CN113199160B - Laser synchronous scanning group hole machining system and scanning method - Google Patents
Laser synchronous scanning group hole machining system and scanning method Download PDFInfo
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- CN113199160B CN113199160B CN202110500075.6A CN202110500075A CN113199160B CN 113199160 B CN113199160 B CN 113199160B CN 202110500075 A CN202110500075 A CN 202110500075A CN 113199160 B CN113199160 B CN 113199160B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention provides a laser synchronous scanning group hole processing system and a scanning method.A laser source generating device is connected with a beam shaper in a matching way, a beam light outlet hole of the beam shaper is arranged in a matching way with the input end of a polygonal rotating mirror assembly, the output end of the polygonal rotating mirror assembly is horizontally collinear with the input end of a reflecting vibrating mirror assembly, the output end of the reflecting mirror assembly is vertically collinear with the input end of an f-theta focusing lens group, the output end of the f-theta focusing lens group is arranged in a matching way with a laser processing target surface, the laser processing target surface is closely adsorbed on a laser processing platform, and a laser processing blowing device is arranged in a matching way with a laser processing dust and smoke removal device; due to the fact that the synchronization of the laser pulse frequency and the scanning frequency of the rotating mirror is achieved, in the multi-pulse laser hole burning process, under the condition that the effective punching times are determined, namely the pulse number needed by punching is determined, the proper scanning speed can be selected, and therefore the production efficiency of laser processing of target group holes can be effectively improved.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser synchronous scanning group hole processing system and a scanning method.
Background
The laser is widely applied to industrial research because of the advantages of high brightness, strong directivity, good monochromaticity and the like, particularly the short pulse laser processing is widely applied, and the laser obtains short pulses and space beams with smaller spot radius by controlling the laser time and space and is applied to the automatic processing of materials by combining the computer numerical control technology.
Laser processing techniques and equipment have been widely used in industry, scientific research and medicine, and in a range of processing operations including marking, cutting, welding, deep engraving, curve processing, heat treatment, cladding, material modification, capacitive resistance fabrication and trimming, rapid prototyping/mold manufacturing, circuit board micro-pore fabrication and integrated circuit board fabrication, ophthalmic and large-area dermatology treatments, and the like.
Compared with the traditional mechanical, electrostatic, electric spark and other drilling, laser drilling is a new technology developed in recent years. Laser drilling is classified into circular cutting drilling, single pulse drilling and multi-pulse drilling technologies, and the single pulse drilling generally has large pulse energy, so that the melting capacity is large, the hole pattern and the hole diameter are poor, and the depth is limited. The multi-pulse continuous punching can obtain better small hole quality and larger depth-diameter ratio, the depth is increased continuously along with the injection of each pulse, a new hole surface is melted again by continuously absorbing laser energy, the multi-pulse punching repeats the process continuously, but evaporation power is caused by the energy conservation in the punching process, melting heat absorption is realized, and the excessive pulse repetition frequency causes unnecessary heat accumulation of materials and the absorption of laser pulses is weaker and weaker due to the particle shielding effect, the hole pattern can be influenced, so that under the condition of multi-pulse punching, how to match the scanning speed is the technical problem to be solved urgently at present.
Disclosure of Invention
The laser synchronous scanning group hole machining system provided by the invention effectively improves the efficiency of machining group holes on the target material by laser, realizes the synchronization of the laser pulse repetition frequency and the laser machining scanning frequency, and can adjust the scanning speed under the effective laser punching pulse number, namely the scanning frequency in the laser machining process so as to improve the efficiency of machining group holes on the target material by the laser.
The method specifically comprises the following steps: the device comprises an industrial personal computer, a laser generating device, a beam shaper, a reflecting galvanometer component, a polygonal rotating mirror component, an f-theta focusing lens group, a laser processing blowing device, a laser processing dust collecting device and a laser processing adsorption platform;
a laser processing target material is arranged on the laser processing adsorption platform;
a laser processing blowing device and a laser processing dust collecting device are arranged above the laser processing target material;
the laser generating device is connected with the beam shaper in a matching way, a beam light outlet hole of the beam shaper is matched with the input end of the polygonal rotating mirror assembly, the output end of the polygonal rotating mirror assembly is horizontally collinear with the input end of the reflecting galvanometer assembly, the output end of the reflecting galvanometer assembly is vertically collinear with the input end of the f-theta focusing lens group, and the output end of the f-theta focusing lens group is matched with the laser processing target material;
the polygon rotating mirror assembly is provided with a scanning motor and a polygon scanning rotating mirror connected with an output shaft of the scanning motor;
the reflecting galvanometer component is provided with a laser galvanometer, the laser galvanometer is connected with a connecting shaft, the connecting shaft is connected with an adjusting motor, and the adjusting motor adjusts the angle of laser on a laser processing target material;
the industrial computer is connected with the laser source generating device, controls the laser source generating device to emit laser, simultaneously controls the scanning motor to run through being connected with the scanning motor of the polygonal rotating mirror assembly, drives the polygonal scanning rotating mirror to rotate at a preset rotating speed, and controls the rotating frequency and the deflection angle of the rotating mirror and the vibrating mirror through being connected with the motor.
It should be further noted that the industrial personal computer is provided with a digital control module and a control panel; the control panel acquires a scanning processing control instruction input by a user and displays the operation information of the system;
the digital control module realizes phase-locking control of laser pulse signal phase shift through a programmable logic gate array according to a scanning processing control instruction input by a user to complete signal synchronization; controlling the repetition frequency of laser pulse and the position information scanned by the rotating mirror.
It should be further noted that the laser processing blowing device and the laser processing dust collecting device are symmetrically arranged on the laser processing adsorption platform;
the laser processing blowing device is a U-shaped dust blowing pipe;
the laser processing dust collection device is a U-shaped dust collection pipe;
the air outlet end of the U-shaped dust collection pipe is connected to an exhaust fan through a pipeline inside the laser processing adsorption platform; the air inlet end of the U-shaped dust collection pipe is arranged between the f-theta focusing lens group and the laser processing target material;
the air outlet end of the U-shaped dust blowing pipe is arranged between the f-theta focusing lens group and the laser processing target material; the air inlet end of the U-shaped dust blowing pipe is connected to the blower through a pipeline inside the laser processing adsorption platform.
Further, the output power of the laser source generator was 1kW, the pulse repetition frequency was 1MHz, and the single pulse energy was 1 mJ.
It is further noted that the beam shaper includes: the beam lens and the beam reflecting mirror are used for expanding and shaping laser emitted by the laser source generating device, so that the emitted laser can be irradiated on the surface of the polygonal scanning mirror.
It should be further noted that the industrial personal computer controls the operation of the scanning motor and drives the polygon scanning rotating mirror to rotate at a constant speed, and the maximum rotating speed can reach 1000 m/s.
The focal length of the f-theta focusing lens group is 420 mm.
The polygon mirror assembly employs a polygon scanning mirror of moewe corporation, germany.
It is further noted that the beam shaper adopts a Galileo structure, the laser beam is a Gaussian beam, and the radius of a light spot is 40 μ M and M after the laser beam is focused by the focusing lens21.2 and achieves a uniform distribution of laser energy.
The invention also provides a method for processing group holes by laser synchronous scanning, which comprises the following steps:
the industrial personal computer obtains information input by a user, average laser output power data of the laser generating device, laser repetition frequency, rotating mirror scanning speed and the like;
the industrial personal computer realizes the phase-locking control of the phase shift of the laser pulse signal through the programmable logic gate array to complete the signal synchronization; controlling the repetition frequency of laser pulses and the position information scanned by a rotating mirror;
the industrial personal computer controls the laser generated by the laser generating device to irradiate on the polygon scanning rotating mirror rotating at a preset rotating speed at a preset angle through the beam shaper, each surface of the polygon scanning rotating mirror scans an incident beam along the same optical axis at a preset speed, and the laser vibrating mirror deflects the laser scanned by the polygon scanning rotating mirror to separate reproduction lines;
after the laser is deflected by the polygonal rotating mirror assembly and the reflecting vibrating mirror assembly, the laser is focused on a laser processing target material through the f-theta focusing lens assembly to form a light spot with a preset radius, so that the laser reaches a preset spatial power density and the injection flux of the material.
It should be further noted that, the laser synchronous scanning processing group hole system is used for respectively scanning 0.1mm thick stainless steel bands with a scanning range of 50mm x 50mm at a scanning speed of 100m/s, an average laser output power of 500W, a pulse repetition frequency of 500KHz, single pulse energy of 1mJ and a focal length of an f-theta focusing lens of 420mm, so that the processing time is reduced, and the efficiency and the yield of laser processing group holes are effectively improved.
According to the technical scheme, the invention has the following advantages:
the laser source generating device is connected with the beam shaper in a matching way, a beam light outlet hole of the beam shaper is matched with the input end of the polygonal rotating mirror assembly, the output end of the polygonal rotating mirror assembly is horizontally collinear with the input end of the reflecting vibrating mirror assembly, the output end of the reflecting mirror assembly is vertically collinear with the input end of the f-theta focusing lens group, the output end of the f-theta focusing lens group is matched with the laser processing target surface, the laser processing target surface is tightly attached to the laser processing platform, and the laser processing blowing device is matched with the laser processing dust and smoke removing device; due to the fact that the synchronization of the laser pulse frequency and the rotating mirror scanning frequency is achieved, in the multi-pulse laser hole burning process, under the condition that the effective punching times are determined, namely the number of pulses required by punching is determined, the proper scanning speed can be selected, and therefore the production efficiency of the laser processing target material group holes can be effectively improved.
The fume waste produced during processing is exhausted from the processing area through a fume absorber. The whole device realizes the ultrafast laser processing group hole process of the laser two-dimensional plane. The efficiency of laser processing group holes on the target material is effectively improved.
In the invention, the laser deflected by the rotating mirror and the vibrating mirror is focused on a laser processing target surface through the f-theta focusing lens group, a laser spot with a preset area is formed at a focal point, and laser drilling is carried out at a preset amount of power density. The whole device realizes the ultrafast processing process of the laser two-dimensional plane. The production rate of ultra-fast laser drilling with kilowatt-level average output power is effectively improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of an embodiment of a laser synchronous scanning group hole machining system;
FIG. 2 is a schematic diagram of an industrial personal computer;
fig. 3 is a flow chart of a method for processing group holes by laser synchronous scanning.
Description of reference numerals:
the laser processing device comprises a 1-industrial personal computer, a 2-laser generating device, a 3-beam shaper, a 4-reflection galvanometer component, a 5-connecting shaft, a 6-polygonal rotating mirror component, a 7-f-theta focusing lens group, an 8-laser processing blowing device, a 9-laser processing dust collecting device, a 10-laser processing target material and an 11-laser processing adsorption platform.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 to 2 in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Ultrafast laser drilling mainly utilizes the characteristics of high power density and high spatial coherence of laser radiation to focus and heat materials, so that the materials locally reach melting and vaporization temperatures, and are gasified to form holes. Laser drilling has the advantages of high precision, strong universality, high efficiency, low cost and the like. The laser drilling machine can be used for drilling holes on airplane wings, obviously, laser machining group holes on a target surface material is an important development trend, the laser machining group hole efficiency is improved, and the output rate is very necessary.
The invention provides a laser synchronous scanning group hole processing system, which comprises: the device comprises an industrial personal computer 1, a laser generating device 2, a beam shaper 3, a reflecting galvanometer component 4, a polygonal rotating mirror component 6, an f-theta focusing lens group 7, a laser processing blowing device 8, a laser processing dust collector 9 and a laser processing adsorption platform 11;
the laser processing adsorption platform 11 is provided with a laser processing target material 10; a laser processing blowing-up device 8 and a laser processing dust collecting device 9 are arranged above the laser processing target material 10;
the laser processing blowing-up device 8 and the laser processing dust suction device 9 are symmetrically arranged on the laser processing adsorption platform 11; the laser processing blowing device 8 is a U-shaped dust blowing pipe; the laser processing dust collection device 9 is a U-shaped dust collection pipe;
the air outlet end of the U-shaped dust collection pipe is connected to an exhaust fan through a pipeline inside the laser processing adsorption platform 11; the air inlet end of the U-shaped dust collection pipe is arranged between the f-theta focusing lens group 7 and the laser processing target material 10;
the air outlet end of the U-shaped dust blowing pipe is arranged between the f-theta focusing lens group 7 and the laser processing target material 10; the air inlet end of the U-shaped dust blowing pipe is connected to a blower through a pipeline inside the laser processing adsorption platform 11.
The laser processing adsorption platform tightly adsorbs the thin film target material to be processed on a processing plane by a negative pressure pumping method, and in addition, the surface of the material is melted in the high-power density processing processWhen the temperature is increased continuously during vaporization, the surrounding steam can be ionized to form a plasma film with high density, the processing efficiency is influenced, and 80% Ar and 20% O are respectively carried out at a speed of 20L/min by using a laser processing blowing device2As process auxiliary gas, the soot waste generated during the further processing is discharged from the processing area via a soot absorption device. The whole device realizes the ultrafast laser processing group hole process of the laser two-dimensional plane. The efficiency of laser processing group holes on the target material is effectively improved.
For the laser drilling system, a laser generating device 2 is connected with a beam shaper 3 in a matching way, a beam light outlet of the beam shaper 3 is arranged in a matching way with the input end of a polygonal rotating mirror assembly 6, the output end of the polygonal rotating mirror assembly 6 is horizontally collinear with the input end of a reflecting galvanometer assembly 4, the output end of the reflecting galvanometer assembly 4 is vertically collinear with the input end of an f-theta focusing lens group 7, and the output end of the f-theta focusing lens group 7 is arranged in a matching way with a laser processing target material 10;
the polygonal rotating mirror assembly 6 is provided with a scanning motor and a polygonal scanning rotating mirror connected with an output shaft of the scanning motor;
the reflecting galvanometer component 4 is provided with a laser galvanometer, the laser galvanometer is connected with a connecting shaft 5, the connecting shaft 5 is connected with an adjusting motor, and the adjusting motor adjusts the angle of laser on a laser processing target material 10;
the industrial personal computer 1 is connected with a laser source generating device to control the laser source generating device to emit laser, and simultaneously, the industrial personal computer is connected with a scanning motor of the polygonal rotating mirror assembly 6 to control the scanning motor to run and drive the polygonal scanning rotating mirror to rotate at a preset rotating speed, and the rotating frequency and the deflection angle of the rotating mirror and the vibrating mirror are controlled by being connected with the motor.
The scanning mirror may be an octagonal polygon mirror, the mirror scanner rapidly rotating about a mechanical axis at a constant speed, each facet having scanned an incident beam along one axis at a very high speed, up to 1000 m/s.
The mirror scanner can complete the laser deflection in another direction to separate many fast reappearing lines, the mirror assembly is connected to the polygonal rotating mirror through the motor output shaft and is also controlled by the motor to adjust the laser deflection angle in another direction of the processing target surface.
The industrial personal computer 1 provided by the invention is provided with a digital control module and a control panel; the control panel acquires a scanning processing control instruction input by a user and displays the operation information of the system;
the digital control module realizes phase-locking control of laser pulse signal phase shift through a programmable logic gate array according to a scanning processing control instruction input by a user to complete signal synchronization; controlling the repetition frequency of laser pulses and the position information scanned by the rotating mirror.
And the laser deflected by the rotating mirror and the vibrating mirror is focused on a laser processing target surface 7 through the f-theta focusing lens group 5, a laser spot with a preset area is formed at a focal point, and laser drilling is carried out at a preset amount of power density. The whole device realizes the ultrafast processing process of the laser two-dimensional plane. The production rate of ultra-fast laser drilling with kilowatt-level average output power is effectively improved.
As the present invention, the beam shaper 3 includes: the beam lens and the beam reflector are used for expanding and shaping the laser emitted by the laser generating device 2, so that the emitted laser can be irradiated on the surface of the polygon scanning mirror.
The polygon turning mirror assembly 6 in the present invention employs a polygon scanning mirror of moewe corporation, germany.
The polygon rotating mirror assembly can realize large-range, ultrahigh-speed, high-precision and high-repeatability laser beam scanning. Compared with galvanometer scanning, the polygon scanning mirror has a faster scanning speed which is 100 times faster than the galvanometer scanning, and has a higher damage threshold.
The polygon mirror assembly includes a motor and a polygon prism having a plurality of reflecting surfaces and mounted on a rotating shaft of the motor. The polygon prism can rotate at high speed by the rotation of the motor, thereby realizing large-angle and high-speed light beam scanning.
The F-theta focusing lens group is also called a flat field focusing lens, the image height of the F-theta focusing lens group is equal to the focal length multiplied by the scanning angle Y which is equal to F theta, and the F-theta focusing lens group is different from the common lens Y which is equal to Ftan theta. The f-theta focusing lens group is specially designed to enable the light beam incident angle and the light spot position on the image surface to satisfy a linear relation, so that the position of the light spot on the image surface can be controlled by controlling the scanning angle of the incident light beam, a linear scanning speed is formed, and finally the laser beam can form a uniform-size focusing light spot in the whole marking plane.
The industrial computer may be a computer and the computer program product, which may be embodied as a computer readable medium, may form part of a computer program product, which may include packaging materials. The computer readable medium of data may include computer storage media such as random access memory RAM, read only memory ROM, non-volatile random access memory NVRAM, electrically erasable programmable read only memory EEPROM, flash memory, magnetic or optical data storage media, and the like. In some embodiments, an article of manufacture may comprise one or more computer-readable storage media.
The industrial personal computer is executed by a processing circuit comprising one or more processors, such as one or more Digital Signal Processors (DSPs), general purpose microprocessors, Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), or other equivalent integrated or discrete logic circuitry. Thus, the term "processor," as used herein, may refer to any of the foregoing structure or any other structure more suitable for implementing the techniques described herein. In addition, in some aspects, the functionality described in this disclosure may be provided in software modules and hardware modules.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed in the system can be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
Based on the laser synchronous scanning group hole processing system, the invention also provides a laser synchronous scanning group hole processing method, which comprises the following steps: as shown in figure 3 of the drawings,
s11, the industrial personal computer obtains the information input by the user, including: the scanning speed, the scanning range, the scanning line spacing, the coordinate position, the average output power of the laser, the repetition frequency of the laser pulse, the pulse width, the scanning position, the correction value and other information of the rotating mirror.
S12, the industrial personal computer realizes the phase locking control of the phase shift of the laser pulse signal through the programmable logic gate array to complete the signal synchronization; controlling the repetition frequency of laser pulses and the position information scanned by a rotating mirror;
s13, the industrial personal computer controls the laser generated by the laser generator to irradiate on the polygon scanning rotating mirror rotating at a preset rotating speed at a preset angle through the beam shaper, each surface of the polygon scanning rotating mirror scans an incident beam along the same optical axis at a preset speed, and the laser vibrating mirror deflects the laser scanned by the polygon scanning rotating mirror to separate a reproduction line;
s14, after the laser is deflected by the polygonal rotating mirror assembly and the reflecting vibrating mirror assembly, the laser is focused on a laser processing target material through the f-theta focusing lens assembly to form a light spot with a preset radius, so that the laser reaches a preset space power density and the injection flux of the material.
According to the process machining embodiment, on the premise of understanding the action mechanism of laser and materials, a series of matrix group holes with good hole consistency, good roundness, less hole opening melt and good conicity are obtained by using the experimental test of the device to laser machining group holes of 0.1mm stainless steel sheets. Because the pulse repetition frequency and the scanning frequency can be synchronized, the digital control system of the industrial personal computer realizes the decoupling of the scanning position signal with high precision and high-speed feedback and the pulse repetition frequency signal, namely, only one pulse passes through each hole in each scanning, and the number of pulses required by punching depends on the scanning times. Therefore, no matter how many laser pulse repetition frequencies are, the synchronous scanning can be realized by adjusting the internal parameters of the computer, the injection energy, the power density and the injection flux of the laser single pulse can be effectively changed, the scanning speed can be freely adjusted and changed for processing group holes by laser scanning, the efficiency of ablating the group holes on the target surface by the laser multi-pulse is improved, the processing speed is increased, the processing quality is also improved, and the optimal scanning speed can be found.
The specific implementation process comprises the following steps:
the 1064nm laser generated by the laser source generator 2 is irradiated at a certain angle by the beam shaper 3 onto the polygonal rotating mirror assembly 6 with a rotation speed up to 1000m/s, the rotating mirror scanner rotates rapidly around the mechanical axis at a constant speed, each surface scans the incident beam along one axis at a very high speed, and the mirror assembly 4 can perform deflection of the laser in the other direction to separate a plurality of rapid reproduction lines. Each scanning line consists of hundreds of resolvable pixel electronic addressing points, the polygonal rotating mirror assembly 6 and the reflecting mirror assembly 4 are focused on a laser processing target surface 10 through the f-theta focusing lens assembly 7 after being deflected, and light spots with extremely small space radiuses are formed at the focal points to increase the space power density of the laser and the injection flux of materials.
Furthermore, the laser synchronous scanning group hole processing device is used for analyzing the punching results of the stainless steel strip with the thickness of 0.1mm in the scanning range of 50mm x 50mm under the conditions of scanning speeds of 50m/s, 100m/s, 200m/s and the like respectively under the condition that other parameters are not changed. The experiment uses 1064nm laser average output power 500W, pulse repetition frequency 500KHz, single pulse energy 1mJ, and focal length 420mm of f-theta focusing lens.
The experimental results are detailed in Table 1, wherein the average output power-Paverage(ii) a Pulse repetition frequency-Fp(ii) a Single pulse energy-E; total number of scans-TIMES; scanning velocity-VS(ii) a Pulse distance-pd(ii) a Scan line pitch-Hatch; total processing time-Tall(ii) a The frequency of the drilling-the Drill,
conclusion of analysis
Experiments show that under the condition of the same laser scanning range, the processing time of processing group holes on a stainless steel sheet by lasers with different scanning speeds, the number of scanning times required for the whole punching and the quality of the group holes after punching are different, wherein the faster the scanning speed, the faster the processing time is obviously, but the processing time is also limited by the influence of the line spacing and the effective frequency of scanning. It can be found that the number of scans required to complete the via generation in the whole processing region is different at different scanning speeds, and the quality of the processed via is also different, i.e. the reason that the number of laser pulses required for each via is different may be that the speed of the scanning speed affects the speed of the heat accumulation of the material and the particle shielding effect generated thereby. We can find that we can achieve our process requirements by properly adjusting the scanning speed under the premise that the laser scanning is synchronized with the laser pulse signal. As embodied in the experiment, the scanning speed of 100m/s can be selected for processing, so that the processing time can be reduced on the premise of ensuring the quality, and the group hole processing efficiency and the yield of laser processing are effectively improved.
TABLE 1
The quality rating is represented, with higher numbers indicating better quality.
That is to say, for one embodiment of the present invention, a laser synchronous scanning processing group hole system is used to scan a 0.1mm thick stainless steel band with a scanning range of 50mm x 50mm at a scanning speed of 100m/s, an average laser output power of 500W, a pulse repetition frequency of 500KHz, a single pulse energy of 1mJ, and a focal length of an f-theta focusing lens of 420mm, so that the processing time is reduced, and the efficiency and the yield of laser processing group holes are effectively improved.
Compared with the method which can obtain the small hole quality and the diameter depth ratio by single pulse laser drilling, the method can realize the continuous removal of the material by adopting multi-pulse continuous drilling, can obtain better small hole quality and larger diameter depth ratio for the processing technology, and adopts multi-pulse continuous drilling sheet materials such as stainless steel sheets, aluminum oxide ceramic sheets and the like to obtain the aperture of 100 mu m-1mm and the maximum aperture depth of 20 mm. The average output power of a laser source applicable to laser industrial processing at the present stage can reach hundreds of watts or even kilowatts, the pulse repetition frequency can reach hundreds of kHz or even MHz, and the method is necessary for improving the multi-pulse punching quality, however, the scanning speed of a galvanometer scanner universal in the present market is obviously not capable of better matching the ultrafast laser pulse repetition frequency about dozens of meters per second, the scanning speed of a galvanometer scanner is dozens of times of that of a galvanometer, the method can be better matched with the high-repetition-frequency laser punching application, the phase shift of pulses is realized by combining a computer digital control system and a gating structure of an FPGA (field programmable gate array), and the synchronization of the scanning speed and the pulse output frequency is completed. The multi-pulse drilling continuously repeats the process of re-melting each pulse injection material, but because of evaporation power caused by energy conservation in the drilling process, melting heat absorption, unnecessary heat accumulation of materials caused by too high pulse repetition frequency and particle shielding effect, the absorption of laser pulses is weaker and weaker, and the hole pattern and the machining efficiency are affected.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A multi-pulse laser synchronous scanning group hole processing system is characterized by comprising: the device comprises an industrial personal computer (1), a laser generating device (2), a beam shaper (3), a reflecting galvanometer component (4), a polygonal rotating mirror component (6), an f-theta focusing lens group (7), a laser processing blowing-up device (8), a laser processing dust suction device (9) and a laser processing adsorption platform (11);
a laser processing target material (10) is arranged on the laser processing adsorption platform (11);
a laser processing blowing-up device (8) and a laser processing dust collecting device (9) are arranged above the laser processing target material (10);
the laser generating device (2) is connected with the beam shaper (3) in a matching mode, a beam light outlet hole of the beam shaper (3) is arranged in a matching mode with an input end of a polygonal rotating mirror assembly (6), an output end of the polygonal rotating mirror assembly (6) is horizontally collinear with an input end of a reflecting vibrating mirror assembly (4), an output end of the reflecting vibrating mirror assembly (4) is vertically collinear with an input end of an f-theta focusing lens group (7), and an output end of the f-theta focusing lens group (7) is arranged in a matching mode with a laser processing target material (10);
the polygonal rotating mirror assembly (6) is provided with a scanning motor and a polygonal scanning rotating mirror connected with an output shaft of the scanning motor;
the reflection galvanometer component (4) is provided with a laser galvanometer, the laser galvanometer is connected with a connecting shaft (5), the connecting shaft (5) is connected with an adjusting motor, and the adjusting motor adjusts the angle of laser on a laser processing target material (10);
the industrial personal computer (1) is connected with the laser generating device to control the laser generating device to emit laser, and simultaneously is connected with the scanning motor of the polygonal rotating mirror assembly (6) to control the scanning motor to operate and drive the polygonal scanning rotating mirror to rotate at a preset rotating speed, and is connected with the scanning motor and the adjusting motor to control the rotating frequency and the deflection angle of the polygonal scanning rotating mirror and the laser oscillating mirror;
the industrial personal computer (1) also controls the repetition frequency of laser pulses to be synchronous with the scanning of the polygon scanning rotating mirror, and each hole only passes one pulse per scanning; the number of pulses required for punching depends on the number of scans.
2. The multi-pulse laser synchronous scanning processing group hole system according to claim 1,
the industrial personal computer (1) is provided with a digital control module and a control panel; the control panel acquires a scanning processing control instruction input by a user and displays the operation information of the system;
the digital control module realizes phase-locking control of laser pulse signal phase shift through a programmable logic gate array according to a scanning processing control instruction input by a user to complete signal synchronization; controlling the repetition frequency of laser pulses and the position information scanned by the polygon scanning rotating mirror.
3. The multi-pulse laser synchronous scanning processing group hole system according to claim 1 or 2,
the laser processing blowing-up device (8) and the laser processing dust suction device (9) are symmetrically arranged on the laser processing adsorption platform (11);
the laser processing blowing device (8) is a U-shaped dust blowing pipe;
the laser processing dust collection device (9) is a U-shaped dust collection pipe;
the air outlet end of the U-shaped dust collection pipe is connected to an exhaust fan through a pipeline inside the laser processing adsorption platform (11); the air inlet end of the U-shaped dust collection pipe is arranged between the f-theta focusing lens group (7) and the laser processing target material (10);
the air outlet end of the U-shaped dust blowing pipe is arranged between the f-theta focusing lens group (7) and the laser processing target material (10); the air inlet end of the U-shaped dust blowing pipe is connected to a blower through a pipeline inside the laser processing adsorption platform (11).
4. The multi-pulse laser synchronous scanning processing group hole system according to claim 1 or 2,
the output power of the laser generating device (2) is 1kW, the pulse repetition frequency is 1MHz, and the single pulse energy is 1 mJ.
5. The multi-pulse laser synchronous scanning processing group hole system according to claim 1 or 2,
the beam shaper (3) comprises: a beam lens and a beam mirror; the beam shaper (3) is used for expanding and shaping the laser emitted by the laser generator (2) so that the emitted laser can be applied to the surface of the polygonal scanning rotating mirror.
6. The multi-pulse laser synchronous scanning processing group hole system according to claim 1 or 2,
the industrial personal computer (1) controls the operation of the scanning motor and drives the polygonal scanning rotating mirror to rotate at a constant speed, and the maximum rotating speed reaches 1000 m/s;
the focal length of the f-theta focusing lens group (7) is 420 mm.
7. The multi-pulse laser synchronous scanning processing group hole system according to claim 1 or 2,
the polygon rotating mirror assembly (6) adopts a polygon scanning mirror of Moewe company in Germany.
8. The multi-pulse laser synchronous scanning processing group hole system according to claim 1 or 2,
the beam shaper (3) adopts a Galileo structure, the laser beam is a Gaussian beam, and the radius of a light spot is 40 mu M and M after the laser beam is focused by a focusing lens2=1.2 and achieves a uniform distribution of the laser energy.
9. A multi-pulse laser synchronous scanning group hole processing method, which is characterized in that the multi-pulse laser synchronous scanning group hole processing system according to any one of claims 1 to 8 is adopted; the method comprises the following steps:
the industrial personal computer obtains information input by a user;
the industrial personal computer realizes the phase-locking control of the phase shift of the laser pulse signal through the programmable logic gate array to complete the signal synchronization; controlling the repetition frequency of laser pulses and the position information scanned by a rotating mirror;
the industrial personal computer controls the laser generated by the laser generating device to irradiate on the polygon scanning rotating mirror rotating at a preset rotating speed at a preset angle through the beam shaper, each surface of the polygon scanning rotating mirror scans an incident beam along the same optical axis at a preset speed, and the laser vibrating mirror deflects the laser scanned by the polygon scanning rotating mirror to separate reproduction lines;
the industrial personal computer also controls the repetition frequency of the laser pulse to be synchronous with the scanning of the polygon scanning rotating mirror, and each hole only passes one pulse in each scanning; the number of pulses required for punching depends on the number of scans;
after the laser is deflected by the polygonal rotating mirror assembly and the reflecting vibrating mirror assembly, the laser is focused on a laser processing target material through the f-theta focusing lens assembly to form a light spot with a preset radius, so that the laser reaches a preset spatial power density and the injection flux of the material.
10. The method of claim 9, wherein the multi-pulse laser synchronous scanning group hole processing is performed,
processing a stainless steel strip with the thickness of 0.1mm with the scanning range of 50mm x 50mm by utilizing a multi-pulse laser synchronous scanning processing group hole system; wherein the scanning speed is 100m/s, the average laser output power is 500W, the pulse repetition frequency is 500KHz, the single pulse energy is 1mJ, and the focal length of the f-theta focusing lens is 420 mm.
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| CN115343688B (en) * | 2022-08-16 | 2024-04-12 | 中国科学院西安光学精密机械研究所 | Laser scanning synchronous control system and control method based on polygon mirror |
| CN115826254B (en) * | 2023-02-14 | 2023-05-02 | 清华大学 | Flat-top beam modulation method, system and storage medium |
| CN116275605A (en) * | 2023-02-17 | 2023-06-23 | 苏州天准科技股份有限公司 | Laser drilling equipment for on-line hole inspection |
| CN116727900B (en) * | 2023-08-11 | 2023-10-20 | 中国人民解放军空军工程大学 | Laser hole making and opening method and device for aviation composite material |
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