CN108687448A - A kind of PC composite materials laser cutting method - Google Patents
A kind of PC composite materials laser cutting method Download PDFInfo
- Publication number
- CN108687448A CN108687448A CN201710217869.5A CN201710217869A CN108687448A CN 108687448 A CN108687448 A CN 108687448A CN 201710217869 A CN201710217869 A CN 201710217869A CN 108687448 A CN108687448 A CN 108687448A
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- China
- Prior art keywords
- cutting
- layer
- composite materials
- laser cutting
- laser
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser cutting methods of PC composite materials, are related to laser cutting field.The PC composite materials include the adhesive sticker paper layer being bonded successively, adhesive layer, PC plastic body layer and PET film layer, and the laser cutting method includes:PC composite materials described in roll-in;The adhesive sticker paper layer on the PC composite materials is removed, cutting body is formed;The cutting body is positioned over default cutting position, is cut according to default cutting parameter;Finally, the adhesive sticker paper layer of removal covers original position again.The cut surface oxidation that the present invention can avoid PC composite materials is uneven, adhesive sticker paper layer is prevented because the high temperature of laser burns out and generates flue dust in cutting process, avoid the problem that flue dust falls to the surface of PC plastic body layer and pollutes PC plastic body layer to solve to turn to be yellow using cut surface when laser cutting, to ensure that the cleanliness factor and smoothness of product surface.
Description
Technical field
The present invention relates to laser cutting field more particularly to a kind of PC (Poly carbonate, makrolon) composite woods
Expect laser cutting method.
Background technology
In recent years, due to the advantageous characteristic of laser, the technique for carrying out cutting processing to material with laser is more and more, skill
Art is also more and more skilled, but due in laser cutting process, the factors such as high temperature of processing and laser to cutting material
In influence and cutting process to cutting material in or cutting process bad to waste material, exhaust-gas treatment caused by cutting
The operations grasps such as the focus adjustment to cutting times, laser are bad, so as to cause the jaundice of last product cutting surfaces, product
The unqualified phenomenon of quality.
Invention content
To solve the problems, such as that generation waste material, exhaust gas cause product surface to turn to be yellow in above-mentioned laser cutting process, the present invention is real
It applies example and a kind of PC composite materials laser cutting method is provided:
A kind of PC composite materials laser cutting method, the PC composite materials include adhesive sticker paper layer, the glue being bonded successively
Adhesion coating, PC plastic body layer and PET (polyethylene terephthalate, polyethylene terephthalate) film
Layer, the laser cutting method include:
PC composite materials described in roll-in;
The adhesive sticker paper layer on the PC composite materials is removed, cutting body is formed;
The cutting body is positioned over default cutting position, is cut according to default cutting setting.
Further, the method further includes:
After the completion of cutting, the adhesive sticker paper layer of removal is conformed into original position again.
Further, the thickness of the PET film layer is 0.25mm~0.3mm.
Further, before being cut to cutting body, the method further includes focusing to laser cutting device
Operation.
Further, while being cut to cutting body, the cutting body in cutting is carried out by extractor fan clear
Clean processing.
Further, the extractor fan is provided with suction opening, and the section of the suction opening is vertical with cutting body surface.
Further, the height of cutting body described in the centre distance of the suction opening is the half of the cutting body diameter.
Further, the cutting setting includes cutting pattern, cutting speed and cutting times.
Further, the cutting times are 5~7 times.
Further, the PC plastic body layer includes PC plastic layer and aluminum membranous layer, and the aluminum membranous layer is set to the PC
On plastic layer, and between the PC plastic layer and the PET film layer.
PC composite materials laser cutting method provided by the invention, the cut surface oxidation that can avoid PC composite materials are uneven
It is even, while adhesive sticker paper layer is prevented because the high temperature of laser burns out and generates flue dust in cutting process, avoid flue dust from falling to PC
The surface of plastic body layer and pollute PC plastic body layer to solve the problems, such as using laser cutting when cut surface turn to be yellow, to
It ensure that the cleanliness factor and smoothness of product surface.
Description of the drawings
Fig. 1 is the structure composition schematic diagram of PC composite materials described in the embodiment of the present invention;
Fig. 2 is cutting method flow diagram described in the embodiment of the present invention;
Fig. 3 is PC plastic body layer structure composition schematic diagram described in the embodiment of the present invention;
Fig. 4 is cutting body formation described in the embodiment of the present invention and structure composition schematic diagram;
Fig. 5 is extractor fan scheme of installation described in the embodiment of the present invention.
Description of the drawings:11- adhesive stickers paper layer, 12- adhesive layers, 13-PC plastic bodies layer, 131-PC plastic layers, 132- aluminium
Film layer, 14-PET film layers.
Specific implementation mode
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.Obviously, described embodiment is only
A part of the embodiment of the present invention gives presently preferred embodiments of the present invention instead of all the embodiments in attached drawing.The present invention can
To realize in many different forms, however it is not limited to embodiment described herein, on the contrary, provide the mesh of these embodiments
Be to make the disclosure of the present invention more thorough and comprehensive.Based on the embodiments of the present invention, the common skill in this field
The every other embodiment that art personnel are obtained without creative efforts belongs to the model that the present invention protects
It encloses.
Refering to fig. 1, it is illustrated that for the structure composition schematic diagram of PC composite materials in the embodiment of the present invention, the PC composite materials
Including adhesive sticker paper layer 11, adhesive layer 12, PC plastic body layer 13 and PET film layer 14, wherein the shape of the PC composite materials
It is at process:Adhesive layer 12 and adhesive sticker paper layer 11 are covered successively in the side of PC plastic body layer 13, in PC plastic body layer
13 other side covering PET film layer 14, i.e., by adhesive sticker paper layer 11, adhesive layer 12, PC plastic body layer 13 and PET film layer
14 successively be bonded after form the PC composite materials;
In the present embodiment, the adhesive sticker paper layer 11 uses self-adhesive paper, the adhesive layer 12 to use super glue, than
Such as AB glue;Certainly, in embodiments of the present invention, used adhesive sticker paper layer and adhesive layer are not limited and is consolidated
It is fixed.
The laser cutting process process of PC composite materials is described in detail below.
Referring to Fig.2, it is illustrated as a kind of flow diagram of PC composite materials laser cutting method provided in an embodiment of the present invention,
The laser cutting method includes:
PC composite materials described in S1, roll-in, the bubble between release PC plastic body layer 13 and PET film layer 14;
Specifically, can be primary or multiple by the PC composite materials roll-in by roll squeezer as the case may be, until
It is entirely only by the bubble release between PC plastic body layer 13 and PET film layer 14;In laser cutting process, PC plastic master
13 surface of body layer can chemically react under laser high temperature with air, since the presence of bubble can lead to PC plastic body layer 13
Surface oxidation is uneven, discharges bubble completely by way of roll-in and can avoid such case, to ensure PC plastic main body
The cleanliness factor and smoothness on 13 surface of layer, that is, ensure that the cleanliness factor and smoothness of the product surface after cutting.
As shown in figure 3, the PC plastic body layer 13 further comprises PC plastic layer 131 and aluminum membranous layer 132, the aluminium film
Layer 132 is smooth layer, and 131 side of PC plastic layer, in the present embodiment, the aluminum membranous layer are attached to by the way of plating
132 thickness is arranged between 0.3~0.5mm;Correspondingly, the PC composite materials include the adhesive sticker paper layer arranged successively
11, adhesive layer 12, PC plastic layer 131 and aluminum membranous layer 132 and PET film layer 14, specifically, in step sl, passing through roll squeezer
Bubble between PET film layer 14 and aluminum membranous layer 132 is released, can prevent from leading to laser because of the reason of bubble in this way
132 surface of aluminum membranous layer chemically reacts when cutting, avoids 132 surface oxidation of aluminum membranous layer uneven, to ensure aluminum membranous layer 132
The cleanliness factor and smoothness on surface.
The PET film layer 14 in laser cutting process for protecting the PC plastic body layer 13 not damaged by laser
It is bad, specifically, PET film layer 14 is used to absorb the heat in cutting process, ensures that cutting temperature will not be too high, prevent Huang
The surface of PC plastic body layer 13 described in color chlorine pollution;In embodiments of the present invention, the thickness control of the PET film layer 14
Between 0.25~0.3mm, the PET film layer 14 in this thickness range can prevent the PET film layer 14 from being played generation
The surface of PC plastic body layer 13 described in yellow chlorine pollution ensures the cleanliness factor and smoothness on final products surface.
The adhesive sticker paper layer 11 of S2, the removal PC composite materials;
It needs the removal of adhesive sticker paper layer 11 forming cutting body before cutting, i.e., the described cutting body includes adhesive layer 12, PC modelings
Expect body layer 13 and PET film layer 14, specifically see Fig. 4, adhesive sticker paper layer 11 can be prevented in this way because in cutting process
It is burnt out at a high temperature of laser and generates unnecessary flue dust, flue dust is avoided to fall to the surface of PC plastic body layer 13 and dirty
Dye, to ensure that the cleanliness factor and smoothness that finally cut obtained product surface.
S3, the cutting body is placed into preset cutting position and fixation, is cut to described according to preset cutting setting
Body is cut to be cut by laser;
Specifically, cutting body is placed on processing platform, upward, the embodiment of the present invention uses vacuum to the adhesive layer 12
The mode of absorption fixes cutting body, be provided with the through-hole vacuumized on the processing platform, and locking device is by vacuumizing
Cutting body is absorbed and fixed on workbench by mode;
Further include that focus operations are carried out to preset laser cutting device, i.e., to laser before being cut to cutting body
Focus is adjusted, and in the present embodiment, focus is arranged to slightly defocusing, and specifically, laser focal point is arranged in PC plastic master
The height of body layer 13, for example the integral thickness of adhesive layer 12, PC plastic body layer 13 is 0.5mm, then the focus of laser is set in
The lower surface of PC plastic main body 13, the focus of laser is 0.5mm at a distance from 12 upper surface of adhesive layer at this time, and neither in institute
State the height of PET film layer 14, nor in the PC composite materials adhesive layer 12 height, with ensure cut when laser it is rigid
The adhesive layer 12 and PC plastic body layer 13 can be cut through well, without damaging the PET film layer 14;Further, institute
It states PC plastic body layer 13 and includes PC plastic layer 131 and aluminum membranous layer 132, then the height in aluminum membranous layer 132 is arranged in its laser spot,
Setting can allow the lines of cutting part to reach most thin in this way, while it is also ensured that the discharge amount of exhaust gas of cutting process is minimum, carry
Rise the quality of cutting.
In embodiments of the present invention, further include opening extractor fan, in cutting process in the cutting process for executing S3
The waste material of generation carries out cleaning treatment, because the exhausting angle of the extractor fan and height can largely influence to be cut into
Final products cutting effect, cutting body therefore put with cutting body at an angle by one side suction opening, optionally, this
Suction opening described in inventive embodiments pastes some edge of neat cutting body and perpendicular to the direction on cutting body surface, i.e. cutting body water
When placing flat, exhaust column is parallel in 0 ° with horizontal plane, and air port section and horizontal plane are vertical in 90 °, on the other hand before cutting will
The height of the extractor fan is set according to the size of cutting body, and different according to the shape of cutting body, the size can be straight
Diameter, length, width or other, in the present embodiment, by taking round cutting body as an example, the position height of the extractor fan central point
For the half of cutting body diameter, for example, the diameter of cutting body described in the embodiment of the present invention is in 8~50mm, then it is correspondingly described
The position height of extractor fan central point is 4~25mm, and the edge of the plane where the section of air port and cutting body is tangent at this time, is taken out
When wind apparatus works so that flue dust flight starting point horizontal plane and heading specifically see Fig. 5, putting in this way can in 45° angle
It is just excluded from the middle position of exhaust column when last flue dust being made to be inhaled into, and cuts exhaust gas and do not diffuse into air, by
This can guarantee extractor fan to the greatest extent by cutting process waste material and exhaust gas detach the surface of cutting body.
In an embodiment of the present invention, the cutting setting includes cutting pattern, cutting speed and cutting times;It is described to cut
It cuts figure, cutting speed and cutting times to be preset by external equipment, wherein the cutting times refer to that laser is multiple
Cutting, until cutting through 13 required number of the adhesive layer 12 and PC plastic body layer;
In an embodiment of the present invention, the speed and cutting times of cutting speed described in cutting body number can influence it is last
Preset cut is not achieved if cutting speed is too high or cutting times are very little/too many in the mass effect that product cutting is completed
Effect is cut, is specifically illustrated by taking cutting times as an example, if cutting times are very little, the cut place of the cutting body is because of list
The secondary overlong time being exposed under the laser environment of high temperature so that cutting surfaces turn to be yellow, simultaneously as the depth of single cut is too
It is deep, cause the waste material exhaust gas that single cut generates on the high side, and the extractor fan is every time certain to the extraction amount of waste material exhaust gas
, it may result in extra waste material exhaust gas and be adsorbed on cutting body cut place, contamination of incision;If cutting times are too many, although often
The exhaust gas amount of waste that secondary cutting generates can in time be excluded by extractor fan, but be reduction of whole cutting efficiency, to avoid
These the occurrence of, preset cutting times are specially 5~7 times in the embodiment of the present invention, it is further preferable that in the present embodiment
The cutting times selected are 6 times, to ensure to cut the exhausting waste gas released every time uniformly and without being adhered to cutting body
Surface is cut in the case where preset cutting times are 6 times, and the cut place on the cutting body will be regular round and smooth, cut surface
Neat and tidy, to improve the quality of cutting.
S4, cutting is completed, self-adhesive paper layer 11 is covered on the cutting body;
In an embodiment of the present invention, it is needed the waste material before cutting to ensure to being generated in cutting process after cutting
With comprehensive clean of exhaust gas and the adhesive sticker paper layer 11 that removes covers again, formed to cut according to default cutting parameter and be completed
Final products.
The present invention is by before cutting removing adhesive sticker paper layer, during being cut to cutting body, can prevent
Adhesive sticker paper layer avoids flue dust from falling to PC plastic body layer because the high temperature of laser burns out and generates flue dust in cutting process
Surface and pollute PC plastic body layer to solve the problems, such as using laser cutting when cut surface turn to be yellow;
Additionally by the strict regulations of focal adjustments, cutting times to laser and in cutting process while to cutting
Face carries out cleaning treatment so that waste material, exhaust gas in cutting process will not remain in cutting surfaces, and cutting surfaces is avoided to turn to be yellow
Situation.
It these are only the embodiment of the present invention, the scope of the claims of the present invention be not intended to limit, although with reference to the foregoing embodiments
Invention is explained in detail, still can be to aforementioned each specific reality for those skilled in the art comes
It applies the technical solution recorded in mode to modify, or equivalence replacement is carried out to which part technical characteristic.It is every to utilize this
The equivalent structure that description of the invention and accompanying drawing content are done directly or indirectly is used in other related technical areas, similarly
Within scope of patent protection of the present invention.
Claims (10)
1. a kind of PC composite materials laser cutting method, the PC composite materials include the adhesive sticker paper layer being bonded successively, gluing
Layer, PC plastic body layer and PET film layer, which is characterized in that the laser cutting method includes:
PC composite materials described in roll-in;
The adhesive sticker paper layer on the PC composite materials is removed, cutting body is formed;
The cutting body is positioned over default cutting position, the cutting body is cut according to default cutting setting.
2. PC composite materials laser cutting method according to claim 1, which is characterized in that the method further includes:
After the completion of cutting, the adhesive sticker paper layer of removal is conformed into original position again.
3. PC composite materials laser cutting method according to claim 2, which is characterized in that the thickness of the PET film layer
Degree is 0.25mm~0.3mm.
4. PC composite materials laser cutting method according to claim 3, which is characterized in that cut to cutting body
Before, the method further includes carrying out focus operations to laser cutting device.
5. PC composite materials laser cutting method according to claim 4, which is characterized in that same being cut to cutting body
When, cleaning treatment is carried out to the cutting body in cutting by extractor fan.
6. PC composite materials laser cutting method according to claim 5, which is characterized in that the extractor fan is provided with
The section of suction opening, the suction opening is vertical with cutting body surface.
7. PC composite materials laser cutting method according to claim 6, which is characterized in that the centre-to-centre spacing of the suction opening
Height from the cutting body is the half of the cutting body diameter.
8. PC composite materials laser cutting method according to claim 1, which is characterized in that the cutting setting includes cutting
Cut figure, cutting speed and cutting times.
9. PC composite materials laser cutting method according to claim 7, which is characterized in that the cutting times are 5~7
It is secondary.
10. according to claim 1~9 any one of them PC composite material laser cutting methods, which is characterized in that the PC modelings
Expect that body layer includes PC plastic layer and aluminum membranous layer, the aluminum membranous layer is set on the PC plastic layer, and is located at the PC plastic
Between layer and the PET film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710217869.5A CN108687448B (en) | 2017-04-05 | 2017-04-05 | Laser cutting method for PC composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710217869.5A CN108687448B (en) | 2017-04-05 | 2017-04-05 | Laser cutting method for PC composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108687448A true CN108687448A (en) | 2018-10-23 |
| CN108687448B CN108687448B (en) | 2020-12-18 |
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ID=63841990
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710217869.5A Active CN108687448B (en) | 2017-04-05 | 2017-04-05 | Laser cutting method for PC composite material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732527A (en) * | 2021-09-08 | 2021-12-03 | 常州英诺激光科技有限公司 | Ultraviolet picosecond laser cutting method for cutting LCP material |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204135565U (en) * | 2014-10-22 | 2015-02-04 | 浙江通智灵信息科技有限公司 | Adhesive sticker laser cutting device |
| KR20150045076A (en) * | 2013-10-18 | 2015-04-28 | 주식회사 엘지화학 | A Cutting Method of Plastic Film for Flexible Display and Plastic Film for Flexible Display Manufactured by The Same |
| JP2016040108A (en) * | 2014-08-13 | 2016-03-24 | セイコーエプソン株式会社 | Laser processing device and printer |
| CN105728958A (en) * | 2014-12-24 | 2016-07-06 | 木本股份有限公司 | Auxiliary sheet for laser dicing |
| CN106181054A (en) * | 2015-04-30 | 2016-12-07 | 西酉电子科技（上海）有限公司 | A kind of ganoid ferrite product laser formation method |
| CN205927537U (en) * | 2016-08-11 | 2017-02-08 | 东莞市汇研机械有限公司 | Adhesive label laser cutting device |
| CN106624353A (en) * | 2016-12-30 | 2017-05-10 | 广东工业大学 | Laser shotblast product surface fabrication system |
-
2017
- 2017-04-05 CN CN201710217869.5A patent/CN108687448B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150045076A (en) * | 2013-10-18 | 2015-04-28 | 주식회사 엘지화학 | A Cutting Method of Plastic Film for Flexible Display and Plastic Film for Flexible Display Manufactured by The Same |
| JP2016040108A (en) * | 2014-08-13 | 2016-03-24 | セイコーエプソン株式会社 | Laser processing device and printer |
| CN204135565U (en) * | 2014-10-22 | 2015-02-04 | 浙江通智灵信息科技有限公司 | Adhesive sticker laser cutting device |
| CN105728958A (en) * | 2014-12-24 | 2016-07-06 | 木本股份有限公司 | Auxiliary sheet for laser dicing |
| CN106181054A (en) * | 2015-04-30 | 2016-12-07 | 西酉电子科技（上海）有限公司 | A kind of ganoid ferrite product laser formation method |
| CN205927537U (en) * | 2016-08-11 | 2017-02-08 | 东莞市汇研机械有限公司 | Adhesive label laser cutting device |
| CN106624353A (en) * | 2016-12-30 | 2017-05-10 | 广东工业大学 | Laser shotblast product surface fabrication system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113732527A (en) * | 2021-09-08 | 2021-12-03 | 常州英诺激光科技有限公司 | Ultraviolet picosecond laser cutting method for cutting LCP material |
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| Publication number | Publication date |
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| CN108687448B (en) | 2020-12-18 |
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