CN112192021A - Laser scanning device - Google Patents

Laser scanning device Download PDF

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Publication number
CN112192021A
CN112192021A CN202011108763.XA CN202011108763A CN112192021A CN 112192021 A CN112192021 A CN 112192021A CN 202011108763 A CN202011108763 A CN 202011108763A CN 112192021 A CN112192021 A CN 112192021A
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China
Prior art keywords
mirror
light
deflecting mirror
axial direction
laser scanning
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CN202011108763.XA
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Chinese (zh)
Inventor
刘国强
姜宝宁
康伟
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Xi'an Micromach Photon Technology Co ltd
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Xi'an Micromach Photon Technology Co ltd
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Priority to CN202011108763.XA priority Critical patent/CN112192021A/en
Publication of CN112192021A publication Critical patent/CN112192021A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

A laser scanning device comprises a light translation element, a galvanometer scanning module and a focusing mirror; the light translation element can rotate around a first axial direction and is used for refracting and translating the light beam, and the first axial direction is a vertical direction; the galvanometer scanning module comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect the received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam; the focusing mirror is used for focusing the light beam which is converted by the light translation element and the galvanometer scanning module. By applying the device, the circular hole or the inverted cone hole can be machined on the workpiece with a certain thickness; and can realize the processing of the micro-hole with large depth-diameter ratio.

Description

Laser scanning device
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser scanning device.
Background
At present, the scanning modes of laser micropore processing are various and can be divided into the following modes according to the principle: transmissive and reflective; the composition structure can be divided into: galvanometer scanning, double optical wedge + parallel flat plate scanning, PZT + parallel flat plate scanning and the like. The galvanometer scanning has the advantage of high scanning speed, thin parts and the like can be quickly processed, the defects that cylindrical holes or inverted taper holes cannot be realized when the processing thickness is larger than 1mm of micropores, the actual application requirement cannot be met, and when an optical wedge and parallel flat plate structure is adopted, the rotating speed of the whole module is low, and the requirement on the actual processing efficiency cannot be met. The PZT scanning module has the defects of small scanning range, low speed and the like. In summary, the conventional scanning method has the following disadvantages: the optical wedge and parallel flat plate type scanning machining efficiency is low, and the actual machining requirements cannot be met; when a thick part is processed by galvanometer scanning (not less than 1mm), the processing of a cylindrical hole and an inverted taper hole cannot be realized; the galvanometer type scanning cannot realize the processing of different taper holes and cannot realize the processing of micro holes with large depth-diameter ratio.
Disclosure of Invention
The invention provides a laser scanning device capable of efficiently processing micropores, which is based on the problems in the prior art, aims to solve the problems of large depth-diameter ratio, low processing efficiency and simultaneous satisfaction of processing of cylindrical holes or inverted cone holes, and provides a laser scanning device capable of efficiently processing micropores.
The invention provides a laser scanning device, which comprises a light translation element, a galvanometer scanning module and a focusing mirror; the light translation element can rotate around a first axial direction and is used for refracting and translating the light beam, and the first axial direction is a vertical direction; the galvanometer scanning module comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect the received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam; the focusing mirror is used for focusing the light beam which is converted by the light translation element and the galvanometer scanning module.
The laser scanning device also comprises a first light splitting plate, a first detection light reflector opposite to the first light splitting plate, a first lens module opposite to the first detection light reflector and a first image detector opposite to the first lens module; the first light splitting plate is positioned on a light emitting path of the light translation element and used for transmitting laser beams and receiving and reflecting light beams reflected from a processing workpiece or a processing hole, the first detection light reflector is used for reflecting the reflected light beams to the first lens module, and the first lens module is used for focusing the reflected light beams; the first image detector is used for imaging.
The laser scanning device further comprises a second light splitting plate, a second detection light reflector opposite to the second light splitting plate, a second lens module opposite to the second detection light reflector and a second image detector opposite to the second lens module, wherein the second light splitting plate is located on a light emitting path of the second deflection mirror and used for splitting a light beam emitted by the second deflection mirror into a detection light beam, the second detection light reflector is used for reflecting the detection light beam to the second lens module, the second lens module is used for focusing the detection light beam, and the second image detector is used for imaging.
In an initial state, an included angle between the first deflection mirror and the horizontal direction is 50-85 degrees, an included angle between the second deflection mirror and the horizontal direction is 5-40 degrees, a difference value between the included angles between the first deflection mirror and the horizontal direction and between the second deflection mirror and the horizontal direction is 45 degrees, the included angle between the first deflection mirror and the second deflection mirror is 45 degrees, the second axial direction is perpendicular to the first axial direction, the third axial direction is 22.5 degrees with the direction perpendicular to the first axial direction and the second axial direction, and an initial vector direction of the galvanometer scanning module is the same as an initial vector direction of the optical translation element and the two synchronous movements are carried out.
In the initial state, the included angle between the first deflection mirror and the horizontal direction is 67.5 degrees, and the included angle between the second deflection mirror and the horizontal direction is 22.5 degrees.
In an initial state, an included angle between the first deflection mirror and the horizontal direction is 30-60 degrees, an included angle between the second deflection mirror and the horizontal direction is 30-60 degrees, the first deflection mirror and the second deflection mirror are parallel to each other, the second axial direction and the third axial direction are perpendicular and are both located in the horizontal direction, and the starting vector direction of the galvanometer scanning module is opposite to the starting vector direction of the optical translation element and moves synchronously with the starting vector direction of the optical translation element.
In an initial state, an included angle between the first deflection mirror and the horizontal direction is 45 degrees, and an included angle between the second deflection mirror and the horizontal direction is 45 degrees.
The laser beam sequentially passes through the optical translation element and the galvanometer scanning module and then reaches the focusing mirror, and the laser scanning device further comprises a reflecting mirror, wherein the reflecting mirror is positioned between the optical translation element and the galvanometer scanning module and used for reflecting the beam emitted from the optical translation element to the first deflection mirror.
The galvanometer scanning module and the rear optical system thereof rotate around any rotating shaft in the horizontal direction by +/-90 degrees as a whole to be used for processing the inclined plane.
The laser scanning device further comprises a first driving device, and the first driving device is used for driving the light translation element to rotate around the first axial direction.
The laser scanning device further comprises a second driving device and a third driving device, the second driving device is used for driving the first deflection mirror to rotate around the second axial direction, and the third driving device is used for driving the second deflection mirror to rotate around the third axial direction.
According to the laser scanning device, firstly, the current processing efficiency requirement can be met through the application of the device, and the special-shaped holes can be processed efficiently; secondly, the device can be used for processing round holes or inverted taper holes on workpieces (more than or equal to 1mm) with certain thicknesses; finally, the device can be used for processing the micropores with large depth-diameter ratio.
Drawings
Fig. 1 is a light path structure diagram of a first embodiment of a laser scanning device of the present invention.
FIG. 2 is an optical schematic diagram of a first deflection mirror and a second deflection mirror of the laser scanning device shown in FIG. 1;
FIG. 3 is a diagram showing an optical path structure of a second embodiment of the laser scanning device of the present invention;
FIG. 4 is a view showing an optical path structure of a laser scanning apparatus according to a third embodiment of the present invention;
FIG. 5 is a diagram showing an optical path structure of a fourth embodiment of a laser scanning apparatus according to the present invention;
FIG. 6 is a view showing an optical path structure of a fifth embodiment of the laser scanning device of the present invention;
FIG. 7 is a schematic diagram illustrating the moving directions of the galvanometer scanning module and the optical translating element of the laser scanning device shown in FIG. 6;
FIG. 8 is a view showing the construction of an optical path of a sixth embodiment of a laser scanning device of the present invention;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The laser scanning device at least comprises a light translation element 1, a galvanometer scanning module (not marked) and a focusing mirror 9. The galvanometer scanning module is mainly used for drawing a preset scanning track, and the optical translation element is mainly used for dynamically changing the offset of the light beam.
The light translation element 1 is able to rotate around a first axis Z, which is the vertical direction, and is used to refract and translate the light beam. The galvanometer scanning module comprises a first deflection mirror 7 and a second deflection mirror 8 which are arranged oppositely, the first deflection mirror 7 can rotate around a second axial direction Y and reflect a received light beam to the second deflection mirror 8, and the second deflection mirror 8 can rotate around a third axial direction C or X and reflect the received light beam. The focusing mirror 9 is used for focusing the light beam which is converted by the light translation element and the galvanometer scanning module.
Wherein, in the light path propagation direction, the positions of the light translation element 1 and the galvanometer scanning module can be interchanged.
Example one
Referring to fig. 1 and 2, a laser scanning device 100 according to a first embodiment of the present invention, a laser beam sequentially passes through a light translation element 1 and a galvanometer scanning module and then reaches a focusing mirror 9. The laser scanning device further comprises a reflecting mirror 6, wherein the reflecting mirror 6 is located between the optical translation element 1 and the galvanometer scanning module and is used for reflecting the light beam emitted from the optical translation element 1 to a first deflecting mirror 7.
Specifically, in the present embodiment, the laser scanning device 100 includes, in order along the optical path propagation direction, an optical translation element 1, a reflecting mirror 6 opposing the optical translation element 1, a first deflecting mirror 7 opposing the reflecting mirror 6, a second deflecting mirror 8 opposing the first deflecting mirror 7, and a focusing mirror 9 opposing the second deflecting mirror 8. The reflecting mirror 6 is used for reflecting the light beam emitted by the light translation element 1 to the first deflecting mirror 7.
The laser scanning device further comprises a first driving device for driving the light translation element 1 to rotate around the first axial direction Z. The light translation element 1 is a parallel plate having a light incident surface and a light emitting surface arranged in parallel. The laser beam firstly enters the optical translation element 1, the beam generates corresponding beam translation amount after passing through the optical translation element 1, different beam offset amounts are generated by adopting parallel flat plates with different thicknesses, and finally the beam can be incident to different positions on the focusing mirror 9, so that the taper of the processed micropore is influenced.
The first deflecting mirror 7 is mounted on a first driving shaft (not shown) extending along a second axial direction Y, and the laser scanning device further includes a second driving device (not shown), wherein the second driving device drives the first driving shaft to drive the first deflecting mirror 7 to swing within a first preset angle and reflect the light beam reflected by the reflecting mirror 6 to the second deflecting mirror 8. The second deflecting mirror 8 is mounted on a second driving shaft (not shown) extending along a third axial direction C, the laser scanning device further includes a third driving device (not shown), the third driving device drives the second driving shaft to drive the second deflecting mirror 8 to swing within a second preset angle and reflect the light beam reflected by the first deflecting mirror 7 to the focusing mirror 9; the focusing mirror 9 is used for focusing the light beam reflected by the second deflecting mirror 8. The starting vector direction of the galvanometer scanning module is the same as the starting vector direction of the optical translation element 1, and the starting vector direction move synchronously.
In an initial state, an included angle between the first deflecting mirror 7 and a horizontal direction (a plane direction perpendicular to the first axial direction Z) is 67.5 °, an included angle between the second deflecting mirror 8 and the horizontal direction is 22.5 °, an included angle between the first deflecting mirror 7 and the second deflecting mirror 8 is 45 °, the second axial direction Y is perpendicular to the first axial direction Z, the third axial direction C and a direction X perpendicular to the first axial direction Z and the second axial direction Y are 22.5 ° included angles, and the third axial direction C is perpendicular to the second axial direction Y. X, Y, Z are three directions in a common three-dimensional coordinate system.
The arrangement can reduce the occupied space of the optical elements to the maximum extent, and can reduce the distance between the first deflection mirror 7 and the second deflection mirror 8 and reduce the processing error. In practical application, the included angle between the first deflecting mirror 7 and the second deflecting mirror 8 can be properly adjusted on the basis of an optimal scheme, for example, the included angle between the first deflecting mirror 7 and the horizontal direction can be 50-85 degrees, the included angle between the second deflecting mirror and the horizontal direction is 5-40 degrees, the difference between the included angles between the first deflecting mirror 7 and the horizontal direction and the difference between the included angles between the second deflecting mirror 8 and the horizontal direction are 45 degrees, and the included angle between the first deflecting mirror and the second deflecting mirror is 45 degrees.
In the technical scheme of the application, when the first deflecting mirror 7 and the second deflecting mirror 8 rotate to any position, the corresponding optical translation element 1 can determine the only position through rotation, and then the maximum processing taper is obtained. The rotating speed of the whole system is determined by the rotating speed of the optical translation element, and in the moving process, the optical translation element and the galvanometer scanning module rotate synchronously.
The galvanometer scanning module and a rear optical system (the optical system is positioned behind the element in the light propagation direction, belongs to the prior art, and is not described in detail in the application) are rotated by +/-90 degrees around any rotating shaft in the horizontal direction as a whole for bevel processing. When the spectroscopic plate 2 and the optical system behind it are rotated 360 deg. around the first axis Z for circumferential machining.
In the present embodiment, the laser scanning device 100 further includes a beam splitting plate 2, a detection mirror 3 facing the beam splitting plate 2, a lens module 4 facing the detection mirror 3, and an image detector 5 facing the lens module 4. The light splitting plate 2 is located on a light emitting path of the light translation element 1, specifically, the light splitting plate 2 is located between the light translation element 1 and the reflecting mirror 6, and is used for transmitting a laser beam and receiving a light beam reflected by a processing workpiece or a processing hole (the light beam reflected by the processing workpiece or the processing hole reaches the light splitting plate 2 after passing through the focusing mirror 9, the galvanometer scanning module and the reflecting mirror 6), and further reflects the reflected light beam out through the light splitting plate. The detection light reflector 3 is used for reflecting the reflected light beam to the lens module 4; the lens module 4 is used for focusing the reflected light beam; the image detector 5 is used for imaging. The lens module 4 is a lens for focusing the detection light beam, and the image detector 5 is a CCD detector for monitoring the processing state of the laser scanning device 100 in real time.
In the present embodiment, the optical axes of the optical translation element 1, the lens module 4 and the image detector 5 are parallel to a first axial direction (i.e., the Z axis shown in fig. 2); the light splitting flat plate 2, the detection light reflector 3 and the reflector 6 are arranged to form an included angle of 45 degrees with the first axial direction.
In the present embodiment, the optical axis of the focusing mirror 9 is parallel to the first axial direction; in the initial state, the included angle between the first deflection mirror 7 and the second deflection mirror 8 is 45 degrees. In the present embodiment, the initial state refers to a state in which neither the first deflecting mirror 7 nor the second deflecting mirror 8 swings, that is, a state in which both the swing angles are 0 degrees. The focusing lens 9 includes a lens with a larger focal length to reduce the deflection angle and the distortion amount. Further, the focusing mirror 9 can move back and forth along the first axial direction, so that the focusing mirror has a motion feeding function.
In the processing process, the optical translation element rotates around a first axial direction, the first deflection mirror is driven to deflect through a first driving shaft, and the second deflection mirror is driven to deflect through a second driving shaft; when the first deflecting mirror and the second deflecting mirror are in any position, the corresponding optical translation element 1 can be rotated to determine the unique position, so that the taper of the machined hole is maximum.
Firstly, the device can meet the current machining efficiency requirement and can efficiently machine the special-shaped holes; secondly, the device can be used for processing round holes or inverted taper holes on workpieces (more than or equal to 1mm) with certain thicknesses; finally, the device can be used for processing the micropores with large depth-diameter ratio.
Example two
Referring to fig. 3, a laser scanning device 200 according to a second embodiment of the present invention is shown. Compared with the first embodiment, the laser scanning device 200 of this embodiment further includes a light splitting plate 10, a detection mirror 11 opposite to the light splitting plate 10, a lens module 12 opposite to the detection mirror 11, and an image detector 13 opposite to the lens module 12, where the light splitting plate 10 is located on the light exit path of the second deflecting mirror 8 and is configured to split the light beam emitted by the second deflecting mirror 8 into a detection light beam, the detection mirror 11 is configured to reflect the detection light beam to the lens module 12, the lens module 12 is configured to focus the detection light beam, and the image detector 13 is configured to image. The beam splitting flat plate 10 and the detection light reflector 11 form an included angle of 45 degrees with an optical axis, the lens module 12 and the image detector 13 are both arranged perpendicular to the optical axis, and the detector is used for detecting the initial position of a light beam passing through the galvanometer scanning module and detecting comprehensive changes such as long-time light beam pointing.
In this embodiment, most of the light beams emitted from the second deflecting mirror 8 are transmitted to the focusing mirror 9 through the beam splitting plate 10, and a small portion of the light beams (generally not more than 0.5%) are split to the detection light reflecting mirror 11 through the beam splitting plate 10, so that light splitting is realized.
EXAMPLE III
Referring to fig. 4, a laser scanning apparatus 300 according to a third embodiment of the present invention is shown. Compared with the first embodiment, in this embodiment, the galvanometer scanning module is disposed before the optical translation element, that is, the positions of the galvanometer scanning module and the optical translation element in the propagation direction of the optical path are changed. The placing angles and included angles of the first deflecting mirror 7 and the second deflecting mirror 8 are the same as those of the first embodiment, and in addition, the laser scanning device 300 is further provided with a diaphragm 15, and the diaphragm 15 is located on the light outgoing path of the reflecting mirror 14 and used for enabling the focal field energy of the laser beam to be close to filamentous distribution, so that the processing capacity of the micro-hole with the large depth-diameter ratio is improved. It should be noted that the position of the diaphragm 15 is not limited to the position given in fig. 4, and may be set at any position in the optical path.
Because the galvanometer scanning module is placed at the front end of the optical path of the optical translation element 1, the central position of the light beam does not change when reaching the first deflecting mirror 7 and the second deflecting mirror 8, and compared with the first embodiment, the size of the first deflecting mirror 7 and the size of the second deflecting mirror 8 can be smaller, and the scanning speed can be increased under the same deflecting angle.
The arrangement positions and the number of the reflecting mirrors 6 and 14 located at the optical path rear end of the optical shift module 1 are not limited to this embodiment.
Further, in one possible implementation, the aperture d of the diaphragm may be adjusted according to equation (1).
Figure BDA0002727855330000091
Where f is the focal length of the focusing mirror 9, and m is the focal field aspect ratio of the laser beam.
In another possible implementation, the aperture d of the diaphragm can be adjusted according to equation (2).
Figure BDA0002727855330000092
Wherein, H is the processing depth, D is the processing aperture, p is the beam translation amount, and f is the focal length of the focusing mirror 9.
According to the formula, the focal field aspect ratio of the laser beam is continuously increased along with the reduction of the aperture of the diaphragm, so that the focal field energy of the laser beam is close to filamentous distribution by reducing the aperture of the diaphragm, and the capability of the laser scanning device for processing micropores with large depth-diameter ratios is improved.
Preferably, the diaphragm 15 may be a soft-edge diaphragm, wherein the soft-edge diaphragm is free from diffraction and thus does not affect the beam quality.
In this embodiment, the diaphragm is disposed on the light path, and the aperture of the diaphragm is adjusted to achieve that the focal field energy is closer to the filamentous distribution, thereby improving the processing capability of the micro-hole with large depth-diameter ratio.
Example four
Referring to fig. 5, a laser scanning device 400 according to a fourth embodiment of the present invention is shown. Compared with the second embodiment, in this embodiment, the galvanometer scanning module is arranged before the optical translation element, that is, the positions of the galvanometer scanning module and the optical translation element in the propagation direction of the optical path are changed. The first deflecting mirror 7 and the second deflecting mirror 8 are both disposed at the same angle and included at the same angle as those of the first embodiment.
Because the galvanometer scanning module is placed at the front end of the optical path of the optical translation element 1, the central position of the light beam does not change when reaching the first deflecting mirror 7 and the second deflecting mirror 8, and compared with the second embodiment, the size of the first deflecting mirror 7 and the size of the second deflecting mirror 8 can be smaller, and the scanning speed can be increased under the same deflecting angle.
The arrangement positions and the number of the reflecting mirrors 6 and 14 located at the optical path rear end of the optical shift module 1 are not limited to this embodiment.
EXAMPLE five
Referring to fig. 6 and 7, a laser scanning apparatus 500 according to a fifth embodiment of the present invention is shown. Compared with the third embodiment, the structure of the galvanometer scanning module is changed. Specifically, in an initial state, an included angle between the first deflecting mirror 7 and the horizontal direction is 45 °, an included angle between the second deflecting mirror 8 and the horizontal direction is 45 °, the first deflecting mirror 7 and the second deflecting mirror 8 are parallel to each other, the second axial direction Y is perpendicular to the third axial direction X and both are located in the horizontal direction, and an initial vector direction of the galvanometer scanning module is opposite to an initial vector direction of the optical translation element 1 and moves synchronously with the optical translation element 1.
The included angle between the first deflecting mirror 7 and the second deflecting mirror 8 can be adjusted properly on the basis of the preferred scheme, for example, the included angle between the first deflecting mirror 7 and the horizontal direction can be 50-85 degrees, the included angle between the second deflecting mirror and the horizontal direction is 5-40 degrees, and the like, so that the difference value of the included angles between the first deflecting mirror and the horizontal direction and the difference value of the included angles between the second deflecting mirror and the horizontal direction are 45 degrees, and the included angle between the first deflecting mirror and the second deflecting mirror is 45 degrees.
EXAMPLE six
Referring to fig. 8, a laser scanning apparatus 600 according to a sixth embodiment of the invention is shown. Compared with the fifth embodiment, the laser scanning device 600 of this embodiment further includes a light splitting flat plate 10, a detection light reflector 11 opposite to the light splitting flat plate 10, a lens module 12 opposite to the detection light reflector 11, and an image detector 13 opposite to the lens module 12, where the light splitting flat plate 10 is located on the light exit path of the second deflecting mirror 8 and is used to split the light beam emitted by the second deflecting mirror 8 into a detection light beam, the detection light reflector 11 is used to reflect the detection light beam to the lens module 12, the lens module 12 is used to focus the detection light beam, and the image detector 13 is used to image.
The beam splitting flat plate 10 and the detection light reflector 11 form an included angle of 45 degrees with an optical axis, the lens module 12 and the image detector 13 are both arranged perpendicular to the optical axis, and the detector is used for detecting the initial position of a light beam passing through the galvanometer scanning module and detecting comprehensive changes such as long-time light beam pointing.
The above embodiments are merely illustrative of one or more embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The laser scanning device is characterized by comprising a light translation element, a galvanometer scanning module and a focusing mirror;
the light translation element can rotate around a first axial direction and is used for refracting and translating the light beam, and the first axial direction is a vertical direction;
the galvanometer scanning module comprises a first deflection mirror and a second deflection mirror which are arranged oppositely, the first deflection mirror can rotate around a second axial direction and reflect the received light beam to the second deflection mirror, and the second deflection mirror can rotate around a third axial direction and reflect the received light beam;
the focusing mirror is used for focusing the light beam which is converted by the light translation element and the galvanometer scanning module.
2. The laser scanning device according to claim 1, further comprising a first beam splitting plate, a first detection mirror opposite to the first beam splitting plate, a first lens module opposite to the first detection mirror, and a first image detector opposite to the first lens module; the first light splitting plate is positioned on a light emitting path of the light translation element and used for transmitting a laser beam and receiving and reflecting a beam reflected from a processing workpiece or a processing hole, the first detection light reflector is used for reflecting the reflected beam to the first lens module, and the first lens module is used for focusing the reflected beam; the first image detector is used for imaging.
3. The laser scanning device according to claim 2, further comprising a second beam splitting plate, a second detecting mirror opposite to the second beam splitting plate, a second lens module opposite to the second detecting mirror, and a second image detector opposite to the second lens module, wherein the second beam splitting plate is located on the light exit path of the second deflecting mirror and is configured to split the light beam emitted from the second deflecting mirror into a detecting light beam, the second detecting mirror is configured to reflect the detecting light beam to the second lens module, the second lens module is configured to focus the detecting light beam, and the second image detector is configured to form an image.
4. The laser scanning device according to claim 1, wherein in an initial state, an included angle between the first deflecting mirror and a horizontal direction is 50 ° to 85 °, an included angle between the second deflecting mirror and the horizontal direction is 5 ° to 40 °, a difference between the included angles between the first deflecting mirror and the horizontal direction is 45 ° and an included angle between the first deflecting mirror and the second deflecting mirror is 45 °, the second axial direction is perpendicular to the first axial direction, the third axial direction is 22.5 ° to a direction perpendicular to the first axial direction and the second axial direction, and an initial vector direction of the galvanometer scanning module is the same as an initial vector direction of the optical translating element and moves synchronously with the optical translating element.
5. The laser scanning device according to claim 4, wherein in the initial state, the angle between the first deflecting mirror and the horizontal direction is 67.5 °, and the angle between the second deflecting mirror and the horizontal direction is 22.5 °.
6. The laser scanning device according to claim 1, wherein in an initial state, an included angle between the first deflecting mirror and a horizontal direction is 30 ° to 60 °, an included angle between the second deflecting mirror and the horizontal direction is 30 ° to 60 °, the first deflecting mirror and the second deflecting mirror are parallel to each other, the second axis is perpendicular to the third axis and both are located in the horizontal direction, and a starting vector direction of the galvanometer scanning module is opposite to a starting vector direction of the optical translation element and moves synchronously with the starting vector direction.
7. The laser scanning device according to claim 1, wherein in an initial state, the first deflecting mirror forms an angle of 45 ° with the horizontal direction, and the second deflecting mirror forms an angle of 45 ° with the horizontal direction.
8. The laser scanning device according to claim 1, wherein the laser beam sequentially passes through the optical translation element and the galvanometer scanning module and then reaches the focusing mirror, and the laser scanning device further comprises a reflecting mirror, which is located between the optical translation element and the galvanometer scanning module and is configured to reflect the beam emitted from the optical translation element to the first deflecting mirror.
9. The laser scanning device according to claim 1, wherein the galvanometer scanning module and the optical system behind the galvanometer scanning module as a whole are rotated by ± 90 ° about any rotation axis located in a horizontal direction for bevel processing.
10. The laser scanning device of claim 1, further comprising a first driving device for driving the light translating element to rotate about a first axial direction.
CN202011108763.XA 2020-10-16 2020-10-16 Laser scanning device Pending CN112192021A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114459597A (en) * 2022-02-14 2022-05-10 熵智科技(深圳)有限公司 Galvanometer calibration system and method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1841172A (en) * 2005-03-10 2006-10-04 日立比亚机械股份有限公司 Apparatus and method for beam drift compensation
CN102218605A (en) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 Laser rotary-cut drilling device
CN103056519A (en) * 2012-12-26 2013-04-24 中科中涵激光设备(福建)股份有限公司 Taper-controllable laser micropore machining light beam scanning device and control method thereof
CN203343612U (en) * 2013-06-07 2013-12-18 张立国 Light beam movement trail control device used for laser processing
CN104162741A (en) * 2014-07-31 2014-11-26 北京万恒镭特机电设备有限公司 Laser processing device and method thereof
CN110695523A (en) * 2019-06-19 2020-01-17 西安中科微精光子制造科技有限公司 Laser scanning device
CN110695521A (en) * 2019-06-04 2020-01-17 西安中科微精光子制造科技有限公司 Light beam scanning system for laser micropore machining
CN111496393A (en) * 2020-03-23 2020-08-07 中国科学院西安光学精密机械研究所 Taper-controllable micro-group hole efficient laser processing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1841172A (en) * 2005-03-10 2006-10-04 日立比亚机械股份有限公司 Apparatus and method for beam drift compensation
CN102218605A (en) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 Laser rotary-cut drilling device
CN103056519A (en) * 2012-12-26 2013-04-24 中科中涵激光设备(福建)股份有限公司 Taper-controllable laser micropore machining light beam scanning device and control method thereof
CN203343612U (en) * 2013-06-07 2013-12-18 张立国 Light beam movement trail control device used for laser processing
CN104162741A (en) * 2014-07-31 2014-11-26 北京万恒镭特机电设备有限公司 Laser processing device and method thereof
CN110695521A (en) * 2019-06-04 2020-01-17 西安中科微精光子制造科技有限公司 Light beam scanning system for laser micropore machining
CN110695523A (en) * 2019-06-19 2020-01-17 西安中科微精光子制造科技有限公司 Laser scanning device
CN111496393A (en) * 2020-03-23 2020-08-07 中国科学院西安光学精密机械研究所 Taper-controllable micro-group hole efficient laser processing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114459597A (en) * 2022-02-14 2022-05-10 熵智科技(深圳)有限公司 Galvanometer calibration system and method
CN114459597B (en) * 2022-02-14 2024-03-29 熵智科技(深圳)有限公司 Vibrating mirror calibration system and method

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