CN113001045A - Composite material through hole drilling method, equipment, device and system - Google Patents
Composite material through hole drilling method, equipment, device and system Download PDFInfo
- Publication number
- CN113001045A CN113001045A CN202110285213.3A CN202110285213A CN113001045A CN 113001045 A CN113001045 A CN 113001045A CN 202110285213 A CN202110285213 A CN 202110285213A CN 113001045 A CN113001045 A CN 113001045A
- Authority
- CN
- China
- Prior art keywords
- laser
- pulse width
- laser focus
- drilling
- focus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the field of laser processing, in particular to a method, equipment, a device and a system for drilling a through hole in a composite material, wherein the method comprises the following steps of irradiating a combined laser focus formed by combining two small laser focuses on the surface of the composite material; and drilling the conductive material layer at the position of the through hole to be drilled in the composite material by using the long pulse width laser focus in the combined laser focus, drilling the insulating material layer at the high laser processing threshold value at the position of the through hole to be drilled in the composite material by using the narrow pulse width laser focus in the combined laser focus, and allowing the laser beam corresponding to the laser focus for subsequent drilling to pass through the hole formed after the previous drilling is finished until the composite material forms a through hole. The invention combines the laser focuses to respectively remove and process materials of respective good dielectric materials, thereby efficiently completing the through hole drilling of the composite material with high quality and perfectly solving the industrial pain point of the through hole drilling of the composite material.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a method, equipment, a device and a system for drilling a through hole in a composite material.
Background
At present, the through hole drilling of a circuit board by adopting laser is increasingly mature, but for ultraviolet nanosecond laser, when an insulating material is an FR4 material or a BT material containing glass fiber or a Teflon material, the ultraviolet nanosecond laser has insufficient peak power, so that the glass fiber is greatly shrunk when being removed, meanwhile, the glass fiber is seriously protruded, or when a Teflon insulating layer is processed, the Teflon material is easily layered with a glue layer due to the low absorption rate of the Teflon material to the laser in an ultraviolet waveband. This is an industry problem after such boards have developed to a certain stage. At present, the problems are that the laser drilling of carbon dioxide is used for some marginal processing, and the processing quality is not ideal.
Disclosure of Invention
The invention aims to provide a method, equipment, a device and a system for drilling a through hole in a composite material, which can solve the problem of the through hole in the composite material containing an insulating material with a high laser processing threshold.
In a first aspect, the invention provides a composite material through hole drilling method, which utilizes a combined laser focus formed by combining two small laser focuses to drill a through hole in a composite material to be processed; the laser processing device comprises a combined laser focus, two small laser focuses, a laser processing system and a laser processing system, wherein the diameters of light spots of the two small laser focuses are both smaller than 40 micrometers, the two small laser focuses are respectively a long pulse width laser focus and a narrow pulse width laser focus, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane; the composite material at least comprises a laminated conductive material layer and a high laser processing threshold insulating material layer;
the composite material through hole drilling method comprises the following steps,
irradiating the combined laser focus on the surface of the composite material;
drilling the conductive material layer at the position of the through hole to be drilled in the composite material by using the long pulse width laser focus in the combined laser focus, and drilling the insulating material layer at the high laser processing threshold value at the position of the through hole to be drilled in the composite material by using the narrow pulse width laser focus in the combined laser focus; in the process that the long pulse width laser focus and the narrow pulse width laser focus respectively drill the conductive material layer and the high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material, a laser beam corresponding to the laser focus of the subsequent drilling processing passes through a hole formed after the laser focus of the previous drilling processing is processed until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
In a second aspect, the present invention provides a composite material through hole drilling apparatus, which is applied to the composite material through hole drilling method described above, and includes a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser for outputting a long pulse width laser beam, and a narrow pulse width laser for outputting a narrow pulse width laser beam; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus; the long pulse width laser focus in the combined laser focus is used for drilling a conductive material layer at a position of a through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus is used for drilling a high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material; the diameters of light spots of the long pulse width laser focus and the narrow pulse width laser focus are both smaller than 40 micrometers, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane; in the process that the long pulse width laser focus and the narrow pulse width laser focus respectively drill the conductive material layer and the high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material, a laser beam corresponding to the laser focus of the subsequent drilling processing passes through a hole formed after the laser focus of the previous drilling processing is processed until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
In a third aspect, the present invention provides a composite through-hole drilling apparatus, comprising a processor, a memory and a computer program stored in the memory and executable on the processor, wherein the computer program is operable to implement the composite through-hole drilling method described above.
In a fourth aspect, the invention provides a composite through hole drilling system, which comprises a machine table, the composite through hole drilling equipment and the composite through hole drilling device, wherein the composite through hole drilling device is electrically connected with the composite through hole drilling equipment;
the machine table is used for placing the composite material to be processed;
the composite material through hole drilling equipment is used for outputting a combined laser focus;
the composite through hole drilling device is used for controlling the combined laser focus output by the composite through hole drilling equipment to execute the composite through hole drilling method, and drilling the composite placed on the machine table.
The invention has the beneficial effects that: in the method, the equipment, the device and the system for drilling the through hole of the composite material, the long pulse width laser can efficiently remove and process metal conductive materials in a conductive material layer, but hardly removes and processes materials containing glass fibers or other insulating materials with high laser processing threshold values; the invention adopts two laser light sources (long pulse width laser and narrow pulse width laser) to carry out laser beam combination, and after the laser beam combination is scanned by a same vibrating mirror and focused by a flat field focusing device, a combined laser focus is constructed, and the medium materials which are good at each laser light source are respectively subjected to material removing processing, so that the through hole drilling of the composite material can be efficiently completed with high quality, and the industrial pain point of the through hole drilling of the composite material is perfectly solved.
Drawings
FIG. 1 is a flow chart of a composite via drilling method of the present invention;
FIG. 2 is a schematic structural diagram of a composite material in a composite material through hole drilling method according to the present invention;
FIG. 3 is a schematic structural diagram of a composite material after a first step of processing in a composite material through hole drilling method according to the present invention;
FIG. 4 is a schematic structural diagram of a composite material after a second step of processing in the composite material through hole drilling method of the present invention;
FIG. 5 is a schematic structural diagram of a composite material after a third step of processing in the composite material through hole drilling method according to the present invention;
FIG. 6 is a schematic structural diagram of a composite material through hole drilling apparatus according to the present invention;
fig. 7 is a schematic structural diagram of a composite material through hole drilling system according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. upper layer of conductive material, 11, first hole, 2, high laser machining threshold insulating material layer, 21, second hole, 3, lower layer of conductive material, 31, third hole.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
The first embodiment is as follows:
the invention provides a composite material through hole drilling method, which is used for drilling a through hole in a composite material to be processed by utilizing a combined laser focus formed by combining two small laser focuses; the laser processing device comprises a combined laser focus, two small laser focuses, a laser processing system and a laser processing system, wherein the diameters of light spots of the two small laser focuses are both smaller than 40 micrometers, the two small laser focuses are respectively a long pulse width laser focus and a narrow pulse width laser focus, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane; the composite material at least comprises a laminated conductive material layer and a high laser processing threshold insulating material layer;
as shown in fig. 1, the composite through-hole drilling method includes the steps of,
irradiating the combined laser focus on the surface of the composite material;
drilling the conductive material layer at the position of the through hole to be drilled in the composite material by using the long pulse width laser focus in the combined laser focus, and drilling the insulating material layer at the high laser processing threshold value at the position of the through hole to be drilled in the composite material by using the narrow pulse width laser focus in the combined laser focus; in the process that the long pulse width laser focus and the narrow pulse width laser focus respectively drill the conductive material layer and the high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material, a laser beam corresponding to the laser focus of the subsequent drilling processing passes through a hole formed after the laser focus of the previous drilling processing is processed until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
In the invention, the long pulse width laser focus refers to a laser focus which can be used for processing a conductive material layer, and the narrow pulse width laser focus refers to a laser focus which can be used for processing a high laser processing threshold insulating material layer; wherein a high laser processing threshold material is defined as requiring greater than 3GW/cm2Material at the processing threshold of peak power density. For example, the peak power density of a 10KW peak power focused on a focusing light spot with the diameter of 20 microns is theoretically calculated to be 3.18GW/cm2In which GW is nine of tenSquare watt, cm2Is square centimeter. The material absorbs laser light, which is firstly shown as the absorption of material substances to specific laser wavelength, but some materials have low absorption coefficient to the specific laser wavelength, for example, materials such as glass/glass fiber and teflon have low absorption to 355nm ultraviolet laser light. At this time, the peak power density of the laser in the laser spot needs to be increased, and under the condition of high-intensity laser power density, the material generates nonlinear absorption on the laser with the wavelength which is not absorbed very much originally. The material substance is a high laser threshold processing material for the laser of the wavelength.
Preferably, before the combined laser focus performs drilling processing on the position of the through hole to be drilled in the composite material, the method further includes the step of adjusting an offset between the narrow pulse width laser focus and the long pulse width laser focus so that a drilling track of the laser focus processed in the subsequent drilling is within a drilling track range of the laser focus processed in the previous drilling.
If the long pulse width laser focus machines a layer of conductive material, such as a copper layer, and the long pulse width laser focus completes a drill window in the surface of the copper layer, then the narrow pulse width laser focus passes through the drill window and drills the underlying high laser machining threshold insulating material layer. Conversely, if a narrow pulse width laser focus drills a high laser machining threshold insulating material layer, then a long pulse width laser focus passes through the narrow pulse width laser focus within the drilling range of the high laser machining threshold insulating material layer and drills the underlying conductive material layer.
Generally, the dispersion of the combined laser focus in the direction perpendicular to the transmission direction of the light beam is expected to be zero, namely, the two light spots coincide, if the two light spots do not coincide, the offset of one light spot relative to the other light spot needs to be set, so that the two light spots can accurately process the same position to be drilled under the action of the vibrating mirror. The two laser foci are preferably located in the same processing plane in the direction of beam propagation, with a maximum allowable offset of 100 microns in the present invention. Therefore, the two processing focuses can process the point to be processed on the same plane without adjusting the relative positions of the laser focus and the material to be processed.
Preferably, the method for adjusting the offset between the narrow pulse width laser focal point and the long pulse width laser focal point is,
and calibrating a galvanometer scanning and flat field focusing device according to the long pulse width laser focus or the narrow pulse width laser focus to determine a drilling coordinate system, so that the offset between the narrow pulse width laser focus and the long pulse width laser focus is in a preset range, and ensuring that the drilling track of the laser focus processed in the subsequent drilling is in the drilling track range of the laser focus processed in the previous drilling.
Preferably, the conductive material in the conductive material layer is copper;
the high laser machining threshold insulating material in the high laser machining threshold insulating material layer comprises any one or a combination of more of a BT material, a ceramic, a liquid crystal polymer material, and a FR4 material comprising glass fibers.
The composite material to be processed can be a double-sided copper clad laminate or a multilayer laminate containing FR4, a double-sided copper clad laminate or a multilayer laminate containing BT material, a double-sided copper clad laminate or a multilayer laminate containing Teflon material, a double-sided copper clad laminate or a multilayer laminate containing LCP (liquid crystal polymer) material, and at least one layer of each material.
In this embodiment, the number of the conductive material layers (copper foils) in the composite material is 2 or more, the number of the high laser processing threshold insulating material layers is 1 or 2 or more, and the upper and lower sides of the high laser processing threshold insulating material layers are the conductive material layers (copper foils). The method comprises the steps of drilling a copper foil (conductive material layer) by using a long pulse width laser focus (which can be a green light nanosecond laser focus), drilling an insulating material layer with a middle high laser processing threshold value by using a long pulse width laser focus (which can be a green light picosecond laser focus), and drilling subsequent materials by using a laser beam which passes through the front surface and a finished hole.
Further, the flow of the method for drilling a through hole in a composite material of the present invention is described below by taking a three-layer composite material as an example, wherein the upper and lower layers of the three-layer composite material are both conductive material layers (copper foils), and the middle layer is an insulating material layer with a high laser processing threshold.
As shown in fig. 2, 1 and 3 represent the upper layer of conductive material, typically copper foil, which may be from 1 micron to 50 microns thick; and 2, a high laser processing threshold insulating material layer, which can be an FR4 material or a BT material containing glass fibers or a Teflon material.
FR4 epoxy glass fiber cloth substrate (FR4 material) is a substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material.
BT material is a BT resin developed by Mitsubishi gas company in Japan, and is mainly polymerized by B (bismelimide) and T (triazine), and a substrate formed by the BT resin as a raw material has the advantages of high glass transition temperature Tg (255-330 ℃), heat resistance (160-230 ℃), moisture resistance, low dielectric constant (Dk), low dissipation factor (Df) and the like.
The teflon cloth is named teflon-coated glass fiber cloth, also known as teflon high-temperature resistant paint (welding) cloth, and is made by impregnating high-performance glass fiber cloth with suspended teflon emulsion, commonly known as plastic king, and is a new high-performance and multipurpose composite material product. For high frequency plate Polytetrafluoroethylene (PTFE), a large amount of inorganic material (such as silicon dioxide SiO2) or glass cloth is used as reinforcing filler for improving the function to increase the rigidity of the substrate and reduce the thermal expansion. In addition, the high-frequency plate is not easy to combine with the copper foil because of the molecular inertia of the polytetrafluoroethylene resin, so that the special appearance treatment of the combination surface with the copper foil is more needed. The processing method comprises the steps of carrying out chemical etching or plasma etching on the polytetrafluoroethylene surface of the high-frequency board, adding surface roughness or adding a bonding film layer between copper foil and polytetrafluoroethylene resin of the high-frequency board for improving the bonding force, but the bonding film layer possibly influences the medium function, and the development of the whole fluorine-based high-frequency circuit substrate needs to be cooperated with various aspects such as original material suppliers, research units, equipment suppliers, high-frequency PCB manufacturers and communication product manufacturers so as to meet the requirement of rapid development of the category of the high-frequency circuit board.
As shown in fig. 3, a long pulse width laser focus (not shown) drills a first hole 11 in the upper conductive material layer 1 of the three-layer composite material. The long pulse width laser may be an infrared or ultraviolet or visible band laser.
As shown in fig. 4, a narrow pulse width laser focal point (not shown) drills a second hole 21 in the high laser machining threshold insulating material layer 2 of the three-layer composite. Of course, a narrow pulse width laser is required to pass through the first hole 11 to drill a hole in the high laser machining threshold insulating material layer 2 while machining the second hole 21. The narrow pulse width laser may be an infrared or ultraviolet or visible band laser.
As shown in fig. 5, a long pulse width laser focus (not shown) drills a third hole 31 in the lower conductive material layer 3 of the three-layer composite. As a matter of course, the long pulse width drilling laser needs to pass through the first hole 11 and the second hole 21 when processing the third hole 31, so as to drill on the lower conductive material layer 3.
Finally, the first hole 11, the second hole 21 and the third hole 31 are connected to form a through hole required for processing.
Preferably, the laser pulse width of the long pulse width laser focus is greater than 1 nanosecond, and the laser pulse width of the narrow pulse width laser focus is less than 1 nanosecond.
For the processing of the conductive material, a certain laser peak value is needed, and meanwhile, a certain laser processing heat is also needed, so that the metal conductive material with high temperature can absorb laser better, and the material removal of the laser processing of the conductive material layer is facilitated. Therefore, the laser pulse width of the long pulse width laser used for processing the conductive material layer can be defined in the order of nanoseconds or even microseconds.
For insulating material layers with high laser processing threshold containing glass fiber or Teflon, nanosecond laser is difficult to achieve the laser processing threshold of the materials due to the fact that the laser peak power of the nanosecond laser is difficult to achieve, and direct laser processing is difficult to carry out. A higher laser peak power processing means must be adopted, so that the narrow pulse width laser is defined as an ultrashort pulse laser, and the pulse width is generally less than 1 nanosecond and includes picoseconds, femtoseconds and the like.
In this embodiment, the long pulse width laser for generating the long pulse width laser focus employs a solid laser with a wavelength of 532 nm, a pulse width of 25 ns @100 khz, an average power of 10 w @100 khz, a beam quality factor of less than 1.2, and a polarization ratio of more than 100: 1. the narrow pulse width laser for generating the narrow pulse width laser focus adopts a laser with the wavelength of 532 nanometers, the pulse width is 10 picoseconds @100 kilohertz, the average power is 10 watts @100 kilohertz, the beam quality factor is less than 1.3, and the polarization ratio is more than 100: 1. the narrow pulse width laser and the long pulse width laser are converged by the laser beam combiner to form a beam with the diameter of 8 mm, and are focused by the vibrating mirror scanning flat field focusing device, and the focusing light spots are about 25 microns.
In further embodiments, the spot diameters of the long pulse width laser focal point and the narrow pulse width laser focal point may also each be 5 microns or 10 microns or 15 microns or 20 microns or 30 microns or 35 microns, etc.
Preferably, in the combined laser focus, the dispersion of the long pulse width laser focus and the narrow pulse width laser focus in a plane perpendicular to the beam transmission direction is less than 30 mm, and the dispersion in the beam transmission direction is less than 100 μm.
Generally, the dispersion of the combined laser focus in the direction perpendicular to the transmission direction of the light beam is expected to be zero, namely, the two light spots coincide, if the two light spots do not coincide, the offset of one light spot relative to the other light spot needs to be set, so that the two light spots can accurately process the same position to be drilled under the action of the vibrating mirror.
The two laser foci are preferably located in the same processing plane in the direction of beam propagation, with a maximum allowable offset of 100 microns in the present invention. Therefore, the two processing focuses can process the point to be processed on the same plane without adjusting the relative positions of the laser focus and the material to be processed.
Example two:
based on the composite material through hole drilling method, the invention also provides composite material through hole drilling equipment.
As shown in fig. 6, a composite through-hole drilling apparatus applied to the composite through-hole drilling method described above includes a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser for outputting a long pulse width laser beam, and a narrow pulse width laser for outputting a narrow pulse width laser beam; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus; the long pulse width laser focus in the combined laser focus is used for drilling a conductive material layer at a position of a through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus is used for drilling a high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material; the diameters of light spots of the long pulse width laser focus and the narrow pulse width laser focus are both smaller than 40 micrometers, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane; in the process that the long pulse width laser focus and the narrow pulse width laser focus respectively drill the conductive material layer and the high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material, a laser beam corresponding to the laser focus of the subsequent drilling processing passes through a hole formed after the laser focus of the previous drilling processing is processed until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
Narrow pulse width lasers (ultrashort pulse laser sources) are relatively easy to process glass fiber or teflon insulating materials due to high peak laser power. However, for the drilling of the insulating material with high threshold, only low pulse repetition frequency (within 200 KHz) can be adopted, and the processing cannot be performed by adopting a pulse train mode (the heat of the pulse train mode is too large, and the peak power is also reduced), and the ultrashort pulse laser of the working mode is difficult to process the metal conductive materials such as copper foil and the like with high efficiency.
The long pulse width laser (nanosecond pulse width pulse laser), especially nanosecond ultraviolet and nanosecond green laser, is especially suitable for copper foil and other metal conducting material.
The ultrashort pulse laser corresponds to the narrow pulse width laser of the invention, and the nanosecond laser corresponds to the long pulse width laser of the invention.
The invention adopts long pulse width laser and narrow pulse width laser to carry out laser beam combination, and after the laser beam combination is focused by the same set of galvanometer scanning and flat field focusing device, a combined laser focus is constructed, and respectively carries out material removing processing on respective good dielectric materials, thus finishing the through hole drilling of the composite material with high efficiency and high quality and perfectly solving the industrial pain point of the through hole drilling of the composite material.
Preferably, the narrow pulse width laser is a picosecond laser or a femtosecond laser, and the long pulse width laser is a nanosecond laser.
Preferably, the long pulse width laser is a narrow pulse width laser operating in burst mode and/or at a high pulse repetition rate, i.e. a pulse repetition rate of greater than 300 khz.
The ultrashort pulse laser (the patent refers to a laser with a pulse width less than 1 nanosecond) working in a pulse train mode or at a high repetition frequency directly generates a relatively large processing heat due to the high spatial overlapping degree of the pulse on the surface of a material, so that the temperature of the processing position of a conductive material layer is increased, the absorption of the metal conductive material in the region on the energy of the ultrashort pulse laser is increased, and the faster clearing speed of the metal conductive material can be obtained.
Example three:
based on the composite material through hole drilling method, the invention also provides a composite material through hole drilling device.
A composite through-hole drilling device comprises a processor, a memory and a computer program stored in the memory and capable of running on the processor, wherein the computer program realizes the composite through-hole drilling method when running.
Example four:
based on the composite material through hole drilling equipment and device, the invention further provides a composite material through hole drilling system.
As shown in fig. 7, a composite via drilling system,
the drilling machine comprises a machine table, the composite material through hole drilling equipment and the composite material through hole drilling device, wherein the composite material through hole drilling device is electrically connected with the composite material through hole drilling equipment;
the machine table is used for placing the composite material to be processed;
the composite material through hole drilling equipment is used for outputting a combined laser focus;
the composite material through hole drilling device is used for controlling the combined laser focus output by the composite material through hole drilling equipment to execute the composite material through hole drilling method, and drilling the composite material placed on the machine table.
In particular, the composite material through-hole drilling system may further include necessary photographing and displacement devices for alignment, optical path devices, and the like.
In the method, the equipment, the device and the system for drilling the through hole of the composite material, the long pulse width laser can efficiently remove and process metal conductive materials in a conductive material layer, but hardly removes and processes materials containing glass fibers or other insulating materials with high laser processing threshold values; the invention adopts two laser light sources (long pulse width laser and narrow pulse width laser) to carry out laser beam combination, and after the laser beam combination is scanned by a same vibrating mirror and focused by a flat field focusing device, a combined laser focus is constructed, and the medium materials which are good at each laser light source are respectively subjected to material removing processing, so that the through hole drilling of the composite material can be efficiently completed with high quality, and the industrial pain point of the through hole drilling of the composite material is perfectly solved.
The reader should understand that in the description of this specification, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (11)
1. A drilling method for a through hole of a composite material is characterized by comprising the following steps: drilling a through hole on the composite material to be processed by using a combined laser focus formed by combining two small laser focuses; the laser processing device comprises a combined laser focus, two small laser focuses, a laser processing system and a laser processing system, wherein the diameters of light spots of the two small laser focuses are both smaller than 40 micrometers, the two small laser focuses are respectively a long pulse width laser focus and a narrow pulse width laser focus, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane; the composite material at least comprises a laminated conductive material layer and a high laser processing threshold insulating material layer;
the composite material through hole drilling method comprises the following steps,
irradiating the combined laser focus on the surface of the composite material;
drilling the conductive material layer at the position of the through hole to be drilled in the composite material by using the long pulse width laser focus in the combined laser focus, and drilling the insulating material layer at the high laser processing threshold value at the position of the through hole to be drilled in the composite material by using the narrow pulse width laser focus in the combined laser focus; in the process that the long pulse width laser focus and the narrow pulse width laser focus respectively drill the conductive material layer and the high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material, a laser beam corresponding to the laser focus of the subsequent drilling processing passes through a hole formed after the laser focus of the previous drilling processing is processed until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
2. The composite via drilling method of claim 1, wherein: before the combined laser focus performs drilling processing on the position of the through hole to be drilled in the composite material, the method further comprises the following step of adjusting the offset between the narrow pulse width laser focus and the long pulse width laser focus to enable the drilling track of the laser focus processed in the subsequent drilling to be within the drilling track range of the laser focus processed in the previous drilling.
3. The composite via drilling method of claim 2, wherein: the method for adjusting the offset between the narrow pulse width laser focus and the long pulse width laser focus is that,
and calibrating a galvanometer scanning and flat field focusing device according to the long pulse width laser focus or the narrow pulse width laser focus to determine a drilling coordinate system, so that the offset between the narrow pulse width laser focus and the long pulse width laser focus is in a preset range, and ensuring that the drilling track of the laser focus processed in the subsequent drilling is in the drilling track range of the laser focus processed in the previous drilling.
4. The composite through-hole drilling method according to any one of claims 1 to 3, characterized in that: the conductive material in the conductive material layer is copper;
the high laser machining threshold insulating material in the high laser machining threshold insulating material layer comprises any one or a combination of more of a BT material, a ceramic, a liquid crystal polymer material, and a FR4 material comprising glass fibers.
5. The composite through-hole drilling method according to any one of claims 1 to 3, characterized in that: the laser pulse width of the long pulse width laser focus is larger than 1 nanosecond, and the laser pulse width of the narrow pulse width laser focus is smaller than 1 nanosecond.
6. The composite through-hole drilling method according to any one of claims 1 to 3, characterized in that: in the combined laser focus, the dispersion of the long pulse width laser focus and the narrow pulse width laser focus in a plane perpendicular to the beam transmission direction is less than 30 mm, and the dispersion in the beam transmission direction is less than 100 μm.
7. The utility model provides a combined material through-hole drilling equipment which characterized in that: the composite through hole drilling equipment is applied to the composite through hole drilling method as claimed in any one of claims 1 to 6, and comprises a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser for outputting a long pulse width laser beam and a narrow pulse width laser for outputting a narrow pulse width laser beam; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus; the long pulse width laser focus in the combined laser focus is used for drilling a conductive material layer at a position of a through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus is used for drilling a high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material; the diameters of light spots of the long pulse width laser focus and the narrow pulse width laser focus are both smaller than 40 micrometers, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane; in the process that the long pulse width laser focus and the narrow pulse width laser focus respectively drill the conductive material layer and the high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material, a laser beam corresponding to the laser focus of the subsequent drilling processing passes through a hole formed after the laser focus of the previous drilling processing is processed until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
8. The composite via drilling apparatus of claim 7, wherein: the narrow pulse width laser is a picosecond laser or a femtosecond laser, and the long pulse width laser is a nanosecond laser.
9. The composite via drilling apparatus of claim 7 or 8, wherein: the long pulse width laser employs a narrow pulse width laser operating in burst mode and/or at a high pulse repetition rate, i.e., a pulse repetition rate greater than 300 kilohertz.
10. The utility model provides a combined material through-hole drilling equipment which characterized in that: comprising a processor, a memory and a computer program stored in the memory and executable on the processor, the computer program when executed implementing a composite through-hole drilling method according to any one of claims 1 to 6.
11. A composite through hole drilling system is characterized in that: comprising a machine station, further comprising a composite via drilling apparatus according to any one of claims 7 to 9 and a composite via drilling device according to claim 10, the composite via drilling device being electrically connected to the composite via drilling apparatus;
the machine table is used for placing the composite material to be processed;
the composite material through hole drilling equipment is used for outputting a combined laser focus;
the composite through hole drilling device is used for controlling the combined laser focus output by the composite through hole drilling equipment to execute the composite through hole drilling method according to any one of claims 1 to 6, and completing the drilling processing of the composite material placed on the machine table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110285213.3A CN113001045A (en) | 2021-03-17 | 2021-03-17 | Composite material through hole drilling method, equipment, device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110285213.3A CN113001045A (en) | 2021-03-17 | 2021-03-17 | Composite material through hole drilling method, equipment, device and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113001045A true CN113001045A (en) | 2021-06-22 |
Family
ID=76409035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110285213.3A Pending CN113001045A (en) | 2021-03-17 | 2021-03-17 | Composite material through hole drilling method, equipment, device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113001045A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114523196A (en) * | 2022-04-22 | 2022-05-24 | 武汉铱科赛科技有限公司 | Blind hole drilling method, equipment, device and system with selective laser absorption |
| CN114535834A (en) * | 2022-03-15 | 2022-05-27 | 武汉锐科光纤激光技术股份有限公司 | Control method and device of drilling equipment, storage medium and electronic device |
| CN114799553A (en) * | 2022-04-22 | 2022-07-29 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
-
2021
- 2021-03-17 CN CN202110285213.3A patent/CN113001045A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535834A (en) * | 2022-03-15 | 2022-05-27 | 武汉锐科光纤激光技术股份有限公司 | Control method and device of drilling equipment, storage medium and electronic device |
| CN114535834B (en) * | 2022-03-15 | 2024-03-19 | 武汉锐科光纤激光技术股份有限公司 | Control method and device of drilling equipment, storage medium and electronic device |
| CN114523196A (en) * | 2022-04-22 | 2022-05-24 | 武汉铱科赛科技有限公司 | Blind hole drilling method, equipment, device and system with selective laser absorption |
| CN114523196B (en) * | 2022-04-22 | 2022-07-15 | 武汉铱科赛科技有限公司 | Blind hole drilling method, equipment, device and system with selective laser absorption |
| CN114799553A (en) * | 2022-04-22 | 2022-07-29 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
| CN114799553B (en) * | 2022-04-22 | 2023-10-20 | 东莞领益精密制造科技有限公司 | Composite material processing technology and composite material production line |
| WO2023201860A1 (en) * | 2022-04-22 | 2023-10-26 | 武汉铱科赛科技有限公司 | Blind via drilling method, device, apparatus and system based on selective laser absorption |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113001045A (en) | Composite material through hole drilling method, equipment, device and system | |
| CN108098147B (en) | Double-sided laser processing method for PCB array micropores | |
| US7528342B2 (en) | Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser | |
| JP6181031B2 (en) | Method and apparatus for forward deposition on a substrate by energy transfer of burst ultrafast laser pulses | |
| US4839497A (en) | Drilling apparatus and method | |
| JP3522654B2 (en) | Laser processing apparatus and processing method | |
| CN110625271A (en) | Ultrafast laser PCB drilling equipment and method thereof | |
| JP2010528865A (en) | Drilling with multiple laser wavelengths and pulse widths | |
| JPH1168275A (en) | Circuit forming board, method and apparatus for forming circuit forming board | |
| JP2012069924A (en) | Printed wiring board and manufacturing method therefor | |
| CN113271729A (en) | Circuit board through hole drilling method, device and system capable of avoiding hole blockage | |
| CN214518290U (en) | Composite material through hole drilling equipment | |
| CN114523196B (en) | Blind hole drilling method, equipment, device and system with selective laser absorption | |
| WO2022222411A1 (en) | Pcb short-wavelength pulse laser drilling method and related apparatus | |
| JP2004351513A (en) | Method for machining material by super-short pulse laser beam, printed circuit board, and method for manufacturing the same | |
| JP4589760B2 (en) | Laser processing method | |
| JPH08340165A (en) | Formation of via hole and laser processing device | |
| Gan et al. | Laser drilling of micro-vias in PCB substrates | |
| CN210967521U (en) | Equipment for ultrafast laser PCB drilling | |
| JPH11309594A (en) | Laser beam machining device and its working parts | |
| KR102583274B1 (en) | Laser drilling method | |
| KR100504234B1 (en) | Laser drilling method | |
| JP2000202664A (en) | Lasder drilling method | |
| Zakariyah et al. | Polymer optical waveguide fabrication using laser ablation | |
| Zhang et al. | 355nm DPSS UV laser micro-processing for the semiconductor and electronics industry |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |