CN112122777A

CN112122777A - PCB (printed circuit board) ultrafast laser drilling system, equipment and method

Info

Publication number: CN112122777A
Application number: CN202011001249.6A
Authority: CN
Inventors: 李万朋; 赖程飞; 蒋小君; 陶雄兵
Original assignee: Dongguan Shengxiong Laser Advanced Equipment Co ltd
Current assignee: Dongguan Shengxiong Laser Advanced Equipment Co ltd
Priority date: 2020-09-22
Filing date: 2020-09-22
Publication date: 2020-12-25

Abstract

The application discloses PCB ultrafast laser drilling system, equipment and method, wherein, the system is through adopting the picosecond green laser as drilling laser source, because it has the short and high characteristic of peak power of pulse width, make PCB board surface copper structure's light absorptivity higher, can need not blackening or brown and take turns to the pretreatment, process manufacturing has been saved, drilling efficiency has been improved, because peak power is high again, the heat effect that produces in the drilling process has been reduced, and simultaneously, picosecond green laser is as ultrafast laser, its drilling aperture flexibility is stronger, can cover the micropore that drilling aperture is 30 ~ 300 mu m.

Description

PCB (printed circuit board) ultrafast laser drilling system, equipment and method

Technical Field

The application relates to the technical field of laser drilling, in particular to a PCB (printed circuit board) ultrafast laser drilling system, corresponding equipment and method.

Background

Electronic design is continuously improving the performance of the whole machine, and at the same time, the miniaturization is pursued, such as small portable products of mobile phones and intelligent weapons.

The HDI (high Density interconnect) is one of the technologies used in pcb (printed circuit board), and HDI is mainly manufactured by using through-hole, blind-hole, and buried-hole technologies, and has a technical characteristic that the Density of the electronic circuit distribution lines in the pcb is higher, but the printed circuit board manufactured by HDI is difficult to be manufactured by using the drilling process of the conventional machine due to the increase of the line Density.

At present, laser drilling is a main scheme of matching hole forming of an HDI high-density interconnection technology, CO2 laser is mainly adopted in the field of industrial application, but a CO2 laser focusing spot is large, a small hole (smaller than 75 micrometers) cannot be manufactured, and the absorption rate of a copper plate in a printed circuit board to CO2 laser is low. The small holes are also made by adopting ultraviolet laser, but the drilling speed is slow due to the limitation of laser power, and especially for the glass fiber in the PCB dielectric layer, the glass fiber can be removed only by improving the energy density to a high degree. In addition, if the light focusing spot center energy is too high, there is a risk of damaging the PCB substrate material.

Disclosure of Invention

The application provides a PCB ultrafast laser drilling system, equipment and method, which are used for solving the technical problems of low PCB drilling efficiency, overhigh central energy of light focusing faculae, poor drilling aperture flexibility and low light absorption rate in the prior art.

In view of the above, the first aspect of the present application provides an ultrafast laser drilling system for PCB, comprising: the picosecond green laser, the beam expander, the beam shaper, the scanning galvanometer, the focusing field lens and the control module are electrically connected;

the picosecond green laser emits laser beams with Gaussian distribution;

the beam expander is used for receiving the laser beam and then performing beam expanding processing;

the beam shaper is used for receiving the laser beam after beam expansion processing by the beam expander and converting the laser beam with Gaussian distribution into a laser beam with flat-top Gaussian distribution;

the scanning galvanometer is used for receiving the laser beam converted by the beam shaper and controlling the laser beam to carry out focusing scanning on the surface of a region to be processed of the PCB to be processed through the focusing field lens in a preset scanning mode and preset scanning parameters, and the preset scanning parameters comprise point engraving time, galvanometer idle speed and galvanometer idle time delay;

the focusing field lens is used for adjusting the focusing focus position of the laser beam according to a preset drilling track so as to drill the PCB to be processed, and then micropores with preset apertures are formed on the PCB to be processed;

the control module is used for controlling the picosecond green light laser, the beam expander, the beam shaper, the scanning galvanometer and the focusing field lens to cooperatively work according to an instruction input by a user in advance.

Preferably, the laser wavelength of the picosecond green laser is 515nm or 532nm, the pulse width is less than or equal to 15ps, the single pulse energy is more than or equal to 200uJ, and the repetition frequency is more than or equal to 100 kHz.

Preferably, the scanning galvanometer is further used for controlling the laser beam to scan the to-be-processed area of the PCB to be processed in a single-point multi-pulse scanning mode when the preset aperture of the micropore is 30-100 μm;

and when the preset aperture of the micro-hole is 100-300 μm, controlling the laser beam to scan the to-be-processed area of the to-be-processed PCB in a winding continuous scanning mode, wherein the winding continuous scanning mode comprises one or a combination of a spiral scanning mode, a double-spiral scanning mode and a circular scanning mode.

In a second aspect, an embodiment of the present application further provides a PCB ultrafast laser drilling device, where the PCB ultrafast laser drilling system described above is applied, including: the drilling machine set, the feeding machine set and the material taking machine set;

the drilling unit comprises the PCB ultrafast laser drilling system and a vacuum adsorption platform;

the vacuum adsorption platform is used for placing a PCB to be processed;

the PCB ultrafast laser drilling system is used for drilling the PCB to be processed;

the feeding unit is used for transporting the PCB to be processed to the vacuum adsorption platform;

and the material taking unit is used for taking out the PCB after drilling processing on the vacuum adsorption platform.

Preferably, the drilling unit further comprises a base, a CCD assembly, a laser range finder and a power meter;

the base is provided with a marble supporting framework, the marble supporting framework is provided with a cross linear sliding table, the cross linear sliding table is provided with the vacuum adsorption platform, the cross linear sliding table comprises a vertical sliding table and a transverse sliding table which are orthogonal to each other, the vertical sliding table is used for driving the vacuum adsorption platform to vertically move, the transverse sliding table is used for driving the vacuum adsorption platform to transversely move, the number of the vacuum adsorption platforms is two, the number of the PCB ultrafast laser drilling systems is two, and the two vacuum adsorption platforms and the two PCB ultrafast laser drilling systems are respectively and correspondingly arranged;

the CCD assembly is arranged above the vacuum adsorption platform and used for visually grabbing a target for the PCB to be processed on the vacuum adsorption platform;

the laser range finder is used for measuring the distance between a focusing field lens of the PCB ultrafast laser drilling system and the PCB to be processed and feeding back the measured distance result to the PCB ultrafast laser drilling system, so that laser beams emitted by the PCB ultrafast laser drilling system are focused on the PCB to be processed;

the power meter is arranged below a focusing field lens of the PCB ultrafast laser drilling system and used for measuring the laser power of a laser beam emitted by the PCB ultrafast laser drilling system.

Preferably, the feeding unit is provided with a feeding machine shell, a feeding trolley, a first pre-positioning module and a feeding carrying module;

the feeding trolley is used for placing a plurality of PCB boards to be processed which are overlapped up and down, the feeding trolley and the feeding machine shell are arranged in a separated mode, the feeding trolley can push the PCB boards out of the feeding machine shell, and the feeding trolley is provided with a first lifting device;

the first pre-positioning module comprises a first locking module, a first pre-positioning platform, a first transverse sliding rail, a first driving mechanism, a first material absorbing position, a second material absorbing position and a first material discharging position, wherein the first material discharging position and the first material absorbing position are arranged in a vertically corresponding mode, and the first material discharging position and the second material absorbing position are arranged horizontally;

the first lifting device is used for controlling the PCB to be processed to be lifted to the first material suction position;

the first locking module is used for limiting the position of the feeding trolley on a first parking space preset in the feeding machine shell to be unchanged, and the preset first parking space and the first suction material position are arranged in an up-and-down corresponding mode;

the first pre-positioning platform is used for adjusting the pose of the PCB to be processed; the first pre-positioning platform is further used for sliding to the second material sucking position or the first material discharging position along the first transverse sliding rail under the driving of the first driving mechanism;

the loading and carrying module comprises a first loading vacuum chuck, a second transverse slide rail, a second driving mechanism, a first long-stroke lifting cylinder and a first short-stroke lifting cylinder;

the first feeding vacuum chuck and the second feeding vacuum chuck are used for sliding along the second transverse slide rail under the driving of the second driving mechanism so as to respectively correspond to the first discharging position and the second sucking position;

the first feeding vacuum chuck is also used for reaching the first suction position under the common driving of the first long-stroke lifting cylinder and the first short-stroke lifting cylinder; the first feeding vacuum chuck is also used for reaching a first discharging position under the driving of the first short-stroke lifting cylinder;

the second feeding vacuum chuck is also used for reaching a second material suction position under the driving of the first short-stroke lifting cylinder;

the first feeding vacuum chuck and the second feeding vacuum chuck are further used for being driven by the second driving mechanism to slide along the second transverse sliding rail to realize that the two feeding vacuum chucks correspond to the two vacuum adsorption platforms respectively, and meanwhile, the first feeding vacuum chuck and the second feeding vacuum chuck are further used for being driven by the first long-stroke lifting cylinder and the first short-stroke lifting cylinder to reach the two vacuum adsorption platforms respectively.

Preferably, the material taking unit is provided with a material taking machine shell, a material taking cart, a second pre-positioning module and a material taking and carrying module;

the material taking trolley is used for placing the PCB after drilling processing, the material taking trolley is separated from the material taking shell, the material taking trolley can be pushed out of the material taking shell, and the material taking trolley is provided with a second lifting device;

the second pre-positioning module comprises a second locking module, a second pre-positioning platform, a third transverse sliding rail, a third driving mechanism, a second material discharging position, a third material discharging position and a third material sucking position, the second material discharging position and the third material sucking position are arranged in an up-and-down corresponding mode, and the third material discharging position and the third material sucking position are arranged horizontally;

the second lifting device is used for controlling the PCB subjected to drilling processing to descend after being lifted to the second discharging position;

the second locking module is used for limiting the position of the material taking trolley on a second parking space preset in the material taking machine shell to be unchanged, and the preset first parking space and the first material suction position are arranged in an up-and-down corresponding mode;

the second pre-positioning platform is used for adjusting the pose of the PCB after the drilling process; the second pre-positioning platform is further used for sliding to the third material sucking position or the third material discharging position along the third transverse sliding rail under the driving of the third driving mechanism;

the material taking and carrying module comprises a first material taking vacuum chuck, a second material taking vacuum chuck, a fourth transverse slide rail, a fourth driving mechanism, a second long-stroke lifting cylinder and a second short-stroke lifting cylinder, and the first material taking vacuum chuck and the second material taking vacuum chuck slide along the fourth transverse slide rail under the driving of the fourth driving mechanism;

the first material taking vacuum chuck and the second material taking vacuum chuck are used for respectively corresponding to the third material sucking position and the third material discharging position by sliding along the fourth transverse sliding rail under the driving of the fourth driving mechanism;

the first material taking vacuum chuck is also used for reaching the second material placing position under the common driving of the second long-stroke lifting cylinder and the second short-stroke lifting cylinder; the first material taking vacuum chuck is also used for reaching a third material sucking position under the driving of the second short-stroke lifting cylinder;

the second material taking vacuum chuck is also used for reaching a third material placing position under the driving of the second short-stroke lifting cylinder;

the first material taking vacuum chuck and the second material taking vacuum chuck are further used for being driven by a fourth driving mechanism to slide along a fourth transverse sliding rail to realize that the first material taking vacuum chuck and the second material taking vacuum chuck correspond to the two vacuum adsorption platforms respectively, and meanwhile, the first material taking vacuum chuck and the second material taking vacuum chuck are further used for being driven by a second long-stroke lifting cylinder and a second short-stroke lifting cylinder to reach the two vacuum adsorption platforms respectively.

Preferably, first elevating gear and second elevating gear are a plurality of, first elevating gear all includes lift cylinder, driving motor and origin sensor with second elevating gear, driving motor's output through a shaft coupling with the lift cylinder is connected, origin sensor is used for the restriction the lift stroke of lift cylinder.

In a third aspect, an embodiment of the present application provides a PCB ultrafast laser drilling method, where the PCB ultrafast laser drilling system is applied, and the method includes the following steps:

s101: emitting laser beams with Gaussian distribution by a picosecond green laser;

s102: receiving the laser beam through a beam expander and then performing beam expanding processing;

s103: after the beam shaper receives the laser beam after beam expansion processing by the beam expander, the laser beam with Gaussian distribution is converted into a laser beam with flat-top Gaussian distribution;

s104: after the laser beam converted by the beam shaper is received by the scanning galvanometer, the laser beam is controlled to carry out focusing scanning on the surface of a region to be processed of the PCB to be processed through the focusing field lens in a preset scanning mode and preset scanning parameters, wherein the preset scanning parameters comprise point engraving time, galvanometer idle-running speed and galvanometer idle-running delay time;

s105: and adjusting the focus position of the laser beam by a preset drilling track through the focusing field lens so as to drill the PCB to be processed, and further forming micropores with preset apertures on the PCB to be processed.

Preferably, the preset scanning manner in step S104 includes:

when the preset aperture of the micropore is 30-100 mu m, the preset scanning mode is a single-point multi-pulse scanning mode;

and when the preset aperture of the micropore is 100-300 mu m, the preset scanning mode is a winding continuous scanning mode, and the winding continuous scanning mode comprises one or a combination of spiral scanning, double spiral scanning and circular scanning.

According to the technical scheme, the embodiment of the application has the following advantages:

the utility model provides a pair of PCB ultrafast laser drilling system, through adopting picosecond green laser as drilling laser source, because it has the characteristics that pulse width is short and peak power is high, make PCB board surface copper structure's light absorptivity higher, can need not blackening or brown pretreatment, the technology process has been saved, drilling efficiency has been improved, again because peak power is high, the heat effect that produces among the drilling process has been reduced, and simultaneously, picosecond green laser is as ultrafast laser, its drilling aperture flexibility is stronger, can cover the micropore that the drilling aperture is 30 ~ 300 mu m. In addition, the beam shaping device is arranged in the light path, so that when laser beams pass through the beam shaping device and are focused, the energy distribution of focused light spots is uniformly processed, flat top light with uniform energy and steep boundary is formed, the laser processing threshold is widened, and the risk that the PCB bottom material is ablated due to overhigh central energy of the laser focused light spots is avoided.

Drawings

Fig. 1 is a schematic structural diagram of an ultrafast laser drilling system for a PCB according to an embodiment of the present disclosure;

FIG. 2 is a diagram illustrating the effect of converting the Gaussian-distributed laser beam into a flat-topped Gaussian-distributed laser beam;

FIG. 3 is a schematic diagram of a single-point multi-pulse scanning method according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a winding continuous scanning mode provided in an embodiment of the present application;

FIG. 5 is a diagram illustrating an effect of a spiral scanning manner provided in an embodiment of the present application;

fig. 6 is an effect diagram of a double-spiral scanning manner provided in the embodiment of the present application;

fig. 7 is an effect diagram of a spiral + outer circular combined scanning manner provided in the embodiment of the present application;

FIG. 8 is a diagram illustrating an effect of a spiral + inner and outer circle scanning manner according to an embodiment of the present disclosure;

FIG. 9 is a diagram illustrating an effect of the double spiral + circular scanning method according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of an ultrafast laser drilling apparatus for a PCB according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of a drilling unit in the ultrafast laser drilling apparatus for PCBs according to the embodiment of the present application;

fig. 12 is a schematic structural diagram of a feeding unit in the ultrafast laser drilling device for PCBs according to the embodiment of the present application;

fig. 13 is a schematic structural view of a material taking unit in the ultrafast laser drilling apparatus for PCB according to the embodiment of the present application;

fig. 14 is a schematic structural diagram of a loading and carrying module in the ultrafast laser drilling apparatus for PCB according to the embodiment of the present application;

fig. 15 is a schematic structural diagram of a lifting device in the ultrafast laser drilling apparatus for PCB according to the embodiment of the present application;

fig. 16 is a flowchart of an ultrafast laser drilling method for a PCB according to an embodiment of the present application.

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

For easy understanding, please refer to fig. 1, the present application provides an ultrafast laser drilling system for PCB, comprising: the picosecond green laser 1, the beam expander 2, the beam shaper 3, the scanning galvanometer, the focusing field lens and the control module are electrically connected with the picosecond green laser 1, the beam expander 2, the beam shaper 3, the scanning galvanometer 4 and the focusing field lens 5;

the picosecond green laser 1 emits laser beams with Gaussian distribution;

the beam expander 2 is used for receiving the laser beam and then performing beam expanding treatment;

the beam shaper 3 is used for receiving the laser beam after being expanded by the beam expander 2 and converting the laser beam with Gaussian distribution into a laser beam with flat-top Gaussian distribution;

the scanning galvanometer 4 is used for receiving the laser beam converted by the beam shaper 3 and controlling the laser beam to carry out focusing scanning on the surface of a region to be processed of the PCB to be processed through the focusing field lens 5 in a preset scanning mode and preset scanning parameters, wherein the preset scanning parameters comprise point engraving time, galvanometer idle-running speed and galvanometer idle-running delay time;

the focusing field lens 5 is used for adjusting the focusing focus position of the laser beam according to a preset drilling track so as to drill the PCB to be processed, and further forming a micropore with a preset aperture on the PCB to be processed;

the control module is used for controlling the picosecond green light laser 1, the beam expander 2, the beam shaper 3, the scanning galvanometer 4 and the focusing field lens 5 to cooperatively work according to instructions input by a user in advance.

It should be noted that, as shown in fig. 2, the left graph shows that the energy of a gaussian spot in a gaussian distributed laser beam is in a gaussian distribution curve when a beam shaper is not provided, wherein the area of the apex of the spot is small, that is, the energy of the center of the spot is the largest, the peak power density is high, there is a risk that the energy of the center of the spot is too high to damage the copper structure at the bottom of the blind hole of the PCB, and meanwhile, if the energy of the edge of the gaussian spot is weaker, the ablation threshold of the PCB material may not be reached, and a thermal effect may be generated. In this embodiment, the right diagram of fig. 2 shows that after the beam shaper is disposed in the optical path, the laser beam is focused after passing through the beam shaper, so that the energy distribution of the focused light spot is uniformly processed, and a flat top light with uniform energy and a steep boundary is formed, so that the bottom of the drilled hole is more uniform, the laser processing threshold is widened, and meanwhile, the risk of ablating the bottom material of the PCB due to too high central energy of the laser focused light spot is avoided.

In addition, in the present embodiment, a plurality of reflection mirrors 60, 61, 62, 63 are provided as optical path members of the laser beam in order to improve flexibility of the optical path.

Furthermore, the laser wavelength of the picosecond green laser 1 is 515nm or 532nm, the pulse width is less than or equal to 15ps, the single pulse energy is more than or equal to 200uJ, and the repetition frequency is more than or equal to 100 kHz.

Further, the scanning galvanometer 4 is also used for controlling the laser beam to scan the to-be-processed area of the PCB to be processed in a single-point multi-pulse scanning mode when the preset aperture of the micropore is 30-100 mu m;

it should be noted that fig. 3 is a schematic diagram of a single-point multi-pulse scanning mode, which is based on the principle that laser emission pulses are focused on a focal point on the surface of a PCB board, the short pulse laser with high power density can conduct huge energy larger than the ablation energy threshold of the material to the PCB in a short time, so that the PCB material is melted and evaporated, and simultaneously, during the evaporation process, the volume of the material in the bore expands sharply, creating a large vapor pressure that can push the molten workpiece material out of the hole, and the dwell time of the focus point determines the number of laser pulses received by the point on the surface of the PCB board, the more the pulse is accumulated, the more the energy is accumulated, the more the melted and evaporated material is, and the efficiency of laser processing is determined by the point engraving time controlled by the scanning galvanometer, the idle walking speed of the galvanometer and the idle walking delay.

The scanning galvanometer is further used for controlling the laser beam to scan the to-be-processed area of the PCB to be processed in a winding continuous scanning mode when the preset aperture of the micropore is 100-300 mu m, wherein the winding continuous scanning mode comprises one or a combination of spiral scanning, double spiral scanning and circular scanning.

It should be noted that fig. 4 is a schematic diagram of a winding continuous scanning mode, and the principle is that a laser beam with high peak power is focused on the surface of the PCB through a focusing field lens under the moving reflection of a scanning galvanometer, and performs a single or multiple winding movements to gradually etch the material, in the process, the PCB plate material is heated by peak power to be quickly raised to the gasification temperature, so that the material is gradually ablated by laser and escapes from the surface of the material in the form of steam, so that holes with corresponding sizes are ablated on the surface of the material, and the winding continuous scanning mode comprises a spiral scanning mode as shown in figure 5, a double-spiral scanning mode as shown in figure 6, and a spiral + outer circular combined scanning mode as shown in figure 7, the scanning method is similar to the spiral + inner and outer circle combined scanning method shown in fig. 8, and the double spiral + circle combined scanning method shown in fig. 9.

In this embodiment, through adopting the picosecond green laser as the drilling laser source, because it has the characteristics that pulse width is short and peak power is high, make the light absorption rate of PCB board surface copper structure higher, can need not blackening or brown and change the pretreatment, saved the technology process, improved drilling efficiency, because peak power is high again, the heat effect that produces in the drilling process has been reduced, simultaneously, picosecond green laser is as ultrafast laser, its drilling aperture flexibility is stronger, can cover the micropore that the drilling aperture is 30 ~ 300 mu m.

The above is an embodiment of a PCB ultrafast laser drilling system provided by the present application, and the following is an embodiment of a PCB ultrafast laser drilling apparatus provided by the present application.

For convenience of understanding, referring to fig. 10 and 11, an ultrafast laser drilling apparatus for PCB using the ultrafast laser drilling system of the above embodiment includes: a drilling unit 200, a feeding unit 300 and a material taking unit 100;

the drilling unit 200 comprises a PCB ultrafast laser drilling system 203 and a vacuum adsorption platform;

the vacuum adsorption platform is used for placing a PCB to be processed;

the PCB ultrafast laser drilling system 203 is used for drilling a PCB to be processed;

the feeding unit 300 is used for transporting the PCB to be processed to the vacuum adsorption platform;

the material taking unit 100 is used for taking out the PCB after drilling on the vacuum adsorption platform.

It can be understood that, the feeding unit 300 in this embodiment can carry the PCB to be processed to the vacuum adsorption platform, and after the PCB to be processed is drilled by the ultrafast laser drilling system 203 of the drilling unit 200, the drilled PCB can be taken down by the taking unit 100, so as to realize the drilling process of full-automatic loading and unloading.

Referring to fig. 11, the drilling unit 200 further includes a base 201, a CCD assembly 208, a laser range finder 206, and a power meter 207;

a marble supporting framework 202 is arranged on the base 201, a cross linear sliding table is arranged on the marble supporting framework 202,

vacuum adsorption platforms

2050 and 2051 are arranged on the cross linear sliding table, the cross linear sliding table comprises a vertical sliding table 2040 and a transverse sliding table 2041 which are orthogonal to each other, the vertical sliding table 2040 is used for driving the

vacuum adsorption platforms

2050 and 2051 to vertically move, the transverse sliding table 2041 is used for driving the

vacuum adsorption platforms

2050 and 2051 to transversely move, the number of the

vacuum adsorption platforms

2050 and 2051 is two, the number of the PCB ultrafast laser drilling systems 203 is two, and the two

vacuum adsorption platforms

2050 and 2051 and the two PCB ultrafast laser drilling systems 203 are respectively and correspondingly arranged;

it will be appreciated that the provision of dual tooling platforms may allow for a more efficient drilling process.

The CCD assembly 208 is arranged above the

vacuum adsorption platforms

2050 and 2051, and the CCD assembly 208 is used for visually grabbing targets on the PCB to be processed on the

vacuum adsorption platforms

2050 and 2051;

the laser range finder 206 is configured to measure a distance between a focusing field lens of the PCB ultrafast laser drilling system 203 and the PCB to be processed, and feed back a measured distance result to the PCB ultrafast laser drilling system 203, so that a laser beam emitted by the PCB ultrafast laser drilling system 203 is focused on the PCB to be processed;

the power meter 207 is arranged below a focusing field lens of the PCB ultrafast laser drilling system 203 and is used for measuring the laser power of the laser beam emitted by the PCB ultrafast laser drilling system 203.

It can be understood that the power meter 207 measures the laser power of the laser beam emitted by the PCB ultrafast laser drilling system 203, so as to facilitate parameter adjustment of the laser power.

Referring to fig. 11 to 12, the feeding unit 300 includes a feeding housing 301, a feeding cart 302, a first pre-positioning module and a feeding carrying module 306;

the feeding cart 302 is used for placing a plurality of PCB boards to be processed which are stacked up and down, the feeding cart 302 is arranged separately from the feeding machine shell 301, the feeding cart 302 can be pushed out of the feeding machine shell 301, and the feeding cart 302 is provided with a first lifting device 303;

the first pre-positioning module comprises a first locking module, a first pre-positioning platform 304, a first transverse sliding rail 305, a first driving mechanism, a first material absorbing position, a second material absorbing position and a first material discharging position, wherein the first material discharging position and the first material absorbing position are arranged in a vertically corresponding mode, and the first material discharging position and the second material absorbing position are arranged horizontally;

it should be noted that the lateral distance between the first discharge position and the second suction position differs by at least the length of the first pre-positioning stage 304.

The first lifting device 303 is used for controlling the PCB to be processed to be lifted to a first material suction position;

the first locking module is used for limiting the position of the feeding trolley 302 on a preset first parking space in the feeding machine shell 301 to be unchanged, and the preset first parking space and the first suction position are arranged in an up-and-down corresponding mode;

the first pre-positioning platform 304 is used for adjusting the pose of the PCB to be processed; the first pre-positioning platform 304 is further configured to slide to a second suction position or a first discharge position along the first transverse slide rail 305 under the driving of the first driving mechanism;

the feeding and carrying module 306 comprises a first feeding vacuum sucker 3061, a second feeding vacuum sucker 3060, a second transverse sliding rail 3062, a second driving mechanism, a first long stroke lifting cylinder and a first short stroke lifting cylinder;

the first feeding vacuum sucker 3061 and the second feeding vacuum sucker 3060 are used for respectively corresponding to a first material placing position and a second material sucking position when driven by the second driving mechanism to slide along the second transverse sliding rail 3062;

the first feeding vacuum chuck 3061 is also used for reaching a first suction position under the common drive of a first long stroke lifting cylinder and a first short stroke lifting cylinder; the first feeding vacuum chuck 3061 is also used for reaching a first discharge position under the drive of the first short stroke lifting cylinder;

the second feeding vacuum chuck 3060 is also used for reaching a second suction position under the drive of the first short stroke lifting cylinder;

the first feeding vacuum sucker 3061 and the second feeding vacuum sucker 3060 are further used for sliding along the second transverse slide rail 3062 under the driving of the second driving mechanism to respectively correspond to the two

vacuum adsorption platforms

2050 and 2051, and meanwhile, the first feeding vacuum sucker 3061 and the second feeding vacuum sucker 3060 are further used for respectively reaching the two

vacuum adsorption platforms

2050 and 2051 under the driving of the first long-stroke lifting cylinder and the first short-stroke lifting cylinder.

It should be noted that, the loading operation of the loading unit 300 is as follows:

1) the feeding cart 302 is used for placing a plurality of PCB boards to be processed which are overlapped up and down, and then pushing the PCB boards to a first parking space preset in the feeding shell 301;

2) the relative position of the feeding trolley 302 and the feeding machine shell 301 is controlled to be unchanged through the first locking module;

3) the first lifting device 303 is used for controlling a plurality of vertically superposed PCBs to be processed to be lifted to a first material suction position;

4) after the first pre-positioning platform 304 slides to the second suction position along the first transverse slide rail 305 under the driving of the first driving mechanism, the first feeding vacuum chuck 3061 and the second feeding vacuum chuck 3060 slide to positions corresponding to the first suction position and the second suction position respectively along the second transverse slide rail 3062 under the driving of the second driving mechanism;

5) the first feeding vacuum sucker 3061 adsorbs a first to-be-processed PCB in the to-be-processed PCB on the first suction position under the common driving of a first long stroke lifting cylinder and a first short stroke lifting cylinder, and the first long stroke lifting cylinder and the first short stroke lifting cylinder are reset;

6) after the first long-stroke lifting cylinder and the first short-stroke lifting cylinder are reset, the first pre-positioning platform 304 slides to a first placing position along the first transverse slide rail 305, the first loading vacuum chuck 3061 is driven by the first short-stroke lifting cylinder to place a first PCB to be processed on the first pre-positioning platform 304, and then the first short-stroke lifting cylinder is reset;

7) after the first to-be-processed PCB is placed on the first pre-positioning platform 304, the first pre-positioning platform 304 adjusts the pose of the first to-be-processed PCB; after the pose of the first PCB to be processed is adjusted and positioned, the first pre-positioning platform 304 slides to the second material suction position along the first transverse slide rail 305, then the second feeding vacuum chuck 3060 sucks the first PCB to be processed under the driving of the first short stroke lifting cylinder, and the first short stroke lifting cylinder resets;

8) after the first loading vacuum chuck 3061 adsorbs a second to-be-processed PCB on the first suction position under the common driving of the first long-stroke lifting cylinder and the first short-stroke lifting cylinder, both the first long-stroke lifting cylinder and the first short-stroke lifting cylinder reset;

9) after the first long-stroke lifting cylinder and the first short-stroke lifting cylinder are reset, the first pre-positioning platform 304 slides to the first material placing position along the first transverse slide rail 305, the first feeding vacuum chuck 3061 is driven by the first short-stroke lifting cylinder to place a second PCB to be processed on the first pre-positioning platform 304 at the first material placing position, and the first short-stroke lifting cylinder is reset;

10) after the second PCB to be processed is placed on the first pre-positioning platform 304, the first pre-positioning platform 304 adjusts the pose of the second PCB to be processed; after the pose of a second PCB to be processed is adjusted and positioned, the first feeding vacuum chuck 3061 adsorbs the second PCB to be processed under the driving of the first short-stroke lifting cylinder, and the first short-stroke lifting cylinder resets;

11) after the first feeding vacuum chuck 3061 and the second feeding vacuum chuck 3060 slide along the second transverse slide rail 3062 to respectively correspond to the two

vacuum adsorption platforms

2050 and 2051, the first long-stroke lifting cylinder and the first short-stroke lifting cylinder are jointly driven to respectively place the first PCB to be processed and the second PCB to be processed on the two

vacuum adsorption platforms

2050 and 2051, so that the feeding process is completed.

Referring to fig. 13 and 14, the material taking unit 100 includes a material taking housing 101, a material taking cart 102, a second pre-positioning module, and a material taking and carrying module 103;

the material taking cart 102 is used for placing the drilled PCB, the material taking cart 102 is arranged separately from the material taking machine shell 101, the material taking cart 102 can be pushed out of the material taking machine shell 101, and the material taking cart 102 is provided with a second lifting device;

the second pre-positioning module comprises a second locking module, a second pre-positioning platform 104, a third transverse sliding rail 105, a third driving mechanism, a second discharging position, a third discharging position and a third sucking position, the second discharging position and the third sucking position are arranged in an up-and-down corresponding mode, and the third discharging position and the third sucking position are arranged horizontally;

it should be noted that the lateral distance between the third discharge position and the third suction position differs by at least the length of the second pre-positioning stage 104.

The second lifting device is used for controlling the PCB after drilling processing to descend after being lifted to a second material placing position;

the second locking module is used for limiting the position of the material taking cart 102 on a second preset parking space in the material taking machine shell 101 to be unchanged, and the preset first parking space and the first material suction position are arranged in an up-and-down corresponding mode;

the second pre-positioning platform 104 is used for adjusting the pose of the PCB after drilling; the second pre-positioning platform 104 is further configured to slide to a third suction position or a third discharge position along a third transverse sliding rail 105 under the driving of a third driving mechanism;

the material taking and carrying module 103 comprises a first material taking vacuum chuck 1031, a second material taking vacuum chuck 1032, a fourth transverse slide rail 1033, a fourth driving mechanism, a second long-stroke lifting cylinder 1034 and a second short-stroke lifting cylinder 1035, wherein the first material taking vacuum chuck 1031 and the second material taking vacuum chuck 1032 slide along the fourth transverse slide rail 1033 under the driving of the fourth driving mechanism;

the first material taking vacuum chuck 1031 and the second material taking vacuum chuck 1032 are used for respectively corresponding to the third material sucking position and the third material discharging position by sliding along the fourth transverse slide rail 1033 under the driving of the fourth driving mechanism;

the first material taking vacuum chuck 1031 is further used for reaching a second material placing position under the common driving of a second long stroke lifting cylinder 1034 and a second short stroke lifting cylinder 1035; the first material taking vacuum chuck 1031 is also used for reaching a third material sucking position under the driving of a second short stroke lifting cylinder 1035;

the second take out vacuum chuck 1032 is also operable to reach a third discharge position under the drive of a second short stroke lift cylinder 1035;

the first material taking vacuum chuck 1031 and the second material taking vacuum chuck 1032 are further used for respectively corresponding to the two

vacuum adsorption platforms

2050 and 2051 by sliding along a fourth transverse slide rail 1033 under the driving of a fourth driving mechanism, and meanwhile, the first material taking vacuum chuck 1031 and the second material taking vacuum chuck 1032 are further used for respectively reaching the two

vacuum adsorption platforms

2050 and 2051 under the driving of a second long-stroke lifting cylinder 1034 and a second short-stroke lifting cylinder 1035.

It should be noted that the blanking process of the material taking unit 100 is as follows:

1) the relative position of the material taking cart 102 in a second parking space preset in the material taking machine shell 101 is controlled to be unchanged through the second locking module, and meanwhile, the second lifting device is lifted to a second material placing position in advance;

2) after the PCB to be processed is drilled and processed by the PCB ultrafast laser drilling system 203, the first material taking vacuum chuck 1031 and the second material taking vacuum chuck 1032 slide along the fourth transverse slide rail 1033 to respectively correspond to the two

vacuum adsorption platforms

2050 and 2051, and then are respectively adsorbed on the first drilled PCB and the second drilled PCB on the two

vacuum adsorption platforms

2050 and 2051 under the common driving of the second long-stroke lifting cylinder 1034 and the second short-stroke lifting cylinder 1035, and the second long-stroke lifting cylinder 1034 and the second short-stroke lifting cylinder 1035 are both reset;

3) after the second long-stroke lifting cylinder 1034 and the second short-stroke lifting cylinder 1035 are reset, the first material taking vacuum chuck 1031 and the second material taking vacuum chuck 1032 slide along the fourth transverse slide rail 1033 to respectively correspond to the third material sucking position and the third material discharging position;

4) after the positions correspond to each other, the second pre-positioning platform 104 slides to a third material sucking position, the first material taking vacuum chuck 1031 places the first drilled PCB on the second pre-positioning platform 104 under the driving of the second short stroke lifting cylinder 1035, and the second pre-positioning platform 104 adjusts the pose of the first drilled PCB;

5) after the pose of the first drilled PCB is adjusted and positioned, the first material taking vacuum chuck 1031 adsorbs the first drilled PCB under the driving of the second short stroke lifting cylinder 1035, then the first material taking vacuum chuck 1031 places the first drilled PCB on the second lifting device of the second material placing position under the driving of the second long stroke lifting cylinder 1034 and the second short stroke lifting cylinder 1035, and the second long stroke lifting cylinder 1034 and the second short stroke lifting cylinder 1035 are both reset;

6) after the second long-stroke lifting cylinder 1034 and the second short-stroke lifting cylinder 1035 are reset, the second pre-positioning platform 104 slides to a third material placing position, the second material taking vacuum chuck 1032 is driven by the second short-stroke lifting cylinder 1035 to place the second drilled PCB on the second pre-positioning platform 104, and the second pre-positioning platform 104 adjusts the pose of the second drilled PCB;

7) after the pose of the second drilled PCB board is adjusted and positioned, the second pre-positioning platform 104 slides to a third material suction position, the first material taking vacuum chuck 1031 is driven by a second short stroke lifting cylinder 1035 to adsorb the second drilled PCB board, and the second short stroke lifting cylinder 1035 resets;

8) the second pre-positioning platform 104 slides to the third material placing position, and then the first material taking vacuum chuck 1031 places the second drilled PCB on the second lifting device of the second material placing position under the driving of the second long stroke lifting cylinder 1034 and the second short stroke lifting cylinder 1035, thereby completing the material placing process.

In addition, the driving mechanisms in the present embodiment all use servo motors.

Further, referring to fig. 15, the first lifting device and the second lifting device are both provided in number, and each of the first lifting device and the second lifting device includes a lifting cylinder 3031, a driving motor 3032 and an origin sensor 3034, an output end of the driving motor 3032 is connected to the lifting cylinder 3031 through a coupling 3033, and the origin sensor 3034 is configured to limit a lifting stroke of the lifting cylinder.

In this embodiment, the first elevating gear of a plurality of and second elevating gear all enclose into the rectangle structure to in play better supporting role, simultaneously, the first elevating gear of a plurality of goes up and down in step, and a plurality of second elevating gear goes up and down in step.

The above is an embodiment of the ultrafast laser drilling apparatus for the PCB provided by the present application, and the following is an embodiment of the ultrafast laser drilling method for the PCB provided by the present application.

For convenience of understanding, referring to fig. 16, an ultrafast laser drilling method for a PCB, to which the ultrafast laser drilling system of the above embodiment is applied, includes the following steps:

s102: performing beam expanding treatment after receiving the laser beam by a beam expander;

s103: after receiving the laser beam after beam expanding processing by the beam expander through the beam shaper, converting the laser beam with Gaussian distribution into a laser beam with flat-top Gaussian distribution;

s104: after the laser beam converted by the beam shaper is received by the scanning galvanometer, the laser beam is controlled to carry out focusing scanning on the surface of a region to be processed of the PCB to be processed through the focusing field lens in a preset scanning mode and preset scanning parameters, wherein the preset scanning parameters comprise point engraving time, galvanometer idle-moving speed and galvanometer idle-moving delay time;

Further, the scanning manner preset in step S104 includes:

when the preset aperture of the micropore is 100-300 μm, the preset scanning mode is a winding continuous scanning mode, and the winding continuous scanning mode comprises one or a combination of spiral scanning, double-spiral scanning and circular scanning.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for executing all or part of the steps of the method described in the embodiments of the present application through a computer device (which may be a personal computer, a server, or a network device). And the aforementioned storage medium includes: a U disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. An ultrafast laser drilling system of a PCB, comprising: the picosecond green laser, the beam expander, the beam shaper, the scanning galvanometer, the focusing field lens and the control module are electrically connected;

the picosecond green laser emits laser beams with Gaussian distribution;

2. The PCB ultrafast laser drilling system of claim 1, wherein the picosecond green laser has a laser wavelength of 515nm or 532nm, a pulse width of 15ps or less, a single pulse energy of 200uJ or more, and a repetition frequency of 100kHz or more.

3. The PCB ultrafast laser drilling system of claim 1, wherein the scanning galvanometer is further configured to control the laser beam to scan the region to be processed of the PCB to be processed in a single-point multi-pulse scanning manner when the preset aperture of the micro-hole is 30-100 μm;

4. An ultrafast laser drilling apparatus for PCB using the ultrafast laser drilling system for PCB as claimed in any one of claims 1 to 3, comprising: the drilling machine set, the feeding machine set and the material taking machine set;

the vacuum adsorption platform is used for placing a PCB to be processed;

5. The PCB ultrafast laser drilling device of claim 4, wherein the drilling unit further comprises a base, a CCD assembly, a laser range finder and a power meter;

6. The PCB ultrafast laser drilling equipment of claim 5, wherein the loading unit is provided with a loading machine shell, a loading cart, a first pre-positioning module and a loading carrying module;

7. The PCB ultrafast laser drilling equipment of claim 5 or 6, wherein the material taking unit is provided with a material taking machine shell, a material taking cart, a second pre-positioning module and a material taking and carrying module;

8. The PCB ultrafast laser drilling device of claim 7, wherein the first lifting device and the second lifting device are both a plurality of ones, the first lifting device and the second lifting device each comprise a lifting cylinder, a driving motor and an origin sensor, an output end of the driving motor is connected with the lifting cylinder through a coupler, and the origin sensor is used for limiting a lifting stroke of the lifting cylinder.

9. An ultrafast laser drilling method for a PCB using the ultrafast laser drilling system for a PCB as claimed in any one of claims 1 to 3, comprising the steps of:

10. The PCB ultrafast laser drilling method of claim 9, wherein the preset scanning manner in the step S104 comprises: