is characterized in that：The infrared nanosecond laser is closed beam device and can also include a support with infrared picosecond laser
Platform (6), the rack platform (6) is fixedly installed on outwardly upper of infrared picosecond laser (1) side
Beam module is closed in edge, the infrared nanosecond laser (2), sharp combiner module (3) and feux rouges preview
(4) it is respectively fixedly disposed at rack platform (6) top.
8. a kind of infrared nanosecond laser closes Shu Fangfa with infrared picosecond laser, it is characterised in that：
Step a：The infrared picosecond laser (1) exports infrared picosecond laser；
Step b：The infrared nanosecond laser (2) exports infrared nanosecond laser；
Step c：The infrared picosecond laser for exporting and infrared nanosecond laser are combined into one by the sharp combiner module (3)
Beam simultaneously exports conjunction Shu Jiguang；
Step d：The conjunction Shu Guang of sharp combiner module (3) output is by after feux rouges previewing module (42) reflection
Into laser galvanometer scanning light path module (5)；
Step e：The laser galvanometer scanning light path module (5) receives closes Shu Guang and feux rouges, and alternately exports infrared psec
Laser and infrared nanosecond laser.
9. infrared nanosecond laser as claimed in claim 8 closes Shu Fangfa with infrared picosecond laser, and its feature exists
In：A step can also be included：Beam module (4) output preview feux rouges is closed in the feux rouges preview, and preview is red
Light after feux rouges previewing module (42) reflection by entering laser galvanometer scanning light path module (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510964342.XA CN106903428A (en) | 2015-12-21 | 2015-12-21 | A kind of infrared nanosecond laser is closed beam device and its closes Shu Fangfa with infrared picosecond laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510964342.XA CN106903428A (en) | 2015-12-21 | 2015-12-21 | A kind of infrared nanosecond laser is closed beam device and its closes Shu Fangfa with infrared picosecond laser |
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| CN106903428A true CN106903428A (en) | 2017-06-30 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510964342.XA Pending CN106903428A (en) | 2015-12-21 | 2015-12-21 | A kind of infrared nanosecond laser is closed beam device and its closes Shu Fangfa with infrared picosecond laser |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108406089A (en) * | 2018-01-26 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | A kind of double light path laser marking equipment and its marking method |
| CN112247363A (en) * | 2020-10-13 | 2021-01-22 | 深圳市嗨兴科技有限公司 | Control method and device for multi-beam-combination engraving |
| CN112845392A (en) * | 2021-04-02 | 2021-05-28 | 西南交通大学 | Accurate nondestructive laser decontamination method for polluted metal parts on surface of nuclear facility |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040074881A1 (en) * | 2002-10-16 | 2004-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method of manufacturing semiconductor device by using the laser irradiation apparatus |
| CN101569962A (en) * | 2009-04-30 | 2009-11-04 | 苏州德龙激光有限公司 | Double light path green light micropore processing device |
| CN201408289Y (en) * | 2009-04-23 | 2010-02-17 | 北京世纪桑尼科技有限公司 | Laser scanning head with indicating light coaxial with laser |
| CN202667917U (en) * | 2012-06-15 | 2013-01-16 | 合肥知常光电科技有限公司 | Precise solar wafer machining device using double laser bundles |
| CN203183034U (en) * | 2013-04-03 | 2013-09-11 | 首都医科大学 | Laser device and laser system |
| CN104347368A (en) * | 2013-07-26 | 2015-02-11 | 上海微电子装备有限公司 | Laser annealing device for multiple lasers and method thereof |
| CN204189772U (en) * | 2014-12-03 | 2015-03-04 | 苏州德龙激光股份有限公司 | Dual-wavelength laser annealing device |
| CN104741798A (en) * | 2015-03-24 | 2015-07-01 | 张立国 | Composite focus space-time synchronized drilling system and method |
| CN204487002U (en) * | 2014-12-27 | 2015-07-22 | 东莞市博世机电设备有限公司 | The efficient treatment system of a kind of pattern laser |
| CN204487006U (en) * | 2014-12-27 | 2015-07-22 | 东莞市博世机电设备有限公司 | A kind of multi-functional marking machine |
| CN204686014U (en) * | 2015-04-23 | 2015-10-07 | 马承伟 | 3D printing equipment |
| CN207181815U (en) * | 2017-08-24 | 2018-04-03 | 镇江金海创科技有限公司 | Previewing module and dynamic focusing laser galvanometer |
-
2015
- 2015-12-21 CN CN201510964342.XA patent/CN106903428A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040074881A1 (en) * | 2002-10-16 | 2004-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus and method of manufacturing semiconductor device by using the laser irradiation apparatus |
| CN201408289Y (en) * | 2009-04-23 | 2010-02-17 | 北京世纪桑尼科技有限公司 | Laser scanning head with indicating light coaxial with laser |
| CN101569962A (en) * | 2009-04-30 | 2009-11-04 | 苏州德龙激光有限公司 | Double light path green light micropore processing device |
| CN202667917U (en) * | 2012-06-15 | 2013-01-16 | 合肥知常光电科技有限公司 | Precise solar wafer machining device using double laser bundles |
| CN203183034U (en) * | 2013-04-03 | 2013-09-11 | 首都医科大学 | Laser device and laser system |
| CN104347368A (en) * | 2013-07-26 | 2015-02-11 | 上海微电子装备有限公司 | Laser annealing device for multiple lasers and method thereof |
| CN204189772U (en) * | 2014-12-03 | 2015-03-04 | 苏州德龙激光股份有限公司 | Dual-wavelength laser annealing device |
| CN204487002U (en) * | 2014-12-27 | 2015-07-22 | 东莞市博世机电设备有限公司 | The efficient treatment system of a kind of pattern laser |
| CN204487006U (en) * | 2014-12-27 | 2015-07-22 | 东莞市博世机电设备有限公司 | A kind of multi-functional marking machine |
| CN104741798A (en) * | 2015-03-24 | 2015-07-01 | 张立国 | Composite focus space-time synchronized drilling system and method |
| CN204686014U (en) * | 2015-04-23 | 2015-10-07 | 马承伟 | 3D printing equipment |
| CN207181815U (en) * | 2017-08-24 | 2018-04-03 | 镇江金海创科技有限公司 | Previewing module and dynamic focusing laser galvanometer |
Non-Patent Citations (1)
| Title |
|---|
| 于兆勤: "《机械制造技术训练》", 30 April 2015 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108406089A (en) * | 2018-01-26 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | A kind of double light path laser marking equipment and its marking method |
| CN108406089B (en) * | 2018-01-26 | 2020-07-14 | 大族激光科技产业集团股份有限公司 | Double-light-path laser marking equipment and marking method thereof |
| CN112247363A (en) * | 2020-10-13 | 2021-01-22 | 深圳市嗨兴科技有限公司 | Control method and device for multi-beam-combination engraving |
| CN112845392A (en) * | 2021-04-02 | 2021-05-28 | 西南交通大学 | Accurate nondestructive laser decontamination method for polluted metal parts on surface of nuclear facility |
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