CN104162741B - Laser processing device and method thereof - Google Patents
Laser processing device and method thereof Download PDFInfo
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- CN104162741B CN104162741B CN201410374711.5A CN201410374711A CN104162741B CN 104162741 B CN104162741 B CN 104162741B CN 201410374711 A CN201410374711 A CN 201410374711A CN 104162741 B CN104162741 B CN 104162741B
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- 238000012545 processing Methods 0.000 title claims abstract description 128
- 238000000034 method Methods 0.000 title abstract description 16
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- 230000033001 locomotion Effects 0.000 claims abstract description 27
- 238000006073 displacement reaction Methods 0.000 claims abstract description 7
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- 238000009826 distribution Methods 0.000 claims description 24
- 230000001360 synchronised effect Effects 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 9
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- 230000000694 effects Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Din | Dout | Difference | |
Conventional apparatus | 50um | 20um | 30um |
This device | 50um | 49.5um | 0.5um |
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410374711.5A CN104162741B (en) | 2014-07-31 | 2014-07-31 | Laser processing device and method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410374711.5A CN104162741B (en) | 2014-07-31 | 2014-07-31 | Laser processing device and method thereof |
Publications (2)
Publication Number | Publication Date |
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CN104162741A CN104162741A (en) | 2014-11-26 |
CN104162741B true CN104162741B (en) | 2016-06-01 |
Family
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Family Applications (1)
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CN201410374711.5A Active CN104162741B (en) | 2014-07-31 | 2014-07-31 | Laser processing device and method thereof |
Country Status (1)
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CN (1) | CN104162741B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3786684A1 (en) * | 2019-08-26 | 2021-03-03 | Canon Kabushiki Kaisha | Optical device and article manufacturing method |
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CN104690432B (en) * | 2015-02-03 | 2016-09-14 | 大族激光科技产业集团股份有限公司 | A kind of precise laser cutting and micropore processing device |
CN104703398B (en) * | 2015-03-27 | 2018-01-09 | 大族激光科技产业集团股份有限公司 | A kind of optimization method of the screw processing track of FPC blind holes |
CN105642893B (en) * | 2015-10-14 | 2019-01-22 | 哈尔滨福沃德多维智能装备有限公司 | Precinct laser fusion system laser spot diameter exports tunable arrangement and method |
CN105382425A (en) * | 2015-12-14 | 2016-03-09 | 武汉隽龙科技有限公司 | Optical scanning system and punching method used for laser rotary punching |
DE102016109909A1 (en) * | 2016-05-30 | 2017-11-30 | Precitec Gmbh & Co. Kg | Device for process monitoring during laser processing |
CN106195671A (en) * | 2016-09-03 | 2016-12-07 | 超视界激光科技(苏州)有限公司 | Laser module |
CN106312333A (en) * | 2016-10-09 | 2017-01-11 | 中国航空工业集团公司北京航空制造工程研究所 | Method and system for processing hole with laser |
CN108115289A (en) * | 2016-11-28 | 2018-06-05 | 深圳中科光子科技有限公司 | A kind of laser processing device and laser processing |
CN106903433A (en) * | 2017-02-21 | 2017-06-30 | 机械科学研究总院先进制造技术研究中心 | A kind of hot spot adjustable laser cladding head |
CN107186346B (en) * | 2017-07-19 | 2024-02-13 | 成都市珑熙科技有限公司 | Laser drilling system and method |
CN107627038A (en) * | 2017-11-08 | 2018-01-26 | 钦成科技有限公司 | Process the laser system of non-circular hole |
CN108067730A (en) * | 2018-01-08 | 2018-05-25 | 西安中科微精光子制造科技有限公司 | For lens type light-beam scanner, system and the beam scanning method of laser micropore processing |
CN109079345A (en) * | 2018-07-12 | 2018-12-25 | 南京瑞驰电子技术工程实业有限公司 | A kind of laser-beam drilling machine and control method with a variety of punching functions |
CN109663915B (en) * | 2018-12-28 | 2024-03-26 | 淮阴工学院 | Anti-cracking method for laser additive manufacturing |
JP2020104167A (en) * | 2018-12-28 | 2020-07-09 | 三星ダイヤモンド工業株式会社 | Laser processing device and beam rotator unit |
CN110695521A (en) * | 2019-06-04 | 2020-01-17 | 西安中科微精光子制造科技有限公司 | Light beam scanning system for laser micropore machining |
CN110449731B (en) * | 2019-08-27 | 2023-07-04 | 华中科技大学 | Laser cone-changing and diameter-changing rotary-cut hole machining optical system |
CN110587155A (en) * | 2019-08-29 | 2019-12-20 | 武汉安扬激光技术有限责任公司 | Laser processing device for cutting inverted taper hole or groove and using method thereof |
CN110587141B (en) * | 2019-10-10 | 2021-10-12 | 山东理工大学 | Method for modulating surface characteristics in hole with high depth-diameter ratio by using laser |
CN110919172B (en) * | 2019-12-26 | 2021-04-02 | 中国科学院长春光学精密机械与物理研究所 | Roller surface microstructure manufacturing equipment, system and method |
CN111790982A (en) * | 2020-07-15 | 2020-10-20 | 中国航空制造技术研究院 | Laser hole making device and method |
CN112008239A (en) * | 2020-07-22 | 2020-12-01 | 中国科学院西安光学精密机械研究所 | Spiral scanning laser processing device and processing method |
CN112059409B (en) * | 2020-08-31 | 2022-06-21 | 深圳泰德激光技术股份有限公司 | Laser drilling device |
CN112164961B (en) * | 2020-09-29 | 2022-02-01 | 长春理工大学 | Aviation pencil end laser processing equipment |
CN112192019B (en) * | 2020-10-13 | 2021-06-04 | 深圳市韵腾激光科技有限公司 | Laser processing drilling system |
CN112192021A (en) * | 2020-10-16 | 2021-01-08 | 西安中科微精光子制造科技有限公司 | Laser scanning device |
CN112846546B (en) * | 2021-03-10 | 2022-04-26 | 武汉华工激光工程有限责任公司 | Laser cutting system |
CN112975171B (en) * | 2021-03-25 | 2021-11-02 | 清华大学 | Ultrafast laser micropore rotary-cut processingequipment |
CN113102902B (en) * | 2021-05-10 | 2022-09-16 | 武汉华工激光工程有限责任公司 | Burr-free laser drilling method for carbon fiber composite material |
CN113437631A (en) * | 2021-06-28 | 2021-09-24 | 北京科益虹源光电技术有限公司 | Excimer laser and line width narrowing device and method |
CN113814583A (en) * | 2021-07-07 | 2021-12-21 | 广东原点智能技术有限公司 | Laser rotary cutting system and rotary cutting method |
CN113634925B (en) * | 2021-07-27 | 2023-07-14 | 江苏先河激光研究院有限公司 | Laser rotary cutting processing system and method |
CN114888458B (en) * | 2021-08-17 | 2023-12-15 | 武汉华工激光工程有限责任公司 | Parallel rotary cutting machining device and method |
CN114160963B (en) * | 2021-12-29 | 2024-04-05 | 武汉奥森迪科智能科技股份有限公司 | Handheld laser welding head with adjustable light spots |
CN114592832B (en) * | 2022-03-15 | 2023-08-25 | 西南石油大学 | Laser perforation robot |
CN114833472A (en) * | 2022-05-26 | 2022-08-02 | 苏州思萃声光微纳技术研究所有限公司 | Laser processing method for non-taper cooling air film hole of aero-engine flame tube |
CN118002912A (en) * | 2022-11-10 | 2024-05-10 | 上海名古屋精密工具股份有限公司 | Method and device for laser processing |
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US6444948B1 (en) * | 1997-10-15 | 2002-09-03 | Daimlerchrysler Ag | Fine and micro-machining process for workpieces by means of laser beams |
CN101161400A (en) * | 2007-11-13 | 2008-04-16 | 苏州维旺科技有限公司 | Method for manufacturing mould core of light conducting plate |
CN101670486A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Laser micropore processor of rotating double-optical wedge |
CN101881889A (en) * | 2010-06-13 | 2010-11-10 | 深圳市大族激光科技股份有限公司 | Optical shaping system |
CN102922142A (en) * | 2012-10-30 | 2013-02-13 | 张立国 | Method for laser processing |
CN203091969U (en) * | 2013-02-05 | 2013-07-31 | 余振新 | Laser optical path guide system for laser sinter molding device |
CN204122927U (en) * | 2014-07-31 | 2015-01-28 | 北京万恒镭特机电设备有限公司 | Laser processing device |
Family Cites Families (1)
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JP4386137B2 (en) * | 2008-02-29 | 2009-12-16 | トヨタ自動車株式会社 | Laser processing apparatus and laser processing method |
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2014
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Patent Citations (7)
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US6444948B1 (en) * | 1997-10-15 | 2002-09-03 | Daimlerchrysler Ag | Fine and micro-machining process for workpieces by means of laser beams |
CN101161400A (en) * | 2007-11-13 | 2008-04-16 | 苏州维旺科技有限公司 | Method for manufacturing mould core of light conducting plate |
CN101670486A (en) * | 2009-09-23 | 2010-03-17 | 上海市激光技术研究所 | Laser micropore processor of rotating double-optical wedge |
CN101881889A (en) * | 2010-06-13 | 2010-11-10 | 深圳市大族激光科技股份有限公司 | Optical shaping system |
CN102922142A (en) * | 2012-10-30 | 2013-02-13 | 张立国 | Method for laser processing |
CN203091969U (en) * | 2013-02-05 | 2013-07-31 | 余振新 | Laser optical path guide system for laser sinter molding device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3786684A1 (en) * | 2019-08-26 | 2021-03-03 | Canon Kabushiki Kaisha | Optical device and article manufacturing method |
US11878367B2 (en) | 2019-08-26 | 2024-01-23 | Canon Kabushiki Kaisha | Optical device and article manufacturing method |
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CN104162741A (en) | 2014-11-26 |
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Legal Events
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DD01 | Delivery of document by public notice |
Addressee: Xu Jie Document name: Notification of Acceptance of Patent Application |
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SE01 | Entry into force of request for substantive examination | ||
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CP01 | Change in the name or title of a patent holder |
Address after: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing Patentee after: Beijing Zhongke Radium Electronics Co., Ltd. Address before: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing Patentee before: BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT CO., LTD. |
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CP01 | Change in the name or title of a patent holder | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Laser processing apparatus and laser processing method Effective date of registration: 20190213 Granted publication date: 20160601 Pledgee: Beijing Zhongke micro Intellectual Property Service Co., Ltd. Pledgor: Beijing Zhongke Radium Electronics Co., Ltd. Registration number: 2019990000122 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220614 Granted publication date: 20160601 Pledgee: Beijing Zhongke Micro Intellectual Property Service Co.,Ltd. Pledgor: BEIJING ZHONGKE LEITE ELECTRONICS Co.,Ltd. Registration number: 2019990000122 |