CN110625271A - Ultrafast laser PCB drilling equipment and method thereof - Google Patents
Ultrafast laser PCB drilling equipment and method thereof Download PDFInfo
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- CN110625271A CN110625271A CN201910553824.4A CN201910553824A CN110625271A CN 110625271 A CN110625271 A CN 110625271A CN 201910553824 A CN201910553824 A CN 201910553824A CN 110625271 A CN110625271 A CN 110625271A
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- laser
- spectroscope
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to equipment and a method for ultrafast laser PCB drilling, wherein a light beam shaping system and a light beam rapid deflection device are sequentially arranged on an output light path of a laser, a first spectroscope is arranged on the output light path of the light beam rapid deflection device, a reflector group is arranged on a transmission light path of the first spectroscope, a second spectroscope is arranged on a reflection light path of the reflector group, a galvanometer scanning and focusing system is arranged on a transmission light path of the second spectroscope, and the output end of the galvanometer scanning and focusing system is right opposite to a processing workpiece on a processing platform; a power meter is arranged on a light reflecting path of the first spectroscope, and a PSD focusing lens and a position sensor are arranged on a light reflecting path of the second spectroscope; the power meter and the position sensor are in communication connection with a controller, and the controller is in control connection with the laser, the light beam rapid deflection device, the galvanometer scanning focusing system and the processing platform. The power meter detects the laser power in real time and controls the laser power in a closed loop manner; the position sensor detects the laser deflection position in real time and controls the laser position in a closed loop mode.
Description
Technical Field
The invention relates to equipment and a method for ultrafast laser PCB drilling.
Background
A Printed Circuit Board (PCB) is a bridge for supporting electronic components and connecting circuits, is used as a parent of electronic products, is widely applied to the fields of communication electronics, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense, aerospace and the like, and is an indispensable electronic component in modern electronic information products. The development level of the PCB industry may reflect the development speed and technical level of the electronic information industry of a country or region to a certain extent. Under the large environment of accelerated evolution such as the current cloud technology, 5G network construction, big data, artificial intelligence, shared economy, industrial 4.0, Internet of things and the like, the PCB industry becomes the fundamental strength of the whole electronic industry chain. In recent years, due to the influence of factors such as speed increasing and slowing of personal computers and smart phones, stack inventory adjustment and the like in the main electronic industry field of the world, the PCB industry has transient adjustment, and after continuous small downslide in 2015 and 2016, the global PCB output value recovers the growth situation in 2017. The global PCB market will keep growing mildly in the next 5 years, and the Internet of things, automotive electronics, industry 4.0, cloud servers, storage devices and the like will become a new direction for driving the growth of PCB demands.
In the PCB, the interconnection holes mainly comprise three types, namely through holes, buried holes and blind holes. The machining method of the interconnected holes mainly comprises mechanical drilling and laser drilling.
Currently, PCB drilling methods mainly have mechanical drilling and laser drilling.
Mechanical drilling is usually performed by using a numerical control machine tool, i.e. the machine tool drills holes according to a pre-designed program under the control of a computer. Mechanical drilling is suitable for machining through holes with the aperture larger than 200 mu m. When the pore diameter is reduced to 200 μm or less, the manufacturing cost of the drill is greatly increased and it is easily broken, causing a problem in cost and a problem in quality of pore-forming. In addition, mechanical drilling is not suitable for making blind holes in printed circuit boards because it is not easy to control the depth of the drilled hole due to poor accuracy control.
Laser drilling typically uses CO2Laser and ultraviolet laser.
CO2The principle of laser drilling is the use of photothermal ablation. CO 22The laser emits infrared laser to irradiate the base material of the printed circuit board to generate a large amount of heat, the temperature of the irradiated base material rises sharply due to low thermal conductivity coefficient to reach the melting point of the base material of the printed circuit board, and the base material is melted and then quickly evaporated to form a hole. By using CO2The laser drilling can leave black burnt traces on the hole wall to influence the metallization quality of the subsequent holes, so that CO is adopted2The holes formed by laser drilling need to be cleaned prior to metallization. CO 22The laser belongs to infrared laser, the laser wavelength is longer, the energy is low, and the processing is difficult when the laser meets the base material of the printed circuit board with higher melting point and higher heat conductivity coefficient. Since copper has a high melting point and a high thermal conductivity, when CO is present2Laser irradiates the surface of copper, the heat of the laser is conducted to other places, the heat is quickly dissipated, and the temperature of an irradiation point does not reach the melting point of the copper, so that CO2The laser cannot drill directly through the copper face. Using CO2Laser drilling, in general, a copper layer is etched away by chemical means at the desired hole, and then CO is used2Laser ablation of the insulating substrate. Thus CO2The laser is suitable for drilling blind holes. By using CO2The laser-processed aperture is generally 75 μm to 150 μm.
Another laser used for printed circuit board drilling is an ultraviolet laser. The ultraviolet laser has short wavelength and high energy, and can reach the bond energy of intermolecular chemical bonds during drilling, and the ultraviolet laser can directly break the molecular bonds when irradiating the surface of the base material, thereby achieving the purpose of cutting the base material. The ultraviolet laser can directly process the copper foil, so that the ultraviolet laser can be adopted to directly drill holes on the printed circuit board, and the through holes and the blind holes can be conveniently processed by controlling the energy of the ultraviolet laser. The aperture of the uv laser machining can be up to 50 μm or even smaller. In addition, because the ultraviolet laser directly breaks chemical bonds to form holes, the residues in the holes are less.
The ultraviolet laser can be classified into nanosecond ultraviolet laser, picosecond ultraviolet laser, femtosecond ultraviolet laser and the like according to different pulse widths. At present, nanosecond ultraviolet laser is mainly used by PCB laser micropore drilling equipment. The nanosecond laser still has a certain heat effect due to long pulse duration, so that the PCB substrate is easily carbonized and remains on the hole wall, and the processing quality is influenced.
With the development of the PCB technology, the diameter of the interconnecting hole of the PCB is smaller, the density is higher, the precision is higher, and meanwhile, the requirement on the processing quality of the interconnecting hole is higher. When a hole having a diameter of 50 μm or less is processed, the processing speed is greatly affected by the mechanical inertia of the galvanometer.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides equipment and a method for ultrafast laser PCB drilling.
The purpose of the invention is realized by the following technical scheme:
the equipment of ultrafast laser PCB drilling, the characteristic is: a beam shaping system and a beam rapid deflection device are sequentially arranged on an output light path of the laser, a first spectroscope is arranged on the output light path of the beam rapid deflection device, a reflector group is arranged on a transmission light path of the first spectroscope, a second spectroscope is arranged on a reflection light path of the reflector group, a galvanometer scanning and focusing system is arranged on a transmission light path of the second spectroscope, and an output end of the galvanometer scanning and focusing system is right opposite to a processing workpiece on the processing platform; a power meter is arranged on a reflection light path of the first spectroscope, and a PSD focusing lens and a position sensor are sequentially arranged on a reflection light path of the second spectroscope; the power meter and the position sensor are in communication connection with the controller, the controller is in control connection with the laser, the light beam rapid deflection device, the galvanometer scanning focusing system and the processing platform, the power meter detects the laser power in real time and feeds back signals to the controller to perform closed-loop control on the laser power, and the position sensor detects the laser deflection position in real time and feeds back signals to the controller to perform closed-loop control on the laser position.
Further, the equipment for drilling the PCB by using the ultrafast laser is characterized in that the laser is a picosecond ultraviolet laser or a femtosecond ultraviolet laser.
Further, the ultrafast laser PCB drilling equipment is characterized in that the picosecond ultraviolet laser is a picosecond ultraviolet laser with the wavelength of 200 nm-400 nm, the repetition frequency of 1 kHz-10 MHz, the power of 1W-100W and the pulse width of 1 ps-500 ps.
Further, the equipment for ultrafast laser PCB drilling is characterized in that the femtosecond laser has a center wavelength of 200 nm-400 nm, or 515 nm-550 nm, or 1030 nm-1080 nm, a repetition frequency of 1 kHz-10 MHz, a power of 1W-100W and a pulse width of 10 fs-1000 fs.
Further, the equipment for drilling the ultrafast laser PCB is described above, wherein the beam shaping system is a diffractive optical element or a spatial light modulator.
Further, the equipment for ultrafast laser PCB drilling is described above, wherein the beam rapid deflection device is an acousto-optic deflector, an electro-optic deflector, or a piezoceramic deflection mirror.
Further, the equipment for ultrafast laser PCB drilling is described above, wherein the galvanometer scanning focusing system comprises a galvanometer scanning module and an f-theta focusing mirror, and the galvanometer scanning module is located above the f-theta focusing mirror.
Furthermore, according to the equipment for drilling the ultrafast laser PCB, a dust suction device is arranged between the workpiece to be machined on the machining platform and the galvanometer scanning and focusing system, and a visual positioning system is arranged on one side of the galvanometer scanning and focusing system.
The invention relates to a method for drilling a hole on an ultrafast laser PCB (printed circuit board). A laser outputs a Gaussian beam, the Gaussian beam is incident to a beam shaping system, the beam shaping system shapes the Gaussian beam into a flat-topped beam and then emits the flat-topped beam into a beam rapid deflection device, the beam rapid deflection device rapidly changes the direction of the beam, the deflected beam passes through a first spectroscope at an incident angle of 45 degrees, a part of the beam is reflected by the first spectroscope and enters a power meter, the power meter detects the laser power in real time, the beam is reflected by a reflector group at an incident angle of 45 degrees after being transmitted by the first spectroscope and then passes through a second spectroscope at an incident angle of 45 degrees, a part of the beam is reflected by the second spectroscope and then is focused on a position sensor through a PSD (phase-sensitive detector) focusing lens, the position sensor detects the deflection angle of the beam rapid deflection device in real time, the beam is transmitted by the second spectroscope and then emits;
the first spectroscope divides a part of light from the light path and emits the part of light into the power meter, and the power meter monitors the laser power in real time and feeds monitoring information back to the controller in real time to perform closed-loop control on the laser power;
and a part of light is split from the light path by the second beam splitter and is emitted to the position sensor through the PSD focusing lens, the position sensor monitors the light spot position corresponding to the deflection of the light beam quick deflection device in real time, and the monitoring information is fed back to the controller in real time to carry out closed-loop control on the laser position.
Furthermore, in the ultrafast laser PCB drilling method, the galvanometer scanning and focusing system comprises a galvanometer scanning module and an f-theta focusing lens, the light beam is transmitted by the second beam splitter and then enters the galvanometer scanning module, the light beam is deflected and then enters the f-theta focusing lens, the f-theta focusing lens focuses the flat-top light beam into a processing light spot, and the workpiece placed on the processing platform is drilled.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:
the invention adopts picosecond ultraviolet laser or femtosecond laser, the picosecond laser and the femtosecond laser have shorter pulse duration and smaller heat effect, the PCB substrate is not easy to be carbonized and remained, and the processing quality is high;
the beam shaping system shapes the Gaussian beam into a flat-top beam through the phase and intensity modulation of the beam;
thirdly, changing the propagation direction of the light beam by adopting a light beam quick deflection device to enable the focused light spot to move along a specific track on the workpiece, thereby drilling a required hole; the light beam rapid deflection device carries out rapid deflection of light beams, provides a small-amplitude rapid light beam deflection function, is complementary with the existing galvanometer, and effectively improves the processing efficiency when micro-holes (the aperture is less than 50 mu m) are drilled;
a part of light is split from the light path by the first beam splitter and is emitted into the power meter, the power meter monitors the laser power in real time, and feeds monitoring information back to a controller which is in control connection with the laser and the light beam rapid deflection device in real time, so as to perform closed-loop control on the laser power; therefore, the stability of the laser power can be ensured, so that the drilling depth can be better controlled, and the drilling quality and stability can be improved;
a part of light is separated from the light path by the second spectroscope and is injected onto the position sensor through the PSD focusing lens, the position sensor monitors the light spot position corresponding to the deflection of the light beam quick deflection device in real time, and feeds monitoring information back to a controller in control connection with the light beam quick deflection device, the galvanometer scanning focusing system and the processing platform in real time, and the laser position is controlled in a closed loop mode; therefore, the accuracy of the laser spot position can be ensured, and the indexes of the positioning precision of processing, the roundness of the drilled hole and the like are improved;
sixthly, the drilling method is suitable for drilling the PCB, and the drilling method comprises a punching method and a non-punching method, wherein the non-punching method comprises a circular cutting method, a spiral method, a concentric circle processing method and the like.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: the invention is a schematic diagram of an optical path structure;
FIG. 2: the Gaussian beam is shaped into a schematic diagram of a flat-topped beam by a beam shaping system;
FIG. 3 a: a schematic diagram of a light spot processing track of a circular cutting method;
FIG. 3 b: a light spot processing track schematic diagram of a spiral method;
FIG. 3 c: and (3) a light spot processing track schematic diagram of a concentric circle method.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, the equipment for ultrafast laser PCB drilling comprises:
a laser 10 outputting a laser beam to provide energy for workpiece material removal;
a beam shaping system 20 for shaping the gaussian beam into a flat-top beam;
the light beam rapid deflection device 30 is used for rapidly moving the laser focusing light spot on a micro curvature radius curve;
the galvanometer scanning focusing system 50 moves laser focusing light spots on the workpiece;
the processing platform 70 with two-dimensional motion drives the processing workpiece (PCB) 60 adsorbed by the processing platform to translate;
the equipment for ultrafast laser PCB drilling is characterized in that a light beam shaping system 20 and a light beam rapid deflection device 30 are sequentially arranged on an output light path of a laser 10, a first spectroscope 81 is arranged on an output light path of the light beam rapid deflection device 30, a reflector group is arranged on a transmission light path of the first spectroscope 81, the reflector group comprises a first reflector 41 and a second reflector 42 which are arranged according to the light path, a second spectroscope 82 is arranged on a reflection light path of the reflector group, a galvanometer scanning and focusing system 50 is arranged on a transmission light path of the second spectroscope 82, and the output end of the galvanometer scanning and focusing system 50 is right opposite to a processing workpiece 60 on a processing platform 70; a power meter 90 is arranged on a reflection light path of the first spectroscope 81, and a PSD focusing lens 101 and a position sensor 102 are sequentially arranged on a reflection light path of the second spectroscope 82; the power meter 90 and the position sensor 102 are in communication connection with a controller, the controller is in control connection with the laser 10, the beam rapid deflection device 30, the galvanometer scanning focusing system 50 and the processing platform 70, the power meter 90 detects laser power in real time and feeds back signals to the controller for closed-loop control of the laser power, and the position sensor 102 detects laser deflection positions in real time and feeds back signals to the controller for closed-loop control of the laser positions.
The laser 10 adopts picosecond ultraviolet laser or femtosecond laser, the picosecond laser and femtosecond laser pulse duration is shorter, the heat effect is smaller, the PCB substrate is not easy to be carbonized and remained, and the processing quality is high. The picosecond ultraviolet laser has the wavelength of 200nm to 400nm, the repetition frequency of 1kHz to 10MHz, the power of 1W to 100W and the pulse width of 1ps to 500 ps; the femtosecond laser has a central wavelength of 200-400 nm or 515-550 nm or 1030-1080 nm, a repetition frequency of 1 kHz-10 MHz, a power of 1-100W and a pulse width of 10 fs-1000 fs.
The beam is rapidly deflected by a beam deflector 30 in the beam path to change the direction of propagation of the beam so that the focused spot follows a specific trajectory on the workpiece to drill the desired hole. The beam rapid deflection device performs rapid deflection of the beam, and the beam rapid deflection device 30 employs an acousto-optic deflector (AOD), an electro-optic deflector (EOD), or a piezoceramic deflection mirror.
The beam shaping system 20 is a diffractive optical element or a spatial light modulator.
The galvanometer scanning focusing system 50 comprises a galvanometer scanning module 51 and an f-theta focusing lens 52, wherein the galvanometer scanning module 51 is positioned on the f-theta focusing lens 52.
A dust absorption device is arranged between a processing workpiece on the processing platform 70 and the galvanometer scanning and focusing system 50, a visual positioning system is arranged on one side of the galvanometer scanning and focusing system 50 and comprises a CCD camera, an image lens and an illumination light source, and the relative positions of the galvanometer scanning and focusing system 50 and the visual positioning system are kept unchanged in the drilling process.
In the method for ultrafast laser PCB drilling, a laser 10 outputs a Gaussian beam, the Gaussian beam is incident to a beam shaping system 20, the beam shaping system 20 shapes the Gaussian beam into a flat-top beam and then enters a beam rapid deflection device 30, the beam rapid deflection device 30 rapidly changes the beam direction, the deflected beam passes through a first beam splitter 81 at an incident angle of 45 degrees, a small part of the beam is reflected by the first beam splitter 81 and enters a power meter 90, the power meter 90 detects the laser power in real time, the beam is transmitted by the first beam splitter 81, then is reflected by a first reflector 41 and a second reflector 42 at an incident angle of 45 degrees respectively, then passes through a second beam splitter 82 at an incident angle of 45 degrees, the small part of the beam is reflected by the second beam splitter 82 and then is focused on a position sensor 102 through a PSD focusing lens 101, the position sensor 102 detects the deflection angle of the beam rapid deflection device in real time, the light beam is transmitted by the second beam splitter 82 and then enters the galvanometer scanning focusing system 50, the galvanometer scanning module 51 of the galvanometer scanning focusing system 50 deflects the light beam and then enters the f-theta focusing lens 52, the f-theta focusing lens 52 focuses the flat-top light beam into a processing light spot, and the processing work piece 60 placed on the processing platform 70 is drilled.
The first beam splitter 81 splits a part of light from the light path and emits the split light into the power meter 90, and the power meter 90 monitors the laser power in real time and feeds monitoring information back to the controller in control connection with the laser 10 and the light beam rapid deflection device 30 in real time so as to perform closed-loop control on the laser power; therefore, the stability of the laser power can be ensured, so that the drilling depth can be better controlled, and the drilling quality and stability can be improved;
the second beam splitter 82 splits a part of light from the light path, the part of light is emitted to the position sensor 102 through the PSD focusing lens 101, the position sensor 102 monitors the light spot position corresponding to the deflection of the light beam quick deflection device in real time, and feeds monitoring information back to a controller in control connection with the light beam quick deflection device 30, the galvanometer scanning focusing system 50 and the processing platform 70 in real time, so as to carry out closed-loop control on the laser position; therefore, the accuracy of the laser spot position can be ensured, and the indexes of the positioning precision of processing, the roundness of the drilled hole and the like are improved.
The dust suction device sucks and discharges dust and waste gas generated in the drilling process.
The vision positioning system is composed of a CCD camera, an image lens and an illumination light source, positions a processing workpiece (PCB) 60 through the vision positioning system to obtain position coordinate information of the PCB, and transmits the position coordinate information to the controller, and the controller controls the galvanometer scanning module 51, the processing platform 70 and the light beam quick deflection device 30 to perform high-precision and high-speed scanning according to the position information to ensure the processing precision.
Light spots of Gaussian-distributed laser focused by the focusing lens are also Gaussian-distributed, the light intensity difference between the center of the Gaussian-distributed laser and the edge is large, the edge insulating material is easily removed incompletely, or the center of the laser spot causes overlarge damage to the lower copper foil; the light intensity distribution of the flat-top light beam is uniform, the depth of the blind hole can be better controlled, and the drilling quality is improved. The gaussian beam is shaped into a flat-topped beam by a beam shaping system 20, as shown in fig. 2. The beam shaping system 30 can shape a gaussian beam into a flat-topped beam by phase and intensity modulation of the beam. The beam shaping system 30 may be a Diffractive Optical Element (DOE) or a Spatial Light Modulator (SLM).
The Diffractive Optical Element (DOE) is a type of diffractive optical element which is based on the diffraction theory of light waves, is etched on a substrate (or the surface of an optical device) to generate a step-type or continuous relief structure, and forms coaxial or off-axis reproduction and has extremely high diffraction efficiency. The pure phase type DOE is generally made into a relief structure with multiple phase orders and has high diffraction efficiency, and the diffraction efficiency is generally more than 90%; by using the sub-wavelength microstructure and the continuous phase profile, diffraction efficiency close to 100% can be achieved.
Spatial Light Modulators (SLMs) are a class of devices that convert electronic or optical information into one-or two-dimensional optical information in order to efficiently exploit the inherent speed, parallelism, and interconnection capabilities of light. Generally, SLM modulators consist of many individual cells spatially arranged in a two-dimensional array structure, each cell independently controlled by an optical or electrical signal to change the amplitude or intensity, phase, polarization, and wavelength of the spatially received light or to convert incoherent light into coherent light.
According to the moving track of the light spot on the workpiece (PCB) 60, the processing method can be divided into a punching method and a non-punching method, and the non-punching method includes a circular cutting method (see fig. 3a), a spiral method (see fig. 3b), a concentric circular processing method (see fig. 3c), and the like. The punching is to directly punch by using laser single pulse, and the aperture is smaller; the circular cutting method is that the track of the laser focusing light spot is a circle along the edge of the hole, such as the light spot processing track of the circular cutting method shown in fig. 3 a; the spiral drilling is that the track of a laser focusing light spot is a spiral line from the circle center to the edge of a hole, such as a light spot processing track of a spiral method shown in fig. 3 b; the concentric circle processing method is to process the track as a series of concentric circles, such as the light spot processing track of the concentric circle method shown in fig. 3c, until the aperture meets the requirement. Among the above processing methods, the punching and circular cutting methods are mainly used for processing through holes, and the spiral method and the concentric circle method can be used for processing through holes and blind holes.
The light beam rapid deflection device is arranged in the light path, provides a small-amplitude rapid light beam deflection function, is complementary with the existing galvanometer, and effectively improves the processing efficiency when the micro-hole (the aperture is less than 50 mu m) is drilled.
The invention is suitable for drilling PCB, the PCB comprises a PCB hard board, a flexible circuit board (FPC) and a soft and hard combined PCB, the substrate of the FPC comprises but is not limited to a flexible copper clad laminate which takes LCP (liquid crystal polymer), PI (polyimide), MPI (modified polyimide), FR4 and other materials as base materials.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. Equipment of ultrafast laser PCB drilling, its characterized in that: a beam shaping system and a beam rapid deflection device are sequentially arranged on an output light path of the laser, a first spectroscope is arranged on the output light path of the beam rapid deflection device, a reflector group is arranged on a transmission light path of the first spectroscope, a second spectroscope is arranged on a reflection light path of the reflector group, a galvanometer scanning and focusing system is arranged on a transmission light path of the second spectroscope, and an output end of the galvanometer scanning and focusing system is right opposite to a processing workpiece on the processing platform; a power meter is arranged on a reflection light path of the first spectroscope, and a PSD focusing lens and a position sensor are sequentially arranged on a reflection light path of the second spectroscope; the power meter and the position sensor are in communication connection with a controller, and the controller is in control connection with the laser, the light beam rapid deflection device, the galvanometer scanning focusing system and the processing platform.
2. The ultrafast laser PCB drilling apparatus of claim 1, wherein: the laser is a picosecond ultraviolet laser or a femtosecond ultraviolet laser.
3. The ultrafast laser PCB drilling apparatus of claim 2, wherein: the picosecond ultraviolet laser has the wavelength of 200 nm-400 nm, the repetition frequency of 1 kHz-10 MHz, the power of 1W-100W and the pulse width of 1 ps-500 ps.
4. The ultrafast laser PCB drilling apparatus of claim 2, wherein: the femtosecond laser has the center wavelength of 200 nm-400 nm or 515 nm-550 nm or 1030 nm-1080 nm, the repetition frequency of 1 kHz-10 MHz, the power of 1W-100W and the pulse width of 10 fs-1000 fs.
5. The ultrafast laser PCB drilling apparatus of claim 1, wherein: the beam shaping system is a diffractive optical element or a spatial light modulator.
6. The ultrafast laser PCB drilling apparatus of claim 1, wherein: the light beam rapid deflection device is an acousto-optic deflector, an electro-optic deflector or a piezoelectric ceramic deflection mirror.
7. The ultrafast laser PCB drilling apparatus of claim 1, wherein: the galvanometer scanning focusing system comprises a galvanometer scanning module and an f-theta focusing mirror, wherein the galvanometer scanning module is positioned on the f-theta focusing mirror.
8. The ultrafast laser PCB drilling apparatus of claim 1, wherein: a dust absorption device is arranged between a processing workpiece on the processing platform and the galvanometer scanning and focusing system, and a vision positioning system is arranged on one side of the galvanometer scanning and focusing system.
9. The ultrafast laser PCB drilling method is characterized by comprising the following steps: the laser outputs a Gaussian beam, the Gaussian beam is incident to a beam shaping system, the beam shaping system shapes the Gaussian beam into a flat-top beam and then enters a beam rapid deflection device, the beam rapid deflection device rapidly changes the direction of the beam, the deflected beam passes through a first spectroscope at an incident angle of 45 degrees, a part of the beam is reflected by the first spectroscope and enters a power meter, the power meter detects the laser power in real time, the beam is transmitted by the first spectroscope and then reflected by a reflector group at an incident angle of 45 degrees and then passes through a second spectroscope at an incident angle of 45 degrees, a part of the beam is reflected by the second spectroscope and then focused on a position sensor through a PSD focusing lens, the position sensor detects the angle deflected by the beam rapid deflection device in real time, the beam is transmitted by the second spectroscope and then enters a galvanometer scanning focusing system, and the galvanometer scanning focusing system outputs a focusing spot to drill a workpiece placed on;
the first spectroscope divides a part of light from the light path and emits the part of light into the power meter, and the power meter monitors the laser power in real time and feeds monitoring information back to the controller in real time to perform closed-loop control on the laser power;
and a part of light is split from the light path by the second beam splitter and is emitted to the position sensor through the PSD focusing lens, the position sensor monitors the light spot position corresponding to the deflection of the light beam quick deflection device in real time, and the monitoring information is fed back to the controller in real time to carry out closed-loop control on the laser position.
10. The method of ultrafast laser PCB drilling of claim 9, wherein: the galvanometer scanning and focusing system comprises a galvanometer scanning module and an f-theta focusing mirror, a light beam is transmitted by a second beam splitter and then enters the galvanometer scanning module, the light beam is deflected and then enters the f-theta focusing mirror, the f-theta focusing mirror focuses a flat-top light beam into a processing light spot, and a workpiece placed on a processing platform is drilled.
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