CN113579517B - Four-vibrating-mirror group hole machining method - Google Patents
Four-vibrating-mirror group hole machining method Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000003754 machining Methods 0.000 title claims abstract description 24
- 238000012545 processing Methods 0.000 claims abstract description 65
- 238000004080 punching Methods 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 16
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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Abstract
The invention provides a four-vibrating mirror group hole machining method; the device comprises a vibrating mirror group, a focusing mirror and a processing platform which are sequentially arranged along a light path; the vibrating mirror group comprises an X1 vibrating mirror, a Y1 vibrating mirror, an X2 vibrating mirror and a Y2 vibrating mirror which are controlled in a linkage manner, wherein the X1 vibrating mirror deflects to realize the offset of a light beam in the X direction of the focusing mirror, the X2 vibrating mirror compensates the deflection angle of the X1 vibrating mirror to realize the angular offset of the light beam in the X direction, the Y1 vibrating mirror deflects to realize the offset of the light beam in the Y direction of the focusing mirror, the Y2 vibrating mirror compensates the deflection angle of the Y1 vibrating mirror to realize the angular offset of the light beam in the Y direction, the position, the taper and the aperture of a hole are regulated by regulating the placement angle of the vibrating mirror, and the focusing mirror or a processing platform is lifted by the regulating mechanism to regulate the focusing position; the whole device repeatedly acts on all group holes while precisely controlling the focal position of the light beam so as to reduce the influence of plasma on punching and accelerate the punching efficiency; the device is used for further completing the special-shaped micropore array with adjustable aperture and taper.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a four-vibrating mirror group hole processing method.
Background
The micro-hole is mainly applied to the semiconductor industry and the aerospace field, has very high requirements on roundness and taper of the hole, and is commonly used in a laser drilling method of Shan Zhenjing groups of scanning and multi-optical wedge combined rotary cutting drilling, and through layer-by-layer circular cutting scanning or spiral scanning. The two methods have the advantages that the problems in the traditional punching method can be solved, micro-holes in the micron level can be processed, but the punching can be completed only by determining the center position of each hole, the punching efficiency is low, meanwhile, the laser of the method is continuously acted, so that plasma interferes with the transmission of laser energy in the punching process, the efficiency of completing the micro-holes is reduced, and the method is extremely impractical for the field of industrial punching.
Disclosure of Invention
In order to solve the problems, the invention provides a four-vibrating-mirror group hole processing method, which aims to solve the problems of low punching efficiency and unqualified quality which cannot be solved in the prior punching technology, and further adjusts and optimizes the prior punching, and the invention provides the four-vibrating-mirror group hole processing method, which comprises the following steps:
s1: sequentially arranging a vibrating mirror group, a focusing mirror and a processing platform along an optical path, wherein the vibrating mirror group comprises an X1 vibrating mirror, a Y1 vibrating mirror, an X2 vibrating mirror and a Y2 vibrating mirror which are controlled in a linkage manner, and the distance between the focusing mirror and the processing platform can be adjusted through an adjusting mechanism;
s2: leading in the characteristics contained in the group holes in punching software, calculating the motion of each vibrating mirror in the punching process through a formula for calculating the deflection angle of the vibrating mirror built in the software, and regulating and controlling the vibrating mirror group; the deflection of the X1 vibrating mirror realizes the deflection of the light beam in the X direction of the focusing mirror, the deflection of the X2 vibrating mirror compensates the deflection angle of the X1 vibrating mirror and realizes the deflection of the light beam in the X direction, the deflection of the Y1 vibrating mirror realizes the deflection of the light beam in the Y direction of the focusing mirror, the deflection of the Y2 vibrating mirror compensates the deflection angle of the Y1 vibrating mirror and realizes the angle deflection of the light beam in the Y direction, the specific position of the small hole and the taper and the size of the punching are controlled by controlling the deflection angle of the vibrating mirror, and the processing requirement of a special-shaped group Kong Weixiao hole array with adjustable aperture and taper is met;
s3: and sequentially processing the same layer of area of each hole, waiting until each layer is processed, adjusting the lifting mechanism to enable the light beam focus to move to the next layer of the hole, processing the next layer, and repeating the steps until the group hole processing is completed.
When processing different tapering deep holes, the accurate control light beam focus position simultaneously, focused beam can not shelter from by the pore wall of upper strata, can be fine process the inside of hole.
In the punching process, the position, taper and aperture of a processed hole are controlled by controlling the deflection angle of the vibrating mirror in the vibrating mirror group, and finally, the focusing effect of the focusing mirror is adjusted by the adjusting mechanism to finish punching.
Preferably, the adjusting mechanism is a Z-axis lifting mechanism.
Preferably, the Z-axis lifting mechanism can lift the processing platform or the focusing lens.
The workpiece is placed on the processing platform, one way is to change the position of the focus on the workpiece by lifting the focusing lens, and the other way is to change the position of the focus on the workpiece by lifting the processing platform, so that the deeper processing of the hole is performed.
Preferably, the distance between the X1 vibrating mirror and the X2 vibrating mirror is the same as the distance between the Y1 vibrating mirror and the Y2 vibrating mirror.
Preferably, in step S2, the formula for processing the deflection angle of the zero cone rectangular Kong Shizhen mirror is that the coordinate position of the micro-hole is (L 1 ，L 2 ) The radius of the light beam is d, the focal length of the focusing lens is f, the radius of the hole in the X direction is a, the radius of the hole in the Y direction is b, and the distance between the X1 vibrating lens and the X2 vibrating lens is L x1x2 Distance L between X2 galvanometer and focusing lens x2 f, the distance between the Y1 vibrating mirror and the Y2 vibrating mirror is L y1y2 ，θ x1 、θ x2 、θ y1 、θ y2 For the angles of four vibrating mirrors, the deflection calculation formula of the vibrating mirror group is as follows:
(θ x1 +θ x2 )*f＝x
(θ y1 +θ y2 )*f＝y
deflection angle of galvanometer X1
Deflection angle of vibrating mirror Y1
Deflection angle of galvanometer X2
Deflection angle of vibrating mirror Y2
Preferably, in step S3, a part or all of the region of the same layer of each hole is sequentially processed, and the single processing time of each hole is 10 to 1000 μs, and the sum of the processing time of each hole is not more than 50% of the total time.
In the processing process, all micropores are synchronously processed, and the influence of plasma on the processing is reduced by repeatedly processing the micropores, so that the processing of the hole array is finished at one time, and the punching quality and efficiency are further improved.
Preferably, in step S3, after finishing each layer of processing, a light-off waiting time is set; the light-stopping waiting time of each time is gradually increased as the depth of the hole is increased.
The light-off waiting time is suitable for the situation that the group Kong Kongzhen is less, the light-off waiting time can be set, if the group Kong Kongzhen is more, the light-off waiting time does not need to be set, and the light-off waiting time is set according to specific punching requirements.
Preferably, in step S3, when each layer is processed, the contour range of each special-shaped hole is processed in a partitioning manner, and a path filled with laser is planned, so that when the galvanometer control beam moves to an adjacent area of the same special-shaped hole, the swinging angle of the galvanometer is smaller; when the laser is controlled to scan in the blocking area of the adjacent special-shaped hole, the switching light positions of the laser on the material are connected recently, so that the idle time of the laser beam is reduced, and the processing efficiency is improved.
The plane is controlled through four vibrating mirrors of the vibrating mirror group, every two vibrating mirrors control one direction, the plane is decomposed into an X direction and a Y direction, the position of each point on the outline of the hole is decomposed into laser processing positions in two directions, meanwhile, the deflection angles of the four vibrating mirrors are different when the laser beam irradiates each point, the four vibrating mirrors are regulated and controlled by a control card and controlled through special software, the deflection of the four vibrating mirrors is mutually independent, and the deflection angles of the vibrating mirrors are regulated by the software of integral control according to the position and the outline of the hole.
Compared with the prior art, the invention has the following beneficial effects due to the adoption of the technical scheme:
1) Compared with the existing punching equipment which can only process a single Kong Zhuge, the four-vibrating-mirror group hole processing method provided by the invention can process groups Kong Kongzhen on a workpiece, and improves the punching efficiency;
2) According to the four-vibrating-mirror group hole processing method, the position, the size and the taper change of the holes are regulated through the angle change of the four vibrating mirrors, so that the regulation difficulty is simplified, and meanwhile, the shape of the punched holes can be regulated by regulating the offset position, so that the special-shaped holes can be punched;
3) According to the four-vibrating-mirror group hole processing method, the four vibrating mirrors are controlled by the same control card, so that the influence of external factors on the vibrating mirrors can be reduced, the four vibrating mirrors cooperatively move in the punching process, and the punching quality is improved;
4) According to the four-vibrating-mirror group hole processing method, when the hole array is processed, the single hole is subjected to partition processing, so that the influence of plasma on the punching process is reduced, and meanwhile, the track of the light beam is optimized, so that when the laser scans the partitioned areas of adjacent special-shaped holes, the switching light positions of the laser on the material are in closest connection, the idle time of the laser beam is reduced, and the punching efficiency is improved;
5) According to the four-vibrating-mirror group hole machining method, single holes are symmetrically machined during group hole machining, more adjustment space is reserved for machining the back taper, and the four-vibrating-mirror group hole machining method is more beneficial to machining of large back taper holes.
6) According to the four-vibrating-mirror group hole processing method, when the group Kong Kongzhen is processed, the laser beam firstly hollows out the upper-layer workpiece, and meanwhile, along with the hollowing out of the surface, the position of the focus is gradually moved downwards, so that the hollowed-out position of the workpiece is gradually lowered, and finally, hole punching is completed, and the loss of laser energy in the process of irradiating the lower-layer material can be reduced, the hole punching flow is optimized, and the hole punching efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a four-galvanometer group hole processing method according to the present invention;
FIG. 2 is a schematic diagram of a hole array processed by a first embodiment of a four-galvanometer group hole processing method according to the present invention;
FIG. 3 is a movement trace of a laser beam in the first embodiment of the four-galvanometer group hole processing method according to the present invention when the surface of FIG. 2 is hollowed out;
FIG. 4 is a schematic diagram of a hole array with different shapes processed by a second embodiment of a four-vibrating-mirror group hole processing method of the present invention;
FIG. 5 is a movement trace of a laser beam in a second embodiment of the four-galvanometer cluster hole processing method according to the invention when the surface of FIG. 4 is engraved;
fig. 6 is a schematic diagram of different tapers of light beams in the four-vibrating-mirror group hole processing method according to the present invention, wherein 1 is a reverse taper schematic diagram, 2 is a zero taper schematic diagram, and 3 is a positive taper schematic diagram.
1-X1 vibrating mirror; 2-Y1 vibrating mirror; 3-X2 galvanometer; 4-Y2 galvanometer; 5-focusing mirror; and 6, a processing platform.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention are included in the protection scope of the present invention. In the drawings, the size and relative sizes of certain parts may be exaggerated for clarity.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected" and "coupled" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be used in any form, such as directly or indirectly through an intermediate medium, or may be used in any form of communication between two elements or in any form of interaction between two elements, and the terms are specifically understood by those of ordinary skill in the art.
In the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", and the like are used for convenience of description and simplicity of operation only, and do not denote or imply that the apparatus or elements in question must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
As shown in an attached figure 1 of the specification, the invention provides a four-vibrating-mirror group hole processing method, which comprises the following steps:
s1: the method comprises the steps that a vibrating mirror group, a focusing mirror 5 and a processing platform 6 are sequentially arranged along a light path, wherein the vibrating mirror group comprises an X1 vibrating mirror 1, a Y1 vibrating mirror 2, an X2 vibrating mirror 3 and a Y2 vibrating mirror 4 which are controlled in a linkage manner, and the distance between the focusing mirror 5 and the processing platform 6 can be adjusted through an adjusting mechanism;
s2: leading in the characteristics contained in the group holes in punching software, calculating the motion of each vibrating mirror in the punching process through a formula for calculating the deflection angle of the vibrating mirror built in the software, and regulating and controlling the vibrating mirror group; the deflection of the X1 vibrating mirror 1 realizes the deflection of the light beam in the X direction of the focusing mirror, the deflection of the X2 vibrating mirror 3 compensates the deflection angle of the X1 vibrating mirror 1, the deflection of the Y1 vibrating mirror 2 realizes the deflection of the light beam in the Y direction of the focusing mirror 5, the deflection of the Y2 vibrating mirror 4 compensates the deflection angle of the Y1 vibrating mirror 2, the angle deflection of the light beam in the Y direction is realized, the specific position of the small hole and the taper and the size of the punching are controlled by controlling the deflection angle of the vibrating mirror, and the processing requirement of the special-shaped group Kong Weixiao hole array with adjustable aperture and taper is met;
s3: and sequentially processing the same layer of area of each hole, waiting until each layer is processed, adjusting the lifting mechanism to enable the light beam focus to move to the next layer of the hole, processing the next layer, and repeating the steps until the group hole processing is completed.
Further, in the processing process, the four vibrating mirrors are controlled by a control card, so that the interference of external factors is reduced, the positions of light beam focuses are controlled by adjusting the angles of the four vibrating mirrors, and the taper of micropores is controlled; the vibration mirrors respectively control the deflection of the light beams in the X direction and the Y direction, control the light beams to move on the surface of the workpiece, firstly process the same layer of the hole array, adjust the distance between the focusing mirror and the processing platform through the adjusting mechanism, and adjust the position of the focus on the workpiece, process the next layer of the hole until finishing the processing of the hole array.
The X1 vibrating mirror and the Y1 vibrating mirror for adjusting the deflection distance of the light beam enable the light beam to be reflected at a large angle, deflection is completed through transmission on a light path, and the X1 vibrating mirror and the Y1 vibrating mirror adjust the position and the taper of the hole when the hole is punched by controlling the deflection angle of the light beam; the X2 vibrating mirror and the Y2 vibrating mirror firstly compensate the angle carried by the light beam before the light beam, simultaneously reflect the light beam at a tiny angle, finally improve the deflection of the angle of the light beam through the focusing of the focusing mirror, and adjust the aperture of the micropore by controlling the deflection angle of the light beam through the X2 vibrating mirror and the Y2 vibrating mirror.
FIG. 2 of the drawings is a position coordinate (L 1 ，L 2 ) According to the characteristics of the holes, calculating the motion trail of each vibrating mirror in the punching process by a formula for calculating the deflection angle of the vibrating mirror built in software, and controlling the four vibrating mirrors through a control card to finish punching of the hole array; machining holes through dual galvanometer systemsWhen the laser perforation device is used for the matrix, the light beams move back and forth in the outline of the micropore according to the track of the figure 3 of the specification, the processing is carried out according to the sequence of 1-2-3-4-5-6-7-8 in the figure 3, the materials in the outline are hollowed out, the idle time of the laser is reduced, and meanwhile, the perforation quality and efficiency are improved; if the beam directly melts the outline of the micropore, the energy of the beam is transmitted in the workpiece to be rapidly reduced along with the increase of the melting depth, the punching efficiency is reduced, and the melting area in the workpiece is narrowed, so that the slag in the workpiece can not be discharged; the laser beam moves back and forth in the micropore outline, so that the laser beam can enlarge the action area of the internal material, and the punching efficiency can be improved.
In the processing process, a part or all of the area of the same layer of each hole is sequentially processed, the single processing time of each hole is 10-1000 mu s, the laser action of each hole is not more than 50% of the total time, if the number of group holes is small, the light stopping waiting time can be set, the Z-axis lifting mechanism is regulated to the hole processing position of the next layer until each layer is processed, the previous steps are repeated, and the light stopping waiting time of each time is gradually increased along with deepening of the holes.
The method comprises the specific operation processes that a vibrating mirror group controls a laser beam to act on the surface of a workpiece for 10-1000 mu s according to the positions of holes, then the laser beam is controlled by the vibrating mirror to move to the position of the next hole, the same layer of the hole array is processed, then the laser beam is moved to the next layer for processing, and the processes are repeated until the whole hole array is punched, so that the influence of plasmas generated by long-time acting of the laser on punching efficiency can be reduced.
In order to further explain the working principle of the four-vibrating-mirror group hole processing method provided by the invention, the following is specifically described:
example 1
The light source is a femtosecond ultraviolet laser, can also be other lasers, four vibrating mirrors, a focusing mirror and a processing platform are arranged according to the structure of FIG. 1, the four vibrating mirrors are controlled by a control card, in FIG. 1, the focusing mirror can be lifted, and in actual use, the focusing mirror can also be lifted by the processing platform; the position and taper of laser drilling can be adjusted by adjusting the angles of the X1 vibrating mirror and the Y1 vibrating mirror, so that the laser beam can act on the group holes for a plurality of times in a short time, and the X2 vibrating mirror and the Y2 vibrating mirror control the positions of the laser beam in the hole outline, namely control the drilling aperture, so as to complete drilling;
processing a 4-hole non-taper rectangular group Kong Kongzhen by the device of FIG. 1, inputting the design details of the group Kong Kongzhen in special punching software, importing the characteristics contained in the group holes, identifying the shape characteristics of the patterns by the software, including the relation of the positions, the intervals, the apertures and the like of the holes, calculating the motion trail required to be made by each vibrating mirror in each time period in the punching process by a built-in formula for calculating the deflection angle of the vibrating mirror by the software, importing the motion trail into a control card, and completing the regulation and control of four vibrating mirrors by the control card; the laser beam deflection and deflection in the figure 6 of the specification are completed by four vibrating mirrors, the X1 vibrating mirror and the Y1 vibrating mirror are responsible for the deflection of the laser beam position, the position and the taper of a hole are determined through calculation when the laser beam is reflected, the laser beam is emitted at a large angle, and the laser beam completes deflection through propagation on an optical path; the X2 vibrating mirror and the Y2 vibrating mirror control the deflection angle of the laser beam, display the micro angle carried by the laser beam through the focusing mirror, control the position of the laser beam in the outline of the hole, control the aperture and finish the punching;
specifically, the laser beam directly performs ablation cutting with the hole profile, and as the laser energy cannot completely pass through the intermediate material, more time is required for the laser energy to penetrate the material inside; the group hole processing method processes the surface layer of the material according to the zoning sequence from 1 to 8 by controlling the laser beam to move back and forth on the surface of the workpiece on the track of figure 3 through the vibrating mirror, and the influence of plasma on the processing process can be reduced by zoning the processed area, and meanwhile, the processing efficiency is improved through optimizing the path; all materials in the hole track are melted, so that more energy of the laser beam can be transmitted; in the machining process, plasma is generated in the process of completing the corrosion of the surface layer of the workpiece along with the laser beam, so that after the laser beam completes the material machining of the surface layer, the laser beam moves to the next hole of the hole array for machining, the influence of the plasma on the machining process is reduced, after the machining of the same layer of the hole array is completed, the position of a focus is lowered to the next layer for machining through adjusting the Z-axis lifting device, and the process is circulated until the machining of the whole group Kong Kongzhen is completed.
Example 2
Processing a 4-hole shaped irregular group Kong Kongzhen with different shapes by the device of fig. 1, inputting the design details of the group Kong Kongzhen in special punching software, importing the characteristics contained in the group holes, identifying the shape characteristics of patterns by the software, including the relation of the positions, the intervals, the apertures and the like of the holes, calculating the motion track required to be made by each vibrating mirror in each time period in the punching process by a built-in formula for calculating the deflection angle of the vibrating mirror by the software, importing the motion track into a control card, and completing the regulation and control of four vibrating mirrors by the control card;
processing according to the contour features of the special-shaped holes according to the principle of symmetrical processing, and then scanning the contour interiors of the special-shaped holes according to fig. 5; the symmetrical machining of the special-shaped holes enables the special-shaped holes to have larger adjustment scope in the machining of irregular contour parts, and is advantageous for machining large-taper special-shaped holes; after scanning the surface layer, the position of the focus is lowered to the next layer through the Z-axis lifting device, the processing is repeated again, and the process is circulated until the processing of the whole special-shaped hole array is completed.
It will be appreciated by those skilled in the art that the invention can be embodied in many other specific forms without departing from the spirit or scope of the invention. Although an embodiment of the present invention has been described, it is to be understood that the invention is not limited to this embodiment, and that variations and modifications may be effected by one skilled in the art within the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. The four-vibrating-mirror group hole machining method is characterized by comprising the following steps of:
s1: sequentially arranging a vibrating mirror group, a focusing mirror and a processing platform along an optical path, wherein the vibrating mirror group comprises an X1 vibrating mirror, a Y1 vibrating mirror, an X2 vibrating mirror and a Y2 vibrating mirror which are controlled in a linkage manner, and the distance between the focusing mirror and the processing platform can be adjusted through an adjusting mechanism;
s2: leading in the characteristics contained in the group holes in punching software, calculating the motion of each vibrating mirror in the punching process through a formula for calculating the deflection angle of the vibrating mirror built in the software, and regulating and controlling the vibrating mirror group; the deflection of the X1 vibrating mirror realizes the deflection of the light beam in the X direction of the focusing mirror, the deflection angle of the X1 vibrating mirror is compensated by the X2 vibrating mirror, the deflection of the Y1 vibrating mirror realizes the deflection of the light beam in the Y direction of the focusing mirror, the deflection angle of the Y1 vibrating mirror is compensated by the Y2 vibrating mirror, the angle deflection of the light beam in the Y direction is realized, the processing requirements of a special-shaped group Kong Weixiao hole array with adjustable aperture and taper are met, the principle that the deflection angles of the X1 vibrating mirror, the Y1 vibrating mirror, the X2 vibrating mirror and the Y2 vibrating mirror ensure that the light beam is not blocked by the upper layer material of the hole wall, the single-hole symmetrical processing is realized, and the deflection of each vibrating mirror reduces the sum of all vibrating mirror swinging angles;
in step S2, the formula for processing the deflection angle of the zero-cone rectangular Kong Shizhen mirror is that the coordinate position of the aperture is (L 1 ，L 2 ) The radius of the beam is d, the focal length of the focusing mirror is f, the radius of the hole in the X direction of the machining direction is a, the radius of the hole in the Y direction is b, and the distance between the X1 vibrating mirror and the X2 vibrating mirror is L x1x2 Distance L between X2 galvanometer and focusing lens x2f The distance between the Y1 vibrating mirror and the Y2 vibrating mirror is L y1y2 ，θ x1 、θ x2 、θ y1 、θ y2 For the angles of four vibrating mirrors, the deflection calculation formula of the vibrating mirror group is as follows:
(θ x1 +θ x2 )*f＝x
(θ y1 +θ y2 )*f＝y
s3: and sequentially processing the same layer of area of each hole, controlling laser to fill the inside according to the profile characteristics of the area, simultaneously carrying out partition processing on each layer, avoiding the influence of plasma, waiting until each layer is processed, adjusting a lifting mechanism to enable a light beam focus to move to the next layer of the hole, carrying out processing of the next layer, and repeating the steps until group hole processing is completed.
2. The method for machining a four-vibrating mirror group hole according to claim 1, wherein the adjusting mechanism is a Z-axis lifting mechanism.
3. The method of claim 2, wherein the Z-axis lifting mechanism can lift the processing platform or the focusing lens.
4. The method for processing four-vibrating-mirror group holes according to claim 1, wherein the distance between the X1 vibrating mirror and the X2 vibrating mirror is the same as the distance between the Y1 vibrating mirror and the Y2 vibrating mirror.
5. The method of processing four-mirror group holes according to claim 1, wherein in step S3, a part or all of the region of the same layer of each hole is sequentially processed, a single processing time per hole is 10 to 1000 μs, and a sum of processing times per hole is not more than 50% of a total time.
6. The four-vibrating-mirror group hole machining method according to claim 1, wherein in the step S3, when each layer is machined, the contour range of each special-shaped hole is subjected to partition treatment, and a laser filling path is planned, so that when a vibrating mirror control beam moves to an adjacent area of the same special-shaped hole, the sum of all vibrating mirror swinging angles is reduced by each vibrating mirror deflection; when the laser is controlled to scan in the blocking area of the adjacent special-shaped hole, the switching light positions of the laser on the material are connected recently, so that the idle time of the laser beam is reduced.
7. The method according to claim 1, wherein in step S3, after each layer is processed, the light-off waiting time is set according to the processing time of the whole layer.
8. The method of claim 7, wherein the waiting time for stopping light is increased gradually as the depth of the hole is increased.
9. The four-vibrating mirror group hole machining method according to claim 1, wherein the X1 vibrating mirror, the Y1 vibrating mirror, the X2 vibrating mirror and the Y2 vibrating mirror are regulated and controlled by one control card.
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| CN114939733B (en) * | 2022-04-24 | 2024-05-14 | 武汉华工激光工程有限责任公司 | Laser processing method and device for improving quality of green ceramic chip through hole |
| CN114833473A (en) * | 2022-04-27 | 2022-08-02 | 江苏先河激光技术有限公司 | Special-shaped group hole machining system and method |
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| CN116787008A (en) * | 2023-06-16 | 2023-09-22 | 中国科学院西安光学精密机械研究所 | A special-shaped hole processing method with precise control of beam spatial trajectory |
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