CN107984094A - Cutting equipment and its cutting method - Google Patents
Cutting equipment and its cutting method Download PDFInfo
- Publication number
- CN107984094A CN107984094A CN201610952241.5A CN201610952241A CN107984094A CN 107984094 A CN107984094 A CN 107984094A CN 201610952241 A CN201610952241 A CN 201610952241A CN 107984094 A CN107984094 A CN 107984094A
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- collecting tank
- liquid
- workpiece
- cooling medium
- laser
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Auxiliary Devices For Machine Tools (AREA)
Abstract
The present invention provides a kind of cutting equipment, it includes cooling device and laser module.Cooling device includes liquid storage module and cooling work platform.Liquid storage module is used for the liquid cooling medium stream that stabilization is provided for cooling work platform.Cooling work platform includes pedestal, collecting tank and adsorption piece.Collecting tank is arranged in pedestal.Collecting tank includes liquid outlet and inlet.Liquid outlet is connected to the bottom of liquid reserve tank, and inlet is connected to the side wall of liquid reserve tank, to obtain liquid cooling medium.Adsorption piece is arranged in collecting tank.Adsorption piece is used for adsorbent support workpiece.One side of the workpiece close to collecting tank is directly flowed through to be cooled down in cutting processing to workpiece positioned at the liquid cooling medium stream of collecting tank, and laser module sends UV laser and workpiece is cut by laser by way of successively scanning.The present invention also provides a kind of cutting method applied to cutting equipment.During cutting, cooled down by using the cold mode of liquid, and successively scan-type is cut using UV laser, quality of cut face is good.
Description
Technical field
The present invention relates to a kind of cutting equipment and its cutting method, more particularly to one kind to be set using the liquid-cooled cutting of laser
Standby and its cutting method.
Background technology
Traditional cutting equipment method of machining identification pattern on workpiece has two kinds, the first processing method for punching press-
Polishing-anodic oxidation-polishing-anodic oxidation, this processing method can cause the bad of turned-down edge, second of processing method for polishing-
Anodic oxidation-polishing-punching press-anodic oxidation, this processing method can cause the bad of burr.In conclusion above cutting equipment
Two kinds of processing methods of machining identification pattern cannot reach processing request.
The content of the invention
In view of this, it is necessary to a kind of cutting equipment and its cutting method are provided, to solve the above problems.
The present invention provides a kind of cutting equipment, including cooling device and laser module.The cooling device includes liquid storage module
With cooling work platform, which includes liquid reserve tank, and the liquid which is used to provide stabilization for the cooling work platform is cold
But medium flow field, the cooling work platform include pedestal, collecting tank and adsorption piece, which is arranged in the pedestal, the collecting tank
Including liquid outlet and inlet, which is connected to the bottom of the liquid reserve tank, which is connected to the side wall of the liquid reserve tank
On, to obtain enough liquid cooling mediums from the liquid reserve tank, which is arranged in collecting tank, which is used to adsorb
Support a workpiece, positioned at the liquid cooling medium stream of the collecting tank can directly flow through the workpiece close to the collecting tank one side with
The workpiece is cooled down in cutting processing, the laser module send UV laser and by way of successively scanning to workpiece into
Row laser cutting.
The present invention also provides a kind of cutting method.The cutting method is applied on a cutting equipment.The cutting equipment includes
Cooling device and laser module, the cooling device include liquid storage module and cooling work platform, which includes liquid reserve tank, should
Liquid reserve tank is used for the liquid cooling medium stream that stabilization is provided for the cooling work platform, which includes pedestal, collecting tank
And adsorption piece, the collecting tank are arranged in the pedestal, which includes liquid outlet and inlet, which is connected to the storage
The bottom of liquid case, the inlet are connected on the side wall of the liquid reserve tank, to obtain enough liquid cooling mediums from the liquid reserve tank,
The adsorption piece is arranged in collecting tank.The cutting method includes step：By the inlet and liquid outlet that control the collecting tank
Flow velocity to be full of liquid cooling medium in the collecting tank, and starts circulating for stabilization；The shape that one workpiece is passed through into negative pressure
Formula is adsorbed on the adsorption piece；The liquid cooling medium directly flows through one side of the workpiece close to the collecting tank with cutting processing
When the workpiece is cooled down；Start the laser module, which sends UV laser and by way of successively scanning pair
Workpiece is cut by laser；And workpiece is removed from the adsorption piece.
Cooled down by the appearance in workpiece using the liquid cooling medium circulated, and using UV laser successively
Scan-type is cut, and quality of cut face is good.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of the cutting equipment in an embodiment of the present invention.
Fig. 2 is the dimensional structure diagram of cooling work platform in Fig. 1.
Fig. 3 disassembles schematic diagram for cooling work platform shown in Fig. 2.
Fig. 4 is diagrammatic cross-sections of the Fig. 2 in Section IV-IV directions.
Fig. 5 is the diagrammatic cross-section in V-V directions in Fig. 2.
Fig. 6 is the diagrammatic cross-section in Section VI-VI directions in Fig. 2.
Fig. 7 is the cutting method flow diagram in an embodiment of the present invention.
Main element symbol description
Following embodiment will combine above-mentioned attached drawing and further illustrate the present invention.
Embodiment
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu, be fully described by, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole implementation
Mode.Based on the embodiment in the present invention, those of ordinary skill in the art are obtained without making creative work
The all other embodiment obtained, belongs to the scope of protection of the invention.
It should be noted that when a component is considered as " connection " another component, it can be directly to separately
One component may be simultaneously present component placed in the middle.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood implication of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of body embodiment, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Please refer to Fig.1, Fig. 1 is the structure diagram of cutting equipment 100 in an embodiment of the present invention.Cutting equipment 100
For cutting to form identification pattern in workpiece (not shown) by the way of laser cutting.Specifically, cutting equipment 100 includes
Laser module 10 and cooling device 20.
The laser that laser module 10 is sent is UV laser, its wavelength is 355nm, and the laser energy of the wavelength is concentrated, can be straight
Connect the chemical bond for the atomic component for destroying connection material so that the heat affecting for being cut by laser generation reduces.In the present embodiment, laser
The cutting mode that module 10 uses cuts for the scan-type successively peeled off so that the heat affecting for being cut by laser generation further subtracts
It is small.
Further to reduce heat affecting, laser module 10 is while identification pattern is cut on workpiece, in workpiece appearance
Face is cooled down using liquid cooling medium.In present embodiment, which is water.It is understood that in other implementations
In mode, which can be other liquid cooling mediums than water, for example, kerosene etc..
Cooling device 20 includes liquid storage module 21, filtering module 22 and cooling work platform 23.
Liquid storage module 21 is used to provide stable liquid cooling medium stream when laser module 10 cuts identification pattern.Liquid storage
Module 21 includes supporting item 211 and liquid reserve tank 212.Liquid reserve tank 212 is arranged on supporting item 211.The bottom of liquid reserve tank 212 is set
First liquid outlet (not shown).The side wall of liquid reserve tank 212 is equipped with the second liquid outlet 2121 and the first inlet 2123.Second goes out
2121 and first inlet 2123 of liquid mouth is arranged at intervals.
Filtering module 22 is arranged at intervals with liquid storage module 21.Filtering module 22 includes filter 221 and electrodynamic pump 223.Electricity
Dynamic pump 223 has the 3rd liquid outlet 2231 and the second inlet (not shown).3rd liquid outlet 2231 and the second inlet difference
It is connected to by pipeline 2233 on filter 221, to increase the flow velocity of liquid cooling medium stream in filter 221.Filter 221
With the 4th liquid outlet 2213 and the 3rd inlet 2211.4th liquid outlet 2213 is connected to liquid reserve tank 212 by pipeline 2215
The first inlet 2123 on, the 3rd inlet 2211 is connected to the second liquid outlet 2121 of liquid reserve tank 212 by pipeline 2217
On, to be filtered to the liquid cooling medium in liquid reserve tank 212.Filter 221 is also connected to cooling by pipeline 2219
On workbench 23, the liquid cooling medium to be flowed out to cooling work platform 23 filters.
Please also refer to Fig. 2 to Fig. 6, cooling work platform 23 is to from when laser module 10 is cut by laser workpiece
To the effect that the support to workpiece is fixed and cools down.Cooling work platform 23 includes pedestal 231, collecting tank 232, liquid-level controller
233rd, adsorption piece 234, gland 235, blank 236 and rewinding box 237.
Pedestal 231 has bottom plate 2311, multiple support columns 2313 and top plate 2315.Top plate 2315 is set with the interval of bottom plate 2311
Put and be parallel to each other.Multiple support columns 2313 are supported between top plate 2315 and bottom plate 2311 so that top plate 2315 and bottom plate
Receiving space 2317 is formed between 2311.Opening 2319 is provided with top plate 2315.
Collecting tank 232 is arranged in pedestal 231.Specifically, collecting tank 232 is arranged in receiving space 2317 and is fixed
In the opening 2319 of top plate 2315.Collecting tank 232 has the 5th liquid outlet 2321 and the 4th inlet 2323.5th liquid outlet
2321 are connected on filter 221 by pipeline 2219, and the 4th inlet 2323 is connected to liquid reserve tank 212 by pipeline 2328
On first liquid outlet, since the first liquid outlet is arranged at the bottom of liquid reserve tank 212, it is ensured that from the liquid of the first liquid outlet outflow
Bubble will not be adulterated in cooling medium, so as to avoid influencing the processing quality of cut surface.A dashpot is additionally provided with collecting tank 232
2325.The dashpot 2325 is set adjacent to the 4th inlet 2323 and the 5th liquid outlet 2321 so that into the collecting tank 232
Liquid cooling medium buffered and avoid influencing liquid cooling medium fluctuating influence to work piece cut quality.
Please also refer to Fig. 4, liquid-level controller 233 is arranged on pedestal 231, and the top of the neighbouring collecting tank 232.Tool
Body, liquid-level controller 233 is arranged at top plate 2315 and adjacent openings 2319.Liquid-level controller 233 is used to monitor collecting tank 232
The height of interior liquid cooling medium.By controlling the 5th liquid outlet 2321 of collecting tank 232 and the liquid of the 4th inlet 2323
State cooling medium causes liquid inlet volume to be slightly larger than liquid outlet quantity, can make to be full of liquid cooling medium in collecting tank 232, and works as collecting tank
When the height of liquid cooling medium in 232 exceedes the height at the place of liquid-level controller 233, which can take out
Walk the unnecessary liquid cooling medium of the collecting tank 232.
Adsorption piece 234 is arranged in collecting tank 232.Height of the height of adsorption piece 234 substantially with the groove edge of collecting tank 232
Unanimously.Adsorption piece 234 is along in its short transverse through setting suction hole 2341.Suction hole 2341 is in net structure.Adsorption piece 234
Bottom integrally through the collecting tank 232 is simultaneously connected by the suction hole 2341 with the getter assembly outside one.Getter assembly energy
It is enough to suction out the air being located in suction hole 2341 so that the workpiece on adsorption piece 234 is adsorbed in by the form of negative pressure
On annex 234.
Please also refer to Fig. 3, gland 235 is rotationally connected with the top plate 2315 of pedestal 231 and is placed in opening 2319.Pressure
Lid 235 is equipped with a resigning mouthful 2351.Gland 235 is by workpiece pressure holding on adsorption piece 234, and resigning mouthful 2351 is to be added by workpiece
Work area domain is got out of the way, and so that laser module 10 can process the region, and the material head that processing is dropped is fallen into the collecting tank 232.
Please also refer to Fig. 5, the bottom wall of collecting tank 232 has certain thickness.The bottom wall of collecting tank 232 is equipped with and this
The almost parallel jogger hole 2327 of the bottom wall of collecting tank 232.It is additionally provided with the bottom wall of collecting tank 232 and connects 2327 He of jogger hole
The collecting tank 232, and the material-dropping hole 2329 of the bottom wall through the collecting tank 232.
Blank 236 includes cylinder 2361 and mandril 2363.The cylinder 2361 is arranged at the outside of the collecting tank 232, should
Mandril 2363 is arranged on the output shaft of the cylinder 2361, and stretches into the jogger hole 2327.The mandril 2363 is by the cylinder 2361
When driving is slided in the jogger hole 2327 and blocks the material-dropping hole 2329, liquid cooled Jie can be filled with the collecting tank 232
Matter.Conversely, the mandril 2363 is driven by the cylinder 2361 when being slided in the jogger hole 2327 and opening the material-dropping hole 2329, should
Liquid cooling medium in collecting tank 232 is together fallen together with material head from the material-dropping hole 2329.
Please also refer to Fig. 3 and Fig. 6, rewinding box 237 is located at the lower section of collecting tank 232.Rewinding box 237 includes box body 2370
With drawer 2371.Drawer 2371 is detachably arranged in box body 2370.Drawer 2371 has filter screen, works as liquid cooling medium
When together being fallen together with material head from the material-dropping hole 2329, material head is stayed in the drawer 2371 in filtering, and liquid cooling medium is fallen into
In the box body 2370.When the material head being deposited in drawer 2371 is more, drawer 2371 can be extracted out manually and outwell material head therein
Put back to again.Liquid cooling medium in box body 2370 can be excluded from its bottom.Cylinder 2361 is fixedly arranged on the side wall of the box body 2370
On.
It is understood that flow control valve is both provided with the individual channel of liquid cooling medium circulation, to adjust individual channel
Liquid cooling medium uninterrupted.
Fig. 7, the cutting method of one embodiment of the invention are refer to, which is applied on above-mentioned cutting equipment.Should
Cutting method includes step：
S701, by controlling the 5th liquid outlet 2321 of the collecting tank 232 and the flow velocity of the 4th inlet 2323, is specially
Adjust the size of a flow control valve so that be full of liquid cooling medium in the collecting tank 232, and start stable recycle stream
It is dynamic；
S702, opens gland 235, workpiece is positioned on the adsorption piece 234, is suctioned out by getter assembly and is located at suction hole
Air in 2341 so that workpiece is adsorbed on adsorption piece 234 by the form of negative pressure.
S703, covers tightly gland 235, the liquid cooling medium directly flow through the workpiece close to the collecting tank 232 one side with
The workpiece is cooled down in cutting processing.
S704, starts laser module 10, which sends UV laser and by way of successively scanning to workpiece
It is cut by laser, to be cut by laser identification pattern on workpiece, the material head of cutting drops in collecting tank 232.
Wherein, laser is UV laser, wavelength 355nm, can the direct company of destruction since the UV laser energies of this wavelength are concentrated
Connect the chemical bond of material atom component so that it is small that it processes heat affecting.
Wherein, processed when the cutting mode of laser is the scanning successively peeled off, its heat affecting is further reduced.
S705, opens gland 235, workpiece is removed from the adsorption piece 234.
S706, when having more material head in the collecting tank 232, mandril 2363 is driven in jogger hole 2327 by cylinder 2361
Interior to slide and when opening material-dropping hole 2329, the liquid cooling medium in collecting tank 232 is together fallen into positioned at material-dropping hole together with material head
In the rewinding box 237 of 2329 lower sections, material head filtering is stayed in the drawer 2371, and liquid cooling medium is fallen into the box body 2370.
S707, when the material head accumulated in drawer 2371 is more, can extract drawer 2371 out manually and outwell material head therein again
Put back to.
Cooled down by way of being cooled down in the appearance of workpiece using the liquid cooling medium circulated, and swashed using UV
Successively scan-type is cut light, and quality of cut face is good.
It is understood that in other embodiments, if being provided with filter screen at the 5th liquid outlet 2321 of collecting tank 232
To be filtered to the impurity in collecting tank 232, and utilize the height of the liquid level between the liquid level and collecting tank 232 of liquid storage module 21
The flowing velocity of the effect increase liquid cooling medium of degree difference, then filtering module 22 can omit, the 5th liquid outlet of collecting tank 232
2321 and the 4th inlet 2323 be connected on liquid reserve tank 212.
It is understood that in other embodiments, if utilizing the liquid level between the liquid level and collecting tank 232 of liquid storage module 21
Difference in height effect increase liquid cooling medium flowing velocity, then electrodynamic pump can be omitted.
It is understood that in other embodiments, if gentle enough into the liquid cooling medium in collecting tank 232, no
Liquid fluctuating can be caused, then the dashpot 2325 of collecting tank 232 can be omitted.
It is understood that in other embodiments, if setting a liquid outlet in the position of liquid-level controller 233, ensure collection
When the liquid level of liquid bath 232 reaches the height of the liquid outlet, then flowed out automatically from the liquid outlet, then liquid-level controller 233 can be with
Omit.
It is understood that in other embodiments, if the sufficiently large adsorption capacity of adsorption piece 234 enables workpiece complete
Fixed by absorption, then gland can be omitted.
It is understood that in other embodiments, material-dropping hole 2329 can manual unlocking exclude liquid cooling medium therein
And material head, then blank 236 and jogger hole 2327 can be omitted.
It is understood that in other embodiments, material head can be removed directly from the adsorption piece 234 manually together in company with workpiece
Or stent falls on bottom plate 2311, then rewinding box 237 can be omitted.
Those skilled in the art it should be appreciated that the embodiment of the above be intended merely to explanation the present invention,
And be not used as limitation of the invention, as long as within the spirit of the present invention, embodiment of above is made
Appropriate change and variation all fall within the scope of protection of present invention.
Claims (10)
1. a kind of cutting equipment, including cooling device and laser module, it is characterised in that：The cooling device include liquid storage module and
Cooling work platform, the liquid storage module include liquid reserve tank, which is used for the liquid cooled that stabilization is provided for the cooling work platform
Medium flow field, the cooling work platform include pedestal, collecting tank and adsorption piece, which is arranged in the pedestal, the collecting tank bag
Liquid outlet and inlet are included, which is connected to the bottom of the liquid reserve tank, which is connected on the side wall of the liquid reserve tank,
To obtain enough liquid cooling mediums from the liquid reserve tank, which is arranged in collecting tank, which is used to adsorb branch
Support a workpiece, positioned at the liquid cooling medium stream of the collecting tank can directly flow through the workpiece close to the collecting tank one side with
The workpiece is cooled down during cutting processing, which sends UV laser and workpiece is carried out by way of successively scanning
Laser cutting.
2. cutting equipment as claimed in claim 1, it is characterised in that：A dashpot is additionally provided with the collecting tank, the dashpot
The neighbouring inlet and the liquid outlet are set so that the liquid cooling medium into the collecting tank is buffered and avoids liquid cooled
The cut quality of the influence of fluctuations workpiece of medium.
3. cutting equipment as claimed in claim 1, it is characterised in that：The pedestal has bottom plate, multiple support columns and top plate, should
Top plate is arranged at intervals and is parallel to each other with the bottom plate, and the plurality of support is supported between the top plate and the bottom plate so that the top
Receiving space is formed between plate and the bottom plate, opening is provided with the top plate, which is arranged in receiving space and is consolidated
Due in the opening of the top plate.
4. cutting equipment as claimed in claim 3, it is characterised in that：The cooling work platform further includes liquid-level controller, the liquid
Face controller is arranged at the top plate and the neighbouring opening, which is used to monitor the liquid cooling medium in the collecting tank
Height, when the liquid cooling medium in the collecting tank height exceed the liquid-level controller where height when, the liquid level control
Device processed takes liquid cooling medium unnecessary in the collecting tank away.
5. cutting equipment as claimed in claim 1, it is characterised in that：The adsorption piece is along in its short transverse through setting air-breathing
Hole, can take workpiece that the air in the suction hole is located on the adsorption piece away by the suction hole by negative-pressure adsorption in the suction
On annex.
6. cutting equipment as claimed in claim 5, it is characterised in that：The bottom wall of the collecting tank is equipped with the bottom with the collecting tank
The parallel jogger hole of wall, the bottom wall of the collecting tank are additionally provided with material-dropping hole, which connects the collecting tank and the jogger hole, and passes through
The bottom wall of the collecting tank is worn, which further includes blank, which includes cylinder and mandril, which is arranged at
The outside of the collecting tank, the mandril are arranged on the cylinder and stretch into the jogger hole, which is driven in the mandril by the cylinder
When being slided in hole and blocking the material-dropping hole, which contains liquid cooling medium, which is driven in the mandril by the cylinder
When being slided in hole and opening the material-dropping hole, the liquid cooling medium in the collecting tank is fallen together with material head from the material-dropping hole.
7. cutting equipment as claimed in claim 6, it is characterised in that：The cooling work platform further includes rewinding box, the rewinding box
Positioned at the lower section of the collecting tank, which includes a box body and the drawer being detachably arranged on the box body, the drawer
With filter screen, which is used to collect the material head fallen from the material-dropping hole, which is used to collect declines from the material-dropping hole
Under liquid cooling medium.
8. cutting equipment as claimed in claim 1, it is characterised in that：The cooling work platform further includes gland, gland pivot joint
In fixing the workpiece on the pedestal for pressure holding, which gets out of the way workpiece region to be processed to allow the laser module to carry out
Laser cutting.
9. a cutting method, which is applied on a cutting equipment, which includes cooling device and mode of laser
Group, the cooling device include liquid storage module and cooling work platform, which includes liquid reserve tank, which is used to be that this is cold
But workbench provides stable liquid cooling medium stream, which includes pedestal, collecting tank and adsorption piece, the collecting tank
It is arranged in the pedestal, which includes liquid outlet and inlet, which is connected to the bottom of the liquid reserve tank, the feed liquor
Mouth is connected on the side wall of the liquid reserve tank, and to obtain enough liquid cooling mediums from the liquid reserve tank, which is arranged at collection
In liquid bath；It is characterized in that：The cutting method includes step：
Liquid cooling medium is full of in inlet and the flow velocity of the liquid outlet collecting tank by controlling the collecting tank, and is opened
The stabilization that begins circulates；
One workpiece is adsorbed on the adsorption piece by the form of negative pressure；
The liquid cooling medium directly flows through the workpiece close to the one side of the collecting tank to be carried out in cutting processing to the workpiece
Cooling；
Start the laser module, which sends UV laser and carry out laser to workpiece by way of successively scanning and cut
Cut；And
Workpiece is removed from the adsorption piece.
10. cutting method as claimed in claim 9, it is characterised in that：The cooling work platform further includes blank, the blank
Including cylinder and mandril, which is arranged at the outside of the collecting tank, which is arranged on the cylinder and stretches into the jogger hole,
When the mandril is slided in the jogger hole of the collecting tank by cylinder driving and blocks the material-dropping hole of the collecting tank, the collecting tank energy
Enough contain liquid cooling medium；The mandril is slided in the jogger hole of the collecting tank by cylinder driving and opens the collecting tank
During material-dropping hole, the liquid cooling medium in the collecting tank is fallen together with cut material head from the material-dropping hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610952241.5A CN107984094A (en) | 2016-10-26 | 2016-10-26 | Cutting equipment and its cutting method |
| TW105136346A TWI667091B (en) | 2016-10-26 | 2016-11-09 | Cutting apparatus and cutting method using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610952241.5A CN107984094A (en) | 2016-10-26 | 2016-10-26 | Cutting equipment and its cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107984094A true CN107984094A (en) | 2018-05-04 |
Family
ID=62029452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610952241.5A Pending CN107984094A (en) | 2016-10-26 | 2016-10-26 | Cutting equipment and its cutting method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107984094A (en) |
| TW (1) | TWI667091B (en) |
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| CN108788501A (en) * | 2018-07-02 | 2018-11-13 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser two-way cooling-water machine with hydraulic pressure monitoring function |
| CN108788491A (en) * | 2018-07-02 | 2018-11-13 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser two-way heat exchange cooling-water machine with function of temperature control |
| CN108788492A (en) * | 2018-07-02 | 2018-11-13 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser two-way heat exchange cooling-water machine |
| CN108817706A (en) * | 2018-07-02 | 2018-11-16 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser two-way bend pipe heat exchange cooling-water machine |
| CN108817707A (en) * | 2018-07-02 | 2018-11-16 | 武汉博富通试验设备有限公司 | A kind of energy-saving and environment-friendly optical-fiber laser two-way temperature control cooling-water machine |
| CN108817685A (en) * | 2018-07-02 | 2018-11-16 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser double water tank two-way bend pipe heat exchange cooling-water machine |
| CN108838566A (en) * | 2018-07-02 | 2018-11-20 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser double water tank two-way heat exchange cooling-water machine |
| CN108838565A (en) * | 2018-07-02 | 2018-11-20 | 武汉博富通试验设备有限公司 | A kind of optical-fiber laser cooling-water machine |
| RU2757978C1 (en) * | 2020-12-14 | 2021-10-25 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") | Liquid cooling table |
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