CN109048080A - The laser processing of cutter - Google Patents
The laser processing of cutter Download PDFInfo
- Publication number
- CN109048080A CN109048080A CN201811064630.XA CN201811064630A CN109048080A CN 109048080 A CN109048080 A CN 109048080A CN 201811064630 A CN201811064630 A CN 201811064630A CN 109048080 A CN109048080 A CN 109048080A
- Authority
- CN
- China
- Prior art keywords
- cutter
- laser
- blade
- processing
- process equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention proposes a kind of laser processing of cutter comprising following steps: the knife handle of the cutter being fixed on the processing platform of a laser process equipment；Turning roughing is carried out using blade of the laser process equipment to the cutter, to form the first round profile surface of arc；Turning finishing is carried out to the first round profile surface using the laser process equipment；And the first round profile surface is processed by shot blasting using the laser process equipment.Above-mentioned laser processing improves the profile tolerance and surface roughness of blade, and improves processing efficiency.
Description
Technical field
The present invention relates to a kind of laser processing of cutter, especially a kind of laser processing of PCD cutter.
Background technique
Polycrystalline diamond (PCD, Polycrystalline diamond) cutter due to high with hardness, compression strength is high,
The characteristics such as thermal conductivity and wearability are good, so that PCD cutter obtains extensively in the various non-ferrous metals of processing and field of non-metallic materials
Using.Currently, the processing method of traditional PCD cutter is EDM Grinding.However, the knife after above-mentioned processing method processing
Tool profile tolerance is easy to appear serious overproof, and roughness with higher.Meanwhile for the cutter with circular arc type contoured surface,
It is easy to appear boss at the machining profile of above-mentioned processing method, is unable to reach the processing request of cutter.
Summary of the invention
In view of the above situation, it is necessary to a kind of laser processing is provided, to solve the above problems.
A kind of laser processing of cutter, comprising the following steps:
The knife handle of the cutter is fixed on the processing platform of a laser process equipment；
Turning roughing is carried out using blade of the laser process equipment to the cutter, to form the first round of arc
Profile surface；
Turning finishing is carried out to the first round profile surface using the laser process equipment；And
The first round profile surface is processed by shot blasting using the laser process equipment.
The laser processing of above-mentioned cutter carries out turning finishing to blade by laser process equipment, turning slightly adds
Work and polishing, with the first round profile surface of processing blades, the laser processing instead of traditional EDM Grinding method,
The profile tolerance and surface roughness of blade are improved, and improves processing efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the blade of the cutter of an embodiment of the present invention.
Fig. 2 is the flow chart of the laser processing of the cutter of an embodiment of the present invention.
Main element symbol description
| Blade | 100 |
| First round profile surface | 10 |
| Second contoured surface | 20 |
| Plane | 30 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
It should be noted that it can be directly to separately when an element is considered as " connection " another element
One element may be simultaneously present the element being centrally located.When an element is considered as " setting exists " another element,
It, which can be, is set up directly on another element or may be simultaneously present the element being centrally located.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Please refer to Fig. 1 and Fig. 2, the present invention provide it is a kind of using laser process equipment (not shown) to PCD cutter into
The laser processing of the cutter of row preparation processing.The blade 100 that above-mentioned PCD cutter has knife handle and is set on knife handle.This
In embodiment, blade 100 is made of PCD material.
Please refer to Fig. 1 and Fig. 2, the better embodiment of the laser processing of cutter of the present invention includes following step
It is rapid:
Step S101: a PCD composite sheet is cut into multiple blades 100.
Specifically, the round PCD composite sheet of one piece of diameter 58mm is cut into using a wire cutting machine (not shown) multiple
Blade 100, wherein the PCD granularity of the PCD composite sheet be 10um, blade 100 with a thickness of 2-4mm.
Step S102: blade 100 is soldered on a knife handle.
Specifically, sanding and polishing is carried out using blade 100 of the grinding apparatus (not shown) to preparation and deburring is handled, then
By after polishing blade 100 and knife handle be put into alcoholic solution, and blade 100 and knife handle are started the cleaning processing simultaneously using brush
It dries spare；Finally, low temperature fluxes are applied in the cutter groove of knife handle and a blade 100 is placed in corresponding cutter groove,
Then by knife handle and blade be placed into a vacuum welding pick in and blade 100 is soldered on knife handle.Wherein, vacuum welding picks
Temperature control parameter is as follows: welding temperature rises to 500 DEG C of used time 4min from room temperature, and keeps the temperature 4min, then rises to 750 DEG C of used time 5min,
5min is kept the temperature again, is then cooled to 400 DEG C of used time 8min, is finally cooled to room temperature.
Step S103: the knife handle of cutter is fixed on the processing platform of a laser process equipment.
Specifically, the knife handle of the cutter after soldering is fixed on the processing platform of laser process equipment.Preferably,
The laser process equipment is five axis laser machines, and power bracket is 10w~100W, for example, laser process equipment model can be
20 type laser machine of DMG-laser.
Step S104: carrying out turning roughing to the blade 100 of cutter using laser process equipment, to form the of arc
One contoured surface.
When turning roughing, rotation C axis band 100 high speed rotation of cutting blade of laser process equipment, X-axis, Y-axis are according to profile
Trajectory coordinates are continuously slowly fed, and Z axis moves up and down in the case where guaranteeing laser focal, and the inclination processing of swing arm A axis needs
The deflection angle wanted removes excess stock, reaches so that laser beam is acted on after transmission and focusing on the surface of blade 100
To being integrally machined molding purpose.
Specifically, the first processing program is preset, sets profile traces coordinate in first processing program, simultaneously
Axial relief angle is set as 8 degree, dextrorotation C axis is 89.9 degree.Using laser process equipment according to above-mentioned first processing program to being located at
The blade 100 of cutter on processing platform carries out turning roughing to form the first round profile surface 10 of blade, first round profile surface 10
Side that is arc-shaped and being located at 100 end of blade.
Wherein, the machined parameters of laser process equipment are as follows in first processing program: single cutting-in is 0.01mm, point
10~15 repetitions are processed, and cutting width is 0.04mm, and focal length 87.5mm, incident angle is 6 degree, and pulsewidth is 0.8 microsecond, and frequency is
3000HZ, rate value 15mm/min, laser power 85W.
Step S105: turning finishing is carried out to first round profile surface 10 using laser process equipment.
Specifically, the second processing program is preset, sets profile traces coordinate in second processing program, simultaneously
Axial relief angle is set as 8 degree, dextrorotation C axis is 89.9 degree.Using the laser process equipment according to above-mentioned second processing program pair
The first round profile surface carries out turning finishing.
Wherein, the machined parameters of laser process equipment are as follows in second processing program: single cutting-in is 0.004mm,
10~15 repetitions are divided to process, cutting width is 0.02mm, and focal length 87.5mm, incident angle is 6 degree, and pulsewidth is 0.8 microsecond, frequency
For 3000HZ, rate value 15mm/min, laser power 60W.
Step S106: first round profile surface 10 is processed by shot blasting using laser process equipment.
Specifically, third processing program is preset, axial relief angle is set in the third processing program as 8 degree, dextrorotation C
Axis is 89.9 degree.First round profile surface is processed by shot blasting according to the third processing program using the laser process equipment.
Wherein, the machined parameters of laser process equipment are as follows in the third processing program: single cutting-in is 0.002mm,
Cutting width is 0.01mm, and focal length 87.5mm, incident angle is 6 degree, and pulsewidth is 0.8 microsecond, and frequency 3000HZ, rate value is
15mm/min, laser power 30W.
Step S107: according to above-mentioned steps S104 to step S105, the second of laser process equipment processing blades 100 is used
Contoured surface 20, the second contoured surface 20 are arc-shaped.
Specifically, the second contoured surface 20 is located at 100 end of blade and is oppositely arranged with first round profile surface 10, first round profile surface
10 and second have a plane 30 between contoured surface 20.
It is appreciated that in other embodiments, step S101~S103 can be omitted, direct using laser process equipment
Cutting processing is carried out to the blade 100 being located on processing platform.
It is appreciated that in other embodiments, if blade 100 only has a first round profile surface 10, step S107 can be with
It omits.
In addition, through detecting, to the first round profile surface 10 and the second contoured surface 20 of the blade 100 after processing according to the method described above
Profile tolerance within positive and negative 0.01um, surface roughness 0.2um.Meanwhile in other embodiments, the laser of cutter adds
Work method and above-mentioned better embodiment the difference is that: step S106 laser power is adjusted to respectively 60W, 50W,
40W, 30W, 20W and 15W, and through detecting, the first round profile surface 10 and second of the blade 100 prepared in above-mentioned other embodiment
20 surface roughness of contoured surface is respectively 1.023um, 0.852um, 0.352um, 0.204um, 0.220um and 0.302um, thus
Illustrate during polishing treatment, laser power is 20W~30W, and the surface roughness of the blade 100 after can making processing reaches
Most preferably.
The laser processing of above-mentioned cutter carries out turning finishing to blade by laser process equipment, turning slightly adds
Work and polishing, with the first round profile surface 10 of processing blades 100 and the second contoured surface 20, the laser processing is instead of traditional
EDM Grinding method, improves the profile tolerance and surface roughness of blade, and improves processing efficiency.
In addition, those skilled in the art can also do other variations in spirit of that invention, certainly, these are smart according to the present invention
The variation that mind is done, should all be included in scope of the present invention.
Claims (10)
1. a kind of laser processing of cutter, comprising the following steps:
The knife handle of the cutter is fixed on the processing platform of a laser process equipment；
Turning roughing is carried out using blade of the laser process equipment to the cutter, to form the first profile of arc
Face；
Turning finishing is carried out to the first round profile surface using the laser process equipment；And
The first round profile surface is processed by shot blasting using the laser process equipment.
2. the laser processing of cutter as described in claim 1, it is characterised in that: using the laser process equipment to knife
The blade of tool carries out the rough machined step of turning specifically: presets the first processing program, sets in first processing program
Profile traces coordinate is determined, concurrently setting axial relief angle is 8 degree, and dextrorotation C axis is 89.9 degree, is pressed using the laser process equipment
Turning roughing is carried out to form the blade to the blade being located on the processing platform according to first processing program
First round profile surface, the first round profile surface is located at the side of blade end.
3. the laser processing of cutter as claimed in claim 2, it is characterised in that: swash described in first processing program
The machined parameters of light process equipment are as follows: single cutting-in is 0.01mm, and cutting width is 0.04mm, focal length 87.5mm, incident angle
It is 6 degree, pulsewidth is 0.8 microsecond, frequency 3000HZ, laser power 85W.
4. the laser processing of cutter as described in claim 1, it is characterised in that: using the laser process equipment to institute
State the step of first round profile surface carries out turning finishing specifically: preset the second processing program, second processing program
In set profile traces coordinate, concurrently set axial relief angle be 8 degree, dextrorotation C axis be 89.9 degree, using it is described laser machine set
It is standby that turning finishing is carried out to the first round profile surface according to second processing program.
5. the laser processing of cutter as claimed in claim 4, it is characterised in that: swash described in second processing program
The machined parameters of light process equipment are as follows: single cutting-in is 0.004mm, and cutting width is 0.02mm, focal length 87.5mm, incident angle
It is 6 degree, pulsewidth is 0.8 microsecond, frequency 3000HZ, laser power 60W.
6. the laser processing of cutter as described in claim 1, it is characterised in that: using the laser process equipment to institute
State the step of first round profile surface is processed by shot blasting specifically: third processing program is preset, in the third processing program
Axial relief angle is set as 8 degree, dextrorotation C axis is 89.9 degree, using the laser process equipment according to the third processing program pair
The first round profile surface is processed by shot blasting.
7. the laser processing of cutter as claimed in claim 6, it is characterised in that: swash described in the third processing program
The machined parameters of light process equipment are as follows: single cutting-in is 0.002mm, and cutting width is 0.01mm, focal length 87.5mm, incident angle
It is 6 degree, pulsewidth is 0.8 microsecond, frequency 3000HZ, laser power 30W.
8. the laser processing of cutter as described in claim 1, it is characterised in that: the laser processing of the cutter is also
The following steps are included:
After being processed by shot blasting to the first round profile surface, the second contoured surface of the blade, institute are processed according to above-mentioned steps
It is arc-shaped to state the second contoured surface, second contoured surface is located at the blade end and is oppositely arranged with the first round profile surface,
There is a plane between the first round profile surface and second contoured surface.
9. the laser processing of cutter as described in claim 1, it is characterised in that: the laser processing of the cutter is also
The following steps are included:
One PCD composite sheet is cut into multiple blades；
The blade is soldered on the knife handle.
10. the laser processing of cutter as claimed in claim 9, it is characterised in that: the blade is soldered to the knife
Step on handle specifically: carry out sanding and polishing using the blade of the grinding apparatus to preparation and deburring is handled, then will
The blade and knife handle after polishing are put into alcoholic solution, and are started the cleaning processing using a brush to the blade and knife handle
And it dries spare；Low temperature fluxes are applied in the cutter groove of the knife handle and the blade is placed in corresponding cutter groove；With
And by the knife handle and the blade be placed into a vacuum welding pick in and the blade is soldered on the knife handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811064630.XA CN109048080A (en) | 2018-09-12 | 2018-09-12 | The laser processing of cutter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811064630.XA CN109048080A (en) | 2018-09-12 | 2018-09-12 | The laser processing of cutter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109048080A true CN109048080A (en) | 2018-12-21 |
Family
ID=64760409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811064630.XA Pending CN109048080A (en) | 2018-09-12 | 2018-09-12 | The laser processing of cutter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109048080A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719360A (en) * | 2019-02-26 | 2019-05-07 | 深圳市鑫金泉钻石刀具有限公司 | A kind of processing method of Whole PC D multiple-cutting-edge tool |
| CN110480188A (en) * | 2019-08-29 | 2019-11-22 | 燕山大学 | A kind of processing method of nano twin crystal micro cutter of diamond rapid shaping |
| CN111375901A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Method for machining cutter through laser turning and milling combination |
| CN113070564A (en) * | 2021-04-19 | 2021-07-06 | 河南景链新材料有限公司 | Method for rapidly processing polycrystalline diamond compact by using laser |
| CN113427140A (en) * | 2020-03-21 | 2021-09-24 | 赣州市普希德工具有限公司 | Five-axis linkage laser processing equipment for processing PCD (polycrystalline Diamond) cutter |
| CN114311963A (en) * | 2021-12-24 | 2022-04-12 | 西安理工大学 | Textured wear-resistant doctor blade of gravure printing machine and preparation method |
| CN114453730A (en) * | 2022-03-09 | 2022-05-10 | 西安中科微精光子科技股份有限公司 | Laser processing method of hemispherical revolving body |
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| CN203725867U (en) * | 2014-01-14 | 2014-07-23 | 常州市恒晁工具制造有限公司 | PCD (Poly Crystal Diamond) milling cutter |
| CN105149627A (en) * | 2013-10-18 | 2015-12-16 | 安徽大学 | Cylindrical turning bionic cutter |
| CN105269284A (en) * | 2015-09-09 | 2016-01-27 | 无锡国宏硬质合金模具刃具有限公司 | Ultra-precise efficient preparing technology method of inward-concave PCD cutter with complex outline |
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| CH255494A (en) * | 1946-08-09 | 1948-06-30 | Olivier Charles | Finishing process using a diamond tool. |
| CN105149627A (en) * | 2013-10-18 | 2015-12-16 | 安徽大学 | Cylindrical turning bionic cutter |
| CN203725867U (en) * | 2014-01-14 | 2014-07-23 | 常州市恒晁工具制造有限公司 | PCD (Poly Crystal Diamond) milling cutter |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109719360A (en) * | 2019-02-26 | 2019-05-07 | 深圳市鑫金泉钻石刀具有限公司 | A kind of processing method of Whole PC D multiple-cutting-edge tool |
| CN110480188A (en) * | 2019-08-29 | 2019-11-22 | 燕山大学 | A kind of processing method of nano twin crystal micro cutter of diamond rapid shaping |
| CN113427140A (en) * | 2020-03-21 | 2021-09-24 | 赣州市普希德工具有限公司 | Five-axis linkage laser processing equipment for processing PCD (polycrystalline Diamond) cutter |
| CN111375901A (en) * | 2020-03-25 | 2020-07-07 | 广东工业大学 | Method for machining cutter through laser turning and milling combination |
| WO2021190532A1 (en) * | 2020-03-25 | 2021-09-30 | 广东工业大学 | Method for laser turning-milling complex machining of tool |
| CN111375901B (en) * | 2020-03-25 | 2021-10-15 | 广东工业大学 | Method for machining cutter through laser turning and milling combination |
| CN113070564A (en) * | 2021-04-19 | 2021-07-06 | 河南景链新材料有限公司 | Method for rapidly processing polycrystalline diamond compact by using laser |
| CN114311963A (en) * | 2021-12-24 | 2022-04-12 | 西安理工大学 | Textured wear-resistant doctor blade of gravure printing machine and preparation method |
| CN114453730A (en) * | 2022-03-09 | 2022-05-10 | 西安中科微精光子科技股份有限公司 | Laser processing method of hemispherical revolving body |
| CN114453730B (en) * | 2022-03-09 | 2024-04-05 | 西安中科微精光子科技股份有限公司 | Laser processing method of hemispherical revolving body |
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