TW201815510A - Cutting apparatus and cutting method using the same - Google Patents

Abstract

A cutting apparatus is provided. The cutting apparatus includes a cooling equipment, and a laser module. The cooling equipment includes a liquid storage module and a cooling worktable. The liquid storage module includes a liquid storage box. The liquid storage box provides steady cooling liquid flow for the cooling worktable. The cooling worktable includes a base, a sump, and an absorbing member. The sump is defined in the base. The sump includes an inlet and an outlet. The outlet is coupled to the bottom of the liquid storage box. The inlet is coupled to the sidewall of the liquid storage box. The absorbing member absorbs workpiece thereon. The cooling liquid flows one side of the workpiece close to the sump so as to cool the workpiece while the workpiece is laser cutting. The laser module lasers the workpiece layer by layer.

Description

Cutting equipment and cutting method

The invention relates to a cutting device and a cutting method thereof, and in particular to a cutting device using a laser liquid cooling type and a cutting method thereof.

Traditional cutting equipment has two methods for processing logo patterns on the workpiece. The first processing method is stamping-polishing-anodizing-polishing-anodizing. This processing method will cause the failure of sag. Polishing-anodizing-polishing-stamping-anodizing, this processing method will cause burrs. To sum up, neither of the above two processing methods for processing the logo pattern by the cutting equipment can meet the processing requirements.

In view of this, it is necessary to provide a cutting device and a cutting method to solve the above problems.

The invention provides a cutting device, which includes a cooling device and a laser module. The cooling device includes a liquid storage module and a cooling workbench. The liquid storage module includes a liquid storage tank. The liquid storage tank is used to provide a stable liquid cooling medium flow for the cooling workbench. The cooling workbench includes a base, A liquid collecting tank and an adsorption member, the liquid collecting tank is arranged in the base, the liquid collecting tank includes a liquid outlet and a liquid inlet, the liquid outlet is connected to the bottom of the liquid storage tank, and the liquid inlet is connected to On the side wall of the liquid storage tank, to obtain sufficient liquid cooling medium from the liquid storage tank, the adsorption member is arranged in the liquid collecting tank, and the adsorption member is used for adsorbing and supporting a workpiece and the liquid cooling medium located in the liquid collecting tank. The flow can directly flow through the side of the workpiece close to the liquid collecting tank to cool the workpiece during the cutting process. The laser module emits UV laser and performs laser cutting on the workpiece by scanning layer by layer.

The invention also provides a cutting method. The cutting method is applied to a cutting device. The cutting device includes a cooling device and a laser module. The cooling device includes a liquid storage module and a cooling workbench. The liquid storage module includes a liquid storage tank. The liquid storage tank is used to provide stable liquid cooling for the cooling workbench. Medium flow, the cooling workbench includes a base, a liquid collecting tank and an adsorption member, the liquid collecting tank is arranged in the base, the liquid collecting tank includes a liquid outlet and a liquid inlet, and the liquid outlet is connected to the storage At the bottom of the liquid tank, the liquid inlet is connected to the side wall of the liquid storage tank to obtain sufficient liquid cooling medium from the liquid storage tank, and the adsorption member is arranged in the liquid collecting tank. The cutting method includes the steps of: controlling the flow rate of the liquid inlet and the liquid outlet of the liquid collecting tank to make the liquid collecting tank filled with liquid cooling medium and starting a stable loop flow; and adsorbing a workpiece in the form of negative pressure On the adsorption member; the liquid cooling medium directly flows through the side of the workpiece close to the liquid collecting tank to cool the workpiece during the cutting process; the laser module is activated, and the laser module emits UV laser and passes through the layer by layer Laser scanning the workpiece by scanning; and removing the workpiece from the suction member.

The appearance of the workpiece is cooled by using a liquid cooling medium flowing in a loop, and UV laser layer-by-layer scanning cutting is used, and the quality of the cutting surface is good.

In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that when an element is considered to be “connected” to another element, it may be directly connected to another element or there may be a centered element at the same time.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

Please refer to FIG. 1, which is a schematic structural diagram of a cutting device 100 according to an embodiment of the present invention. The cutting device 100 is used to cut and form a logo pattern on a workpiece (not shown) by means of laser cutting. Specifically, the cutting apparatus 100 includes a laser module 10 and a cooling device 20.

The laser emitted by the laser module 10 is a UV laser with a wavelength of 355 nm. The concentration of the laser energy at this wavelength can directly destroy the chemical bonds of the atomic components of the connected substances, so that the thermal influence of laser cutting is reduced. In this embodiment, the cutting method adopted by the laser module 10 is a scanning type of peeling layer by layer, so that the thermal influence generated by the laser cutting is further reduced.

In order to further reduce the thermal influence, the laser module 10 uses a liquid cooling medium to cool the workpiece while cutting the logo pattern on the workpiece. In this embodiment, the liquid cooling medium is water. It can be understood that, in other embodiments, the liquid cooling medium may be a liquid cooling medium other than water, for example, kerosene and the like.

The cooling device 20 includes a liquid storage module 21, a filter module 22, and a cooling table 23.

The liquid storage module 21 is used to provide a stable liquid cooling medium flow when the laser module 10 cuts the logo pattern. The liquid storage module 21 includes a support 211 and a liquid storage tank 212. The liquid storage tank 212 is disposed on the support 211. The bottom of the liquid storage tank 212 is provided with a first liquid outlet (not shown). A second liquid outlet 2121 and a first liquid inlet 2123 are provided on a side wall of the liquid storage tank 212. The second liquid outlet 2121 and the first liquid inlet 2123 are disposed at intervals.

The filter module 22 and the liquid storage module 21 are arranged at intervals. The filtering module 22 includes a screening program 221 and an electric pump 223. The electric pump 223 has a third liquid outlet 2231 and a second liquid inlet (not shown). The third liquid outlet 2231 and the second liquid inlet are respectively connected to the screening program 221 through a line 2233 to increase the flow rate of the liquid cooling medium flow in the screening program 221. The screening program 221 has a fourth liquid outlet 2213 and a third liquid inlet 2211. The fourth liquid outlet 2213 is connected to the first liquid inlet 2123 of the liquid storage tank 212 through a line 2215, and the third liquid inlet 2211 is connected to the second liquid outlet 2121 of the liquid storage tank 212 through a line 2217. The liquid cooling medium in the liquid storage tank 212 is filtered. The screening program 221 is also connected to the cooling workbench 23 through a line 2219 to filter the liquid cooling medium flowing out of the cooling workbench 23.

Please refer to FIG. 2 to FIG. 6 together. The cooling table 23 is used to support and cool the workpiece when the laser module 10 performs laser cutting on the workpiece. The cooling table 23 includes a base 231, a liquid collecting tank 232, a liquid level controller 233, an adsorption member 234, a gland 235, a blanking member 236, and a receiving box 237.

The base 231 has a bottom plate 2311, a plurality of support posts 2313, and a top plate 2315. The top plate 2315 and the bottom plate 2311 are spaced apart and parallel to each other. A plurality of support posts 2313 are supported between the top plate 2315 and the bottom plate 2311, so that a receiving space 2317 is formed between the top plate 2315 and the bottom plate 2311. The top plate 2315 is provided with an opening 2319.

The liquid collecting tank 232 is disposed in the base 231. Specifically, the liquid collecting tank 232 is disposed in the receiving space 2317 and is fixed in the opening 2319 of the top plate 2315. The liquid collecting tank 232 has a fifth liquid outlet 2321 and a fourth liquid inlet 2323. The fifth liquid outlet 2321 is connected to the screening program 221 through the line 2219, and the fourth liquid inlet 2323 is connected to the first liquid outlet of the liquid storage tank 212 through the line 2328. Since the first liquid outlet is provided in the liquid storage tank The bottom of 212 can ensure that the liquid cooling medium flowing out of the first liquid outlet will not be doped with air bubbles, thereby avoiding affecting the processing quality of the cutting surface. The liquid collecting tank 232 is also provided with a buffer tank 2325. The buffer tank 2325 is disposed adjacent to the fourth liquid inlet 2323 and the fifth liquid outlet 2321, so that the liquid cooling medium entering the liquid collecting tank 232 is buffered to avoid the influence of the fluctuation of the liquid cooling medium on the cutting quality of the workpiece.

Please refer to FIG. 4 together. The liquid level controller 233 is disposed on the base 231 and is adjacent to the top of the liquid collecting tank 232. Specifically, the liquid level controller 233 is disposed on the top plate 2315 and is adjacent to the opening 2319. The liquid level controller 233 is used to monitor the height of the liquid cooling medium in the liquid collecting tank 232. By controlling the liquid cooling medium of the fifth liquid outlet 2321 and the fourth liquid inlet 2323 of the liquid collecting tank 232 so that the amount of liquid input is slightly larger than the liquid discharging amount, the liquid collecting medium in the liquid collecting tank 232 can be filled, and when the liquid is collected When the height of the liquid cooling medium in the tank 232 exceeds the height of the liquid level controller 233, the liquid level controller 233 can remove the excess liquid cooling medium of the liquid collecting tank 232.

The adsorption member 234 is disposed in the liquid collecting tank 232. The height of the adsorption member 234 is substantially the same as the height of the groove edge of the liquid collecting tank 232. The suction member 234 is provided with a suction hole 2341 in the height direction. The suction holes 2341 have a mesh structure. The suction member 234 passes through the bottom of the liquid collecting tank 232 as a whole and is connected to an external suction element through the suction hole 2341. The suction element is capable of sucking out the air located in the suction hole 2341, so that the workpiece located on the suction member 234 is suctioned onto the suction member 234 by a negative pressure.

Referring to FIG. 3 together, the cover 235 is rotatably connected to the top plate 2315 of the base 231 and covers the opening 2319. The gland 235 is provided with a yielding port 2351. The gland 235 holds the workpiece on the adsorption member 234, and allows the position 2351 to clear the area to be processed, so that the laser module 10 can process the area, and the processed material head falls into the liquid collecting tank 232. in.

Please refer to FIG. 5 together, the bottom wall of the liquid collecting tank 232 has a certain thickness. The bottom wall of the liquid collecting tank 232 is provided with a pin hole 2327 substantially parallel to the bottom wall of the liquid collecting tank 232. The bottom wall of the liquid collecting tank 232 is further provided with a blanking hole 2329 which communicates with the ejector hole 2327 and the liquid collecting tank 232 and penetrates the bottom wall of the liquid collecting tank 232.

The blanking member 236 includes a cylinder 2361 and a ejector rod 2363. The cylinder 2361 is disposed outside the liquid collecting tank 232, and the ejector rod 2363 is disposed on the output shaft of the cylinder 2361, and extends into the ejector hole 2327. When the ejector pin 2363 is driven by the cylinder 2361 to slide in the ejector hole 2327 and block the blanking hole 2329, the liquid collecting tank 232 can be filled with a liquid cooling medium. Conversely, when the ejector pin 2363 is driven by the cylinder 2361 to slide in the ejector hole 2327 and the blanking hole 2329 is opened, the liquid cooling medium in the liquid collecting tank 232 and the material head fall together from the blanking hole 2329. .

Please refer to FIG. 3 and FIG. 6 together. The receiving box 237 is located below the liquid collecting tank 232. The receiving box 237 includes a box body 2370 and a drawer 2371. The drawer 2371 is detachably disposed in the box body 2370. The drawer 2371 has a filter screen, and when the liquid cooling medium falls together with the material head from the blanking hole 2329, the material head remains in the drawer 2371 while filtering, and the liquid cooling medium falls into the box body 2370. When there are many material heads accumulated in the drawer 2371, the material heads in the drawer 2371 can be manually pulled out and then put back. The liquid cooling medium in the box body 2370 can be removed from the bottom thereof. The air cylinder 2361 is fixed on a side wall of the box body 2370.

It can be understood that each passage of the liquid cooling medium loop is provided with a flow regulating valve to adjust the flow rate of the liquid cooling medium in each passage.

Please refer to FIG. 7, a cutting method according to an embodiment of the present invention. The cutting method is applied to the cutting device. The cutting method includes steps:

S701. By controlling the flow velocity of the fifth liquid outlet 2321 and the fourth liquid inlet 2323 of the liquid collecting tank 232, specifically adjusting the size of a flow regulating valve, the liquid collecting medium is filled in the liquid collecting tank 232, and starts Stable loop flow;

S702: Open the pressure cover 235, place the workpiece on the adsorption member 234, and suck out the air located in the suction hole 2341 through the suction element, so that the workpiece is adsorbed on the adsorption member 234 by a negative pressure.

In step S703, the cap 235 is tightly closed, and the liquid cooling medium directly flows through a side of the workpiece near the liquid collecting tank 232 to cool the workpiece during the cutting process.

S704, starting the laser module 10, the laser module 10 emits UV laser and performs laser cutting on the workpiece by scanning layer by layer to laser cut the logo pattern on the workpiece, and the cut material head falls into the liquid collecting tank 232 .

Among them, the laser is a UV laser with a wavelength of 355 nm. Due to the concentration of the UV laser energy at this wavelength, the chemical bonds connecting the atomic components of the substance can be directly destroyed, so that its processing heat effect is small.

Among them, the laser cutting method is processing at the time of scanning peeled layer by layer, so that its thermal influence is further reduced.

S705: Open the gland 235, and remove the workpiece from the adsorption member 234.

S706, when there are more material heads in the liquid collecting tank 232, when the ejector rod 2363 is driven by the cylinder 2361 to slide in the ejector hole 2327 and open the blanking hole 2329, the liquid cooling medium in the liquid collecting tank 232 together with the material The heads fall together into the receiving box 237 located below the falling hole 2329, the material heads are filtered and left in the drawer 2371, and the liquid cooling medium falls into the box body 2370.

S707, when there are more material heads stacked in the drawer 2371, the material heads in the drawer 2371 can be manually pulled out and put back.

It is cooled by the liquid cooling medium flowing in a circular flow on the appearance surface of the workpiece, and UV laser layer-by-layer scanning cutting is adopted, and the quality of the cutting surface is good.

It can be understood that, in other embodiments, if a filter is provided at the fifth liquid outlet 2321 of the liquid collecting tank 232 to filter impurities in the liquid collecting tank 232, and the liquid level of the liquid storage module 21 and the The effect of the height difference of the liquid level between the liquid collecting tanks 232 increases the flow speed of the liquid cooling medium, the filter module 22 can be omitted, and the fifth liquid outlet 2321 and the fourth liquid inlet 2323 of the liquid collecting tank 232 are connected respectively. On the liquid storage tank 212.

It can be understood that, in other embodiments, if the effect of the height difference between the liquid level of the liquid storage module 21 and the liquid collecting tank 232 is used to increase the flow speed of the liquid cooling medium, the electric pump can be omitted.

It can be understood that, in other embodiments, if the liquid cooling medium entering the liquid collecting tank 232 is gentle enough to not cause liquid level fluctuation, the buffer tank 2325 of the liquid collecting tank 232 may be omitted.

It can be understood that, in other embodiments, if a liquid outlet is provided at the position of the liquid level controller 233 to ensure that the liquid level of the liquid collecting tank 232 reaches the height of the liquid outlet, it will automatically flow out of the liquid outlet. The liquid level controller 233 may be omitted.

It can be understood that in other embodiments, if the adsorption member 234 has a sufficiently large adsorption capacity so that the workpiece can be completely adsorbed and fixed, the gland can be omitted.

It can be understood that in other embodiments, the blanking hole 2329 can be manually opened to exclude the liquid cooling medium and the material head therein, and the blanking member 236 and the ejector hole 2327 can be omitted.

It can be understood that, in other embodiments, the material head can be manually removed from the adsorption member 234 directly with the workpiece or the bracket falls on the bottom plate 2311, and the receiving box 237 can be omitted.

In summary, the present invention complies with the elements of an invention patent, and a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of the present invention. For those who are familiar with the skills of this case, equivalent modifications or changes made according to the spirit of the present invention should be covered by the following patent application scope.

100‧‧‧ cutting equipment

10‧‧‧laser module

20‧‧‧ Cooling device

21‧‧‧Liquid storage module

211‧‧‧Support

212‧‧‧Storage tank

2121‧‧‧Second Outlet

2123‧‧‧First inlet

22‧‧‧Filter Module

221‧‧‧ Screening Program

2211‧‧‧Third liquid inlet

2213‧‧‧The fourth outlet

223‧‧‧Electric Pump

2231‧‧‧Third Outlet

23‧‧‧cooling table

231‧‧‧pedestal

2311‧‧‧ floor

2313‧‧‧Support Post

2315‧‧‧Top plate

2317‧‧‧Containment space

2319‧‧‧ opening

232‧‧‧ collection tank

2321‧‧‧ fifth outlet

2323‧‧‧Fourth liquid inlet

2325‧‧‧Buffer tank

2327‧‧‧ ejector hole

2329‧‧‧fall hole

233‧‧‧Liquid level controller

234‧‧‧Adsorption

2341‧‧‧Suction hole

235‧‧‧ Gland

2351‧‧‧Giveway

236‧‧‧ blanking parts

2361‧‧‧ Cylinder

2363‧‧‧ Jack

237‧‧‧Receiving Box

2370‧‧‧Box

2371‧‧‧Drawer

2233, 2215, 2217, 2219, 2328‧‧‧ pipeline

FIG. 1 is a schematic perspective view of a cutting device according to an embodiment of the present invention.

FIG. 2 is a three-dimensional structure diagram of the cooling table in FIG. 1.

FIG. 3 is a disassembly schematic diagram of the cooling workbench shown in FIG. 2.

FIG. 4 is a schematic cross-sectional view taken along the IV-IV direction of FIG. 2.

Fig. 5 is a schematic cross-sectional view in the V-V direction in Fig. 2.

FIG. 6 is a schematic cross-sectional view taken along the VI-VI direction in FIG. 2.

FIG. 7 is a schematic flowchart of a cutting method according to an embodiment of the present invention.

no

no

Claims (10)

A cutting device includes a cooling device and a laser module. The improvement is that the cooling device includes a liquid storage module and a cooling workbench, the liquid storage module includes a liquid storage tank, and the liquid storage tank is used for the cooling workbench. Provide a stable liquid cooling medium flow. The cooling table includes a base, a liquid collecting tank and an adsorption member. The liquid collecting tank is disposed in the base. The liquid collecting tank includes a liquid outlet and a liquid inlet. The inlet is connected to the bottom of the liquid storage tank, the liquid inlet is connected to the side wall of the liquid storage tank to obtain sufficient liquid cooling medium from the liquid storage tank, the adsorption member is arranged in the liquid collecting tank, and the adsorption member It is used to adsorb and support a workpiece. The liquid cooling medium flow located in the liquid collecting tank can directly flow through the side of the workpiece close to the liquid collecting tank to cool the workpiece during the cutting process. The laser module emits UV laser and passes through Laser cutting is performed on the workpiece layer by layer. The cutting device according to item 1 of the scope of patent application, wherein the liquid collecting tank is further provided with a buffer tank, which is arranged adjacent to the liquid inlet and the liquid outlet so that the liquid entering the liquid collecting tank is cooled The medium is buffered to prevent the fluctuation of the liquid cooling medium from affecting the cutting quality of the workpiece. The cutting device according to item 1 of the patent application scope, wherein the base has a bottom plate, a plurality of support columns and a top plate, the top plate is spaced from the bottom plate and is parallel to each other, and the plurality of supports are supported on the top plate and the Between the bottom plates, a receiving space is formed between the top plate and the bottom plate. An opening is provided on the top plate, and the liquid collecting tank is disposed in the receiving space and fixed in the opening of the top plate. The cutting equipment according to item 3 of the patent application scope, wherein the cooling table further comprises a liquid level controller, the liquid level controller is disposed on the top plate and adjacent to the opening, and the liquid level controller is used to monitor the liquid collection The height of the liquid cooling medium in the tank. When the height of the liquid cooling medium in the liquid collecting tank exceeds the height of the liquid level controller, the liquid level controller removes excess liquid cooling medium in the liquid collecting tank. The cutting device according to item 1 of the scope of patent application, wherein: the suction member is provided with suction holes along its height direction, and the air in the suction holes can be removed through the suction holes so as to be located on the suction member. The workpiece is adsorbed on the adsorption member by negative pressure. The cutting device according to item 5 of the scope of patent application, wherein: the bottom wall of the liquid collecting tank is provided with a jack hole parallel to the bottom wall of the liquid collecting tank, and the bottom wall of the liquid collecting tank is further provided with a drop A feed hole, which is connected to the liquid collecting tank and the ejector hole, and penetrates the bottom wall of the liquid collecting tank. The cooling table further includes a blanking member, the blanking member includes an air cylinder and an ejector rod, and the air cylinder The ejector rod is arranged on the outside of the liquid collecting tank. The ejector rod is arranged on the cylinder and extends into the ejector rod hole. When the ejector rod is driven by the cylinder to slide in the ejector rod hole and block the blanking hole, the set The liquid tank contains liquid cooling medium. When the ejector rod is driven by the cylinder to slide in the ejector hole and open the blanking hole, the liquid cooling medium in the liquid collecting tank and the material head fall together from the blanking hole. The cutting equipment according to item 6 of the scope of patent application, wherein the cooling table further includes a receiving box, which is located below the liquid collecting tank. The receiving box includes a box body and a detachable setting. A drawer on the box body, the drawer has a filter screen, the drawer is used to collect the material heads dropped from the blanking hole, and the box body is used to collect the liquid cooling medium dropped from the blanking hole. The cutting device according to item 1 of the patent application scope, wherein the cooling table further comprises a gland, which is pivotally connected to the base for holding and fixing the workpiece, and the gland holds the workpiece to be processed. The area is set aside to allow the laser module to perform laser cutting. A cutting method is applied to a cutting device. The cutting device includes a cooling device and a laser module. The cooling device includes a liquid storage module and a cooling table. The liquid storage module includes a liquid storage tank. The liquid tank is used to provide a stable liquid cooling medium flow for the cooling workbench. The cooling workbench includes a base, a liquid collecting tank and an adsorption member. The liquid collecting tank is arranged in the base, and the liquid collecting tank includes a liquid outlet. A liquid inlet and a liquid inlet, the liquid outlet is connected to the bottom of the liquid storage tank, the liquid inlet is connected to the side wall of the liquid storage tank to obtain sufficient liquid cooling medium from the liquid storage tank, and the adsorption member is provided In the liquid collecting tank; the improvement is that the cutting method comprises the steps of: making the liquid collecting tank filled with liquid cooling medium by controlling the flow velocity of the liquid inlet and the liquid outlet of the liquid collecting tank, and starting a stable loop flow ; Adsorbing a workpiece on the adsorption member in the form of negative pressure; the liquid cooling medium directly flows through a side of the workpiece near the liquid collecting tank to cool the workpiece during cutting processing; starting the laser module, the laser Group emits UV laser and laser cutting of the workpiece layer by layer in a scanning manner; and removing them from the sorbent. The cutting method according to item 9 of the scope of patent application, wherein the cooling table further includes a blanking part, the blanking part includes a cylinder and a ejector rod, the cylinder is disposed outside the liquid collecting tank, and the ejector rod is provided When the jack is pushed on the cylinder and penetrates into the jack hole, the jack is driven by the cylinder to slide in the jack hole of the liquid collecting tank and block the blanking hole of the liquid collecting tank, the liquid collecting tank can hold liquid Cooling medium; when the ejector rod is driven by the cylinder to slide in the ejector hole of the liquid collecting tank and open the blanking hole of the liquid collecting tank, the liquid cooling medium in the liquid collecting tank is removed along with the cut material head The blanking hole is dropped.