CN108115289A - A kind of laser processing device and laser processing - Google Patents
A kind of laser processing device and laser processing Download PDFInfo
- Publication number
- CN108115289A CN108115289A CN201611077039.9A CN201611077039A CN108115289A CN 108115289 A CN108115289 A CN 108115289A CN 201611077039 A CN201611077039 A CN 201611077039A CN 108115289 A CN108115289 A CN 108115289A
- Authority
- CN
- China
- Prior art keywords
- laser beam
- laser
- optical facilities
- workpiece
- wedges
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 59
- 230000003287 optical effect Effects 0.000 claims abstract description 57
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 238000006073 displacement reaction Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
Abstract
The invention discloses a kind of laser processing device and laser processings.Laser processing device includes laser and a driving mechanism, is equipped with the optical facilities that can be rotated and one successively along the laser beam exits direction of laser for carrying the microscope carrier of workpiece, wherein：The optical facilities are for laser beam to be reflected, to make the laser beam of the optical facilities outlet side and input side parallel and there are spacing, when the optical facilities rotate, its outlet side laser beam be driven to be rotated using input side laser beam as axle center；The driving mechanism is used to drive the laser beam of rotation and workpiece generates relative displacement, laser beam to be made to form spiral shape cutting track on workpiece.The present invention can expand width of slit and be avoided that laser attenuation again, and then improve Laser Processing efficiency, the workpiece for being suitble to processing dimension thicker.
Description
Technical field
The present invention relates to technical field of laser processing more particularly to a kind of laser processing devices and laser processing.
Background technology
The essence of Laser Processing is that the high-energy density after being focused on using laser forms a rhegmalypt in material surface, so
Machining shape is formed by the telecontrol equipment of auxiliary afterwards.In practical applications, ultra-thin materials of the thickness less than 50 μm may be needed only
It once can be completed and penetrate processing, but if material is thicker, then repeatedly cutting is needed to completely penetrate through material.It is less than for thickness
Relatively simple process can be used in 200 μm of sheeting, i.e. multiple tracks cutting is carried out at the same time, and per pass cutting is all along complete
Identical track, and use identical condition.But for thicker material, stimulated light influence of fading can reduce processing effect
Rate.In the prior art, when cutting thicker material, generally use changes the mode of focus lamp focal length or beam diameter, makes hot spot
Size reaches desired value to be cut, but this method can reduce the power of incident laser, so as to influence processing efficiency, causes
The material at joint-cutting cannot be substantially removed in cutting processing.
The content of the invention
The technical problem to be solved in the present invention is, in view of the deficiencies of the prior art, providing one kind, can to expand joint-cutting wide
Degree is avoided that laser attenuation again, and then improves the processing unit (plant) and processing method of Laser Processing efficiency.
In order to solve the above technical problems, the present invention adopts the following technical scheme that.
A kind of laser processing device includes laser and a driving mechanism, along the laser beam exits direction of laser
The optical facilities that can be rotated and one are equipped with successively for carrying the microscope carrier of workpiece, wherein：The optical facilities are used to swash
Light beam reflects, to make the laser beam of the optical facilities outlet side and input side parallel and there are spacing, when the optical facilities
During rotation, its outlet side laser beam is driven to be rotated using input side laser beam as axle center；The driving mechanism is used to drive rotation
The laser beam and workpiece turned generates relative displacement, laser beam to be made to form spiral shape cutting track on workpiece.
Preferably, the optical facilities include two identical wedges of structure, and the inclined-plane of two wedges is opposite, and two
Wedge is oppositely arranged, is reflected laser beam twice by two wedges so that the outlet side laser beam of optical facilities with
Input side laser beam is parallel.
Preferably, the inclined-plane of two wedges is parallel.
Preferably, for a scanning galvanometer to be driven to deflect, what the scanning galvanometer was used to rotate swashs the driving mechanism
Light beam is reflexed on workpiece, and when the scanning galvanometer deflects laser beam is driven to form spiral shape cutting rail on workpiece
Mark.
Preferably, the driving mechanism generates opposite position for microscope carrier to be driven to translate with the laser beam for making workpiece and rotation
It moves.
Preferably, the outlet side of the scanning galvanometer is equipped with condenser lens, and the condenser lens is used for laser beam focus
In forming focus point on workpiece.
Preferably, the input side of the optical facilities is equipped with beam expanding lens, and the beam expanding lens is used to adjust the diameter of laser beam.
Preferably, further included a controller, the controller for controlling laser emitting laser beam, for controlling light
Learn the rotary speed of mechanism and the deflection angle for controlling scanning galvanometer.
A kind of laser processing, this method realize that the laser processing device includes based on a laser processing device
Laser and a driving mechanism are equipped with the optical facilities that can be rotated and a use along the laser beam exits direction of laser successively
In the microscope carrier of carrying workpiece, the laser processing includes the following steps：Step S1, laser emitting laser beam to optics machine
Structure；Step S2, the optical facilities cause the laser beam phase of optical facilities outlet side and input side for laser beam to be reflected
It is parallel and there are spacing；Step S3, the optical facilities rotate, and drive its outlet side laser beam using input side laser beam as axis
The heart is rotated；Step S4, the driving mechanism drive the laser beam of rotation and workpiece to generate relative displacement；Step S5, laser
Beam forms spiral shape cutting track on workpiece.
Preferably, the optical facilities include two identical wedges of structure, and the inclined-plane of two wedges is opposite, and two
Wedge is oppositely arranged, is reflected laser beam twice by two wedges so that the outlet side laser beam of optical facilities with
Input side laser beam is parallel, by adjusting two wedges in the relative position of radial direction, and then adjusts spiral shape cutting track
Width.
In laser processing device and laser processing disclosed by the invention, beam transmission that laser is sent to optics
During mechanism, optical facilities reflect laser beam so that the laser beam of optical facilities both sides is mutually parallel, when optical facilities rotate
When, outlet side laser beam is rotated using input side laser beam as axial line, and the focus point of the slewed laser beam is on workpiece
Circular motion track is formed, when driving mechanism drives the laser beam of rotation and workpiece to generate relative displacement, circular cutting track
Become helical, using the spiral shape cutting track, the joint-cutting with one fixed width is formed on workpiece so that joint-cutting can be more
It is deep, and then thicker workpiece can be processed, meanwhile, without changing the diameter of laser beam, laser attenuation is avoided, with reference to above two
Point so that the present invention realizes and can expand the effect that width of slit is avoided that laser attenuation again, and then improve processing quality and
Processing efficiency.
Description of the drawings
Fig. 1 is the structure diagram of laser processing device of the present invention.
Fig. 2 is the joint-cutting enlarged drawing after being cut using laser processing device to workpiece.
Fig. 3 is the flow chart of laser processing of the present invention.
Fig. 4 is that the joint-cutting comparison diagram after present invention cutting is cut and utilized using existing process.
Specific embodiment
The present invention is described in more detail with reference to the accompanying drawings and examples.
The invention discloses a kind of laser processing devices, with reference to shown in Fig. 1 and Fig. 2, include the driving of laser 1 and one
Mechanism is equipped with the optical facilities 2 and one that can be rotated along the laser beam exits direction of laser 1 for carrying workpiece successively
100 microscope carrier 4, wherein：
The optical facilities 2 are for laser beam to be reflected, to make the laser beam phase of 2 outlet side of optical facilities and input side
It is parallel and there are spacing, when the optical facilities 2 rotate, drive its outlet side laser beam using input side laser beam as axle center into
Row rotation；
The driving mechanism is used to drive the laser beam of rotation and workpiece 100 generates relative displacement, to make laser beam in work
Spiral shape cutting track 101 is formed on part 100.
In above-mentioned laser processing device, during beam transmission to the optical facilities 2 that laser 1 is sent, optical facilities 2 will swash
Light beam reflect so that the laser beam of 2 both sides of optical facilities is mutually parallel, when optical facilities 2 rotate, outlet side laser beam with
Input side laser beam is rotated for axial line, and the focus point of the slewed laser beam forms circular motion track on workpiece 100,
When driving mechanism drives the laser beam of rotation and workpiece 100 to generate relative displacement, circular cutting track becomes helical, utilizes
The spiral shape cutting track forms the joint-cutting with one fixed width so that joint-cutting can be deeper, and then can on workpiece 100
The thicker workpiece of processing, meanwhile, without changing the diameter of laser beam, laser attenuation is avoided, with reference to above 2 points so that this hair
Bright realize can expand the effect that width of slit is avoided that laser attenuation again, and then improve processing quality and processing efficiency.
As a kind of preferred embodiment, the optical facilities 2 include two identical wedges 20 of structure, two wedges 20
Inclined-plane is opposite, and two wedges 20 are oppositely arranged, is reflected laser beam twice by two wedges 20, and causes optics
The outlet side laser beam of mechanism 2 is parallel with input side laser beam.Further, the inclined-plane of two wedges 20 is parallel.
Wherein, two wedges 20 are preferably prism, and the inclined-plane of the two is parallel opposite, and two wedges 20 are oppositely arranged so that
Two wedges 20 combine the shape in similar cuboid.In use, make by adjusting two wedges 20 in the relative position of radial direction
The refractive direction of laser beam is adjusted, have adjusted hanging down for 2 outlet side laser beam of optical facilities and input side laser beam therewith
Linear distance, this adjustment will change the radius of slewed laser beam, that is, have adjusted the width of joint-cutting.
In the present embodiment, on the preferred structure of driving mechanism, the driving mechanism is inclined for driving a scanning galvanometer 3
Turn, the scanning galvanometer 3 is used to the laser beam of rotation reflexing to workpiece 100, and is driven when the scanning galvanometer 3 deflects
Laser beam is made to form spiral shape cutting track 101 on workpiece 100.Specifically, when scanning galvanometer 3 deflects, laser beam and work
Part 100 relatively moves, and circular cutting track becomes helical at this time.Present invention preferably employs the controls of scanning galvanometer 3 to cut
Track, but this is only the preferred embodiment of the present invention, is not intended to limit the invention, in other implementations of the present invention
In example, the driving mechanism can also be used to microscope carrier 4 be driven to translate, workpiece 100 and the laser beam of rotation to be made to generate relative displacement.
In the present embodiment, the outlet side of the scanning galvanometer 3 is equipped with condenser lens 5, and the condenser lens 5 is used for laser
Beam focuses on workpiece 100 and forms focus point.The input side of the optical facilities 2 is equipped with beam expanding lens 6, and the beam expanding lens 6 is used
In the diameter of adjustment laser beam.
It is automatically controlled to realize, which has further included a controller, and the controller is sharp for controlling
1 shoot laser beam of light device, the deflection angle for the rotary speed that controls optical facilities 2 and for controlling scanning galvanometer 3.Its
In, optical facilities 2 and scanning galvanometer 3 can be driven operating by motor etc., and controller can to these motors etc. into
Row electrical control, and then realize the control to 3 deflection angle of 2 rotary speed of optical facilities and scanning galvanometer so that Laser Processing
Device can be processed workpiece by preset path.
It,, should with reference to shown in Fig. 1 to Fig. 3 invention additionally discloses a kind of laser processing based on above-mentioned laser processing device
Method realizes that the laser processing device includes 1 and one driving mechanism of laser, along laser based on a laser processing device
1 laser beam exits direction is equipped with the microscope carrier 4 that the optical facilities 2 and one that can be rotated are used to carry workpiece 100 successively, described
Laser processing includes the following steps：
Step S1,1 shoot laser beam of laser to optical facilities 2；
Step S2, the optical facilities 2 cause 2 outlet side of optical facilities and input side for laser beam to be reflected
Laser beam is parallel and there are spacing；
Step S3, the optical facilities 2 rotate, and its outlet side laser beam is driven to be carried out by axle center of input side laser beam
Rotation；
Step S4, the driving mechanism drive the laser beam of rotation and workpiece 100 to generate relative displacement；
Step S5, laser beam form spiral shape cutting track 101 on workpiece 100.
Fig. 4 is refer to, A is using the joint-cutting after laser processing of the present invention cutting, and B is using after existing process cutting
Joint-cutting, it is seen that using laser processing of the present invention cutting after, joint-cutting have certain width, so be more suitable for process it is thicker
Workpiece.
Further, the optical facilities 2 include two identical wedges 20 of structure, the inclined-plane phase of two wedges 20
It is right, and two wedges 20 are oppositely arranged, reflected laser beam twice by two wedges 20 so that optical facilities 2
Outlet side laser beam is parallel with input side laser beam, by adjusting two wedges 20 radial direction relative position, and then adjust
The width of spiral shape cutting track 101.
Wherein, two wedges 20 are preferably prism, and the inclined-plane of the two is parallel opposite, and two wedges 20 are oppositely arranged so that
Two wedges 20 combine the shape in similar cuboid.In use, make by adjusting two wedges 20 in the relative position of radial direction
The refractive direction of laser beam is adjusted, have adjusted hanging down for 2 outlet side laser beam of optical facilities and input side laser beam therewith
Linear distance, this adjustment will change the radius of slewed laser beam, that is, have adjusted the width of joint-cutting.
Laser processing device and laser processing disclosed by the invention by deflecting and rotating laser beam, make
It obtains laser beam and forms a conical scan track along the optical axis of laser emitting laser beam, be scanned through after vibration mirror scanning in material
Expect that surface forms helical scanning, width of slit is determined by the outer diameter of spiral rather than depending on laser spot size, it is therefore not necessary to
Width of slit is controllable when changing laser beam radius, and then realizing cutting material, to improve cut quality and efficiency.
The above is preferred embodiments of the present invention, is not intended to limit the invention, all technology models in the present invention
Interior done modification, equivalent substitution or improvement etc. are enclosed, should be included in the range of of the invention protect.
Claims (10)
1. a kind of laser processing device, which is characterized in that include laser and a driving mechanism, along the laser of laser (1)
Beam-emergence direction is equipped with the optical facilities that can be rotated (2) and one for carrying the microscope carrier (4) of workpiece (100) successively, wherein：
The optical facilities (2) are for laser beam to be reflected, to make the laser beam phase of optical facilities (2) outlet side and input side
It is parallel and there are spacing, when the optical facilities (2) rotate, its outlet side laser beam is driven using input side laser beam as axle center
It is rotated；
The driving mechanism is used to drive the laser beam of rotation and workpiece (100) generates relative displacement, to make laser beam in workpiece
(100) spiral shape cutting track (101) is formed on.
2. laser processing device as described in claim 1, which is characterized in that it is identical that the optical facilities (2) include structure
Two wedges (20), the inclined-plane of two wedges (20) is opposite, and two wedges (20) are oppositely arranged, by two wedges (20)
And laser beam is reflected twice so that the outlet side laser beam of optical facilities (2) is parallel with input side laser beam.
3. laser processing device as claimed in claim 2, which is characterized in that the inclined-plane of two wedges (20) is parallel.
4. laser processing device as described in claim 1, which is characterized in that the driving mechanism is used to drive a scanning galvanometer
(3) deflecting, the scanning galvanometer (3) is used to the laser beam of rotation reflexing to workpiece (100), and when the scanning galvanometer
(3) when deflecting laser beam is driven to form spiral shape cutting track (101) on workpiece (100).
5. laser processing device as described in claim 1, which is characterized in that the driving mechanism is used to drive microscope carrier (4) flat
It moves, workpiece (100) and the laser beam of rotation to be made to generate relative displacement.
6. laser processing device as claimed in claim 4, which is characterized in that the outlet side of the scanning galvanometer (3) is equipped with poly-
Focus lens (5), the condenser lens (5) are used for laser beam focus in forming focus point on workpiece (100).
7. laser processing device as described in claim 1, which is characterized in that the input side of the optical facilities (2), which is equipped with, to be expanded
Shu Jing (6), the beam expanding lens (6) are used to adjust the diameter of laser beam.
8. laser processing device as claimed in claim 4, which is characterized in that further included a controller, the controller is used
In control laser (1) shoot laser beam, for the rotary speed that controls optical facilities (2) and for controlling scanning galvanometer
(3) deflection angle.
9. a kind of laser processing, which is characterized in that this method is based on laser processing device realization, the laser processing device
It puts and includes laser and a driving mechanism, the light that can be rotated is equipped with successively along the laser beam exits direction of laser (1)
Mechanism (2) and one is learned for carrying the microscope carrier (4) of workpiece (100), the laser processing includes the following steps：
Step S1, laser (1) shoot laser beam to optical facilities (2)；
Step S2, the optical facilities (2) cause optical facilities (2) outlet side and input side for laser beam to be reflected
Laser beam is parallel and there are spacing；
Step S3, the optical facilities (2) rotate, and its outlet side laser beam is driven to be revolved using input side laser beam as axle center
Turn；
Step S4, the driving mechanism drive the laser beam of rotation and workpiece (100) to generate relative displacement；
Step S5, laser beam form spiral shape cutting track (101) on workpiece (100).
10. laser processing as claimed in claim 9, which is characterized in that it is identical that the optical facilities (2) include structure
Two wedges (20), the inclined-plane of two wedges (20) is opposite, and two wedges (20) are oppositely arranged, by two wedges (20)
And laser beam is reflected twice so that the outlet side laser beam of optical facilities (2) is parallel with input side laser beam, passes through
Relative position of two wedges (20) in radial direction is adjusted, and then adjusts the width of spiral shape cutting track (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611077039.9A CN108115289A (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device and laser processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611077039.9A CN108115289A (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device and laser processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108115289A true CN108115289A (en) | 2018-06-05 |
Family
ID=62226937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611077039.9A Pending CN108115289A (en) | 2016-11-28 | 2016-11-28 | A kind of laser processing device and laser processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108115289A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109954978A (en) * | 2019-04-26 | 2019-07-02 | 哈尔滨工业大学 | Femtosecond laser system of processing for nano twin crystal diamond cutter and based on the processing method of the system |
| CN110161512A (en) * | 2019-05-08 | 2019-08-23 | 深圳市速腾聚创科技有限公司 | Multi-line laser radar |
| CN110919169A (en) * | 2018-09-03 | 2020-03-27 | 大族激光科技产业集团股份有限公司 | Laser processing real-time detection device and method |
| CN111055024A (en) * | 2018-10-15 | 2020-04-24 | 雷科股份有限公司 | Copper coil structure for laser cutting thick copper and method thereof |
| CN113695767A (en) * | 2021-10-29 | 2021-11-26 | 济南邦德激光股份有限公司 | Laser cutting light spot control system and method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004136307A (en) * | 2002-10-16 | 2004-05-13 | Toshiba Corp | Method and device of laser beam machining |
| KR20120108563A (en) * | 2011-03-24 | 2012-10-05 | 한국기계연구원 | Groove havning incleind surface machining method using laser |
| EP2602048A1 (en) * | 2011-11-16 | 2013-06-12 | Optec S.p.A. | Process of laser welding with a calibration unit with refraction means |
| JP2014004631A (en) * | 2013-09-12 | 2014-01-16 | Higashiyama Toru | Femtosecond laser processing machine |
| CN104162741A (en) * | 2014-07-31 | 2014-11-26 | 北京万恒镭特机电设备有限公司 | Laser processing device and method thereof |
| CN104870137A (en) * | 2013-02-27 | 2015-08-26 | 三菱重工业株式会社 | Methods and systems for joining materials |
| CN206241474U (en) * | 2016-11-28 | 2017-06-13 | 深圳中科光子科技有限公司 | A kind of laser processing device |
-
2016
- 2016-11-28 CN CN201611077039.9A patent/CN108115289A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004136307A (en) * | 2002-10-16 | 2004-05-13 | Toshiba Corp | Method and device of laser beam machining |
| KR20120108563A (en) * | 2011-03-24 | 2012-10-05 | 한국기계연구원 | Groove havning incleind surface machining method using laser |
| EP2602048A1 (en) * | 2011-11-16 | 2013-06-12 | Optec S.p.A. | Process of laser welding with a calibration unit with refraction means |
| CN104870137A (en) * | 2013-02-27 | 2015-08-26 | 三菱重工业株式会社 | Methods and systems for joining materials |
| JP2014004631A (en) * | 2013-09-12 | 2014-01-16 | Higashiyama Toru | Femtosecond laser processing machine |
| CN104162741A (en) * | 2014-07-31 | 2014-11-26 | 北京万恒镭特机电设备有限公司 | Laser processing device and method thereof |
| CN206241474U (en) * | 2016-11-28 | 2017-06-13 | 深圳中科光子科技有限公司 | A kind of laser processing device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110919169A (en) * | 2018-09-03 | 2020-03-27 | 大族激光科技产业集团股份有限公司 | Laser processing real-time detection device and method |
| CN110919169B (en) * | 2018-09-03 | 2021-12-10 | 大族激光科技产业集团股份有限公司 | Laser processing real-time detection device and method |
| CN111055024A (en) * | 2018-10-15 | 2020-04-24 | 雷科股份有限公司 | Copper coil structure for laser cutting thick copper and method thereof |
| CN109954978A (en) * | 2019-04-26 | 2019-07-02 | 哈尔滨工业大学 | Femtosecond laser system of processing for nano twin crystal diamond cutter and based on the processing method of the system |
| CN110161512A (en) * | 2019-05-08 | 2019-08-23 | 深圳市速腾聚创科技有限公司 | Multi-line laser radar |
| CN113695767A (en) * | 2021-10-29 | 2021-11-26 | 济南邦德激光股份有限公司 | Laser cutting light spot control system and method |
| CN113695767B (en) * | 2021-10-29 | 2022-02-25 | 济南邦德激光股份有限公司 | Laser cutting light spot control system and method |
| WO2023072282A1 (en) * | 2021-10-29 | 2023-05-04 | 济南邦德激光股份有限公司 | Spot control system and method for laser cutting |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206241474U (en) | A kind of laser processing device | |
| CN108115289A (en) | A kind of laser processing device and laser processing | |
| US4160894A (en) | Method and apparatus for the focal form cutting of a moving web of material by a laser beam | |
| US20140263212A1 (en) | Coordination of beam angle and workpiece movement for taper control | |
| JP6990506B2 (en) | Methods and equipment for 3D printing | |
| CN106312335B (en) | A kind of laser drill and drilling fill system and method | |
| CN104162741A (en) | Laser processing device and method thereof | |
| US20140353296A1 (en) | Substrate cutting device using laser beam | |
| CN106715033A (en) | Method for producing workpiece surface on bar-shaped workpiece | |
| JP2020104167A (en) | Laser processing device and beam rotator unit | |
| CN103203541A (en) | Laser machining device | |
| CN113441852B (en) | Laser spiral scanning blind hole manufacturing method | |
| CN105728946B (en) | Roller surface laser disordered texturing processing method and processing unit (plant) based on transmission-type galvanometer | |
| JP2019000851A (en) | Laser beam machining apparatus | |
| CN112008239A (en) | Spiral scanning laser processing device and processing method | |
| CN206230159U (en) | A kind of laser drill and drilling fill system | |
| CN103418913A (en) | Device for machining small hole by using ultrashort pulse laser and small hole machining method | |
| CN113245694A (en) | Laser joint cutting device with adjustable machining size and controllable taper | |
| CN212019780U (en) | Laser rotary drilling device | |
| CN108508595A (en) | One kind cutting optical system based on four wedge laser scannings of rotation | |
| CN110026677B (en) | Laser processing method of special-shaped air film hole | |
| CN113634925B (en) | Laser rotary cutting processing system and method | |
| EP0624421A2 (en) | Method and apparatus for creating an image by a pulsed laser beam inside a transparent material | |
| KR102375235B1 (en) | Laser processing system and laser processing method | |
| JP2000071088A (en) | Laser processing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180605 |
|
| WD01 | Invention patent application deemed withdrawn after publication |