CN107520535A - Generate the method and device of brittle substrate processing technology - Google Patents
Generate the method and device of brittle substrate processing technology Download PDFInfo
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- CN107520535A CN107520535A CN201610443809.0A CN201610443809A CN107520535A CN 107520535 A CN107520535 A CN 107520535A CN 201610443809 A CN201610443809 A CN 201610443809A CN 107520535 A CN107520535 A CN 107520535A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The embodiments of the invention provide a kind of method and device for generating brittle substrate processing technology, belong to material processing field.Methods described includes：Obtain the size of substrate to be processed, the material information of substrate to be processed, on target machining shape and the substrate to be processed region to be processed positional information；The laser parameter of laser scanning device is generated according to the material information；The target machining shape is divided into multiple scanning areas, size and the positional information based on the substrate to be processed, determines the laser scanning device respective sweep parameter in the multiple scanning area of the sector scanning to be processed.The target machining shape is divided into multiple scanning areas by this method, so that laser scanning device is during scanning substrate, multiple scanning areas can be scanned respectively, avoid because causing substrate to produce fragmentation or the problem of crack directly cutting target machining shape on substrate, improve crudy and machining accuracy.
Description
Technical field
The present invention relates to material processing field, in particular to a kind of side for generating brittle substrate processing technology
Method and device.
Background technology
Currently manufactured business is more and more to use substrate formed by two dimension or Three-dimension process technology etc. in electronic device
Parts, and with industry and the increase of social demand, such as glass or crystal fragile material of high accuracy and high quality
The two-dimentional or three-dimensional parts being processed into increasingly are favored；But most of traditional manufacturing industry is using numerical control, line
The processing and manufacturing of these parts is completed in the combination of saw technology and grinding lathe etc., and such a mode processing efficiency is low, processing
Process is various, complicated.At present, although also there is the method for Laser Processing fragile material in the prior art, existing method is deposited
It is low in parts machining quality, process parts and expend time length, the defects of Product Precision is low and error rate is high.
The content of the invention
In view of this, the purpose of the embodiment of the present invention is to provide a kind of method for generating brittle substrate processing technology
And device, to improve in existing method there is parts machining quality is low, process a parts and expend time length, production
Product precision is low and the defects of error rate is high.
In a first aspect, the embodiments of the invention provide a kind of method for generating brittle substrate processing technology, the side
Method includes：Obtain the size of substrate to be processed, the material information of substrate to be processed, target machining shape and the base to be processed
The positional information in region to be processed on plate；The laser parameter of laser scanning device is generated according to the material information；By the mesh
Mark machining shape is divided into multiple scanning areas, size and the positional information based on the substrate to be processed, determines institute
Laser scanning device respective sweep parameter in the multiple scanning area of the sector scanning to be processed is stated, so that described swash
Light scanning apparatus launches laser corresponding to the laser parameter and is based on sweep parameter scanning region to be processed, described to be added
Work area domain processes the target machining shape.
Second aspect, the embodiments of the invention provide a kind of device for generating brittle substrate processing technology, the dress
Put including：Parameter acquiring unit, for obtaining the size of substrate to be processed, the material information of substrate to be processed, target processing shape
The positional information in region to be processed on shape and the substrate to be processed；Scanning laser parameter generating unit, for according to
Material information generates the laser parameter of laser scanning device；Scanning pattern generation unit, for the target machining shape to be divided
Multiple scanning areas are segmented into, size and the positional information based on the substrate to be processed, determine the laser scanning dress
The respective sweep parameter in the multiple scanning area of the sector scanning to be processed is put, so that the laser scanning device is sent out
Penetrate laser corresponding to the laser parameter and be based on sweep parameter scanning region to be processed, go out in the region processing to be processed
The target machining shape.
The method and device of generation brittle substrate processing technology provided in an embodiment of the present invention, it is to be added by obtaining
Region to be processed on the size of work substrate, the material information of substrate to be processed, target machining shape and the substrate to be processed
Positional information, generate the laser parameter of laser scanning device, and the target machining shape is divided into multiple scanning areas,
Size and the positional information based on the substrate to be processed, determine the laser scanning device in the region to be processed
Scan the mode of respective sweep parameter during the multiple scanning area so that the laser scanning device can be launched described sharp
Laser corresponding to optical parameter, each scanning area is processed according to sweep parameter corresponding to each scanning area, improved
There is parts machining quality is low in existing method, process a parts and expend time length, Product Precision is low and goes out
The defects of error rate is high.
Other features and advantages of the present invention will illustrate in subsequent specification, also, partly become from specification
It is clear that or by implementing understanding of the embodiment of the present invention.The purpose of the present invention and other advantages can be by saying what is write
Specifically noted structure is realized and obtained in bright book, claims and accompanying drawing
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by embodiment it is required use it is attached
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore be not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is a kind of structured flowchart of computer provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation of fragile material system of processing provided in an embodiment of the present invention；
Fig. 3 is the structural representation of another fragile material system of processing provided in an embodiment of the present invention；
Fig. 4 is the flow chart of the method for the generation brittle substrate processing technology that first embodiment of the invention provides；
Fig. 5 is that the scanning area that first embodiment of the invention provides splits schematic diagram；
Fig. 6 is the flow chart of the method for the generation brittle substrate processing technology that second embodiment of the invention provides；
Fig. 7 is the structured flowchart of the device for the generation brittle substrate processing technology that third embodiment of the invention provides；
Fig. 8 is the structured flowchart of the device for the generation brittle substrate processing technology that third embodiment of the invention provides.
Embodiment
Below in conjunction with accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Ground describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Generally exist
The component of the embodiment of the present invention described and illustrated in accompanying drawing can be configured to arrange and design with a variety of herein.Cause
This, the detailed description of the embodiments of the invention to providing in the accompanying drawings is not intended to limit claimed invention below
Scope, but it is merely representative of the selected embodiment of the present invention.Based on embodiments of the invention, those skilled in the art are not doing
The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.Meanwhile the present invention's
In description, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that instruction or hint relative importance.
As shown in figure 1, it is the knot of the computer 100 of generation brittle substrate processing technology provided in an embodiment of the present invention
Structure block diagram.The computer 100 includes generating the device of brittle substrate processing technology, memory, storage control, processing
Device, Peripheral Interface, input-output unit and display unit.
The memory, storage control, processor, Peripheral Interface, input-output unit, audio unit, display unit
Each element is directly or indirectly electrically connected between each other, to realize the transmission of data or interaction.For example, these elements mutually it
Between can pass through one or more communication bus or signal wire and realize and be electrically connected with.The generation brittle substrate processing technology
Device include it is at least one can be stored in the memory or be solidificated in the form of software or firmware (firmware) it is described
Software function module in the operating system (operating system, OS) of computer 100.The processor is deposited for execution
The executable module stored in reservoir, such as the software function mould that the device for generating brittle substrate processing technology includes
Block or the program of computer 100.
Wherein, memory may be, but not limited to, random access memory (Random Access Memory, RAM),
Read-only storage (Read Only Memory, ROM), programmable read only memory (Programmable Read-Only
Memory, PROM), erasable read-only memory (Erasable Programmable Read-Only Memory, EPROM),
Electricallyerasable ROM (EEROM) (Electric Erasable Programmable Read-Only Memory, EEPROM) etc..
Wherein, memory is used for storage program, and the processor performs described program, the foregoing present invention after execute instruction is received
The method performed by server that the stream process that embodiment any embodiment discloses defines can apply in processor, Huo Zheyou
Processor is realized.
Processor is probably a kind of IC chip, has the disposal ability of signal.Above-mentioned processor can be logical
With processor, including central processing unit (Central Processing Unit, abbreviation CPU), network processing unit (Network
Processor, abbreviation NP) etc.；It can also be digital signal processor (DSP), application specific integrated circuit (ASIC), ready-made programmable
Gate array (FPGA) either other PLDs, discrete gate or transistor logic, discrete hardware components.Can be with
Realize or perform disclosed each method, step and the logic diagram in the embodiment of the present invention.General processor can be micro- place
It can also be any conventional processor etc. to manage device or the processor.
Various input/output devices are coupled to processor and memory by the Peripheral Interface.In certain embodiments,
Peripheral Interface, processor and storage control can be realized in one single chip.In some other example, they can divide
Do not realized by independent chip.
Input-output unit is used to be supplied to user input data to realize interacting for user and the computer 100.It is described
Input-output unit may be, but not limited to, mouse and keyboard etc..
Display unit provided between the computer 100 and user an interactive interface (such as user interface) or
Referred to for display image data to user.In the present embodiment, the display unit can be that liquid crystal display or touch-control show
Show device.If touch control display, it can be the capacitance type touch control screen or resistance type touch control screen for supporting single-point and multi-point touch operation
Deng.Single-point and multi-point touch operation is supported to refer to that touch control display can sense one or more positions on the touch control display
Place is put with caused touch control operation, and the touch control operation that this is sensed transfers to processor to be calculated and handled.
As shown in Fig. 2 generated by a kind of executable method provided according to the present embodiment provided in an embodiment of the present invention
Processing technology system of processing structure chart, the system of processing includes：Laser scanning device, first position governor motion 130,
Processing platform 140 and control device 150.Laser scanning device includes LASER Light Source 110, multiple optical modules 120.
The loading end of processing platform 140 is used to put brittle substrate to be processed, pacifies above processing platform 140
Equipped with LASER Light Source 110 and first position governor motion 130, multiple optical modules are installed on first position governor motion 130
120.Multiple optical modules 120 include：Girth cutting assembly 121, chamfering cutting assembly 122, hole cutting assembly 123.
LASER Light Source 110 is used to provide initial laser light beam, can be specifically an optical fiber laser.Wherein, initially
Laser beam can be a wider ellipse light spot of a line width, and each optical module can be according to the demand of manufacturing procedure to first
Beginning laser beam carries out the processing such as linewidth compression or intensity amplification, and initial laser light beam is adjusted to the processing of optical module
Process corresponds to the working laser light beam of parameter.System of processing can also be the knot shown in Fig. 3 in addition to it can be said structure
Structure.The most important difference of system of processing shown in Fig. 3 and Fig. 2 is that the governor motion in Fig. 3 is adjusted for the linear second place
Mechanism 170.
After the method that the present embodiment provides generates processing technology, machined parameters corresponding to the processing technology of generation pass
In the defeated control device 150 to system of processing, in order to the control system of control device 150 according to machined parameters to being positioned over processing
Fragile material on platform 140 is processed substantially.
First embodiment
As shown in figure 4, a kind of method of the generation brittle substrate processing technology provided for first embodiment of the invention,
Methods described includes：
Step S410：Obtain the size of substrate to be processed, the material information of substrate to be processed, target machining shape and institute
State the positional information in region to be processed on substrate to be processed.
During processing technology is generated, for the substrate of different type, size and material, the processing corresponding to it
Technique can be different.Then in machining process is generated, it is necessary to obtain the size and material information of substrate to be processed, so as to
In laser parameter corresponding to generation.Also need to obtain the position in region to be processed on target machining shape and the substrate to be processed
Confidence ceases, in order to determine the scanning pattern of laser scanning device.
, can (Computer Aided Design, area of computer aided be set by loading CAD as a kind of embodiment
Meter) the source graphic file such as source file；The size and material information of the substrate to be processed are read from the source graphic file,
And on target machining shape and the substrate to be processed region to be processed positional information.
Step S420：The laser parameter of laser scanning device is generated according to the material information；
As a kind of embodiment, it can pre-establish and be stored with material information and laser corresponding with material information ginseng
Several database, in order to after material information is got, directly search and get from the database established
Laser parameter corresponding to material information.And get laser parameter corresponding to material information when not found in database
When, the data of user's input can also be received as laser parameter corresponding to the material information.
Step S430：The target machining shape is divided into multiple scanning areas, the chi based on the substrate to be processed
Very little and described positional information, determine the laser scanning device in the multiple scanning area of the sector scanning to be processed
Respective sweep parameter, so that laser corresponding to the laser scanning device transmitting laser parameter is based on the sweep parameter
Region to be processed is scanned, goes out the target machining shape in the region processing to be processed.
When directly carrying out the Laser Processing of target machining shape of larger area on brittle substrate, easily cause crisp
Property material substrate produce fragmentation or crack, in order to avoid above mentioned problem, lift machining accuracy, improve crudy, can will
The target machining shape is divided into multiple scanning areas, then determines sweep parameter corresponding to each scanning area, in order to swash
Light scanning apparatus can scan the multiple scanning area respectively.In order to further lift the machining accuracy in process,
Laser scanning device can have different scanning patterns, different sweep length and different when scanning each scanning area
Scan depths, to define the pattern of each scanning area.For example, such as Fig. 5, when doing chamfer machining on substrate to be processed,
The shape segmentations that the chamfering of processing can be first intended to are multiple scanning areas, then determine scanning ginseng corresponding to each scanning area
Number.
The method of generation brittle substrate processing technology provided in an embodiment of the present invention, by obtaining substrate to be processed
The position letter in region to be processed on size, the material information of substrate to be processed, target machining shape and the substrate to be processed
Breath, generates the laser parameter of laser scanning device, and the target machining shape is divided into multiple scanning areas so that laser
Scanning means can scan multiple scanning areas respectively during scanning substrate, avoid because directly being cut on substrate
The problem of cutting target machining shape and causing substrate to produce fragmentation or crack, improves crudy and machining accuracy.
Second embodiment
Referring to Fig. 6, the embodiments of the invention provide a kind of method for generating brittle substrate processing technology, the side
Method includes：
Step S510：Obtain the size of substrate to be processed, the material information of substrate to be processed, target machining shape and institute
State the positional information in region to be processed on substrate to be processed；
Step S520：The laser parameter of laser scanning device is generated according to the material information；
Step S530：The target machining shape is divided into multiple scanning areas, the chi based on the substrate to be processed
Very little and described positional information, determine the laser scanning device in the multiple scanning area of the sector scanning to be processed
Respective sweep parameter.
Step S540：It is raw according to the size of the substrate to be processed, and the positional information in multiple regions to be processed
Into the mobile route of the platform for placing the substrate to be processed, so that the platform drives substrate according to the mobile route
It is mobile, laser corresponding to the laser scanning device transmitting laser parameter is scanned multiple regions to be processed respectively,
Go out the target machining shape in each region processing to be processed.
When the region to be processed has multiple, the platform for placing substrate to be processed moves according to the mobile route, makes
Obtaining each region to be processed of substrate to be processed accurately can be presented in the scanning range of laser scanning device, so as to swash
Light scanning apparatus can be scanned processing to each region to be processed.
The method of generation brittle substrate processing technology provided in an embodiment of the present invention, not only causes laser scanning device
During scanning substrate, multiple scanning areas can be scanned respectively, are avoided and are added because cutting target directly on substrate
Work shape and cause substrate to produce fragmentation or the problem of crack, improve crudy and machining accuracy, also cause when to be added
When having multiple regions to be processed on work substrate, platform can move according to the mobile route, by multiple regions to be processed
It is presented in respectively in the scanning range of laser scanning device.
3rd embodiment
Referring to Fig. 7, third embodiment of the invention provides a kind of device for generating brittle substrate processing technology
600, described device 600 includes：Parameter acquiring unit 610, scanning laser parameter generating unit 620 and scanning pattern generation are single
Member 630.
Wherein, parameter acquiring unit 610, for obtaining the size of substrate to be processed, the material information of substrate to be processed, mesh
Mark the positional information in region to be processed on machining shape and the substrate to be processed；As a kind of embodiment, the parameter
Acquiring unit 610, including：
Source file loading unit 611, for loading source graphic file；
Parameter reading unit 612, for reading the size and material of the substrate to be processed from the source graphic file
Expect the positional information in region to be processed in information, and target machining shape and the substrate to be processed.
Scanning laser parameter generating unit 620, the laser for generating laser scanning device according to the material information are joined
Number；As a kind of embodiment, the sweep parameter includes scanning pattern, and sweep length corresponding to the scanning pattern and
Scan depths.
As a kind of embodiment, the scanning laser parameter generating unit 620, including:
Material information acquiring unit 621, for obtaining material information；
Scanning laser parameter searching unit 622, for being searched and the material information pair in the database pre-established
The laser parameter answered.
Scanning pattern generation unit 630, for the target machining shape to be divided into multiple scanning areas, based on described
The size of substrate to be processed and the positional information, determine the laser scanning device described in the sector scanning to be processed
Respective sweep parameter during multiple scanning areas, so that the laser scanning device launches laser-based corresponding to the laser parameter
Region to be processed is scanned in the sweep parameter, goes out the target machining shape in the region processing to be processed.
It should be noted that each unit in the present embodiment can be by software code realization, now, above-mentioned each unit
It can be stored in the memory of computer 100.Above each unit can equally be realized by hardware such as IC chip.
Fourth embodiment
Referring to Fig. 8, fourth embodiment of the invention provides a kind of device for generating brittle substrate processing technology
700, described device 700 includes：Parameter acquiring unit 710, scanning laser parameter generating unit 720, scanning pattern generation unit
730 and platform mobile route generation unit 740.
Wherein, parameter acquiring unit 710, for obtaining the size of substrate to be processed, the material information of substrate to be processed, mesh
Mark the positional information in region to be processed on machining shape and the substrate to be processed.
Scanning laser parameter generating unit 720, the laser for generating laser scanning device according to the material information are joined
Number；As a kind of embodiment, the sweep parameter includes scanning pattern, and sweep length corresponding to the scanning pattern and
Scan depths.
Scanning pattern generation unit 730, for the target machining shape to be divided into multiple scanning areas, based on described
The size of substrate to be processed and the positional information, determine the laser scanning device described in the sector scanning to be processed
Respective sweep parameter during multiple scanning areas, so that the laser scanning device launches laser-based corresponding to the laser parameter
Region to be processed is scanned in the sweep parameter, goes out the target machining shape in the region processing to be processed.
Platform mobile route generation unit 740, for the size according to the substrate to be processed, and it is multiple described to be added
The positional information in work area domain, the mobile route of the platform for placing the substrate to be processed is generated, so that the platform drives
Substrate moves according to the mobile route, the laser scanning device is scanned multiple regions to be processed.
It should be noted that each unit in the present embodiment can be by software code realization, now, above-mentioned each unit
It can be stored in the memory of computer 100.Above each unit can equally be realized by hardware such as IC chip.
It is apparent to those skilled in the art that for convenience and simplicity of description, the device of foregoing description
With the specific work process of unit, the corresponding process in preceding method embodiment is may be referred to, will not be repeated here.
In several embodiments provided herein, it should be understood that disclosed apparatus and method, can also pass through
Other modes are realized.Device embodiment described above is only schematical, for example, flow chart and block diagram in accompanying drawing
Show the device of multiple embodiments according to the present invention, method and computer program product architectural framework in the cards,
Function and operation.At this point, each square frame in flow chart or block diagram can represent the one of a module, program segment or code
Part, a part for the module, program segment or code include one or more and are used to realize holding for defined logic function
Row instruction.It should also be noted that at some as in the implementation replaced, the function that is marked in square frame can also with different from
The order marked in accompanying drawing occurs.For example, two continuous square frames can essentially perform substantially in parallel, they are sometimes
It can perform in the opposite order, this is depending on involved function.It is it is also noted that every in block diagram and/or flow chart
The combination of individual square frame and block diagram and/or the square frame in flow chart, function or the special base of action as defined in performing can be used
Realize, or can be realized with the combination of specialized hardware and computer instruction in the system of hardware.
In addition, each functional module in each embodiment of the present invention can integrate to form an independent portion
Point or modules individualism, can also two or more modules be integrated to form an independent part.
If the function is realized in the form of software function module and is used as independent production marketing or in use, can be with
It is stored in a computer read/write memory medium.Based on such understanding, technical scheme is substantially in other words
The part to be contributed to prior art or the part of the technical scheme can be embodied in the form of software product, the meter
Calculation machine software product is stored in a storage medium, including some instructions are causing a computer equipment (can be
People's computer, server, or network equipment etc.) perform all or part of step of each embodiment methods described of the present invention.
And foregoing storage medium includes：USB flash disk, mobile hard disk, read-only storage (ROM, Read-Only Memory), arbitrary access are deposited
Reservoir (RAM, Random Access Memory), magnetic disc or CD etc. are various can be with the medium of store program codes.Need
Illustrate, herein, such as first and second or the like relational terms be used merely to by an entity or operation with
Another entity or operation make a distinction, and not necessarily require or imply between these entities or operation any this reality be present
The relation or order on border.Moreover, term " comprising ", "comprising" or its any other variant are intended to the bag of nonexcludability
Contain, so that process, method, article or equipment including a series of elements not only include those key elements, but also including
The other element being not expressly set out, or also include for this process, method, article or the intrinsic key element of equipment.
In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that including the key element
Process, method, other identical element also be present in article or equipment.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.It should be noted that：Similar label and letter exists
Similar terms is represented in following accompanying drawing, therefore, once being defined in a certain Xiang Yi accompanying drawing, is then not required in subsequent accompanying drawing
It is further defined and explained.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention described should be defined by scope of the claims.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that process, method, article or equipment including a series of elements not only will including those
Element, but also the other element including being not expressly set out, or it is this process, method, article or equipment also to include
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Other identical element also be present in process, method, article or equipment including the key element.
Claims (10)
- A kind of 1. method for generating brittle substrate processing technology, it is characterised in that methods described includes：Obtain the size of substrate to be processed, the material information of substrate to be processed, target machining shape and the substrate to be processed The positional information in upper region to be processed；The laser parameter of laser scanning device is generated according to the material information；The target machining shape is divided into multiple scanning areas, size and the position based on the substrate to be processed Information, determine the laser scanning device respective scanning ginseng in the multiple scanning area of the sector scanning to be processed Number, so that the laser scanning device is launched laser corresponding to the laser parameter and scanned based on the sweep parameter to be processed Region, go out the target machining shape in the region processing to be processed.
- 2. according to the method for claim 1, it is characterised in that the sweep parameter includes scanning pattern, and described sweeps Retouch sweep length corresponding to path and scan depths.
- 3. method according to claim 1 or 2, it is characterised in that when the region to be processed has multiple, methods described Also include：According to the size of the substrate to be processed, and the positional information in multiple regions to be processed, generate for placing institute The mobile route of the platform of substrate to be processed is stated, so that the platform drives the substrate to be processed to be moved according to the mobile route It is dynamic, the laser scanning device is scanned multiple regions to be processed.
- 4. according to the method for claim 1, it is characterised in that the size for obtaining substrate to be processed, substrate to be processed Material information, on target machining shape and the substrate to be processed region to be processed positional information, including：Loading source graphic file；The size of the substrate to be processed, the material information, described of the substrate to be processed are read from the source graphic file The positional information in region to be processed on target machining shape and the substrate to be processed.
- 5. according to the method for claim 1, it is characterised in that described that laser scanning device is generated according to the material information Laser parameter, including:Obtain the material information；Laser parameter corresponding with the material information is searched in the database pre-established.
- 6. a kind of device for generating brittle substrate processing technology, it is characterised in that described device includes：Parameter acquiring unit, for obtain the size of substrate to be processed, the material information of substrate to be processed, target machining shape with And on the substrate to be processed region to be processed positional information；Scanning laser parameter generating unit, for generating the laser parameter of laser scanning device according to the material information；Scanning pattern generation unit, for the target machining shape to be divided into multiple scanning areas, based on described to be processed The size of substrate and the positional information, determine that the laser scanning device is swept the sector scanning to be processed is the multiple Respective sweep parameter during region is retouched, so that the laser scanning device launches laser corresponding to the laser parameter and is based on institute State sweep parameter and scan region to be processed, go out the target machining shape in the region processing to be processed.
- 7. device according to claim 6, it is characterised in that the sweep parameter includes scanning pattern, and described sweeps Retouch sweep length corresponding to path and scan depths.
- 8. the device according to claim 6 or 7, it is characterised in that when the region to be processed has multiple, described device Also include：Platform mobile route generation unit, for the size according to the substrate to be processed, and multiple regions to be processed Positional information, the mobile route of the platform for placing the substrate to be processed is generated, so that the platform drives substrate to press Moved according to the mobile route, the laser scanning device is scanned multiple regions to be processed.
- 9. device according to claim 6, it is characterised in that the parameter acquiring unit, including：Source file loading unit, for loading source graphic file；Parameter reading unit, for the size that the substrate to be processed is read from the source graphic file, the base to be processed The positional information in region to be processed on the material information of plate, the target machining shape and the substrate to be processed.
- 10. device according to claim 6, it is characterised in that the scanning laser parameter generating unit, including:Material information acquiring unit, for obtaining the material information；Scanning laser parameter searching unit, for searching laser corresponding with the material information in the database pre-established Parameter.
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| CN201610443809.0A CN107520535A (en) | 2016-06-20 | 2016-06-20 | Generate the method and device of brittle substrate processing technology |
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| CN201610443809.0A CN107520535A (en) | 2016-06-20 | 2016-06-20 | Generate the method and device of brittle substrate processing technology |
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| CN110404888A (en) * | 2019-08-16 | 2019-11-05 | 深圳泰德激光科技有限公司 | Control method, laser cleaning equipment and the storage medium of laser cleaning equipment |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433619A (en) * | 2013-08-30 | 2013-12-11 | 深圳市大族激光科技股份有限公司 | Laser cladding printer and manufacturing method of circuit board |
| CN103481381A (en) * | 2012-06-12 | 2014-01-01 | 清华大学 | Cutting method for fragile sheet structures |
| CN105458515A (en) * | 2014-09-11 | 2016-04-06 | 大族激光科技产业集团股份有限公司 | Sapphire laser grooving device and grooving method thereof |
-
2016
- 2016-06-20 CN CN201610443809.0A patent/CN107520535A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103481381A (en) * | 2012-06-12 | 2014-01-01 | 清华大学 | Cutting method for fragile sheet structures |
| CN103433619A (en) * | 2013-08-30 | 2013-12-11 | 深圳市大族激光科技股份有限公司 | Laser cladding printer and manufacturing method of circuit board |
| CN103433619B (en) * | 2013-08-30 | 2015-10-21 | 大族激光科技产业集团股份有限公司 | The preparation method of laser melting coating printer and wiring board |
| CN105458515A (en) * | 2014-09-11 | 2016-04-06 | 大族激光科技产业集团股份有限公司 | Sapphire laser grooving device and grooving method thereof |
Cited By (19)
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| CN110404888A (en) * | 2019-08-16 | 2019-11-05 | 深圳泰德激光科技有限公司 | Control method, laser cleaning equipment and the storage medium of laser cleaning equipment |
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| CN113814560A (en) * | 2021-09-10 | 2021-12-21 | 广东工业大学 | Multi-pulse width laser processing device and method |
| CN114083112A (en) * | 2021-10-20 | 2022-02-25 | 泰德激光惠州有限公司 | Control method and device of laser ablation system and computer readable storage medium |
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