CN113732527A - Ultraviolet picosecond laser cutting method for cutting LCP material - Google Patents
Ultraviolet picosecond laser cutting method for cutting LCP material Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 125
- 238000005520 cutting process Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000003698 laser cutting Methods 0.000 title claims abstract description 24
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 34
- 235000011089 carbon dioxide Nutrition 0.000 claims description 16
- 239000001569 carbon dioxide Substances 0.000 claims description 9
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims 1
- 239000000779 smoke Substances 0.000 abstract description 18
- 238000003672 processing method Methods 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004071 soot Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the technical field of LCP material processing methods, and particularly relates to an ultraviolet picosecond laser cutting method for cutting LCP materials, which comprises the following steps: measuring the thickness of the LCP material to be cut; calculating the cutting times and the single cutting time according to the thickness of the LCP material to be cut and the output parameters of the laser; controlling a laser to output corresponding laser beams to the LCP material one by one according to set output parameters, cutting times and single cutting time, and moving the focal position of the laser beam to the center of the LCP material by a corresponding distance after cutting each time; according to the invention, the LCP material is cut by the laser, the LCP material with the corresponding thickness is cut for a plurality of times each time, for the LCP material with the thicker thickness, the focus position is changed after each cutting, the focus position gradually moves from the surface of the LCP material to the center of the LCP material, and the laser repetition frequency inhibits the generation of smoke and reduces the smoke adhesion of the cutting surface by changing the pulse width of a single laser.
Description
Technical Field
The invention belongs to the technical field of LCP material processing methods, and particularly relates to an ultraviolet picosecond laser cutting method for cutting LCP materials.
Background
Liquid crystalline high molecular polymers (LCP materials) are highly crystalline, thermotropic (melt-oriented) thermoplastics with high stiffness and low coefficients of thermal expansion in thin wall sections. LCP materials are composed of rigid rod-like polymers, are linearly arranged in a melting process to form a liquid crystal structure, and can bear surface mount welding temperature including welding. If the glass fiber and the carbon fiber are used for reinforcement, the glass fiber and the carbon fiber are far more excellent than other engineering plastics. These properties make LCP materials ideal for electronic applications such as sockets, bobbins, switches, connectors, chip carriers and sensors. Many grades of superior performance surpass ceramics, thermosets and other high temperature resistant plastics.
The excellent performance is achieved and the difficulty is increased in the manufacturing process. For example, the cutting process of some special shapes uses the traditional cutter to cut, and has low efficiency, poor precision and large deformation. Cutting by using the traditional laser cutting process, wherein the cutting process is fixed in some processes; some cutting processes can cause serious material deformation; some processes can generate a large amount of smoke dust and attach to the vicinity of the material cut, thereby seriously affecting the subsequent manufacturing.
Therefore, it is necessary to develop a new uv picosecond laser cutting method for cutting LCP material to solve the above problems.
Disclosure of Invention
The invention aims to provide an ultraviolet picosecond laser cutting method for cutting LCP materials.
In order to solve the above technical problems, the present invention provides an ultraviolet picosecond laser cutting method for cutting an LCP material, comprising: measuring the thickness of the LCP material to be cut; calculating the cutting times and the single cutting time according to the thickness of the LCP material to be cut and the output parameters of the laser; and controlling the laser to output corresponding laser beams to the LCP material one by one according to the set output parameters, the cutting times and the single cutting time, and moving the focal position of the laser beam to the center of the LCP material by a corresponding distance after cutting every time.
In one embodiment, the method for controlling the laser to output the corresponding laser beam to the LCP material one by one according to the set output parameters, the cutting times, and the single cutting time, and moving the focal position of the laser beam to the center of the LCP material by the corresponding distance after each cutting includes: step 1, measuring the thickness of an LCP material to be cut to be d, setting the cutting times to be n, wherein i represents the serial number of a cutting layer, and setting the focal position of a laser beam output by a laser on the surface of the LCP material, wherein i is equal to 1; step 2, controlling a laser to output corresponding laser beams to the LCP material according to set output parameters and single cutting time; step 3, moving the focal position of the laser beam output by the laser from the surface of the LCP material to the center of the LCP material by a corresponding distance, wherein i is i + 1; and 4, judging whether i is smaller than n, if i is smaller than n, skipping to the step 2, and if i is not smaller than n, ending the cutting.
In one embodiment, after each time the laser outputs a laser beam to cut the LCP material, carbon dioxide dry ice is blown to the cutting location.
In one embodiment, carbon dioxide dry ice is blown through a dry ice nozzle, and the dry ice nozzle is disposed coaxially with the laser.
In one embodiment, after each cutting of the LCP material, the focal position of the laser beam is moved toward the center of the LCP material by a distance d/n.
In one embodiment, after each time of cutting the LCP material, the moving distance of the focal point position of the laser beam toward the center of the LCP material is a moving fixed value, and the moving fixed value is set according to the set output parameter of the laser, the cutting times, and the single cutting time.
In one embodiment, the output wavelength of the laser is 355nm ± 50 nm.
In one embodiment, the laser is a pulse laser, and the laser outputs a single laser pulse with a width of 1-500 picoseconds.
In one embodiment, the output power of the laser is not less than 1 watt.
In one embodiment, the laser beam is a focused laser beam.
The LCP material cutting device has the advantages that the LCP material is cut by the laser, the cutting is finished for multiple times in corresponding thickness each time, for the LCP material with thicker thickness, the focal position is changed after each cutting, the focal position gradually moves from the surface of the LCP material to the center of the LCP material, the laser repetition frequency inhibits smoke generation by changing the pulse width of a single laser, the smoke adhesion of a cutting surface is reduced, carbon dioxide dry ice is used for cleaning, the cut is blown in from the side, the smoke adhesion of the cutting position is further removed, the LCP material can be cut rapidly and accurately, the thermal deformation of the LCP material is avoided, and the smoke adhesion is effectively avoided.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a cut-state diagram of the present invention with the focal point location set at the surface of the LCP material;
FIG. 2 is a cut state diagram of the focal position of the present invention moving from the surface of the LCP material toward the center of the LCP material;
FIG. 3 is a flow chart of the ultraviolet picosecond laser cutting method of the present invention for cutting LCP materials;
FIG. 4 is a step diagram of the ultraviolet picosecond laser cutting method of the present invention;
FIG. 5 is a graph of single cut time versus focal position shift distance for the present invention;
FIG. 6 is a graph of single cut time, cut speed and cut layer number for the present invention;
FIG. 7 is a graph of the cut front geometry of LCP material of the invention as a function of defocus;
in the figure:
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
In the present embodiment, as shown in fig. 1 to 7, the present embodiment provides an ultraviolet picosecond laser cutting method for cutting an LCP material, which includes: measuring the thickness of the LCP material 1 to be cut; calculating the cutting times and the single cutting time according to the thickness of the LCP material 1 to be cut and the output parameters of the laser; and controlling the laser to output corresponding laser beams 2 to the LCP material 1 one by one according to the set output parameters, the cutting times and the single cutting time, and moving the focal position 201 of the laser beams 2 towards the center of the LCP material 1 by a corresponding distance after cutting each time.
In this embodiment, a picosecond ultraviolet laser is used.
In the present embodiment, the LCP material 1 is cut by a conventional laser cutting process, some processes are not moved; some cutting processes can cause serious material deformation; some processes generate a large amount of smoke 4 and attach to the vicinity of the material cut, which seriously affects the subsequent manufacturing. The laser beam 2 is focused on the LCP material 1 and the LCP material 1 around the focal position 201 is heated. Some components of the LCP material 1 are heated to the vaporization temperature in a very short time, while other components of the LCP material 1 absorb the laser energy and are degraded. But all generate soot 4.
This embodiment is based on how to improve the laser rate of utilization, reduce energy input and research and development, according to setting for output parameter through the control laser ware, the cutting number of times, single cutting time is to LCP material 1 output corresponding laser beam 2 one by one, and remove corresponding distance with the focus position 201 of laser beam 2 towards the center of LCP material 1 after cutting at every turn, can improve the rate of utilization of laser beam 2 and reduce the energy input of laser beam 2, thereby realize reducing the smoke and dust 4 that cutting LCP material 1 produced.
In this embodiment, this embodiment cuts LCP material 1 through the laser instrument, cut corresponding thickness at every turn and cut many times, to the thick LCP material 1 of thickness, change focus position 201 after cutting at every turn, focus position 201 removes to the center of LCP material 1 from the surface of LCP material 1 gradually, through changing single laser pulse width, laser repetition frequency suppresses smoke and dust 4 and produces, it adheres to reduce cutting plane smoke and dust 4, assist the washing of carbon dioxide dry ice, blow in the incision from the side, further get rid of the smoke and dust 4 of cutting position and adhere to, cutting LCP material 1 that can be quick accurate, do not cause the heat altered shape to LCP material 1 itself, and effectively avoid smoke and dust 4 to adhere to.
In this embodiment, the method for controlling the laser to sequentially output the corresponding laser beam 2 to the LCP material 1 according to the set output parameters, the cutting times, and the single cutting time, and moving the focal point 201 of the laser beam 2 to the center of the LCP material 1 by the corresponding distance after each cutting includes: step 1, measuring the thickness of an LCP material 1 to be cut to be d, setting the cutting times to be n, wherein i represents the serial number of a cutting layer, and setting the focal position 201 of a laser beam 2 output by a laser on the surface of the LCP material 1, wherein i is equal to 1; step 2, controlling a laser to output a corresponding laser beam 2 to the LCP material 1 according to the set output parameters and the single cutting time; step 3, moving the focal position 201 of the laser beam 2 output by the laser from the surface of the LCP material 1 toward the center of the LCP material 1 by a corresponding distance, and i is i + 1; and 4, judging whether i is smaller than n, if i is smaller than n, skipping to the step 2, and if i is not smaller than n, ending the cutting.
TABLE-laser output parameters for LCP Material traditional cutting methods
TABLE II output parameters of the laser in the UV picosecond laser cutting method of the present example
In this embodiment, as can be seen from a comparison between the table i and the table ii, the uv picosecond laser cutting method provided in this embodiment can reduce the time for cutting the LCP material 1 once, that is, can improve the usage rate of the laser beam 2 and reduce the energy input of the laser beam 2.
TABLE III working parameters at 75% output energy of the laser
TABLE IV operating parameters at 55% laser output
In the present embodiment, comparing table three and table four, it can be seen that the utilization rate of the laser beam 2 can be increased and the energy input of the laser beam 2 can be reduced by reducing the energy output of the laser and changing the output speed of the laser.
In the present embodiment, as shown in fig. 5, the single cutting time is inversely proportional to the moving distance, and after the moving distance reaches 0.3mm, the single cutting time does not decrease with the increase of the moving distance.
In the present embodiment, as shown in fig. 6, the single cutting time has little influence on the number of cuts, but the output speed of the laser is proportional to the cutting speed.
In this embodiment, after the LCP material 1 is cut by the laser beam 2 output from the laser each time, carbon dioxide dry ice is blown to the cutting position, and the accumulation of the soot 4 can be removed.
In the present embodiment, carbon dioxide dry ice is blown through the dry ice nozzle 3, and the dry ice nozzle 3 is disposed coaxially with the laser.
In the present embodiment, the focal position 201 of the laser beam 2 is moved toward the center of the LCP material 1 by a distance d/n after each cutting of the LCP material 1.
In the present embodiment, after each time the LCP material 1 is cut, the moving distance of the focal position 201 of the laser beam 2 toward the center of the LCP material 1 is a moving fixed value, which is set according to the set output parameter of the laser, the number of cuts, and the single cutting time.
In this embodiment, the output wavelength of the laser is 355nm ± 50nm, preferably 355 nm.
In this embodiment, when the output wavelength of the laser is 355nm, the LCP material 1 can be stably cut.
In the present embodiment, the laser is a pulse laser, and the laser outputs a single laser pulse with a width of 1-500 picoseconds, preferably 200 picoseconds, 300 picoseconds, 400 picoseconds.
In the present embodiment, when the laser outputs a single laser pulse with a width of 200 picoseconds, the LCP material 1 can be stably cut.
In the present embodiment, when the single laser pulse width output by the laser is 300 picoseconds, the LCP material 1 can be stably cut.
In the present embodiment, when the laser outputs a single laser pulse with a width of 400 picoseconds, the LCP material 1 can be stably cut.
In this embodiment, the output power of the laser is not less than 1 watt, preferably 1.5 watts.
In this embodiment, when the output power of the laser is 1.5 watts, the LCP material 1 can be stably cut.
In this embodiment, the laser beam 2 is a focused laser beam 2.
In summary, the present invention cuts the LCP material by the laser, cuts the LCP material by a plurality of times with a corresponding thickness each time, changes the focal position after cutting the LCP material with a thicker thickness each time, the focal position gradually moves from the surface of the LCP material to the center of the LCP material, inhibits the generation of smoke by changing the laser repetition frequency, reduces the smoke adhesion on the cut surface, is assisted with carbon dioxide dry ice cleaning, blows into the cut from the side, further removes the smoke adhesion on the cut position, can cut the LCP material quickly and accurately, does not cause thermal deformation to the LCP material itself, and effectively avoids the smoke adhesion.
The components selected for use in the present application (components not illustrated for specific structures) are all common standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. An ultraviolet picosecond laser cutting method for cutting LCP materials, comprising:
measuring the thickness of the LCP material to be cut;
calculating the cutting times and the single cutting time according to the thickness of the LCP material to be cut and the output parameters of the laser;
and controlling the laser to output corresponding laser beams to the LCP material one by one according to the set output parameters, the cutting times and the single cutting time, and moving the focal position of the laser beam to the center of the LCP material by a corresponding distance after cutting every time.
2. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 1,
the method for controlling the laser to output the corresponding laser beams to the LCP material one by one according to the set output parameters, the cutting times and the single cutting time, and moving the focal position of the laser beams to the center of the LCP material by the corresponding distance after cutting each time comprises the following steps:
step 1, measuring the thickness of an LCP material to be cut to be d, setting the cutting times to be n, wherein i represents the serial number of a cutting layer, and setting the focal position of a laser beam output by a laser on the surface of the LCP material, wherein i is equal to 1;
step 2, controlling a laser to output corresponding laser beams to the LCP material according to set output parameters and single cutting time;
step 3, moving the focal position of the laser beam output by the laser from the surface of the LCP material to the center of the LCP material by a corresponding distance, wherein i is i + 1;
and 4, judging whether i is smaller than n, if i is smaller than n, skipping to the step 2, and if i is not smaller than n, ending the cutting.
3. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
after the laser beam output by the laser is used for cutting the LCP material each time, carbon dioxide dry ice is blown to the cutting position.
4. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 3,
and blowing carbon dioxide and dry ice through a dry ice nozzle, wherein the dry ice nozzle is coaxially arranged with the laser.
5. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
after each cutting of the LCP material, the focal position of the laser beam moves to the center of the LCP material by a distance d/n.
6. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
after the LCP material is cut every time, the moving distance of the focal position of the laser beam towards the center of the LCP material is a moving fixed value, and the moving fixed value is set according to the set output parameters, the cutting times and the single cutting time of the laser.
7. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
the output wavelength of the laser is 355nm +/-50 nm.
8. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
the laser adopts a pulse type laser, and the width of a single laser pulse output by the laser is 1-500 picoseconds.
9. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
the output power of the laser is not less than 1 watt.
10. The ultraviolet picosecond laser cutting method for cutting LCP materials according to claim 2,
the laser beam is a focused laser beam.
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| CN114951962A (en) * | 2022-05-23 | 2022-08-30 | 深圳市杰普特光电股份有限公司 | Cutting method, device, system, laser, electronic device and storage medium |
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| CN108687448A (en) * | 2017-04-05 | 2018-10-23 | 大族激光科技产业集团股份有限公司 | A kind of PC composite materials laser cutting method |
| CN110340520A (en) * | 2019-06-27 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of pulse dislocation laser processing, device and system |
| CN111302613A (en) * | 2020-04-13 | 2020-06-19 | 武汉吉事达科技股份有限公司 | Picosecond laser cutting method for ultra-thick glass |
| CN111590197A (en) * | 2020-05-11 | 2020-08-28 | 苏州优快激光科技有限公司 | Ceramic substrate porous array picosecond laser galvanometer scanning drilling system and method |
| CN112074096A (en) * | 2020-10-13 | 2020-12-11 | 安捷利（番禺）电子实业有限公司 | Drilling method for 5G high-frequency LCP material |
| CN112518141A (en) * | 2020-11-24 | 2021-03-19 | 无锡先导智能装备股份有限公司 | Laser induced cutting method and device |
| CN112809196A (en) * | 2020-12-22 | 2021-05-18 | 安捷利（番禺）电子实业有限公司 | 5G high-frequency LCP material shape cutting method |
| CN112809204A (en) * | 2021-02-04 | 2021-05-18 | 厦门大学 | Laser cutting decarbonization device and method for polyimide cover film |
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| CN114951962A (en) * | 2022-05-23 | 2022-08-30 | 深圳市杰普特光电股份有限公司 | Cutting method, device, system, laser, electronic device and storage medium |
| CN114951962B (en) * | 2022-05-23 | 2024-04-30 | 深圳市杰普特光电股份有限公司 | Cutting method, cutting device, cutting system, laser, electronic equipment and storage medium |
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Application publication date: 20211203 |