CN111496393A - Taper-controllable micro-group hole efficient laser processing method - Google Patents
Taper-controllable micro-group hole efficient laser processing method Download PDFInfo
- Publication number
- CN111496393A CN111496393A CN202010207626.5A CN202010207626A CN111496393A CN 111496393 A CN111496393 A CN 111496393A CN 202010207626 A CN202010207626 A CN 202010207626A CN 111496393 A CN111496393 A CN 111496393A
- Authority
- CN
- China
- Prior art keywords
- processing
- laser
- taper
- micropore
- optical rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 67
- 230000003287 optical effect Effects 0.000 claims abstract description 50
- 238000003754 machining Methods 0.000 claims abstract description 15
- 238000013519 translation Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a taper-controllable micro-group hole high-efficiency laser processing method, which solves the problems of uncontrollable taper and low processing efficiency of the existing laser micro-hole processing method. Which comprises the following steps; step one, light beams emitted by a laser are expanded by a beam expander, and then enter a rotating light system; step two, the optical rotation system rotates the laser beam according to the aperture and taper requirements of the micropore processing, so that the laser beam meets the processing requirements; thirdly, positioning an emergent light beam of the rotary optical system by the scanning galvanometer according to the micropore machining position of the machined part; fourthly, the laser beam is focused after passing through the field lens and acts on the surface of the processed part to realize the processing of the micropore; controlling the laser to close the laser, and driving an internal reflector of the scanning galvanometer to switch to the processing position of the next micropore; and step six, circulating the step one to the step five to realize the processing of all micropores.
Description
Technical Field
The invention belongs to the field of laser precision manufacturing, and particularly relates to a taper-controllable micro-group hole efficient laser processing method.
Background
With the development of the technology in the field of microelectronics, the design of electronic circuits is also being developed towards miniaturization, light weight and high density, so that higher micropore processing requirements are also put forward for important carriers of electronic circuits, such as PCBs (printed circuit boards) and FPCs (flexible printed circuit boards).
The laser processing is a precision processing method, has the characteristics of non-contact, small focusing light spot and the like, is particularly suitable for processing the micropores of the printed circuit board, and is a processing mode widely adopted by precision drilling of the printed circuit board. In the current laser drilling system of the printed circuit board, the characteristics of high precision, quick response and the like of an optical scanning galvanometer are mainly utilized, and a light beam is rotated by the scanning galvanometer in the processing process, so that the micropore processing requirement of the printed circuit board is met. However, the method has some problems, when the laser acts on the surface of the part through the field lens attached to the vibrating mirror, the formed focused light beam is conical due to the focusing principle of the light beam, so that the side profile of the processed micropore is necessarily in a regular conical shape, and the processing requirements of some PCB micropores cannot be met; secondly, rely on the scanning galvanometer to make the light beam carry out the processing mode of sweeping soon and switching to the processing position through the motion platform, its manufacturing efficiency often is limited to the switching of motion platform to the processing position, especially to when driling on such frivolous parts as FPC, the time that the drilling spent is very short, but the time that the platform switched the processing position has surpassed drilling time to the promotion of machining efficiency has been restricted.
Disclosure of Invention
The invention aims to solve the problems of uncontrollable taper and low processing efficiency of the existing laser micropore processing method and provides a taper-controllable efficient laser processing method for micro-group holes.
The technical scheme adopted by the invention for solving the problems is as follows:
a taper controllable micro-group hole high-efficiency laser processing method comprises the following steps;
step one, light beams emitted by a laser are expanded by a beam expander, and then enter a rotating light system;
step two, the optical rotation system rotates the laser beam according to the aperture and taper requirements of the micropore processing, so that the laser beam meets the processing requirements;
2.1) adjusting the translation amount of a translation reflector of the optical rotation system relative to the central axis of the dove prism so as to control the taper of micropore machining;
2.2) driving the rotary optical wedge of the optical rotation system to rotate forward by different angles around the central axis of the dove prism so as to control the diameter of micropore processing;
thirdly, positioning an emergent light beam of the rotary optical system by the scanning galvanometer according to the micropore machining position of the machined part;
fourthly, the laser beam is focused after passing through the field lens and acts on the surface of the processed part to realize the processing of the micropore;
controlling the laser to close the laser, and driving an internal reflector of the scanning galvanometer to switch to the processing position of the next micropore;
and step six, circulating the step one to the step five to realize the processing of all micropores.
Furthermore, in the first step, after the beam emitted by the laser is expanded by the beam expander, the beam is reflected by the reflector and enters the optical rotation system, so that the adjustment of different optical paths is realized.
Further, the third step is specifically: the scanning galvanometer respectively drives two reflectors in the scanning galvanometer according to the micropore machining position of the machined part, so that light beams emitted by the optical rotation system deflect by a certain angle, and the focused light beams are respectively positioned at different machining positions.
Compared with the prior art, the invention has the beneficial effects that:
1. the method of the invention leads the focused light beam to generate a certain included angle relative to the surface of the part through the optical rotation system, and the included angle is adjusted according to the translation reflecting mirror in the optical rotation system, thereby realizing the control of the processing taper of the micropore, and realizing the high-efficiency manufacture of the micropore with controllable taper.
2. The method of the invention respectively combines the characteristics of the optical rotation system that the taper controllable micropore processing capability can be realized and the scanning galvanometer has high responsiveness, the optical rotation system rotates at high speed according to the processing requirements of the micropore taper and the pore diameter in the processing process, and then the scanning galvanometer controls the internal reflector to rapidly deflect, thereby realizing the high-speed and high-precision positioning of the focused processing light beam at different positions and further realizing the high-efficiency processing of the micro-group holes.
Drawings
FIG. 1 is a structural diagram of an apparatus used in the taper-controllable micro-group hole high-efficiency laser processing method of the present invention;
FIG. 2 is a schematic diagram of a taper-controllable micro-group hole high-efficiency laser processing method for processing a non-tapered micro-hole according to the present invention;
FIG. 3 is a schematic diagram of a taper-controllable micro-group hole high-efficiency laser processing method for processing a right-taper micro-hole according to the present invention;
FIG. 4 is a schematic diagram of an inverted cone micro-hole machined by the taper-controllable micro-group hole high-efficiency laser machining method of the invention;
FIG. 5 is a schematic view of the structure of an optical rotation system.
Reference numerals: 1-laser, 2-beam expander, 3-first reflector, 4-second reflector, 5-optical rotation system, 6-scanning galvanometer, 7-field lens, 8-processed part, 9-galvanometer control board card, 51-translation reflector, 52-rotating optical wedge, 53-dove prism and 54-third reflector.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
The invention provides a taper-controllable micro-group hole efficient laser processing method, which can realize the adjustability of the taper of the micro holes of a printed circuit board and the efficient manufacture of the micro holes.
As shown in fig. 1, the device for implementing the taper-controllable micro-group hole high-efficiency laser processing method of the present invention includes a laser 1, a beam expander 2, a first reflector 3, a second reflector 4, an optical rotation system 5, a scanning galvanometer 6, a field lens 7, a processed part 8, and a galvanometer control board 9. In which the laser 1 is used as a processing light sourceThe laser 1 may be CO in particular, providing the energy required for the machining of the micro-holes2The average power of the laser is 5100-5900W, the frequency of the laser is 90-110Hz, and the pulse width of the laser is 12-15 us. The beam expander 2 is used for expanding the laser beam to obtain fine and small focused light spots; the first reflector 3 and the second reflector 4 are used for introducing CO2The light beam emitted from the laser is introduced into the optical rotation system 5. The optical rotation system 5 is a common micro-hole processing device in the field of laser processing, such as a laser processing head based on a dove prism form, a light wedge type rotating scanning head, and the like, and the main functions of the optical rotation system 5 in the method include two aspects: 1. the light beam is enabled to generate rotary motion, the processing 2 of the round hole is realized, the space posture of the interaction of the light beam and the material is enabled to be changed, and the micro-hole processing with adjustable taper is realized. The scanning galvanometer 6 is used for positioning the processing position of the scanning light beam generated by the optical rotation system 5, so that the quick switching of different processing positions is realized. The scanning galvanometer 6 and the field lens 7 position and focus the light beam modulated by the rotary cutting system on a part (printed circuit board) to be processed.
In the practice of the present invention, the optical rotation system 5 is a laser processing head based on the principle of dove prism 53, as shown in fig. 5, wherein the dashed frame part is the optical rotation system 5 used in the method of the present invention, i.e. the dove prism processing head, which is composed of modules such as third reflector 54, translation reflector 51, rotating wedge 52, dove prism 53, etc., wherein the adjustment of the translation reflector 51 determines the taper of the micro-hole processing, and the rotating wedge 52 determines the diameter of the micro-hole processing. In the processing process, in order to implement the micro-hole processing with adjustable taper and aperture, the optical rotation system 5 needs to respectively translate and rotate the translation mirror 51 and the rotary optical wedge according to the requirements of the processing aperture and taper to implement the displacement of the focused light beam and the adjustment of the spatial angle.
As shown in fig. 2-4, the angles of action between the different beams and the material determine the taper of the wells. In this embodiment, in order to machine a cylindrical hole with a diameter of 0.1mm, a light beam is rotated by the optical rotation system 5 to form a circular ring with a diameter of 0.1mm and the light beam is applied perpendicularly to the surface of the part, thereby realizing the machining of the cylindrical hole.
Based on the device, the taper controllable micro-group hole efficient laser processing method specifically comprises the following steps:
firstly, a light beam emitted by a laser 1 is expanded by a beam expander 2 and then enters an optical rotation system 5;
in this step, after the beam emitted by the laser 1 is expanded by the beam expander 2, the beam may be reflected by the first reflector 3 and the second reflector 4 and then enter the optical rotation system 5, so as to adjust different optical paths;
step two, the optical rotation system 5 rotates the laser beam according to the aperture and taper requirements of the micropore processing, so that the laser beam meets the processing requirements;
2.1) adjusting the translation amount of a translation reflector 51 of the optical rotation system 5 relative to the central axis of a dove prism 53 to control the taper of micropore machining;
specifically, the optical rotation system 5 drives the translation reflector 51 to enable the light beam to translate 0.5mm in the forward direction relative to the central axis of the dove prism 53, so that the focused light beam is perpendicular to the surface of the part;
2.2) driving the rotary optical wedge of the optical rotation system 5 to rotate around the central axis of the dove prism 53 by different angles in the forward direction so as to control the diameter of micropore processing;
specifically, the rotary optical wedge is driven to rotate around the central axis of the dove prism 53 in the forward direction by 5 degrees, so that the cylindrical hole with the diameter of 0.1mm is machined;
thirdly, the scanning galvanometer 6 positions the emergent light beams of the rotary optical system 5 according to the micropore machining position of the machined part 8;
the scanning galvanometer 6 respectively drives two reflectors in the scanning galvanometer according to the micropore processing position of the printed circuit board to deflect a light beam emitted by the optical rotation system 5 by a certain angle, so that the focused light beam is respectively positioned at different processing positions;
fourthly, the laser beam is focused after passing through the field lens 7 and acts on a processed part 8 (the surface of the printed circuit board), so that the processing of the micropore is realized;
fifthly, the galvanometer control board card 9 controls the laser 1 to close laser, and then drives the internal reflector thereof to be rapidly switched to the processing position of the next micropore;
and step six, circulating the step one to the step five to realize the processing of all micropores.
In the embodiment of the present invention, the rotation diameter of the light beam is made 0.1mm, and the spatial angle of the light beam is adjusted to be vertically applied to the printed circuit board.
The method of the invention leads the focused light beam to generate a certain included angle relative to the surface of the part through the optical rotation system, and the included angle is adjusted according to the translation reflecting mirror in the optical rotation system, thereby realizing the control of the processing taper of the micropore.
The method of the invention combines the characteristics of the optical rotation system that the taper controllable micropore processing capability and the scanning galvanometer high responsiveness can be realized. In the processing process, the optical rotation system rotates at a high speed according to the processing requirements of the taper and the aperture of the micro-hole, and then the scanning galvanometer controls the internal reflector to quickly deflect, so that the high-speed and high-precision positioning of the focused processing light beam at different positions is realized, and the high-efficiency processing of micro-group holes is realized.
Claims (3)
1. A taper controllable micro-group hole high-efficiency laser processing method is characterized by comprising the following steps;
step one, light beams emitted by a laser are expanded by a beam expander, and then enter a rotating light system;
step two, the optical rotation system rotates the laser beam according to the aperture and taper requirements of the micropore processing, so that the laser beam meets the processing requirements;
2.1) adjusting the translation amount of a translation reflector of the optical rotation system relative to the central axis of the dove prism so as to control the taper of micropore machining;
2.2) driving the rotary optical wedge of the optical rotation system to rotate forward by different angles around the central axis of the dove prism so as to control the diameter of micropore processing;
thirdly, positioning an emergent light beam of the rotary optical system by the scanning galvanometer according to the micropore machining position of the machined part;
fourthly, the laser beam is focused after passing through the field lens and acts on the surface of the processed part to realize the processing of the micropore;
step five, closing the laser, and driving an internal reflector of the scanning galvanometer to switch to the processing position of the next micropore;
and step six, circulating the step one to the step five to realize the processing of all micropores.
2. The taper-controllable micro-group hole high-efficiency laser processing method according to claim 1, characterized in that: in the first step, after the beam emitted by the laser is expanded by the beam expander, the beam is reflected by the reflector and enters the optical rotation system to realize the adjustment of different optical paths.
3. The taper-controllable micro-group hole high-efficiency laser processing method according to claim 1 or 2, characterized in that: the third step is specifically as follows: the scanning galvanometer respectively drives two reflectors in the scanning galvanometer according to the micropore machining position of the machined part, so that light beams emitted by the optical rotation system deflect by a certain angle, and the focused light beams are respectively positioned at different machining positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010207626.5A CN111496393A (en) | 2020-03-23 | 2020-03-23 | Taper-controllable micro-group hole efficient laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010207626.5A CN111496393A (en) | 2020-03-23 | 2020-03-23 | Taper-controllable micro-group hole efficient laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111496393A true CN111496393A (en) | 2020-08-07 |
Family
ID=71865768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010207626.5A Pending CN111496393A (en) | 2020-03-23 | 2020-03-23 | Taper-controllable micro-group hole efficient laser processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111496393A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112059409A (en) * | 2020-08-31 | 2020-12-11 | 深圳泰德激光科技有限公司 | Laser drilling device |
| CN112192021A (en) * | 2020-10-16 | 2021-01-08 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
| CN113385838A (en) * | 2021-05-12 | 2021-09-14 | 华东师范大学 | Method for improving femtosecond laser metal material drilling efficiency and drilling thickness |
| CN113579518A (en) * | 2021-07-27 | 2021-11-02 | 江苏先河激光技术有限公司 | Six-galvanometer group hole machining device and machining method |
| CN114226954A (en) * | 2021-12-27 | 2022-03-25 | 中国科学院西安光学精密机械研究所 | Laser processing system and method for surface insulation structure of heterogeneous material |
| JP2022065693A (en) * | 2020-10-16 | 2022-04-28 | 国立大学法人信州大学 | Optical unit, laser processing equipment, laser processing method and three-dimensional processing equipment |
| EP4024118A1 (en) * | 2021-01-05 | 2022-07-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for aligning, rotating and / or forming a laser beam |
| CN114739291A (en) * | 2022-03-31 | 2022-07-12 | 中国科学院西安光学精密机械研究所 | Automatic correction method and system for laser pendulum shaft light beam pointing error |
| CN114769845A (en) * | 2022-04-20 | 2022-07-22 | 华东师范大学 | Laser rotary cutting drill device based on burst mode and drilling method |
| JP2022107852A (en) * | 2020-10-16 | 2022-07-22 | 国立大学法人信州大学 | Optical unit, laser processing device, and laser processing method |
| CN115091063A (en) * | 2022-08-24 | 2022-09-23 | 绵阳新能智造科技有限公司 | Femtosecond laser inner hole wall machining device |
| WO2023103354A1 (en) * | 2021-12-10 | 2023-06-15 | 西安交通大学 | Precision machining apparatus and method for group holes of ultrafast laser controllable hole pattern |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090045176A1 (en) * | 2005-06-28 | 2009-02-19 | Welf Wawers | Device for drilling and for removing material using a laser beam |
| CN203091969U (en) * | 2013-02-05 | 2013-07-31 | 余振新 | Laser optical path guide system for laser sinter molding device |
| CN104570363A (en) * | 2015-02-03 | 2015-04-29 | 大族激光科技产业集团股份有限公司 | Gauss laser beam shaping method and device and precise laser micropore processing device |
| CN104690432A (en) * | 2015-02-03 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Precision laser cutting and micro-hole machining device |
| CN110405368A (en) * | 2019-08-30 | 2019-11-05 | 温州大学 | A kind of perforating device and its drilling technology that femtosecond laser processing taper is controllable |
| CN110695521A (en) * | 2019-06-04 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Light beam scanning system for laser micropore machining |
-
2020
- 2020-03-23 CN CN202010207626.5A patent/CN111496393A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090045176A1 (en) * | 2005-06-28 | 2009-02-19 | Welf Wawers | Device for drilling and for removing material using a laser beam |
| CN203091969U (en) * | 2013-02-05 | 2013-07-31 | 余振新 | Laser optical path guide system for laser sinter molding device |
| CN104570363A (en) * | 2015-02-03 | 2015-04-29 | 大族激光科技产业集团股份有限公司 | Gauss laser beam shaping method and device and precise laser micropore processing device |
| CN104690432A (en) * | 2015-02-03 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Precision laser cutting and micro-hole machining device |
| CN110695521A (en) * | 2019-06-04 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Light beam scanning system for laser micropore machining |
| CN110405368A (en) * | 2019-08-30 | 2019-11-05 | 温州大学 | A kind of perforating device and its drilling technology that femtosecond laser processing taper is controllable |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112059409B (en) * | 2020-08-31 | 2022-06-21 | 深圳泰德激光技术股份有限公司 | Laser drilling device |
| CN112059409A (en) * | 2020-08-31 | 2020-12-11 | 深圳泰德激光科技有限公司 | Laser drilling device |
| CN112192021A (en) * | 2020-10-16 | 2021-01-08 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
| JP7240774B2 (en) | 2020-10-16 | 2023-03-16 | 国立大学法人信州大学 | Optical unit and laser processing equipment |
| JP2022107852A (en) * | 2020-10-16 | 2022-07-22 | 国立大学法人信州大学 | Optical unit, laser processing device, and laser processing method |
| JP2022065693A (en) * | 2020-10-16 | 2022-04-28 | 国立大学法人信州大学 | Optical unit, laser processing equipment, laser processing method and three-dimensional processing equipment |
| DE102021200021A1 (en) | 2021-01-05 | 2022-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Arrangement for the alignment, rotation and/or shaping of a laser beam |
| EP4024118A1 (en) * | 2021-01-05 | 2022-07-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for aligning, rotating and / or forming a laser beam |
| CN113385838B (en) * | 2021-05-12 | 2022-07-08 | 华东师范大学 | Method for improving femtosecond laser metal material drilling efficiency and drilling thickness |
| CN113385838A (en) * | 2021-05-12 | 2021-09-14 | 华东师范大学 | Method for improving femtosecond laser metal material drilling efficiency and drilling thickness |
| CN113579518A (en) * | 2021-07-27 | 2021-11-02 | 江苏先河激光技术有限公司 | Six-galvanometer group hole machining device and machining method |
| WO2023103354A1 (en) * | 2021-12-10 | 2023-06-15 | 西安交通大学 | Precision machining apparatus and method for group holes of ultrafast laser controllable hole pattern |
| CN114226954A (en) * | 2021-12-27 | 2022-03-25 | 中国科学院西安光学精密机械研究所 | Laser processing system and method for surface insulation structure of heterogeneous material |
| CN114739291A (en) * | 2022-03-31 | 2022-07-12 | 中国科学院西安光学精密机械研究所 | Automatic correction method and system for laser pendulum shaft light beam pointing error |
| CN114739291B (en) * | 2022-03-31 | 2023-01-06 | 中国科学院西安光学精密机械研究所 | Automatic correction method for laser pendulum shaft light beam pointing error |
| CN114769845A (en) * | 2022-04-20 | 2022-07-22 | 华东师范大学 | Laser rotary cutting drill device based on burst mode and drilling method |
| CN115091063A (en) * | 2022-08-24 | 2022-09-23 | 绵阳新能智造科技有限公司 | Femtosecond laser inner hole wall machining device |
| CN115091063B (en) * | 2022-08-24 | 2022-11-04 | 绵阳新能智造科技有限公司 | Femtosecond laser inner hole wall machining device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111496393A (en) | Taper-controllable micro-group hole efficient laser processing method | |
| CN108098147B (en) | Double-sided laser processing method for PCB array micropores | |
| US20010045419A1 (en) | Laser system and method for single pass micromachining of multilayer workpieces | |
| US8729426B2 (en) | Method and apparatus for laser machining relatively narrow and relatively wide structures | |
| US5933218A (en) | Laser beam machining apparatus | |
| US6791060B2 (en) | Beam shaping and projection imaging with solid state UV gaussian beam to form vias | |
| US6657159B2 (en) | Method for laser drilling | |
| KR100982677B1 (en) | Method for laser machining a workpiece with laser spot enlargement | |
| CN103203541B (en) | Laser machining device | |
| KR20150126603A (en) | Coordination of beam angle and workpiece movement for taper control | |
| JP2005502476A (en) | For example, a laser drilling method using a perforated mask | |
| JP2005532908A5 (en) | ||
| JP2000233291A (en) | Device and method for laser beam working | |
| WO2022222411A1 (en) | Pcb short-wavelength pulse laser drilling method and related apparatus | |
| JP7404043B2 (en) | Laser processing equipment and laser processing method | |
| CN112605542A (en) | Laser system and method for processing flexible circuit board by using same | |
| CN111515526A (en) | Multi-beam processing device and method | |
| US20070187373A1 (en) | Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam | |
| JP3323987B2 (en) | Laser processing equipment | |
| CN114682934B (en) | Multi-pulse width composite printed circuit board laser processing device | |
| CN214392877U (en) | Laser system for processing flexible circuit board | |
| GB2466221A (en) | Method and apparatus for laser machining structures of different sizes by means of two different laser processes | |
| JP2002346775A (en) | Device and method for laser beam machining | |
| JPH03142087A (en) | Method for boring printed wiring board | |
| JPH10323788A (en) | Laser processing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200807 |