JP2010188396A - Laser beam machining method, laser beam machining device, and method for producing solar panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining device where, without providing DOE for every a plurality of branched laser beams, all the laser beams are converted into top-hat beams so as to be emitted to a substrate. <P>SOLUTION: The laser beam machining device branches a laser beam into a plurality of laser beams, while relatively moving the branched plurality of laser beams to a workpiece, they are emitted so as to perform prescribed working to a workpiece. At this time, a phase diffraction optical element means is arranged in an optical path before the branching of the laser beam so as to convert the laser beam into a top-hat intensity distribution. The laser beam after the conversion is branched into a plurality of laser beams, respectively, by a branching means. The branching means introduces the laser beams into the workpiece in such a manner that the respective optical path lengths until the plurality of laser beams after the conversion are emitted are made equal each other, and they are emitted. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laser processing method, a laser processing apparatus, and a solar panel manufacturing method for processing a thin film or the like using laser light, and in particular, a laser processing method, laser processing apparatus, and solar for performing processing by branching laser light into a plurality of parts. The present invention relates to a panel manufacturing method.

  Conventionally, in a solar panel manufacturing process, a transparent electrode layer, a semiconductor layer, and a metal layer are sequentially formed on a translucent substrate (glass substrate), and each layer is processed into a strip shape with laser light in each step after the formation. A solar panel module has been completed. When manufacturing a solar panel module in this manner, scribe lines are formed on a thin film on a glass substrate with laser light at a pitch of about 10 mm, for example. The scribe line has a line width of about 30 μm, and is composed of three lines such that the distance between the lines is about 30 μm. When forming a scribe line with a laser beam, the laser beam is usually irradiated onto a glass substrate that moves at a constant speed. As a result, it was possible to form a scribe line having a stable depth and line width. In such a processing method using laser light, a method described in Patent Document 1 is known for performing processing by branching a laser beam into a plurality of parts.

JP 2004-141929 A

  In the laser processing method described in Patent Document 1, a laser is branched into a plurality of laser beams using a phase grating, and the workpiece is irradiated with the plurality of branched laser beams. In general, in a solar panel manufacturing process, a Gaussian beam is used as it is as a laser beam, the beam diameter is reduced to a specified width, the substrate is moved, and scribing is performed. When a Gaussian beam is used as the laser light, the processed shape becomes a mortar shape, and there is a problem that the film in the center part is excessively jumped or the glass substrate is damaged. Further, since the scribing process irradiates the laser beam in a pulsed manner, there is a problem that the ridge lines on both sides of the scribe line are wavy.

In order to solve these problems, conventionally, a phase type diffractive optical element (DOE) is disposed immediately before the condenser lens, and a Gaussian beam is converted into a tophat beam. The substrate was irradiated with laser light. The DOE is an element that has the function of converting / shaping the light distribution characteristics of the laser light. It mainly converts the Gaussian intensity distribution of the laser light into a flat top (top hat) intensity distribution, and is used to improve the accuracy of laser processing. It is what is said.
However, since the DOE is an expensive element, it is not preferable to provide the DOE immediately before the condensing lenses for the plurality of laser beams branched as described above, resulting in an increase in price. It was.

  The object of the present invention has been made in view of the above points, and converts all laser light into a top hat beam and irradiates the substrate without providing a DOE for each of a plurality of branched laser lights. It is to provide a laser processing method, a laser processing apparatus and a solar panel manufacturing method.

The feature of the laser processing method according to the present invention is that a laser beam is branched into a plurality of laser beams, and the workpiece is irradiated with the plurality of branched laser beams while moving relative to the workpiece. In the laser processing method to be performed, phase type diffractive optical element means is arranged in the optical path before the laser beam is branched to convert the laser beam into a top hat intensity distribution, and the plurality of laser beams after conversion are irradiated to the workpiece The laser beam is split into a plurality of beams and irradiated onto the workpiece so that the respective optical path lengths until they are made are the same.
In this invention, when the laser beam is split into a plurality of laser beams and irradiated while moving the plurality of branched laser beams relative to the workpiece, the phase-type diffraction is performed in the optical path before the splitting of the laser beams. Optical element means is arranged to convert the laser light into a top hat intensity distribution. The converted laser beam is branched into a plurality of laser beams by a half mirror, a reflection mirror, or the like. At this time, the laser light is guided to the workpiece and irradiated so that the respective optical path lengths until the converted laser beams are irradiated onto the workpiece are equal to each other. Accordingly, the substrate can be irradiated with a plurality of laser beams converted into a top hat beam without providing a phase-type diffractive optical element (DOE) for each of the plurality of branched laser beams. I can plan. Further, since the light is branched from one (DOE) light source, the characteristics of the branched laser light can be made uniform relatively easily. .

  A feature of the laser processing apparatus according to the present invention is that the laser beam is split into a plurality of laser beams, and the plurality of branched laser beams are irradiated while being moved relative to the workpiece held by the holding means. In a laser processing apparatus for performing predetermined processing on a workpiece, phase-type diffractive optical element means provided in an optical path before branching of the laser light and converting the laser light into a top hat intensity distribution, and the phase-type diffractive optical element Branching means for branching the laser beam into a plurality of beams and irradiating the workpiece with the same optical path length until the workpiece is irradiated with a plurality of laser beams converted by the device. is there. This is an invention of a laser processing apparatus corresponding to the first feature of the laser processing method.

  The solar panel manufacturing method according to the present invention is characterized in that a solar panel is manufactured using the laser processing method or the laser processing apparatus. In this method, a solar panel is manufactured using either the laser processing method or the laser processing apparatus.

  According to the present invention, there is an effect that the tact time at the time of laser beam processing can be shortened and the overall throughput can be greatly improved.

It is a figure which shows schematic structure of the laser processing apparatus which concerns on one embodiment of this invention. It is a figure which shows the detailed structure of the optical system member of FIG. It is a schematic diagram which shows the structure of the detection optical system member of FIG. It is a block diagram which shows the detail of a process of a control apparatus. It is a figure which shows an example of operation | movement of the pulse missing determination means of FIG. It is a figure which shows an example of the waveform output from the high-speed photodiode of FIG. It is the figure which looked at the optical system member of Drawing 1 from the lower side (work side). It is a figure which shows the relationship between the rotation amount of an optical system member, and the pitch width of a scribe line.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. This laser processing apparatus performs a laser beam processing (laser scribing) process of a solar panel manufacturing apparatus.

  The solar panel manufacturing apparatus of FIG. 1 includes a pedestal 10, an XY table 20, a laser generator 40, an optical system member 50, an alignment camera device 60, a linear encoder 70, a control device 80, a detection optical system member, and the like. . An XY table 20 that is driven and controlled along the X-axis direction and the Y-axis direction (XY plane) of the pedestal 10 is provided on the pedestal 10.

  The XY table 20 is controlled to move in the X direction and the Y direction. In addition, although a ball screw, a linear motor, etc. are used as a drive means of the XY table 20, these illustration is abbreviate | omitted. On the upper side of the XY table 20, a workpiece 1 to be laser processed is held. A slide frame 30 that is slid in the Y-axis direction while holding the optical system member is provided on the base 10. The XY table 20 is configured to be rotatable in the θ direction about the Z axis. Note that when the amount of movement in the Y-axis direction can be sufficiently secured by the slide frame 30, the XY table 20 may be configured to only move in the X-axis direction. In this case, the XY table 20 may have an X-axis table configuration.

  The slide frame 30 is attached to a movable table provided at four corners on the base 10. The slide frame 30 is controlled to move in the Y direction by this moving table. A vibration isolation member (not shown) is provided between the base plate 31 and the moving table. A laser generator 40, an optical system member 50, and a control device 80 are installed on the base plate 31 of the slide frame 30. The optical system member 50 is constituted by a combination of a mirror and a lens, and divides the laser beam generated by the laser generator 40 into four lines and guides it onto the work 1 on the XY table 20. Note that the number of divisions of the laser light is not limited to four, but may be two or more.

  The alignment camera device 60 acquires images near the both end portions (front and rear edge portions in the X-axis direction) of the work 1 on the XY table 20. An image acquired by the alignment camera device 60 is output to the control device 80. The control device 80 stores the image from the alignment camera device 60 in the database unit together with the ID data of the workpiece 1 and uses it for the subsequent alignment processing of the workpiece 1.

  The linear encoder 70 includes a scale member and a detection unit provided on the side surface of the X-axis movement table of the XY table 20. The detection signal of the linear encoder 70 is output to the control device 80. The control device 80 detects the moving speed (moving frequency) in the X-axis direction of the XY table 20 based on the detection signal from the linear encoder 70 and controls the output (laser frequency) of the laser generator 40.

  The optical system member 50 is provided on the lower surface side of the base plate 31 as illustrated. Mirrors 33 and 35 for guiding laser light emitted from the laser generator 40 to the optical system member 50 are provided on the base plate 31. The laser light emitted from the laser generator 40 is reflected by the mirror 33 toward the mirror 35, and the mirror 35 receives the reflected laser light from the mirror 33 through the through hole provided in the base plate 31. Lead to 50. The laser light emitted from the laser light generating device 40 may have any configuration as long as the laser light is configured to be introduced from above into the optical system member 50 through a through hole provided in the base plate 31. It may be. For example, the laser generator 40 may be provided on the upper side of the through hole, and the laser beam may be directly guided to the optical system member 50 through the through hole.

  FIG. 2 is a diagram showing a detailed configuration of the optical system member 50. Although the actual configuration of the optical system member 50 is complicated, the illustration is simplified here for the sake of simplicity. FIG. 2 is a view of the inside of the optical system member 50 as viewed from the −X axis direction of FIG. 1. As shown in FIG. 2, the base plate 31 has a through hole 37 for introducing the laser beam reflected by the mirror 35 into the optical system member 50. A phase type diffractive optical element (DOE) 500 that converts laser light having a Gaussian intensity distribution into laser light having a top hat intensity distribution is provided directly below the through hole 37.

  The laser light converted into laser light having a top hat intensity distribution (top hat beam) by the DOE 500 is branched into a reflected beam and a transmitted beam by the half mirror 511, and the reflected beam is transmitted to the right half mirror 512. Advances toward the reflective mirror 524 in the downward direction. The beam reflected by the half mirror 511 is further split into a reflected beam and a transmitted beam by the half mirror 512, and the reflected beam travels toward the lower reflecting mirror 522, and the transmitted beam travels toward the right reflecting mirror 521. The beam that has passed through the half mirror 512 is reflected by the reflecting mirror 521, and is irradiated onto the work 1 through the condensing lens 541 in the downward direction. The beam reflected by the half mirror 512 is reflected by the reflection mirrors 522 and 523 and is irradiated onto the workpiece 1 through the condensing lens 542 in the downward direction. The beam transmitted through the half mirror 511 is reflected by the reflection mirror 524 and travels in the left direction. The beam reflected by the reflection mirror 524 is branched into a reflection beam and a transmission beam by the half mirror 513, the reflection beam travels toward the reflection mirror 526 in the downward direction, and the transmission beam travels toward the reflection mirror 528 in the left direction. The beam reflected by the half mirror 513 is reflected by the reflection mirrors 526 and 527 and is irradiated onto the work 1 through the condensing lens 543 in the downward direction. The beam that has passed through the half mirror 513 is reflected by the reflecting mirror 528, and is irradiated onto the work 1 through the condensing lens 544 in the downward direction.

  The top hat beam converted by the DOE 500 is transmitted and reflected by the above-described half mirrors 511 to 513 and the reflection mirrors 521 to 528 and guided to the condenser lenses 541 to 544. At this time, the optical path lengths from the DOE 500 to the condenser lenses 541 to 544 are set to be equal. That is, the optical path length from when the beam reflected by the half mirror 511 passes through the half mirror 512 to be reflected by the reflection mirror 521 and reaches the condenser lens 541, and the beam reflected by the half mirror 511 is the half mirror 512 and the reflection mirror 522. , 523, the optical path length until reaching the condenser lens 542, and the beam that has passed through the half mirror 511 are reflected by the reflection mirror 523, half mirror 513, and reflection mirrors 526 and 527, respectively, to the condenser lens 543. The optical path length until the beam reaches the condensing lens 544 is reflected by the reflection mirror 523, reflected by the reflection mirror 523, reflected by the reflection mirror 528, and reaches the condenser lens 544, respectively. Are equal distances. Accordingly, even if the DOE 500 is arranged immediately before the beam is branched, the laser light having the top hat intensity distribution can be similarly guided to the condenser lenses 541 to 544.

  The shutter mechanisms 531 to 534 block the emission of laser light when the laser light emitted from the condenser lenses 541 to 544 of the optical system member 50 is detached from the work 1. The autofocus length measuring systems 52 and 54 are composed of a detection light irradiation laser and an autofocus photodiode (not shown), and are reflected from the surface of the work 1 in the light irradiated from the detection light irradiation laser. The reflected light is received, and the condensing lenses 541 to 544 in the optical system member 50 are driven up and down in accordance with the amount of reflected light to adjust the height relative to the work 1 (the focus of the condensing lenses 541 to 544). The focus adjustment drive mechanism is not shown.

  FIG. 3 is a schematic diagram showing the configuration of the detection optical system member. As shown in FIGS. 1 and 3, the detection optical system member includes beam samplers 92 and 93, a high-speed photodiode 94, and an optical axis inspection CCD camera 96. The beam samplers 92 and 93 are provided in the optical path of laser light introduced into the optical system member 50. In this embodiment, it is provided between the laser generator 40 and the reflection mirror 33. The beam samplers 92 and 93 are elements that sample a part of the laser beam (for example, about 10% of the laser beam or less) and branch and output it to the outside. The high-speed photodiode 94 is disposed so as to receive a part (sampling beam) of the laser beam branched and output by the beam sampler 92 near the center of the light receiving surface. An output signal corresponding to the intensity of the laser light detected by the high speed photodiode 94 is output to the control means 80. The optical axis inspection CCD camera 96 is arranged so as to receive a part (sampling beam) of the laser beam branched and output by the beam sampler 93 near the center of the light receiving surface. The image captured by the optical axis inspection CCD camera 96 is output to the control means 80. The optical axis inspection CCD camera 96 may capture an image indicating the position of the laser light applied to the high-speed photodiode 94 and output the image to the control means 80.

  The control device 80 detects the moving speed (moving frequency) of the XY table 20 in the X-axis direction based on the detection signal from the linear encoder 70, controls the output (laser frequency) of the laser generator 40, and is a high-speed photodiode. 94 and the signal output from the optical axis inspection CCD camera 96 are used to detect missing pulses of the laser light emitted from the laser generator 40, or based on the amount of optical axis deviation of the laser light. The emission conditions are controlled, and the arrangement of the reflection mirrors 33 and 35 for introducing the laser light in the optical system member 50 is feedback-controlled.

  FIG. 4 is a block diagram showing details of processing of the control device 80. The control device 80 includes a branching unit 81, a missing pulse determining unit 82, an alarm generating unit 83, a reference CCD image storage unit 84, an optical axis deviation amount measuring unit 85, and a laser controller 86. The branching unit 81 branches the detection signal (clock pulse) of the linear encoder 70 and outputs it to the laser controller 86 at the subsequent stage.

  The pulse missing determination means 82 receives an output signal (diode output) corresponding to the laser light intensity from the high-speed photodiode 94 and a detection signal (clock pulse) output from the branching means 81, and based on this, the laser light Determine missing pulses. FIG. 5 is a diagram showing an example of the operation of the missing pulse determination means 82. 5A is an example of a detection signal (clock pulse) output from the branching means 81, and FIG. 5B is an output signal (diode corresponding to the laser light intensity output from the high-speed photodiode 94. FIG. 5C shows an example of an alarm signal output by the missing pulse determination means 82 when a missing pulse is detected.

  As shown in FIG. 5, the pulse missing determining means 82 determines whether or not the diode output value is equal to or greater than a predetermined threshold Th using the falling edge of the clock pulse from the branching means 81 as a trigger signal. When the diode output value is smaller than the threshold value Th, a high level signal is output to the alarm generating means 83. The alarm generating unit 83 notifies the outside of the alarm indicating that a pulse missing has occurred when the signal from the pulse missing judging unit 82 changes from a low level to a high level. The alarm is notified by various methods such as image display and pronunciation. The occurrence of an alarm allows the operator to recognize that a pulse drop has occurred. If this alarm occurs frequently, it means that the performance of the laser generator has deteriorated or has reached the end of its life.

  The reference CCD image storage means 84 stores a reference CCD image 84a as shown in FIG. The reference CCD image 84a shows an image in a state where the laser beam is received at the center of the light receiving surface of the CCD camera 96 for optical axis inspection. The optical axis inspection CCD camera 96 outputs an inspection image 85a as shown in FIG. The optical axis deviation amount measuring means 85 captures the inspected image 85a from the optical axis inspection CCD camera 96, compares it with the reference CCD image 84a, measures the optical axis deviation amount, and calculates the deviation amount by the laser. Output to the controller 86. For example, when an image such as the inspected image 85a shown in FIG. 4 is output from the optical axis inspection CCD camera 96, the optical axis deviation measuring means 85 compares the X axis and the Y axis. The amount of direction deviation is measured and output to the laser controller 86. The laser controller 86 introduces the laser beam into a device related to the optical axis of the laser beam, that is, the emission condition of the laser generator 40 and the optical system member 50 so that the inspected image 85a and the reference CCD image 84a coincide. The arrangement and the like of the reflection mirrors 33 and 35 are adjusted by feedback.

  In the above-described embodiment, the case where the optical axis shift and the missing pulse of the laser beam are inspected has been described. However, the pulse state of the laser beam is inspected based on the output waveform from the high-speed photodiode 94 as shown in FIG. You may do it. For example, in FIG. 6, the pulse width and pulse height of the laser beam may be measured, and an alarm may be generated when an abnormality occurs in these. The pulse width of the laser light is normal when the period during which the output waveform from the high-speed photodiode 94 is equal to or greater than a predetermined value is within a predetermined range, and when it is larger or smaller than this range, the pulse width is abnormal. And outputs an alarm. The pulse height of the laser beam is normal when the maximum value of the output waveform from the high-speed photodiode 94 is within the allowable range, and when it is larger or smaller than this allowable range, the pulse height is abnormal. Judge and output an alarm. As described above, since the laser light is always sampled, the quality of the laser light such as the pulse width and the pulse height (power) can be managed in real time. If the above-described pulse omission occurs frequently, it can be determined that the laser generator 40 is deteriorated or has a lifetime.

  FIG. 7 is a view of the optical system member of FIG. 1 viewed from the lower side (workpiece side). FIG. 7 shows a part of the optical system member 50 and the base plate 31. FIG. 7A is a diagram showing the positional relationship between the optical system member 50 and the base plate 31 shown in FIG. 1, and as shown in the drawing, the end surface (upper end portion in the figure) of the optical system member 50 and the base are shown. The end surface (upper end portion in the figure) of the plate 31 coincides. FIG. 7B is a diagram showing a state in which the optical system member 50 is rotated about 30 degrees counterclockwise with respect to the base plate 31 with the center of the through hole 37 as the rotation axis. FIG. 7C is a view showing a state in which the optical system member 50 is rotated about 45 degrees counterclockwise with respect to the base plate 31 with the center of the through hole 37 as the rotation axis.

  In the solar panel manufacturing apparatus according to this embodiment, the optical system member 50 is configured to be freely rotatable with the center of the through hole 37, which is a laser light introduction hole, as the rotation axis. That is, the rotation of the optical system member 50 that is a branching unit is controlled with the traveling direction of the vertical laser light traveling from the reflection mirror 35 of FIG. 2 through the DOE 500 toward the half mirror 511 as the central axis. This makes it possible to variably control the angle θ formed by the laser beam branching direction and the relative movement direction of the laser beam with respect to the workpiece (vertical direction in FIG. 7). In addition, although the existing techniques, such as a ball screw and a linear motor, are used as a rotational drive means of the optical system member 50, these illustration is abbreviate | omitted.

  As shown in FIG. 7, even when the angle between the laser beam branching direction and the laser beam scanning direction (vertical direction in FIG. 7) is variably controlled, the DOE 500 rotates relative to the relative movement direction of the laser beam. It is configured not to. That is, by using the DOE 500, the irradiation shape of the laser light shows an irradiation shape such as a dotted square as shown in the condensing lenses 541 to 544 in FIG. Therefore, when the DOE 500 is rotated together with the rotation control of the optical system member 50, the dotted squares in the condenser lenses 541 to 544 also rotate according to the rotation amount. When the laser beam is scanned and irradiated in this state, square corners are positioned on both side ridge lines of the scribe line, and the ridge line shows a wavy shape. Therefore, as shown in FIGS. 7B and 7C, scanning is performed as shown in FIGS. 7B and 7C by adopting a configuration in which the DOE 500 is not rotated even if the rotation of the optical system member 50 is controlled as in this embodiment. The direction (vertical direction in FIG. 7) coincides with the left and right sides of the dotted square in the condenser lenses 541 to 544, and both sides of the scribe line can be formed very smoothly, and the optical system member 50 is rotated. Thus, even when the pitch of the scribe lines is appropriately controlled, it is possible to form a scribe line having a smooth ridge line. The DOE 500 can be made independent from the rotation of the optical system member 50 by being directly connected to the base plate 31 in a form separated from the optical system member 50.

  FIG. 8 is a diagram showing the relationship between the rotation amount of the optical system member and the pitch width of the scribe line. 8A shows a state where the optical system member 50 is not rotated as shown in FIG. 7A, and FIG. 8B shows a state where the optical system member 50 is rotated about 30 degrees as shown in FIG. 7B. FIG. 8C is a diagram showing the state of the scribe line when the laser scribing process is performed with the optical system member 50 rotated about 45 degrees as shown in FIG. 7C. If the pitch of the scribe lines in FIG. 8A is P0, the pitch P30 in FIG. 8B is P0 × cos 30 °, and the pitch P45 in FIG. 8C is P0 × cos 45 °. Become. Thus, the solar panel manufacturing apparatus according to this embodiment can variably adjust the pitch of the scribe lines by appropriately adjusting the rotation angle of the optical system member 50.

In the above-described embodiment, only the occurrence of missing pulses is observed, but by acquiring and storing the coordinate data (position data) of the location where the missing pulses have occurred, it is possible to perform scribe line repair processing. It becomes.
In the above-described embodiment, a part of the laser beam (sampling beam) branched and output by the beam sampler 93 is directly received using the CCD camera 96 for optical axis inspection, and the optical beam is processed by image processing. The case where the deviation is inspected has been described. An image showing a state where the laser beam is received at the center of the light receiving surface of the high-speed photodiode 94 is acquired as an inspection image by the CCD camera 96 for optical axis inspection or the split type photodiode. Thus, the optical axis deviation may be inspected.
In the above-described embodiment, the case of inspecting the optical axis deviation and the missing pulse of the laser beam has been described. However, the state of the laser beam is inspected by appropriately combining the optical axis deviation, the missing pulse, the pulse width, and the pulse height. You may make it do.
In the above-described embodiment, the case where the laser beam is irradiated from the surface of the workpiece 1 on which the thin film is formed to form the scribe line (groove) on the thin film is described. However, the laser beam is irradiated from the back surface of the workpiece 1. A scribe line may be formed on the thin film on the workpiece surface.
In the above-described embodiment, the solar panel manufacturing apparatus has been described as an example. However, the present invention can also be applied to an apparatus that performs laser processing, such as an EL panel manufacturing apparatus, an EL panel correction apparatus, and an FPD correction apparatus.

DESCRIPTION OF SYMBOLS 1 ... Work 10 ... Base 20 ... XY table 30 ... Slide frame 31 ... Base plate 33, 35 ... Reflection mirror 37 ... Through-hole 40 ... Laser generator 50 ... Optical system member 500 ... Phase type diffractive optical element (DOE)
511 to 513 ... half mirrors 521 to 528 ... reflection mirrors 531 to 534 ... shutter mechanisms 541 to 544 ... condensing lenses 52 and 54 ... length measurement system 60 for autofocus ... alignment camera device 70 ... linear encoder 80 ... control device 81 ... Branch means 82 ... Pulse missing judgment means 83 ... Alarm generation means 84 ... Reference CCD image storage means 85 ... Optical axis deviation measurement means 86 ... Laser controllers 92, 93 ... Beam sampler 94 ... High-speed photodiode 96 ... Optical axis inspection CCD camera

Claims (3)

In a laser processing method for performing predetermined processing on a workpiece by branching a laser beam into a plurality of laser beams and irradiating the plurality of branched laser beams while moving relative to the workpiece,
Phase type diffractive optical element means is arranged in the optical path before the laser beam is branched to convert the laser beam into a top hat intensity distribution, and each of the plurality of laser beams after conversion is irradiated onto the workpiece. A laser processing method, wherein the laser beam is split into a plurality of beams so that the optical path lengths are the same, and the workpiece is irradiated. In a laser processing apparatus for performing predetermined processing on a workpiece by branching a laser beam into a plurality of laser beams and irradiating the plurality of branched laser beams while moving relative to the workpiece held by a holding means ,
Phase-type diffractive optical element means provided in an optical path before branching of the laser light and converting the laser light into a top hat intensity distribution;
Branch means for branching the laser beam into a plurality of beams and irradiating the workpiece with the same optical path length until the workpiece is irradiated with the plurality of laser beams converted by the phase type diffractive optical element device A laser processing apparatus comprising:   A solar panel manufacturing method using the laser processing method according to claim 1 or the laser processing apparatus according to claim 2 to manufacture a solar panel.

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