CN114192995A - Laser cutting method and device - Google Patents
Laser cutting method and device Download PDFInfo
- Publication number
- CN114192995A CN114192995A CN202111143211.7A CN202111143211A CN114192995A CN 114192995 A CN114192995 A CN 114192995A CN 202111143211 A CN202111143211 A CN 202111143211A CN 114192995 A CN114192995 A CN 114192995A
- Authority
- CN
- China
- Prior art keywords
- laser
- cut
- pulse width
- workpiece
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 118
- 238000005520 cutting process Methods 0.000 claims abstract description 37
- 239000004642 Polyimide Substances 0.000 claims description 37
- 239000007769 metal material Substances 0.000 claims description 37
- 229920001721 polyimide Polymers 0.000 claims description 37
- 125000005462 imide group Chemical group 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 238000003763 carbonization Methods 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 12
- 239000000428 dust Substances 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 150000003949 imides Chemical class 0.000 description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000370 laser capture micro-dissection Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
Abstract
A laser cutting method and device. The method comprises the steps of obtaining material attributes corresponding to parts to be cut on a workpiece to be cut; obtaining each pulse width laser matched with each material attribute according to each material attribute corresponding to each part to be cut; and respectively cutting the parts to be cut of the workpiece to be cut by adopting the pulse width lasers. The laser cutting method and the laser cutting device adopt lasers with different pulse widths to cut different materials on a workpiece to be cut aiming at different materials so as to ensure that the pulse width of each laser is matched with the attribute of each material, and further reduce the heat effect of the laser on the part to be cut where the material is located, the lower the degree of the heat effect, the lower the carbonization degree generated by the cutting part can be, the smaller the carbonization degree is, the better the quality of the cut workpiece is, and the better the use effect of the cut workpiece can be ensured.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser cutting method and a laser cutting device.
Background
Laser cutting is a technique that uses laser cutting of materials, typically for industrial manufacturing applications. The working principle of laser cutting is generally to direct a high power laser output through optics. The laser optical system and the numerical control system are used for guiding the generated laser beam, focusing the laser beam to the material through guiding, and then melting, burning, evaporating or blowing away the material by gas jet flow so as to complete the cutting of the material.
The workpiece to be cut contains materials with different attributes, some materials are metal, some materials are non-metal, and the existing laser cutting method adopts laser with the same pulse width to cut each material of the workpiece to be cut, so that partial materials are carbonized, and the using effect of the cut workpiece is reduced.
In summary, the laser cutting method of the prior art can cause the workpiece after cutting to have carbonization.
Thus, there is a need for improvements and enhancements in the art.
Disclosure of Invention
In order to solve the technical problems, the invention provides a laser cutting method and a laser cutting device, which solve the problem that the laser cutting method in the prior art can cause the phenomenon of carbonization of a cut workpiece.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a laser cutting method, wherein material attributes corresponding to portions to be cut on a workpiece to be cut are obtained;
obtaining each pulse width laser matched with each material attribute according to each material attribute corresponding to each part to be cut;
and respectively cutting the parts to be cut of the workpiece to be cut by adopting the pulse width lasers.
In one implementation manner, the obtaining, according to each material attribute corresponding to each portion to be cut, each pulse width laser matched to each material attribute includes:
according to the material attributes, obtaining a polyimide material and a metal material in the material attributes;
and obtaining picosecond pulse width laser matched with the polyimide material and nanosecond pulse width laser matched with the metal material in each pulse width laser according to the polyimide material and the metal material.
In one implementation, the cutting each to-be-cut portion of the workpiece to be cut by using each pulse width laser includes:
obtaining a flexible circuit board to be cut in the workpiece to be cut according to the workpiece to be cut, wherein the flexible circuit board to be cut is composed of a polyimide material and metal materials which are arranged on the polyimide material at intervals;
according to the pulse width laser, picosecond pulse width laser matched with the polyimide material and nanosecond pulse width laser matched with the metal material in the pulse width laser are obtained;
and shooting the picosecond pulse width laser to the polyimide material and the nanosecond pulse width laser to the metal material by alternately shooting the picosecond pulse width laser and the nanosecond pulse width laser to cut the workpiece to be cut.
In one implementation, the cutting the workpiece to be cut by alternately emitting the picosecond pulse width laser and the nanosecond pulse width laser, and emitting the picosecond pulse width laser to the polyimide material and the nanosecond pulse width laser to the metal material includes:
obtaining the position of the imide material and the position of the metal material;
obtaining a path matched with the position of the imide material and the position of the metal material according to the position of the imide material and the position of the metal material;
and alternately emitting the picosecond pulse width laser and the nanosecond pulse width laser along the path to cut the workpiece to be cut.
In one implementation, the cutting the workpiece to be cut according to each pulse width laser includes:
obtaining the thickness corresponding to each part to be cut;
obtaining the laser intensity corresponding to each pulse width laser according to the thickness corresponding to each part to be cut;
and cutting the workpiece to be cut through the pulse width lasers corresponding to the laser intensities.
In a second aspect, an embodiment of the present invention further provides a laser cutting apparatus, where the apparatus includes the following components:
the laser generation module is used for generating each pulse width laser matched with each material attribute corresponding to each part to be cut;
and the laser scanning module is used for emitting each pulse width laser generated by the laser generating module to each part to be cut.
In one implementation, the laser generation module includes a nanosecond ultraviolet laser and a picosecond ultraviolet laser, and the laser scanning module is located on an emergent light path of the nanosecond ultraviolet laser and the picosecond ultraviolet laser.
In one implementation, the laser generation module further includes a beam combiner located on the nanosecond ultraviolet laser and the picosecond ultraviolet laser exit light path, and the laser scanning module is located on the exit light path emitted by the beam combiner.
In one implementation, the laser scanning module includes a laser scanning galvanometer located on an exit light path of the beam combiner, and a lens located on an exit light path of the laser scanning galvanometer.
In one implementation mode, the device further comprises a dust collector, a dust collection cavity communicated with the dust collector, and an adsorption cavity communicated with the dust collector, wherein the dust collection cavity is located on the emergent light path of the lens, and the adsorption cavity is used for adsorbing each workpiece to be cut at the part to be cut through the adsorption force of the dust collector.
Has the advantages that: the laser cutting method and the laser cutting device adopt lasers with different pulse widths to cut different materials on a workpiece to be cut aiming at different materials so as to ensure that the pulse width of each laser is matched with the attribute of each material, and further reduce the heat effect of the laser on the part to be cut where the material is located, the lower the degree of the heat effect, the lower the carbonization degree generated by the cutting part can be, the smaller the carbonization degree is, the better the quality of the cut workpiece is, and the better the use effect of the cut workpiece can be ensured.
Drawings
FIG. 1 is an overall flow chart of the present invention;
FIG. 2 is a block diagram of the apparatus of the present invention;
fig. 3 is a structure diagram of a flexible wiring board in the embodiment.
The notations in the figures have the following meanings:
1. a laser generation module; 11. a nanosecond ultraviolet laser; 12. a picosecond ultraviolet laser; 13. a beam combining mirror; 14. a controller;
2. a vacuum dust removal module; 21. a vacuum cleaner; 22. a dust collection cavity; 23. an adsorption cavity; 24. a communicating pipe;
3. a flexible circuit board; 31. a polyimide substrate; 32. a metal contact piece;
4. a laser scanning module; 41. laser scanning galvanometers; 42. a lens.
Detailed Description
The technical scheme of the invention is clearly and completely described below by combining the embodiment and the attached drawings of the specification. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Laser cutting has been found to be a technique for cutting materials using laser light, and is commonly used in industrial manufacturing applications. The working principle of laser cutting is generally to direct a high power laser output through optics. A laser optical system and a numerical control system are used to guide the generated laser beam. Cutting of the material is accomplished by directing a focused laser beam at the material, which then melts, burns, vaporizes, or is blown away by a gas jet. The workpiece to be cut contains materials with different attributes, some materials are metal, some materials are non-metal, and the existing laser cutting method adopts laser with the same pulse width to cut each material of the workpiece to be cut, so that partial materials are carbonized, and the using effect of the cut workpiece is reduced. The prior art laser cutting method can cause the phenomenon of carbonization of the workpiece after cutting.
In order to solve the technical problems, the invention provides a laser cutting method and a laser cutting device, which solve the problem that the laser cutting method in the prior art can cause the phenomenon of carbonization of a cut workpiece. In specific implementation, obtaining material attributes corresponding to each part to be cut on a workpiece to be cut; obtaining each pulse width laser matched with each material attribute according to each material attribute corresponding to each part to be cut; and respectively cutting the parts to be cut of the workpiece to be cut by adopting the pulse width lasers. The laser cutting method and the laser cutting device adopt lasers with different pulse widths to cut different materials on the workpiece to be cut aiming at different materials so as to ensure that the pulse width of each laser is matched with the attribute of each material, reduce the carbonization degree generated by a cutting part and ensure the using effect of the cut workpiece.
For example, the workpiece to be cut includes two parts a and B, the part a corresponds to a material a, the part B corresponds to a material B, wherein the part a is very easy to generate carbonization, has a certain requirement on the pulse width of laser, and does not generate carbonization only within a set pulse width range a ', while the requirement on the pulse width of the part B is different from the requirement on the pulse width of the part a (the pulse width range corresponding to the part B'), if the workpiece to be cut is uniformly cut by adopting the pulse width laser suitable for the part B, the carbonization of the part a is caused; if the workpiece to be cut is uniformly cut by adopting the pulse width a' suitable for the part A, the cutting of the part B is not ideal. In order to avoid the problems, the invention adopts laser with alternate pulse width, namely when the laser irradiates part A, the pulse width range of the laser is a'; when the laser light is irradiated to the portion B, the pulse width range of the laser light is B'. Thus, the laser with different pulse widths is emitted alternately to cut the workpiece to be cut, and the carbonization phenomenon can be prevented.
Exemplary method
The laser cutting method of the embodiment can be applied to terminal equipment. In this embodiment, as shown in fig. 1, the laser cutting method specifically includes the following steps:
s100, obtaining the material attributes corresponding to the parts to be cut on the workpiece to be cut.
The workpiece to be cut in this embodiment is a flexible wiring board 3 composed of a polyimide laminate 31 and a metal contact 32, or a flexible board composed of other materials.
The Flexible Printed Circuit (FPC) has the characteristics of high wiring density, light weight and thin thickness. The method is mainly used for a plurality of products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and the like. There are many areas on the FPC board, which are composed of many golden conductive contact pieces (metal contact pieces 32) like golden fingers, and the conductive contact pieces are called "golden fingers" because the surfaces thereof are plated with gold and the conductive contact pieces are arranged like fingers. For the FPC board, after the electroplating process is finished, cutting is needed, because of the property problem of the FPC board material, a large amount of burrs are generated by direct mechanical forming, a laser cutting mode is generally adopted, then the section of the golden finger is manually repaired, and a carbonized layer is wiped off.
S200, obtaining each pulse width laser matched with each material attribute according to each material attribute corresponding to each part to be cut.
In this embodiment, lasers with different pulse widths are used for materials of different portions of a workpiece to be cut, and the step S200 specifically includes the following steps S201 and S202:
s201, obtaining the polyimide material and the metal material in the material attributes according to the material attributes.
The workpiece to be cut in the embodiment is composed of a polyimide material and a metal material, wherein the metal material is copper.
S202, according to the polyimide material and the metal material, picosecond pulse width lasers matched with the polyimide material and nanosecond pulse width lasers matched with the metal material in the pulse width lasers are obtained.
In this embodiment, the wavelength of the picosecond pulse width laser is 355nm, and the pulse width is 7 picoseconds; the wavelength of nanosecond pulse width laser is 355nm, and the pulse width is 10-20 ns.
S300, cutting the parts to be cut of the workpiece to be cut respectively by adopting the pulse width lasers.
In this embodiment, different portions of a workpiece to be cut are cut by using lasers with different pulse widths, and the step S300 includes the following steps S301, S302, and S303:
s301, obtaining the flexible circuit board 3 to be cut in the workpiece to be cut according to the workpiece to be cut, wherein the flexible circuit board 3 to be cut is made of polyimide materials and metal materials which are arranged on the polyimide materials at intervals.
In this embodiment, the polyimide material is a material that is easily carbonized, the metal material is copper, and if the polyimide material between adjacent copper that are arranged at intervals is carbonized, a short circuit will occur between the adjacent copper, thereby affecting the use.
S302, according to the pulse width laser, picosecond pulse width laser matched with the polyimide material and nanosecond pulse width laser matched with the metal material in the pulse width laser are obtained.
And S303, shooting the picosecond pulse width laser to the polyimide material and the nanosecond pulse width laser to the metal material by alternately emitting the picosecond pulse width laser and the nanosecond pulse width laser, and cutting the workpiece to be cut. The specific process comprises the following steps: obtaining the position of the imide material and the position of the metal material; obtaining a path matched with the position of the imide material and the position of the metal material according to the position of the imide material and the position of the metal material; and alternately emitting the picosecond pulse width laser and the nanosecond pulse width laser along the path to cut the workpiece to be cut.
In the embodiment, paths for transmitting picosecond pulse width laser and nanosecond pulse width laser are planned according to the position of the imide material and the position of the metal material so as to ensure that the picosecond pulse width laser can be accurately irradiated to the imide material, but not the nanosecond pulse width laser is irradiated to the imide material, so that the carbonization phenomenon of the imide material is further prevented.
In this embodiment, the method may also be to cut the imide material only with the picosecond pulse width laser, and simultaneously cut the metal material with the picosecond pulse width laser and the nanosecond pulse width laser, and cut the material to be cut with the above-mentioned combined laser, and when cutting along the arrow shown in fig. 3 in a reciprocating manner, the method can complete the cutting of the imide material while completing the cutting of the metal material, thereby avoiding the occurrence of carbonization of the imide material after the imide material is cut, and because the metal material is not cut yet, the imide material after the cutting is carbonized while the nanosecond pulse width laser is continuously moved in a reciprocating manner to cut the metal material.
When considering the influence of the thickness of the portion to be cut on the cutting, the step S300 includes the following steps S304, S305, S306:
s304, obtaining the thickness corresponding to each part to be cut.
The thickness in this embodiment is a thickness along the laser incident direction.
S305, obtaining the laser intensity corresponding to each pulse width laser according to the thickness corresponding to each part to be cut.
S306, cutting the workpiece to be cut through the pulse width lasers corresponding to the laser intensities.
In summary, the invention uses lasers with different pulse widths to cut different materials on a workpiece to be cut aiming at different materials, so as to ensure that the pulse width of each laser is matched with the attribute of each material, and further reduce the thermal effect of the laser on the part to be cut where the material is located, the lower the degree of the thermal effect, the lower the carbonization degree generated by the cutting part, and the smaller the carbonization degree, the better the quality of the cut workpiece, and the better the use effect of the cut workpiece.
Exemplary devices
The embodiment also provides a laser cutting device, the device includes following component parts:
and the laser generating module 1 is used for generating each pulse width laser matched with each material attribute corresponding to each part to be cut.
And the laser scanning module 4 is used for emitting each pulse width laser generated by the laser generating module 1 to each part to be cut.
And the vacuum dust removal module 2 is used for collecting waste materials generated in the laser cutting process.
These are described below:
as shown in fig. 2, the laser generation module 1 includes a nanosecond ultraviolet laser 11, a picosecond ultraviolet laser 12, a beam combiner 13, and a controller 14 for controlling the nanosecond ultraviolet laser 11 and the picosecond ultraviolet laser 12, where the beam combiner 13 is located on an emitting light path of the nanosecond ultraviolet laser 11 and the picosecond ultraviolet laser 12.
The laser scanning module 4 comprises a laser scanning galvanometer 41 positioned on the emergent light path of the beam combining mirror 13, and a lens 42 positioned on the emergent light path of the laser scanning galvanometer 41
The vacuum dust removal module 2 comprises a dust collector 21, a dust collection cavity 22 communicated with the dust collector 21, and an adsorption cavity 23 communicated with the dust collector 21, wherein the dust collector 21 and the dust collection cavity 22 are communicated through a communication pipe 24, and the communication pipe 24 is a corrugated pipe.
The cutting process of the present device is described in detail below:
step one, the flexible circuit board 3 is placed on the adsorption cavity 23, and the software in the controller 14 sends out an instruction to control the dust collector 21 to be started, so that the flexible circuit board 3 is paved and fixed.
And step two, inputting parameters of the pattern, the coordinate position, the thickness of the metal contact 32 and the thickness of the polyamide pressboard 31 which are required to be cut by the flexible circuit board 3 into the controller 14, and automatically generating a processing path and laser processing parameters by processing software built in the controller 14.
And step three, controlling the nanosecond ultraviolet laser 11 and the picosecond ultraviolet laser 12 to respectively emit nanosecond pulse width lasers and picosecond pulse width lasers through processing software built in the controller 14, and controlling the laser scanning galvanometer 41 through a program to enable the focused light beams passing through the lens 42 to cut the flexible circuit board 3. In the laser cutting process, when the laser moves to the metal contact 32, the controller 14 controls the nanosecond ultraviolet laser 11 to emit laser, or the nanosecond ultraviolet laser 11 and the picosecond ultraviolet laser 12 emit laser simultaneously, so that the metal contact 32 is cut by adopting higher laser capacity, and when the laser moves to the polyimide substrate 31 between the adjacent metal contacts 32, the controller 14 controls the nanosecond ultraviolet laser 11 to be closed, namely the nanosecond ultraviolet laser 11 is stopped to emit laser, and only the picosecond ultraviolet laser 12 emits laser, so that the polyimide substrate 31 in front of the adjacent metal contact 32 is ensured to realize high-quality non-carbonization cutting. By matching the laser processing parameters and increasing the laser processing times, the laser moves back and forth along the arrow direction in fig. 3 to cut the flexible wiring board 3, and the cutting depth is increased continuously until the flexible wiring board 3 is completely cut into two parts.
In the cutting process, the dust suction cavity 22 is located above the flexible circuit board 3, the laser emitted from the lens 42 is emitted to the flexible circuit board 3 through the inside of the dust suction cavity 22, and in the laser cutting process, waste materials generated by cutting the flexible circuit board 3 enter the dust collector 21 through the dust suction cavity 22, so that the waste materials are prevented from polluting the environment.
In this embodiment, when the nanosecond ultraviolet laser 11 and the picosecond ultraviolet laser 12 both emit laser to cut the metal contact 32, the two laser beams need to be changed into a coaxial laser beam by the beam combiner 13, and then sequentially pass through the laser scanning galvanometer 41 and the lens 42 to be emitted to the metal contact 32.
In summary, the invention discloses a laser cutting method and a laser cutting device, wherein the method comprises the following steps: obtaining material attributes corresponding to parts to be cut on a workpiece to be cut; obtaining each pulse width laser matched with each material attribute according to each material attribute corresponding to each part to be cut; and respectively cutting the parts to be cut of the workpiece to be cut by adopting the pulse width lasers. The invention adopts picosecond pulse width laser aiming at the polyimide substrate 31, and can avoid carbonization, thereby preventing short circuit between two adjacent metal contact pieces 32.
In addition, the invention adopts ultraviolet laser with the pulse width of nanosecond and picosecond respectively to cut the gold-plated copper metal contact sheet 32 and the polyimide press amino plate 31 on the flexible circuit board 3, and through the matching of relevant laser processing parameters, the two types of laser can just finish the processing of corresponding materials when the processing times are the same, thereby preventing the carbonization aggravation of the polyimide press amino plate 31 caused by over processing.
The invention adopts the ultraviolet laser with the pulse width of nanosecond and picosecond to cut the gold-plated copper metal contact 32 and the polyimide press amino plate 31 on the flexible circuit board 3, because the polyimide press amino plate 31 is cut by the picosecond ultraviolet laser, the non-carbonization of the material can well prevent the micro short circuit between the adjacent metal contact 32, and simultaneously, the material covering the metal contact 32 (the part of the polyimide press amino plate 31 below the metal contact 32) has larger parameter tolerance, even if the material (the part of the polyimide press amino plate 31 below the metal contact 32) is partially carbonized due to the overhigh laser energy, the final performance of the flexible circuit board 3 can not be influenced.
The invention adopts double-beam processing, because the picosecond ultraviolet laser does not need to process the copper metal contact piece 32, compared with the single-beam picosecond ultraviolet laser, the requirement on laser energy is much lower, but the nanosecond ultraviolet laser is adopted for the copper metal contact piece 32, and the cost of the nanosecond ultraviolet laser is lower than that of the picosecond ultraviolet laser, thereby reducing the cost of the whole system.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A laser cutting method, comprising:
obtaining material attributes corresponding to parts to be cut on a workpiece to be cut;
obtaining each pulse width laser matched with each material attribute according to each material attribute corresponding to each part to be cut;
and respectively cutting the parts to be cut of the workpiece to be cut by adopting the pulse width lasers.
2. The laser cutting method according to claim 1, wherein obtaining each pulse width laser matched with each material property according to each material property corresponding to each part to be cut comprises:
according to the material attributes, obtaining a polyimide material and a metal material in the material attributes;
and obtaining picosecond pulse width laser matched with the polyimide material and nanosecond pulse width laser matched with the metal material in each pulse width laser according to the polyimide material and the metal material.
3. The laser cutting method according to claim 1, wherein said cutting each of the portions to be cut of the workpiece to be cut with each of the pulse width lasers respectively comprises:
obtaining a flexible circuit board to be cut in the workpiece to be cut according to the workpiece to be cut, wherein the flexible circuit board to be cut is composed of a polyimide material and metal materials which are arranged on the polyimide material at intervals;
according to the pulse width laser, picosecond pulse width laser matched with the polyimide material and nanosecond pulse width laser matched with the metal material in the pulse width laser are obtained;
and shooting the picosecond pulse width laser to the polyimide material and the nanosecond pulse width laser to the metal material by alternately shooting the picosecond pulse width laser and the nanosecond pulse width laser to cut the workpiece to be cut.
4. The laser cutting method according to claim 3, wherein the cutting of the work to be cut by alternately emitting the picosecond pulse width laser and the nanosecond pulse width laser, the picosecond pulse width laser being emitted to the polyimide material, and the nanosecond pulse width laser being emitted to the metal material, comprises:
obtaining the position of the imide material and the position of the metal material;
obtaining a path matched with the position of the imide material and the position of the metal material according to the position of the imide material and the position of the metal material;
and alternately emitting the picosecond pulse width laser and the nanosecond pulse width laser along the path to cut the workpiece to be cut.
5. The laser cutting method according to claim 1, wherein the cutting the workpiece to be cut according to each of the pulse width lasers includes:
obtaining the thickness corresponding to each part to be cut;
obtaining the laser intensity corresponding to each pulse width laser according to the thickness corresponding to each part to be cut;
and cutting the workpiece to be cut through the pulse width lasers corresponding to the laser intensities.
6. A laser cutting device, characterized in that the device comprises the following components:
the laser generation module is used for generating each pulse width laser matched with each material attribute corresponding to each part to be cut;
and the laser scanning module is used for emitting each pulse width laser generated by the laser generating module to each part to be cut.
7. The laser cutting device according to claim 6, wherein the laser generating module comprises a nanosecond ultraviolet laser and a picosecond ultraviolet laser, and the laser scanning module (4) is positioned on the emergent light path of the nanosecond ultraviolet laser and the picosecond ultraviolet laser.
8. The laser cutting apparatus according to claim 7, wherein the laser generating module further includes a beam combiner disposed on an exit optical path of the nanosecond ultraviolet laser and the picosecond ultraviolet laser, and the laser scanning module is disposed on an exit optical path emitted from the beam combiner.
9. The laser cutting device according to claim 8, wherein the laser scanning module comprises a laser scanning galvanometer located on an exit optical path of the beam combining mirror, and a lens located on an exit optical path of the laser scanning galvanometer.
10. The laser cutting device according to claim 9, further comprising a vacuum cleaner, a vacuum chamber in communication with the vacuum cleaner, and an adsorption chamber in communication with the vacuum cleaner, wherein the vacuum chamber is located on the light path from the lens, and the adsorption chamber is configured to adsorb the workpiece to be cut on which each of the portions to be cut is located by an adsorption force of the vacuum cleaner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111143211.7A CN114192995A (en) | 2021-09-28 | 2021-09-28 | Laser cutting method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111143211.7A CN114192995A (en) | 2021-09-28 | 2021-09-28 | Laser cutting method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114192995A true CN114192995A (en) | 2022-03-18 |
Family
ID=80646168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111143211.7A Pending CN114192995A (en) | 2021-09-28 | 2021-09-28 | Laser cutting method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114192995A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114951962A (en) * | 2022-05-23 | 2022-08-30 | 深圳市杰普特光电股份有限公司 | Cutting method, device, system, laser, electronic device and storage medium |
| CN114951962B (en) * | 2022-05-23 | 2024-04-30 | 深圳市杰普特光电股份有限公司 | Cutting method, cutting device, cutting system, laser, electronic equipment and storage medium |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581437A (en) * | 2011-08-24 | 2012-07-18 | 唐山松下产业机器有限公司 | Welder, system and method capable of managing welding operation |
| CN206998047U (en) * | 2017-05-11 | 2018-02-13 | 宁德新能源科技有限公司 | Laser cutting device |
| CN109048072A (en) * | 2018-08-21 | 2018-12-21 | 深圳市创客工场科技有限公司 | Laser processing, device, equipment and computer readable storage medium |
| CN110072660A (en) * | 2016-10-24 | 2019-07-30 | 伊利诺斯工具制品有限公司 | System and method for selecting welding parameter |
| CN111098032A (en) * | 2019-12-30 | 2020-05-05 | 武汉可为光电自动化科技股份有限公司 | Laser power self-matching method and device based on welding material |
| CN210548928U (en) * | 2019-07-30 | 2020-05-19 | 华中科技大学 | Device for separating transparent brittle material by laser composite cutting |
| CN111331261A (en) * | 2020-03-26 | 2020-06-26 | 英诺激光科技股份有限公司 | Laser polishing process method and device for cutting cross section of superhard material |
-
2021
- 2021-09-28 CN CN202111143211.7A patent/CN114192995A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581437A (en) * | 2011-08-24 | 2012-07-18 | 唐山松下产业机器有限公司 | Welder, system and method capable of managing welding operation |
| CN110072660A (en) * | 2016-10-24 | 2019-07-30 | 伊利诺斯工具制品有限公司 | System and method for selecting welding parameter |
| CN206998047U (en) * | 2017-05-11 | 2018-02-13 | 宁德新能源科技有限公司 | Laser cutting device |
| CN109048072A (en) * | 2018-08-21 | 2018-12-21 | 深圳市创客工场科技有限公司 | Laser processing, device, equipment and computer readable storage medium |
| CN210548928U (en) * | 2019-07-30 | 2020-05-19 | 华中科技大学 | Device for separating transparent brittle material by laser composite cutting |
| CN111098032A (en) * | 2019-12-30 | 2020-05-05 | 武汉可为光电自动化科技股份有限公司 | Laser power self-matching method and device based on welding material |
| CN111331261A (en) * | 2020-03-26 | 2020-06-26 | 英诺激光科技股份有限公司 | Laser polishing process method and device for cutting cross section of superhard material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114951962A (en) * | 2022-05-23 | 2022-08-30 | 深圳市杰普特光电股份有限公司 | Cutting method, device, system, laser, electronic device and storage medium |
| CN114951962B (en) * | 2022-05-23 | 2024-04-30 | 深圳市杰普特光电股份有限公司 | Cutting method, cutting device, cutting system, laser, electronic equipment and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7404316B2 (en) | Laser processing apparatus, method for laser processing a workpiece, and related configurations | |
| JP6181031B2 (en) | Method and apparatus for forward deposition on a substrate by energy transfer of burst ultrafast laser pulses | |
| CN108098147B (en) | Double-sided laser processing method for PCB array micropores | |
| US6417481B2 (en) | Method and a device for heating at least two elements by means of laser beams of high energy density | |
| US20130164506A1 (en) | Apparatus for the selective separation of two layers of material using an ultrashort pulse source of electromagnetic radiation | |
| KR20110133555A (en) | A method and system for electrical circuit repair | |
| CN105127604A (en) | Laser processing system and method | |
| CN110625271A (en) | Ultrafast laser PCB drilling equipment and method thereof | |
| CN105562939A (en) | Multi-wavelength femtosecond laser scanning type etching method for printed circuit board | |
| US20210107091A1 (en) | Method and system for extending optics lifetime in laser processing apparatus | |
| CN103056527A (en) | Device and method for laser etching of conducting film layers on touch on lens (TOL) and one glass solution (OGS) touch components | |
| CN115382852A (en) | Device and method for removing residual glue on PCB | |
| JP4646690B2 (en) | Gold plating peeling device | |
| CN111515526A (en) | Multi-beam processing device and method | |
| CN115666003A (en) | Circuit board blind slot manufacturing method and system | |
| CN103675984A (en) | Optical fiber, optical fiber device and laser processing device | |
| KR100824962B1 (en) | Apparatus and method for cutting substrate using ultrafast frequency laser | |
| KR100921662B1 (en) | Apparatus and method for cutting substrate using UV laser | |
| CN114192995A (en) | Laser cutting method and device | |
| CN210967521U (en) | Equipment for ultrafast laser PCB drilling | |
| CN107511596A (en) | The laser machining device and method of multilayer material | |
| CN114521061B (en) | Laser repair method and device for short circuit of printed circuit board | |
| JPH11309594A (en) | Laser beam machining device and its working parts | |
| CN109940284B (en) | Circuit board golden finger laser cutting method and system | |
| CN113146060A (en) | Laser processing device and method for rapidly etching large-format conductive film by multiple beams |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |