CN104162741A - Laser processing device and method thereof - Google Patents

Laser processing device and method thereof Download PDF

Info

Publication number
CN104162741A
CN104162741A CN201410374711.5A CN201410374711A CN104162741A CN 104162741 A CN104162741 A CN 104162741A CN 201410374711 A CN201410374711 A CN 201410374711A CN 104162741 A CN104162741 A CN 104162741A
Authority
CN
China
Prior art keywords
wedge
plane mirror
shaped mirrors
laser
light beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410374711.5A
Other languages
Chinese (zh)
Other versions
CN104162741B (en
Inventor
李俊
李纪东
杨顺凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Zhongke Radium Electronics Co Ltd
Original Assignee
BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd filed Critical BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd
Priority to CN201410374711.5A priority Critical patent/CN104162741B/en
Publication of CN104162741A publication Critical patent/CN104162741A/en
Application granted granted Critical
Publication of CN104162741B publication Critical patent/CN104162741B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms

Abstract

The invention provides a laser processing device and a method of the laser processing device. The laser processing device comprises a laser, a lens set, a Dove prism, a plane mirror, a focus lens and a workpiece to be processed which are all sequentially arranged in the direction of an optical axis, wherein the lens set is composed of two lenses, and the distance between the two lenses can be adjusted so that the spot sizes and the divergence angles of outgoing beams of the laser can be adjusted; the Dove lens is installed in a rotary motor and rotates with the optical axis as the center, and the beams going out from the Dove lens also rotate with the optical axis as the center; the plane mirror is used for deflecting the transmission direction of the beams; the position of the focus lens in the beam transmission direction can be adjusted, and the beams are focused on the surface of the workpiece to be processed after passing through the focus lens; the workpiece to be processed is placed on an electric displacement platform and can make two-dimensional movement in the plane perpendicular to the transmission direction of the beams.

Description

Laser processing device and method thereof
Technical field
The invention belongs to technical field of laser processing, relate to a kind of laser processing device and method thereof, be specially adapted to the Laser Micro-Machining of high rigidity, brittle materials.
Background technology
Laser processing technology has that precision is high, highly versatile, efficiency is high, cost is low and the advantage such as complex art remarkable in economical benefits, has become one of the key technology in modern manufacture field, has solved the indeterminable difficult problem of some traditional machinings.Laser Processing efficiency is high, without tool loss, can on the difficult to machine material such as hard, crisp, soft, process, and be the advanced manufacturing process of micro-processing technology.
Micro-processing is a large branch of field of laser processing, along with the raising of scientific and technical progress and manufacturing industry technological level, miniaturization and the accuracy of people to product requires more and more higher, under the prerequisite that meets crudy, micro-machined minimum dimension is less, product output rate is higher, and the economic benefit obtaining is just larger.In general laser drilling, focal beam spot diameter is less, and the diameter in hole is less; Depth of focus is longer, and the tapering in hole is less; The action time of laser and workpiece is longer, and fused mass is more, and heat affected area is larger.The Gaussian characteristics of Stimulated Light light beam determines, its focal beam spot is less, and depth of focus is shorter, causes the diameter in hole less, and the more bad control of tapering in hole has had a strong impact on quality and the shape in hole.In current technology, there is publication to show to utilize rotary-cut punching technology can obtain better hole shape, more smooth hole wall, cleaner surface of the work before.
Rotary-cut punching technology is beaten micropore with percussion drilling technology and is compared, and can obtain better hole shape, but the tapering of general rotary-cut punching technology is difficult to control, and the fused mass on limit, hole is difficult to eliminate.
Summary of the invention
In order to solve the parameter such as roughness, angle of inclination, trim process size of unmanageable processing cross section in Laser Micro-Machining, the laser processing device the present invention proposes and method thereof, diameter and tapering that can control hole, the rotating speed of rotary-cut can be doubled, not only improve operating efficiency, also the corresponding action time having reduced between laser and workpiece, can effectively ensure machined surface smooth, smooth, without fused mass.
Object of the present invention is achieved through the following technical solutions:
A kind of laser processing device, it comprises laser instrument, set of lenses, Dove prism, plane mirror, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; Described Dove prism is arranged in electric rotating machine, centered by optical axis, rotates, also will be along with rotation from the light beam of described Dove prism outgoing; Described plane mirror is for the transmission direction of deflected beam; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp; Described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing device, described Dove prism is substituted by a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed, and be placed on together in electric rotating machine, centered by optical axis, rotate, also will be along with rotation from the light beam of these two wedge-shaped mirrors outgoing.
In above-mentioned laser processing device, also comprise the two-piece type vibration mirror scanning head being arranged between described Dove prism or described a pair of wedge-shaped mirrors and described plane mirror.
In above-mentioned laser processing device, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror is also connected with an electric rotating machine, can centered by optical axis, rotate described plane mirror and described Dove prism or described a pair of wedge-shaped mirrors synchronous rotary.
A kind of laser processing device, it comprises laser instrument, set of lenses, a pair of wedge-shaped mirrors, plane mirror, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; In described a pair of wedge-shaped mirrors, the angle of wedge of two wedge-shaped mirrors and size all equate and Central Symmetry placement, and each wedge-shaped mirrors is placed on respectively in an electric rotating machine, centered by optical axis, rotate, and two electric rotating machines first rotate then synchronous rotaries of angles relatively; Described plane mirror is for the transmission direction of deflected beam; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp; Described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing device, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror is also connected with an electric rotating machine, can centered by optical axis, rotate, described plane mirror is also followed synchronous rotary in the time of described two wedge-shaped mirrors synchronous rotaries.
A kind of laser processing device, it comprises laser instrument, set of lenses, plane mirror, a pair of wedge-shaped mirrors, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; Described plane mirror is for the transmission direction of deflected beam, and described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror; In described a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed; Described plane mirror is placed in electric rotating machine together with described a pair of wedge-shaped mirrors, centered by optical axis, rotates, also will be along with rotation from the light beam of described a pair of wedge-shaped mirrors outgoing; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp; Described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing device, also comprise the Dove prism being arranged between described set of lenses and described plane mirror, described Dove prism is arranged in electric rotating machine, centered by optical axis, rotates, also will be along with rotation from the light beam of described Dove prism outgoing.
In above-mentioned laser processing device, described plane mirror can move in light beam incident direction.
In above-mentioned laser processing device, also comprise the parallel flat being arranged between described plane mirror and described focus lamp, described parallel flat can deflection.
A kind of laser processing device, it comprises laser instrument, set of lenses, Dove prism, plane mirror, first pair of wedge-shaped mirrors, second pair of wedge-shaped mirrors, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; Described Dove prism is arranged in electric rotating machine, centered by optical axis, rotates, also will be along with rotation from the light beam of described Dove prism outgoing; Described plane mirror is for the transmission direction of deflected beam; In described first pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative distance capable of regulating; In described second pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative angle capable of regulating; Described first pair of wedge-shaped mirrors and described second pair of wedge-shaped mirrors are placed in same rotating mechanism synchronous rotary centered by optical axis; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp.
In above-mentioned laser processing device, described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing device, also comprise the Gauss beam reshaping element being arranged between described laser instrument and described processing work, the energy density distribution of the outgoing beam of described laser instrument on the cross section vertical with transmission direction is Gaussian distribution, and the energy density distribution from the light beam of described Gauss beam reshaping element outgoing on the cross section vertical with transmission direction is that the uniform flat-top of energy density distributes.
In above-mentioned laser processing device, also comprise the electronics optical gate being arranged between described laser instrument and described set of lenses, utilize its time delay for the initial l fraction of laser is blocked.
A kind of laser processing, it comprises: the outgoing beam of laser instrument incides the Dove prism or a pair of wedge-shaped mirrors that centered by optical axis, rotate after the adjustment of spot size and the angle of divergence, also centered by optical axis, rotate from the light beam of described Dove prism or a pair of wedge-shaped mirrors outgoing, then by the transmission direction of plane mirror deflected beam, light beam is again by focusing on the surface of processing work after focus lamp, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam, in described a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed.
In above-mentioned laser processing, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror also with described Dove prism or described a pair of wedge-shaped mirrors synchronous rotary.
In above-mentioned laser processing, between described Dove prism or described a pair of wedge-shaped mirrors and described plane mirror, arrange two-piece type vibration mirror scanning head.
A kind of laser processing, it comprises: the outgoing beam of laser instrument incides a pair of wedge-shaped mirrors rotating centered by optical axis after the adjustment of spot size and the angle of divergence, in described a pair of wedge-shaped mirrors, the angle of wedge of two wedge-shaped mirrors and size all equate and Central Symmetry placement, two wedge-shaped mirrors first rotate then synchronous rotary of an angle relatively, then by the transmission direction of plane mirror deflected beam, light beam is again by focusing on the surface of processing work after focus lamp, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror also and then synchronous rotary in the time of described two wedge-shaped mirrors synchronous rotaries.
A kind of laser processing, it comprises: the outgoing beam of laser instrument incides plane mirror after the adjustment of spot size and the angle of divergence, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, light beam incides a pair of wedge-shaped mirrors after by plane mirror deflection transmission direction, in described a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed, described plane mirror rotates together with described a pair of wedge-shaped mirrors centered by optical axis, also centered by optical axis, rotate from the light beam of described a pair of wedge-shaped mirrors outgoing, then light beam is again by focusing on the surface of processing work after focus lamp, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing, the outgoing beam of laser instrument first incides the Dove prism rotating centered by optical axis after the adjustment of spot size and the angle of divergence, then incide described plane mirror, also centered by optical axis, rotate from the light beam of described Dove prism outgoing.
In above-mentioned laser processing, described plane mirror can move in light beam incident direction.
In above-mentioned laser processing, between described plane mirror and described focus lamp, arrange deflectable parallel flat.
A kind of laser processing, it comprises: the outgoing beam of laser instrument incides the Dove prism rotating centered by optical axis after the adjustment of spot size and the angle of divergence, also centered by optical axis, rotate from the light beam of described Dove prism outgoing, then by the transmission direction of plane mirror deflected beam, light beam incides first pair of wedge-shaped mirrors and second pair of wedge-shaped mirrors of synchronous rotary centered by optical axis successively, light beam is again by focusing on the surface of processing work after focus lamp, in described first pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative distance capable of regulating, in described second pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative angle capable of regulating.
In above-mentioned laser processing, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam.
In above-mentioned laser processing, between described laser instrument and described processing work, arrange Gauss beam reshaping element, the energy density distribution of the outgoing beam of described laser instrument on the cross section vertical with transmission direction is Gaussian distribution, and the energy density distribution from the light beam of described Gauss beam reshaping element outgoing on the cross section vertical with transmission direction is that the uniform flat-top of energy density distributes.
In above-mentioned laser processing, the initial l fraction of laser emitting light beam is blocked.
Laser processing device of the present invention, 2 dimension translational motions and one that can integrate light beam rotatablely move, and realize dynamic laser processing, shorten the continuous time of laser to workpiece effect, reduce heat affected area, increase the smoothness of machined surface, can increase work efficiency simultaneously.It is smooth that the advantage that laser spot is rotated is to make processing cross section, reduces splashing and fused deposition of surface.But because Laser Focusing spot diameter is generally all in 20um left and right, the Area comparison of processing is little, in the time can adjusting laser beam and incide the position on focus lamp, be the processing dimension of capable of regulating laser, can by translated plane speculum or by adjust wedge between phase mutual edge distance adjust laser beam and incide the position on focus lamp.
Under some practical situations, require processing cross section to have certain gradient, to punch as example, have requirement straight hole, also have the product of requirement taper hole or reverse taper holes.Therefore need a kind of method that can control tapering.By Oscillating flat mirror or by wedge, or by ripe vibration mirror scanning head to adjusting the incident angle of laser beam with respect to focus lamp.Can adjust the size of processing cross section.
The present invention, on the basis of laser spinning, adjusts laser beam and incides position and the angle on focus lamp, controls the size of Laser Processing, tapering, and surface smoothing degree etc., can meet the demand that on market, great majority are applied.
Laser processing device uniqueness of the present invention is in the control to light path, and the one, by adjusting the relative distance of first lens and the second lens, can adjust the diameter of focal beam spot, implement to adjust the live width on workpiece machined surface; The 2nd, by spinning unit, make light beam rotation, the same with the drill bit of electric drill, avoid the Energy distribution difference of pulse or continuous impulse and cause machined surface uneven, stick the problem of slag, and process velocity can improve at least one times; The 3rd, control aperture by beam deflection unit, beam deflection unit is fixed on high-precision rotary motor, realize processing action; The 4th, can realize the control of the gradient to processing cross section by gradient control module, processing cross-section smooth, does not have fused mass.
Brief description of the drawings
Fig. 1 is the structure chart of the first laser processing device of the present invention;
Fig. 2 is the schematic diagram of the present invention at the light beam of surface of the work formation;
Fig. 3 is the structure chart of the second laser processing device of the present invention;
Fig. 4 is the structure chart of the third laser processing device of the present invention;
Fig. 5 is that light beam when two electric rotating machines have relative rotation in Fig. 4 forms schematic diagram;
Fig. 6 is the structure chart of the 4th kind of laser processing device of the present invention;
Fig. 7 is the structure chart of the 5th kind of laser processing device of the present invention;
Fig. 8 is the structure chart of the 6th kind of laser processing device of the present invention;
Fig. 9 is the structure chart of the 7th kind of laser processing device of the present invention;
Figure 10 is the structure chart of the 8th kind of laser processing device of the present invention;
Figure 11 is the focusing effect schematic diagram that Figure 10 midplane speculum produces in the time that directions X moves;
Figure 12 is the structure chart of the 9th kind of laser processing device of the present invention;
Figure 13 is the structure chart of the tenth kind of laser processing device of the present invention;
Figure 14 is the spiral machining locus that the tenth kind of laser processing device of the present invention realized;
Figure 15 is that the twill that the tenth kind of laser processing device of the present invention realized is filled machining locus;
Figure 16 is that the grid that the tenth kind of laser processing device of the present invention realized is filled machining locus;
Figure 17 is the energy density distribution figure of laser emitting light beam of the present invention;
Figure 18 is the energy density distribution figure after Gauss beam reshaping of the present invention;
Figure 19 is the structure chart of the 11 kind of laser processing device of the present invention.
Figure 20 is the schematic diagram of Laser Processing tapering.
In figure, the implication of each mark is as follows:
1: laser instrument;
2: electronics optical gate;
31: first lens;
32: the second lens;
4: Dove prism;
5: plane mirror;
51: plane mirror;
52: plane mirror;
53: plane mirror;
54: right-angle prism;
6: focus lamp;
7: processing work;
8: parallel flat;
9: wedge-shaped mirrors;
91: wedge-shaped mirrors 1;
92: wedge-shaped mirrors 2;
93: wedge-shaped mirrors 3;
94: wedge-shaped mirrors 4;
10: Gauss beam reshaping element
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in detail:
Fig. 1 shows the schematic diagram of the laser processing device described in an embodiment in the present invention.Laser processing device is composed as follows: laser instrument 1, has high-octane continuous or pulse laser for transmitting; Electronics optical gate 2, utilizes its time delay that the initial l fraction of pulse laser is blocked, and avoids the irregular of machined surface; Be arranged on the set of lenses on electricity driving displacement platform, be made up of lens 31 and lens 32, the distance between lens 31 and lens 32 is relatively adjustable, reduces the angle of divergence of Emission Lasers light beam, expands spot diameter; Dove prism 4, is arranged in hollow shaft electric rotating machine, can High Rotation Speed, and in the time that Dove prism rotates with speed omega, outgoing beam is with the speed spinning of 2 ω; Plane mirror 5, by from the photoconduction of Dove prism 4 outgoing to being normally incident in focus lamp 6; Light beam, by after focus lamp 6, focuses on the surface of processing work 7.Focus lamp 6 can move on the direction of propagation of light, adjusts in real time the relative position between laser spot and surface of the work.
In Fig. 1, have 3 groups of motions, set of lenses is arranged on line slideway, and the position between lens 31 and lens 32 is relatively adjustable, by adjusting the relative position between lens 31 and lens 32, adjusts the size of final focus point spot diameter.Dove prism 4 is arranged on high-speed rotary motor, and because light beam has a total reflection in Dove prism inside, in the time that driven by motor Dove prism rotates, outgoing beam rotates thereupon, and rotating shaft is optical axis.Focus lamp 6 is arranged on high accuracy line slideway, is driven by motor, can on the direction of propagation of light, adjust the position of focus lamp 6, but real-time ensuring focus point is positioned at surface to be machined.
In the time that workpiece in Fig. 1 is positioned over X-Y mobile platform, in the time that X-Y mobile platform drives workpiece motion s, the light beam that focuses on surface of the work is formed by two parts movement combination, a profile driving for mobile platform, and one is the high speed rotary motion of focused beam centered by optical axis.Taking circular trace as example, its movement locus as shown in Figure 2.Beam trajectory A is the motion of mobile platform, and what beam trajectory B was focused beam rotatablely moves.Due to the combination of two kinds of motions, can ensure to process the level and smooth of cross section, avoid burr.
Dove prism in Fig. 1 also can be replaced with a pair of wedge-shaped mirrors, as shown in Figure 3.The size of wedge-shaped mirrors 91 and 92 and the angle of wedge equate and Central Symmetry is placed.Wedge-shaped mirrors 91 is fixed on high-speed rotary motor together with 92.When 91 and 92 rotation of driven by motor wedge-shaped mirrors, outgoing beam is rotated centered by optical axis, reaches the function identical with Dove prism 4.
Fig. 4 represents the third laser processing device of the present invention, and this laser processing device is particularly useful for boring.This processing unit (plant), on the basis of Fig. 3, is contained in wedge-shaped mirrors 91 and wedge-shaped mirrors 92 respectively on 2 electric rotating machine C, D.In the time that electric rotating machine C does individual low-angle rotation with respect to D, by there is a little drift angle with respect to incident light, also will depart from optical axis center O by the focus point after focus lamp 6 from the emergent light of wedge-shaped mirrors 92, focus on O1 point, as shown in Figure 5.Then, motor C and D are during with identical speed synchronous rotary, and focus point O1 just rotates centered by O.This laser processing device is ensureing in the carrot-free situation of processing cross-section smooth, real-time change aperture, and by rotation C and D, the relative angle between adjustment wedge-shaped mirrors 91 and 92, and then change focus point O to the distance between O1, be aperture.
The object that adjustment aperture is realized in relative drift angle between two wedge-shaped mirrors of this adjustment also can realize by Oscillating flat mirror 5.As shown in Figure 6.Plane mirror 5 is arranged on high accuracy angular deflection platform, in the time that needs are adjusted focus point position, realizes by the angle of adjusting plane mirror 5.Adjust the drift angle of plane mirror by motor E, realize the change of focus point O to distance between O1.Then plane mirror 5 is connected with high-speed rotary motor R again, and motor R drives plane mirror to be rotated centered by optical axis, and its rotating speed is synchronizeed with motor C and D, realizes the rotation of focus point O1 taking O as the center of circle.
Also can optimize and save a motor for the laser processing device shown in Fig. 6, as shown in Figure 7.Plane mirror 5 is arranged on high accuracy angular deflection platform, realizes motion E; By wedge-shaped mirrors 91 and wedge-shaped mirrors 92 Central Symmetry fixed placement, be connected with high-speed rotary motor R together with the plane mirror that can adjust drift angle.This device can be realized and adjust drift angle, and focal beam spot is rotating two kinds of motions.
Light beam spinning effect shown in associating Fig. 1, adds after Dove prism, can realize each processing stand with light beam spinning, ensures the even of Energy distribution, avoids the coarse of machined surface.Specifically as shown in Figure 8.
The deflection of the adjustment plane mirror 5 shown in Fig. 7 and Fig. 8 realizes motion, also can substitute with two-piece type vibration mirror scanning head, by editing out arbitrary graphic to the control of galvanometer motor, as shown in Figure 9.
Due to the Gaussian characteristics of laser beam, laser spot center energy is the highest, and the closer to outer, laser energy is lower; Loss while propagation downwards from workpiece surface due to laser again, causes acting on after laser beam focusing that surface of the work forms is that aperture, porch is large, the conical surface that aperture, exit is little.Especially in laser boring, hole shape is easy to become bellmouth.And commercial Application needs the straight hole that hole wall is smooth mostly at present, or reverse taper holes, in laser processing device, be necessary to realize the control to tapering.Therefore need to adjust the light-beam position inciding on focus lamp, adjust tapering.In the laser processing device shown in Fig. 8, add again motion in one dimension, as shown in figure 10, can realize capable of regulating laser beam and incide the position on focus lamp.
Y motion in Figure 10 drives plane mirror 5 in the time that directions X moves, and the different focusing effect of generation as shown in figure 11.
The motion Y that drive plane mirror 5 in Figure 10 moves at directions X also can substitute with parallel flat that can deflection, avoids the installation accuracy of bringing because of the multi-dimensional movement of plane mirror 5 to require high, expensive.Specifically as shown in figure 12.
Also can be optimized for as shown in figure 13 for the laser processing device shown in Figure 12.The laser beam that laser instrument 1 sends is by after optical gate 2, enter hot spot and adjust set of lenses 31 and 32, the angle of divergence and the spot size of adjusting laser beam, the Dove prism 4 of rotation rotates laser beam thereupon, and plane mirror 5 makes laser beam enter another rotating mechanism W.Rotating mechanism W comprises wedge 91,92,93 and 94.4 wedge synchronous rotaries in rotating mechanism.By adjusting the relative distance between 91 and 92, can adjust laser the relative position that incides focus lamp.By adjusting the relative angle between 93 and 94, can adjust laser the relative angle that incides focus lamp.On the direction of propagation of light, transportable focus lamp 6 is adjusted the relative position between focal beam spot and surface of the work 7.By spinning mechanism, adjust laser and incide the relative position mechanism on focus lamp, to adjust laser and incide the relative angle mechanism on focus lamp, the control of this three aspects: can realize the track of arbitrary shape.Back and forth process by multistep at machining area, can ensure finished surface, quality and the appearance requirement of processing cross section.Especially taking punching as example, can have helical trajectory as shown in figure 14, the twill shown in Figure 15 is filled track, and the grid shown in Figure 16 is filled track.
As everyone knows, the energy density distribution of the light beam of laser emitting on the cross section vertical with the direction of propagation is Gaussian distribution, as shown in figure 17.From the position away from spot center, energy reduces.In the time carrying out Laser Processing, when laser energy is not enough, can make the edge of a knife of Laser Processing occur fused mass, cross section poor quality like this.Therefore add therein Gauss beam reshaping element, the energy density distribution that makes light beam is flat-top, as shown in figure 18, O is the center of circle of laser facula, spot radius is OR1=OR2, and laser energy is evenly distributed on whole laser facula, laser facula noenergy gradient difference, processing knife-edge part is without fused mass and re cast layer, and sidewall is smooth.Can realize above-mentioned Gauss beam reshaping by microlens array or diffraction optical element.
As shown in figure 19, after the plane mirror 5 in Figure 13, add a Gauss beam reshaping element, the energy density distribution of the light beam after outgoing in the plane vertical with the direction of propagation is flat-top.The flat top beam rotating enters two pairs of wedges, adjusts translational movement and the angle of light according to process requirements, makes to process the edge of a knife smooth, smooth, without ginseng time uneven breach.
All governor motions of this laser processing device have all been realized automatically controlled, especially can meet variation and the flexibility of product.Advantage is, can not only double rotating speed, increases work efficiency, and reduces the action time between laser and workpiece, eliminates heat affected area, and can control the diameter in hole and tapering.This laser processing device can not only be competent at the processing of micropore, also can complete special-shaped cutting.
Laser instrument taking wavelength as 1064nm is example, the focal length of the focus lamp using is 50mm, incide spot diameter before focus lamp and be 10mm (in the present embodiment only taking circular light spot as example, but its shape is not limited to circle, can also be square or other shapes, normal beam incides Gauss beam reshaping element 5, the circular light spot of Gaussian characteristics is converted to the uniform flat-top hot spot of energy density, the shape of hot spot can be square, rectangle, the arbitrary shape such as linear or oval, select according to the micro-process requirements of reality, these shapes are decided by the design of Gauss beam reshaping element).The about 11.5um. of spot diameter after focusing on adopts the device shown in Figure 19, and it is the improvement of tapering that the processing result of gained the most significantly improves. as shown in figure 20, the schematic diagram of tapering, the computing formula of tapering is:
Tapering=(Din-Dout)/thickness
In the situation that thickness of workpiece is identical, hand-hole aperture Din and the difference of aperture Dout of portalling are less, and tapering is less. the device shown in prior device and Figure 19, and be contrast experiment on the thick ceramic substrate of 1mm time, its tapering size is as shown in the table:
? Din Dout Difference
Prior device 50um 20um 30um
This device 50um 49.5um 0.5um
Certainly in the situation that having, requiring tapering is negative value.Such as fuel nozzle, require Din to be less than Dout, evidence, in the application's device, can realize arbitrary taper value completely.
The present invention does not do any pro forma restriction, the simple modification that every foundation technical spirit of the present invention is carried out, and equivalent variations and modification, all still belong in the scope of technical solution of the present invention.

Claims (27)

1. a laser processing device, it comprises laser instrument, set of lenses, Dove prism, plane mirror, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; Described Dove prism is arranged in electric rotating machine, centered by optical axis, rotates, also will be along with rotation from the light beam of described Dove prism outgoing; Described plane mirror is for the transmission direction of deflected beam; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp; Described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
2. laser processing device as claimed in claim 1, described Dove prism is substituted by a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed, and be placed on together in electric rotating machine, centered by optical axis, rotate, also will be along with rotation from the light beam of these two wedge-shaped mirrors outgoing.
3. laser processing device as claimed in claim 1 or 2, also comprises the two-piece type vibration mirror scanning head being arranged between described Dove prism or described a pair of wedge-shaped mirrors and described plane mirror.
4. laser processing device as claimed in claim 1 or 2, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror is also connected with an electric rotating machine, can centered by optical axis, rotate described plane mirror and described Dove prism or described a pair of wedge-shaped mirrors synchronous rotary.
5. a laser processing device, it comprises laser instrument, set of lenses, a pair of wedge-shaped mirrors, plane mirror, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; In described a pair of wedge-shaped mirrors, the angle of wedge of two wedge-shaped mirrors and size all equate and Central Symmetry placement, and each wedge-shaped mirrors is placed on respectively in an electric rotating machine, centered by optical axis, rotate, and two electric rotating machines first rotate then synchronous rotaries of angles relatively; Described plane mirror is for the transmission direction of deflected beam; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp; Described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
6. laser processing device as claimed in claim 5, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror is also connected with an electric rotating machine, can centered by optical axis, rotate, described plane mirror is also followed synchronous rotary in the time of described two wedge-shaped mirrors synchronous rotaries.
7. a laser processing device, it comprises laser instrument, set of lenses, plane mirror, a pair of wedge-shaped mirrors, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; Described plane mirror is for the transmission direction of deflected beam, and described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror; In described a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed; Described plane mirror is placed in electric rotating machine together with described a pair of wedge-shaped mirrors, centered by optical axis, rotates, also will be along with rotation from the light beam of described a pair of wedge-shaped mirrors outgoing; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp; Described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
8. laser processing device as claimed in claim 7, also comprise the Dove prism being arranged between described set of lenses and described plane mirror, described Dove prism is arranged in electric rotating machine, centered by optical axis, rotates, also will be along with rotation from the light beam of described Dove prism outgoing.
9. the laser processing device as described in claim 1-8 any one, described plane mirror can move in light beam incident direction.
10. the laser processing device as described in claim 1-8 any one, also comprises the parallel flat being arranged between described plane mirror and described focus lamp, and described parallel flat can deflection.
11. 1 kinds of laser processing devices, it comprises laser instrument, set of lenses, Dove prism, plane mirror, first pair of wedge-shaped mirrors, second pair of wedge-shaped mirrors, focus lamp and the processing work arranged successively along optical axis direction; Described set of lenses is made up of two lens, and the distance between two lens is adjustable, in order to adjust spot size and the angle of divergence of laser emitting light beam; Described Dove prism is arranged in electric rotating machine, centered by optical axis, rotates, also will be along with rotation from the light beam of described Dove prism outgoing; Described plane mirror is for the transmission direction of deflected beam; In described first pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative distance capable of regulating; In described second pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative angle capable of regulating; Described first pair of wedge-shaped mirrors and described second pair of wedge-shaped mirrors are placed in same rotating mechanism synchronous rotary centered by optical axis; The position of described focus lamp in beam Propagation direction is adjustable, and light beam focuses on the surface of described processing work after by described focus lamp.
12. laser processing devices as claimed in claim 11, described processing work is placed on electricity driving displacement platform, and it can make two dimensional motion in the plane vertical with the transmission direction of light beam.
13. laser processing devices as described in aforementioned any one claim, also comprise the Gauss beam reshaping element being arranged between described laser instrument and described processing work, the energy density distribution of the outgoing beam of described laser instrument on the cross section vertical with transmission direction is Gaussian distribution, and the energy density distribution from the light beam of described Gauss beam reshaping element outgoing on the cross section vertical with transmission direction is that the uniform flat-top of energy density distributes.
14. laser processing devices as described in aforementioned any one claim, also comprise the electronics optical gate being arranged between described laser instrument and described set of lenses, utilize its time delay for the initial l fraction of laser is blocked.
15. 1 kinds of laser processings, it comprises: the outgoing beam of laser instrument incides the Dove prism or a pair of wedge-shaped mirrors that centered by optical axis, rotate after the adjustment of spot size and the angle of divergence, also centered by optical axis, rotate from the light beam of described Dove prism or a pair of wedge-shaped mirrors outgoing, then by the transmission direction of plane mirror deflected beam, light beam is again by focusing on the surface of processing work after focus lamp, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam, in described a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed.
16. laser processings as claimed in claim 15, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror also with described Dove prism or described a pair of wedge-shaped mirrors synchronous rotary.
17. laser processings as claimed in claim 15 are arranged two-piece type vibration mirror scanning head between described Dove prism or described a pair of wedge-shaped mirrors and described plane mirror.
18. 1 kinds of laser processings, it comprises: the outgoing beam of laser instrument incides a pair of wedge-shaped mirrors rotating centered by optical axis after the adjustment of spot size and the angle of divergence, in described a pair of wedge-shaped mirrors, the angle of wedge of two wedge-shaped mirrors and size all equate and Central Symmetry placement, two wedge-shaped mirrors first rotate then synchronous rotary of an angle relatively, then by the transmission direction of plane mirror deflected beam, light beam is again by focusing on the surface of processing work after focus lamp, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam.
19. laser processings as claimed in claim 18, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, described plane mirror also and then synchronous rotary in the time of described two wedge-shaped mirrors synchronous rotaries.
20. 1 kinds of laser processings, it comprises: the outgoing beam of laser instrument incides plane mirror after the adjustment of spot size and the angle of divergence, described plane mirror is arranged on angular deflection platform in order to adjust the drift angle of described plane mirror, light beam incides a pair of wedge-shaped mirrors after by plane mirror deflection transmission direction, in described a pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed and relative position is fixed, described plane mirror rotates together with described a pair of wedge-shaped mirrors centered by optical axis, also centered by optical axis, rotate from the light beam of described a pair of wedge-shaped mirrors outgoing, then light beam is again by focusing on the surface of processing work after focus lamp, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam.
21. laser processings as claimed in claim 20, the outgoing beam of laser instrument first incides the Dove prism rotating centered by optical axis after the adjustment of spot size and the angle of divergence, then incide described plane mirror, also centered by optical axis, rotate from the light beam of described Dove prism outgoing.
22. laser processings as described in claim 15-21 any one, described plane mirror can move in light beam incident direction.
23. laser processings as described in claim 15-21 any one are arranged deflectable parallel flat between described plane mirror and described focus lamp.
24. 1 kinds of laser processings, it comprises: the outgoing beam of laser instrument incides the Dove prism rotating centered by optical axis after the adjustment of spot size and the angle of divergence, also centered by optical axis, rotate from the light beam of described Dove prism outgoing, then by the transmission direction of plane mirror deflected beam, light beam incides first pair of wedge-shaped mirrors and second pair of wedge-shaped mirrors of synchronous rotary centered by optical axis successively, light beam is again by focusing on the surface of processing work after focus lamp, in described first pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative distance capable of regulating, in described second pair of wedge-shaped mirrors, the angle of wedge and the size of two wedge-shaped mirrors all equate, Central Symmetry is placed, between relative angle capable of regulating.
25. laser processings as claimed in claim 24, described processing work is made two dimensional motion in the plane vertical with the transmission direction of light beam.
26. laser processings as described in claim 15-25 any one, between described laser instrument and described processing work, arrange Gauss beam reshaping element, the energy density distribution of the outgoing beam of described laser instrument on the cross section vertical with transmission direction is Gaussian distribution, and the energy density distribution from the light beam of described Gauss beam reshaping element outgoing on the cross section vertical with transmission direction is that the uniform flat-top of energy density distributes.
27. laser processings as described in claim 15-26 any one, block the initial l fraction of laser emitting light beam.
CN201410374711.5A 2014-07-31 2014-07-31 Laser processing device and method thereof Active CN104162741B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410374711.5A CN104162741B (en) 2014-07-31 2014-07-31 Laser processing device and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410374711.5A CN104162741B (en) 2014-07-31 2014-07-31 Laser processing device and method thereof

Publications (2)

Publication Number Publication Date
CN104162741A true CN104162741A (en) 2014-11-26
CN104162741B CN104162741B (en) 2016-06-01

Family

ID=51906828

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410374711.5A Active CN104162741B (en) 2014-07-31 2014-07-31 Laser processing device and method thereof

Country Status (1)

Country Link
CN (1) CN104162741B (en)

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104690432A (en) * 2015-02-03 2015-06-10 大族激光科技产业集团股份有限公司 Precision laser cutting and micro-hole machining device
CN104703398A (en) * 2015-03-27 2015-06-10 大族激光科技产业集团股份有限公司 Optimizing method of spiral processing track of FPC (Flexible Printed Circuit) blind hole
CN105382425A (en) * 2015-12-14 2016-03-09 武汉隽龙科技有限公司 Optical scanning system and punching method used for laser rotary punching
CN105642893A (en) * 2015-10-14 2016-06-08 哈尔滨福沃德多维智能装备有限公司 Laser spot diameter output adjustable device and method for selective laser melting system
CN106195671A (en) * 2016-09-03 2016-12-07 超视界激光科技(苏州)有限公司 Laser module
CN106312333A (en) * 2016-10-09 2017-01-11 中国航空工业集团公司北京航空制造工程研究所 Method and system for processing hole with laser
CN106903433A (en) * 2017-02-21 2017-06-30 机械科学研究总院先进制造技术研究中心 A kind of hot spot adjustable laser cladding head
CN107186346A (en) * 2017-07-19 2017-09-22 成都市珑熙科技有限公司 Laser drilling system and method
CN107627038A (en) * 2017-11-08 2018-01-26 钦成科技有限公司 Process the laser system of non-circular hole
CN108067730A (en) * 2018-01-08 2018-05-25 西安中科微精光子制造科技有限公司 For lens type light-beam scanner, system and the beam scanning method of laser micropore processing
CN108115289A (en) * 2016-11-28 2018-06-05 深圳中科光子科技有限公司 A kind of laser processing device and laser processing
CN108145309A (en) * 2018-02-09 2018-06-12 北京大学口腔医学院 Multiple degrees of freedom laser process equipment
CN109079345A (en) * 2018-07-12 2018-12-25 南京瑞驰电子技术工程实业有限公司 A kind of laser-beam drilling machine and control method with a variety of punching functions
CN109219496A (en) * 2016-05-30 2019-01-15 普雷茨特两合公司 The device with optical distance-measuring device and prism deflection unit of process monitoring and the laser Machining head with it when laser processing
CN109663915A (en) * 2018-12-28 2019-04-23 淮阴工学院 A kind of laser gain material manufacture crack stopper
CN110449731A (en) * 2019-08-27 2019-11-15 华中科技大学 A kind of laser change cone diameter variable rotary working of the cutting hole optical system
CN110587141A (en) * 2019-10-10 2019-12-20 山东理工大学 Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser
CN110587155A (en) * 2019-08-29 2019-12-20 武汉安扬激光技术有限责任公司 Laser processing device for cutting inverted taper hole or groove and using method thereof
CN110919172A (en) * 2019-12-26 2020-03-27 中国科学院长春光学精密机械与物理研究所 Roller surface microstructure manufacturing equipment, system and method
CN111375913A (en) * 2018-12-28 2020-07-07 三星钻石工业株式会社 Laser processing device and beam rotator unit
CN111790982A (en) * 2020-07-15 2020-10-20 中国航空制造技术研究院 Laser hole making device and method
CN112008239A (en) * 2020-07-22 2020-12-01 中国科学院西安光学精密机械研究所 Spiral scanning laser processing device and processing method
WO2020244200A1 (en) * 2019-06-04 2020-12-10 西安中科微精光子制造科技有限公司 Light beam scanning system and laser processing device
CN112059409A (en) * 2020-08-31 2020-12-11 深圳泰德激光科技有限公司 Laser drilling device
CN112164961A (en) * 2020-09-29 2021-01-01 长春理工大学 Aviation pencil end laser processing equipment
CN112192019A (en) * 2020-10-13 2021-01-08 深圳市韵腾激光科技有限公司 Laser processing drilling system
CN112192021A (en) * 2020-10-16 2021-01-08 西安中科微精光子制造科技有限公司 Laser scanning device
CN112496527A (en) * 2019-08-26 2021-03-16 佳能株式会社 Optical device and article manufacturing method
CN112846546A (en) * 2021-03-10 2021-05-28 武汉华工激光工程有限责任公司 Laser cutting system
CN112975171A (en) * 2021-03-25 2021-06-18 清华大学 Ultrafast laser micropore rotary-cut processingequipment
CN113102902A (en) * 2021-05-10 2021-07-13 武汉华工激光工程有限责任公司 Burr-free laser drilling method for carbon fiber composite material
CN113437631A (en) * 2021-06-28 2021-09-24 北京科益虹源光电技术有限公司 Excimer laser and line width narrowing device and method
CN113634925A (en) * 2021-07-27 2021-11-12 江苏先河激光研究院有限公司 Laser rotary cutting processing system and method
CN114160963A (en) * 2021-12-29 2022-03-11 武汉奥森迪科智能科技股份有限公司 Handheld laser welding head with adjustable light spot
CN114592832A (en) * 2022-03-15 2022-06-07 西南石油大学 Laser perforation robot
CN114833472A (en) * 2022-05-26 2022-08-02 苏州思萃声光微纳技术研究所有限公司 Laser processing method for non-taper cooling air film hole of aero-engine flame tube
CN114888458A (en) * 2021-08-17 2022-08-12 武汉华工激光工程有限责任公司 Parallel rotary cutting machining device and method
WO2023279662A1 (en) * 2021-07-07 2023-01-12 广东原点智能技术有限公司 Laser rotary cutting system and rotary cutting method
CN116117304A (en) * 2023-02-03 2023-05-16 武汉引领光学技术有限公司 Rotation following optical device for shaping light beam and laser processing system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6444948B1 (en) * 1997-10-15 2002-09-03 Daimlerchrysler Ag Fine and micro-machining process for workpieces by means of laser beams
CN101161400A (en) * 2007-11-13 2008-04-16 苏州维旺科技有限公司 Method for manufacturing mould core of light conducting plate
CN101670486A (en) * 2009-09-23 2010-03-17 上海市激光技术研究所 Laser micropore processor of rotating double-optical wedge
CN101881889A (en) * 2010-06-13 2010-11-10 深圳市大族激光科技股份有限公司 Optical shaping system
US20100288740A1 (en) * 2008-02-29 2010-11-18 Toyota Jidosha Kabushiki Kaisha Laser processing apparatus and laser processing method
CN102922142A (en) * 2012-10-30 2013-02-13 张立国 Method for laser processing
CN203091969U (en) * 2013-02-05 2013-07-31 余振新 Laser optical path guide system for laser sinter molding device
CN204122927U (en) * 2014-07-31 2015-01-28 北京万恒镭特机电设备有限公司 Laser processing device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6444948B1 (en) * 1997-10-15 2002-09-03 Daimlerchrysler Ag Fine and micro-machining process for workpieces by means of laser beams
CN101161400A (en) * 2007-11-13 2008-04-16 苏州维旺科技有限公司 Method for manufacturing mould core of light conducting plate
US20100288740A1 (en) * 2008-02-29 2010-11-18 Toyota Jidosha Kabushiki Kaisha Laser processing apparatus and laser processing method
CN101670486A (en) * 2009-09-23 2010-03-17 上海市激光技术研究所 Laser micropore processor of rotating double-optical wedge
CN101881889A (en) * 2010-06-13 2010-11-10 深圳市大族激光科技股份有限公司 Optical shaping system
CN102922142A (en) * 2012-10-30 2013-02-13 张立国 Method for laser processing
CN203091969U (en) * 2013-02-05 2013-07-31 余振新 Laser optical path guide system for laser sinter molding device
CN204122927U (en) * 2014-07-31 2015-01-28 北京万恒镭特机电设备有限公司 Laser processing device

Cited By (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104690432A (en) * 2015-02-03 2015-06-10 大族激光科技产业集团股份有限公司 Precision laser cutting and micro-hole machining device
CN104703398A (en) * 2015-03-27 2015-06-10 大族激光科技产业集团股份有限公司 Optimizing method of spiral processing track of FPC (Flexible Printed Circuit) blind hole
CN104703398B (en) * 2015-03-27 2018-01-09 大族激光科技产业集团股份有限公司 A kind of optimization method of the screw processing track of FPC blind holes
CN105642893A (en) * 2015-10-14 2016-06-08 哈尔滨福沃德多维智能装备有限公司 Laser spot diameter output adjustable device and method for selective laser melting system
CN105382425A (en) * 2015-12-14 2016-03-09 武汉隽龙科技有限公司 Optical scanning system and punching method used for laser rotary punching
CN109219496A (en) * 2016-05-30 2019-01-15 普雷茨特两合公司 The device with optical distance-measuring device and prism deflection unit of process monitoring and the laser Machining head with it when laser processing
CN106195671A (en) * 2016-09-03 2016-12-07 超视界激光科技(苏州)有限公司 Laser module
CN106312333A (en) * 2016-10-09 2017-01-11 中国航空工业集团公司北京航空制造工程研究所 Method and system for processing hole with laser
CN108115289A (en) * 2016-11-28 2018-06-05 深圳中科光子科技有限公司 A kind of laser processing device and laser processing
CN106903433A (en) * 2017-02-21 2017-06-30 机械科学研究总院先进制造技术研究中心 A kind of hot spot adjustable laser cladding head
CN107186346A (en) * 2017-07-19 2017-09-22 成都市珑熙科技有限公司 Laser drilling system and method
CN107186346B (en) * 2017-07-19 2024-02-13 成都市珑熙科技有限公司 Laser drilling system and method
CN107627038A (en) * 2017-11-08 2018-01-26 钦成科技有限公司 Process the laser system of non-circular hole
CN108067730A (en) * 2018-01-08 2018-05-25 西安中科微精光子制造科技有限公司 For lens type light-beam scanner, system and the beam scanning method of laser micropore processing
CN108145309A (en) * 2018-02-09 2018-06-12 北京大学口腔医学院 Multiple degrees of freedom laser process equipment
CN109079345A (en) * 2018-07-12 2018-12-25 南京瑞驰电子技术工程实业有限公司 A kind of laser-beam drilling machine and control method with a variety of punching functions
CN111375913A (en) * 2018-12-28 2020-07-07 三星钻石工业株式会社 Laser processing device and beam rotator unit
CN109663915A (en) * 2018-12-28 2019-04-23 淮阴工学院 A kind of laser gain material manufacture crack stopper
CN109663915B (en) * 2018-12-28 2024-03-26 淮阴工学院 Anti-cracking method for laser additive manufacturing
WO2020244200A1 (en) * 2019-06-04 2020-12-10 西安中科微精光子制造科技有限公司 Light beam scanning system and laser processing device
CN112496527B (en) * 2019-08-26 2023-08-29 佳能株式会社 Optical device and article manufacturing method
CN112496527A (en) * 2019-08-26 2021-03-16 佳能株式会社 Optical device and article manufacturing method
CN110449731A (en) * 2019-08-27 2019-11-15 华中科技大学 A kind of laser change cone diameter variable rotary working of the cutting hole optical system
CN110587155A (en) * 2019-08-29 2019-12-20 武汉安扬激光技术有限责任公司 Laser processing device for cutting inverted taper hole or groove and using method thereof
CN110587141B (en) * 2019-10-10 2021-10-12 山东理工大学 Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser
CN110587141A (en) * 2019-10-10 2019-12-20 山东理工大学 Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser
CN110919172A (en) * 2019-12-26 2020-03-27 中国科学院长春光学精密机械与物理研究所 Roller surface microstructure manufacturing equipment, system and method
CN111790982A (en) * 2020-07-15 2020-10-20 中国航空制造技术研究院 Laser hole making device and method
CN112008239A (en) * 2020-07-22 2020-12-01 中国科学院西安光学精密机械研究所 Spiral scanning laser processing device and processing method
CN112059409A (en) * 2020-08-31 2020-12-11 深圳泰德激光科技有限公司 Laser drilling device
CN112059409B (en) * 2020-08-31 2022-06-21 深圳泰德激光技术股份有限公司 Laser drilling device
CN112164961A (en) * 2020-09-29 2021-01-01 长春理工大学 Aviation pencil end laser processing equipment
CN112192019A (en) * 2020-10-13 2021-01-08 深圳市韵腾激光科技有限公司 Laser processing drilling system
CN112192021A (en) * 2020-10-16 2021-01-08 西安中科微精光子制造科技有限公司 Laser scanning device
CN112846546A (en) * 2021-03-10 2021-05-28 武汉华工激光工程有限责任公司 Laser cutting system
CN112846546B (en) * 2021-03-10 2022-04-26 武汉华工激光工程有限责任公司 Laser cutting system
CN112975171A (en) * 2021-03-25 2021-06-18 清华大学 Ultrafast laser micropore rotary-cut processingequipment
CN113102902B (en) * 2021-05-10 2022-09-16 武汉华工激光工程有限责任公司 Burr-free laser drilling method for carbon fiber composite material
CN113102902A (en) * 2021-05-10 2021-07-13 武汉华工激光工程有限责任公司 Burr-free laser drilling method for carbon fiber composite material
CN113437631A (en) * 2021-06-28 2021-09-24 北京科益虹源光电技术有限公司 Excimer laser and line width narrowing device and method
WO2023279662A1 (en) * 2021-07-07 2023-01-12 广东原点智能技术有限公司 Laser rotary cutting system and rotary cutting method
CN113634925A (en) * 2021-07-27 2021-11-12 江苏先河激光研究院有限公司 Laser rotary cutting processing system and method
CN114888458A (en) * 2021-08-17 2022-08-12 武汉华工激光工程有限责任公司 Parallel rotary cutting machining device and method
CN114888458B (en) * 2021-08-17 2023-12-15 武汉华工激光工程有限责任公司 Parallel rotary cutting machining device and method
CN114160963A (en) * 2021-12-29 2022-03-11 武汉奥森迪科智能科技股份有限公司 Handheld laser welding head with adjustable light spot
CN114160963B (en) * 2021-12-29 2024-04-05 武汉奥森迪科智能科技股份有限公司 Handheld laser welding head with adjustable light spots
CN114592832A (en) * 2022-03-15 2022-06-07 西南石油大学 Laser perforation robot
CN114833472A (en) * 2022-05-26 2022-08-02 苏州思萃声光微纳技术研究所有限公司 Laser processing method for non-taper cooling air film hole of aero-engine flame tube
CN116117304A (en) * 2023-02-03 2023-05-16 武汉引领光学技术有限公司 Rotation following optical device for shaping light beam and laser processing system

Also Published As

Publication number Publication date
CN104162741B (en) 2016-06-01

Similar Documents

Publication Publication Date Title
CN104162741A (en) Laser processing device and method thereof
CN204122927U (en) Laser processing device
CN206241474U (en) A kind of laser processing device
US6444948B1 (en) Fine and micro-machining process for workpieces by means of laser beams
CN102091875B (en) For forming laser process equipment and the method on surface in unfinished products
CN102248307B (en) Ultraviolet laser fine processing device and method with double optical heads for different limiting apertures
CN104148802B (en) Beam forming device and method
CN203817621U (en) Laser beam splitting and galvanometer scanning processing device
CN102773605B (en) A kind of rotary light beam module group laser motion tracking control system
CN102218605A (en) Laser rotary-cut drilling device
CN204075509U (en) Optical beam forming apparatus
CN113441852B (en) Laser spiral scanning blind hole manufacturing method
CN100413631C (en) Roller surface coarsening processing method using multiheaded high power laser and its device
CN105382425A (en) Optical scanning system and punching method used for laser rotary punching
CN103203541A (en) Laser machining device
CN110722272A (en) Ultrafast laser micro-nano cutting drilling equipment and method
CN113579517B (en) Four-vibrating-mirror group hole machining method
US20160207143A1 (en) Laser machining systems and methods
CN106312335A (en) Laser drilling and drilled-hole filling system and method
CN111250878B (en) Four-axis laser cutting and punching machine for machining wire-drawing die and punching method
CN103418913A (en) Device for machining small hole by using ultrashort pulse laser and small hole machining method
CN108115289A (en) A kind of laser processing device and laser processing
CN109623161A (en) A kind of multi-axis numerical control laser process equipment and its processing method
CN110026677B (en) Laser processing method of special-shaped air film hole
CN110253155B (en) Laser processing device controlled by microcracks

Legal Events

Date Code Title Description
DD01 Delivery of document by public notice

Addressee: Xu Jie

Document name: Notification of Acceptance of Patent Application

C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing

Patentee after: Beijing Zhongke Radium Electronics Co., Ltd.

Address before: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing

Patentee before: BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT CO., LTD.

CP01 Change in the name or title of a patent holder
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Laser processing apparatus and laser processing method

Effective date of registration: 20190213

Granted publication date: 20160601

Pledgee: Beijing Zhongke micro Intellectual Property Service Co., Ltd.

Pledgor: Beijing Zhongke Radium Electronics Co., Ltd.

Registration number: 2019990000122

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20220614

Granted publication date: 20160601

Pledgee: Beijing Zhongke Micro Intellectual Property Service Co.,Ltd.

Pledgor: BEIJING ZHONGKE LEITE ELECTRONICS Co.,Ltd.

Registration number: 2019990000122