CN214518290U - Composite material through hole drilling equipment - Google Patents
Composite material through hole drilling equipment Download PDFInfo
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- CN214518290U CN214518290U CN202120550088.XU CN202120550088U CN214518290U CN 214518290 U CN214518290 U CN 214518290U CN 202120550088 U CN202120550088 U CN 202120550088U CN 214518290 U CN214518290 U CN 214518290U
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Abstract
The utility model relates to the laser processing field, in particular to a composite material through hole drilling device, which comprises a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser and a narrow pulse width laser; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus. The utility model discloses combination laser focus carries out the material to the dielectric material who excels in separately respectively and clears away processing, can accomplish combined material's through-hole drilling high-efficiently high-quality ground, and the perfect trade pain point of solving this type of combined material through-hole drilling.
Description
Technical Field
The utility model relates to a laser beam machining technical field, concretely relates to combined material through-hole drilling equipment.
Background
At present, the through hole drilling of a circuit board by adopting laser is increasingly mature, but for ultraviolet nanosecond laser, when an insulating material is an FR4 material or a BT material containing glass fiber or a Teflon material, the ultraviolet nanosecond laser has insufficient peak power, so that the glass fiber is greatly shrunk when being removed, meanwhile, the glass fiber is seriously protruded, or when a Teflon insulating layer is processed, the Teflon material is easily layered with a glue layer due to the low absorption rate of the Teflon material to the laser in an ultraviolet waveband. This is an industry problem after such boards have developed to a certain stage. At present, the problems are that the laser drilling of carbon dioxide is used for some marginal processing, and the processing quality is not ideal.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a combined material through-hole drilling equipment is provided, can solve the combined material's that contains the insulating material of high laser beam machining threshold value through-hole difficult problem.
The utility model provides an above-mentioned technical problem's technical scheme as follows: a composite material through hole drilling device comprises a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser for outputting a long pulse width laser beam and a narrow pulse width laser for outputting a narrow pulse width laser beam; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus; the long pulse width laser focus in the combined laser focus is used for drilling a conductive material layer at a position of a through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus is used for drilling a high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material; the long pulse width laser focus and the narrow pulse width laser focus have spot diameters smaller than 40 microns, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane.
The utility model has the advantages that: in the composite material through hole drilling equipment, the long pulse width laser can efficiently remove and process metal conductive materials in a conductive material layer, but is difficult to remove and process materials containing glass fibers or other high laser processing threshold insulating materials; and narrow pulse width laser (ultrashort pulse laser) is owing to possess high laser peak power, and the processing is clear away to the material that is particularly suitable for this type of high laser processing threshold insulating material, but the material that is difficult to high-efficient solution metal conducting layer clears away the processing, the utility model discloses a these two kinds of laser source (long pulse width laser and narrow pulse width laser) carry out laser beam combination and through after same set of galvanometer scanning and flat field focusing device focus, construct combination laser focus, carry out the material respectively to the medium material who excels in separately and clear away the processing, can accomplish combined material's through-hole drilling high-efficiently high-quality ground, the perfect trade pain point of this type of combined material through-hole drilling.
Drawings
Fig. 1 is a schematic structural view of the composite material through hole drilling equipment of the present invention;
FIG. 2 is a schematic structural view of a composite material;
FIG. 3 is a schematic structural view of the composite material after a first step of processing;
FIG. 4 is a schematic structural view of the composite material after a second step of processing;
fig. 5 is a schematic structural diagram of the composite material after the third processing step.
In the drawings, the components represented by the respective reference numerals are listed below:
1. upper layer of conductive material, 11, first hole, 2, high laser machining threshold insulating material layer, 21, second hole, 3, lower layer of conductive material, 31, third hole.
Detailed Description
The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
As shown in fig. 1, a composite material through hole drilling apparatus includes a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser for outputting a long pulse width laser beam, and a narrow pulse width laser for outputting a narrow pulse width laser beam; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus; the long pulse width laser focus in the combined laser focus is used for drilling a conductive material layer at a position of a through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus is used for drilling a high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material; the long pulse width laser focus and the narrow pulse width laser focus have spot diameters smaller than 40 microns, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane.
Narrow pulse width lasers (ultrashort pulse laser sources) are relatively easy to process glass fiber or teflon insulating materials due to high peak laser power. However, for the drilling of the insulating material with high threshold, only low pulse repetition frequency (within 200 KHz) can be adopted, and the processing cannot be performed by adopting a pulse train mode (the heat of the pulse train mode is too large, and the peak power is also reduced), and the ultrashort pulse laser of the working mode is difficult to process the metal conductive materials such as copper foil and the like with high efficiency.
The long pulse width laser (nanosecond pulse width pulse laser), especially nanosecond ultraviolet and nanosecond green laser, is especially suitable for copper foil and other metal conducting material.
Ultrashort pulse laser has corresponded the utility model discloses a narrow pulse width laser, nanosecond laser has corresponded the utility model discloses a long pulse width laser.
The utility model discloses a long pulse width laser and narrow pulse width laser carry out laser beam combination and through the same set of mirror scanning that shakes and the focusing back of flat field focusing device, found combination laser focus, carry out the material to the dielectric material who excels in separately respectively and clear away processing, can accomplish combined material's through-hole drilling high-efficiently high-quality ground, the perfect trade pain point of solving this type of combined material through-hole drilling.
In the utility model, the long pulse width laser focus refers to the laser focus that can be used for processing the conductive material layer, and the narrow pulse width laser focus refers to the laser focus that can be used for processing the insulating material layer with high laser processing threshold; wherein a high laser processing threshold material is defined as requiring greater than 3GW/cm2Material at the processing threshold of peak power density. For example, the peak power density of a 10KW peak power focused on a focusing light spot with the diameter of 20 microns is theoretically calculated to be 3.18GW/cm2Wherein GW is nine power watts, cm of ten2Is square centimeter. The material absorbs laser light, which is firstly shown as the absorption of material substances to specific laser wavelength, but some materials have low absorption coefficient to the specific laser wavelength, for example, materials such as glass/glass fiber and teflon have low absorption to 355nm ultraviolet laser light. At this time, the peak power density of the laser in the laser spot needs to be increased, and under the condition of high-intensity laser power density, the material generates nonlinear absorption on the laser with the wavelength which is not absorbed very much originally. The material substance is a high laser threshold processing material for the laser of the wavelength.
Preferably, the laser pulse width of the long pulse width laser beam emitted by the long pulse width laser is greater than 1 nanosecond, and the laser pulse width of the narrow pulse width laser beam emitted by the narrow pulse width laser is less than 1 nanosecond.
For the processing of the conductive material, a certain laser peak value is needed, and meanwhile, a certain laser processing heat is also needed, so that the metal conductive material with high temperature can better absorb laser, and the material removal of the laser processing of the conductive layer is facilitated. Therefore, the laser pulse width of the long pulse width laser used for processing the conductive layer can be defined in the order of nanoseconds or even microseconds.
For insulating material layers with high laser processing threshold containing glass fiber or Teflon, nanosecond laser is difficult to achieve the laser processing threshold of the materials due to the fact that the laser peak power of the nanosecond laser is difficult to achieve, and direct laser processing is difficult to carry out. A higher laser peak power processing means must be adopted, so that the narrow pulse width laser is defined as an ultrashort pulse laser, and the pulse width is generally less than 1 nanosecond and includes picoseconds, femtoseconds and the like.
In this embodiment, the long-pulse width laser employs a solid laser with a wavelength of 532 nm, a pulse width of 25 ns @100 khz, an average power of 10 w @100 khz, a beam quality factor of less than 1.2, and a polarization ratio of more than 100: 1. the narrow pulse width laser adopts a laser with the wavelength of 532 nanometers, the pulse width is 10 picoseconds @100 kilohertz, the average power is 10 watts @100 kilohertz, the beam quality factor is less than 1.3, and the polarization ratio is more than 100: 1. the narrow pulse width laser and the long pulse width laser are converged by the laser beam combiner to form a beam with the diameter of 8 mm, and are focused by the vibrating mirror scanning flat field focusing device, and the focusing light spots are about 25 microns.
Preferably, the narrow pulse width laser is a picosecond laser or a femtosecond laser, and the long pulse width laser is a nanosecond laser.
Preferably, in the combined laser focus, the dispersion of the long pulse width laser focus and the narrow pulse width laser focus in a plane perpendicular to the beam transmission direction is less than 30 mm, and the dispersion in the beam transmission direction is less than 100 μm.
Generally, the dispersion of the combined laser focus in the direction perpendicular to the transmission direction of the light beam is expected to be zero, namely, the two light spots coincide, if the two light spots do not coincide, the offset of one light spot relative to the other light spot needs to be set, so that the two light spots can accurately process the same position to be drilled under the action of the vibrating mirror.
In the beam transmission direction, the two laser focus points are preferably located in the same machining plane, in which case the maximum allowable offset is 100 micrometers. Therefore, the two processing focuses can process the point to be processed on the same plane without adjusting the relative positions of the laser focus and the material to be processed.
Preferably, the spot diameter of the long pulse width laser focus and the spot diameter of the narrow pulse width laser focus are both less than 40 microns.
Preferably, the long pulse width laser is a narrow pulse width laser operating in burst mode and/or at a high pulse repetition rate, i.e. a pulse repetition rate of greater than 300 khz.
The ultrashort pulse laser (the patent refers to a laser with a pulse width less than 1 nanosecond) working in a pulse train mode or at a high repetition frequency directly generates a relatively large processing heat due to the high spatial overlapping degree of the pulse on the surface of a material, so that the temperature of a processing position of a conductive layer is increased, the absorption of the metal conductive material in the region on the energy of the ultrashort pulse laser is increased, and the faster removal speed of the metal conductive material can be obtained.
Drilling the composite material to be processed by using the composite material through hole drilling equipment; wherein the composite material comprises at least a layer of laminated conductive material and a layer of high laser machining threshold insulating material.
Utilize the utility model relates to a combined material through-hole drilling equipment carries out laser beam machining's process as follows:
irradiating the combined laser focus on the surface of the composite material to be processed; the long pulse width laser focus in the combined laser focus carries out drilling processing on the conductive material layer at the position of the through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus carries out drilling processing on the insulating material layer at the high laser processing threshold value at the position of the through hole to be drilled in the composite material; in the process of drilling and processing the position of the through hole to be drilled in the composite material by the combined laser focus, the laser beam corresponding to the laser focus processed in the subsequent drilling passes through the hole formed after the laser focus processed in the previous drilling is finished until the composite material forms a through hole; the laser focus of the post-drilling process is specifically the long pulse width laser focus or the narrow pulse width laser focus, and correspondingly, the laser focus of the pre-drilling process is specifically the narrow pulse width laser focus or the long pulse width laser focus.
Preferably, before the combined laser focus performs drilling processing on the position of the through hole to be drilled in the composite material, the method further includes the step of adjusting an offset between the narrow pulse width laser focus and the long pulse width laser focus so that a drilling track of the laser focus processed in the subsequent drilling is within a drilling track range of the laser focus processed in the previous drilling.
Generally, the dispersion of the combined laser focus in the direction perpendicular to the transmission direction of the light beam is expected to be zero, namely, the two light spots coincide, if the two light spots do not coincide, the offset of one light spot relative to the other light spot needs to be set, so that the two light spots can accurately process the same position to be drilled under the action of the vibrating mirror. In the beam transmission direction, the two laser focus points are preferably located in the same machining plane, in which case the maximum allowable offset is 100 micrometers. Therefore, the two processing focuses can process the point to be processed on the same plane without adjusting the relative positions of the laser focus and the material to be processed.
Preferably, the method for adjusting the offset between the narrow pulse width laser focal point and the long pulse width laser focal point is,
and calibrating a galvanometer scanning and flat field focusing device according to the long pulse width laser focus or the narrow pulse width laser focus to determine a drilling coordinate system, so that the offset between the narrow pulse width laser focus and the long pulse width laser focus is in a preset range, and ensuring that the drilling track of the laser focus processed in the subsequent drilling is in the drilling track range of the laser focus processed in the previous drilling.
Preferably, the conductive material in the conductive material layer is copper;
the high laser machining threshold insulating material in the high laser machining threshold insulating material layer comprises any one or a combination of more of a BT material, a ceramic, a liquid crystal polymer material, and a FR4 material comprising glass fibers.
The composite material to be processed can be a double-sided copper clad laminate or a multilayer laminate containing FR4, a double-sided copper clad laminate or a multilayer laminate containing BT material, a double-sided copper clad laminate or a multilayer laminate containing Teflon material, a double-sided copper clad laminate or a multilayer laminate containing LCP (liquid crystal polymer) material, and at least one layer of each material.
In this embodiment, the number of the conductive material layers (copper foils) in the composite material is 2 or more, the number of the high laser processing threshold insulating material layers is 1 or 2 or more, and the upper and lower sides of the high laser processing threshold insulating material layers are the conductive material layers (copper foils). The copper foil (conductive layer) is drilled by adopting a long pulse width laser focus (which can be a green light nanosecond laser focus), the insulating material layer with a middle high laser processing threshold is drilled by adopting a long pulse width laser focus (which can be a green light picosecond laser focus), and a laser beam adopted by the subsequent drilling processing needs to pass through the front surface and the finished hole to drill the subsequent material.
Further, the following describes the process of the composite material through hole drilling method by taking a three-layer composite material as an example, wherein the upper and lower layers of the three-layer composite material are conductive layers (copper foils), and the middle layer is an insulating material layer with a high laser processing threshold value.
As shown in fig. 2, 1 and 3 represent the upper layer of conductive material, typically copper foil, which may be from 1 micron to 50 microns thick; and 2, a high laser processing threshold insulating material layer, which can be an FR4 material or a BT material containing glass fibers or a Teflon material.
FR4 epoxy glass fiber cloth substrate (FR4 material) is a substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcing material.
BT material is a BT resin developed by Mitsubishi gas company in Japan, and is mainly polymerized by B (bismelimide) and T (triazine), and a substrate formed by the BT resin as a raw material has the advantages of high glass transition temperature Tg (255-330 ℃), heat resistance (160-230 ℃), moisture resistance, low dielectric constant (Dk), low dissipation factor (Df) and the like.
The teflon cloth is named teflon-coated glass fiber cloth, also known as teflon high-temperature resistant paint (welding) cloth, and is made by impregnating high-performance glass fiber cloth with suspended teflon emulsion, commonly known as plastic king, and is a new high-performance and multipurpose composite material product. For high frequency plate Polytetrafluoroethylene (PTFE), a large amount of inorganic material (such as silicon dioxide SiO2) or glass cloth is used as reinforcing filler for improving the function to increase the rigidity of the substrate and reduce the thermal expansion. In addition, the high-frequency plate is not easy to combine with the copper foil because of the molecular inertia of the polytetrafluoroethylene resin, so that the special appearance treatment of the combination surface with the copper foil is more needed. The processing method comprises the steps of carrying out chemical etching or plasma etching on the polytetrafluoroethylene surface of the high-frequency board, adding surface roughness or adding a bonding film layer between copper foil and polytetrafluoroethylene resin of the high-frequency board for improving the bonding force, but the bonding film layer possibly influences the medium function, and the development of the whole fluorine-based high-frequency circuit substrate needs to be cooperated with various aspects such as original material suppliers, research units, equipment suppliers, high-frequency PCB manufacturers and communication product manufacturers so as to meet the requirement of rapid development of the category of the high-frequency circuit board.
As shown in fig. 3, a long pulse width laser focus (not shown) drills a first hole 11 in the upper conductive material layer 1 of the three-layer composite material. The long pulse width laser may be an infrared or ultraviolet or visible band laser.
As shown in fig. 4, a narrow pulse width laser focal point (not shown) drills a second hole 21 in the high laser machining threshold insulating material layer 2 of the three-layer composite. Of course, a narrow pulse width laser is required to pass through the first hole 11 to drill a hole in the high laser machining threshold insulating material layer 2 while machining the second hole 21. The narrow pulse width laser may be an infrared or ultraviolet or visible band laser.
As shown in fig. 5, a long pulse width laser focus (not shown) drills a third hole 31 in the lower conductive material layer 3 of the three-layer composite. As a matter of course, the long pulse width drilling laser needs to pass through the first hole 11 and the second hole 21 when processing the third hole 31, so as to drill on the lower conductive material layer 3.
Finally, the first hole 11, the second hole 21 and the third hole 31 are connected to form a through hole required for processing.
In the composite material through hole drilling equipment, the long pulse width laser can efficiently remove and process metal conductive materials in a conductive material layer, but is difficult to remove and process materials containing glass fibers or other high laser processing threshold insulating materials; and narrow pulse width laser (ultrashort pulse laser) is owing to possess high laser peak power, and the processing is clear away to the material that is particularly suitable for this type of high laser processing threshold insulating material, but the material that is difficult to high-efficient solution metal conducting layer clears away the processing, the utility model discloses a these two kinds of laser source (long pulse width laser and narrow pulse width laser) carry out laser beam combination and through after same set of galvanometer scanning and flat field focusing device focus, construct combination laser focus, carry out the material respectively to the medium material who excels in separately and clear away the processing, can accomplish combined material's through-hole drilling high-efficiently high-quality ground, the perfect trade pain point of this type of combined material through-hole drilling.
The reader should understand that in the description of this specification, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (6)
1. The utility model provides a combined material through-hole drilling equipment which characterized in that: the laser pulse width control device comprises a laser beam combiner, a galvanometer scanning and flat field focusing device, a long pulse width laser used for outputting a long pulse width laser beam and a narrow pulse width laser used for outputting a narrow pulse width laser beam; the laser output port of the long pulse width laser and the laser output port of the narrow pulse width laser are both connected with the laser input port of the laser beam combiner through optical paths, the laser output port of the laser beam combiner is connected with the input end of the galvanometer scanning and flat field focusing device through optical paths, the output end of the galvanometer scanning and flat field focusing device is used for outputting a combined laser focus, and the combined laser focus comprises a long pulse width laser focus and a narrow pulse width laser focus; the long pulse width laser focus in the combined laser focus is used for drilling a conductive material layer at a position of a through hole to be drilled in the composite material, and the narrow pulse width laser focus in the combined laser focus is used for drilling a high laser processing threshold insulating material layer at the position of the through hole to be drilled in the composite material; the long pulse width laser focus and the narrow pulse width laser focus have spot diameters smaller than 40 microns, and in the combined laser focus, the long pulse width laser focus and the narrow pulse width laser focus are located in the same processing plane.
2. The composite via drilling apparatus of claim 1, wherein: the laser pulse width of the long pulse width laser beam emitted by the long pulse width laser is larger than 1 nanosecond, and the laser pulse width of the narrow pulse width laser beam emitted by the narrow pulse width laser is smaller than 1 nanosecond.
3. The composite via drilling apparatus of claim 1, wherein: the narrow pulse width laser is a picosecond laser or a femtosecond laser, and the long pulse width laser is a nanosecond laser.
4. The composite via drilling apparatus of claim 1, wherein: in the combined laser focus, the dispersion of the long pulse width laser focus and the narrow pulse width laser focus in a plane perpendicular to the beam transmission direction is less than 30 mm, and the dispersion in the beam transmission direction is less than 100 μm.
5. The composite via drilling apparatus of claim 1, wherein: the spot diameters of the long pulse width laser focus and the narrow pulse width laser focus are both less than 40 microns.
6. The composite via drilling apparatus of claim 1, wherein: the long pulse width laser employs a narrow pulse width laser operating in burst mode and/or at a high pulse repetition rate, i.e., a pulse repetition rate greater than 300 kilohertz.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023201860A1 (en) * | 2022-04-22 | 2023-10-26 | 武汉铱科赛科技有限公司 | Blind via drilling method, device, apparatus and system based on selective laser absorption |
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2021
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023201860A1 (en) * | 2022-04-22 | 2023-10-26 | 武汉铱科赛科技有限公司 | Blind via drilling method, device, apparatus and system based on selective laser absorption |
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Denomination of utility model: Composite material through hole drilling equipment Effective date of registration: 20211231 Granted publication date: 20211029 Pledgee: Wuhan area branch of Hubei pilot free trade zone of Bank of China Ltd. Pledgor: WUHAN EXCEL SCIENCE AND TECHNOLOGY Ltd. Registration number: Y2021420000158 |
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