CN114951962A - Cutting method, device, system, laser, electronic device and storage medium - Google Patents
Cutting method, device, system, laser, electronic device and storage medium Download PDFInfo
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- CN114951962A CN114951962A CN202210565902.4A CN202210565902A CN114951962A CN 114951962 A CN114951962 A CN 114951962A CN 202210565902 A CN202210565902 A CN 202210565902A CN 114951962 A CN114951962 A CN 114951962A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 194
- 238000000034 method Methods 0.000 title claims abstract description 69
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- 238000012545 processing Methods 0.000 description 10
- 238000003698 laser cutting Methods 0.000 description 8
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- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
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- 229910003460 diamond Inorganic materials 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The cutting method, the device, the system, the laser, the electronic equipment and the storage medium provided by the invention conveniently comprise the following steps: determining the position to be cut of a target object; if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut; and controlling the laser to switch the current pulse width parameter to the pulse width parameter and then controlling the position to be cut. The cutting method provided by the embodiment of the invention can realize the function of switching the pulse width parameters of the laser in the continuous cutting process, uses the optimal pulse width parameters suitable for the cutting part, has quick response time, can reduce or eliminate the surface burrs and the heat affected zone of the target object, and has good cutting quality.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a cutting method, a cutting device, a cutting system, a laser, electronic equipment and a storage medium.
Background
The laser cutting is a novel cutting technology developed relative to the traditional saw blade cutting in the industry, the laser cutting process is that a laser beam forms a high-energy-density light spot through a focusing lens group and is focused on the surface of a processed object, and the high-energy-density light beam instantly melts or gasifies a processed material at high temperature to finish the removal of the material.
However, the laser processing technology can only continuously cut the same object with different materials by using the same pulse width parameter, which results in that some materials may have a little burr on the cut surface of the object due to inadaptation of the parameter, thereby affecting the quality of the product.
Disclosure of Invention
An object of the present invention is to provide a cutting method, apparatus, system, laser, electronic device and storage medium, which can reduce or even eliminate the surface burr and heat affected zone of the target object, and improve the processing precision. And expanding the applicable scene.
In a first aspect, the present invention provides a method of cutting, the method comprising: determining the position to be cut of a target object; if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut; and controlling a laser to switch the current pulse width parameter to the pulse width parameter, and then controlling to cut the position to be cut.
In a second aspect, the present invention provides a method of cutting, the method comprising: receiving a target pulse width parameter sent by a control terminal; the target pulse width parameter is the pulse width parameter corresponding to the position to be cut determined by the control terminal under the condition that the material type corresponding to the position to be cut is inconsistent with the material type of the last section of cutting position; and switching the current pulse width parameter to the target pulse width parameter.
In a third aspect, the present invention provides a cutting device comprising: the determining module is used for determining the position to be cut of the target object; if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut; and the control module is used for controlling the laser to switch the current pulse width parameter to the pulse width parameter and then controlling to cut the position to be cut.
In a fourth aspect, the present invention provides a laser, wherein the laser is in communication connection with a control terminal; the laser is used for: receiving a target pulse width parameter sent by a control terminal; the target pulse width parameter is the pulse width parameter corresponding to the position to be cut determined by the control terminal under the condition that the material type corresponding to the position to be cut is inconsistent with the material type of the last section of cutting position; and switching the current pulse width parameter to the target pulse width parameter.
In a fifth aspect, the present disclosure provides a cutting system comprising an electronic device and a cutter, wherein the electronic device and the cutter are electrically connected; the electronic device is used for realizing the cutting method of the first aspect.
In a sixth aspect, the present invention provides an electronic device, comprising a processor and a memory, wherein the memory stores a computer program executable by the processor, and the processor can execute the computer program to implement the cutting method of the first aspect.
In a seventh aspect, the present invention provides a readable storage medium, on which a computer program is stored, which, when executed by a processor, implements the cutting method according to the first aspect or the second aspect.
The invention provides a cutting method, a device, a system, a laser, electronic equipment and a storage medium, wherein the method comprises the following steps: the method comprises the steps of determining a position to be cut of a target object, determining a pulse width parameter corresponding to the position to be cut when the material type corresponding to the position to be cut is determined to be inconsistent with the material type of the last section of cutting position, controlling a laser to switch the current pulse width parameter to the pulse width parameter, and controlling to cut the position to be cut.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a scenario provided in an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating the effect of a conventional laser cutting method;
fig. 3 is a block diagram of an electronic device according to an embodiment of the present invention;
FIG. 4 is a schematic flow chart of a cutting method according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a battery pole piece cutting process according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating an effect of the cutting method according to the embodiment of the present invention;
FIG. 7 is a schematic flow chart of another cutting method according to an embodiment of the present invention;
fig. 8 is a cutting path of a battery pole piece according to an embodiment of the present invention;
FIG. 9 is a second schematic flow chart of another cutting method according to the embodiment of the present invention;
fig. 10 is a third schematic flow chart of another cutting method according to the embodiment of the present invention;
FIG. 11 is a functional block diagram of a cutting apparatus according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a cutting system according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Laser cutting is widely applied in the field of preparation of products such as chips, lithium ion batteries and the like because of the advantages of high productivity, high yield, easy automation operation, low cost and the like. However, the laser processing technology can only continuously cut the same object with different materials by using the same pulse width parameter, which results in that some materials may have a little burr on the cut surface of the object due to inadaptation of the parameter, thereby affecting the quality of the product.
Taking a battery pole piece as an example, please refer to fig. 1, and fig. 1 is a schematic view of a scene provided by an embodiment of the present invention, where the scene includes: the control terminal 100, the laser 111, the galvanometer 112, the focusing field lens 113 and the battery pole piece 120, wherein the battery pole piece 120 is located in a certain range near the focus of the focusing field lens 113. The control terminal 100 is electrically connected to a cutter 110 consisting of a laser 111, a galvanometer 112 and a focusing field lens 113.
The cutting of the battery pole piece is one of the important steps in the production of the lithium ion battery, and comprises the cutting of a coating material and a metal foil, and because the problems of burrs, powder falling, white exposure and the like are easily caused by adopting mechanical cutting methods such as circular rolling cutter cutting, die cutting and the like in the traditional mode, the potential safety hazards such as overheating, short circuit, explosion and the like exist in the battery, and therefore, the laser cutting mode becomes the mainstream cutting mode of the battery pole piece.
As shown in fig. 1, the control terminal 100 controls the laser 111 to emit a laser beam, outputs laser to act on a to-be-cut portion of the battery pole piece 120 after passing through the galvanometer 112 and the focusing field lens 113, and then controls the galvanometer 112 to move, so that the focused laser moves on the battery pole piece 120, and a cutting effect is achieved.
It can be seen that, the laser processing technology can only be applied to cutting different pole piece materials by using the same pulse width parameter, which results in some pole piece materials possibly not being suitable for the parameter, and the cut surface of the pole piece still has a few burrs, as shown in fig. 2, fig. 2 is an effect diagram of the existing laser cutting mode, and as can be seen from the surface diagram, the thermal influence area generated in the cut surface by the existing cutting mode is about 100 μm, and the burrs are about 10 μm, which affects the quality of the battery.
In order to solve the above problem, the cutting method provided in the embodiment of the present invention can implement a laser pulse width varying function in a continuous cutting process of a same product, and select corresponding optimal cutting parameters for cutting positions of different material types of the same product, so as to solve the problem of an excessively large burr in the current laser cutting process.
Referring to fig. 3, fig. 3 is a block diagram of an electronic device according to an embodiment of the present invention, and referring to fig. 3, an electronic device 300 includes a memory 301, a processor 302, and a communication interface 303, where the memory 301, the processor 302, and the communication interface 303 are electrically connected to each other directly or indirectly to implement data transmission or interaction. For example, the components may be electrically connected to each other via one or more communication buses or signal lines.
The memory 301 may be used to store software programs and modules, such as instructions/modules of the cutting apparatus 400 provided in the embodiment of the present invention, which may be stored in the memory 301 in the form of software or firmware (firmware) or may be fixed in an Operating System (OS) of the electronic device 300, and the processor 302 executes the software programs and modules stored in the memory 301, so as to perform various functional applications and data processing. The communication interface 303 may be used for communicating signaling or data with other node devices.
The Memory 301 may be, but is not limited to, a Random Access Memory (RAM), a Read Only Memory (ROM), a Programmable Read-Only Memory (PROM), an Erasable Read-Only Memory (EPROM), an electrically Erasable Read-Only Memory (EEPROM), and the like.
The processor 302 may be an integrated circuit chip having signal processing capabilities. The processor 302 may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components.
It will be appreciated that the configuration shown in fig. 3 is merely illustrative and that electronic device 300 may include more or fewer components than shown in fig. 3 or have a different configuration than shown in fig. 3. The components shown in fig. 3 may be implemented in hardware, software, or a combination thereof.
Referring to fig. 4, fig. 4 is a schematic flow chart of a cutting method according to an embodiment of the present invention, where the method may use the electronic device shown in fig. 3 as an execution main body, and the method includes:
s406, determining the position to be cut of the target object.
In the embodiment of the present invention, the target object may be, but is not limited to, a battery tab, a diamond, a chip, etc., taking a battery pole piece as an example, please refer to fig. 5, fig. 5 is a schematic diagram of cutting a battery pole piece according to an embodiment of the present invention, where the cutting of the pole piece is divided into three parts, a first part is a straight-edge cutting of ceramic, a second part is a corner cutting of ceramic, and a third part is a special-shaped aluminum foil cutting, where an AB segment, a BC segment, a CD segment, and a DA segment all represent one cutting position of the battery pole piece, and the battery pole piece may be divided into multiple cutting positions according to material types at different positions.
S407, if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut.
The pulse width parameters related in the embodiment of the invention all represent the pulse width of the laser, if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, the width of the laser pulse used when the previous section of cutting position is cut may not be suitable for the type of the material at the position to be cut, and at the moment, the width of the laser pulse used when the previous section of cutting position is cut is switched to be suitable for the width of the laser pulse at the position to be cut, so that burrs and a heat affected zone can be ensured not to be generated at the position to be cut as far as possible.
For example, with reference to fig. 5, the materials of the AB segment, the CD segment and the DA segment are all aluminum foils, the material type of the CD segment is a ceramic coating, if the previous segment is the BD segment, and the position to be cut is the CD segment, the material types of the BD segment and the CD segment are obviously inconsistent, the pulse width for cutting the BD segment is not suitable for cutting the ceramic layer of the CD segment, so the pulse width for cutting the BD segment should be switched to the optimal pulse width corresponding to the ceramic layer.
And S408, controlling the laser to switch the current pulse width parameter into the pulse width parameter, and controlling the position to be cut.
It can be understood that the current pulse width parameter is a face width parameter corresponding to a previous cutting position, and after determining an optimal cutting parameter corresponding to the position to be cut, the laser can be controlled to generate a laser beam according to the optimal cutting parameter, so as to achieve lossless cutting at the position to be cut.
According to the cutting method provided by the embodiment of the invention, the position to be cut of the target object is determined, and when the material type corresponding to the position to be cut is determined to be inconsistent with the material type of the previous section of cutting position, the pulse width parameter corresponding to the position to be cut is determined, and the laser is controlled to switch the current pulse width parameter to the pulse width parameter, and then the position to be cut is controlled.
Fig. 6 is a schematic view of the effect of the cutting method according to the embodiment of the present invention, and compared with the cutting effect diagram shown in fig. 2, the cutting method according to the embodiment of the present invention does not generate burrs on the surface of the target object, and the heat affected zone is also greatly reduced compared with the prior art, and has the characteristics of high processing quality and precision, no consumable material, no pollution, no contact stress, and capability of realizing automation of the device. The invention provides effective support for eliminating potential safety hazards such as battery overheating, short circuit, explosion and the like caused by burrs, powder falling and the like in the traditional pole piece cutting mode.
In an alternative embodiment, in the process of cutting the target object, in order to ensure the cutting effect, the cutting speed of the galvanometer needs to be controlled, so that this embodiment of the present invention further provides a possible implementation manner, that is, before performing step S408, the method may further include:
step 1, acquiring speed information and frequency information corresponding to a position to be cut;
the step S408 can be implemented as follows: and after controlling the laser to switch the current pulse width parameter to the pulse width parameter, controlling to cut the position to be cut according to the speed information and the frequency information corresponding to the position to be cut.
For example, continuing with fig. 5 as an example, if the material types of the AB segment and the BC segment are the same, it can be considered that the pulse parameters corresponding to cutting the AB segment and cutting the BC segment are the same, but the shapes of the AB segment and the BC segment are different, it can be seen that there is a corner in the cutting process of the BC segment, and then the cutting speed and frequency should be adaptively adjusted when cutting the BC segment, so as to ensure the cutting quality at the corner, so the speed principle of cutting the AB segment and cutting the BC segment should be different.
It can be seen that in the embodiment of the present invention, for each cutting position, not only the optimal laser pulse parameter, but also the optimal speed information and frequency are set for each cutting position, so as to achieve the effect of ensuring the cutting quality.
In an alternative embodiment, as can be seen from the above embodiment, if the material types of the two adjacent cutting positions are different, the laser is controlled to switch the pulse parameters, and in order to quickly determine the different pulse parameters corresponding to the different cutting positions, a possible embodiment is further provided in the present invention, that is, the step S407 may be implemented as follows: and acquiring the pulse width parameter corresponding to the position to be cut according to the corresponding relation between the preset cutting position and the pulse width parameter.
That is to say, before the target object is cut, the embodiment of the present invention may pre-establish the corresponding relationship between the cutting position and the pulse parameter, so that in the actual cutting process, the pulse parameter corresponding to the position to be cut may be quickly and accurately obtained according to the pre-established corresponding relationship, thereby improving the cutting efficiency.
Fig. 7 is a schematic flow chart of another cutting method provided in an embodiment of the present invention, that is, before cutting, the effect of the position to be cut may also be quickly determined, so as to facilitate comparison of material types, where the method further includes:
s401, dividing the target object into a plurality of sections of cutting positions consistent with the material type number according to the material type number corresponding to the target object.
Wherein each segment cutting location corresponds to a material type.
In the embodiment of the invention, the target object can be divided according to the material types of different parts to obtain a plurality of sections of cutting positions, and for each section of cutting position, cutting is carried out according to the optimal cutting parameters corresponding to the material type of the section of cutting position, so that burrs and a heat affected zone on the section of cutting position can be reduced or eliminated.
For example, with continued reference to fig. 5, the materials of the AB segment, the CD segment, and the DA segment are all aluminum foils, and therefore, the battery pole pieces can be divided into the cutting positions: the cutting positions can use the optimal cutting parameters corresponding to the aluminum foil, the type of the material of the CD section to be cut is the ceramic coating, and therefore the cutting positions of the battery pole piece also comprise the CD section, and the optimal cutting parameters corresponding to the ceramic coating can be used.
S402, planning a cutting path according to the shape of the target object.
Wherein the cutting path has a plurality of sub-paths.
In the embodiment of the present invention, the cutting path represents the moving track of the galvanometer 112, since the cutting of the target object is mostly dynamic cutting, and the production line is horizontal motion, in order to ensure the cutting shape of the target object, the cutting path should match the shape of the target object, for example, the battery pole piece shown in fig. 5 is taken as an example, according to the shape of the battery pole piece, the moving track of the galvanometer is "8" shaped according to the parallelogram rule of vector operation, as shown in fig. 8, fig. 8 is the cutting path of the battery pole piece provided by the embodiment of the present invention, and the direction of the arrow in the drawing is consistent with the processing direction in fig. 3.
S403, aiming at each cutting position, establishing a corresponding relation between each cutting position and one sub-path.
On the basis of the above steps S401 to S403, the above step S403 may be performed as follows:
a1, determining the next segment of sub-path adjacent to the completed sub-path according to the completed sub-path;
and A2, determining a section of cutting position corresponding to the next section of sub-path as the position to be cut according to the corresponding relation.
In this embodiment, the corresponding relationship between each cutting position and each sub-path is established, so that the current cutting position of the target object can be quickly located according to the moving track of the galvanometer 113, so that the moving track of the galvanometer is consistent with the shape of the battery pole piece, and the cutting accuracy is ensured.
Fig. 9 is a second flowchart of another cutting method according to an embodiment of the present invention, in which the method may further pre-establish a corresponding relationship between each material type and an optimal cutting parameter of the material type, so that once it is determined that the cutting parameter needs to be switched, the cutting parameter corresponding to the current position to be cut can be quickly obtained according to the corresponding relationship, and the method further includes:
s404, determining a plurality of cutting positions corresponding to the target object and pulse width parameters corresponding to the material types corresponding to the cutting positions.
S405, establishing a corresponding relation between the cutting position and the pulse width parameter.
Through the pre-established corresponding relation between the material type and the cutting parameters, the switching of the pulse width parameters can be responded quickly, and the cutting efficiency is improved.
Fig. 10 is a third schematic flow chart of another cutting method according to the embodiment of the present invention, and the method may further include:
and S409, if the material type corresponding to the position to be cut is determined to be consistent with the material type of the previous section of cutting position, determining the current pulse width parameter as the pulse width parameter corresponding to the position to be cut.
It can be understood that if the type of the material corresponding to the position to be cut is consistent with the type of the material at the previous cutting position, it is indicated that the pulse width parameter may not be switched, and the pulse width parameter corresponding to the previous cutting position is directly used to cut the position to be cut, thereby further improving the cutting efficiency and quality.
Fig. 11 is a functional block diagram of a cutting apparatus according to an embodiment of the present invention, and the cutting apparatus 400 according to an embodiment of the present invention includes:
a determining module 410, configured to determine a position to be cut of the target object; if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut;
and the control module 420 is configured to control the laser to switch the current pulse width parameter to a pulse width parameter corresponding to the position to be cut, and then control the position to be cut.
It will be appreciated that the determination module 410 and the control module 420 may cooperatively perform the various steps shown in fig. 4 to achieve a corresponding technical effect.
In an optional embodiment, the determining module 410 is further configured to obtain speed information and frequency information corresponding to the position to be cut; the control module 420 is configured to control the laser to switch the current pulse width parameter to the pulse width parameter, and then control the position to be cut according to the speed information and the frequency information corresponding to the position to be cut.
In an optional embodiment, the determining module 410 is specifically configured to obtain a pulse width parameter corresponding to the position to be cut according to a preset correspondence between the cutting position and the pulse width parameter.
In an optional implementation manner, the cutting apparatus 400 provided in the embodiment of the present invention may further include a dividing module and a building module, where the dividing module is configured to divide the target object into multiple segments of cutting positions, where the multiple segments of cutting positions are consistent with the number of material types, according to the number of material types corresponding to the target object; each section cutting position corresponds to one material type; planning a cutting path according to the shape of the target object; wherein the cutting path has a plurality of sub-paths; the construction module is used for establishing the corresponding relation between each section of cutting position and one section of sub-path aiming at each section of cutting position.
In an optional implementation manner, the determining module 410 is specifically configured to: determining a next section of sub-path adjacent to the completed sub-path according to the completed sub-path; and determining a section of cutting position corresponding to the next section of sub-path as the position to be cut according to the corresponding relation.
In an optional embodiment, the building module is further configured to determine a plurality of cutting positions corresponding to the target object and a pulse width parameter corresponding to a material type corresponding to each cutting position; and establishing a corresponding relation between the cutting position and the pulse width parameter.
In an optional embodiment, the determining module 410 is further configured to control the laser to cut the position to be cut after the laser is controlled to keep the current pulse width parameter unchanged if it is determined that the material type corresponding to the position to be cut is consistent with the material type at the previous cutting position.
Based on the same inventive concept, the invention also provides a cutting method, which can be applied to a laser and comprises the steps of obtaining a target pulse width parameter; and under the condition that the target pulse width parameter is the type of the material corresponding to the position to be cut and is inconsistent with the type of the material at the previous section of cutting position, the determined pulse width parameter corresponding to the position to be cut switches the current pulse width parameter into the target pulse width parameter.
On this basis, the embodiment of the present invention further provides a laser, which may be in communication connection with a control terminal, and the laser is configured to: receiving a target pulse width parameter sent by a control terminal; the target pulse width parameter is the pulse width parameter corresponding to the position to be cut determined by the control terminal under the condition that the material type corresponding to the position to be cut is inconsistent with the material type of the last section of cutting position; and switching the current pulse width parameter to the target pulse width parameter.
Fig. 12 is a schematic structural diagram of a cutting system 600 according to an embodiment of the present invention, where the cutting system 600 includes an electronic device 300 and a cutter 110. The electronic device 300 and the cutter 110 may be electrically connected. The cutting system provided by the embodiment of the invention can adapt to different production line speeds of 5m/min-150m/min and the like.
As an alternative embodiment, the cutter 110 may comprise a laser 111, a galvanometer 112 and a focusing field lens 113 as shown in fig. 1, and a cutting table for carrying the target object. The focal length of the focusing field lens 113 needs to be selected to match the size of the output light spot of the cutting system 600, and if a larger focal length field lens is selected, in order to ensure the processing capability of the cutting system, a beam expander with a proper magnification needs to be used to expand the output light spot of the laser 111 to ensure that the focusing light spot is not changed.
The embodiment of the present invention further provides a readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the cutting method according to any one of the foregoing embodiments. The computer readable storage medium may be, but is not limited to, various media that can store program codes, such as a U disk, a removable hard disk, a ROM, a RAM, a PROM, an EPROM, an EEPROM, a magnetic or optical disk, etc.
It should be understood that the disclosed apparatus and method may be embodied in other forms. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, the functional modules in the embodiments of the present invention may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes. It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
Claims (13)
1. A method of cutting, the method comprising:
determining the position to be cut of a target object;
if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut;
and controlling a laser to switch the current pulse width parameter to the pulse width parameter, and then controlling to cut the position to be cut.
2. The cutting method according to claim 1, wherein after controlling the laser to switch the current pulse width parameter to the pulse width parameter, before controlling to cut the position to be cut, the method further comprises:
acquiring speed information and frequency information corresponding to the position to be cut;
after controlling the laser to switch the current pulse width parameter to the pulse width parameter, controlling to cut the position to be cut, including:
and controlling a laser to switch the current pulse width parameter to the pulse width parameter, and then controlling to cut the position to be cut according to the speed information and the frequency information corresponding to the position to be cut.
3. The cutting method according to claim 1, wherein determining the pulse width parameter corresponding to the position to be cut comprises:
and acquiring the pulse width parameter corresponding to the position to be cut according to the corresponding relation between the preset cutting position and the pulse width parameter.
4. The cutting method according to claim 1, wherein before determining the position of the target object to be cut, the method further comprises:
dividing the target object into a plurality of sections of cutting positions consistent with the material type quantity according to the material type quantity corresponding to the target object; each section cutting position corresponds to one material type;
planning a cutting path according to the shape of the target object; wherein the cutting path has a plurality of sub-paths;
and aiming at each section of cutting position, establishing a corresponding relation between each section of cutting position and one section of sub-path.
5. The cutting method according to claim 4, wherein determining a position of the target object to be cut comprises:
determining a next section of sub-path adjacent to the completed sub-path according to the completed sub-path;
and determining a section of cutting position corresponding to the next section of sub-path as the position to be cut according to the corresponding relation.
6. The cutting method according to claim 1, wherein before determining the position of the target object to be cut, the method further comprises:
determining a plurality of cutting positions corresponding to the target object and pulse width parameters corresponding to the material types corresponding to the cutting positions;
and establishing a corresponding relation between the cutting position and the pulse width parameter.
7. The cutting method of claim 1, further comprising:
and if the material type corresponding to the position to be cut is determined to be consistent with the material type of the last section of cutting position, determining the current pulse width parameter as the pulse width parameter corresponding to the position to be cut.
8. A method of cutting, the method comprising:
receiving a target pulse width parameter sent by a control terminal; the target pulse width parameter is the pulse width parameter corresponding to the position to be cut determined by the control terminal under the condition that the material type corresponding to the position to be cut is inconsistent with the material type of the last section of cutting position;
and switching the current pulse width parameter to the target pulse width parameter.
9. A cutting device, comprising:
the determining module is used for determining the position to be cut of the target object; if the type of the material corresponding to the position to be cut is inconsistent with the type of the material at the previous section of cutting position, determining a pulse width parameter corresponding to the position to be cut;
and the control module is used for controlling the laser to switch the current pulse width parameter to the pulse width parameter and then controlling to cut the position to be cut.
10. The laser is characterized in that the laser is in communication connection with a control terminal; the laser is used for:
receiving a target pulse width parameter sent by a control terminal; the target pulse width parameter is the pulse width parameter corresponding to the position to be cut determined by the control terminal under the condition that the material type corresponding to the position to be cut is inconsistent with the material type of the last section of cutting position;
and switching the current pulse width parameter to the target pulse width parameter.
11. A cutting system comprising an electronic device and a cutter, wherein the electronic device and the cutter are electrically connected; the electronic device configured to perform the method of any one of claims 1-7.
12. An electronic device comprising a processor and a memory, the memory storing a computer program executable by the processor, the processor being operable to execute the computer program to implement the cutting method of any one of claims 1-7.
13. A storage medium having stored thereon a computer program, characterized in that the computer program, when being executed by a processor, implements the cutting method according to any one of claims 1-7 or implements the cutting method according to claim 8.
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