CN111136389A - Device and method for cutting pi screen plate by laser imaging method - Google Patents
Device and method for cutting pi screen plate by laser imaging method Download PDFInfo
- Publication number
- CN111136389A CN111136389A CN202010073511.1A CN202010073511A CN111136389A CN 111136389 A CN111136389 A CN 111136389A CN 202010073511 A CN202010073511 A CN 202010073511A CN 111136389 A CN111136389 A CN 111136389A
- Authority
- CN
- China
- Prior art keywords
- light
- axis
- reflector
- cutting
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 32
- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000004579 marble Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 241001233242 Lontra Species 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 2
- 238000009826 distribution Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a device and a method for cutting a pi screen plate by a laser imaging method, which comprises a tool carrying platform for clamping the screen plate and an ultraviolet ultrashort pulse laser, wherein a beam expander, a spectroscope unit, a light cover plate and a reflector set are sequentially arranged on an output light path of the ultraviolet ultrashort pulse laser, a reflection light path of the reflector set is connected with a vibrating mirror, a scanning field lens is arranged at the output end of the vibrating mirror, and the projection end of the scanning field lens is right opposite to the tool carrying platform. The ultra-short pulse ultraviolet laser is adopted, a group of two spectroscopes are used for light splitting and light homogenizing, the laser is imaged through a light shield plate to remove pi and a glue layer on the surface of pi, light homogenizing treatment is carried out on imaging light spots, the taper of the cutting surface of the pi is obviously reduced, meanwhile, a plurality of groups of imaging light shield plates with different sizes are provided, the size of the processing light spots can be selected, the vibration mirror scanning is combined with a platform linear motion combined mode to carry out material processing, and the processing precision and the processing efficiency are obviously improved.
Description
Technical Field
The invention relates to a device and a method for cutting a pi screen plate by a laser imaging method.
Background
Currently, with the continuous development of silicon solar cell technology, the performance requirements of the industry on solar cells are higher and higher while the pursuit of low cost is pursued. The solar cell manufacturing mainly comprises the following steps: cutting a silicon wafer and preparing materials; removing the damaged layer; texturing; diffusion and junction making; etching and cleaning the edge; depositing an antireflection layer; printing an upper electrode and a lower electrode; co-firing to form metal contacts; and (6) testing the battery piece. The printing of the electrode has great influence on the performance of the cell, and the electrode with high quality performance can effectively improve the conversion efficiency of the solar cell to a certain extent. The traditional positive electrode printing screen plate is formed by mutually perpendicular a plurality of main grid lines and a plurality of thin grid lines, the main grid lines of the electrode printed by the traditional screen plate are large in width and almost penetrate through the whole cell, the large area of the main grid lines covers the illumination area of the cell, and therefore the utilization rate of solar energy is reduced. The industry people are always striving to reduce the line diameter width of the printed fine grid line so as to increase the effective illumination area of the battery piece, but the current collection capability of the grid line structure inherent to the printed electrode is difficult to be further improved;
the traditional laser processing mode at present adopts a Gaussian facula to carry out scanning processing by using a galvanometer, and carries out splicing and filling processing on the wire grating, and the method has the problem of overlarge taper in the processing of the wire grating; the processing of the thick grid line has the problems that filling processing is needed, and the efficiency is extremely low; the long wire grid processing has the problems that splicing processing is needed, obvious splicing traces exist, and the electrical property is influenced in the later period.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a device and a method for cutting a pi screen plate by a laser imaging method.
The purpose of the invention is realized by the following technical scheme:
the device for cutting the pi screen plate by the laser imaging method is characterized in that: contain frock microscope carrier and the ultrashort pulse laser of ultraviolet that is used for the centre gripping otter board, arranged beam expanding mirror, spectroscope unit, light cover plate and speculum group in proper order on the output light path of the ultrashort pulse laser of ultraviolet, the reflection light path of speculum group links up the mirror that shakes, and the output of the mirror that shakes arranges the scanning field mirror, and the projection end of scanning field mirror is just to the frock microscope carrier.
Further, the device for cutting the pi net plate by the laser imaging method is characterized in that the ultraviolet ultrashort pulse laser is an ultraviolet ultrashort pulse laser with the wavelength of 355nm, the pulse width of 1 ns-30 ns, the frequency of 150-500 KHZ and the number of sub-pulses of 5.
Further, in the device for cutting the pi net plate by the laser imaging method, the beam splitter unit includes two beam splitters, which are arranged perpendicular to each other in a beam splitting direction.
Further, the device for cutting the pi net plate by the laser imaging method is characterized in that the beam expander is a beam expander with a beam expansion magnification of 1 time.
Further, in the device for cutting the pi net plate by using the laser imaging method, the reflector group comprises a first reflector, a second reflector, a third reflector and a fourth reflector which are sequentially arranged, and light is sequentially reflected and transmitted to the second reflector, the third reflector and the fourth reflector through the first reflector.
Further, the device for cutting the pi net plate by the laser imaging method is characterized in that the scanning field lens is a scanning field lens with a focal length of 55 mm-70 mm.
Further, the device for cutting the pi net plate by the laser imaging method comprises an X-axis conveying unit, a Y-axis conveying unit and a substrate, wherein the X-axis conveying unit comprises an X-axis marble base, an X-axis linear guide rail, an X-axis connecting plate and an X-axis linear motor for controlling the X-axis connecting plate to move; the Y-axis conveying unit comprises a Y-axis marble base, a Y-axis linear guide rail, a Y-axis connecting plate and a Y-axis linear motor for controlling the movement of the Y-axis connecting plate, the Y-axis linear guide rail and the Y-axis linear motor are installed on the Y-axis marble base, the Y-axis connecting plate is arranged on the Y-axis linear guide rail, and the Y-axis linear motor is in driving connection with the Y-axis connecting plate so as to control the movement of the Y-axis connecting plate along the Y-axis linear guide rail; the base plate is arranged on the Y-axis connecting plate.
Further, the device for cutting the pi net plate by the laser imaging method is characterized in that the galvanometer is a full digital galvanometer.
The invention relates to a method for cutting a pi screen plate by a laser imaging method, wherein laser emitted by an ultraviolet ultrashort pulse laser is vertically emitted to a beam expander, the beam expanding magnification is 1 time, the laser is emitted to a spectroscope unit after being collimated, the beam expanding angle of a spectroscope I and a spectroscope II is adjusted, 1-3 levels of light spots after being split are arranged in a rectangular array, the overlapping rate of each light spot is more than 50 percent, a light spot group emitted from the spectroscope passes through the center of a light cover plate, an object to be imaged is formed in the center of the light cover plate, the position and the size of the light cover plate are adjusted, the position adjustment is vertical incidence of the center, the size adjustment is the size of the light spot to be imaged, and different imaging light; the light transmitted by the photomask plate is transmitted in the light path by the reflector group, the reflector group is adjusted to enable the light beam passing through the photomask plate to vertically enter the galvanometer, and the light beam is focused and imaged by the scanning field lens and projected onto a pi screen plate on the tooling carrying platform, so that the energy density of etching pi is achieved to etch the pi.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:
the invention adopts ultrashort pulse ultraviolet laser, utilizes a group of two spectroscopes to split and homogenize light, the laser is imaged on the surface of pi through a photomask plate to remove pi and an adhesive layer, the homogenization treatment is carried out on imaging facula, the taper of the cutting surface of pi is obviously reduced, and meanwhile, the invention is provided with a plurality of groups of imaging photomask plates with different sizes, so that the size of the processing facula can be selected, and the galvanometer scanning is combined with the linear motion combination mode of a platform to process materials, thereby obviously improving the processing precision and efficiency.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: the light path schematic diagram of the device of the invention;
FIG. 2: the position distribution schematic diagram of the uniform light spots of the spectroscope I and the spectroscope II of the spectroscope unit is shown;
FIG. 3: the light intensity distribution schematic diagram of the uniform light spots of the spectroscope I and the spectroscope II of the spectroscope unit;
FIG. 4: the light intensity of the light spot after being homogenized is schematically shown at the rear of the light shield plate;
FIG. 5: the imaging principle is schematically shown.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
The invention adopts a dodging imaging method, and uses a method combining platform movement and galvanometer scanning, so that the taper can be obviously reduced, and the processing precision and efficiency are improved.
As shown in fig. 1, the device for cutting a pi net plate by a laser imaging method includes a tooling carrier 100 for holding the net plate and an ultraviolet ultrashort pulse laser 10, wherein the ultraviolet ultrashort pulse laser 10 is an ultraviolet ultrashort pulse laser with a wavelength of 355nm, a pulse width of 1 ns-30 ns, a frequency of 150-500 KHZ, and a sub-pulse number of 5, a beam expander 20, a beam splitter unit 30, a mask plate 40, and a reflector group are sequentially arranged on an output light path of the ultraviolet ultrashort pulse laser 10, the beam expander 20 is a beam expander with a beam expanding magnification of 1 time, and the beam splitter unit 30 includes two beam splitters which are arranged perpendicularly to each other in a beam splitting direction; the reflector group comprises a first reflector 50, a second reflector 51, a third reflector 52 and a fourth reflector 53 which are sequentially arranged, and light is sequentially reflected and transmitted to the second reflector 51, the third reflector 52 and the fourth reflector 53 through the first reflector 50; the reflection light path of the reflector group is connected with the galvanometer 60, the galvanometer 60 is a full digital galvanometer, the output end of the galvanometer 60 is provided with a scanning field lens 70, the scanning field lens 70 is a scanning field lens with the focal length of 55 mm-70 mm, and the projection end of the scanning field lens 70 is aligned to the tooling carrier 100.
A vision lens 80 is mounted beside the galvanometer for determining and determining the imaging position.
The tooling carrying platform 100 comprises an X-axis conveying unit, a Y-axis conveying unit and a substrate, wherein the X-axis conveying unit comprises an X-axis marble base, an X-axis linear guide rail, an X-axis connecting plate and an X-axis linear motor for controlling the movement of the X-axis connecting plate; the Y-axis conveying unit comprises a Y-axis marble base, a Y-axis linear guide rail, a Y-axis connecting plate and a Y-axis linear motor for controlling the movement of the Y-axis connecting plate, the Y-axis linear guide rail and the Y-axis linear motor are installed on the Y-axis marble base, the Y-axis connecting plate is arranged on the Y-axis linear guide rail, and the Y-axis linear motor is in driving connection with the Y-axis connecting plate so as to control the movement of the Y-axis connecting plate along the Y-axis linear guide rail; the base plate is arranged on the Y-axis connecting plate; a pi net plate 90 is fixed to the substrate.
When the ultraviolet ultrashort pulse laser is used, laser emitted by an ultraviolet ultrashort pulse laser 10 is vertically incident to a beam expander 20, the beam expanding magnification is 1 time, the laser is incident to a spectroscope unit 30 after being collimated, the splitting angle of a spectroscope I and a spectroscope II is adjusted, 1-3-level light spots after being split are arranged in a rectangular array, the overlapping rate of each light spot is more than 50%, for example, the position distribution of the uniform light spots of the spectroscope I and the spectroscope II is shown in fig. 2, and for example, the light intensity distribution of the uniform light spots of the spectroscope I and the spectroscope II; the light spot group emitted from the spectroscope passes through the center of the light shield plate 40, an object to be imaged is formed at the center of the light shield plate, the position and the size of the light shield plate 40 are adjusted, the position adjustment is that the center vertically enters, the size adjustment is that the size of the light spot to be imaged, different imaging light spots are selected by switching different light shield plates, and the light intensity is shown at the rear of the light shield plate after the light spots are homogenized in the figure 4; the light transmitted by the photomask plate is transmitted in the optical path by the reflector group, the reflector group is adjusted to enable the light beam passing through the photomask plate to be vertically incident into the galvanometer 60, and the light beam is focused, imaged and projected onto a pi screen plate 90 on a tooling carrying table 100 through a scanning field lens 70, as shown in fig. 5, the screen plate is horizontally upward, and the energy density of etching pi is achieved to etch pi. Because the imaging light spots are subjected to dodging treatment, the taper of the cutting surface of the pi is obviously reduced; meanwhile, the device is provided with a plurality of groups of imaging light cover plates with different sizes, so that the size of the processing light spot can be selected.
And adjusting the position of the Z axis, finding out the position of an imaging point through a field lens, and recording the coordinate of the Z axis.
And (4) carrying out material processing on the pi material in a mode of platform linear motion and galvanometer scanning at the position of an imaging point.
In summary, the invention adopts ultrashort pulse ultraviolet laser, utilizes a group of two spectroscopes to split and homogenize light, the laser is imaged on the pi surface through a photomask plate to remove pi and a glue layer, the light homogenization treatment is carried out on imaging light spots, the taper of the cutting surface of the pi is obviously reduced, and meanwhile, the invention is provided with a plurality of groups of imaging photomask plates with different sizes, so that the size of the processing light spots can be selected, and the material processing is carried out in a combined mode of galvanometer scanning and platform linear motion.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (9)
1. Device of laser imaging method cutting pi otter board, its characterized in that: contain frock microscope carrier (100) and the ultrashort pulse laser instrument of ultraviolet (10) that are used for the centre gripping otter board, beam expanding lens (20), spectroscope unit (30), light cover board (40) and speculum group have been arranged in proper order on the output light path of the ultrashort pulse laser instrument of ultraviolet (10), and the reflection light path of speculum group links up vibrating mirror (60), and scanning field mirror (70) are arranged to the output of vibrating mirror (60), and the projection end of scanning field mirror (70) is just to frock microscope carrier (100).
2. The apparatus for cutting pi net plate according to claim 1, wherein: the ultraviolet ultrashort pulse laser (10) is an ultraviolet ultrashort pulse laser with the wavelength of 355nm, the pulse width of 1 ns-30 ns, the frequency of 150-500 KHZ and the number of sub-pulses of 5.
3. The apparatus for cutting pi net plate according to claim 1, wherein: the beam splitter unit (30) includes two beam splitters arranged perpendicular to each other in a beam splitting direction.
4. The apparatus for cutting pi net plate according to claim 1, wherein: the beam expanding lens (20) is a beam expanding lens with the beam expanding multiplying power of 1 time.
5. The apparatus for cutting pi net plate according to claim 1, wherein: the reflector group comprises a first reflector, a second reflector, a third reflector and a fourth reflector which are sequentially arranged, and light is reflected and transmitted to the second reflector, the third reflector and the fourth reflector through the first reflector in sequence.
6. The apparatus for cutting pi net plate according to claim 1, wherein: the scanning field lens (70) is a scanning field lens with a focal length of 55 mm-70 mm.
7. The apparatus for cutting pi net plate according to claim 1, wherein: the tooling carrying platform (100) comprises an X-axis conveying unit, a Y-axis conveying unit and a substrate, wherein the X-axis conveying unit comprises an X-axis marble base, an X-axis linear guide rail, an X-axis connecting plate and an X-axis linear motor for controlling the X-axis connecting plate to move; the Y-axis conveying unit comprises a Y-axis marble base, a Y-axis linear guide rail, a Y-axis connecting plate and a Y-axis linear motor for controlling the movement of the Y-axis connecting plate, the Y-axis linear guide rail and the Y-axis linear motor are installed on the Y-axis marble base, the Y-axis connecting plate is arranged on the Y-axis linear guide rail, and the Y-axis linear motor is in driving connection with the Y-axis connecting plate so as to control the movement of the Y-axis connecting plate along the Y-axis linear guide rail; the base plate is arranged on the Y-axis connecting plate.
8. The apparatus for cutting pi net plate according to claim 1, wherein: the galvanometer (60) is a full digital galvanometer.
9. A method for cutting a pi net plate by using the device of claim 1, which is characterized in that: laser emitted by an ultraviolet ultrashort pulse laser (10) is vertically emitted to a beam expander (20), the beam expanding magnification is 1 time, the laser is emitted to a spectroscope unit (30) after being collimated, the beam splitting angle of a spectroscope I and a spectroscope II is adjusted, 1-3 levels of light spots after being split are arranged in a rectangular array, the overlapping rate of each light spot is more than 50%, a light spot group emitted from the spectroscope passes through the center of a light cover plate (40), an object to be imaged is formed at the center of the light cover plate, the position and the size of the light cover plate (40) are adjusted, and different imaging light spots are selected by switching different light cover plates; the light transmitted by the photomask plate is transmitted in the light path by the reflector group, the reflector group is adjusted to enable the light beam passing through the photomask plate to be vertically incident into the galvanometer (60), and the light beam is focused and imaged by the scanning field lens (70) and projected onto a pi screen plate (90) on a tooling carrying table (100), so that the energy density of etching pi is achieved to etch the pi.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010073511.1A CN111136389A (en) | 2020-01-22 | 2020-01-22 | Device and method for cutting pi screen plate by laser imaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010073511.1A CN111136389A (en) | 2020-01-22 | 2020-01-22 | Device and method for cutting pi screen plate by laser imaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111136389A true CN111136389A (en) | 2020-05-12 |
Family
ID=70526981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010073511.1A Pending CN111136389A (en) | 2020-01-22 | 2020-01-22 | Device and method for cutting pi screen plate by laser imaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111136389A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335251A (en) * | 2021-12-31 | 2022-04-12 | 成都中建材光电材料有限公司 | Laser scribing equipment, scribing method of thin-film photovoltaic chip and power generation building board |
| CN114473247A (en) * | 2022-03-18 | 2022-05-13 | 广东中科微精光子制造科技有限公司 | Laser cutting device and laser cutting method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751878A (en) * | 1993-08-23 | 1995-02-28 | Seiko Epson Corp | Excimer laser spectroscopic type laser homogenizer |
| CN1596172A (en) * | 2001-11-30 | 2005-03-16 | 松下电器产业株式会社 | Method of laser milling using constant tool path algorithm |
| CN103128450A (en) * | 2013-02-19 | 2013-06-05 | 深圳市海目星激光科技有限公司 | Ultraviolet laser processing device |
| CN109108485A (en) * | 2018-07-24 | 2019-01-01 | 西安交通大学 | A method of labyrinth alumina ceramic core is repaired using picosecond laser |
| CN110253136A (en) * | 2019-06-12 | 2019-09-20 | 光越科技(深圳)有限公司 | A kind of dodging device, light homogenizing equipment and even smooth method |
| CN110625271A (en) * | 2019-06-25 | 2019-12-31 | 苏州德龙激光股份有限公司 | Ultrafast laser PCB drilling equipment and method thereof |
| CN211840637U (en) * | 2020-01-22 | 2020-11-03 | 苏州德龙激光股份有限公司 | Device for cutting pi net plate by laser imaging method |
-
2020
- 2020-01-22 CN CN202010073511.1A patent/CN111136389A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0751878A (en) * | 1993-08-23 | 1995-02-28 | Seiko Epson Corp | Excimer laser spectroscopic type laser homogenizer |
| CN1596172A (en) * | 2001-11-30 | 2005-03-16 | 松下电器产业株式会社 | Method of laser milling using constant tool path algorithm |
| CN103128450A (en) * | 2013-02-19 | 2013-06-05 | 深圳市海目星激光科技有限公司 | Ultraviolet laser processing device |
| CN109108485A (en) * | 2018-07-24 | 2019-01-01 | 西安交通大学 | A method of labyrinth alumina ceramic core is repaired using picosecond laser |
| CN110253136A (en) * | 2019-06-12 | 2019-09-20 | 光越科技(深圳)有限公司 | A kind of dodging device, light homogenizing equipment and even smooth method |
| CN110625271A (en) * | 2019-06-25 | 2019-12-31 | 苏州德龙激光股份有限公司 | Ultrafast laser PCB drilling equipment and method thereof |
| CN211840637U (en) * | 2020-01-22 | 2020-11-03 | 苏州德龙激光股份有限公司 | Device for cutting pi net plate by laser imaging method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335251A (en) * | 2021-12-31 | 2022-04-12 | 成都中建材光电材料有限公司 | Laser scribing equipment, scribing method of thin-film photovoltaic chip and power generation building board |
| CN114473247A (en) * | 2022-03-18 | 2022-05-13 | 广东中科微精光子制造科技有限公司 | Laser cutting device and laser cutting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211840637U (en) | Device for cutting pi net plate by laser imaging method | |
| CN101431126B (en) | Novel apparatus used for film engraving and dotting of thin-film solar cell | |
| JP2663560B2 (en) | Laser processing equipment | |
| TW445189B (en) | Laser processing apparatus and method | |
| CN111136389A (en) | Device and method for cutting pi screen plate by laser imaging method | |
| CN113985707B (en) | Super-resolution laser direct writing device and method capable of controlling pulse stretching and time delay | |
| CN111215765B (en) | Processing method for processing precise photosensitive hole by ultraviolet laser and laser equipment | |
| CN109732223A (en) | The device of wafer cutting | |
| JP2019505850A (en) | Exposure system, exposure apparatus, and exposure method | |
| JP2012520768A (en) | Irradiating plates with multiple radiation sources in one piece | |
| CN112363322A (en) | Coaxial super-resolution focal spot array generating device for laser direct writing | |
| CN111007586A (en) | Preparation method of large-size nano periodic grating | |
| CN102717193B (en) | Device and method for manufacturing silicon solar cell electrode printing screen through laser | |
| JPH10258383A (en) | Linear laser beam optical system | |
| CN110993741A (en) | Multi-pulse homogenization laser solar cell processing method and equipment | |
| CN113284989A (en) | Micro LED chip stripping device, stripping machine and use method of stripping machine | |
| CN113146060A (en) | Laser processing device and method for rapidly etching large-format conductive film by multiple beams | |
| CN212858217U (en) | Laser cutting optical system integrating coaxial vision | |
| JP3305206B2 (en) | Laser processing equipment | |
| CN115319278A (en) | Wafer laser de-bonding system and method based on two-dimensional acousto-optic deflector | |
| CN212083832U (en) | Laser grooved optical system, laser and equipment with laser | |
| CN116038106A (en) | Laser multi-beam processing device and solar cell multi-beam processing method | |
| KR20100138312A (en) | Laser machining apparatus and method for manufacturing multi-layer substrate using the same | |
| CN219303607U (en) | Laser doping equipment | |
| CN216097032U (en) | Low-transmittance brittle material laser cutting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |