CN108788498A - Laser cutting machine method for punching, device and electronic equipment - Google Patents
Laser cutting machine method for punching, device and electronic equipment Download PDFInfo
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- CN108788498A CN108788498A CN201810999863.2A CN201810999863A CN108788498A CN 108788498 A CN108788498 A CN 108788498A CN 201810999863 A CN201810999863 A CN 201810999863A CN 108788498 A CN108788498 A CN 108788498A
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- plank
- hole pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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Abstract
The present invention provides a kind of laser cutting machine method for punching, device and electronic equipments, are related to the technical field of laser beam perforation, including：Obtain the thickness parameter of plank to be perforated；Determine at least one hole pattern corresponding with thickness parameter；Wherein, each hole pattern includes multiple perforation parameters；Laser cutting machine is controlled according to the multiple perforation parameter at least one hole pattern into eleven punch 11.Invention not only avoids because cause plank to punch out-of-flatness to punch this plank using same a collection of parameter in perforation procedure, meanwhile, also save resource.
Description
Technical field
The present invention relates to laser perforation techniques fields, more particularly, to a kind of laser cutting machine method for punching, device and electricity
Sub- equipment.
Background technology
When being perforated using laser cutting machine, needs to adjust the focus point of laser head, the distance apart from plank and shine
Three parameters of power, under normal circumstances according to the difference of plate thickness, staff can adjust above three parameter, laser is made to cut
Cutting mill uses fixed-focus, spacing and fixed power into eleven punch 11.
It is fixed in focus point, the distance apart from plank and luminous power however, in conjunction with shown in Fig. 1, with wearing
The thickness of the progress in hole, plank is gradually thinning, and the intensity of the light sprayed at this time from laser head is for thinning plank, undoubtedly
It is a kind of wasting of resources；In addition, being worn in the case that lower part waits being punched in the upper part of plank, laser head is apart from plank
Distance farther out, be easy to make the section out-of-flatness of perforation inner wall up and down.
Invention content
In view of this, the purpose of the present invention is to provide laser cutting machine method for punching, device and electronic equipment, not only keep away
Exempt to cause plank to punch out-of-flatness to punch this plank using same a collection of parameter because of in perforation procedure, meanwhile, also save
About resource.
In a first aspect, an embodiment of the present invention provides a kind of laser cutting machine method for punching, including：
Obtain the thickness parameter of plank to be perforated；
Determine at least one hole pattern corresponding with the thickness parameter；Wherein, each hole pattern includes
Multiple perforation parameters；
The laser cutting machine is controlled to be worn according to the multiple perforation parameter at least one hole pattern
Hole.
With reference to first aspect, an embodiment of the present invention provides the first possible embodiments of first aspect, wherein really
Fixed at least one hole pattern corresponding with the thickness parameter, including：
Based on the thickness parameter, the plank to be perforated is divided into level；
The with different levels quantity of plank to be perforated stroke is stated according to described, determines at least one hole pattern.
With reference to first aspect, an embodiment of the present invention provides second of possible embodiments of first aspect, wherein root
With different levels quantity is drawn according to the plank to be perforated, determines at least one hole pattern, including：
When it is the first preset value that the plank to be perforated, which draws with different levels quantity, start the first hole pattern；
When it is the second preset value that the plank to be perforated, which draws with different levels quantity, start the second hole pattern and institute successively
State the first hole pattern；
When it is third preset value that the plank to be perforated, which draws with different levels quantity, start third hole pattern, institute successively
State the second hole pattern and first hole pattern.
With reference to first aspect, an embodiment of the present invention provides the third possible embodiments of first aspect, wherein institute
Multiple perforation parameters are stated to be luminous intensity parameter, go out light frequency parameter, focal position parameter, delay parameter, air pressure parameter.
With reference to first aspect, an embodiment of the present invention provides the 4th kind of possible embodiments of first aspect, wherein obtains
The thickness parameter of plank to be perforated is taken, including：
The thickness parameter of plank to be perforated is obtained by the thickness measurement sensor installed on plank to be perforated.
Second aspect, the embodiment of the present invention also provide a kind of laser cutting machine punching machine, including：
Acquisition module, the thickness parameter for obtaining plank to be perforated；
Determining module, for determining at least one hole pattern corresponding with the thickness parameter；Wherein, each described to wear
Hole pattern includes multiple perforation parameters；
Control module is worn for controlling the laser cutting machine according to the multiple at least one hole pattern
Hole parameter is into eleven punch 11.
In conjunction with second aspect, an embodiment of the present invention provides the first possible embodiments of second aspect, wherein institute
Determining module is stated, including：Divide submodule and pattern determination sub-module；
The plank to be perforated is divided level by the division submodule for being based on the thickness parameter；
The pattern determination sub-module determines at least one for drawing with different levels quantity according to the plank to be perforated
Hole pattern.
In conjunction with second aspect, an embodiment of the present invention provides second of possible embodiments of second aspect, wherein institute
Pattern determination sub-module is stated, is specifically used for：When it is the first preset value that the plank to be perforated, which draws with different levels quantity, start the
One hole pattern；When it is the second preset value that the plank to be perforated, which draws with different levels quantity, start the second hole pattern successively
With first hole pattern；When it is third preset value that the plank to be perforated, which draws with different levels quantity, start third successively
Hole pattern, second hole pattern and first hole pattern.
The third aspect, the embodiment of the present invention also provide a kind of electronic equipment, including memory, processor, the memory
In be stored with the computer program that can be run on the processor, the processor is realized when executing the computer program
The step of stating embodiment any one of them method.
Fourth aspect, the embodiment of the present invention also provide the computer for the non-volatile program code that can perform with processor
Readable medium, said program code make the processor execute described any the method for embodiment.
The embodiment of the present invention brings following advantageous effect：By obtaining the thickness parameter of plank to be perforated, determine and thickness
Spend the corresponding at least one hole pattern of parameter, wherein each hole pattern includes multiple perforation parameters, control laser cutting
Machine according to the multiple perforation parameter at least one hole pattern into eleven punch 11, the present invention for different thickness parameters,
Determining has at least one hole pattern of different perforation parameters, not only avoids because using same group of parameter in perforation procedure
Plank is caused to punch out-of-flatness to punch this plank, meanwhile, also save resource.
Other features and advantages of the present invention will illustrate in the following description, also, partly become from specification
It obtains it is clear that understand through the implementation of the invention.The purpose of the present invention and other advantages are in specification, claims
And specifically noted structure is realized and is obtained in attached drawing.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment cited below particularly, and coordinate
Appended attached drawing, is described in detail below.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, other drawings may also be obtained based on these drawings.
Fig. 1 is the schematic diagram that laser cutting machine cuts plank；
Fig. 2 is the flow chart of laser cutting machine method for punching provided in an embodiment of the present invention；
Fig. 3 is the method flow diagram of determining hole pattern provided in an embodiment of the present invention；
Fig. 4 is that plank provided in an embodiment of the present invention draws with different levels schematic diagram；
Fig. 5 is the schematic diagram of the corresponding hole pattern of the first preset value provided in an embodiment of the present invention；
Fig. 6 is the schematic diagram of the corresponding hole pattern of the second preset value provided in an embodiment of the present invention；
Fig. 7 is the schematic diagram of the corresponding hole pattern of third preset value provided in an embodiment of the present invention；
Fig. 8 is the structure chart of laser cutting machine punching machine provided in an embodiment of the present invention；
Fig. 9 is the structure chart of determining module provided in an embodiment of the present invention.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention
Technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
In conjunction with shown in Fig. 2, an embodiment of the present invention provides a kind of laser cutting machine method for punching, including：
S110：Obtain the thickness parameter of plank to be perforated.
Specifically, the thickness parameter of plank to be perforated is obtained by the thickness measurement sensor installed on plank to be perforated.
Thickness measurement sensor is voltage sensor, and voltage sensor has upper and lower two pole plates, and plank to be perforated is placed on two up and down
In pole plate, the thickness parameter of plank to be perforated is obtained by the data of voltage.
S120：Determine at least one hole pattern corresponding with the thickness parameter.Wherein, in each hole pattern
Including multiple perforation parameters.
Wherein, hole pattern can have a plurality of types of, such as：Wherein, hole pattern can be to burn plank following table
The pattern used when face, hole pattern can be to melt the pattern used when plank middle layer, and hole pattern can be explosion plate
The pattern used when material upper surface.Certainly, what is be illustrated and described herein is only exemplary, not as limitation.This
Invention can determine the piercing die of a kind of hole pattern or two kinds of hole patterns or three kinds and three kinds or more according to thickness parameter
Formula.
Specifically, in conjunction with shown in Fig. 3, step S120 includes：
S1201：Based on thickness parameter, the plank to be perforated is divided into level.
In conjunction with shown in Fig. 4, plank can be divided into different levels, such as：Upper surface, middle layer and lower surface, work as laser
When cutting machine punches plank, upper surface, middle layer and the lower surface of punching plank are actually needed.Due to needing to punch plank
The required energy of different levels is different, then parameter of perforating is also different.Certainly, in all examples being illustrated and described herein,
Any occurrence should be construed as merely illustrative, not as limitation, therefore, other examples of exemplary embodiment
There can be different values.For example, plank can be divided into different levels, upper surface, upper middle level, centre according to different thickness
Layer, lower middle level and lower surface, plank are segmented into 1,2,3,4,5 etc. layers.This present invention is not limited.Certainly, level is drawn
That divides is more, then is perforated using different penetrating parameters with thickness change laser cutting machine, so that laser cutting machine is worn
The section in hole is more smooth.
So when known to the thickness parameter of plank to be perforated, plank to be perforated can be divided not according to thickness difference
Same level.Such as：When plank to be perforated is very thin, a level can be divided, when plank to be perforated is very thick, can be divided
Three levels.
S1202：With different levels quantity is drawn according to plank to be perforated, determines at least one hole pattern.
Specifically,
When it is the first preset value that plank to be perforated, which draws with different levels quantity, start the first hole pattern；
When it is the second preset value that plank to be perforated, which draws with different levels quantity, starts the second hole pattern and first successively and wear
Hole pattern；
When it is third preset value that plank to be perforated, which draws with different levels quantity, startup third hole pattern, second are worn successively
Hole pattern and the first hole pattern.
Specifically, when it is the first preset value that plank to be perforated, which draws with different levels quantity, the first preset value can be 1,
Plank i.e. to be perforated is very thin, then uses the first hole pattern.It is the second preset value to draw with different levels quantity when plank to be perforated, the
Two preset values can be 2, then the second hole pattern and the first hole pattern.It is third to draw with different levels quantity when plank to be perforated
Preset value, third preset value can be 3, then use third hole pattern, the second hole pattern and the first hole pattern.
Third hole pattern, the second hole pattern and the first hole pattern include multiple perforation parameters, and perforation parameter can
With including luminous intensity parameter, go out light frequency parameter, focal position parameter, delay parameter, one or more in air pressure parameter.
Wherein, luminous intensity parameter includes：Explosion power, punctured power, peak power, perforation electric current and explosion electric current.
It refers to Blast frequency, and/or point cycle, and/or pulse frequency to go out light frequency parameter.Specifically, work as use
When the first hole pattern, it is pulse frequency to go out light frequency, and when using the second hole pattern, it is point cycle to go out light frequency, when
When using third hole pattern, it is Blast frequency to go out light frequency.It is drawn for different levels quantity with plank to be perforated, when to be perforated
When the with different levels quantity of plank stroke is the first preset value, it is pulse frequency to go out light frequency, when plank to be perforated draws with different levels number
When amount is the second preset value, it is pulse frequency and point cycle to go out light frequency, and it is the to draw with different levels quantity when plank to be perforated
When three preset values, it is pulse frequency, point cycle and Blast frequency to go out light frequency.
Focal position parameter refers to the focal position of laser head, using the jet hole of laser head as zero, when increasing in laser head
When the distance between collimation lens and focusing eyeglass, the focus of laser head moves down, and it is positive burnt, phase to be located at the focus under zero
Anti-, when reducing the distance between two eyeglasses, the focus of laser head moves up, and it is negative coke to be located at the focus in zero.
Delay parameter refers to the extension time under the parameter state.For explosion delay refer to explosion upper surface when
Long, delay and burn-through delay when perforation delay refers to perforation refer to delay when burning lower surface.So explosion is delayed, wears
Hole is delayed and burn-through delay is the address of parameter in varied situations that is delayed.
As an example, in conjunction with shown in Fig. 5, the first hole pattern is shown, in this mode, it is understood that be：
The hole pattern used when plank lower surface is burnt, specifically includes progressive time-parameters as 500 milliseconds, 2 milli of nozzle height parameter
Rice, gaseous species (gas i.e. used in laser cutting machine cutting process, wherein this gaseous species include oxygen or
Person's nitrogen), atmospheric pressure value 9BAR, peak power 100%, duty ratio 60%, pulse frequency 1000Hz, focal position
It is 200 milliseconds, stops light to blow to be 1000 milliseconds for -6 millimeters, burn-through delay.
In conjunction with shown in Fig. 6, it is the hole pattern that the second preset value uses to show that plank to be perforated draws with different levels quantity,
Including：It burns the hole pattern (the first hole pattern) used when plank lower surface and punches the pattern used when plank middle layer
(the second hole pattern), wherein burn the pattern such as Fig. 5 used when plank lower surface, punch the mould used when plank middle layer
Formula (the second hole pattern) includes：15 millimeters of perforation height, perforation gas are oxygen, and perforation air pressure is 2.5BAR, electric current of perforating
It is 100%, punctured power 35%, point cycle 500Hz, focal position is 0 millimeter, and perforation delay is 400 milliseconds.
In conjunction with shown in Fig. 7, it is piercing die used by third preset value to show that plank to be perforated draws with different levels quantity
Formula, including：It burns the pattern (the first hole pattern) used when plank lower surface, punch the pattern used when plank middle layer
The pattern (third hole pattern) used when (the second hole pattern) and explosion plank upper surface.Wherein, plank lower surface is burnt
The pattern of Shi Caiyong punches the pattern that is used when plank middle layer as shown in fig. 6, the pattern that uses of when explosion plank upper surface
(third hole pattern) includes：15 millimeters of Blasting height, blasting fume are oxygen, and explosion air pressure is 5BAR, and explosion electric current is
100%, explosion power is 50%, Blast frequency 5000Hz, and focal position is 0 millimeter, and perforation delay is 200 milliseconds.
By taking Fig. 7 as an example, when the thickness parameter of plank to be perforated is larger, plank to be perforated is divided into three levels, that is, adopt
Three layers of plank to be perforated are punched respectively with the hole pattern of three kinds of different penetrating parameters.When the upper table for breaking plank to be perforated
When face, since thickness is thicker, when plate thickness is thicker, the height of explosion is higher, and with the progress of perforation, plate thickness becomes
It is thin, while height of perforating is lower, last nozzle height continues to reduce.That is with the perforation of plank, the height of nozzle with
Reduction.
Certainly, in all examples being illustrated and described herein, any occurrence should be construed as merely illustrative,
Not as limitation, therefore, other examples of exemplary embodiment can have different values.
S130：Laser cutting machine is controlled according to multiple perforation parameters at least one hole pattern into eleven punch 11.
In summary, laser cutting machine method for punching provided in an embodiment of the present invention, can be by obtaining plank to be perforated
Thickness parameter, determine at least one hole pattern corresponding with thickness parameter, wherein each hole pattern includes multiple wears
Hole parameter, control laser cutting machine is according to the multiple perforation parameter in hole pattern into eleven punch 11, and the present invention is for difference
Thickness parameter, determine have it is different perforation parameters at least one hole pattern, not only avoid because perforation procedure in make
This plank is punched with same group of parameter and plank is caused to punch out-of-flatness, meanwhile, also save resource.
In addition, thickness parameter can be treated perforated sheet metal by the present invention is divided into many levels, by many levels of foundation,
Carry out the successively different pattern of secondary correspondence, that is, it is successively secondary into eleven punch 11, improve the planarization of section.
In conjunction with shown in Fig. 8, the embodiment of the present invention additionally provides a kind of laser cutting machine punching machine, including：Acquisition module
810, determining module 820 and control module 830, wherein
Acquisition module 810, the thickness parameter for obtaining plank to be perforated；
Determining module 820, for determining at least one hole pattern corresponding with the thickness parameter；Each perforation
Pattern includes multiple perforation parameters；
Control module 830, for controlling the laser cutting machine according to described more at least one hole pattern
A perforation parameter is into eleven punch 11.
In summary, laser cutting machine punching machine provided in an embodiment of the present invention, can be by obtaining plank to be perforated
Thickness parameter, determine at least one hole pattern corresponding with thickness parameter, wherein each hole pattern includes multiple wears
Hole parameter, control laser cutting machine is according to the multiple perforation parameter in hole pattern into eleven punch 11, and the present invention is for difference
Thickness parameter, determine have it is different perforation parameters at least one hole pattern, not only avoid because perforation procedure in make
This plank is punched with same group of parameter and plank is caused to punch out-of-flatness, meanwhile, also save resource.
Optionally, in conjunction with shown in Fig. 9, determining module 820, including：Divide submodule 8201 and pattern determination sub-module
8202；Wherein,
Submodule 8201 is divided, for being based on thickness parameter, plank to be perforated is divided into level；
Pattern determination sub-module 8202 determines at least one perforation for drawing with different levels quantity according to plank to be perforated
Pattern.
Optionally, pattern determination sub-module 8202, is specifically used for：It is the to draw with different levels quantity when the plank to be perforated
When one preset value, start the first hole pattern；When it is the second preset value that the plank to be perforated, which draws with different levels quantity, successively
Start the second hole pattern and first hole pattern；It is third preset value to draw with different levels quantity when the plank to be perforated
When, start third hole pattern, second hole pattern and first hole pattern successively.
Optionally, multiple perforation parameters are luminous intensity parameter, go out light frequency parameter, focal position parameter, delay parameter, gas
Press parameter.
Optionally, acquisition module 810 are specifically used for：It is waited for by the thickness measurement sensor acquisition installed on plank to be perforated
The thickness parameter of perforated sheet metal.
The technique effect and preceding method embodiment phase of the device that the embodiment of the present invention is provided, realization principle and generation
Together, to briefly describe, device embodiment part does not refer to place, can refer to corresponding contents in preceding method embodiment.
The embodiment of the present invention additionally provides a kind of electronic equipment, including memory, processor, is stored in the memory
The computer program that can be run on the processor, the processor realize above-described embodiment when executing the computer program
The step of any one of them method.
Wherein, memory may include high-speed random access memory (RAM, Random Access Memory), also may be used
Can further include non-labile memory (non-volatile memory), for example, at least a magnetic disk storage.
Wherein, memory is for storing program, and the processor executes described program after receiving and executing instruction, preceding
The method performed by the device that the stream process that any embodiment of the embodiment of the present invention discloses defines is stated to can be applied in processor,
Or it is realized by processor.
Processor may be a kind of IC chip, the processing capacity with signal.During realization, the above method
Each step can be completed by the instruction of the integrated logic circuit of the hardware in processor or software form.Above-mentioned processing
Device can be general processor, including central processing unit (Central Processing Unit, abbreviation CPU), network processing unit
(Network Processor, abbreviation NP) etc.；It can also be digital signal processor (Digital Signal
Processing, abbreviation DSP), application-specific integrated circuit (Application Specific Integrated Circuit, referred to as
ASIC), ready-made programmable gate array (Field-Programmable Gate Array, abbreviation FPGA) or other are programmable
Logical device, discrete gate or transistor logic, discrete hardware components.It may be implemented or execute in the embodiment of the present invention
Disclosed each method, step and logic diagram.General processor can be microprocessor or the processor can also be to appoint
What conventional processor etc..The step of method in conjunction with disclosed in the embodiment of the present invention, can be embodied directly in hardware decoding processing
Device executes completion, or in decoding processor hardware and software module combination execute completion.Software module can be located at
Machine memory, flash memory, read-only memory, programmable read only memory or electrically erasable programmable memory, register etc. are originally
In the storage medium of field maturation.The storage medium is located at memory, and processor reads the information in memory, in conjunction with its hardware
The step of completing the above method.
Unless specifically stated otherwise, the opposite step of the component and step that otherwise illustrate in these embodiments, digital table
It is not limit the scope of the invention up to formula and numerical value.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustrative, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
Flow chart and block diagram in attached drawing show the system, method and computer journey of multiple embodiments according to the present invention
The architecture, function and operation in the cards of sequence product.In this regard, each box in flowchart or block diagram can generation
A part for a part for one module, section or code of table, the module, section or code includes one or more uses
The executable instruction of the logic function as defined in realization.It should also be noted that in some implementations as replacements, being marked in box
The function of note can also occur in a different order than that indicated in the drawings.For example, two continuous boxes can essentially base
Originally it is performed in parallel, they can also be executed in the opposite order sometimes, this is depended on the functions involved.It is also noted that
It is the combination of each box in block diagram and or flow chart and the box in block diagram and or flow chart, can uses and execute rule
The dedicated hardware based system of fixed function or action is realized, or can use the group of specialized hardware and computer instruction
It closes to realize.
In addition, in the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be electrical connection to be mechanical connection；It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
In the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for description purposes only, and is not understood to indicate or imply relative importance.
The computer program product for the progress laser cutting machine punching machine that the embodiment of the present invention is provided, including store
The computer readable storage medium of the executable non-volatile program code of processor, the instruction that said program code includes are available
In the method described in previous methods embodiment that executes, specific implementation can be found in embodiment of the method, and details are not described herein.Specifically
Computer program product can be cell phone application or computer application program.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description,
The specific work process of device and unit, can refer to corresponding processes in the foregoing method embodiment, and details are not described herein.
In several embodiments provided herein, it should be understood that disclosed systems, devices and methods, it can be with
It realizes by another way.The apparatus embodiments described above are merely exemplary, for example, the division of the unit,
Only a kind of division of logic function, formula that in actual implementation, there may be another division manner, in another example, multiple units or component can
To combine or be desirably integrated into another system, or some features can be ignored or not executed.Another point, it is shown or beg for
The mutual coupling, direct-coupling or communication connection of opinion can be by some communication interfaces, device or unit it is indirect
Coupling or communication connection can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, you can be located at a place, or may be distributed over multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, it can also
It is that each unit physically exists alone, it can also be during two or more units be integrated in one unit.
It, can be with if the function is realized in the form of SFU software functional unit and when sold or used as an independent product
It is stored in the executable non-volatile computer read/write memory medium of a processor.Based on this understanding, of the invention
Technical solution substantially the part of the part that contributes to existing technology or the technical solution can be with software in other words
The form of product embodies, which is stored in a storage medium, including some instructions use so that
One computer equipment (can be personal computer, server or the network equipment etc.) executes each embodiment institute of the present invention
State all or part of step of method.And storage medium above-mentioned includes：USB flash disk, mobile hard disk, read-only memory (ROM, Read-
Only Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can be with
Store the medium of program code.
Finally it should be noted that：Embodiment described above, only specific implementation mode of the invention, to illustrate the present invention
Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, it will be understood by those of ordinary skill in the art that：Any one skilled in the art
In the technical scope disclosed by the present invention, it can still modify to the technical solution recorded in previous embodiment or can be light
It is readily conceivable that variation or equivalent replacement of some of the technical features；And these modifications, variation or replacement, do not make
The essence of corresponding technical solution is detached from the spirit and scope of technical solution of the embodiment of the present invention, should all cover the protection in the present invention
Within the scope of.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. a kind of laser cutting machine method for punching, which is characterized in that including：
Obtain the thickness parameter of plank to be perforated；
Determine at least one hole pattern corresponding with the thickness parameter；Wherein, each hole pattern includes multiple
Perforation parameter；
The laser cutting machine is controlled according to the multiple perforation parameter at least one hole pattern into eleven punch 11.
2. according to the method described in claim 1, it is characterized in that, determining at least one perforation corresponding with the thickness parameter
Pattern, including：
Based on the thickness parameter, the plank to be perforated is divided into level；
With different levels quantity is drawn according to the plank to be perforated, determines at least one hole pattern.
3. according to the method described in claim 2, it is characterized in that, drawing with different levels quantity according to the plank to be perforated, really
Fixed at least one hole pattern, including：
When it is the first preset value that the plank to be perforated, which draws with different levels quantity, start the first hole pattern；
When it is the second preset value that the plank to be perforated, which draws with different levels quantity, start the second hole pattern and described the successively
One hole pattern；
When it is third preset value that the plank to be perforated, which draws with different levels quantity, start third hole pattern, described the successively
Two hole patterns and first hole pattern.
4. according to the method described in claim 1, it is characterized in that, the multiple perforation parameter is luminous intensity parameter, goes out optical frequency
Rate parameter, focal position parameter, delay parameter, air pressure parameter.
5. according to the method described in claim 1, it is characterized in that, obtain the thickness parameter of plank to be perforated, including：
The thickness parameter of plank to be perforated is obtained by the thickness measurement sensor installed on plank to be perforated.
6. a kind of laser cutting machine punching machine, which is characterized in that including：
Acquisition module, the thickness parameter for obtaining plank to be perforated；
Determining module, for determining at least one hole pattern corresponding with the thickness parameter；Wherein, each piercing die
Formula includes multiple perforation parameters；
Control module is joined for controlling the laser cutting machine according to the multiple perforation at least one hole pattern
It measures into eleven punch 11.
7. device according to claim 6, which is characterized in that the determining module, including：It divides submodule and pattern is true
Stator modules；
The plank to be perforated is divided level by the division submodule for being based on the thickness parameter；
The pattern determination sub-module determines at least one perforation for drawing with different levels quantity according to the plank to be perforated
Pattern.
8. device according to claim 6, which is characterized in that the pattern determination sub-module is specifically used for：It is waited for when described
When the with different levels quantity of perforated sheet metal stroke is the first preset value, start the first hole pattern；When the plank to be perforated divides layer
When secondary quantity is the second preset value, start the second hole pattern and first hole pattern successively；When the plate to be perforated
Material draws with different levels quantity when being third preset value, starts third hole pattern, second hole pattern and described the successively
One hole pattern.
9. a kind of electronic equipment, including memory, processor, be stored in the memory to run on the processor
Computer program, which is characterized in that the processor realizes that the claims 1 to 5 are any when executing the computer program
Described in method the step of.
10. a kind of computer-readable medium for the non-volatile program code that can perform with processor, which is characterized in that described
Program code makes the processor execute described any the methods of claim 1-5.
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| CN114131220A (en) * | 2021-11-04 | 2022-03-04 | 江苏大学 | Method for processing small holes in transparent hard and brittle material based on laser pulse control |
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