CN1925944B - Laser processing apparatus and laser processing method - Google Patents
Laser processing apparatus and laser processing method Download PDFInfo
- Publication number
- CN1925944B CN1925944B CN2005800063847A CN200580006384A CN1925944B CN 1925944 B CN1925944 B CN 1925944B CN 2005800063847 A CN2005800063847 A CN 2005800063847A CN 200580006384 A CN200580006384 A CN 200580006384A CN 1925944 B CN1925944 B CN 1925944B
- Authority
- CN
- China
- Prior art keywords
- processing
- laser
- machined object
- working position
- identifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Making Paper Articles (AREA)
Abstract
A laser processing apparatus is provided with a laser oscillator, a spectroscopic section, first and second positioning sections and a marking control section. The spectroscopic section splits a laser beam emitted from a laser oscillator into a first laser beam and a second laser beam. The first positioning section permits the first laser beam to enter and position at a processing position on a first object to be processed. The second positioning section permits the second laser beam to enter and position at a processing position on a second object to be processed. The marking control section controls the first positioning section and the second positioning section. Then, at least either a first identifier, which indicates processing by the first positioning section, is marked on the first object by the first laser beam, or a second identifier, which indicates processing by the second positioning section, is marked on the second object by the second laser beam.
Description
Technical field
The invention relates to divisible laser, and carry out the laser processing device of the processing of a plurality of machined objects with a laser oscillator simultaneously from laser oscillator.
Background technology
Japan patent of invention spy open disclose in flat 11-192571 number a kind of: will be divided into a plurality ofly from the laser of laser oscillator, carry out the example of the laser processing device in the past of a plurality of machined objects processing more simultaneously.This laser processing device is used for the perforate processing of printed base plate.And with Fig. 3 explanation laser processing device in the past.
Arrive optical length among each laser beam 2A, the 2B that separates by beam splitter 10, be configured to same distance by processing head 21,22 lens 6 formed convergent points separately.That is, to be reentered the optical length that is mapped to inspection stream mirror (galvano-mirror) 4A, reentered the optical length that is mapped to inspection stream mirror 4A with laser beam 2B by speculum 3D, 3E, 3F reflection by speculum 3B, 3C reflection be equal length to laser beam 2A.Thus, by making the optical length unanimity, thereby make the converged state of the laser beam 2A, the 2B that respectively process head 21,22 identical, 2 plate bases 17 can be machined to high precision simultaneously.
2 plate bases 17 by the processing of the irradiation of laser so structure are maintained on the assigned position of XY platform 19.The scanning area that the range of work of substrate 17 is processed head 21,22 is wider.Therefore, shown in dotted line, the range of work is divided into a plurality of processing.That is, when by by each scanning of carrying out of processing head 21,22, make that XY platform 19 makes the next range of work move to the below of processing head 21,22 after the process finishing of 1 range of work.
In the structure of cutting apart laser as described above, in a processing head, for example, at a side galvanometer 4,5, or a side lens 6 are when being subjected to polluting, and then laser output can reduce, thereby unfavorable condition takes place in processing.Under this situation, difficult understanding is with which processing head to process, and is difficult for being selected to the machined object of object.
Summary of the invention
Laser processing device of the present invention comprises laser oscillator, spectrum part, the 1st and the 2nd location division and indicates control part.Spectrum part will be divided into the 1st laser and the 2nd laser from the laser that laser oscillator penetrates.The 1st location division incident the 1st laser also is located Working position on the 1st machined object.The 2nd location division incident the 2nd laser also is located Working position on the 2nd machined object.Described sign control part determines that the Working position on Working position on the 1st machined object and the 2nd machined object is carry out hole processing or should indicate processing, under the situation that should indicate processing, judge whether described sign processing is that processing head identification indicates, in described sign processing is under the situation of described processing head identification sign, controls the 1st location division and the 2nd location division.Then, carry out to represent that by the 1st laser the 1st identifier of the processing that carry out the 1st location division is recorded in the 1st machined object and will represents that by the 2nd laser the 2nd identifier of the processing that carry out the 2nd location division is recorded at least any one party of the 2nd machined object.In such structure, can on machined object, put down in writing by the identifier of the 1st location division processing or the identifier of processing by the 2nd location division, thereby after Laser Processing, can easily confirm.
Description of drawings
Fig. 1 is the structural map of the laser processing device in the invention process form.
Fig. 2 is the flow chart of the laser processing in the expression the invention process form.
Fig. 3 is the structural map of laser processing device in the past.
Among the figure:
The 1-laser oscillator; 2,2A, 2B-laser beam; 3B, 3C, 3D, 3E, 3F-speculum; 4,5-galvanometer; 4A-inspection stream mirror (galvano-mirror); The 6-lens; The 10-beam splitter; The 17-substrate; The 19-XY platform; 21,22-processing head; 110-the 1st storage part; 131-the 2nd storage part; 132-the 3rd storage part; 140-positioning control portion; The 150-card for laser control unit; The 151-laser oscillator; 152,152A, 152B-laser; 153A, 153B-speculum; 154-beam splitter (spectrum part); 160-machine table control part; The 161-Y axial brake device; The 162-X axial brake device; The 170-machine table; 171,172-printed base plate; 180-processing head control part; 181-processing head (the 1st location division); 182-processing head (the 2nd location division); The 190-light shielding part.
The specific embodiment
Fig. 1 is the structural map of the laser processing device in the invention process form.In the 1st storage part (below, be called storage part) 110, writing down the perforate data (drilldate) that comprise processing unit (plant) and processing conditions.Master control part 120 can be divided into the perforate data of storage part 110 position data and processing conditions data, and is stored in the 2nd storage part (below, be called storage part) the 131 and the 3rd storage part (below, be called storage part) 132 respectively.Be carried on the machine table 170 as the printed base plate of machined object (below, be called substrate) 171,172.Machine table control part 160 control Y-axis drive units 161, X-axis drive unit 162, and two dimension drives machine table 170.
From the laser 152 of laser oscillator 151 output, can by speculum 153A, 153B import with position that machine table 170 is faced mutually on fixing processing head 181.In addition, be provided with beam splitter 154 between speculum 153A and speculum 153B, so that laser 152 beam split import another processing head 182 as spectrum part.Processing head the 181, the 182nd by processing head control part 180 control, carries out two-dimensional localization with laser 152A, the 152B of institute's incident, shines respectively on substrate 171,172 again.That is, processing head 181 is the 1st location divisions, and its incident is laser 152A by the 1st laser after cutting apart, and to make laser 152A be positioned the 1st machined object be Working position on the substrate 171.Processing head 182 is the 2nd location divisions, and its incident is laser 152B by the 2nd laser after cutting apart, and to make laser 152B be positioned the 2nd machined object be Working position on the substrate 172.
Fig. 2 is the flow chart of processing of the perforate data of expression master control part 2.In the perforate data of storage part 110,, also comprise the sign processing order of aftermentioned in order to the processing identifier except in advance substrate 171,172 being carried out the order of hole processing.At first, master control part 120 is to judge with S201 whether the signal of reading from the perforate data of storage part 110 serves as to indicate the processing order.Not being when indicating the processing order, then be judged as hole processing order, and, in S211, on the assigned position of substrate 171,172, carry out hole processing by each control part.Then, judge in S231 whether processing finishes.As long as process finishing is handled promptly and finished,, then handle and get back to S201 if do not finish.
On the other hand, when the signal of reading in S201 was ordered for indicating processing, then processing can enter S221.In S221, judge whether the sign processing order of being read is that processing head identification indicates order.
When the sign processing order of being read was not the order of processing head identification sign, processing can enter S222, and master control part 120 can be carried out the processing of common sign processing.At this, so-called common sign is to represent that for example producer or build date etc. and processing head do not have the content of direct relation.On the other hand, be that processing head identification indicates under the situation of order, can enter S223, and master control part 120 can be carried out the processing of processing head identification processing.No matter under what situation, need only when indicating the processing end, handle promptly entering S231.
In the processing head identification processing of S223, master control part 120 generates the text line or mark grade in an imperial examination the 1, the 2nd identifier of expression processing head 181,182 identifications.Then, by positioning control portion 140, processing head control part 180, positional information is sent to processing head 181,182.Thus, laser 152A, 152B are by two-dimensional localization and shine substrate 171,172, to process these identifiers.
These identifiers are recorded in the required Laser emission number of substrate 171,172 and since because of processing head 181,182 different, so behind a side processing head irradiating laser, at remaining processing head irradiating laser.Perhaps, according to Laser emission number in each processing head less and carried out processing in a synchronous manner after, shine remaining Laser emission by a side processing head.For example, do not carry out laser when irradiation, can prevent irradiation by light shielding part 190 from the laser 152A of processing head 181 at processing head 181.As long as light shielding part 190 is arranged at least any one party in the processing head 181,182.
Perhaps, during processing head 182 was recorded in substrate 172 with identifier, light shielding part 190 also can prevent the irradiation from the laser 152A of processing head 181.Under this situation, but the substrate of not putting down in writing identifier after processing has as yet been processed in identification with processing head 181.That is the also any one party in substrate 171,172 record identifier only.
Thus, master control part 120, positioning control portion 140, processing head control part 180 are controlled processing head 181,182 as a whole.Promptly, these structure has constituted the sign control part, it controls processing head 181,182, and the 1st identifier of the processing of being undertaken by processing head 181 with laser 152A record expression on substrate 171, the 2nd identifier of the processing of being undertaken by processing head 182 with laser 152B record expression on substrate 172.Indicate control part and can constitute one, also can constitute each control part with independent circuit or chip.In addition, storage part 110,131,132 also can be divided field of storage and constitute in 1 storage device, with device formation that can be independent.
The industry practicality
As mentioned above, no matter which adds foreman's processing according to the present invention with, all can on machined object, put down in writing. Therefore, even a side the foreman that adds unfavorable condition takes place, can select easily to add the machined object that the foreman processed by this. Therefore, the processing of these machined objects also becomes easily, also can specify easily the foreman that adds that should carry out Recovery processing simultaneously. Thus, can obtain industrial useful laser processing device.
Claims (5)
1. laser processing device comprises:
Laser oscillator;
Spectrum part, it will be divided into the 1st laser and the 2nd laser from the laser that described laser oscillator penetrates;
The 1st location division, described the 1st laser of its incident, and with the Working position of described the 1st laser positioning on the 1st machined object;
The 2nd location division, described the 2nd laser of its incident, and with the Working position of described the 2nd laser positioning on the 2nd machined object; And
Indicate control part, it moves in the following manner, determine that the Working position on Working position on described the 1st machined object and described the 2nd machined object is carry out hole processing or should indicate processing, under the situation that should indicate processing, judge whether described sign processing is that processing head identification indicates, in described sign processing is under the situation of described processing head identification sign, control described the 1st location division and described the 2nd location division, described the 1st laser that worked of going forward side by side will represent that the 1st identifier of the processing that carry out described the 1st location division is recorded in described the 1st machined object, with will represent that by described the 2nd laser the 2nd identifier of the processing that carry out described the 2nd location division is recorded at least any one party of described the 2nd machined object.
2. laser processing device as claimed in claim 1 is characterized in that,
Also comprise the 1st storage part, record the perforate data in the 1st storage part, these perforate data comprise Working position and the processing conditions by described the 1st location division and the decision of the 2nd location division;
Described sign control part reads described perforate data from described the 1st storage part, and is divided into Working position data and processing conditions data.
3. laser processing device as claimed in claim 2 is characterized in that,
Described perforate data comprise any one the sign processing order at least that is used to process described the 1st identifier and the 2nd identifier.
4. laser processing device as claimed in claim 1 is characterized in that,
Also be included in the blocking portion of interdicting described the 1st laser in the processing of described the 2nd identifier.
5. laser processing comprises:
The lasing step of vibrating;
Described laser is divided into the step of the 1st laser and the 2nd laser;
Step with the Working position of described the 1st laser positioning on the 1st machined object;
Step with the Working position of described the 2nd laser positioning on the 2nd machined object;
Determine that the Working position on Working position on described the 1st machined object and described the 2nd machined object is carry out hole processing or should indicate processing steps;
Under the situation that should carry out described sign processing, judge whether described sign processing is the step that processing head identification indicates; And
In the processing of described sign is under the described processing head identification situation about indicating, and the 1st identifier of carrying out the processing will expression undertaken by described the 1st laser is recorded in described the 1st machined object and the 2nd identifier of the processing that will represent to be undertaken by described the 2nd laser is recorded in the step of at least any one party of described the 2nd machined object.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005112015A JP4765378B2 (en) | 2005-04-08 | 2005-04-08 | Laser processing equipment |
| JP112015/2005 | 2005-04-08 | ||
| PCT/JP2005/019170 WO2006112066A1 (en) | 2005-04-08 | 2005-10-19 | Laser processing apparatus and laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1925944A CN1925944A (en) | 2007-03-07 |
| CN1925944B true CN1925944B (en) | 2010-08-18 |
Family
ID=37114810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005800063847A Expired - Fee Related CN1925944B (en) | 2005-04-08 | 2005-10-19 | Laser processing apparatus and laser processing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4765378B2 (en) |
| KR (1) | KR100815312B1 (en) |
| CN (1) | CN1925944B (en) |
| TW (1) | TW200635688A (en) |
| WO (1) | WO2006112066A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009002011A1 (en) * | 2007-06-28 | 2008-12-31 | Eo Technics Co., Ltd. | Method of dividing marking objects in multi-laser marking system |
| JP2010188396A (en) * | 2009-02-19 | 2010-09-02 | Hitachi High-Technologies Corp | Laser beam machining method, laser beam machining device, and method for producing solar panel |
| JP5328406B2 (en) * | 2009-02-19 | 2013-10-30 | 株式会社日立ハイテクノロジーズ | Laser processing method, laser processing apparatus, and solar panel manufacturing method |
| CN102348527B (en) * | 2009-04-15 | 2014-07-09 | 三菱电机株式会社 | Laser machining method and laser machining device |
| JP2011036881A (en) * | 2009-08-10 | 2011-02-24 | Hitachi Via Mechanics Ltd | Laser beam machining method |
| KR101036157B1 (en) * | 2010-03-11 | 2011-05-23 | 에스엔유 프리시젼 주식회사 | Laser scribing apparatus having marking function and method for machining solar cell using the same |
| JP5430488B2 (en) * | 2010-05-11 | 2014-02-26 | 株式会社日本製鋼所 | Laser annealing processing apparatus, laser annealing processing body manufacturing method, and laser annealing processing program |
| KR101012138B1 (en) * | 2010-11-09 | 2011-02-07 | 김미선 | Manufacturing method and apparatus for 3-dimensional conductor pattern using laser |
| JP5926592B2 (en) * | 2012-03-27 | 2016-05-25 | 川崎重工業株式会社 | Laser processing equipment for patterning |
| CN105195904B (en) * | 2014-06-23 | 2020-03-10 | 三菱电机株式会社 | Laser processing apparatus |
| JP2016074956A (en) * | 2014-10-08 | 2016-05-12 | セイコーエプソン株式会社 | Three-dimensional formation apparatus and three-dimensional formation method |
| JP6599098B2 (en) * | 2014-12-12 | 2019-10-30 | 株式会社ディスコ | Laser processing equipment |
| CN105921887B (en) * | 2016-05-25 | 2019-04-02 | 青岛自贸激光科技有限公司 | A kind of device and method based on ultrafast laser manufacture three-dimensional structure battery |
| JP6826427B2 (en) * | 2016-12-22 | 2021-02-03 | 株式会社村田製作所 | Laser machining equipment and laser machining method |
| JP6844901B2 (en) * | 2017-05-26 | 2021-03-17 | 株式会社ディスコ | Laser processing equipment and laser processing method |
| JP6869623B2 (en) * | 2017-10-26 | 2021-05-12 | 住友重機械工業株式会社 | Laser processing equipment |
| KR102125030B1 (en) * | 2018-12-07 | 2020-06-19 | 주식회사 이오테크닉스 | Apparatus for laser marking and method of laser marking using the same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60115222U (en) * | 1984-01-10 | 1985-08-03 | 株式会社 富士電機総合研究所 | Laser printing device |
| JPH024544A (en) * | 1988-06-22 | 1990-01-09 | Mitsubishi Electric Corp | Laser marking device with optical branch circuit |
| JPH06226472A (en) * | 1993-02-05 | 1994-08-16 | Hitachi Ltd | Liquid crystal mask type laser marker |
| JP3655675B2 (en) * | 1995-09-22 | 2005-06-02 | 株式会社シンク・ラボラトリー | Laser processing method for printing plate |
| JPH09308983A (en) * | 1996-05-17 | 1997-12-02 | Sumitomo Heavy Ind Ltd | Laser beam machine |
| JP2001079674A (en) * | 1999-09-10 | 2001-03-27 | Shibaura Mechatronics Corp | Marking device |
| JP2003290939A (en) * | 2002-03-28 | 2003-10-14 | Sunx Ltd | Laser marking device |
| JP2004337943A (en) * | 2003-05-16 | 2004-12-02 | Sumitomo Heavy Ind Ltd | Laser beam machining apparatus |
-
2005
- 2005-04-08 JP JP2005112015A patent/JP4765378B2/en not_active Expired - Fee Related
- 2005-10-19 WO PCT/JP2005/019170 patent/WO2006112066A1/en not_active Application Discontinuation
- 2005-10-19 KR KR1020067017031A patent/KR100815312B1/en active IP Right Grant
- 2005-10-19 CN CN2005800063847A patent/CN1925944B/en not_active Expired - Fee Related
- 2005-10-24 TW TW094137148A patent/TW200635688A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1925944A (en) | 2007-03-07 |
| TWI375600B (en) | 2012-11-01 |
| JP2006289415A (en) | 2006-10-26 |
| JP4765378B2 (en) | 2011-09-07 |
| KR100815312B1 (en) | 2008-03-19 |
| KR20070007789A (en) | 2007-01-16 |
| TW200635688A (en) | 2006-10-16 |
| WO2006112066A1 (en) | 2006-10-26 |
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