CN110834151A - Laser processing control method, laser processing apparatus, and computer-readable storage medium - Google Patents
Laser processing control method, laser processing apparatus, and computer-readable storage medium Download PDFInfo
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- CN110834151A CN110834151A CN201911179396.XA CN201911179396A CN110834151A CN 110834151 A CN110834151 A CN 110834151A CN 201911179396 A CN201911179396 A CN 201911179396A CN 110834151 A CN110834151 A CN 110834151A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention discloses a laser processing control method, which is applied to a laser processing device and comprises the following steps: after a product to be processed is clamped to an equipment workbench, adjusting the angle of a laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be a preset angle; controlling a laser to emit laser, and controlling the laser to irradiate the surface of the product to be processed; the laser is controlled to move on the surface of the product to be processed at a preset speed by controlling the flying light path, so that the product to be processed is ground, wherein the flying light path is composed of a laser head and a motion shaft. The invention also discloses a laser processing device and a computer readable storage medium. The invention can solve the problem of lower grinding efficiency of the existing product.
Description
Technical Field
The present invention relates to the field of laser processing technologies, and in particular, to a laser processing control method, a laser processing apparatus, and a computer-readable storage medium.
Background
Super-hard materials (super-hard materials) refer to materials with particularly high hardness, and can be divided into natural and artificial materials, wherein the former includes natural Diamond, black Diamond, and the like, and the latter includes polycrystalline Diamond (PCD), polymeric Diamond Nanorods (ADNR), and the like. The superhard material is suitable for manufacturing tools for processing other materials, has incomparable superiority and occupies irreplaceable important position particularly in the aspect of processing hard materials, has certain special properties in the aspects of optics, electrics and heat, is an important functional material, and is increasingly widely applied in the fields of modern industry, national defense, high and new technology and the like. At present, grinding is generally adopted when the surface of the superhard material is ground, and in view of the high hardness and wear resistance of the superhard material, the grinding mainly comprises diamond grinding wheel grinding, discharge grinding and electrolytic grinding. However, the grinding process usually requires a high facility and the grinding process is inefficient. Therefore, how to improve the grinding efficiency of the product is a problem that needs to be solved.
Disclosure of Invention
The invention mainly aims to provide a laser processing control method, a laser processing device and a computer readable storage medium, and aims to solve the problem that the existing product grinding processing efficiency is low.
In order to achieve the above object, the present invention provides a laser processing control method applied to a laser processing apparatus, the laser processing control method including:
after a product to be processed is clamped to an equipment workbench, adjusting the angle of a laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be a preset angle;
controlling a laser to emit laser, and controlling the laser to irradiate the surface of the product to be processed;
the laser is controlled to move on the surface of the product to be processed at a preset speed by controlling the flying light path, so that the product to be processed is ground, wherein the flying light path is composed of a laser head and a motion shaft.
Optionally, the laser processing device includes one or more laser heads, and when the laser processing device includes a plurality of laser heads, the angle of adjustment laser head makes the laser emission direction of laser head with the contained angle between the surface of waiting to process the product is preset angle's step includes:
and adjusting the angles of the plurality of laser heads to enable included angles between the laser emission direction of each laser head and the surface of the product to be processed to be first preset angles, wherein the value of the first preset included angle is in the range of 0-90 degrees.
Optionally, when the laser processing device includes a plurality of laser heads, the angle of adjustment laser head makes the laser emission direction of laser head with contained angle between the surface of the product of treating processing still includes for preset angle:
respectively acquiring the numbers of the laser heads, and determining the corresponding adjustment information of each laser head based on the numbers and a first preset mapping relation;
and adjusting the angle of the corresponding laser head based on the adjustment information, so that the included angle between the laser emission direction of each laser head and the surface of the product to be processed is a corresponding second preset angle respectively, wherein the value of the second preset angle is in the range of 0-90 degrees.
Optionally, before the step of controlling the laser to move on the surface of the product to be processed at a preset speed by controlling the flight path, the method further includes:
determining grinding operation parameters of the product to be processed according to the preset speed;
the method comprises the following steps of controlling laser to move on the surface of the product to be processed at a preset speed in a mode of controlling a flight light path so as to grind the product to be processed, wherein the step of controlling the flight light path comprises the following steps:
and controlling laser to move on the surface of the product to be processed based on the grinding operation parameters and the preset speed by controlling a flight light path so as to grind and process the product to be processed.
Optionally, the step of determining the grinding operation parameters of the product to be processed according to the preset speed comprises:
acquiring the diameter of a light spot formed by irradiating the surface of the product to be processed with laser and the laser frequency emitted by the laser;
multiplying the diameter of the light spot by the numerical value of the laser frequency to obtain a limited speed;
judging whether the preset speed is smaller than the limited speed or not;
if the preset speed is less than the limit speed, determining that the grinding operation parameter of the product to be processed is the single moving irradiation of the laser along the surface of the product to be processed;
and if the preset speed is greater than or equal to the limited speed, determining the grinding operation parameter of the product to be processed as the laser irradiation of multiple reciprocating movements along the surface of the product to be processed.
Optionally, before the step of adjusting the angle of the laser head, the method further includes:
detecting the current clamping state of the product to be processed;
comparing the current clamping state with a preset clamping state to obtain a comparison parameter;
judging whether the current clamping state of the product to be processed meets the requirements or not based on the comparison parameters;
if yes, executing the following steps: adjusting the angle of the laser head;
and if not, adjusting the product to be processed in the current clamping state to the preset clamping state according to the comparison parameter.
Optionally, before the step of controlling the laser to emit laser light and controlling the laser light to irradiate the surface of the product to be processed, the method further includes:
obtaining the material type of the product to be processed, and determining the target output power of the laser according to the material type and a second preset mapping relation;
the step of controlling the laser to emit laser light comprises the following steps:
and controlling the laser to emit laser light based on the target output power.
Optionally, the step of controlling the laser to irradiate the surface of the product to be processed includes:
controlling laser to irradiate the surface of the product to be processed through a focusing lens; or the like, or, alternatively,
and controlling laser to irradiate the surface of the product to be processed through a vibrating mirror and a focusing lens.
In order to achieve the above object, the present invention further provides a laser processing apparatus, which includes one or more laser heads, and further includes a memory, a processor, and a laser processing control program stored in the memory and executable on the processor, wherein the laser processing control program, when executed by the processor, implements the steps of the laser processing control method as described above.
In order to achieve the above object, the present invention further provides a computer-readable storage medium, wherein a laser processing control program is stored on the computer-readable storage medium, and when executed by a processor, the laser processing control program implements the steps of the laser processing control method as described above.
The invention provides a laser processing control method, a laser processing device and a computer readable storage medium, wherein after a product to be processed is clamped to an equipment workbench, the angle of a laser head is adjusted, so that the included angle between the laser emission direction of the laser head and the surface of the product to be processed is a preset angle; controlling a laser to emit laser and controlling the laser to irradiate the surface of a product to be processed; the laser is controlled to move on the surface of a product to be processed at a preset speed by controlling a flying optical path so as to grind the product to be processed, wherein the flying optical path consists of a laser head and a moving shaft. Because laser processing belongs to non-contact processing, no cutter wearing and tearing, consequently compare with current abrasive machining mode, its intensity requirement to processing equipment is lower. Meanwhile, the laser processing is to grind and process the product to be processed by utilizing a high-intensity laser beam, so that the processing time can be greatly reduced during processing, and the automatic grinding and processing of the product to be processed are realized through intelligent control, thereby greatly improving the processing efficiency.
Drawings
Fig. 1 is a schematic diagram of a hardware configuration of a laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a first embodiment of a laser processing control method according to the present invention;
fig. 3 is a flowchart illustrating a laser processing control method according to a second embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The main solution of the embodiment of the invention is as follows: after a product to be processed is clamped to an equipment workbench, adjusting the angle of a laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be a preset angle; controlling a laser to emit laser, and controlling the laser to irradiate the surface of the product to be processed; the laser is controlled to move on the surface of the product to be processed at a preset speed by controlling the flying light path, so that the product to be processed is ground, wherein the flying light path is composed of a laser head and a motion shaft.
In the prior art, a grinding mode is generally adopted when the surface of the superhard material is ground, and in view of the high hardness and the wear resistance of the superhard material, the grinding mode mainly comprises diamond grinding wheel grinding, discharge grinding and electrolytic grinding. However, the grinding process usually requires a high facility and the grinding process is inefficient.
In order to solve the technical problem, the invention provides a laser processing control method, which is applied to a laser processing device, and the method comprises the steps of adjusting the angle of a laser head after a product to be processed is clamped to an equipment workbench, so that the included angle between the laser emission direction of the laser head and the surface of the product to be processed is a preset angle; controlling a laser to emit laser and controlling the laser to irradiate the surface of a product to be processed; the laser is controlled to move on the surface of a product to be processed at a preset speed by controlling a flying optical path so as to grind the product to be processed, wherein the flying optical path consists of a laser head and a moving shaft. Because laser processing belongs to non-contact processing, no cutter wearing and tearing, consequently compare with current abrasive machining mode, its intensity requirement to processing equipment is lower. Meanwhile, the laser processing is to grind and process the product to be processed by utilizing a high-intensity laser beam, so that the processing time can be greatly reduced during processing, and the automatic grinding and processing of the product to be processed are realized through intelligent control, thereby greatly improving the processing efficiency.
As shown in fig. 1, fig. 1 is a schematic diagram of a hardware configuration of a laser processing apparatus according to an embodiment of the present invention.
In this embodiment, the laser processing apparatus may be a laser processing machine, a laser machine, or the like, and includes: a processor 1001, such as a CPU (Central Processing Unit), a memory 1002, a communication bus 1003, and one or more laser heads 1004. The communication bus 1003 is used to implement connection communication among these components. The memory 1002 may be a high-speed RAM memory 1002, or may be a non-volatile memory 1002 (e.g., a disk memory 1002). The memory 1002 may alternatively be a storage device separate from the processor 1001. The laser head 1004 may be a combination of a galvanometer and a field lens, a cutting head or a welding head, or a combination of a galvanometer and a self-designed lens set. The galvanometer can be a common galvanometer or a 3D galvanometer.
Those skilled in the art will appreciate that the terminal structure shown in fig. 1 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components. For example, the laser processing apparatus may further include a laser, a driving device, a device table, a thickness detection device, and the like.
As shown in fig. 1, a memory 1002, which is a kind of computer storage medium, may include therein a laser machining control program; and the processor 1001 may be configured to call up the laser machining control program stored in the memory 1002 and perform the following operations:
after a product to be processed is clamped to an equipment workbench, adjusting the angle of a laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be a preset angle;
controlling a laser to emit laser, and controlling the laser to irradiate the surface of the product to be processed;
the laser is controlled to move on the surface of the product to be processed at a preset speed by controlling the flying light path, so that the product to be processed is ground, wherein the flying light path is composed of a laser head and a motion shaft.
Further, the laser processing apparatus includes one or more laser heads, and when the laser processing apparatus includes a plurality of laser heads, the processor 1001 may be configured to call up the laser processing control program stored in the memory 1002 and perform the following operations:
and adjusting the angles of the plurality of laser heads to enable included angles between the laser emission direction of each laser head and the surface of the product to be processed to be first preset angles, wherein the value of the first preset included angle is in the range of 0-90 degrees.
Further, when the laser processing apparatus includes a plurality of laser heads, the processor 1001 may be configured to call up a laser processing control program stored in the memory 1002 and perform the following operations:
respectively acquiring the numbers of the laser heads, and determining the corresponding adjustment information of each laser head based on the numbers and a first preset mapping relation;
and adjusting the angle of the corresponding laser head based on the adjustment information, so that the included angle between the laser emission direction of each laser head and the surface of the product to be processed is a corresponding second preset angle respectively, wherein the value of the second preset angle is in the range of 0-90 degrees.
Further, the processor 1001 may be configured to call a laser processing control program stored in the memory 1002, and perform the following operations:
determining grinding operation parameters of the product to be processed according to the preset speed;
and controlling laser to move on the surface of the product to be processed based on the grinding operation parameters and the preset speed by controlling a flight light path so as to grind and process the product to be processed.
Further, the processor 1001 may be configured to call a laser processing control program stored in the memory 1002, and perform the following operations:
acquiring the diameter of a light spot formed by irradiating the surface of the product to be processed with laser and the laser frequency emitted by the laser;
multiplying the diameter of the light spot by the numerical value of the laser frequency to obtain a limited speed;
judging whether the preset speed is smaller than the limited speed or not;
if the preset speed is less than the limit speed, determining that the grinding operation parameter of the product to be processed is the single moving irradiation of the laser along the surface of the product to be processed;
and if the preset speed is greater than or equal to the limited speed, determining the grinding operation parameter of the product to be processed as the laser irradiation of multiple reciprocating movements along the surface of the product to be processed.
Further, the processor 1001 may be configured to call a laser processing control program stored in the memory 1002, and perform the following operations:
detecting the current clamping state of the product to be processed;
comparing the current clamping state with a preset clamping state to obtain a comparison parameter;
judging whether the current clamping state of the product to be processed meets the requirements or not based on the comparison parameters;
if yes, executing the following steps: adjusting the angle of the laser head;
and if not, adjusting the product to be processed in the current clamping state to the preset clamping state according to the comparison parameter.
Further, the processor 1001 may be configured to call a laser processing control program stored in the memory 1002, and perform the following operations:
obtaining the material type of the product to be processed, and determining the target output power of the laser according to the material type and a second preset mapping relation;
the step of controlling the laser to emit laser light comprises the following steps:
and controlling the laser to emit laser light based on the target output power.
Further, the processor 1001 may be configured to call a laser processing control program stored in the memory 1002, and perform the following operations:
controlling laser to irradiate the surface of the product to be processed through a focusing lens; or the like, or, alternatively,
and controlling laser to irradiate the surface of the product to be processed through a vibrating mirror and a focusing lens.
Based on the hardware architecture, the embodiment of the laser processing control method is provided.
Referring to fig. 2, fig. 2 is a first embodiment of the laser processing control method of the present invention.
In this embodiment, the laser processing control method is applied to a laser processing control apparatus, and includes:
step S10, after a product to be processed is clamped to an equipment workbench, adjusting the angle of a laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be a preset angle;
in this embodiment, the laser processing device may be a laser processing machine, a laser machine, etc., and may perform the punching, cutting, welding, and surface grinding processes by heating, melting, ablating, or even vaporizing the material based on the infrared radiation of the laser system and the intrinsic heat of the material. Compared with the existing grinding machining, the laser machining range is wider, common material machining can be considered, and meanwhile the laser machining method can be suitable for machining superhard materials.
In this embodiment, after waiting to process the product and being clamped to the equipment workstation, the angle of adjustment laser head for the contained angle between the laser emission direction of laser head and the surface of waiting to process the product is preset angle. The laser processing device is provided with an equipment workbench which is used for clamping a product to be processed and driving the product to rotate, the equipment workbench can be composed of a carrying disc and a rotating table, the carrying disc is used for carrying the product to be processed, and the rotating table is used for controlling the carrying disc to rotate. When the laser processing device operates, the laser processing device clamps a product to be processed on the equipment workbench through the built-in clamp so that the product to be processed is fixed, subsequent processing is convenient, and when the product to be processed is clamped, required clamping force can be provided according to the weight of the product to be processed. The trigger time of the angle of the laser head can be adjusted when the detection device detects that the product to be processed is clamped to the equipment workbench, and can also be adjusted when a laser processing control instruction triggered by a worker is received (the worker clamps the product to be processed to the equipment workbench and then triggers). In addition, the value of the preset angle is in the range of 0-90 degrees. The preset angle is the processing angle of laser grinding, and when the included angle between the laser beam and the surface of the product to be processed is larger, the cutting force of the laser beam is stronger, so that the laser grinding device is suitable for processing products with harder materials or being used under the condition of larger grinding degree; when the included angle between the laser beam and the surface of the product to be processed is small, the cutting force of the laser beam is low, and the laser beam cutting device is suitable for processing the product with low material hardness or used under the condition of low grinding degree.
Wherein, the laser processing device can include one or more laser heads, preferably, the laser processing device includes a plurality of laser heads to can improve machining efficiency, when the laser processing device includes a plurality of laser heads, step "the angle of adjusting the laser head makes the laser emission direction of laser head with the contained angle between the surface of waiting to process the product is preset angle" includes:
step a1, adjusting the angles of the laser heads to make the included angles between the laser emission direction of each laser head and the surface of the product to be processed be first preset angles, wherein the value of the first preset included angle is in the range of 0-90 degrees.
The angles of the laser heads can be adjusted based on the same adjusting parameter, so that the angles of the laser heads are all consistent. Namely, the angles of the laser heads are adjusted, so that the included angle between the laser emission direction of each laser head and the surface of a product to be processed is a first preset angle, wherein the value of the first preset included angle is in the range of 0-90 degrees. It can be understood that, for the positions of the plurality of laser heads, optionally, the laser heads can be dispersedly arranged to correspond to the positions of the samples, so that different samples can be respectively and simultaneously ground by the plurality of laser heads, and the processing efficiency can be improved.
When the laser beam machining device includes a plurality of laser heads, step "the angle of adjustment laser head makes the laser emission direction of laser head with contained angle between the surface of waiting to process the product can also include for preset angle":
a2, respectively acquiring the numbers of the laser heads, and determining the corresponding adjustment information of each laser head based on the numbers and a first preset mapping relation;
step a3, adjusting the angle of the corresponding laser head based on the adjustment information, so that the included angle between the laser emission direction of each laser head and the surface of the product to be processed is a corresponding second preset angle, wherein the value of the second preset angle is in the range of 0-90 degrees.
The angle that can adjust a plurality of laser heads respectively based on different adjustment parameters for the angle of a plurality of laser heads is inconsistent, processes to the different positions of sample, thereby can grind the processing to the different positions of same sample respectively through a plurality of laser heads, thereby can improve machining efficiency. Specifically, the numbers of the laser heads can be respectively obtained, and the adjustment parameters corresponding to the laser heads are determined based on the numbers and a first preset mapping relationship, wherein the first preset mapping relationship comprises the mapping relationship between the laser head numbers and the adjustment parameters. And then, adjusting the angle of the corresponding laser head based on the adjustment parameter, so that the included angle between the laser emission direction of each laser head and the surface of the product to be processed is a corresponding second preset angle respectively, wherein the value of the second preset angle is in the range of 0-90 degrees, and the second preset angles can be partially or completely different.
Step S20, controlling a laser to emit laser and controlling the laser to irradiate the surface of the product to be processed;
and after the angle of the laser head is adjusted, controlling the laser to emit laser and controlling the laser to irradiate the surface of the product to be processed. Specifically, the step of controlling the laser to irradiate the surface of the product to be processed includes:
controlling laser to irradiate the surface of the product to be processed through a focusing lens; or the like, or, alternatively,
and controlling laser to irradiate the surface of the product to be processed through a vibrating mirror and a focusing lens.
Specifically, when laser irradiation is controlled, the laser irradiation can be controlled to irradiate the surface of a product to be processed through a focusing lens; or controlling the laser to irradiate the surface of the product to be processed through the vibrating mirror and the focusing lens. The galvanometer can be a common galvanometer or a 3D galvanometer; the focusing lens can be an existing focusing lens, such as a field lens, or a combined focusing lens obtained by self-combination, such as a combined focusing lens obtained by combining a lens group designed by self. In addition, it should be noted that, during irradiation, the distance between the laser emitting laser and the surface of the product to be processed may be preset according to the thickness of the product to be processed, and if the thickness of the product to be processed is thin, the distance between the laser and the surface of the product to be processed should be widened appropriately, which is beneficial to reducing the occurrence of the situation that the laser directly punctures the product to be processed and affects the molding of the product to be processed.
And step S30, controlling the laser to move on the surface of the product to be processed at a preset speed by controlling a flying optical path so as to grind the product to be processed, wherein the flying optical path consists of a laser head and a moving shaft.
And then, controlling the laser to move on the surface of the product to be processed at a preset speed by controlling the flying light path so as to grind the product to be processed. The preset speed may be preset, and of course, in practical application, the relevant parameters may be obtained in real time to calculate and adjust the preset speed. Because laser generator all is generally fixed, the transmission direction of the corresponding laser is also fixed, in order to make the laser move on the surface of the product to be processed in order to realize the grinding processing of the product to be processed, consequently, need to change the transmission direction of laser, in this embodiment, flight light route comprises laser head and motion axis, wherein, the laser head can be the combination of galvanometer field lens, also can be cutting head or soldered connection, of course, still can be the combination of galvanometer and the lens group of self-designed. The galvanometer can be a common galvanometer or a 3D galvanometer. The motion axis refers to a mechanical part for controlling the position of the light spot by laser processing, and the function of the flight light path is to change the laser transmission direction under the condition that the laser transmitter is not moved, so that the grinding processing of a product to be processed is realized.
Further, the laser processing control method may further include:
and when the laser moves on the surface of the product to be processed, cooling the laser-irradiated part of the product to be processed.
Through set up cooling device on laser beam machining device, it is concrete, cooling device can set up on the equipment workstation to when laser moves on the surface of treating the processing product, treat that the processing product is cooled down by laser irradiation department and handle, still can be for equipment workstation cooling simultaneously.
The embodiment of the invention provides a laser processing control method, which is applied to a laser processing device, and is used for adjusting the angle of a laser head after a product to be processed is clamped to an equipment workbench, so that the included angle between the laser emission direction of the laser head and the surface of the product to be processed is a preset angle; controlling a laser to emit laser and controlling the laser to irradiate the surface of a product to be processed; the laser is controlled to move on the surface of a product to be processed at a preset speed by controlling a flying optical path so as to grind the product to be processed, wherein the flying optical path consists of a laser head and a moving shaft. Because laser processing belongs to non-contact processing, no cutter wearing and tearing, consequently compare with current abrasive machining mode, its intensity requirement to processing equipment is lower. Meanwhile, the laser processing is to grind and process the product to be processed by utilizing a high-intensity laser beam, so that the processing time can be greatly reduced during processing, and the automatic grinding and processing of the product to be processed are realized through intelligent control, thereby greatly improving the processing efficiency.
Further, referring to fig. 3, fig. 3 is a diagram illustrating a second embodiment of the laser processing control method according to the present invention.
In the first embodiment shown in fig. 2, before step S30, the laser processing control method further includes:
step S40, determining the grinding operation parameters of the product to be processed according to the preset speed;
in this embodiment, in order to further improve the processing efficiency, and ensure that the flatness of the product to be processed is high, the forming effect is good, the grinding operation parameters of the product to be processed can be determined according to the preset speed, and then the actual moving operation of the laser is controlled according to the grinding operation parameters. Specifically, the grinding operation parameters of the product to be processed can be determined according to the preset speed. It will be appreciated that since the apparatus table is fixed and not controlled to rotate, the preset speed is also the relative speed at which the laser moves relative to the product to be machined. Of course, in specific implementation, the rotation of the device workbench may also be controlled, and at this time, the rotation speed of the device workbench may be obtained, the relative speed of the laser relative to the movement of the product to be processed is obtained according to the rotation speed and the preset speed, and then the grinding operation parameter of the product to be processed is determined according to the relative speed. For the calculation of the relative speed, since the rotation direction of the device table is usually fixed, the relative speed can be calculated only based on the rotation speed and the preset speed, if the rotation method of the device table is opposite to the moving direction of the laser scanning machining, the relative speed is the sum of the rotation speed and the preset speed, and if the rotation method of the device table is the same as the moving direction of the laser scanning machining, the relative speed is the difference between the rotation speed and the preset speed.
Specifically, step S40 includes:
b1, acquiring the diameter of a light spot formed by irradiating the surface of the product to be processed with laser and the laser frequency emitted by the laser;
the diameter of a light spot formed by irradiating laser on the surface of a product to be processed and the laser frequency emitted by the laser are obtained. The measuring process of the diameter of the light spot can be as follows: the diameter of the generated light spot is measured by irradiating laser on a product to be processed at a single time and then using an electron microscope. It will be appreciated that the method of measuring the diameter of the spot may be a single measurement or a plurality of measurements with an average value. The laser frequency of the laser emission is determined by debugging the laser processing device when the laser processing device leaves the factory, so the frequencies of the laser emission on the laser processing devices of different models are different, so the laser processing device in the embodiment can collect and count different laser emission frequencies, and further input in advance manually, that is, the laser frequency of the laser emission is obtained by inputting in advance after collecting and counting manually, and of course, the laser frequency of the laser emission can also be formed by the factory data of the laser processing device.
Step b2, multiplying the diameter of the light spot by the numerical value of the laser frequency to obtain a limited speed;
step b3, judging whether the preset speed is less than the limit speed;
and then multiplying the diameter of the light spot by the numerical value of the laser frequency to obtain a limited speed, and further judging whether the preset speed is less than the limited speed. It can be understood that the spot diameter of the laser beam irradiated on the surface of the product to be processed represents the grinding and cutting stroke of the laser beam when the laser beam is positioned and irradiated, and the output frequency of the laser beam represents the number of times the laser beam is irradiated in each time unit, i.e. the number of times the laser beam is cut in each time unit, so that the maximum limit value of the preset speed of the laser beam on the surface of the product to be processed can be deduced to be the product of the two, and then the value is calculated and defined as the limited speed.
B4, if the preset speed is less than the limited speed, determining the grinding operation parameter of the product to be processed as the single movement irradiation of the laser along the surface of the product to be processed;
and b5, if the preset speed is greater than or equal to the limited speed, determining the grinding operation parameter of the product to be processed as the laser irradiation of multiple reciprocating movements along the surface of the product to be processed.
And if the preset speed is less than the limited speed, determining the grinding operation parameter of the product to be processed as the single movement irradiation of the laser along the surface of the product to be processed. It can be understood, for the comparatively even effect of the grinding on the surface of the product of treating processing of realization, do not produce the characteristics of processing stress and the easy control of laser with the work piece contact when utilizing laser beam machining, when the surface of the product of treating processing is evenly processed, need make laser at the surface of the product of treating processing everywhere laser cutting number of times unanimous, therefore laser should move on the surface with a constant speed when the surface processing of the product of treating processing is with, if moving speed is too fast, the condition of laser irradiation disappearance appears in partial removal route when can lead to removing, and then treat that the unsmooth surface roughness after the product of processing attenuate leads to its surface smoothness after processing lower, the shaping effect is relatively poor. Therefore, the preset speed of the laser is ensured to move for a single time under the maximum limit value (namely, the limited speed), so that the flatness of the product to be processed is higher when the product to be processed is thinned, and the forming effect is better. In addition, when speed is less than the speed of injecing owing to predetermineeing, the single removal of laser has satisfied the demand of single attenuate, so set up, is favorable to promoting the efficiency of attenuate.
If the preset speed is greater than or equal to the limited speed, the situation that laser irradiation is lost in a part of moving paths during moving is easily caused due to the fact that the preset speed is too high, at the moment, the grinding operation parameters of the product to be processed are determined to be that the laser irradiates along the surface of the product to be processed in a reciprocating mode for multiple times, and then the laser can be controlled to irradiate along the surface of the product to be processed in a reciprocating mode for multiple times, so that the situation that laser irradiation is lost in a part of moving paths is filled.
At this time, step S30 includes:
and step S31, controlling the laser to move on the surface of the product to be processed based on the grinding operation parameters and the preset speed by controlling the flying light path so as to grind the product to be processed.
And after the grinding operation parameters of the product to be processed are determined, controlling the laser to move on the surface of the product to be processed based on the grinding operation parameters and the preset speed by controlling the flight light path so as to grind the product to be processed.
Through the mode, the laser processing device can control the movement of the laser relative to the product to be processed under the condition that the preset speed (namely the relative speed of the laser relative to the product to be processed) is different, so that the requirement of processing the product to be processed is better met.
Further, a third embodiment of the laser processing control method of the present invention is proposed based on the first embodiment shown in fig. 2.
In this embodiment, before the step "adjusting the angle of the laser head", the laser processing control method further includes:
step A, detecting the current clamping state of the product to be processed;
in this embodiment, before the control device worktable rotates, the current clamping state of the product to be processed may be detected first to determine whether the current clamping state meets the requirement. Specifically, the current clamping state of a product to be processed can be detected firstly, wherein the product to be processed is a composite plate and comprises a superhard material layer and a metal alloy layer which are connected in sequence. And detecting the plane of the connecting surface of the metal alloy layer and the superhard material layer by using a plane detection device.
Step B, comparing the current clamping state with a preset clamping state to obtain a comparison parameter;
and then, comparing the current clamping state with a preset clamping state to obtain a comparison parameter. Specifically, a plane where one side of the metal alloy layer in the current clamping state, which is connected with the superhard material layer, is located and a plane where one side of the metal alloy layer in the preset clamping state, which is connected with the superhard material layer, is located are parallel to each other and compared. A machining reference plane is preset, and the distance between the machining reference plane and the grinding surface of the superhard material layer is equal to the thickness of the superhard material layer.
The preset clamping state is a state that one side, connected with the superhard material layer, of the metal alloy layer is in the same plane with a preset machining reference surface, the distance between the current clamping state and the two planes in the preset clamping state is detected through a distance detection device, and the numerical value of the distance obtained through comparison is a comparison parameter.
C, judging whether the current clamping state of the product to be processed meets the requirements or not based on the comparison parameters;
if yes, executing the following steps: adjusting the angle of the laser head;
if not, executing step D: and adjusting the product to be processed in the current clamping state to the preset clamping state according to the comparison parameter.
Then, whether the current clamping state of the product to be processed meets the requirement is judged based on the comparison parameter, and specifically, whether the current clamping state of the product to be processed meets the requirement can be judged by detecting whether the comparison parameter is within a preset numerical value range. If the angle of the laser head is consistent with the preset angle, adjusting the angle of the laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be the preset angle; if not, adjusting the product to be processed in the current clamping state to a preset clamping state according to the comparison parameters, further adjusting the angle of the laser head, and executing the subsequent steps. In the adjustment, the position of the jig can be adjusted by a driving device of the laser processing device. And controlling the driving device to adjust the position of the clamp according to the comparison parameter so that the side, connected with the superhard material layer, of the metal alloy layer in the current clamping state and the side, connected with the superhard material layer, of the metal alloy layer in the preset clamping state are on the same plane. Thereby make among the abrasive machining process, can use metal alloy layer's surface as the processing reference surface, and then to the superhard material layer attenuate, be favorable to making each thickness after the superhard material layer processing unanimous, the roughness is higher promptly, in addition, also just to the management and control of hard material layer thickness, thereby can promote abrasive machining effect.
Of course, it can be understood that the above method for detecting the clamping state is only one of the methods, and in a specific embodiment, other detection methods may be adopted to detect the clamping state of the product to be processed.
Further, a fourth embodiment of the laser processing control method of the present invention is proposed based on the first embodiment shown in fig. 2.
In this embodiment, before the step "controlling the laser to emit laser light", the laser processing control method further includes:
step E, acquiring the material type of the product to be processed, and determining the target output power of the laser according to the material type and a second preset mapping relation;
in this embodiment, after adjusting the angle of the laser head, the output power of the laser needs to be determined first, specifically, the material type of the product to be processed may be obtained first, and then the target output power of the laser is determined according to the material type and a second preset mapping relationship, where the second preset mapping relationship includes mapping relationships between different material types and the laser output power.
At this time, the step of "controlling the laser to emit laser light" includes: and controlling the laser to emit laser light based on the target output power.
After the target output power of the laser is determined, the laser is controlled to emit the laser based on the target output power, namely, the output power of the laser is controlled to be the target output power when the laser is emitted.
By the mode, the laser with appropriate output power can be adopted for products to be processed of different material types to process the products to be processed, so that the laser processing effect can be improved, the situation of repeated processing due to inappropriate output power is avoided, and the processing efficiency can be improved to a certain extent.
It will be appreciated that the above embodiments of the invention all employ lasers emitting pulsed laser light. In other embodiments of the present invention, when a laser emitting continuous laser light is used, in step S40 and step S31, the laser is controlled to move on the surface of the workpiece to be processed under the condition that the grinding operation parameters are controlled to keep the time of the laser stay at a single position in a unit time to be consistent. Wherein, the staying time is preset time. And in the grinding process, the cutting amount between the positions can be detected by using the thickness detection device, and then the preset time can be adjusted within an allowable range according to the difference between the cutting amounts at the positions through comparison.
The present invention also provides a computer-readable storage medium having stored thereon a laser machining control program which, when executed by a processor, implements the steps of the laser machining control method according to any one of the above embodiments.
The specific embodiment of the computer readable storage medium of the present invention is substantially the same as the embodiments of the laser processing control method described above, and is not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A laser processing control method is applied to a laser processing device, and comprises the following steps:
after a product to be processed is clamped to an equipment workbench, adjusting the angle of a laser head to enable the included angle between the laser emission direction of the laser head and the surface of the product to be processed to be a preset angle;
controlling a laser to emit laser, and controlling the laser to irradiate the surface of the product to be processed;
the laser is controlled to move on the surface of the product to be processed at a preset speed by controlling the flying light path, so that the product to be processed is ground, wherein the flying light path is composed of a laser head and a motion shaft.
2. The laser machining control method of claim 1, wherein the laser machining apparatus includes one or more laser heads, and when the laser machining apparatus includes a plurality of laser heads, the step of adjusting an angle of the laser heads so that an included angle between a laser emitting direction of the laser heads and the surface of the product to be machined is a preset angle includes:
and adjusting the angles of the plurality of laser heads to enable included angles between the laser emission direction of each laser head and the surface of the product to be processed to be first preset angles, wherein the value of the first preset included angle is in the range of 0-90 degrees.
3. The laser machining control method of claim 1, wherein when the laser machining apparatus includes a plurality of laser heads, the adjusting of the angles of the laser heads such that an included angle between a laser emitting direction of the laser heads and a surface of the product to be machined is a preset angle further includes:
respectively acquiring the numbers of the laser heads, and determining the corresponding adjustment information of each laser head based on the numbers and a first preset mapping relation;
and adjusting the angle of the corresponding laser head based on the adjustment information, so that the included angle between the laser emission direction of each laser head and the surface of the product to be processed is a corresponding second preset angle respectively, wherein the value of the second preset angle is in the range of 0-90 degrees.
4. The laser processing control method according to any one of claims 1 to 3, wherein the step of controlling the laser to move on the surface of the product to be processed at a preset speed by controlling the flight path to grind and process the product to be processed further comprises:
determining grinding operation parameters of the product to be processed according to the preset speed;
the method comprises the following steps of controlling laser to move on the surface of the product to be processed at a preset speed in a mode of controlling a flight light path so as to grind the product to be processed, wherein the step of controlling the flight light path comprises the following steps:
and controlling laser to move on the surface of the product to be processed based on the grinding operation parameters and the preset speed by controlling a flight light path so as to grind and process the product to be processed.
5. The laser machining control method according to claim 4, wherein the step of determining the grinding operation parameter of the product to be machined according to the preset speed includes:
acquiring the diameter of a light spot formed by irradiating the surface of the product to be processed with laser and the laser frequency emitted by the laser;
multiplying the diameter of the light spot by the numerical value of the laser frequency to obtain a limited speed;
judging whether the preset speed is smaller than the limited speed or not;
if the preset speed is less than the limit speed, determining that the grinding operation parameter of the product to be processed is the single moving irradiation of the laser along the surface of the product to be processed;
and if the preset speed is greater than or equal to the limited speed, determining the grinding operation parameter of the product to be processed as the laser irradiation of multiple reciprocating movements along the surface of the product to be processed.
6. The laser processing control method of any one of claims 1 to 3, wherein the step of adjusting the angle of the laser head is preceded by:
detecting the current clamping state of the product to be processed;
comparing the current clamping state with a preset clamping state to obtain a comparison parameter;
judging whether the current clamping state of the product to be processed meets the requirements or not based on the comparison parameters;
if yes, executing the following steps: adjusting the angle of the laser head;
and if not, adjusting the product to be processed in the current clamping state to the preset clamping state according to the comparison parameter.
7. The laser processing control method according to any one of claims 1 to 3, wherein before the step of controlling the laser to emit laser light and controlling the laser light to irradiate the surface of the product to be processed, the method further comprises:
obtaining the material type of the product to be processed, and determining the target output power of the laser according to the material type and a second preset mapping relation;
the step of controlling the laser to emit laser light comprises the following steps:
and controlling the laser to emit laser light based on the target output power.
8. The laser processing control method according to any one of claims 1 to 3, wherein the step of controlling the laser light to be irradiated to the surface of the product to be processed includes:
controlling laser to irradiate the surface of the product to be processed through a focusing lens; or the like, or, alternatively,
and controlling laser to irradiate the surface of the product to be processed through a vibrating mirror and a focusing lens.
9. A laser machining apparatus comprising one or more laser heads, and further comprising a memory, a processor, and a laser machining control program stored on the memory and executable on the processor, the laser machining control program when executed by the processor implementing the steps of the laser machining control method of any one of claims 1 to 8.
10. A computer-readable storage medium, having a laser machining control program stored thereon, which when executed by a processor, implements the steps of the laser machining control method according to any one of claims 1 to 8.
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