CN108098147B - Double-sided laser processing method for PCB array micropores - Google Patents
Double-sided laser processing method for PCB array micropores Download PDFInfo
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- CN108098147B CN108098147B CN201711247676.0A CN201711247676A CN108098147B CN 108098147 B CN108098147 B CN 108098147B CN 201711247676 A CN201711247676 A CN 201711247676A CN 108098147 B CN108098147 B CN 108098147B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
Abstract
The invention provides a double-sided laser processing method for PCB array micropores, which comprises the following steps: s1: testing the ablation threshold of each layer of material required to be processed by the PCB; s2: fixing the PCB on the ultra-precise platform and setting the rotation angle of the ultra-precise platform along the u direction; s3: laser beams are output by a laser, are divided into two beams by a light splitting module, and then respectively pass through a reflector and a focusing module in sequence so as to respectively carry out laser micropore machining on the front side and the back side of the PCB clamped on the ultra-precise platform. The processing method has the advantages of high efficiency, high precision, low cost and the like.
Description
Technical Field
The invention relates to processing of a PCB (printed circuit board), in particular to a double-sided laser processing method for PCB array micro-holes.
Background
With the development of information technology, the trend of miniaturization, light weight and high density of PCBs (Printed Circuit boards) is advancing, which puts higher demands on the micro-via processing of PCBs. In the conventional PCB drilling process, mechanical drilling is most often used. With the continuous reduction of the aperture requirement of the PCB, the traditional mechanical drilling mode has the defects of easy needle breakage, low drill bit strength, low rigidity and the like, and is not suitable for micropore processing with the aperture less than 100 mu m.
The laser is a high-energy beam processing method and is not in contact with a workpiece, and due to the characteristic that materials such as resin and the like have high absorption efficiency on the laser with specific wavelength, the laser is particularly suitable for processing PCBs and the like, and is widely applied to the field of PCB micropore processing at present.
In the laser micropore processing field of the current PCB, in order to increase the depth-diameter ratio of the hole and reduce the thermal influence, the main measures taken are as follows: the aspect ratio of the hole is re-trimmed or the defects caused by thermal influence are treated using other auxiliary processes, and the like. Increasing the depth-to-diameter ratio of the machined hole by using ultrasonic vibration or a mechanical auxiliary process; processing the micropores processed by the laser by adopting a chemical corrosion process and the like to remove a heat affected zone; and testing and adjusting new machining parameters to increase the depth-diameter ratio of the hole, reduce the thermal influence and the like. Patent CN201210475417.4 discloses a drilling method for circuit board (including laser drilling and mechanical drilling processes), which can well avoid the problems of hole deformation caused by thermal influence, but the method needs to set a functional area and a test area, test and adjust parameters in the test area, and then process the functional area, which increases material cost and reduces production efficiency.
Therefore, a laser processing method for PCB array micro via with high processing efficiency, high processing precision and low processing cost is needed.
Disclosure of Invention
In view of the above, the present invention aims to provide a high-efficiency, high-precision and low-cost laser processing method for PCB array micro-holes.
A double-sided laser processing method for PCB array micro-holes comprises the following steps:
s1: testing the ablation threshold of each layer of material required to be processed by the PCB;
s2: fixing the PCB on the ultra-precise platform and setting the rotation angle of the ultra-precise platform along the u direction;
s3: laser beams are output by a laser, are divided into two beams by a light splitting module, and then respectively pass through a reflector and a focusing module in sequence so as to respectively carry out laser micropore machining on the front side and the back side of the PCB clamped on the ultra-precise platform.
The method is limited by the defects that materials cannot be sprayed out in time, energy is absorbed, reflected and attenuated in the laser transmission process, and the like, when the laser micropore processing of the PCB reaches a certain depth, the laser processing is in a saturated state, the processing cannot be continued, and the processing requirement of the large depth-diameter ratio of the cylindrical micropore is difficult to meet. The laser micro-hole processing on the front side and the back side of the PCB can greatly increase the processing depth of the laser, so that under the condition of a certain aperture, the processing depth can be increased to a greater extent, and the processing requirement of high depth-diameter ratio can be met.
Because of the heat influence in the laser processing process, in order to prevent the accumulation of the heat influence of double-sided and long-time continuous processing, the heat dissipation is facilitated through alternate and fractional processing, so that the heat accumulation is reduced, and the processing without heat damage is realized.
One-time double-side positioning processing avoids position errors caused by repeated repositioning, and the processing precision is high.
Alternate processing is carried out by planning a double-sided laser scanning processing path of the PCB, so that the processing method can be suitable for processing requirements of different array micropores.
Preferably, the optical splitting module adjusts the wavelength, pulse width, power, repetition frequency and defocusing amount of the output laser beam according to the ablation threshold value and the processing depth of the front and back side materials of the PCB.
Preferably, the wavelength of the laser beam is 355-1064 nm, the pulse width is 0-200 ns, the output power adjustment range is 0-30W, the repetition frequency range is 2-150 kHz, and the defocusing amount is-3 mm.
Preferably, the focusing module is used for adjusting processing parameters such as a focusing position and a processing position of the laser beam, the setting of the processing parameters in the processing process of the focusing module and the processing parameter of the focusing module are independent, and the scanning speed is 0-1000 mm/s.
Preferably, the front and back surfaces of the PCB fixed by the ultra-precision platform can be focused on the laser beam of the corresponding surface for processing, the ultra-precision platform can move in the translation directions of x, y and z axes, and meanwhile, the angle can be adjusted in the u direction, and the adjustment range is 0-45 degrees.
The invention has the beneficial effects that:
1. according to the double-sided laser processing method for the PCB array micro-holes, the laser processing depth can be greatly increased by simultaneously processing the laser micro-holes on the front side and the back side of the PCB, so that under the condition of a certain aperture, the processing requirement of high depth-diameter ratio can be met by reaching larger depth, and the defects of large energy, large heat influence, low processing efficiency, high cost and the like in one-time processing are avoided.
2. According to the double-sided laser processing method for the PCB array micropores, provided by the invention, the array holes are processed alternately, so that the heat dissipation is facilitated, the heat accumulation is reduced, and the non-thermal-damage processing is realized.
3. The double-sided laser processing method for the PCB array micro-hole provided by the invention has the advantages that the positioning is carried out once, the double-sided processing is carried out, the position error caused by repeated repositioning is avoided, and the processing precision is high.
4. The double-sided laser processing method for the PCB array micropores provided by the invention carries out alternate processing by planning the double-sided laser scanning processing path of the PCB, and can be suitable for the processing requirements of different array micropores.
Drawings
FIG. 1 is a schematic diagram of a first exemplary embodiment of a double-sided laser processing system for PCB array micro via in example 1;
FIG. 2 is a second schematic diagram of double-sided laser processing of micro-holes of the PCB array in example 1;
FIG. 3 is a schematic diagram of double-sided laser processing of micro-vias of a PCB array in example 2;
wherein: 1-a laser; 2-a laser beam; 3-a light splitting module; 4-a mirror; 5-a focusing module; 6-ultra-precise platform; 7-PCB.
Example 1
As shown in fig. 1 and 2, the present embodiment provides a double-sided laser processing method for PCB7 array micro via, which determines the ablation threshold of the required processing layer material of PCB 7; fixing the processed PCB7 on the ultra-precise platform 6 and setting the rotation angle of the ultra-precise platform 6 along the u direction; laser 1 output laser beam 2, divide into twice laser beam 2 through beam splitting module 3, twice laser beam 2 passes through focus module 5 through speculum 4 respectively, processes the PCB7 positive and negative that installs in ultra-precise platform 6.
A. And B surface is the PCB7 with a symmetrical structure, and the depth-diameter ratio is more than 2: 1: the laser system outputs two laser beams 2 of A, B, the output wavelengths of the laser beams 2 are 355nm, the pulse width is 80ns, the power is 8W, the repetition frequency is 100kHz, the defocusing amount is 0, the focusing module 5 corresponding to the A, B surface is adjusted to enable the processing positions of the A, B laser beams 2 to be collinear in the vertical direction, micro-hole processing is respectively carried out on the A, B surface, the scanning speed is 700mm/s, when the processing depths are slightly more than one half of the processed PCB7, the processing is stopped, and proper trimming is carried out according to the communication condition of the processed cylindrical micro-holes.
A. B surface is PCB7 with asymmetric structure and the depth-diameter ratio is more than 2: 1: the laser system utilizes the light splitting module 3 to distribute and output a laser beam 2 of A, B according to an ablation threshold of A, B surfaces of processed materials, wherein A is the laser beam 2 with the output wavelength of 532nm, the pulse width of 80ns, the power of 8W, the repetition frequency of 100kHz and the defocusing amount of 0, B is the laser beam 2 with the output wavelength of 355nm, the pulse width of 80ns, the power of 6W, the repetition frequency of 100kHz and the defocusing amount of 0, the focusing module 5 corresponding to a A, B surface is adjusted to enable the processing position of the A, B laser beam 2 to be collinear in the vertical direction, micro-hole processing is respectively carried out on A, B surfaces, the scanning speed is 800mm/s, when the processed holes are communicated, the processing is stopped, and proper trimming is carried out according to the communication condition of the processed cylindrical micro-holes.
Processing of a blind hole on the A surface of the PCB7 or processing of a through hole with the depth-diameter ratio of less than 2: 1: the output of the laser beam 2 corresponding to the surface B is closed by using the light splitting module 3, the laser system outputs the laser beam A according to the ablation threshold of the processed material and the micropore processing depth, the output wavelength is 532nm, the pulse width is 80ns, the power is 15W, the repetition frequency is 100kHz, the defocusing amount is 0, the laser processing position is adjusted by using the focusing module 5 to carry out micropore processing on the PCB7, and the scanning speed is 900 mm/s.
Processing blind holes on A, B surfaces of the PCB 7: according to the ablation threshold value and the required processing depth of a material processed on the A, B surface, a laser system utilizes a light splitting module 3 to distribute and output a laser beam 2 of A, B, A is the laser beam 2 with the output wavelength of 532nm, the pulse width of 80ns, the power of 10W, the repetition frequency of 100kHz and the defocusing amount of-1 mm, B is the laser beam 2 with the output wavelength of 532nm, the pulse width of 80ns, the power of 6W, the repetition frequency of 100kHz and the defocusing amount of 1mm, a focusing module 5 corresponding to a A, B surface is utilized to adjust the processing position of the A, B laser beam 2, and micro-hole processing is respectively carried out on the A, B surface, and the scanning speed is respectively 800mm/s and 700 mm/s.
Example 2:
the embodiment provides a double-sided laser processing method for PCB7 array micro-holes, which is used for increasing heat dissipation and reducing heat influence in the processing process of PCB7 array micro-holes. In this embodiment, the case of "processing a through hole with a symmetric A, B plane in the PCB7 and a depth-diameter ratio of more than 2: 1" in embodiment 1 is taken as an example, and other cases are extensions of this embodiment and are also within the scope of the present invention.
Determining ablation thresholds for the layers of material of the processed PCB 7; fixing the processed PCB7 on the ultra-precise platform 6 and setting the rotation angle of the ultra-precise platform 6 along the u direction; two laser beams 2 with consistent output parameters of the laser system are A and B, the A and B are the laser beams 2 with output wavelength of 1064nm, pulse width of 80ns, power of 16W, repetition frequency of 100kHz and defocusing amount of 0, as shown in fig. 3, the processing position of the laser beam 2 is adjusted A, B by using the focusing module 5 corresponding to the A, B plane, at this time, the processing position of the A, B laser beam 2 is a different micro-hole staggered from each other in the array micro-holes, the laser micro-hole processing is performed, the scanning speed is all 800mm/s, and when the processing depth reaches half of the depth of the processed PCB7, stopping processing, readjusting the processing position of A, B laser beam 2 by using the focusing module 5, respectively collinear with the processing position before the B, A laser beam 2 in the vertical direction, performing laser micro-hole processing again to complete the processing of the through hole, and performing appropriate trimming according to the communication condition of the processed cylindrical micro-hole.
The foregoing is a detailed description of the invention, which is described in greater detail and not intended to limit the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention, and that such obvious alternatives fall within the scope of the invention.
Claims (1)
1. A double-sided laser processing method for PCB array micro-holes is characterized by comprising the following steps:
s1: testing the ablation threshold of each layer of material required to be processed by the PCB;
s2: fixing the PCB on the ultra-precise platform and setting the rotation angle of the ultra-precise platform along the u direction;
s3: laser beams are output by a laser, are divided into two beams by a light splitting module, and then respectively pass through a reflector and a focusing module in sequence so as to respectively carry out laser micropore machining on the front side and the back side of a PCB clamped on the ultra-precise platform;
the focusing module is used for adjusting the focusing position and the processing position of a laser beam, the setting of processing parameters of the focusing module and the processing module in the processing process are mutually independent, and the scanning speed is 0-1000 mm/s;
the light splitting module adjusts the wavelength, pulse width, power, repetition frequency and defocusing parameter of the corresponding laser beam according to the ablation threshold and the processing depth of the front and back side materials of the PCB;
the front and back surfaces of the PCB fixed by the ultra-precision platform can be focused on laser beams on corresponding surfaces for processing, the ultra-precision platform can perform translational motion along the x, y and z axes, and can perform angle adjustment along the u direction, and the adjustment range is 0-45 degrees;
the wavelength of the laser beam is 355-1064 nm, the pulse width is 0-200 ns, the output power adjustment range is 0-30W, the repetition frequency range is 2-150 kHz, and the defocusing amount is-3 mm.
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| CN110026693A (en) * | 2019-04-03 | 2019-07-19 | 大族激光科技产业集团股份有限公司 | Laser boring method, device, electronic device and computer readable storage medium |
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