CN102343481B - The processing method of laser processing device, machined object and the dividing method of machined object - Google Patents
The processing method of laser processing device, machined object and the dividing method of machined object Download PDFInfo
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- CN102343481B CN102343481B CN201110176186.2A CN201110176186A CN102343481B CN 102343481 B CN102343481 B CN 102343481B CN 201110176186 A CN201110176186 A CN 201110176186A CN 102343481 B CN102343481 B CN 102343481B
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- 238000003672 processing method Methods 0.000 title claims abstract description 32
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- 230000015572 biosynthetic process Effects 0.000 claims abstract description 53
- 230000000694 effects Effects 0.000 claims abstract description 23
- 239000000470 constituent Substances 0.000 claims abstract description 14
- 230000001678 irradiating effect Effects 0.000 claims description 42
- 238000003825 pressing Methods 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 2
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- 230000003287 optical effect Effects 0.000 description 30
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- 239000000758 substrate Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- 230000000452 restraining effect Effects 0.000 description 13
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- 229910052594 sapphire Inorganic materials 0.000 description 12
- 239000010980 sapphire Substances 0.000 description 12
- 230000000875 corresponding effect Effects 0.000 description 11
- 238000005286 illumination Methods 0.000 description 11
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- 238000003860 storage Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 230000010287 polarization Effects 0.000 description 5
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- 238000000879 optical micrograph Methods 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
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- 238000005520 cutting process Methods 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The invention provides a kind of laser processing device, the processing method of machined object and the dividing method of machined object.This laser processing device can suppress the formation of processing trace and can form the segmentation starting point of the segmentation more positively realizing machined object.Possesses the light source sending pulse laser, and the laser processing device of the mounting portion loading machined object also possesses stress applying mechanism, this stress applying mechanism utilizes bend at 3 and applies power to the machined object placed by mounting portion, thus to the processing object position effect tensile stress of machined object, to the machined object placed by mounting portion, utilize stress applying mechanism and to processing object position effect tensile stress state under, in the mode of irradiated area discrete formation on machined surface of the constituent parts pulsed light of pulse laser, mounting portion is moved, and by pulsed laser irradiation in machined object, riving or splitting of machined object is produced successively each other thus in irradiated area, the starting point for splitting is formed whereby on machined object.
Description
Technical field
The present invention relates to and a kind ofly irradiate laser and the laser processing that machined object is processed and the laser processing device using this laser processing.
Background technology
As irradiated with pulse laser to the technology (being also only called Laser Processing or laser processing technology below) that machined object is processed, known existed various (such as with reference to patent document 1 to patent document 4) already.
Content disclosed in patent document 1, when being a kind of segmentation machined object channel mould, utilizes laser ablation along the groove (disconnection groove) of segmentation preset lines Formation cross-section V-shaped, and with the gimmick that this groove is starting point and segmented mold.On the other hand, content disclosed in patent document 2, a kind of the segmentation preset lines of the laser of defocus condition along machined object (divided body) to be irradiated, and produce the crystalline state cross section substantially V-shaped more defeated and dispersed than surrounding in irradiated area melt upgrading region (affected zone), and with this lowest point of melting upgrading region for starting point and split the gimmick of machined object.
When using technology disclosed in patent document 1 and patent document 2 and form segmentation starting point, in order to carry out segmentation below well, namely the scanning direction that important part is along laser is split preset lines direction and forms the uniform V-shaped cross section of shape (slot cross-section or affected zone cross section).As this method of reply, such as, have in the mode repeated before and after the irradiated area (light beam spot) of the laser of every 1 pulse, control the irradiation of laser.
Such as, the most basic parameter repetition rate (unit kHz) of Laser Processing is set to R, when sweep speed (unit mm/sec) is set to V, both ratio V/R become the Center Gap of light beam spot, in the technology disclosed in patent document 1 and patent document 2, in order to make light beam spot overlap each other, and carry out irradiation and the scanning of laser with the condition that V/R is less than 1 μm.
In addition, Patent Document 3 discloses following aspect: the substrate inside in surface with lamination portion makes focal point aim at and irradiate laser, forms upgrading region thus, and this upgrading region is set to cut-out starting point in substrate inside.
And, Patent Document 4 discloses following aspect: the repeatedly laser scanning relative to 1 defiber, be formed at continuous print groove portion and upgrading portion and discontinuous inner upgrading portion on defiber direction on defiber direction up and down at depth direction.
On the other hand, Patent Document 5 discloses a kind of pulsewidth that uses for the process technology of the ultra-short pulse laser of psec level, and disclose following aspect: by adjusting the focal point position of pulse laser, form the small molten trace clustered from the small be full of cracks of position, top layer throughout surface of machined object (plate body), thus form the easily separated region of wire be formed by connecting by described multiple molten trace.
[look-ahead technique document]
[patent document]
Patent document 1: Japanese Patent Laid-Open 2004-9139 publication
Patent document 2: No. 2006/062017th, International Publication
Patent document 3: Japanese Patent Laid-Open 2007-83309 publication
Patent document 4: Japanese Patent Laid-Open 2008-98465 publication
Patent document 5: Japanese Patent Laid-Open 2005-271563 publication
Summary of the invention
[inventing problem to be solved]
Carried out the gimmick split by decoupler after utilizing laser to form segmentation starting point, compared with ruling with the mechanical cutting method used and diamond in the past, more favourable in automaticity high speed stability high precision.
But, by when gimmick utilizes laser to form segmentation starting point in the past, inevitably so-called processing trace (Laser Processing trace) will be formed in the part of irradiating laser.So-called processing trace, refers to the affected zone that after irradiating laser, material or structure change compared with pre-irradiation.The formation of processing trace can bring baneful influence to the characteristic etc. of each machined object (split tablet) through segmentation usually, therefore preferably suppresses as far as possible.
Such as, by such as Laser Processing in the past disclosed in patent document 2, by sapphire etc., will there is hard fragility and the substrate of optically transparent material formed the machined object of the light emitting element configuration such as LED structure, with the marginal portion of the light-emitting component of chip unit gained (being subject to sharp light-struck part during segmentation), about forming width number μm continuously, degree of depth number μm ~ the processing trace of about tens of μm.This processing trace can absorb the light that light-emitting component inside produces, and there is the problem making the light of element plunder out efficiency reduction.When using the light emitting element configuration of the high sapphire substrate of refractive index, this problem especially shows.
Inventor of the present invention finds after repeatedly studying with keen determination: irradiate laser to machined object and form segmentation starting point, by utilizing the riving property of this machined object or fissility, can suppress the formation of processing trace aptly.In addition, find that this processing is comparatively suitable when using the laser of ultrashort pulse.
In patent document 1 to patent document 5, about utilize the riving property of machined object or fissility and formed segmentation starting point aspect, do not carry out any open.
And after using laser to form segmentation starting point on the other hand, with in the processing procedure of chip unit machined object, the fore-end being preferably segmentation starting point arrives the position dark as far as possible of machined object, so can improve segmentation certainty.This situation is also identical when using the laser of ultrashort pulse.
The present invention is in view of described Study on Problems forms, and its object is to provide a kind of and suppresses to process trace formation and can form the processing method of the divided body of the segmentation starting point more positively realizing machined object segmentation and use the laser processing device of this processing method.
[technological means of dealing with problems]
In order to solve described problem, the invention of the 1st technical scheme is a kind of laser processing device, it possesses the light source sending pulse laser, and the mounting portion of mounting machined object, it is characterized in that: also possess stress applying mechanism, utilize bend at 3 and power is applied to the described machined object placed by described mounting portion, thus to the processing object position effect tensile stress of described machined object, at the described machined object loaded described mounting portion, utilize described stress applying mechanism under the state of described processing object position effect tensile stress, in the mode of irradiated area discrete formation on described machined surface of the constituent parts pulsed light of described pulse laser, described mounting portion is moved, and by described pulsed laser irradiation in described machined object, riving or splitting of machined object is produced successively each other thus in described irradiated area, the starting point for splitting is formed whereby on described machined object.
The invention of the 2nd technical scheme is the laser processing device according to the 1st technical scheme, it is characterized in that: the ultrashort pulse light of described pulse laser to be pulsewidth be psec level.
The invention of the 3rd technical scheme is the laser processing device according to the 1st or 2 technical schemes, it is characterized in that: described stress applying mechanism possesses a pair constraint mechanism and pressing mechanism, described a pair constraint mechanism is arranged in the mode separated above described processing object position, and retrain described machined object from described machined surface side, described pressing mechanism abuts from the opposition side of described machined surface, and presses described machined object.
The invention of the 4th technical scheme is the laser processing device according to the 3rd technical scheme, it is characterized in that: described pressing mechanism is formed as tabular, by making the leading section of described pressing mechanism generally perpendicularly abut relative to described machined surface, and press described machined object.
The invention of the 5th technical scheme is the laser processing device according to the 4th technical scheme, it is characterized in that: the described leading section of described pressing mechanism is formed as cross section and looks trapezoidal shape.
The invention of the 6th technical scheme is the laser processing device according to the 1st or 2 technical schemes, it is characterized in that: formed when being used for the starting point of described segmentation on described machined object, by least 2 irradiated areas utilizing different described unit pulse light to be formed with in described machined object rive or on easy direction of splitting, adjacent mode is formed.
The invention of the 7th technical scheme is the laser processing device according to the 6th technical scheme, it is characterized in that: the formation of described at least 2 irradiated areas is in riving described in different 2 of described machined object or hocketing in easy direction of splitting.
The invention of the 8th technical scheme is the laser processing device according to the 6th technical scheme, it is characterized in that: described irradiated area entirety is riving or the easy direction and being formed of splitting along described machined object.
The invention of the 9th technical scheme is the laser processing device according to the 1st or 2 technical schemes, it is characterized in that: when forming the starting point being used for described segmentation on described machined object, described irradiated area is formed on the direction that 2 the different easy directions of riving or split relative to described machined object are of equal value.
The invention of the 10th technical scheme is the laser processing device according to the 1st or 2 technical schemes, it is characterized in that: utilize described constituent parts pulsed light irradiate described illuminated position time impact or stress, and between the illuminated position of the described unit pulse light just irradiated before or simultaneously irradiate, rive described in generation or described in split.
The invention of the 11st technical scheme is a kind of processing method, and it is used to machined object be formed segmentation starting point, it is characterized in that comprising: mounting step, is placed in mounting portion by machined object; And irradiating step, 3 bending applying power are being utilized to the described machined object placed by described mounting portion, under state thus to the processing object position effect tensile stress of described machined object, described pulse laser is being irradiated in described machined object with the irradiated area of constituent parts pulsed light with the mode of discrete formation on the machined surface of described mounting surface subtend, produce riving or splitting of described machined object each other successively in described irradiated area thus, on described machined object, form the starting point for splitting whereby.
The invention of the 12nd technical scheme is the processing method according to the 11st technical scheme, it is characterized in that: the ultrashort pulse light of described pulse laser to be pulsewidth be psec level.
The invention of the 13rd technical scheme is the processing method according to the 11st or 12 technical schemes, it is characterized in that: in described irradiating step, utilize and be positioned at partitions each other a pair confining part that the mode above described processing object position arranges, described machined object is retrained from described machined surface side, then pressing mechanism is made to be connected to described machined surface from the opposition side of described machined surface, whereby in described processing object position effect tensile stress.
The invention of the 14th technical scheme is the processing method according to the 13rd technical scheme, it is characterized in that: described pressing mechanism is formed as tabular, and in described irradiating step, by making the leading section of described pressing mechanism generally perpendicularly abut relative to described machined surface, and press described machined object.
The invention of the 15th technical scheme is the processing method according to the 14th technical scheme, it is characterized in that: the described leading section of described pressing mechanism is formed as cross section and looks trapezoidal shape.
The invention of the 16th technical scheme is the processing method according to the 11st or 12 technical schemes, it is characterized in that: at least 2 irradiated areas utilizing different described unit pulse light to be formed be with described machined object rive or on easy direction of splitting, adjacent mode is formed.
The invention of the 17th technical scheme is the processing method according to the 16th technical scheme, it is characterized in that: the formation of described at least 2 irradiated areas is rived described in different 2 of described machined object or hockets in easy direction of splitting.
The invention of the 18th technical scheme is the processing method according to the 16th technical scheme, it is characterized in that: described irradiated area entirety is riving or the easy direction and being formed of splitting along described machined object.
The invention of the 19th technical scheme is the processing method according to the 11st or 12 technical schemes, it is characterized in that: described irradiated area is formed on the direction that 2 the different easy directions of riving or split relative to described machined object are of equal value.
The invention of the 20th technical scheme is the processing method according to the 11st or 12 technical schemes, it is characterized in that: make the outgoing source of described pulse laser and described machined object relative movement, and the exit direction of described pulse laser is changed in the face periodically vertical with this relative movement direction, on described machined object, form the multiple described irradiated area meeting zigzag configuration relation thus.
The invention of the 21st technical scheme is the processing method according to the 11st or 12 technical schemes, it is characterized in that: make multiple outgoing source of described pulse laser and described machined object relative movement, and the irradiation timing cycles of described multiple outgoing source described unit pulse light is separately changed, on described machined object, form the multiple described irradiated area meeting zigzag configuration relation thus.
The invention of the 22nd technical scheme is the processing method according to the 11st or 12 technical schemes, it is characterized in that: in described irradiating step, impact when utilizing described constituent parts pulsed light to irradiate described illuminated position or stress, and rive described in producing between the illuminated position of the described unit pulse light just irradiated before or simultaneously irradiate or described in split.
The invention of the 23rd technical scheme is a kind of dividing method of machined object, it is characterized in that comprising: mounting step, is placed in mounting portion by machined object; Irradiating step, 3 bending applying power are being utilized to the described machined object placed by described mounting portion, under state thus to the processing object position effect tensile stress of described machined object, described pulse laser is being irradiated in described machined object with the irradiated area of constituent parts pulsed light with the mode of discrete formation on the machined surface of described mounting surface subtend, produce riving or splitting of described machined object each other successively in described irradiated area thus, on described machined object, form the starting point for splitting whereby; And segmentation step, to form the machined object splitting starting point by utilizing described irradiating step, being split along described segmentation starting point.
[effect of invention]
Invention according to the 1 to 23 technical scheme, can dispersing etc. of the formation of the processing trace caused that goes bad because of machined object or machined object be controlled as local, on the other hand by producing riving or splitting of machined object energetically, compared with the past can formation on machined object very at high speed splits starting point.And by acting on tensile stress to processing object position, the energy that can contribute to pulse laser more effectively forms segmentation starting point, and the leading section of segmentation starting point therefore can be made to arrive more position, deep.
Especially the invention according to the 7th technical scheme, the 9th technical scheme, the 17th technical scheme and the 19 to 21 technical scheme, can the near surface of segmentation cross section when split machined object along the segmentation starting point formed and machined object, to utilize adjacent to rive or parting plane forms concavo-convex mode each other and forms segmentation starting point.When machined object is when having hard fragility by sapphire etc. and the substrate of optically transparent material is formed the light emitting element configuration such as LED structure, by forming this kind of concaveconvex shape on the segmentation cross section of substrate, the luminous efficiency of light-emitting component can be improved.
Accompanying drawing explanation
Fig. 1 (a) ~ (e) is the key diagram of the processing of the 1st processing graphic pattern.
Fig. 2 is the optical microscope image utilizing the split/split processing of the 1st processing graphic pattern and form the surface of the machined object of segmentation starting point.
Fig. 3 be utilize the processing of the 1st processing graphic pattern and formed segmentation starting point sapphire C face substrate along this segmentation starting point segmentation after, surface (c face) to cross section SEM image.
Fig. 4 (a) ~ (e) is the schematic diagram of the processing aspect representing the 2nd processing graphic pattern.
Fig. 5 is the optical microscope image utilizing the split/split processing of the 2nd processing graphic pattern and form the surface of the machined object of segmentation starting point.
Fig. 6 be utilize the processing of the 2nd processing graphic pattern and formed segmentation starting point sapphire c face substrate along this segmentation starting point segmentation after, surface (c face) to cross section SEM image.
Fig. 7 (a), (b) are the schematic diagrames of the processing aspect representing the 3rd processing graphic pattern.
Fig. 8 is the figure of the relation representing the processing preset lines of the 3rd processing graphic pattern and the formation precalculated position of irradiated area.
Fig. 9 is the schematic diagram that outline represents the formation of the laser processing device 50 of embodiments of the present invention.
Figure 10 is the schematic diagram of the formation of exemplary optical systems 5.
Figure 11 is the schematic diagram of the formation representing light path set mechanism 5c.
Figure 12 is the side view that outline represents the mounting portion 7 that the laser processing device 50 of present embodiment possesses and travel mechanism 7m.
Figure 13 is the side view that outline represents the mounting portion 7 that the laser processing device 50 of present embodiment possesses and travel mechanism 7m.
Figure 14 is the side cross-sectional view of the situation representing laser processing device 50 pairs of machined surface effect tensile stresses.
Figure 15 is the top view of the situation representing laser processing device 50 pairs of machined surface effect tensile stresses.
Figure 16 is the side cross-sectional view of situation when representing that laser processing device 50 changes processing object position.
[explanation of symbol]
1 controller
2 control parts
3 storage parts
5 optical systems
5c light path set mechanism
7 mounting portions
7a supporting member
7b elevating mechanism
7m travel mechanism
10 machined objects
10a (machined object) machined surface
10e (machined object) end edge portion
50 laser processing devices
51 beam expander
52 objective systems
53 half-reflecting mirrors
5a, 54 eyeglasses
55 light path selection mechanisms
61 restraining plates
63 scraper plates
63e (scraper plate) leading section
71x axle travel mechanism
72y axle travel mechanism
73 θ rotating mechanisms
C1 ~ C3, C11a, C11b, C21 ~ C24 rive/parting plane
D (mounting portion) moving direction
L processes preset lines
LB, LB0, LB1, LB2 laser
RE, RE1 ~ RE4, RE11 ~ RE15, RE21 ~ RE25 irradiated area
SL LASER Light Source
SW optical switch
Detailed description of the invention
The principle > of < processing
First, the process principle realized in embodiment of the present invention shown below is described.The processing carried out in the present invention in brief, be scanning impulse laser (being also only called laser below) and irradiated the upper surface (machined surface) in machined object, riving or splitting of machined object is produced successively thus, the starting point (segmentation starting point) formed for splitting as each splitting surface of upper formation or the continuous surface of parting plane between the irradiated area of each pulse.
Further, in the present embodiment, what is called is split the phenomenon referring to and along the crystal plane beyond splitting surface, machined object is ruptured roughly regularly, and corresponding crystal plane is called parting plane.Further, except the riving or split of the complete microphenomenon along crystal plane, the situation that the be full of cracks that also there is Macroscopic produces along roughly fixing crystal orientation.Different according to material, also have and mainly only produce the material of any one in riving, split or chap, numerous and diverse below in order to avoid explanation, do not distinguish and rive, split and chap and be only referred to as and rive/split.In addition, there is the situation processing of this kind of aspect being also only called split/split processing etc.
Below, take machined object as the monocrystalline material of hexagonal crystal and each direction of principal axis of its a1 axle, a2 axle and a3 axle is rive/the split situation in easy direction is described for example.Such as, c surface sapphire substrate etc. is had accordingly.The a1 axle of hexagonal crystal, a2 axle, a3 axle are the angle of 120 ° each other and are positioned at symmetrical position in c face.In processing of the present invention, different from the relation in the direction (processing predetermined direction) of processing preset lines according to the direction of described multiaxis, and there is some patterns.Below, described multiple pattern is described.Further, below the laser by each pulse irradiation is called unit pulse light.
< the 1st processing graphic pattern >
1st processing graphic pattern be a1 direction of principal axis, a2 direction of principal axis, a3 axial any one parallel with processing preset lines time the aspect of split/split processing.More briefly, be rive/split easy direction with processing preset lines direction consistent time processing aspect.
Fig. 1 is the schematic diagram of the processing aspect representing the 1st processing graphic pattern.Exemplified with the situation that a1 direction of principal axis is parallel with processing preset lines L in Fig. 1.Fig. 1 (a) represents a1 direction of principal axis, a2 direction of principal axis, a3 direction of principal axis and the position relation processing preset lines L in the case.Fig. 1 (b) represents that the state of the irradiated area RE1 in processing preset lines L end is penetrated in the unit pulse illumination of the 1st pulse of laser.
As a rule, the irradiation of unit pulse light can give high-energy to the atomic zonule of machined object, thus this irradiation can on plane of illumination with (laser) irradiated area of unit pulse light quite or the rotten melting producing material in the scope wider than irradiated area evaporate and remove.
But, if the irradiation time of unit pulse light and width sets earth polar short, then less than the spot size of laser and be present in the material in the substantial middle region of irradiated area RE1, can disperse to the direction vertical with plane of illumination because obtaining kinergety from the laser irradiated or go bad, on the other hand, the impact produced because of unit of exposure pulsed light headed by the counter-force produced to disperse with this or stress, can act on the surrounding of this irradiated area, especially rive/split easy direction and a1 direction of principal axis, a2 direction of principal axis, a3 direction of principal axis.Thus, produce along respective direction, though keep in touch state part in appearance to produce small riving or split, or do not reach the state that rive or split degree and inside exist thermal distoftion.In other words, the irradiation of the unit pulse light of alternatively ultrashort pulse plays a role towards the driving force of overlooking the weak intensity part of substantially linear in easy direction of riving/split as being used for being formed.
In Fig. 1 (b), schematically show the weak intensity part W1 in+a1 direction in the weak intensity part that described easy direction of respectively riving/split is formed, that coincide with the bearing of trend of processing preset lines L with dotted arrow.
Then, as shown in Fig. 1 (c), if irradiate the unit pulse light of the 2nd pulse of laser, with the position formation irradiated area RE2 of irradiated area RE1 at a distance of specific range on processing preset lines L, then in the same manner as the 1st pulse, this 2nd pulse also forms the weak intensity part along easy direction of riving/split.Such as ,-a1 direction forms weak intensity part W2a ,+a1 direction is formed weak intensity part W2b.
But carve at this moment, the weak intensity part W1 formed because of the irradiation of the unit pulse light of the 1st pulse is present on the bearing of trend of weak intensity part W2a.That is, the bearing of trend of weak intensity part W2a becomes the utilization energy less than other positions and can produce the position of riving or splitting.Therefore, in fact, if irradiate the unit pulse light of the 2nd pulse, then the impact at this moment produced or stress propagation are to riving/splitting easy direction and the weak intensity part that exists before, from weak intensity part W2a to weak intensity part W1, rive completely or split roughly irradiating to produce instantaneously.Thus ,/parting plane the C1 that rives shown in Fig. 1 (d) is formed.Further, rive/parting plane C1 overlooks the degree of depth that vertical direction can be formed as several μm ~ about tens of μm machined object graphic.And, as described below, riving/parting plane C1 on be subject to thump or stress and produce the slip of crystal plane, thus produce fluctuating in the depth direction.
And, as shown in Fig. 1 (e), afterwards by scanning laser, successively to irradiated area RE1, RE2, RE3, RE4 along processing preset lines L ... unit of exposure pulsed light, accordingly, is formed successively and rives/parting plane C2, C3 ...Be form/parting plane of riving continuously in this aspect, be called the split/split processing of the 1st processing graphic pattern.
That is, in the 1st processing graphic pattern, formed between multiple irradiated area of discrete existence and described multiple irradiated area along processing preset lines L rive/parting plane as a complete unit, become segmentation starting point when splitting machined object along processing preset lines L.After forming this segmentation starting point, particular jig or device is used to split, whereby can with the aspect segmentation machined object roughly along processing preset lines L.
Further, in order to realize this kind of split/split processing, need irradiation pulsewidth short and the laser of short pulse.Specifically, the laser that pulsewidth must be used to be below 100psec.Such as, the laser with the pulsewidth of about 1psec ~ 50psec is preferably used.
On the other hand, just can in the scope that the irradiation spacing (Center Gap of illuminated point) of unit pulse light is defined in 4 μm ~ 50 μm.If irradiate spacing to be greater than this scope, the formation of weak intensity part in easy direction of then riving/split does not catch up with/the formation of parting plane of riving sometimes, therefore with regard to positively being formed by riving as above/viewpoint of segmentation starting point that forms of parting plane, not preferably.Further, with regard to sweep speed, working (machining) efficiency, product quality aspect, irradiate spacing and be the bigger the better, but in order to more positively form/parting plane of riving, it is desirable to the scope being defined in 4 μm ~ 30 μm, more preferably 4 μm ~ about 15 μm.
Below when the repetition rate of laser is R (kHz), time every 1/R (msec), send unit pulse light from LASER Light Source.When laser is mobile with relative velocity V (mm/sec) relative to machined object, irradiating separation delta (μm) is by Δ=V/R regulation.Therefore, the scan velocity V of laser and repetition rate are that the mode being about several μm with Δ specifies.Such as, preferably scan velocity V is about 50mm/sec ~ 3000mm/sec, repetition rate R is 1kHz ~ 200kHz, especially about 10kHz ~ 200kHz.As long as the occurrence of V or R is considered the material of machined object or absorptivity, thermal conductivity, fusing point etc. and suitably specifies just can.
Laser continuous print irradiates with the beam diameter of about 1 μm ~ about 10 μm.Now, the peak power density of the irradiation of laser is about 0.1TW/cm
2~ number 10TW/cm
2.
In addition, the irradiation energy (pulse energy) of laser suitable regulation in the scope of 0.1 μ J ~ 50 μ J just can.
Fig. 2 is the optical microscope image utilizing the split/split processing of the 1st processing graphic pattern and form the surface of the machined object of segmentation starting point.Specifically, represent and sapphire c face substrate is set to machined object, a1 direction of principal axis be set to the bearing of trend of processing preset lines L on its c face and form the result of the processing of illuminated point with 7 μm of spaced discrete.The machined object of the result signal reality shown in Fig. 2 is processed by described mechanism.
And Fig. 3 is the sapphire c face substrate forming segmentation starting point by utilizing the processing of the 1st processing graphic pattern, SEM (SEM) image in surface (c face) to cross section after the segmentation of this segmentation starting point.Further, the boundary member in surface and cross section is represented by dotted lines in Fig. 3.
Observe in Fig. 3 exist roughly at equal intervals in the scope of 10 μm of front and back with respective surfaces, have from machined object surface to the elongated triangular shape of the length direction of inside or needle-like region, be directly rotten or produce the region (hereinafter referred to as direct affected zone) of the phenomenons such as removing of dispersing by the irradiation of unit pulse light.And, exist between described multiple direct affected zone, observe drawing and overlook the following micron pitch of muscle shape part left and right directions with length direction to overlook above-below direction region multiple continuously at drawing be/parting plane of riving.The more below of described multiple direct affected zone and riving/parting plane is the divisional plane formed because of segmentation.
Formed rive/region of parting plane is not subject to sharp light-struck region, therefore in the processing of described 1st processing graphic pattern, the direct affected zone carrying out discrete formation becomes processing trace.And, about the size of the machined surface of direct affected zone is only hundreds of nm ~ 1 μm.That is, by carrying out the processing of the 1st processing graphic pattern, the segmentation starting point that suitably can suppress the formation of processing trace compared with the past can be formed.
Further, the muscle shape part observed in SEM image be actually rive/parting plane on the minute asperities with 0.1 μm ~ about 1 μm difference of height that formed.This is concavo-convex is when carrying out split/split processing as object using such as sapphire hard brittle inorganic compound, because of the irradiation of unit pulse light to machined object effect thump or stress, and slides because specific crystal plane produces and is formed.
Although this kind of micro concavo-convex exists, but judge that surface is divided into border roughly orthogonal with cross section with wave line part according to Fig. 3, as long as therefore micro concavo-convex is positioned at the permissible range of mismachining tolerance, then can form segmentation starting point by the 1st processing graphic pattern, along this segmentation starting point segmentation machined object, whereby machined object is generally perpendicularly split relative to its surface.
Further, as described below, also there is actively this micro concavo-convex of formation is good situation.Such as, by the processing of the 1st processing graphic pattern, the effect that the light being shown acquisition by the processing of following 2nd processing graphic pattern plunders out efficiency raising also can be obtained to a certain extent.
< the 2nd processing graphic pattern >
2nd processing graphic pattern be any one in a1 direction of principal axis, a2 direction of principal axis, a3 direction of principal axis vertical with processing preset lines time the aspect of split/split processing.Further, the condition of the laser of the 2nd processing graphic pattern use is identical with the 1st processing graphic pattern.More briefly, be relative to different 2 easy directions of riving/split be direction (becoming the direction of the symmetry axis in 2 easy directions of riving/split) of equal value become the direction of processing preset lines time processing aspect.
Fig. 4 is the schematic diagram of the processing aspect representing the 2nd processing graphic pattern.Exemplified with the situation of a1 direction of principal axis with the L-orthogonal of processing preset lines in Fig. 4.Fig. 4 (a) represents a1 direction of principal axis, a2 direction of principal axis, a3 direction of principal axis and the position relation processing preset lines L now.Fig. 4 (b) represents that the state of the irradiated area RE11 of the end in processing preset lines L is penetrated in the unit pulse illumination of the 1st pulse of laser.
2nd processing graphic pattern is also the unit pulse light by irradiating ultrashort pulse, forms weak intensity part in the same manner as the 1st processing graphic pattern.In Fig. 4 (b), schematically illustrate with dotted arrow in the weak intensity part that described easy direction of respectively riving/split is formed, close to weak intensity part W11a, the W12a on the-a2 direction of bearing of trend of processing preset lines L and+a3 direction.
And, as shown in Fig. 4 (c), if irradiate the unit pulse light of the 2nd pulse of laser, upper at formation irradiated area, the position RE12 with irradiated area RE11 apart specific range in processing preset lines L, then in the same manner as the 1st pulse, this 2nd pulse also forms the weak intensity part along easy direction of riving/split.Such as ,-a3 direction forms weak intensity part W11b ,+a2 direction is formed weak intensity part W12b ,+a3 direction is formed weak intensity part W12c ,-a2 direction is formed weak intensity part W11c.
This situation is in the same manner as the 1st processing graphic pattern, the weak intensity part W11a, the W12a that are formed because of the irradiation of the unit pulse light of the 1st pulse are present on the bearing of trend of weak intensity part W11b, W12b respectively, if in fact irradiate the unit pulse light of the 2nd pulse, then the impact at this moment produced or stress can be propagated in rive/split easy direction and the weak intensity part that exists before.That is, as shown in Fig. 4 (d), formed and rive/parting plane C11a, C11b.Further, in the case, rive/parting plane C11a, C11b overlook the degree of depth that vertical direction can be formed as several μm ~ about tens of μm at the drawing of machined object.
Then, as shown in Fig. 4 (e), laser is scanned along processing preset lines L, to irradiated area RE11, RE12, RE13, RE14 ... unit of exposure pulsed light successively, then because of the impact that at this moment produces or stress, form drawing successively along processing preset lines L and overlook riving/parting plane C11a and C11b, C12a and C12b, C13a and C13b, C14a and C14b of linearity ...
Thus, realize riving/parting plane relative to processing preset lines L the state of symmetry.In 2nd processing graphic pattern, along processing preset lines L discrete existence multiple irradiated areas, with described multiple zigzag exists rive/parting plane as a complete unit, become along segmentation starting point during processing preset lines L segmentation machined object.
Fig. 5 is the optical microscope image utilizing the split/split processing of the 2nd processing graphic pattern and form the surface of the machined object of segmentation starting point.Specifically, represent and sapphire C face substrate is set to machined object, and the direction orthogonal with a1 direction of principal axis is set to the bearing of trend processing preset lines L on its C face and the processing forming illuminated point with 7 μm of spaced discrete.According to Fig. 5, actual machined object, also in the same manner as the schematic diagram of Fig. 4 (e), confirms to rive/parting plane depending on jagged (Z-shaped) in surface.The machined object that this result hint is actual is processed by described mechanism.
In addition, Fig. 6 be the processing by the 2nd processing graphic pattern is formed segmentation starting point sapphire C face substrate along this segmentation starting point segmentation after, surface (c face) to cross section SEM image.Further, the boundary member in surface and cross section is represented by dotted lines in Fig. 6.
According to Fig. 6, confirm the cross section of machined object after singulation with surface in the scope of 10 μm of front and back, the cross section of machined object has the zigzag schematically shown with Fig. 4 (e) and configures corresponding concavo-convex.Forming this concavo-convex is/parting plane of riving.Further, the concavo-convex spacing in Fig. 6 is about 5 μm.In the same manner as the situation of the processing of the 1st processing graphic pattern ,/parting plane uneven of riving, but slide because the irradiation of unit pulse light causes specific crystal plane to produce, and produce the concavo-convex of time micron pitch with this.
And what extend from surface portion to depth direction corresponding to the position of this concavo-convex protuberance is the cross section of direct affected zone.Compared with the direct affected zone formed with the machining of the 1st processing graphic pattern shown in Fig. 3, its shape is uneven.And the more below of described multiple direct affected zone and riving/parting plane is the divisional plane formed because of segmentation.
The situation of the 2nd processing graphic pattern is identical with the 1st processing graphic pattern, and the direct affected zone of only discrete formation becomes processing trace.And the size of the machined surface of direct affected zone is only hundreds of nm ~ 2 μm degree.That is, that carries out the 2nd processing graphic pattern adds man-hour, and the formation of starting point is better split in the formation that also can realize processing trace than ever.
When the processing of the 2nd processing graphic pattern, except riving/parting plane on secondary micron pitch concavo-convex that formed, also adjacent riving/parting plane is each other for the spacing of about several μm is formed concavo-convex.Form the aspect with the cross section of this kind of concaveconvex shape, by sapphire etc., there is hard fragility and on the substrate that forms of optically transparent material, the machined object of the light emitting element configuration such as LED structure will formed with effective when chip (split tablet) unit.When light-emitting component, utilize Laser Processing and the position of the processing trace formed on substrate, the light that light-emitting component inside produces can be absorbed, make the light of element plunder out efficiency to reduce, but to have a mind to be formed shown in Fig. 6 like this on substrate processing cross section by the processing carrying out the 2nd processing graphic pattern concavo-convex, the total reflectivity of relevant position declines, and light-emitting component realizes higher light and plunders out efficiency.
< the 3rd processing graphic pattern >
3rd processing graphic pattern and the something in common of the 2nd processing graphic pattern are to use the laser of ultrashort pulse and a1 direction of principal axis, a2 direction of principal axis, a3 axial any one vertical with processing preset lines (direction being equivalence relative to different 2 easy directions of riving/split becomes the direction processing preset lines), and are the irradiation aspect of laser with the difference of the 2nd processing graphic pattern.
Fig. 7 is the schematic diagram of the processing aspect representing the 3rd processing graphic pattern.Exemplified with the situation of a1 direction of principal axis with the L-orthogonal of processing preset lines in Fig. 7.Fig. 7 (a) represents a1 direction of principal axis, a2 direction of principal axis, a3 direction of principal axis and the position relation processing preset lines L now.
In described 2nd processing graphic pattern, be according to the position relation shown identical with Fig. 7 (a), laser is scanned point-blank along the direction (being the direction of equivalence relative to a2 direction of principal axis and a3 direction of principal axis) of bearing of trend, i.e. the a2 direction of principal axis and the axial center of a3 of processing preset lines L.In the 3rd processing graphic pattern, replace in this, as shown in Fig. 7 (b), be with each irradiated area with alternately along with the mode clamping the aspect zigzag (Z-shaped) of process 2 easy directions of riving/split of preset lines L and formed, irradiate the unit pulse light of each irradiated area of formation.If the situation of Fig. 7, then alternately form irradiated area RE21, RE22, RE23, RE24, RE25 along-a2 direction and+a3 direction ...
During with this aspect unit of exposure pulsed light, also in the same manner as the 1st and the 2nd processing graphic pattern, between irradiated area, form/parting plane of riving with the irradiation of constituent parts pulsed light.If the situation shown in Fig. 7 (b), by forming irradiated area RE21, RE22, RE23, RE24, RE25 successively ..., and formed successively and rive/parting plane C21, C22, C23, C24 ...
Thus, in 3rd processing graphic pattern, with the riving of being formed between multiple irradiated area of discrete existence and each irradiated area of processing that preset lines L is axle and zigzag configuration/parting plane as a complete unit, segmentation starting point when splitting machined object along processing preset lines L is become.
And, when splitting along corresponding segmentation starting point is actual, in the same manner as the 2nd processing graphic pattern, the cross section of machined object after singulation with surface in the scope of 10 μm of front and back, form/several μm of spacing causing of parting plane concavo-convex of riving.And, respectively rive/parting plane on, in the same manner as the situation of the 1st and the 2nd processing graphic pattern, produce in specific crystal plane because of the irradiation of unit pulse light, and produce the concavo-convex of time micron pitch with this.In addition, the formation aspect of direct affected zone is also identical with the 2nd processing graphic pattern.That is, in the 3rd processing graphic pattern, also can be and the 2nd processing graphic pattern same degree by the formation suppression of processing trace.
Therefore, when the processing of this kind the 3rd processing graphic pattern, in the same manner as the processing of the 2nd pattern, except riving/parting plane on formed secondary micron pitch concavo-convex except, also by riving/parting plane forms the concavo-convex of the spacing of about several μm each other, therefore improve light as above with regard to gained light-emitting component when being object with light-emitting component and plunder out with regard to the viewpoint of efficiency, the processing of the 3rd processing graphic pattern is preferably.
Also have, different according to the kind of machined object, rive to more positively produce/split, also can position on arbitrary processing preset lines L and the irradiated area RE21 of Fig. 7 (b) and mid point, the mid point of irradiated area RE22 and irradiated area RE23, the mid point of irradiated area RE23 and irradiated area RE24, the mid point of irradiated area RE24 and illuminated neck city RE25 of irradiated area RE22 ... upper formation irradiated area.
But the allocation position of the irradiated area of the 3rd processing graphic pattern is that part is along riving/splitting easy direction.With as above processing the point midway on preset lines L, also to form the situation of irradiated area identical.That is, the common part of the 3rd processing graphic pattern and the 1st processing graphic pattern can be, at least 2 irradiated area adjacent formation on the easy direction of riving/split of machined object.Therefore, in other words, the 3rd processing graphic pattern also can be thought the direction of periodically-varied scanning laser and carry out the processing of the 1st processing graphic pattern.
In addition, when the 1st and the 2nd processing graphic pattern, irradiated area is located on a straight line, therefore the outgoing source of laser is moved in a straight line along processing preset lines, and whenever arrive specific form object's position time unit of exposure pulsed light and formed irradiated area just can, it is the most effective that this forms aspect.But, when the 3rd processing graphic pattern, irradiated area is not located on a straight line but is formed as zigzag (Z-shaped), therefore not only can utilize the gimmick of outgoing source in fact zigzag (Z-shaped) movement making laser, various gimmick can also be utilized to form irradiated area.Also have, in the present embodiment, the movement in so-called outgoing source refers to the relative movement in machined object and outgoing source, not only comprise machined object to fix and the situation of outgoing source movement, also comprise outgoing source fix and machined object move (be actually mounting machined object mounting portion move) aspect.
Such as, make outgoing source and mounting portion and process preset lines constant speed relative movement abreast, and make the exit direction of laser in the face periodically change etc. vertical with processing preset lines, also can form irradiated area with the aspect meeting zigzag configuration relation as above thus.
Or, make the constant speed relative movement abreast of multiple outgoing sources, and the irradiation timing cycles of the unit pulse light in each outgoing source changed, also can form irradiated area with the aspect meeting zigzag configuration relation as above thus.
Fig. 8 represents the relation in the formation precalculated position of processing preset lines in described 2 situations and irradiated area.In arbitrary situation, as shown in Figure 8, by irradiated area RE21, RE22, RE23, RE24, RE25 ... formation precalculated position P21, P22, P23, P24, P25 ... just parallel with processing preset lines L straight line L α, L β alternately set, along formation precalculated position P21, P23, P25 of straight line L α ... irradiated area formation, with along formation precalculated position P22, P24 of straight line L β ... the formation of irradiated area, also can regard as and carry out side by side simultaneously.
Also have, when making zigzag (Z-shaped) movement of outgoing source, no matter be the outgoing source directly movement making laser, still make the mounting portion of mounting machined object move and make laser relative scanning, the movement of outgoing source or mounting portion is the action simultaneously of two axles.In contrast, the action only making outgoing source or mounting portion and the movement abreast of processing preset lines is an axle action.Therefore, with regard to the high-speed mobile that realizes outgoing source and working (machining) efficiency raising aspect, the latter is preferably.
As shown in above each processing graphic pattern, the split/split processing of carrying out in present embodiment is as being mainly used to give the mechanism producing the impact of riving continuously/splitting or stress and the processing aspect used to machined object using the discrete illumination of unit pulse light.Rotten (namely the processing the formation of trace) of the machined object of irradiated area or disperse that to wait be only locally produce with addendum.There is the split/split processing of the present embodiment of this kind of feature, with by making the irradiation area of unit pulse light overlapping and produce rotten melting continuously or discontinuously evaporate and remove and carry out compared with the processing gimmick in the past of processing, its machine-processed existence difference in essence.
And, to each irradiated area apply instantaneously thump or stress just can, therefore can high-velocity scanning laser irradiating.Specifically, hypervelocity scanning and the High-speed machining of maximum 1000mm/sec can be realized.The process velocity of processing method mostly in the past is most about 200mm/sec, and its difference shows.Certainly, the processing method realized in present embodiment shows raising productivity compared with processing method in the past.
Also have, the split/split processing of present embodiment as described in crystal orientation (orientation in easy direction of riving/split) and the processing preset lines of machined object as each processing graphic pattern meet particular kind of relationship time effective especially, but applicable object is not limited to this, the situation or the machined object that meet any relation both principle also goes for are multicrystal situation.In these situations, the direction of riving/splitting is produced non-essential fixing relative to processing preset lines, therefore segmentation starting point can produce irregular concavo-convex, by suitably setting the illuminate condition of the interval of irradiated area or the laser headed by pulsewidth, and carry out the processing of no problem in this concavo-convex practicality controlled in the permissible range of mismachining tolerance.
The summary > of < laser processing device
Secondly, the laser processing device of the processing that can realize described various processing graphic pattern is described.
Fig. 9 is the schematic diagram that outline represents the formation of the laser processing device 50 of present embodiment.Laser processing device 50 mainly possesses laser irradiating part 50A, observation section 50B, in the controller 1 of the various actions (observing action, alignment actions, processing action etc.) of the mounting portion 7 and control laser processing device 50 that in fact load machined object 10.Laser irradiating part 50A possesses LASER Light Source SL and optical system 5, and for irradiating the position of laser to the machined object 10 placed by mounting portion 7, is equivalent to the outgoing source of described laser.Observation section 50B is the position that the surface observation carrying out directly observing this machined object 10 from irradiation laser side (being referred to as surface) and the back side observing this machined object 10 from the mounting side (being referred to as the back side) mounting portion 7 through this mounting portion 7 are observed.
Mounting portion 7 utilizes the travel mechanism 7m of details description and horizontal direction can move between laser irradiating part 50A and observation section 50B.Travel mechanism 7m makes mounting portion 7 move to specific XY2 direction of principal axis in horizontal plane by the effect of not shown driving mechanism.Whereby, the movement etc. of the mounting portion 7 between the movement of the observation place in the movement of the laser irradiating position in laser irradiating part 50A, observation section 50B and laser irradiating part 50A and observation section 50B is realized.Further, for travel mechanism 7m, rotation (θ rotation) action centered by specific rotating shaft in horizontal plane also can be carried out with horizontal drive independently.Detailed description about mounting portion 7 and travel mechanism 7m will hereafter carried out describing.
In addition, surface observation can suitably be switched in laser processing device 50 and the back side is observed.Whereby, can carry out flexibly and promptly corresponding to the material of machined object 10 or the optimal viewing of state.
< mounting portion and travel mechanism >
Figure 12 and Figure 13 is the side view that outline represents the situation of the mounting portion 7 that the laser processing device 50 observing present embodiment from different 2 directions possesses and travel mechanism 7m.Further, in Figure 12 and Figure 13 for convenience's sake, and enclose and the drawing of Figure 12 is overlooked left and right directions be set to x-axis direction, the direction vertical with drawing is set to y-axis direction, drawing is overlooked the xyz coordinate that above-below direction is set to z-axis direction.X-axis direction is equivalent to the scanning direction of laser LB.
Travel mechanism 7m possesses: x-axis travel mechanism 71, has the movable part 71a freely that retreats in the direction of the x axis; Y-axis travel mechanism 72, is configured on movable part 71a, and has the movable part 72a freely that retreats in the y-axis direction; And θ rotating mechanism 73, be configured on movable part 72a, can rotate in horizontal plane.And, this θ rotating mechanism 73 is provided with mounting portion 7.Forming by having this, being placed in the state of mounting portion 7 with machined object 10 in laser processing device 50 and making each travel mechanism action of travel mechanism 7m, machined object 10 can be transported to desired location.Further, the conveyance of the machined object 10 between laser irradiating part 50A and observation section 50B, can be realized by the movable part 72a of y-axis travel mechanism 72.That is, the y-axis direction shown in Figure 12 and Figure 13 is equivalent to the moving direction between the laser irradiating part 50A of Fig. 9 and observation section 50B.
Mounting portion 7 possesses: pair of supporting members 7a, is respectively the component of the elongated shape extended in the y-axis direction; And elevating mechanism 7b, be configured on θ rotating mechanism 73, each support portion 7a is elevated in the z-axis direction.The mode that pair of supporting members 7a is supported by each supporting member 7a with the opposite end edge 10e of only machined object 10, is spaced apart with the specific range of the fitting dimensions with machined object 10 in the direction of the x axis.That is, in present embodiment, so-called machined object 10 is placed in the state of mounting portion 7, refers to the state of the end edge portion 10e loading machined object 10 on each supporting member 7a strictly speaking.
In addition, as shown in FIG. 12 and 13, laser processing device 50 possesses a pair restraining plate 61, close from top relative to the machined surface 10a of machined object 10 of mounting on the supporting member 7a of mounting portion 7, and retrains machined object 10.Restraining plate 61 is supported by the bracket part 62 be fixedly installed on the movable part 71a of x-axis travel mechanism 71.Further, as shown in figure 13, a pair restraining plate 61 is spaced from each other in the y-axis direction, and as irradiated with pulse laser LB, machined object 10 processes the mode that preset lines is positioned at this spaced portions to configure.In other words, a pair restraining plate 61 is that the mode be not positioned in the light path of the laser LB that optical system 5 is irradiated configures.
In laser processing device 50, by making elevating mechanism 7b action, and making the machined surface 10a of the machined object 10 of mounting on supporting member 7a close to the plate face of a pair restraining plate 61, carrying out the processing of pulse laser LB in this case.Whereby, the stable posture of the machined object 10 adding man-hour can be guaranteed.Be preferably, machined object 10 and restraining plate 61 are configured to act on drag between when only utilizing following scraper plate 63 to press machined object 10, or mutually abut with the degree not acting in fact drag.The state continuing at least to make restraining plate 61 be crimped on machined object 10 can make machined object 10 produce the unfavorable conditions such as damaged, therefore not good.
Further, under the state that mounting portion 7 is positioned at laser irradiating part 50A, the below of mounting portion 7 configures scraper plate 63.Scraper plate 63 is tabular components that the fore-end in the cross section (yz cross section) vertical with length direction (x-axis direction) has trapezoidal shape, freedom of being retreated in the z-axis direction by not shown driving mechanism.This scraper plate 63 is the split/split processing in order to more effectively carry out to machined object 10 in laser processing device 50, and is used for pressing the mechanism of machined object when irradiated with pulse laser LB.Action aspect about scraper plate 63 will in being hereafter described in detail.Further, the front end geometry of scraper plate 63 is not limited to trapezoidal, also can be rectangular shape etc., is preferably and machined object 10 shapes contacted.When linear contact lay, likely produce the unfavorable conditions such as damage machined object 10.
< illuminator and observing system >
Observation section 50B is configured to the machined object 10 relative to mounting in mounting portion 7 and overlap carries out above mounting portion 7, irradiate falling to penetrating illumination light L1 and irradiating skew ray transmission illumination light L2 from skew ray lighting source S2 of epi-illumination light source S1, and carries out utilizing the surface observation of surface observation mechanism 6 from the upper side of mounting portion 7 and utilizing the back side of back side observation element 16 to observe from mounting portion 7 lower side.
Specifically, what send from epi-illumination light source S1 falls to penetrating illumination light L1 by omitting in illustrated lens barrel after set half-reflecting mirror 9 reflects, and irradiates in machined object 10.And, observation section 50B possesses surface observation mechanism 6, this surface observation mechanism 6 comprise the CCD camera 6a that is located at (above lens barrel) above half-reflecting mirror 9 and be connected to this CCD camera 6a monitor 6b, can the bright-field picture immediately observing machined object 10 under the state that fall to penetrating illumination light L1 irradiated.
In addition, in observation section 50B, more preferably possess back side observation element 16 below mounting portion 7, this back side observation element 16 comprises the CCD camera 16a being located at (below lens barrel) below following the half-reflecting mirror 19 and monitor 16b being connected to this CCD camera 16a.Further, the monitor 6b that monitor 16b and surface observation mechanism 6 possess also can be general.
< LASER Light Source >
The wavelength of LASER Light Source SL is 500nm ~ 1600nm.And in order to realize the processing of described processing graphic pattern, the pulsewidth of laser LB is necessary for about 1psec ~ 50psec.And preferably repetition rate R is about 10kHz ~ 200kHz, the irradiation energy (pulse energy) of laser is 0.1 μ J ~ 50 μ about J.
Further, can be rotatory polarization from the polarized condition of the laser LB of LASER Light Source SL outgoing also can be linear polarization.Wherein, when linear polarization, with regard to the viewpoint of the bending of the processing cross section in crystallinity machined material and S. E. A., be preferably polarization direction almost parallel with scanning direction, such as, within the angle that both are become is ± 1 °.
< optical system >
Optical system 5 is positions that setting laser irradiates the light path when machined object 10.According to the light path set by optical system 5, laser is irradiated the specific irradiation position (the formation precalculated position of irradiated area) in machined object.
Figure 10 is the schematic diagram of the formation of exemplary optical systems 5.Optical system 5 mainly possesses beam expander 51 and objective system 52.And, in optical system 5, in order to the light path that converts laser LB towards, also in position the eyeglass 5a of suitable number can be set at place.The situation being provided with 2 eyeglass 5a is illustrated in Figure 10.
In addition, when emergent light is linear polarization, optical system 5 preferably possesses attenuator 5b.Attenuator 5b is configured at the appropriate position in the light path of laser LB, is used for adjusting the intensity of laser LB of outgoing.
Further, in Figure 10 in illustrative optical system 5, be set to during processing process, the laser LB sent from LASER Light Source SL irradiates in machined object 10 with the state that its light path is fixed.In addition, can also form for following: set the light path that multiple laser LB sent from LASER Light Source SL irradiates the laser LB when machined object 10 practically or virtually, and light path set mechanism 5c (Figure 11) can be utilized, the light path when constituent parts pulsed light of switched laser LB irradiates in machined object in the multiple light paths set.In the latter case, the state of state or the also column scan simultaneously virtually scanned is carried out at multiple positions that can realize machined object 10 upper surface simultaneously side by side.In other words, this is by the light path multiplex of laser LB.
Further, exemplified with utilizing 3 laser LB0, LB1, LB2 to scan the situation at 3 positions in Fig. 9, but the aspect of the light path multiplex of optical system 5 might not be defined in this.The concrete configuration example of optical system 5 will in description.
< controller >
Controller 1 controls the action in described each portion, and also possesses: control part 2, realizes the processing process of the machined object 10 under following various aspect; And storage part 3, store the various data of reference during program 3p and the processing process of the action controlling laser processing device 50.
Control part 2 utilizes the such as general-purpose computer such as PC or micro computer and realizes, and by the program 3p stored in storage part 3 being read in this computer and being performed, and realizes the functional inscape of various inscape as control part 2.
Specifically, control part 2 mainly possesses: drive control part 21, control the driving of mounting portion 7 of travel mechanism 7m and the focus action of collector lens 18 etc., with process the action processing relevant various drive parts; Imaging control part 22, controls the shooting of CCD camera 6a and 16a; Irradiate control part 23, control the irradiation of the laser LB of LASER Light Source SL and the light path setting aspect of optical system 5; And processing handling part 25, according to the Working position data D1 (following) provided and cooked mode setting data D2 (following), perform the processing process to processing object position.
Storage part 3 utilizes the medium such as ROM or RAM and hard disk and realizes.Further, storage part 3 can be the aspect realized by the inscape of the computer realizing control part 2, also can be arranged on the aspect beyond this computer in the case of a hard disk.
The Working position data D1 describing the position to the processing preset lines that machined object 10 sets provided from outside is provided in storage part 3.And, cooked mode setting data D2 is stored in advance, imposing a condition or the drive condition (or they can setting range) etc. of mounting portion 7 of the light path of the conditioned disjunction optical system 5 that each parameter wherein describing laser by each cooked mode is correlated with in storage part 3.
Further, by operator be supplied to laser processing device 50 various input instruction preferably utilize in controller 1 realize GUI carry out.Such as, processing process menu is provided according to the effect of processing handling part 25 by GUI.Operator, according to this processing process menu, carries out the selection of following cooked mode or the input etc. of processing conditions.
< alignment actions >
In laser processing device 50, before implementing processing process, observation section 50B is utilized to carry out the alignment actions of the allocation position of inching machined object 10.Alignment actions is and the process carried out consistent with the reference axis of mounting portion 7 of the XY reference axis in order to make machined object 10 specify.When carrying out the processing of described processing graphic pattern, meet the particular kind of relationship obtained in each processing graphic pattern, this registration process outbalance to make the scanning direction of the crystal orientation of machined object, processing preset lines and laser.
Alignment actions can be applied known techniques and perform, and carries out just can with suitable aspect as long as correspond to processing graphic pattern.Such as, by the situations such as multiple element chips that use 1 motherboard is produced cut out, if the surface of machined object 10 forms the situation of repeat patterns, then realize suitable alignment actions by using the gimmicks such as pattern match.In this case, in simple terms, multiple photographed images to mutatis mutandis mark that machined object 10 is formed are obtained by CCD camera 6a or 16a, according to the relativeness of the camera position of these photographed images, processing handling part 25 determines amount of alignment, drive control part 21, according to this amount of alignment, makes mounting portion 7 move by travel mechanism 7m, realizes thus aiming at.
By carrying out this alignment actions, the Working position processing process can be determined exactly.Further, after alignment actions terminates, the mounting portion 7 loading machined object 10 moves to laser irradiating part 50A, then carries out the processing process of irradiating laser LB.Further, mounting portion 7, from observation section 50B to the movement of laser irradiating part 50A, is that processing precalculated position in order to suppose when ensureing alignment actions and actual Working position deviation do not occur.
The outline > of < processing process
Next, the processing process of the laser processing device 50 of present embodiment is described.Combined through the irradiation of the laser LB of optical system 5, the movement that is fixed wtih the mounting portion 7 of machined object 10 with mounting after LASER Light Source SL sends by laser processing device 50, make thus laser through optical system 5 relative to machined object 10 relative scanning, and carry out the processing of machined object 10.
The feature of laser processing device 50 is: as the pattern (cooked mode) of the processing process of (relatively) scanning laser LB, the two can select one from basic model and multiplex mode.These cooked modes are that the light path corresponding to described optical system 5 sets aspect and sets.
Basic model is the pattern of the light path of laser LB that sends of regulation LASER Light Source SL regularly.In basic model, laser LB is all the time by 1 light path, and the mounting portion 7 loading machined object 10 moves with specific speed, realizes the processing that laser scans the aspect of machined object 10 in one direction thus.When Figure 10 illustrative optical system 5, only can carry out the processing under this basic model.
Basic model is suitable for the situation of the processing carrying out the described 1st and the 2nd processing graphic pattern.Namely, the machined object 10 parallel with easy direction of riving/split is set as processing preset lines L, machined object 10 is aimed in the mode that this easy direction of riving/split is consistent with the moving direction of mounting portion 7, then carry out the processing under basic model, carry out the processing of the 1st processing graphic pattern thus.On the other hand, the machined object 10 vertical with easy direction of riving/split is set as processing preset lines L, machined object 10 is aimed in the mode that this easy direction of riving/split is orthogonal with the moving direction of mounting portion 7, then carry out the processing under basic model, carry out the processing of the 2nd processing graphic pattern thus.
In addition, in principle, by suitably changing the moving direction of mounting portion 7, the processing of the 3rd processing graphic pattern can also be applied.
On the other hand, multiplex mode is by the light path of laser LB physically or virtually multiplex and set the pattern of multiple light path.This pattern is as follows: such as, as shown in Figure 8 along with parallel straight line L α, the L β of processing preset lines L or further along processing preset lines L self, physically or virtually scan multiple laser, realize the processing identical with when scanning laser with the aspect of processing preset lines L repeated overlapping thus.Further, what is called scans multiple laser virtually, although in fact refer to that irradiating its light path of laser with 1 light path in the same manner as basic model changes temporally, realizes the scanning aspect identical with when irradiating laser with multiple light path thus.
Multiplex mode is applicable to the situation of the processing carrying out the 3rd processing graphic pattern.Namely, in the same manner as the situation of the 2nd processing graphic pattern, the machined object 10 vertical with easy direction of riving/split is set as concerning processing preset lines L, machined object 10 is aimed in the mode that this easy direction of riving/split is orthogonal with the moving direction of mounting portion 7, then carry out the processing of multiplex mode, carry out the processing of the 3rd processing graphic pattern thus.
Cooked mode is preferably such as according to the effect of processing handling part 25, can process menu by controller 1 according to the available processing being supplied to operator and select.Processing handling part 25 obtains Working position data D1 and obtains the condition corresponding with the processing graphic pattern selected from cooked mode setting data D2, in order to perform the action corresponding to corresponding conditions, by drive control part 21, irradiate control part 23 and other and control the action in corresponding each portion.
Such as, the wavelength of the laser LB that LASER Light Source SL sends, output, the repetition rate of pulse, the adjustment etc. of pulsewidth is realized by the irradiation control part 23 of controller 1.If send specific setting signal according to cooked mode setting data D2 from processing handling part 25 to irradiating control part 23, then irradiate control part 23 according to this setting signal, the illuminate condition of setting laser LB.
In addition, especially carry out adding man-hour with multiplex mode, irradiate the light path switching sequence that control part 23 makes light path set mechanism 5c, with the outgoing timing synchronization of the unit pulse light of LASER Light Source SL.Whereby, relative to the formation precalculated position of each irradiated area, the unit of exposure pulsed light with the light path corresponding with this formation precalculated position in multiple light paths of light path set mechanism 5c setting.
Further, in laser processing device 50, when carrying out processing process, optionally also can focal position wittingly from the defocus condition that the surface of machined object 10 is departed from, irradiate laser LB.This can realize by such as adjusting the relative distance of mounting portion 7 and optical system 5.
The configuration example of < light path set mechanism and action > thereof
Next, for concrete formation and the action case thereof of light path set mechanism 5c, mainly with the action of multiplex mode for object is described.
Further, in below illustrating, when carrying out processing process, be that the mounting portion 7 making to load machined object 10 moves along the moving direction D consistent with the bearing of trend processing preset lines L and processes.
In addition, in the action of multiplex mode, that irradiate when processing preset lines L forms irradiated area RE is laser LB0, being laser LB1 with what irradiate when the parallel straight line L α of processing preset lines L forms irradiated area RE, parallel with same processing preset lines L and be laser LB2 relative to what irradiate when the straight line L β processed on the position of preset lines L symmetry forms irradiated area RE.
And the processing of the 3rd processing graphic pattern under multiplex mode is that the multiple irradiated areas by being formed successively or simultaneously realize along the mode of easy direction formation of riving/split.
Figure 11 is the schematic diagram of the formation representing light path set mechanism 5c.Light path set mechanism 5c is an inscape as optical system 5 and arranges.Light path set mechanism 5c possesses multiple half-reflecting mirror 53, eyeglass 54 and light path selection mechanism 55.
Arrange half-reflecting mirror 53 to be with the object of eyeglass 54, make the light path of the laser LB of LASER Light Source SL outgoing in the Mian Nei direction top set vertical with the moving direction D of mounting portion 7, and form multiple light path (light path of laser LB0, LB1, LB2).Further, the quantity of half-reflecting mirror 53 is determined according to light path quantity.2 half-reflecting mirrors 53 are provided with in order to obtain 3 light paths in Figure 11.By possessing these half-reflecting mirrors 53 and eyeglass 54, shoot laser LB also makes mounting portion 7 move, and realizes the state of multiple laser scanning machined object 10 whereby.
The object arranging light path selection mechanism 55 is the outgoing sequential of the laser of the machined object 10 controlling multiple light path.More particularly, light path selection mechanism 55 possesses optical switch SW in the light path way of each laser by half-reflecting mirror 53 and eyeglass 54 branch.Optical switch SW is made up of such as AOM (sound equipment Optical modulator) or EOM (electro-optical device) etc., and when having ON state, make incident laser pass through, make the function of incident laser blocking or decay (non-pass through state) during OFF state.Whereby, light path selection mechanism 55 only makes the laser of the optical switch SW by ON state irradiate in machined object 10.
The action possessed under the multiplex mode of the laser processing device 50 with the light path set mechanism 5c that this kind is formed realizes in the following way: irradiate control part 23 according to the outgoing sequential of the unit pulse light of the laser LB according to repetition rate R, with the optical switch SW in the light path of laser LB0, LB1, LB2 successively and periodically become the mode of ON state, the ON/OFF action of each optical switch SW is controlled.By this control, each laser LB0, LB1, LB2 are only when arriving the sequential forming irradiated area, and each laser LB0, LB1, LB2 are irradiated in machined object 10 by light path selection mechanism 55.
That is, in fact the light path of irradiating in the laser of machined object 10 is provided with multiple, makes the irradiation sequential of described multiple laser unit pulse light separately different respectively and scans side by side simultaneously, performing the action of multiplex mode whereby.
Further, the action of basic model also can realize in the following way: such as, only to make in laser LB0, LB1, LB2 the optical switch SW in any one light path be always ON state and shoot laser LB, and mounting portion 7 is moved.
The high efficiency > of < split/split processing
Described split/split processing utilizes the impact or stress that produce because of the irradiation of unit pulse light, makes machined object produce the gimmick of riving/splitting.Therefore, can form with less energy ezpenditure/parting plane of riving during the irradiation of constituent parts pulsed light, also can make to rive/split to arrive the more depths of machined object even if the energy provided is identical, the more deep of the fore-end arrival machined object of segmentation starting point is divided, thus can more effectively form/parting plane of riving.
According to above viewpoint, in present embodiment, irradiated with pulse laser under the state making the processing object position of machined surface act on tensile stress in advance, can realize more effective split/split processing whereby.Specifically, with the sequential of irradiated with pulse laser, 3 bending applying power are utilized to machined object, realize the state to processing object position effect tensile stress whereby.
Figure 14 and Figure 15 is side cross-sectional view and the top view of the situation representing laser processing device 50 pairs of machined surface effect tensile stresses respectively.Figure 16 is the side cross-sectional view of situation when representing that laser processing device 50 changes processing object position.
When laser processing device 50 carries out split/split processing, first be positioned at the mode of the central authorities of the spaced portions of a pair restraining plate 61 with processing object position 10p (namely processing preset lines) of pulse laser LB, carry out the allocation position in the y-axis direction of regulation machined object 10.And, under the state of specified configuration position in this way, rise by making the mounting portion 7 (supporting member 7a) loading machined object 10, as shown in Figure 14 and Figure 15, the machined surface 10a of machined object 10 is made to be connected to a pair restraining plate 61 separating specific interval in the y-axis direction from below.
In this case, the mode of the position immediately below the processing object position 10p being connected to machined object 10 further with leading section 63e, generally perpendicularly compresses the below of scraper plate 63 from the spaced portions of a pair restraining plate 61.Whereby, machined object 10 is pressed by scraper plate 63, and on machined surface 10a, act on the tensile stress from processing object position 10p towards the positive negative direction of y-axis.In this case, if outgoing pulse laser LB the movable part 71a of ShixZhou travel mechanism 71 move, then together with restraining plate 61 and scraper plate 63, mounting portion 7 relative movement relative to pulse laser LB.Whereby, under the state acting on tensile stress, utilize pulse laser LB and relatively scanning machining object's position 10p.In the case, the part of tensile stress effect can reduce formed rives/parting plane time the energy that consumes, to rive thus/progress of parting plane becomes easy.
Also have, after the irradiation of the pulse laser LB to processing object position 10p shown in Figure 14 and Figure 15 terminates, as shown in figure 16, after making scraper plate 63 decline, also mounting portion 7 is made to decline, then be positioned at the mode of the central authorities of the spaced portions of a pair restraining plate 61 with next processing object position 10q, utilize travel mechanism 7m to move mounting portion 7.Afterwards, the process identical with described situation is carried out.
Claims (23)
1. a laser processing device, it possesses:
Light source, sends pulse laser; And
Mounting portion, loads machined object;
It is characterized in that:
Described laser processing device also possesses stress applying mechanism, utilizes bend at 3 and applies power to the described machined object placed by described mounting portion, thus to the processing object position effect tensile stress of described machined object;
At the described machined object loaded described mounting portion, utilize described stress applying mechanism and under state to described processing object position effect tensile stress, described mounting portion and the relative movement continuously of described light source is made in the mode of irradiated area discrete formation on machined surface of the constituent parts pulsed light of described pulse laser, and by described pulsed laser irradiation in described machined object, produce riving or splitting of machined object successively each other in described irradiated area thus, on described machined object, form the starting point for splitting whereby.
2. laser processing device according to claim 1, is characterized in that:
The ultrashort pulse light of described pulse laser to be pulsewidth be psec level.
3. laser processing device according to claim 1 and 2, is characterized in that:
Described stress applying mechanism possesses:
A pair constraint mechanism, is arranged in the mode separated above described processing object position, retrains described machined object from described machined surface side; And
Pressing mechanism, abuts from the opposition side of described machined surface, and presses described machined object.
4. laser processing device according to claim 3, is characterized in that:
Described pressing mechanism is formed as tabular, by making the leading section of described pressing mechanism generally perpendicularly abut relative to described machined surface, and presses described machined object.
5. laser processing device according to claim 4, is characterized in that:
It is trapezoidal shape that the described leading section of described pressing mechanism is formed as cross section.
6. laser processing device according to claim 1 and 2, is characterized in that:
Described machined object is formed when being used for the starting point of described segmentation, utilize different described unit pulse light and at least 2 irradiated areas being formed be with described machined object rive or on easy direction of splitting, adjacent mode is formed.
7. laser processing device according to claim 6, is characterized in that:
The formation of described at least 2 irradiated areas is rived described in different 2 of described machined object or hockets in easy direction of splitting.
8. laser processing device according to claim 6, is characterized in that:
Described irradiated area entirety is riving or the easy direction and being formed of splitting along described machined object.
9. laser processing device according to claim 1 and 2, is characterized in that:
When described machined object is formed the starting point being used for described segmentation, described irradiated area is formed on the direction of the symmetry axis in 2 the different easy directions of riving or split relative to described machined object.
10. laser processing device according to claim 1 and 2, is characterized in that:
Utilize described constituent parts pulsed light to irradiate impact when illuminated position or stress, and rive described in producing between the illuminated position of the described unit pulse light just irradiated before or simultaneously irradiate or described in split.
The processing method of 11. 1 kinds of machined objects, be used on machined object, form segmentation starting point, it is characterized in that, the method comprises:
Mounting step, is placed in mounting portion by machined object; And
Irradiating step, 3 bending applying power are being utilized to the described machined object placed by described mounting portion, under state thus to the processing object position effect tensile stress of described machined object, while make the light source relative movement continuously of described mounting portion and pulse laser, while by described pulse laser with the irradiated area of constituent parts pulsed light in the mode with discrete formation on the machined surface of mounting surface subtend, irradiate in described machined object, riving or splitting of described machined object is produced each other successively thus in described irradiated area, the starting point for splitting is formed whereby on described machined object.
The processing method of 12. machined objects according to claim 11, is characterized in that:
The ultrashort pulse light of described pulse laser to be pulsewidth be psec level.
The processing method of 13. machined objects according to claim 11 or 12, is characterized in that:
In described irradiating step, utilize and be positioned at partitions each other a pair confining part that the mode above described processing object position arranges, described machined object is retrained from described machined surface side, then pressing mechanism is made to be connected to described machined surface from the opposition side of described machined surface, whereby to described processing object position effect tensile stress.
The processing method of 14. machined objects according to claim 13, is characterized in that:
Described pressing mechanism is formed as tabular, in described irradiating step, by making the leading section of described pressing mechanism generally perpendicularly abut relative to described machined surface, and presses described machined object.
The processing method of 15. machined objects according to claim 14, is characterized in that:
It is trapezoidal shape that the described leading section of described pressing mechanism is formed as cross section.
The processing method of 16. machined objects according to claim 11 or 12, is characterized in that:
In described irradiating step, at least 2 irradiated areas utilizing different described unit pulse light to be formed be with described machined object rive or on easy direction of splitting, adjacent mode is formed.
The processing method of 17. machined objects according to claim 16, is characterized in that:
In described irradiating step, the formation of described at least 2 irradiated areas is rived described in different 2 of described machined object or hockets in easy direction of splitting.
The processing method of 18. machined objects according to claim 16, is characterized in that:
In described irradiating step, described irradiated area entirety is riving or the easy direction and being formed of splitting along described machined object.
The processing method of 19. machined objects according to claim 11 or 12, is characterized in that:
In described irradiating step, described irradiated area is formed on the direction of the symmetry axis in 2 the different easy directions of riving or split relative to described machined object.
The processing method of 20. machined objects according to claim 11 or 12, is characterized in that:
In described irradiating step, make the outgoing source of described pulse laser and described machined object relative movement, and the exit direction of described pulse laser is changed in the face periodically vertical with this relative movement direction, on described machined object, form the multiple described irradiated area meeting zigzag configuration relation whereby.
The processing method of 21. machined objects according to claim 11 or 12, is characterized in that:
In described irradiating step, make multiple outgoing source of described pulse laser and described machined object relative movement, and the irradiation timing cycles of described multiple outgoing source described unit pulse light is separately changed, on described machined object, form the multiple described irradiated area meeting zigzag configuration relation whereby.
The processing method of 22. machined objects according to claim 11 or 12, is characterized in that:
In described irradiating step, utilize described constituent parts pulsed light to irradiate impact when illuminated position or stress, and between the illuminated position of the described unit pulse light just irradiated before or simultaneously irradiate, rive described in generation or described in split.
The dividing method of 23. 1 kinds of machined objects, is used for splitting machined object, it is characterized in that comprising:
Mounting step, is placed in mounting portion by machined object;
Irradiating step, 3 bending applying power are utilized at the described machined object loaded described mounting portion, under state thus to the processing object position effect tensile stress of described machined object, while make the light source relative movement continuously of described mounting portion and pulse laser, while described pulse laser is being irradiated in described machined object with the irradiated area of constituent parts pulsed light with the mode of discrete formation on the machined surface of mounting surface subtend, riving or splitting of described machined object is produced each other successively thus in described irradiated area, the starting point for splitting is formed whereby on described machined object, and
Segmentation step, to form the machined object splitting starting point, being split along described segmentation starting point by utilizing described irradiating step.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010166230A JP5104920B2 (en) | 2010-07-23 | 2010-07-23 | Laser processing apparatus, workpiece processing method, and workpiece dividing method |
| JP2010-166230 | 2010-07-23 |
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| JP (1) | JP5104920B2 (en) |
| KR (1) | KR101330608B1 (en) |
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| JP5966468B2 (en) * | 2012-03-15 | 2016-08-10 | 三星ダイヤモンド工業株式会社 | Laser processing equipment |
| JP5940906B2 (en) * | 2012-06-19 | 2016-06-29 | 株式会社ディスコ | Laser processing equipment |
| JP5902281B2 (en) * | 2014-11-19 | 2016-04-13 | 三星ダイヤモンド工業株式会社 | Laser processing equipment |
| JP6594699B2 (en) * | 2015-08-18 | 2019-10-23 | 浜松ホトニクス株式会社 | Processing object cutting method and processing object cutting apparatus |
| IT201600071345A1 (en) | 2016-07-08 | 2018-01-08 | Konig Spa | ANTI-SLIP DEVICE |
| DE102018124208B4 (en) * | 2018-10-01 | 2021-08-12 | Precitec Gmbh & Co. Kg | Method and device for monitoring a laser machining process on a workpiece and the associated laser machining system |
| JP7153851B2 (en) * | 2020-10-27 | 2022-10-17 | 株式会社東京精密 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
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| CN1929978A (en) * | 2004-04-27 | 2007-03-14 | 三星钻石工业股份有限公司 | Method for forming vertical crack on brittle board and vertical crack forming apparatus |
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| JPH1071483A (en) * | 1996-08-29 | 1998-03-17 | Hitachi Constr Mach Co Ltd | Method for shearing brittle material |
| JP2000270833A (en) * | 1999-03-19 | 2000-10-03 | Japan Tobacco Inc | Laser opening apparatus |
| JP4659300B2 (en) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip manufacturing method |
| JP2003220489A (en) * | 2002-01-23 | 2003-08-05 | Fine Device:Kk | Device and method for laser beam machining |
| ATE493226T1 (en) * | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | METHOD FOR CUTTING A MACHINED OBJECT |
| JP4909657B2 (en) * | 2006-06-30 | 2012-04-04 | 株式会社ディスコ | Processing method of sapphire substrate |
| JP2009107301A (en) * | 2007-10-31 | 2009-05-21 | Lemi Ltd | Full body cutting method for brittle material |
| JP5380986B2 (en) * | 2008-09-30 | 2014-01-08 | アイシン精機株式会社 | Laser scribing method and laser scribing apparatus |
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| CN1929978A (en) * | 2004-04-27 | 2007-03-14 | 三星钻石工业股份有限公司 | Method for forming vertical crack on brittle board and vertical crack forming apparatus |
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| CN102343481A (en) | 2012-02-08 |
| KR101330608B1 (en) | 2013-11-18 |
| JP5104920B2 (en) | 2012-12-19 |
| TWI428195B (en) | 2014-03-01 |
| TW201213033A (en) | 2012-04-01 |
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| KR20120010109A (en) | 2012-02-02 |
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