CN104162741A - Laser processing device and method thereof - Google Patents
Laser processing device and method thereof Download PDFInfo
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- CN104162741A CN104162741A CN201410374711.5A CN201410374711A CN104162741A CN 104162741 A CN104162741 A CN 104162741A CN 201410374711 A CN201410374711 A CN 201410374711A CN 104162741 A CN104162741 A CN 104162741A
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- wedge
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- shaped mirrors
- laser
- light beam
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- 238000012545 processing Methods 0.000 title claims abstract description 161
- 238000000034 method Methods 0.000 title abstract description 14
- 230000003287 optical effect Effects 0.000 claims abstract description 60
- 230000005540 biological transmission Effects 0.000 claims abstract description 43
- 230000033001 locomotion Effects 0.000 claims abstract description 34
- 238000006073 displacement reaction Methods 0.000 claims abstract description 10
- 230000001360 synchronised effect Effects 0.000 claims description 22
- 238000009826 distribution Methods 0.000 claims description 20
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 9
- 241001270131 Agaricus moelleri Species 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000009987 spinning Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
Abstract
Description
? | Din | Dout | Difference |
Prior device | 50um | 20um | 30um |
This device | 50um | 49.5um | 0.5um |
Claims (27)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410374711.5A CN104162741B (en) | 2014-07-31 | 2014-07-31 | Laser processing device and method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410374711.5A CN104162741B (en) | 2014-07-31 | 2014-07-31 | Laser processing device and method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104162741A true CN104162741A (en) | 2014-11-26 |
CN104162741B CN104162741B (en) | 2016-06-01 |
Family
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Family Applications (1)
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CN201410374711.5A Active CN104162741B (en) | 2014-07-31 | 2014-07-31 | Laser processing device and method thereof |
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CN (1) | CN104162741B (en) |
Cited By (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104690432A (en) * | 2015-02-03 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Precision laser cutting and micro-hole machining device |
CN104703398A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Optimizing method of spiral processing track of FPC (Flexible Printed Circuit) blind hole |
CN105382425A (en) * | 2015-12-14 | 2016-03-09 | 武汉隽龙科技有限公司 | Optical scanning system and punching method used for laser rotary punching |
CN105642893A (en) * | 2015-10-14 | 2016-06-08 | 哈尔滨福沃德多维智能装备有限公司 | Laser spot diameter output adjustable device and method for selective laser melting system |
CN106195671A (en) * | 2016-09-03 | 2016-12-07 | 超视界激光科技(苏州)有限公司 | Laser module |
CN106312333A (en) * | 2016-10-09 | 2017-01-11 | 中国航空工业集团公司北京航空制造工程研究所 | Method and system for processing hole with laser |
CN106903433A (en) * | 2017-02-21 | 2017-06-30 | 机械科学研究总院先进制造技术研究中心 | A kind of hot spot adjustable laser cladding head |
CN107186346A (en) * | 2017-07-19 | 2017-09-22 | 成都市珑熙科技有限公司 | Laser drilling system and method |
CN107627038A (en) * | 2017-11-08 | 2018-01-26 | 钦成科技有限公司 | Process the laser system of non-circular hole |
CN108067730A (en) * | 2018-01-08 | 2018-05-25 | 西安中科微精光子制造科技有限公司 | For lens type light-beam scanner, system and the beam scanning method of laser micropore processing |
CN108115289A (en) * | 2016-11-28 | 2018-06-05 | 深圳中科光子科技有限公司 | A kind of laser processing device and laser processing |
CN108145309A (en) * | 2018-02-09 | 2018-06-12 | 北京大学口腔医学院 | Multiple degrees of freedom laser process equipment |
CN109079345A (en) * | 2018-07-12 | 2018-12-25 | 南京瑞驰电子技术工程实业有限公司 | A kind of laser-beam drilling machine and control method with a variety of punching functions |
CN109219496A (en) * | 2016-05-30 | 2019-01-15 | 普雷茨特两合公司 | The device with optical distance-measuring device and prism deflection unit of process monitoring and the laser Machining head with it when laser processing |
CN109663915A (en) * | 2018-12-28 | 2019-04-23 | 淮阴工学院 | A kind of laser gain material manufacture crack stopper |
CN110449731A (en) * | 2019-08-27 | 2019-11-15 | 华中科技大学 | A kind of laser change cone diameter variable rotary working of the cutting hole optical system |
CN110587141A (en) * | 2019-10-10 | 2019-12-20 | 山东理工大学 | Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser |
CN110587155A (en) * | 2019-08-29 | 2019-12-20 | 武汉安扬激光技术有限责任公司 | Laser processing device for cutting inverted taper hole or groove and using method thereof |
CN110919172A (en) * | 2019-12-26 | 2020-03-27 | 中国科学院长春光学精密机械与物理研究所 | Roller surface microstructure manufacturing equipment, system and method |
CN111375913A (en) * | 2018-12-28 | 2020-07-07 | 三星钻石工业株式会社 | Laser processing device and beam rotator unit |
CN111790982A (en) * | 2020-07-15 | 2020-10-20 | 中国航空制造技术研究院 | Laser hole making device and method |
CN112008239A (en) * | 2020-07-22 | 2020-12-01 | 中国科学院西安光学精密机械研究所 | Spiral scanning laser processing device and processing method |
WO2020244200A1 (en) * | 2019-06-04 | 2020-12-10 | 西安中科微精光子制造科技有限公司 | Light beam scanning system and laser processing device |
CN112059409A (en) * | 2020-08-31 | 2020-12-11 | 深圳泰德激光科技有限公司 | Laser drilling device |
CN112164961A (en) * | 2020-09-29 | 2021-01-01 | 长春理工大学 | Aviation pencil end laser processing equipment |
CN112192019A (en) * | 2020-10-13 | 2021-01-08 | 深圳市韵腾激光科技有限公司 | Laser processing drilling system |
CN112192021A (en) * | 2020-10-16 | 2021-01-08 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
CN112496527A (en) * | 2019-08-26 | 2021-03-16 | 佳能株式会社 | Optical device and article manufacturing method |
CN112846546A (en) * | 2021-03-10 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Laser cutting system |
CN112975171A (en) * | 2021-03-25 | 2021-06-18 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
CN113102902A (en) * | 2021-05-10 | 2021-07-13 | 武汉华工激光工程有限责任公司 | Burr-free laser drilling method for carbon fiber composite material |
CN113437631A (en) * | 2021-06-28 | 2021-09-24 | 北京科益虹源光电技术有限公司 | Excimer laser and line width narrowing device and method |
CN113634925A (en) * | 2021-07-27 | 2021-11-12 | 江苏先河激光研究院有限公司 | Laser rotary cutting processing system and method |
CN114160963A (en) * | 2021-12-29 | 2022-03-11 | 武汉奥森迪科智能科技股份有限公司 | Handheld laser welding head with adjustable light spot |
CN114592832A (en) * | 2022-03-15 | 2022-06-07 | 西南石油大学 | Laser perforation robot |
CN114833472A (en) * | 2022-05-26 | 2022-08-02 | 苏州思萃声光微纳技术研究所有限公司 | Laser processing method for non-taper cooling air film hole of aero-engine flame tube |
CN114888458A (en) * | 2021-08-17 | 2022-08-12 | 武汉华工激光工程有限责任公司 | Parallel rotary cutting machining device and method |
WO2023279662A1 (en) * | 2021-07-07 | 2023-01-12 | 广东原点智能技术有限公司 | Laser rotary cutting system and rotary cutting method |
CN116117304A (en) * | 2023-02-03 | 2023-05-16 | 武汉引领光学技术有限公司 | Rotation following optical device for shaping light beam and laser processing system |
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US6444948B1 (en) * | 1997-10-15 | 2002-09-03 | Daimlerchrysler Ag | Fine and micro-machining process for workpieces by means of laser beams |
CN101161400A (en) * | 2007-11-13 | 2008-04-16 | 苏州维旺科技有限公司 | Method for manufacturing mould core of light conducting plate |
CN101670486A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Laser micropore processor of rotating double-optical wedge |
CN101881889A (en) * | 2010-06-13 | 2010-11-10 | 深圳市大族激光科技股份有限公司 | Optical shaping system |
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CN204122927U (en) * | 2014-07-31 | 2015-01-28 | 北京万恒镭特机电设备有限公司 | Laser processing device |
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CN101161400A (en) * | 2007-11-13 | 2008-04-16 | 苏州维旺科技有限公司 | Method for manufacturing mould core of light conducting plate |
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Cited By (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104690432A (en) * | 2015-02-03 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Precision laser cutting and micro-hole machining device |
CN104703398A (en) * | 2015-03-27 | 2015-06-10 | 大族激光科技产业集团股份有限公司 | Optimizing method of spiral processing track of FPC (Flexible Printed Circuit) blind hole |
CN104703398B (en) * | 2015-03-27 | 2018-01-09 | 大族激光科技产业集团股份有限公司 | A kind of optimization method of the screw processing track of FPC blind holes |
CN105642893A (en) * | 2015-10-14 | 2016-06-08 | 哈尔滨福沃德多维智能装备有限公司 | Laser spot diameter output adjustable device and method for selective laser melting system |
CN105382425A (en) * | 2015-12-14 | 2016-03-09 | 武汉隽龙科技有限公司 | Optical scanning system and punching method used for laser rotary punching |
CN109219496A (en) * | 2016-05-30 | 2019-01-15 | 普雷茨特两合公司 | The device with optical distance-measuring device and prism deflection unit of process monitoring and the laser Machining head with it when laser processing |
CN106195671A (en) * | 2016-09-03 | 2016-12-07 | 超视界激光科技(苏州)有限公司 | Laser module |
CN106312333A (en) * | 2016-10-09 | 2017-01-11 | 中国航空工业集团公司北京航空制造工程研究所 | Method and system for processing hole with laser |
CN108115289A (en) * | 2016-11-28 | 2018-06-05 | 深圳中科光子科技有限公司 | A kind of laser processing device and laser processing |
CN106903433A (en) * | 2017-02-21 | 2017-06-30 | 机械科学研究总院先进制造技术研究中心 | A kind of hot spot adjustable laser cladding head |
CN107186346A (en) * | 2017-07-19 | 2017-09-22 | 成都市珑熙科技有限公司 | Laser drilling system and method |
CN107186346B (en) * | 2017-07-19 | 2024-02-13 | 成都市珑熙科技有限公司 | Laser drilling system and method |
CN107627038A (en) * | 2017-11-08 | 2018-01-26 | 钦成科技有限公司 | Process the laser system of non-circular hole |
CN108067730A (en) * | 2018-01-08 | 2018-05-25 | 西安中科微精光子制造科技有限公司 | For lens type light-beam scanner, system and the beam scanning method of laser micropore processing |
CN108145309A (en) * | 2018-02-09 | 2018-06-12 | 北京大学口腔医学院 | Multiple degrees of freedom laser process equipment |
CN109079345A (en) * | 2018-07-12 | 2018-12-25 | 南京瑞驰电子技术工程实业有限公司 | A kind of laser-beam drilling machine and control method with a variety of punching functions |
CN111375913A (en) * | 2018-12-28 | 2020-07-07 | 三星钻石工业株式会社 | Laser processing device and beam rotator unit |
CN109663915A (en) * | 2018-12-28 | 2019-04-23 | 淮阴工学院 | A kind of laser gain material manufacture crack stopper |
CN109663915B (en) * | 2018-12-28 | 2024-03-26 | 淮阴工学院 | Anti-cracking method for laser additive manufacturing |
WO2020244200A1 (en) * | 2019-06-04 | 2020-12-10 | 西安中科微精光子制造科技有限公司 | Light beam scanning system and laser processing device |
CN112496527B (en) * | 2019-08-26 | 2023-08-29 | 佳能株式会社 | Optical device and article manufacturing method |
CN112496527A (en) * | 2019-08-26 | 2021-03-16 | 佳能株式会社 | Optical device and article manufacturing method |
CN110449731A (en) * | 2019-08-27 | 2019-11-15 | 华中科技大学 | A kind of laser change cone diameter variable rotary working of the cutting hole optical system |
CN110587155A (en) * | 2019-08-29 | 2019-12-20 | 武汉安扬激光技术有限责任公司 | Laser processing device for cutting inverted taper hole or groove and using method thereof |
CN110587141B (en) * | 2019-10-10 | 2021-10-12 | 山东理工大学 | Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser |
CN110587141A (en) * | 2019-10-10 | 2019-12-20 | 山东理工大学 | Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser |
CN110919172A (en) * | 2019-12-26 | 2020-03-27 | 中国科学院长春光学精密机械与物理研究所 | Roller surface microstructure manufacturing equipment, system and method |
CN111790982A (en) * | 2020-07-15 | 2020-10-20 | 中国航空制造技术研究院 | Laser hole making device and method |
CN112008239A (en) * | 2020-07-22 | 2020-12-01 | 中国科学院西安光学精密机械研究所 | Spiral scanning laser processing device and processing method |
CN112059409A (en) * | 2020-08-31 | 2020-12-11 | 深圳泰德激光科技有限公司 | Laser drilling device |
CN112059409B (en) * | 2020-08-31 | 2022-06-21 | 深圳泰德激光技术股份有限公司 | Laser drilling device |
CN112164961A (en) * | 2020-09-29 | 2021-01-01 | 长春理工大学 | Aviation pencil end laser processing equipment |
CN112192019A (en) * | 2020-10-13 | 2021-01-08 | 深圳市韵腾激光科技有限公司 | Laser processing drilling system |
CN112192021A (en) * | 2020-10-16 | 2021-01-08 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
CN112846546A (en) * | 2021-03-10 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Laser cutting system |
CN112846546B (en) * | 2021-03-10 | 2022-04-26 | 武汉华工激光工程有限责任公司 | Laser cutting system |
CN112975171A (en) * | 2021-03-25 | 2021-06-18 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
CN113102902B (en) * | 2021-05-10 | 2022-09-16 | 武汉华工激光工程有限责任公司 | Burr-free laser drilling method for carbon fiber composite material |
CN113102902A (en) * | 2021-05-10 | 2021-07-13 | 武汉华工激光工程有限责任公司 | Burr-free laser drilling method for carbon fiber composite material |
CN113437631A (en) * | 2021-06-28 | 2021-09-24 | 北京科益虹源光电技术有限公司 | Excimer laser and line width narrowing device and method |
WO2023279662A1 (en) * | 2021-07-07 | 2023-01-12 | 广东原点智能技术有限公司 | Laser rotary cutting system and rotary cutting method |
CN113634925A (en) * | 2021-07-27 | 2021-11-12 | 江苏先河激光研究院有限公司 | Laser rotary cutting processing system and method |
CN114888458A (en) * | 2021-08-17 | 2022-08-12 | 武汉华工激光工程有限责任公司 | Parallel rotary cutting machining device and method |
CN114888458B (en) * | 2021-08-17 | 2023-12-15 | 武汉华工激光工程有限责任公司 | Parallel rotary cutting machining device and method |
CN114160963A (en) * | 2021-12-29 | 2022-03-11 | 武汉奥森迪科智能科技股份有限公司 | Handheld laser welding head with adjustable light spot |
CN114160963B (en) * | 2021-12-29 | 2024-04-05 | 武汉奥森迪科智能科技股份有限公司 | Handheld laser welding head with adjustable light spots |
CN114592832A (en) * | 2022-03-15 | 2022-06-07 | 西南石油大学 | Laser perforation robot |
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