CN115170580A

CN115170580A - Plate processing control method and device, computer equipment and storage medium

Info

Publication number: CN115170580A
Application number: CN202110358731.3A
Authority: CN
Inventors: 欧阳韬; 冯建国; 胡智明; 邓舟泰; 陈焱; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd; Hans Laser Smart Equipment Group Co Ltd
Current assignee: Han s Laser Technology Industry Group Co Ltd; Hans Laser Smart Equipment Group Co Ltd
Priority date: 2021-04-02
Filing date: 2021-04-02
Publication date: 2022-10-11

Abstract

The embodiment of the application belongs to the technical field of plate processing, and relates to a plate processing control method, a device, computer equipment and a storage medium, wherein the method comprises the following steps: obtaining an initial layout electronic drawing of a plate to be cut, wherein the initial layout electronic drawing comprises a graphic object of a target element; calculating the graphic complexity of each graphic object according to the area and the number of the break points of each graphic object; taking the graphic complexity as a layout factor, and performing layout on each graphic object based on a layout algorithm to obtain a standard layout electronic drawing; dividing the standard layout electronic drawing into a plurality of sub-drawing areas; running threads with the same number as the sub-paper areas to parallelly determine a first cutting path in each sub-paper area and a second cutting path between each sub-paper area based on a path planning algorithm, so as to obtain a standard cutting path; and controlling a laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element. This application has improved panel machining efficiency.

Description

Plate processing control method and device, computer equipment and storage medium

Technical Field

The present disclosure relates to the field of plate processing technologies, and in particular, to a method and an apparatus for controlling plate processing, a computer device, and a storage medium.

Background

In industrial production, a plate material is often cut and processed by a laser, and a desired product is further produced from a component obtained by cutting. The improvement of the yield and the processing efficiency of the product is a necessary pursuit of manufacturers.

In the manufacture of sheet material, a plurality of elements may be cut from a sheet of material. Before cutting, the distribution of the elements in the sheet material is generally planned, as well as the cutting path. However, these plans take a lot of time when the number of elements to be cut is large, reducing the efficiency of the sheet processing.

Disclosure of Invention

An embodiment of the present application provides a method and an apparatus for controlling plate processing, a computer device and a storage medium, so as to solve the problem of low plate processing efficiency.

In order to solve the above technical problem, an embodiment of the present application provides a method for controlling plate processing, which adopts the following technical solutions:

obtaining an initial layout electronic drawing of a plate to be cut, wherein the initial layout electronic drawing comprises a graphic object of a target element;

calculating the graphic complexity of each graphic object according to the area and the number of the break points of each graphic object;

taking the graph complexity as a layout factor, and performing layout on each graph object based on a preset layout algorithm to obtain a standard layout electronic drawing;

dividing the standard layout electronic drawing into a plurality of sub-drawing areas;

running a plurality of threads to determine a first cutting path in each sub-paper area and a second cutting path between each sub-paper area in parallel based on a preset path planning algorithm, and obtaining a standard cutting path according to the first cutting path and the second cutting path, wherein the number of the running threads is the same as that of the sub-paper areas;

and controlling a laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element.

In order to solve the above technical problem, an embodiment of the present application further provides a panel processing control device, which adopts the following technical scheme:

the system comprises a drawing acquisition module, a cutting module and a cutting module, wherein the drawing acquisition module is used for acquiring an initial layout electronic drawing of a plate to be cut, and the initial layout electronic drawing comprises a graphic object of a target element;

the complexity calculation module is used for calculating the graph complexity of each graph object according to the area and the number of the break points of each graph object;

the object layout module is used for taking the graph complexity as a layout factor and performing layout on each graph object based on a preset layout algorithm to obtain a standard layout electronic drawing;

the drawing dividing module is used for dividing the standard layout electronic drawing into a plurality of sub-drawing areas;

the path determining module is used for operating a plurality of threads, parallelly determining a first cutting path in each sub-graph paper region and a second cutting path between each sub-graph paper region based on a preset path planning algorithm, and obtaining a standard cutting path according to the first cutting path and the second cutting path, wherein the number of the operated threads is the same as that of the sub-graph paper regions;

and the plate cutting module is used for controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element.

In order to solve the above technical problem, an embodiment of the present application further provides a computer device, which adopts the following technical solutions:

In order to solve the above technical problem, an embodiment of the present application further provides a computer-readable storage medium, which adopts the following technical solutions:

running a plurality of threads, parallelly determining a first cutting path in each sub-graph paper region and a second cutting path between each sub-graph paper region based on a preset path planning algorithm, and obtaining a standard cutting path according to the first cutting path and the second cutting path, wherein the number of the running threads is the same as that of the sub-graph paper regions;

Compared with the prior art, the embodiment of the application mainly has the following beneficial effects: obtaining an initial layout electronic drawing of a plate to be cut, wherein the initial layout electronic drawing comprises a graphic object of a target element; calculating the graphic complexity of each graphic object according to the area and the number of the break points of the graphic objects; the method comprises the steps of performing layout on graphic objects according to a layout algorithm so as to fully utilize a plate to be cut and reduce resource waste, and the graphic complexity is combined during layout so as to separately arrange the graphic objects with different complexities and facilitate cutting control; dividing standard layout electronic drawings obtained after layout into a plurality of sub-drawing areas, determining a first cutting path in each sub-drawing area and a second cutting path between each sub-drawing area based on a path planning algorithm to obtain a standard cutting path, simultaneously operating a plurality of threads in parallel, and performing path planning on one sub-drawing area by each thread to improve the path planning efficiency; the standard cutting path is used for indicating the laser cutting head to cut the plate, so that the moving path during cutting is reduced, and the plate processing efficiency is further improved.

Drawings

In order to more clearly illustrate the solution of the present application, the drawings needed for describing the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.

FIG. 1 is an exemplary system architecture diagram in which the present application may be applied;

FIG. 2 is a flow chart of one embodiment of a sheet material processing control method according to the present application;

FIG. 3 is a schematic structural view of one embodiment of a sheet material processing control apparatus according to the present application;

FIG. 4 is a schematic block diagram of one embodiment of a computer device according to the present application.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

As shown in fig. 1, the system architecture 100 may include a terminal 101, a network 102, and a cutting platform 103. The network 102 is used to provide the medium of a communication link between the terminal 101 and the cutting platform 103. Network 102 may include various connection types, such as wired, wireless communication links, or fiber optic cables, to name a few. The terminal 101 may be, but is not limited to, various industrial computers, personal computers, and notebook computers. The terminal 101 may control the cutting platform 103 to perform the cutting of the sheet material.

It should be noted that the plate material processing control method provided in the embodiments of the present application is generally executed by a terminal, and accordingly, the plate material processing control device is generally provided in the terminal.

It should be understood that the number of terminals and cutting platforms in fig. 1 is merely illustrative. There may be any number of terminals and cutting platforms, as desired for implementation.

With continued reference to FIG. 2, a flow chart of one embodiment of a sheet material processing control method according to the present application is shown. The plate processing control method comprises the following steps:

step S201, obtaining an initial layout electronic drawing of a plate to be cut, wherein the initial layout electronic drawing comprises a graphic object of a target element.

In this embodiment, the electronic device (for example, the terminal shown in fig. 1) on which the plate material processing control method operates may communicate with the cutting platform through a wired connection manner or a wireless connection manner. It is noted that the wireless connection means may include, but is not limited to, a 3G/4G connection, a WiFi connection, a bluetooth connection, a WiMAX connection, a Zigbee connection, a UWB (ultra wideband) connection, and other wireless connection means now known or developed in the future.

The initial layout electronic drawing can be an electronic drawing for performing typesetting design on a plate to be cut; the target element may be an element that needs to be cut from a sheet to be cut; in an electronic drawing, a graph needs to be drawn according to the actual shape of a target element to obtain a graph object of the target element, wherein the size of the graph object and the actual size of the target element accord with a preset scale.

Specifically, the initial layout electronic drawing may be drawn in advance and stored in the terminal, and the terminal reads the initial layout electronic drawing corresponding to the drawing number in the drawing obtaining instruction according to the drawing obtaining instruction. In one embodiment, the user can also operate the terminal to draw the initial layout electronic drawing in the cutting control software. The initial layout electronic drawing has a plurality of graphic objects of target elements, and the number of the graphic objects of each target element can be also a plurality.

In one embodiment, the initial layout electronic drawing may be a file in CAD (Computer Aided Design) format.

In one embodiment, the area of the initial layout electronic drawing is larger than the area of the plate to be cut reduced according to the preset scale, and the graphic objects in the initial layout electronic drawing can be randomly placed. The drawing layout area matched with the shape and the size of the plate to be cut is marked in the initial layout electronic drawing. The layout is called typesetting, namely, the graphic objects are rearranged in the layout area of the drawing, and the graphic objects are placed in the layout area of the drawing as much as possible so as to fully utilize the plate to be cut.

Step S202, calculating the graphic complexity of each graphic object according to the area and the number of the break points of each graphic object.

Wherein the graphic complexity may be a quantized evaluation of the graphic object complexity.

Specifically, before the layout, the graph complexity of each graph object may be obtained, which measures the graph complexity of the graph object, and the higher the graph complexity value is, the more complex the graph object is. The graphics complexity may be determined by the area of the graphics object and the number of break points, where a break point is the intersection of two edges. Generally, the larger the area, the simpler the pattern can be considered, and the cutting speed can be increased; the smaller the number of the folding points, the simpler the pattern is, and the cutting speed can be improved. The terminal calculates the area of the graphic object, identifies the number of the break points, and calculates the area and the number of the break points according to a preset complexity calculation mode to obtain the complexity of the graphic; during calculation, weights can be added to the area and the number of the break points, so that the area and the number of the break points have different degrees of influence on the complexity of the graph.

And S203, taking the graphic complexity as a layout factor, and performing layout on each graphic object based on a preset layout algorithm to obtain a standard layout electronic drawing.

Specifically, when the shape of the graphic object is complex, the setting of the equipment parameters during cutting is complex, some graphic objects are simple, and the setting of the equipment parameters during cutting is simple. Therefore, the graphic complexity can be used as a layout factor when the layout is carried out, and the influence of the graphic complexity is considered when the layout is carried out.

The terminal can carry out layout to the figure object according to the layout algorithm of predetermineeing, and when the layout, according to the figure complexity, confirm comparatively complicated figure object, can concentrate and arrange in predetermineeing the region.

In one embodiment, the layout step implemented by the layout algorithm comprises: copying and filtering a drawing, identifying a loop, judging an outermost contour, carrying out envelope fitting treatment, carrying out two-dimensional irregular collision judgment and intersection calculation and carrying out pre-combination butting on parts.

The drawing copying and filtering is to copy the initial layout electronic drawing and perform layout on the copied copy without changing the original initial layout electronic drawing. The loop identification is to re-extract the original geometric characteristic information of the parameterized drawing. The outermost contour judgment is to acquire a contour feature point set of a graphic object, perform operations such as graphic intersection calculation, envelope fitting and the like on the feature point set, identify a unique outermost contour loop from a plurality of loops after the loops are obtained, and obtain point set coordinates of the outermost contour, wherein the point set coordinates are basic data of a layout algorithm.

The envelope fitting process is to surround the outline of the two-dimensional irregular graphic object into a rectangle, wherein the envelope rectangle needs to completely contain the end points on the graphic object and needs to be connected with the edge of the graphic object. The graphic object may have a plurality of circumscribed rectangles, and a circumscribed rectangle with a smallest area needs to be selected from the plurality of circumscribed rectangles.

When performing layout, a key step is to determine whether the graphic objects are overlapped and interfered with each other. When two graphic objects are overlapped and interfered, there must be an intersection point between them. Based on this principle, algorithms such as moving scan lines, point determination of intersections, contour projection vector determination based and bitmap-based bump determination are currently generally used. When the minimum circumscribed rectangle is obtained, a separation intersection method based on the minimum rectangle envelope can be adopted, namely whether overlapping interference exists or not is judged according to the coordinate of the minimum circumscribed rectangle.

In a layout study, extracting a pre-assembly between graphical objects tends to reduce the gaps between graphical objects, for example, a layout gap may be reduced by a complementary assembly abutment between irregular graphical objects. When the parts are pre-combined and abutted, the parts can be clustered and combined by using a subtraction algorithm in dynamic clustering by adopting three characteristics of area, outsourcing rectangle coverage rate and approximate major-minor axis ratio.

In one embodiment, after the initial layout electronic drawing is obtained, the drawing copy and filtration, the loop identification and the outermost contour judgment can be performed firstly, the complexity of the graph is calculated after the outermost contour is obtained, and then the envelope fitting processing, the two-dimensional irregular collision judging and crossing calculation and the pre-combination leaning of the parts are performed.

Further, the step S203 may include: dividing each graphic object into a first graphic object and a second graphic object according to the graphic complexity; performing layout on each first graphic object based on a preset layout algorithm in a first area of the initial layout electronic drawing; and in a second area of the initial layout electronic drawing, performing layout on each second graphic object based on a layout algorithm to obtain a standard layout electronic drawing.

Specifically, a preset complexity threshold is obtained, and the graphic objects are classified according to the graphic complexity and the complexity threshold, wherein the graphic complexity smaller than the complexity threshold can be divided into a first graphic object, and the graphic complexity greater than the complexity threshold can be divided into a second graphic object.

The layout of the first graphic object can be performed based on a preset layout algorithm in a first area of the initial layout electronic drawing. In practical applications, the first area is not a designated area, the layout can be started from any corner of the drawing layout area, and the area where the first graphic object is arranged is the first area. After the first graphic object is arranged, the blank area without the first graphic object is the second area. And the terminal performs layout on the second graphic object in the second area according to a layout algorithm to obtain a final standard layout electronic drawing.

It will be appreciated that in practical applications, the graphical objects may also be divided into classes of graphical objects, not necessarily limited to two classes.

In the embodiment, the graphic objects are classified according to the graphic complexity, the graphic objects are separately arranged during layout, and the graphic objects of the same type can be arranged together during layout, so that the cutting control is facilitated.

And step S204, dividing the standard layout electronic drawing into a plurality of sub-drawing areas.

Specifically, the terminal can split the standard layout electronic drawing into a plurality of sub-drawing regions, each sub-drawing region includes a graphic object, and each graphic object can be only divided into one sub-drawing region. The number of the sub-drawing areas can be set according to actual conditions.

Further, the step S204 may include: dividing a first area in a standard layout electronic drawing into a plurality of sub-drawing areas; and dividing each second graphic object in the second area into sub-drawing areas respectively.

Specifically, the first area in the standard layout electronic drawing may be divided into a plurality of sub-drawing areas, and the number of the sub-drawing areas may be preset or may be temporarily set according to an actual situation. For the graphic objects in the second area in the standard layout electronic drawing, each graphic object can be separately divided into one sub-drawing area due to the higher complexity of the graphics.

In this embodiment, different partitioning methods are adopted for the graphics objects with different graphics complexities, and the graphics object with higher graphics complexity can be partitioned into one sub-graphics area separately, thereby facilitating subsequent cutting control.

Step S205, a plurality of threads are operated, a first cutting path in each sub-paper area and a second cutting path between each sub-paper area are determined in parallel based on a preset path planning algorithm, and a standard cutting path is obtained according to the first cutting path and the second cutting path, wherein the number of the operated threads is the same as that of the sub-paper areas.

Specifically, if the cutting path is directly planned for the complete standard layout electronic drawing, the time consumption is long, and the efficiency is low. Therefore, the standard layout electronic drawing is divided into a plurality of sub-drawing areas, threads with the same number as the sub-drawing areas are run in parallel, and each thread performs cutting path planning on one sub-drawing area based on a preset path planning algorithm to obtain a first cutting path in each sub-drawing area. The first cutting path indicates a moving path of the laser cutting head during cutting, and when the laser cutting head performs cutting according to the first cutting path, the laser cutting head can obtain the target elements corresponding to the graphic objects in the sub-graphic area by the shortest moving distance.

Because a plurality of sub-drawing areas exist, a second cutting path among the sub-drawing areas needs to be determined according to a path planning algorithm, and the second cutting path shows the shortest path when the sub-drawing areas move.

The path planning Algorithm may construct an optimal solution of the cutting path based on a Greedy Algorithm (Greedy Algorithm), which relies on a Greedy Criterion (Greedy Criterion) to ensure that a distance between a processing end point of a previous processing trajectory and a processing start point of a next processing trajectory is shortest.

And S206, controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element.

Specifically, the standard cutting path defines a moving track of the laser cutter during cutting, and the terminal controls the laser cutter to cut the plate to be cut according to the standard cutting path, so that each target element is obtained.

Further, the step S206 may include: acquiring the graph complexity of each graph object in each sub-graph paper area; determining the cutting speed of the laser cutter in each sub-paper area according to the acquired graph complexity; and controlling a laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed to obtain each target element.

Specifically, the cutting may be performed in units of sub-drawing regions, and the target element of the graphic object in one sub-drawing region is obtained by cutting, and then the cutting is performed according to another sub-drawing region.

When cutting is carried out according to one sub-paper area, the graph complexity of each graph object in the sub-paper area can be obtained, and the cutting speed of the laser cutter during cutting according to the sub-paper area is determined according to the graph complexity. For example, an average value of the graph complexity of each graph object in the sub-graph paper region may be calculated, and the cutting speed corresponding to the average value may be queried in the cutting speed table; alternatively, a uniform cutting speed is used for the graphical objects in the first region and another uniform cutting speed is used for the graphical objects in the second region.

When the graph complexity is high, the cutting speed needs to be reduced during cutting, so that the cutting accuracy is ensured; when the graph complexity is lower, the cutting speed can be improved during cutting, and therefore the cutting efficiency is improved.

And the terminal controls the laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed, and each target element is obtained after the cutting is finished.

In one embodiment, the terminal can also simulate the cutting process, simulate the cutting process according to a standard cutting path and a cutting speed, calculate the time required by processing and display the time through a display screen; and the time required by the residual progress can be calculated in real time according to the current processing progress in the processing process and displayed through a display screen.

In the embodiment, the cutting speed corresponding to each sub-drawing area is determined according to the graph complexity, the laser cutter performs cutting according to the standard cutting path and the cutting speed, the moving distance of the laser cutter is reduced during cutting, the cutting efficiency is improved, and the cutting accuracy is also ensured.

In the embodiment, an initial layout electronic drawing of a plate to be cut is obtained, wherein the initial layout electronic drawing comprises a graphic object of a target element; calculating the graphic complexity of each graphic object according to the area and the number of the break points of the graphic objects; the method comprises the steps of performing layout on graphic objects according to a layout algorithm so as to fully utilize a plate to be cut and reduce resource waste, and the graphic complexity is combined during layout so as to separately arrange the graphic objects with different complexities and facilitate cutting control; dividing standard layout electronic drawings obtained after layout into a plurality of sub-drawing areas, determining a first cutting path in each sub-drawing area and a second cutting path between each sub-drawing area based on a path planning algorithm to obtain a standard cutting path, simultaneously running a plurality of threads in parallel, and performing path planning on one sub-drawing area by each thread to improve the path planning efficiency; the standard cutting path is used for indicating the laser cutting head to cut the plate, so that the moving path during cutting is reduced, and the plate processing efficiency is further improved.

Further, after step S203, the method may further include: determining candidate cutting areas of all target elements on a plate to be cut according to a standard layout electronic drawing; and adding a graphic code corresponding to the target element in the candidate cutting area, wherein the graphic code is used for acquiring element information of the target element from a database, and the element information comprises processing information, storage information and logistics information.

And the candidate cutting area is an area on the plate to be cut, and the target element can be obtained after cutting according to the area outline of the candidate cutting area.

Specifically, after a standard layout electronic drawing is obtained, the terminal determines candidate cutting areas of each target element on a plate to be cut, and adds a graphic code corresponding to the target element in the candidate cutting areas. The graphic code includes, but is not limited to, a two-dimensional code and a bar code. The method and the device can record the element information of the target element through the database, wherein the element information comprises processing information, storage information and logistics information. The machining information may include production date of the target component, type of workpiece, size information, various machining states and state change times, an equipment operator at the time of machining, and the like. The storage information may record information related to the storage of the target component, such as a warehouse number where the target component is stored. The logistics information can record relevant information of the logistics process of the target element. The component information may also include a component number of the target component.

The element information stored in the database can be accessed by scanning the pattern code, so that the monitoring and tracking of the target element from processing, warehouse management and sale are realized, the management of the target element is facilitated, and the management efficiency of the target element is improved.

In the embodiment, the graphic code is added to the target element, and the element information of the target element can be acquired from the database after the graphic code is scanned, so that the target element is monitored, and the management efficiency of the target element is improved.

Further, after step S206, the method may further include: acquiring a component image of each target component; and detecting each target element according to the element image to obtain an element detection result, wherein the element detection result comprises a size detection result and a defect detection result.

In particular, after the cutting is completed, the target element can also be detected through machine vision. The terminal can shoot the component image of each target component through the image acquisition device on the cutting platform. The target component is inspected by the terminal based on the component image, and the inspection may include size inspection and defect inspection. Wherein the size detection is used to determine whether the size of the target element conforms to a preset size. The defect detection is used for determining whether quality defects exist in the target element, and the quality detection can take the form characteristics of the kerf, such as the slag hanging rate, kerf width, heat affected zone, roughness, kerf taper, surface stripes and the like as evaluation indexes of the laser cutting quality.

The terminal can perform digital image processing on the component image, thereby realizing component detection. Or inputting the element image into a pre-trained neural network model, and detecting the element by the neural network model. And obtaining element detection results after the detection is finished, wherein the element detection results comprise size detection results and defect detection results. When the size of the element does not accord with the preset size or the quality defect occurs, an early warning instruction can be triggered to instruct a user to obtain the target element which fails to be detected according to the early warning instruction, so that the final yield is improved.

In the embodiment, the target element is automatically detected according to the element image, and the element detection result is generated, so that the detection efficiency is improved.

Further, after step S206, the method may further include: acquiring an initial storage electronic drawing of a component storage area; and based on a layout algorithm, performing layout on the graphic object of each target element in the initial storage electronic drawing to obtain a standard storage electronic drawing, wherein the standard storage electronic drawing is used for indicating that each target element is stacked in the element storage area.

The element storage area may be an area space for storing and placing the target element. The initial storage electronic drawing may be a drawing drawn according to an actual shape of the component storage area, and the size of the initial storage electronic drawing and the size of the component storage area conform to a preset scale.

Specifically, the terminal obtains an initial storage electronic drawing of the element storage area, and in the initial storage electronic drawing, the layout algorithm is used for performing layout on the graphic objects of the target elements to obtain a standard electronic drawing. When the layout is carried out in the initial storage electronic drawing, the calculation process of the layout algorithm is the same as that of the layout algorithm in the initial layout electronic drawing, and only a certain distance value needs to be set between target elements, wherein the distance value is used for leaving a moving channel between the target elements so as to carry and move the target elements.

The standard storage electronic drawing is used for indicating that the cut target components are stacked in the component storage area, and the layout algorithm is also used for layout in the component stacking so as to fully utilize the storage area.

In this embodiment, after the initial storage electronic drawing of the component storage area is obtained, the layout algorithm is based on, and the layout is performed on the graphic object of each target component in the initial storage electronic drawing, so that each target component is stacked according to the standard storage electronic drawing after the layout, and the storage field is fully utilized.

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a computer-readable storage medium, and can include the processes of the embodiments of the methods described above when the computer program is executed. The storage medium may be a non-volatile storage medium such as a magnetic disk, an optical disk, a Read-Only Memory (ROM), or a Random Access Memory (RAM).

It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

With further reference to fig. 3, as an implementation of the method shown in fig. 2, the present application provides an embodiment of a panel processing control apparatus, where the embodiment of the apparatus corresponds to the embodiment of the method shown in fig. 2, and the apparatus can be applied to various electronic devices.

As shown in fig. 3, the plate material processing control apparatus 300 according to the present embodiment includes: a drawing acquisition module 301, a complexity calculation module 302, an object layout module 303, a drawing division module 304, a path determination module 305, and a sheet cutting module 306, wherein:

the drawing obtaining module 301 is configured to obtain an initial layout electronic drawing of a to-be-cut sheet, where the initial layout electronic drawing includes a graphic object of a target element.

And a complexity calculating module 302, configured to calculate the graphics complexity of each graphics object according to the area and the number of break points of each graphics object.

And the object layout module 303 is configured to perform layout on each graphic object based on a preset layout algorithm by using the graphic complexity as a layout factor, so as to obtain a standard layout electronic drawing.

The drawing dividing module 304 is configured to divide the standard layout electronic drawing into a plurality of sub-drawing areas.

The path determining module 305 is configured to run a plurality of threads, to determine a first cutting path in each sub-paper region and a second cutting path between each sub-paper region in parallel based on a preset path planning algorithm, and to obtain a standard cutting path according to the first cutting path and the second cutting path, where the number of the running threads is the same as the number of the sub-paper regions.

And the plate cutting module 306 is used for controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element.

In the embodiment, an initial layout electronic drawing of a plate to be cut is obtained, wherein the initial layout electronic drawing comprises a graphic object of a target element; calculating the graphic complexity of each graphic object according to the area and the number of the break points of the graphic objects; the method comprises the steps of performing layout on graphic objects according to a layout algorithm so as to fully utilize a plate to be cut and reduce resource waste, and the graphic complexity is combined during layout so as to separately arrange the graphic objects with different complexities and facilitate cutting control; dividing standard layout electronic drawings obtained after layout into a plurality of sub-drawing areas, determining a first cutting path in each sub-drawing area and a second cutting path between each sub-drawing area based on a path planning algorithm to obtain a standard cutting path, simultaneously operating a plurality of threads in parallel, and performing path planning on one sub-drawing area by each thread to improve the path planning efficiency; the standard cutting path is used for indicating the laser cutting head to cut the plate, so that the moving path during cutting is reduced, and the plate processing efficiency is further improved.

In some optional implementations of this embodiment, the subject layout module 303 may include: object divides submodule, first arrangement submodule and second arrangement submodule, wherein:

and the object dividing submodule is used for dividing each graphic object into a first graphic object and a second graphic object according to the graphic complexity.

And the first layout sub-module is used for performing layout on each first graphic object based on a preset layout algorithm in a first area of the initial layout electronic drawing.

And the second layout submodule is used for performing layout on each second graphic object based on a layout algorithm in a second area of the initial layout electronic drawing to obtain a standard layout electronic drawing.

In some optional implementations of this embodiment, the drawing dividing module 304 may include: a first partitioning submodule and a second partitioning submodule, wherein:

the first dividing module is used for dividing a first area in the standard layout electronic drawing into a plurality of sub-drawing areas.

And the second dividing submodule is used for dividing each second graphic object in the second area into the sub-drawing areas respectively.

In some optional implementations of this embodiment, the plate material cutting module 306 may include: the complexity acquisition submodule, the speed determination submodule and the cutting control submodule, wherein:

and the complexity obtaining submodule is used for obtaining the graph complexity of each graph object in each sub-graph paper area.

And the speed determining sub-module is used for determining the cutting speed of the laser cutter in each sub-paper area according to the acquired graph complexity.

And the cutting control sub-module is used for controlling the laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed to obtain each target element.

In some optional implementations of this embodiment, the plate material processing control apparatus 300 may include: the device comprises an area determining module and a graphic code adding module, wherein:

and the area determining module is used for determining candidate cutting areas of all target elements on the plate to be cut according to the standard layout electronic drawing.

And the graphic code adding module is used for adding a graphic code corresponding to the target element in the candidate cutting area, the graphic code is used for acquiring element information of the target element from a database, and the element information comprises processing information, storage information and logistics information.

and the image acquisition module is used for acquiring the element image of each target element.

And the element detection module is used for detecting each target element according to the element image to obtain an element detection result, wherein the element detection result comprises a size detection result and a defect detection result.

In some optional implementations of this embodiment, the plate material processing control apparatus 300 may include: storage drawing acquisition module and storage drawing layout module, wherein:

and the storage drawing acquisition module is used for acquiring the initial storage electronic drawing of the component storage area.

And the storage drawing layout module is used for performing layout on the graphic objects of the target elements in the initial storage electronic drawing based on a layout algorithm to obtain a standard storage electronic drawing, and the standard storage electronic drawing is used for indicating the target elements to be stacked in the element storage area.

In order to solve the technical problem, an embodiment of the present application further provides a computer device. Referring to fig. 4 in particular, fig. 4 is a block diagram of a basic structure of a computer device according to the embodiment.

The computer device 4 comprises a memory 41, a processor 42, a network interface 43 communicatively connected to each other via a system bus. It is noted that only computer device 4 having components 41-43 is shown, but it is understood that not all of the shown components are required to be implemented, and that more or fewer components may be implemented instead. As will be understood by those skilled in the art, the computer device is a device capable of automatically performing numerical calculation and/or information processing according to a preset or stored instruction, and the hardware includes, but is not limited to, a microprocessor, an Application Specific Integrated Circuit (ASIC), a Programmable Gate Array (FPGA), a Digital Signal Processor (DSP), an embedded device, and the like.

The computer device can be a desktop computer, a notebook, a palm computer, a cloud server and other computing devices. The computer equipment can carry out man-machine interaction with a user through a keyboard, a mouse, a remote controller, a touch panel or voice control equipment and the like.

The memory 41 includes at least one type of readable storage medium including flash memory, hard disks, multimedia cards, card-type memory (e.g., SD or DX memory, etc.), random Access Memory (RAM), static Random Access Memory (SRAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), programmable Read Only Memory (PROM), magnetic memory, magnetic disks, optical disks, etc. In some embodiments, the memory 41 may be an internal storage unit of the computer device 4, such as a hard disk or a memory of the computer device 4. In other embodiments, the memory 41 may also be an external storage device of the computer device 4, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, which are provided on the computer device 4. Of course, the memory 41 may also include both internal and external storage devices of the computer device 4. In this embodiment, the memory 41 is generally used for storing an operating system installed in the computer device 4 and various application software, such as computer readable instructions of a plate processing control method. Further, the memory 41 may also be used to temporarily store various types of data that have been output or are to be output.

The processor 42 may be a Central Processing Unit (CPU), controller, microcontroller, microprocessor, or other data Processing chip in some embodiments. The processor 42 is typically used to control the overall operation of the computer device 4. In this embodiment, the processor 42 is configured to execute computer readable instructions or processing data stored in the memory 41, for example, computer readable instructions for executing the plate processing control method.

The network interface 43 may comprise a wireless network interface or a wired network interface, and the network interface 43 is generally used for establishing communication connection between the computer device 4 and other electronic devices.

The computer device provided in this embodiment may execute the plate material processing control method. Here, the plate material processing control method may be the plate material processing control method of each of the above embodiments.

The present application provides another embodiment, which is to provide a computer readable storage medium, wherein the computer readable storage medium stores computer readable instructions, which can be executed by at least one processor, so as to cause the at least one processor to execute the steps of the plate processing control method.

Through the description of the foregoing embodiments, it is clear to those skilled in the art that the method of the foregoing embodiments may be implemented by software plus a necessary general hardware platform, and certainly may also be implemented by hardware, but in many cases, the former is a better implementation. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.

It should be understood that the above-described embodiments are merely exemplary of some, and not all, embodiments of the present application, and that the drawings illustrate preferred embodiments of the present application without limiting the scope of the claims appended hereto. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.

Claims

1. A plate processing control method is characterized by comprising the following steps:

2. The sheet processing control method according to claim 1, wherein the step of performing layout on each graphic object based on a preset layout algorithm by using the graphic complexity as a layout factor to obtain a standard layout electronic drawing includes:

dividing the graphic objects into a first graphic object and a second graphic object according to the graphic complexity;

performing layout on each first graphic object based on a preset layout algorithm in a first area of the initial layout electronic drawing;

and in a second area of the initial layout electronic drawing, performing layout on each second graphic object based on the layout algorithm to obtain a standard layout electronic drawing.

3. The plate processing control method according to claim 2, wherein the step of dividing the standard layout electronic drawing into a plurality of sub-drawing areas comprises:

dividing a first area in the standard layout electronic drawing into a plurality of sub-drawing areas;

and dividing each second graphic object in the second area into sub-drawing areas respectively.

4. The method as claimed in claim 3, wherein the step of controlling the laser cutter to cut the sheet to be cut according to the standard cutting path to obtain each target element comprises:

acquiring the graph complexity of each graph object in each sub-graph paper area;

determining the cutting speed of the laser cutter in each sub-paper area according to the acquired graph complexity;

and controlling the laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed to obtain each target element.

5. The method for controlling plate processing according to claim 1, wherein after the step of performing layout on each graphic object based on a preset layout algorithm by using the graphic complexity as a layout factor to obtain a standard layout electronic drawing, the method further comprises:

determining candidate cutting areas of all target elements on the plate to be cut according to the standard layout electronic drawing;

and adding a graphic code corresponding to the target element in the candidate cutting area, wherein the graphic code is used for acquiring element information of the target element from a database, and the element information comprises processing information, storage information and logistics information.

6. The method for controlling sheet processing according to claim 1, wherein after the step of controlling the laser cutter to cut the sheet to be cut according to the standard cutting path to obtain each target element, the method further comprises:

acquiring element images of the target elements;

and detecting each target element according to the element image to obtain an element detection result, wherein the element detection result comprises a size detection result and a defect detection result.

7. The method for controlling sheet processing according to claim 1, wherein after the step of controlling the laser cutter to cut the sheet to be cut according to the standard cutting path to obtain each target element, the method further comprises:

acquiring an initial storage electronic drawing of a component storage area;

and based on the layout algorithm, performing layout on the graphic objects of the target elements in the initial storage electronic drawing to obtain a standard storage electronic drawing, wherein the standard storage electronic drawing is used for indicating that the target elements are stacked in the element storage area.

8. A panel processing control apparatus, comprising:

the system comprises a drawing acquisition module, a cutting module and a cutting processing module, wherein the drawing acquisition module is used for acquiring an initial layout electronic drawing of a plate to be cut, and the initial layout electronic drawing comprises a graphic object of a target element;

the complexity calculating module is used for calculating the graphic complexity of each graphic object according to the area and the number of the break points of each graphic object;

the path determining module is used for operating a plurality of threads, parallelly determining a first cutting path in each sub-paper region and a second cutting path between each sub-paper region based on a preset path planning algorithm, and obtaining a standard cutting path according to the first cutting path and the second cutting path, wherein the number of the operated threads is the same as that of the sub-paper regions;

9. A computer apparatus comprising a memory having computer readable instructions stored therein and a processor which when executed implements the steps of a sheet material processing control method according to any one of claims 1 to 7.

10. A computer readable storage medium having computer readable instructions stored thereon which, when executed by a processor, implement the steps of the sheet material processing control method of any one of claims 1 to 7.