CN205342240U - Parallel rotatory beam group drilling system of rotation axes of symmetry - Google Patents

Parallel rotatory beam group drilling system of rotation axes of symmetry Download PDF

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Publication number
CN205342240U
CN205342240U CN201620134229.9U CN201620134229U CN205342240U CN 205342240 U CN205342240 U CN 205342240U CN 201620134229 U CN201620134229 U CN 201620134229U CN 205342240 U CN205342240 U CN 205342240U
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laser
laser beam
group
rotary
boring
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CN201620134229.9U
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Chinese (zh)
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张立国
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Wuhan Excel Science And Technology Ltd
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Wuhan Excel Science And Technology Ltd
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Abstract

The utility model discloses a parallel rotatory beam group drilling system of rotation axes of symmetry, include laser instrument group, the rotatory modulator group of laser beam, laser bundle combining device, galvanometer scanning flat field focus module, laser drill synchro control module and wait to process the work piece. Multi beam drilling laser beam is modulated and is carried on behind the laser beam combining through high -speed rotation, the rotary drilling laser beam group of output rotation axes of symmetry line space parallel (containing coaxially) or approximate parallel (containing approximate coaxially), through galvanometer scanning flat field focus module, form rotatory drilling laser focusing focus group on waiting to process the work piece, the rotatory orbit of each focal point of laser of focus inter block is concentric circles or approximate concentric circles, drilling laser focusing focus group processes from the same processing hole site that the processing work piece was treated to two dimensions of the time and space, improve laser drill efficiency at double, combine the scanning galvanometer to organize techniques such as carrying out the switching of high -speed position between kong yukong with the laser focusing focus, realize high -efficient high accuracy high quality laser drill.

Description

The rotary light beam group hole-drilling system that a kind of rotation axes of symmetry is parallel
Technical field
This utility model relates to laser drill processing technique field, is specifically related to the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry is parallel.
Background technology
Current laser drill, boring on a bore position, the raising of the speed being substantially the raising of pulse recurrence frequency from the viewpoint of LASER Light Source, laser beam shaping, light beam scanning is several, for the raising of the pulse recurrence frequency of LASER Light Source, rise to one megahertz or higher from tens KHz originally；Laser beam shaping is then attempted by more people, mainly the application of flat-top hot spot；Light beam scanning rises to electropical scanning, acousto-optic scanning, high-speed rotating scanning etc. from vibration mirror scanning, but electropical scanning and acousto-optic scanning change at the heat stability of device and face in the change of the scanning positional precision brought that some are difficult, high-speed rotating scanning can not solve the change of scan aperture.Anyway, it is in that a concrete micropore boring, above-mentioned thinking unanimously carries out around LASER Light Source, laser beam transformation, laser this thinking of light velocity rotation sweep, this is a kind of serial thinking model, being be confined to " bicycle road " to solve problem above, this utility model jumps out serial thinking model, have employed parallel thinking model, i.e. " multilane " thinking model, considers the high-velocity scanning problem solving the array micropore particularly array blind hole of different pore size from two spaces of the time and space.
Utility model content
Technical problem to be solved in the utility model is to provide the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry is parallel, it is possible to make up the deficiencies in the prior art.
The technical scheme that this utility model solves above-mentioned technical problem is as follows:
This utility model provides the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry is parallel, including laser array, laser beam Rotating Modulator group, laser bundling device, vibration mirror scanning f-theta module, laser drill synchronization control module and workpiece to be processed；
Described laser array, including at least one laser instrument, restraints above boring laser beam for launching two bundles or two；
Described laser beam Rotating Modulator group, including two or more laser beam Rotating Modulators, the corresponding a branch of boring laser beam of each laser beam Rotating Modulator, each described laser beam Rotating Modulator, for corresponding boring laser beam is carried out space modulation, obtain corresponding rotary drilling laser beam, and incident laser bundling device, wherein, the angle between optical axis and the rotation axes of symmetry of this rotary drilling laser beam of every a branch of rotary drilling laser beam more than 0 radian less than 20 milliradians；
Described laser bundling device, for carrying out closing bundle to incident multi beam rotary drilling laser beam, output rotary drilling laser beam group, wherein, closing space parallel (containing coaxial) or less parallel (containing approximate coaxial) between the multi beam rotary drilling laser beam optical axis Space Rotating axis of symmetry in the rotary drilling laser beam group after bundle, described less parallel (containing approximate coaxial) refers in described rotary drilling laser beam group that the space angle between the optical axis rotation axes of symmetry of each rotary drilling laser interfascicular is less than 1 milliradian；
Described vibration mirror scanning f-theta module, including scanning galvanometer and scanning f-theta mirror, vibration mirror scanning light beam group is exported after described rotary drilling laser beam group incidence scanning galvanometer, described vibration mirror scanning light beam group incidence scanning f-theta mirror, obtain rotary laser focused spot group, wherein, in described rotary laser focused spot group, the movement locus at each laser spot center is concentric circular or approximate concentric circular, described approximate concentric circular refers to that in rotary laser focused spot group, the center of circle dispersion of each laser spot central motion circular trace is less than 50 microns, described concentric circular or approximate concentrically ringed diameter are less than 300 microns；Described scanning galvanometer, between the difference processing position, hole of workpiece to be processed, switching at a high speed is carried out for controlling the switching at a high speed of vibration mirror scanning light beam group and then control rotary laser focused spot group, or, for rotary laser focused spot group being carried out assisted movement modulation one of workpiece to be processed processing position, hole；
Described laser drill synchronization control module, is used for controlling co-operating between described laser array, laser beam Rotating Modulator group and vibration mirror scanning f-theta module.
Wherein, described laser array, including at least one laser instrument, if a laser instrument, refer to that this laser beam output beam can beam splitting be multiple beam, can directly being controlled laser switch light by described laser drill synchronization control module, or adopt external modulation photoswitch to control the switch light of every light beam respectively, described external modulation photoswitch is also controlled by described laser drill synchronization control module.
The beneficial effects of the utility model are: multi beam boring laser beam is after high speed rotating is modulated and carried out laser conjunction bundle, the rotary drilling laser beam group of output rotation axes of symmetry space of lines parallel (containing coaxial) or less parallel (containing approximate coaxial), through vibration mirror scanning f-theta module, workpiece to be processed is formed the rotary laser focused spot group of rotation, in rotary laser focused spot group, each laser spot rotational trajectory is concentric circular or approximate concentric circular, the position, same processing hole of workpiece to be processed is processed by laser focusing focal group from two dimensions of the time and space, significantly improve laser drill efficiency, in conjunction with vibration mirror scanning, laser focusing focal group carried out between Kong Yukong the technology such as high speed position switching, realize high-efficiency high-accuracy high-quality laser group's hole drilling.
Parallel laser beam is through equal angular incidence f-theta mirror, when incident angle is in f-theta mirror incidence range with position, the focused spot space coincidence of all collimated laser beams, from another angle of optics, all collimated light beams can be regarded as one laser beam, through the certain only one of which of over-focusing back focus；Through equal angular incidence f-theta mirror, when incident angle is in f-theta mirror incidence range with position, the movement locus of the focused spot of the laser beam of all rotations axes of symmetry parallel (containing coaxial) or less parallel (containing approximate coaxial) is concentric circular or approximate concentric circular；Therefore, same hole (particularly blind hole) to be processed can be processed by all above-mentioned slewed laser beam groups, capillary processing speed is directly significantly improved from two aspects of the time and space, time referring to, same hole is processed by these boring laser beams simultaneously or successively, spatially refer to that these focusing focused spot rotational trajectories holing laser beams are concentric circular or approximate concentric circular, all within the scope of position, a hole, same hole is processed.This is utility model of the present utility model point.The combination of different Beam rotation modulation systems, embodies again the superiority that the more group hole blind hole except working (machining) efficiency is processed.
On the basis of technique scheme, this utility model can also do following improvement.
Further, described laser beam Rotating Modulator is that acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic reflecting mirror or galvanometer drive reflecting mirror or electric spindle motor to drive to rotate refraction prism optical element or any one or multiple tandem compound that galvanometer swings in refracting prisms optical element.
Described any one or multiple tandem compound refer to kind, for transmitted light beam beat modulation system or reflection light beam beat modulation system, form the light beam of rotation, at least needing the series connection of two elements, namely acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic reflecting mirror or galvanometer drive reflecting mirror or swing refracting prisms optical element and need at least two pieces series connection to use just can to realize Beam rotation.
Further, also including laser beam expander group, described laser beam expander group includes the laser beam expander of two or more than two, the corresponding laser beam expander of the every a branch of boring laser beam in described boring laser beam group；
When described laser beam Rotating Modulator is that acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic reflecting mirror or electric spindle motor drive and rotate refraction prism optical element or when any one or multiple tandem compound that galvanometer swings in refracting prisms optical element, described laser beam expander group, between described laser array and laser beam Rotating Modulator group, expands for the multi beam boring laser beam that laser array is launched；Or, described laser beam expander group is between laser rotary manipulator group and laser bundling device, for multi beam rotary drilling laser beam is expanded；Or, described laser beam expander group, between laser bundling device and described scanning f-theta module, expands for the rotary drilling laser beam group after involutory bundle；
When described laser beam Rotating Modulator is galvanometer driving reflecting mirror, described laser beam expander group is between laser rotary manipulator group and laser bundling device, for multi beam rotary drilling laser beam is expanded；Or, described laser beam expander group, between laser bundling device and described scanning f-theta module, expands for the rotary drilling laser beam group after involutory bundle.
It is interval that the described rotation full-shape angle further having the beneficial effect that laser beam Rotating Modulator group modulation boring laser beam is in galvanometer high frequency sweep, galvanometer is made to possess the highest round rate of scanning, through expanding the rotary oscillation angle compression of the laser beam expander that multiplying power is N times, the pivot angle that rotates of the slewed laser beam after expanding becomes N/mono-of beam expander incident beam rotation pivot angle, so, the high-velocity scanning galvanometer high frequency of macroscopic view comes and goes the microcosmic high-velocity scanning obtaining fine angle resolution after being scanned across described beam expander, rate of scanning can either be improved, obtain again fine angle scans resolution, it is very suitable for laser accurate micro Process.
Similar thought is after boring laser beam expands, galvanometer drives refracting prisms optical element scanning boring laser beam, owing to swinging refracting prisms optical element, the laser beam pendulum angle of transmission can be reduced to 1/10th of prism pendulum angle even one thousandths, so can so that galvanometer be operated in optimum scanning frequency range obtains fastest sweep frequency so that the macro scan processing of high-speed galvanometer becomes microcosmic scanning machining.The position of laser beam expander is different, also can change when boring laser beam optical axis is rotated full-shape design, because laser beam expander has anglec of rotation compression function, Beam rotation angle compression ratio is theoretically the multiplying power of beam expander.
Further, when described laser beam Rotating Modulator group is that electric spindle motor drives the parallel combination rotating refraction prism optical element and galvanometer driving reflecting mirror, or when described laser beam Rotating Modulator group is the parallel combination that electric spindle motor drives rotation refraction prism optical element and galvanometer driving refracting prisms optical element, described rotary laser focused spot group inner laser focus rotates in the concentric circular or approximate concentric circular tracks formed, the circular trace at center is driven rotation refraction prism optical element that lens bore laser beam is rotated by electric spindle motor and is formed, other circular trace is driven reflecting mirror that the boring laser beam rotation of reflection is formed by galvanometer or the boring laser beam of transmission is rotated and formed by galvanometer driving refracting prisms optical element.
Described further have the beneficial effect that in the concentric circular tracks that each laser focusing focussing movement in rotary laser focused spot group is formed, the curvature of central circular geometric locus is too big, galvanometer drives mirror fashion, namely tradition galvanometer motor drives the laser beam Rotating Modulator of galvanometer eyeglass mode cannot complete scanning at a high speed, even if galvanometer drives reflecting mirror low speed rotation modulation boring laser beam, there is also the fit procedure circular with polygon infinite approach, Beam rotation modulation efficiency is low, effect is also bad, therefore central circular geometric locus is avoided adopting vibration mirror scanning (galvanometer driving mirror fashion), and this central circular track is driven by electric spindle motor and rotates refraction prism optical element to lens bore laser beam rotation sweep, the circular trace curve smoothing obtained, thus, vibration mirror scanning external concentric Circular test, possesses flexible scan capability, multiple concentric Circular test can be scanned, and electric spindle motor drives and rotates refracting prisms scanning center concentric circular tracks, scanned geometric locus is smooth incomparably, this is the very perfect light beam scanning combination of one.
Further, laser refraction scan module is sealed between described laser bundling device and described vibration mirror scanning f-theta module, described laser refraction scan module, transparent prism optical element including two or more series connection, each transparent prism optical element is arranged on the galvanometer motor main shaft of correspondence, for swinging under the driving of galvanometer motor, to adjust the deviation angle variable quantity of the rotary drilling laser beam group after closing bundle, and under the control of described laser drill synchronization control module, rotary drilling laser beam group after involutory bundle carries out compound scan motion.
The described angle further having the beneficial effect that the electric machine main shaft swing installing optical element is same, the deflection angle of transmitted light beam is far smaller than the reflecting mirror deflection angle to reflection light beam by refracting prisms optical element, therefore laser refraction scan module is adopted, the precision of light beam beat compound motion can be improved greatly, described laser drill synchronization control module controls described laser refraction scan module and transmitted light beam carries out compound beat motion, solves original aperture and can not adjust problem continuously.
Further, also include heating and clean laser instrument；Before described heating and cleaning laser instrument are arranged at described laser bundling device, it is used for launching heating and cleaning laser beam；
Described heating and cleaning laser beam are when laser bundling device enters described vibration mirror scanning f-theta module, and the angle between the optical axis rotation axes of symmetry of its optical axis and arbitrary rotary drilling laser beam is less than 1 milliradian；Described heating obtains LASER HEATING after described vibration mirror scanning f-theta module focuses on cleaning laser beam and cleans hot spot, and wherein, the movement locus of described rotary laser focused spot group is in this LASER HEATING and cleans within the scope of hot spot；
When workpiece to be processed is scanned holing by described rotary laser focused spot group, scanning boring region is carried out LASER HEATING and the cleaning pretreatment of space-time synchronous by described LASER HEATING and cleaning laser facula before described rotary laser focused spot group goes out light or when going out light；Or, when described rotary laser focused spot group goes out light or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate clean.
Described further have the beneficial effect that described space-time synchronous, refer to when being holed in the position, concrete hole of workpiece to be processed, spatially, described LASER HEATING and cleaning hot spot and laser f-theta mirror and workpiece to be processed geo-stationary, described rotary laser focused spot group and workpiece to be processed relative motion, described rotary laser focused spot group is only limitted to hole with cleaning hot spot scope interscan in described LASER HEATING, and described LASER HEATING and cleaning hot spot are spatially comprise and involved relation with described focused spot group movement locus；In time, described boring slewed laser beam focused spot group and described LASER HEATING with clean hot spot and match and add man-hour, described two class Laser output sequential can be adjusted according to the needs of Drilling operation technique, when workpiece to be processed is scanned holing by described rotary laser focused spot group, scanning boring region can be carried out space-time synchronous laser pre-treated before described rotary laser focused spot group goes out light or when going out light with cleaning hot spot by described LASER HEATING, include but not limited to LASER HEATING or laser cleaning or laser roughening, can also when described rotary laser focused spot group goes out light or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate clean.Its benefit is, introduces space-time synchronous LASER HEATING and cleaning and laser roughening on the one hand in the intensive boring field of laser, improves the drilling efficiency of boring laser beam, also improve drilling quality；On the other hand, also not because of the relative motion man-hour of laser focusing system during introducing laser pre-treated and cleaning light beam and add laser drill with material to be processed, because described two bundle laser focuses are space-time synchronous at bore position, as long as described heating goes out light with cleaning laser, laser spot just covers the motion outline scope of described boring laser beam foucing, it is possible to carry out spatial synchronization laser cleaning in real time.
Described cleaning refers to laser cleaning, refers to employing heating and cleans laser beam irradiation surface of the work so that attachment generation flash evapn or the strippings such as the dirt on surface, granule, rust staining, material burr, thus reaching the technical process of Cress.The wherein laser cleaning in laser pre-treated process, advantageously reduces described scanning drilling beams and carries out the shielding to scanning boring laser beam of the following process plasma；While boring or boring terminate after laser cleaning, it is possible to directly reduce the ultrasonic waves for cleaning of subsequent handling or chemical cleaning procedure workload, even cancel follow-up matting, improve product quality, reduction product cost.
Described laser roughening, refers to that adopting heating and cleaning light beam to treat boring region carries out material surface texturing, is conducive to the material to be processed absorption to described scanning drilling beams, thus improves efficiency and the quality of follow-up Drilling operation.
Further, described laser bundling device is any one or the multiple combination in plane bundling device or cube bundling device or plane mirror.
Further, described laser drill synchronization control module can control simultaneously or selectivity controls the laser pulse shape parameter of the laser switch light sequential of each laser beam of holing in described boring laser beam group, the laser pulse repetition frequency of each laser beam of holing, the pulsed laser energy of each laser beam of holing, the laser pulse width of each laser beam of holing, each laser beam of holing, wherein, described laser switch light sequential refers to that each boring laser beam can go out light simultaneously, also light can successively be gone out, can open the light, it is possible to successively open the light simultaneously.
Further, described workpiece to be processed is formed by stacking by different types of thin material, described boring laser array launches the multi beam boring laser beam of different wave length, the order of the laser switch light of the multi beam boring laser beam of the different wave length of described laser drill synchronization control module keyhole laser array output so that the different material layer in the processing hole of workpiece to be processed is processed by the boring laser beam of different wave length.
The described system further having the beneficial effect that this utility model provides is a complication system, only each several part highly coordinates in sequential, spatially highly overlap, just can give play to powerful working ability, the realization of the technology of high-new point needs good technology platform, and described laser drill synchronization control module act as command centre role.
One typical example, multilayer circuit board, it is simply that have multiple layers of different materials to be formed by stacking, the material of different layers, the laser processing technology parameter difference taked is very big.
Further, under described laser drill synchronization control module controls, corresponding boring laser beam is carried out multipurpose rotary modulation by described laser beam Rotating Modulator, and boring laser beam corresponding in the process can change with different pulsed laser energies or different laser pulse widths or different laser pulse shapes or different pulse recurrence frequencies and light.
Described further have the beneficial effect that for the different material layer to be drilled in hole depth direction, it is possible to adopt different laser parameters to be processed, improve the specific aim of crudy and laser processing technology.
Accompanying drawing explanation
The four boring laser beams that Fig. 1 is this utility model embodiment 1 close bundle hole-drilling system structural representation；
The four boring laser beams that Fig. 2 is this utility model embodiment 2 close bundle hole-drilling system structural representation；
The two boring laser beams that Fig. 3 is this utility model embodiment 3 close bundle hole-drilling system schematic diagram；
Double; two hollow electric spindle parallel connection rotary laser dual-beams that Fig. 4 is this utility model embodiment 4 close bundle hole-drilling system schematic diagram；
Fig. 5 is that this utility model embodiment 5 hollow electric spindle compresses galvanometer rotary laser dual-beam in parallel conjunction bundle hole-drilling system schematic diagram with pivot angle；
The double; two galvanometer parallel connection rotary laser dual-beam of pivot angle compression that Fig. 6 is this utility model embodiment 6 closes bundle hole-drilling system schematic diagram；
Fig. 7 is the rotary drilling laser focusing focal group schematic diagram that four boring laser beams ultimately form；
Fig. 8 is the rotary drilling laser focusing focal group schematic diagram that two boring laser beams ultimately form.
In accompanying drawing, the list of parts representated by each label is as follows:
1, laser array, 11, P polarization end laser array, 111, the first laser instrument, the 112, second laser, 113, first boring laser beam, 114, the second boring laser beam, 12, S-polarization end laser array, the 121, the 3rd laser instrument, the 122, the 4th laser instrument, 123, the 3rd boring laser beam, the 124, the 4th boring laser beam；2, laser beam expander group, 21, P polarization end laser beam expander group, 211, the first laser beam expander, the 212, second laser beam expander, 213, first expands laser beam, 214, second laser beam is expanded, 22, S-polarization end laser beam expander group, the 221, the 3rd laser beam expander, the 222, the 4th laser beam expander, 223, the 3rd expanding laser beam, the 224, the 4th expands laser beam；3, laser beam rotation modulation group, 31, P polarization end laser beam Rotating Modulator group, 311, the first laser beam Rotating Modulator, the 312, second laser beam Rotating Modulator, the 313, first rotary drilling laser beam, 314, the second rotary drilling laser beam, 32, S-polarization end laser beam Rotating Modulator group, the 321, the 3rd laser beam Rotating Modulator, the 322, the 4th laser beam Rotating Modulator, 323, the 3rd rotary drilling laser beam, the 324, the 4th rotary drilling laser beam；4, laser bundling device, 41, P polarization end laser bundling device, 411, first reflection light combination mirror, 412, light beams is closed in first reflection, 413, first swashs combiner element, 414, P polarization end laser catcher, 415, P polarization end swashs combiner incident beam, 42, S-polarization end laser bundling device, 421, second reflection light combination mirror, 422, light beams is closed in second reflection, 423, second swashs combiner element, 424, S-polarization end laser catcher, 425, S-polarization end swashs combiner incident beam, 426, 3rd reflection light combination mirror, 43, polarization laser closes bundle element, 44, rotary drilling laser beam group；5, laser refraction scan module, 501, first refractive optical prism, the 502, second refractive optics prism, 503, refraction scan module the second electric machine main shaft, 504, refraction scan module the second motor, 505, compound motion rotary drilling laser beam group；6, vibration mirror scanning f-theta module, 601, scanning galvanometer the second electric machine main shaft, 602, scanning galvanometer the second reflecting mirror, 603, scanning galvanometer first reflects light beam, 604, scanning galvanometer the first motor, 605, scanning galvanometer the first electric machine main shaft, 606, scanning galvanometer the first reflecting mirror；7, vibration mirror scanning light beam group, 8, the scanning focused mirror of flat field, 9, f-theta drilling beams group, 10, workpiece to be processed；200, heating with clean laser beam, 201, heating with clean laser instrument, 202, the optical axis heating parallel with boring laser beam rotation axes of symmetry with clean laser beam, 203, the heating that exports of vibration mirror scanning and cleaning laser beam；81, hole Fourth Ring, 82, boring the 3rd ring, 83, the second ring of holing, 84, the first ring of holing.
Detailed description of the invention
Below in conjunction with accompanying drawing, principle of the present utility model and feature being described, example is served only for explaining this utility model, is not intended to limit scope of the present utility model.
Embodiment 1, four laser beam closes bundle hole-drilling system.It is described in detail below in conjunction with Fig. 1 and Fig. 7 system that the present embodiment is provided.
Fig. 1 is that four laser beams close bundle hole-drilling system schematic diagram, as it is shown in figure 1, the system that the present embodiment provides includes laser array 1, laser beam expander group 2, laser beam Rotating Modulator group 3, laser bundling device 4, vibration mirror scanning f-theta module 6 and workpiece to be processed 10 and laser drill synchronization control module (not indicating in figure).
Described laser array 1 comprises P polarization end laser array 11 and S-polarization end laser array 12, described P polarization end laser array 11 comprises the first boring laser beam 113 and the second boring laser beam 114, and described S-polarization end laser array 12 comprises the 3rd boring laser beam 123 and the 4th boring laser beam 124.
Respectively holing the parameters such as the optical maser wavelength of laser beam, laser pulse repetition frequency, pulsewidth, pulse energy, beam quality factor in described boring laser beam group can be identical, it is also possible to different.
Described laser beam expander group 2 comprises P polarization end laser beam expander group 21 and S-polarization end laser beam expander group 22, described P polarization end laser beam expander group 21 comprises the first laser beam expander 211 and the second laser beam expander 212, described first boring laser beam 113 expands output first through the first laser beam expander 211 and expands laser beam 213, and described second boring laser beam 114 expands output second through the second laser beam expander 212 and expands laser beam 214；Described S-polarization end laser beam expander group 22 comprises the 3rd laser beam expander 221 and the 4th laser beam expander 222, described 3rd boring laser beam 123 expands output the 3rd through the 3rd laser beam expander 221 and expands laser beam 223, and described 4th boring laser beam 124 expands output the 4th through the 4th laser beam expander 222 and expands laser beam 224.
Described laser beam Rotating Modulator group 3 comprises P polarization end laser beam rotation modulation group 31 and S-polarization end laser beam rotation modulation group 32, described P polarization end laser beam rotation modulation group 31 comprises the first laser beam Rotating Modulator 311 and the second laser beam Rotating Modulator 312, described first expands laser beam 213 through described first laser beam Rotating Modulator 311 rotation modulation, export the first rotary drilling laser beam 313, described second expands laser beam 214 through described second laser beam Rotating Modulator 312 rotation modulation, exports the second rotary drilling laser beam 314；Described S-polarization end laser beam rotation modulation group 32 comprises the 3rd laser beam Rotating Modulator 321 and the 4th laser beam Rotating Modulator 322, described 3rd expands laser beam 223 through described 3rd laser beam Rotating Modulator 321 rotation modulation, export the 3rd rotary drilling laser beam 323, described 4th expands laser beam 224 through described 4th laser beam Rotating Modulator 322 rotation modulation, exports the 4th rotary drilling laser beam 324.
Described laser beam Rotating Modulator can be acousto-optic deflection device, it can also be electro-optic deflector, can also be that Piezoelectric Ceramic reflecting mirror or galvanometer drive reflecting mirror or refracting prisms optical element, can also for hollow electric spindle motor drive rotate refraction optical element, or be aforementioned this several in any two or more combine.
Such as, when laser beam Rotating Modulator is acousto-optic deflection device, acousto-optic deflection device regulates the Bragg grating reflection angle of described incident laser by changing the carrier frequency of the drive source of acousto-optic deflection device, change incident laser transmission direction, at least two acousto-optic deflection device be together in series can realize laser beam rotary motion modulation；When laser beam Rotating Modulator is electro-optic deflector, electro-optic deflector utilizes the characteristic that electro-optic crystal refractive index changes with voltage, applied voltage is applied along being perpendicular to electro-optical deflection crystal growth direction, electro-optical deflection crystal is made to form graded index Gradient distribution along the direction of growth, and then make electro-optical deflection crystals light wave equiphase surface deflect, and the deflection of beam direction is realized at its outfan, then changing applied voltage continuously and will change the deflection angle of light beam continuously, at least two electro-optic deflector is together in series the rotary motion modulation that can realize laser beam；When laser beam Rotating Modulator is hollow electric spindle motor driving rotation refraction optical element, the rotor of described hollow electric spindle motor includes axially hollow hollow electric spindle and the electromagnetic induction coil being centered around in described hollow electric spindle, is provided with and carries out the coil of electromagnetic induction effect with electromagnetic induction coil in described hollow electric spindle in described hollow electric spindle motor stator；The axial direction of described hollow electric spindle is provided with refracting prisms optical element, described refracting prisms optical element is fixing with described hollow electric spindle to be connected, and rotate with hollow electric spindle, the refracting prisms optical element of rotation is for rotating modulation to the light beam of transmission hollow electric spindle and refracting prisms optical element.Described hollow electric spindle motor is air supporting hollow electric spindle motor or hydraulic pressure hollow electric spindle motor or magnetic floating electrocardio spindle motor or ceramic bearing hollow electric spindle motor.When the hollow electric spindle of described hollow electric spindle motor is arranged on air-bearing, this hollow electric spindle motor is also referred to as air supporting hollow electric spindle motor.Described air-bearing refers to and realizes, by importing pressure air in bearing bore, the bearing that hollow electric spindle suspends in atmosphere.When the hollow electric spindle of described hollow electric spindle motor is arranged on Hydrodynamic and-static Bearing, this hollow electric spindle motor is also referred to as hydraulic pressure hollow electric spindle motor.Described Hydrodynamic and-static Bearing refers to that a kind of foundation by being externally supplied constant pressure oil, in bearing makes electro spindle bearing of the oil film of suspension high voltage static pressure carrying all the time from start to stopping.When the hollow electric spindle of described hollow electric spindle motor is arranged on electromagnetic suspension bearing, this hollow electric spindle motor is also referred to as magnetic floating electrocardio spindle motor.Described electromagnetic suspension bearing is a kind of to utilize electromagnetic force that electro spindle is suspended in space to realize the bearing of contactless supporting.When the hollow electric spindle of described hollow electric spindle motor is arranged on ceramic bearing, this hollow electric spindle motor is also referred to as ceramic bearing hollow electric spindle motor.Described ceramic bearing refers to that the rolling element of bearing uses Ceramic Balls, and bearing ring is still the bearing of steel ring.
Described laser bundling device 4 comprises P polarization end laser bundling device 41 and S-polarization end laser bundling device 42 and polarization laser closes bundle element 43, and the polarization laser in the present embodiment closes bundle element 43 and is based on the polarization coupling sheet of optical thin film.Described P polarization end laser bundling device 41 comprises the first reflection light combination mirror 411 and first and swashs combiner element 413 and P polarization end laser catcher 414, described first rotary drilling laser beam 313 reflects light combination mirror 411 plane reflection through described first, obtain the first reflection and close light beams 412, described first reflection is closed the 50% of light beams 412 mean power and is transmitted through the first sharp combiner element 413, become P polarization end and swash a part for combiner incident beam 415, the 50% of described first reflection conjunction light beams 412 mean power reflexes to P polarization end laser catcher 414 through the first sharp combiner element 413 and collects, described second rotary drilling laser beam 314, 50% is transmitted through the first sharp combiner element 413 output collects to P polarization end laser catcher 414, and 50% swashs combiner element 413 through first is reflected as a part for the sharp combiner incident beam 415 of P polarization end；Described S-polarization end swashs combiner submodule 42 and comprises the second reflection light combination mirror 421 and the second sharp combiner element 423 and S-polarization end laser catcher 424, described 3rd rotary drilling laser beam 323 reflects light combination mirror 421 plane reflection output the second reflection through described second and closes light beams 422, described second reflection is closed the 50% of light beams 422 mean power and is transmitted through the second sharp combiner element 424, become S-polarization end and swash a part for combiner incident beam 425, the 50% of described second reflection conjunction light beams 422 mean power reflexes to S-polarization end laser catcher 424 and collects, described 4th rotary drilling laser beam 324, mean power 50% is transmitted through the second sharp combiner element 423 output and collects to S-polarization end laser catcher 424, and the 50% of mean power swashs combiner element 423 through second is reflected as a part for the sharp combiner incident beam 425 of S-polarization end.Described P polarization end laser catcher 414 and S-polarization end laser catcher 424 are for collecting no laser.
Described P polarization end swashs combiner incident beam 415 and exports the parallel or approximately parallel rotary drilling laser beam group 44 of rotation axes of symmetry with the sharp combiner incident beam 425 of S-polarization end through polarization laser conjunction bundle element 43.
It is polarization beam combiner that polarization laser in the present embodiment closes bundle element 43, polarization beam combiner at least can adopt following three kinds of technical schemes, the first technical scheme is that polarization beam apparatus (PBS=polarizingbeamsplitter) uses in turn, described polarization beam apparatus enables to a polarization state light reflection, another polarizing beam transmission, when carrying out two kinds of polarizing beam and closing bundle, a kind of polarizing beam P polarization light with and another kind of polarizing beam S-polarization light input from the corresponding outfan of polarization beam apparatus respectively, so polarization beam apparatus input can export P polarization light and the laser beam of S-polarization combiner；The second technical scheme is to adopt film polarizer (ThinFilmPolarizer), it is also possible that a polarization state light reflection, another polarizing beam transmission, when carrying out two kinds of polarizing beam and closing bundle, a kind of polarizing beam transmission, such as P polarization light transmission film polarizer, another kind of polarizing beam, such as S-polarization light exports the position input of P polarization light beam from film polarizer, so film polarizer can to this S-polarization light total reflection, such film polarizer outfan can export P polarization light and the laser beam of S-polarization combiner, the advantage of this scheme is that laser beam closes bundle efficiency height, volume is little；The third technical scheme is a kind of special circumstances, Brewster sheet is adopted to carry out closing bundle, when carrying out two kinds of polarizing beam and closing bundle, a kind of polarizing beam transmission, such as P polarization light transmission Brewster sheet, another kind of polarizing beam, such as S-polarization light exports the position input of P polarization light beam from Brewster sheet, so film polarizer can be partially reflective to this S-polarization light, such film polarizer outfan can export P polarization light and the laser beam of S-polarization combiner, the advantage of this scheme is that the laser beam that can complete phase co-wavelength or different wave length carries out closing bundle.
Scanning galvanometer the first reflecting mirror 606 from the incident vibration mirror scanning f-theta module 6 of the parallel or approximately parallel rotary drilling laser beam group 44 of rotation axes of symmetry of described laser bundling device module 4 output, outgoing scanning galvanometer first reflects light beam 603, described scanning galvanometer first reflects incident scanning galvanometer the second reflecting mirror 602 of light beam 603, exports vibration mirror scanning light beam group 7.Described scanning galvanometer the first reflecting mirror 606 is fixed on scanning galvanometer first electric machine main shaft 605 of scanning galvanometer the first motor 604, described scanning galvanometer the second reflecting mirror 602 is fixed on scanning galvanometer the second electric machine main shaft 601, described scanning galvanometer the first electric machine main shaft 605 and the space crossed placement of scanning galvanometer the second electric machine main shaft 601.
As previously mentioned, the internal each boring laser beam of rotary drilling laser beam group 44 is rotation status, and Beam rotation axis of symmetry parallel (containing coaxial) between each boring slewed laser beam or less parallel (containing approximate coaxial), described less parallel (containing approximate coaxial) refers to that the space angle between the optical axis Space Rotating axis of symmetry of described rotary motion boring laser beam is less than 1 milliradian.
As it was previously stated, each laser drill laser beam is rotation status in described vibration mirror scanning light beam group 7, and Beam rotation axis of symmetry parallel (containing coaxial) between each rotary drilling laser beam or less parallel (containing approximate coaxial).
Described vibration mirror scanning light beam group 7 focuses on through f-theta mirror 8, output f-theta drilling beams group 9, f-theta drilling beams group 9 is focused to boring laser beam laser focusing focal group (not indicating in figure) on workpiece to be processed 10, the laser spot of all of boring laser focusing focal group is all used for processing position, unified hole, and movement locus is concentric circular or approximate concentric circular, described approximate concentric circular refers to that the center of circle dispersion of each rotary drilling laser beam focus focus center motion circular trace is less than 50 microns, described concentric circular or approximate concentrically ringed diameter are less than 300 microns.Each laser spot spot size of described boring laser focusing focal group can be identical, it is also possible to different；The diameter of the motion circular trace at each laser spot center of described boring laser focusing focal group can be identical, it is possible to different.When described fraction of laser light focussing movement circular trace diameter is identical or close to time, the workpiece to be processed that different materials superposition is formed by different optical maser wavelength is adopted to hole more for advantage, now different wavelength laser focuses can successively be used for processing the material of different levels, play various wavelength to certain material more for the advantage of working ability, improve processing quality and efficiency.When described laser spot motion circular trace diameter difference, laser spot spot size is taken into account, all laser spot movement locus form donut or approximate donut, process blind hole or through hole so that the form of great circle ring set small circle ring is disposable, greatly improve blind hole penetration rate.
In the present embodiment, the common parameters of the multi beam boring laser beam that all laser instrument in described laser array are launched is: optical maser wavelength 355 nanometers, beam quality factor is less than 1.1, hot spot circularity is more than 90 percent, single mode gauss laser (horizontal field intensity is Gauss distribution), range of pulse repetition frequency 20 to 100 KHz.Wherein different laser parameters, mean power: 1 watt of 20 KHz.Mean power: 2 watt of 40 KHz.Mean power: 3 watt of 60 KHz.Mean power: 4 watt of 80 KHz.
In the present embodiment, the multiplying power that expands of described first laser beam expander the 211, second laser beam expander the 212, the 3rd laser beam expander the 221, the 4th laser beam expander 222 is 10 times.In the present embodiment, the beam diameter of first boring laser beam the 113, second boring laser beam the 114, the 3rd boring laser beam 123 and the 4th boring laser beam 124 is 0.7mm, after expanding, first expand laser beam 213, second expand laser beam the 214, the 3rd to expand laser beam the 223, the 4th beam diameter expanding laser beam 224 be 7 millimeters.
In the present embodiment, first laser beam Rotating Modulator 311, second laser beam Rotating Modulator 312, 3rd laser beam Rotating Modulator 321, 4th laser beam Rotating Modulator 322 all adopts 180,000 revs/min of air-floating main shaft Beam rotation modes, wherein, it is 0.2 milliradian that the beam optical axis of the first rotary drilling laser beam 313 rotates full-shape, it is 0.6 milliradian that second rotary drilling laser beam 314 beam optical axis rotates full-shape, it is 1 milliradian that 3rd rotary drilling laser beam 323 beam optical axis rotates full-shape, it is 1.4 milliradians that 4th rotary drilling laser beam 324 beam optical axis rotates full-shape.The design of these beam optical axis rotation full-shape considers laser gathering spot diameter size, and (the present embodiment is according to all laser focusing spot diameter 20 lim design, it is of course possible to consideration practical situation, can first design different focal beam spot sizes, such beam optical axis rotates the design of full-shape and needs to change accordingly design), and degree of overlapping between different laser beam laser spot circle annulus processing cross section (the present embodiment according between annulus just Overlap design).
In the present embodiment, first swashs combiner element 413 it is required that the polarization state that P polarization end swashs combiner incident beam 415 is P polarization, second swashs combiner element 423 it is required that the polarization state that S-polarization end swashs combiner incident beam 425 is S-polarization, P polarization end swashs combiner incident beam 415 and S-polarization end and swashs combiner incident beam 425 and close bundle element 43 through polarization laser and close bundle output, and the rotation axes of symmetry parallel (containing coaxial) of the parallel all light beams of rotary drilling laser beam group 44 of rotation axes of symmetry or less parallel (containing approximate coaxial).Actually, the all sharp combiner elements of the present embodiment are all that (such as first swashs combiner element 413 and second swashs combiner element 423 for anticaustic (such as polarization laser closes bundle element 43) of corresponding laser beam splitter element or partly utilization, in order to close bundle, every Shu Jiguang loses 50% mean power).
In the present embodiment, the scanning galvanometer in described vibration mirror scanning f-theta module 6 adopts the ultraviolet digital scan galvanometer of 15 millimeters, entrance hole diameter.
In the present embodiment, scanning f-theta mirror 8 adopts telecentric scanning focus lamp, the focal length of telecentric scanning focus lamp to be 100 millimeters, f-theta scope 50 millimeters × 50 millimeters, eyeglass anti-reflection film wavelength 355 nanometers.In the present embodiment, described workpiece to be processed 10 is 100 micron thickness double-side flexible printed circuit boards, and wherein two-layer layers of copper is 15 micron thickness copper, has the insulating barriers such as polyimides between two-layer copper.Described f-theta drilling beams group 9 is focused into four focal beam spots on workpiece to be processed surface, and the diameter of each focal beam spot is 20 microns, and depth of focus is 200 microns.
The present embodiment workflow is as follows:
Described laser drill synchronization control module notice or control first laser beam Rotating Modulator the 311, second laser beam Rotating Modulator the 312, the 3rd laser beam Rotating Modulator the 321, the 4th laser beam Rotating Modulator 322 are in running order, such as 180,000 revs/min, namely 3000 revolutions per seconds；Workpiece to be processed 10 is in correct locus, and namely workpiece to be processed location is complete, and is in the focal plane of f theta lenses 8；Described laser drill synchronization control module (does not have to indicate) scanning galvanometer the first reflecting mirror 606 controlling vibration mirror scanning f-theta module 6 in figure and scanning galvanometer the second reflecting mirror 602 is in and determines position so that laser focusing focal group (does not indicate in figure) and is in position hole to be drilled.
Described laser drill synchronization control module (does not have to indicate) control vibration mirror scanning f-theta module 6 and positions each laser beam in the complete laser beam group of keyhole immediately and go out light simultaneously in figure, now the beam optical axis of the first rotary drilling laser beam 313 rotates full-shape is 0.2 milliradian, its focus center is at the circle that position, hole hole to be drilled movement locus is 20 micron diameters, consider the size of laser focusing hot spot 20 microns, its focussing movement cross section is diameter 40 lim solid circle, asking for an interview region indicated by 84 in Fig. 7, hatched parts is focussing movement section of outline；Second rotary drilling laser beam 314 beam optical axis rotates full-shape simultaneously is 0.6 milliradian, its focus center is at the circle that position, hole hole to be drilled movement locus is 60 micron diameters, consider the size of laser focusing hot spot 20 microns, its focussing movement cross section is the annulus of internal diameter 40 microns outer diameter 80 microns, just entangle 40 lim solid circles of light beam 313 correspondence, asking for an interview region indicated by 83 in Fig. 7, hatched parts is focussing movement section of outline；3rd rotary drilling laser beam 323 beam optical axis rotates full-shape simultaneously is 1 milliradian, its focus center is at the circle that position, hole hole to be drilled movement locus is 100 micron diameters, consider the size of laser focusing hot spot 20 microns, its focussing movement cross section is 120 microns of annulus of internal diameter 80 microns outer diameter, just entangle the annulus of the corresponding focussing movement profile of light beam 314, asking for an interview region indicated by 82 in Fig. 7, hatched parts is focussing movement section of outline；4th rotary drilling laser beam 324 beam optical axis rotates full-shape simultaneously is 1.4 milliradians, its focus center is at the circle that position, hole hole to be drilled movement locus is 140 micron diameters, consider the size of laser focusing hot spot 20 microns, its focussing movement cross section is 160 microns of annulus of internal diameter 120 microns outer diameter, just entangle the annulus of the corresponding focussing movement profile of light beam 323, asking for an interview region indicated by 81 in Fig. 7, hatched parts is focussing movement section of outline；It is 334 microseconds that all boring laser instrument go out the light time, and all boring laser instrument one trip out light and complete the drill tasks of 160 microns of blind holes of diameter during this period of time.In boring procedure, pulse recurrence frequency 20 KHz, pulse recurrence frequency 40 KHz, pulse recurrence frequency 60 KHz, pulse recurrence frequency 80 KHz.
Once the boring of position, hole is complete, described laser drill synchronization control module (does not indicate in figure) and controls laser array 1 stopping transmitting boring laser beam immediately, and control vibration mirror scanning f-theta module 6 next position, hole to be processed is positioned, repeat above procedure.
If having only to bore 40 microns of blind holes, described laser drill synchronization control module only controls to open the light, and other laser beams are in lock light state；If needing to bore 80 microns of blind holes, described laser drill synchronization control module controls the first boring laser beam and the second boring laser beam opens the light, and other boring laser beams are in lock light state；If needing to bore 120 microns of blind holes, described laser drill synchronization control module controls the first boring laser beam, the second boring laser beam and the 3rd boring laser beam, and other boring laser beams are in lock light state；If needing to bore 120 microns of through holes, described laser drill synchronization control module controls the 3rd boring laser beam and opens the light, and other boring laser beams are in lock light state；If needing to bore 160 microns of through holes, described laser drill synchronization control module controls the 4th boring laser beam and opens the light, and other boring laser beams are in lock light state.In sum, the present embodiment scheme may be used for blind hole and the through hole boring in discrete aperture.
Actually, the beam modulation rotating speed of first laser beam Rotating Modulator the 311, second laser beam Rotating Modulator the 312, the 3rd laser beam Rotating Modulator the 321, the 4th laser beam Rotating Modulator 322 can be different, so corresponding boring laser beam pulses repetition rate can also be different, the switch light time length of corresponding boring laser beam has the sequencing can be different, and these are all controlled by described laser drill synchronization control module.
Actually, described laser array 1 can only comprise P polarization end laser array 11, can also only comprise S-polarization end laser array 12, corresponding, described laser beam expander group 2 can only comprise P polarization end laser beam expander group 21, can also only comprise S-polarization end laser beam expander group 22, corresponding, described laser beam Rotating Modulator group 3 can only comprise P polarization end laser beam Rotating Modulator group 31, can also only comprise S-polarization end laser beam rotation modulation group 32, corresponding, described laser bundling device 4 can only comprise P polarization end laser bundling device 41, can also only comprise S-polarization end laser bundling device 42.
Actually, when described laser beam Rotating Modulator be acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic reflecting mirror or electric spindle motor drive the combination rotating refraction prism optical element or wherein arbitrarily both or many persons time, described laser beam expander group may be located between boring laser beam group and laser beam rotation modulation group, can also between laser beam rotation modulation group and laser bundling device module, it is also possible between laser bundling device module and described vibration mirror scanning f-theta module；
Actually, when described laser beam Rotating Modulator be galvanometer drive reflecting mirror or galvanometer swing refracting prisms optical element or both combine time, described laser beam expander group is between laser beam rotation modulation group and laser bundling device module, it is also possible between laser bundling device module and described vibration mirror scanning f-theta module.
The position of laser beam expander is different, and boring laser beam optical axis can change when rotating full-shape design, because beam expander is by anglec of rotation compression function.
Actually, the above-mentioned collimated light beam time and space synchronizes position, same hole is processed, greatly improve capillary processing speed, it is the revolutionary raising in technical scheme for blind holes of circuit board is holed, and blind holes of circuit board boring aperture size is also discrete design, and the present embodiment scheme is just for the blind hole in discrete aperture and through hole boring.
Embodiment 2, four boring laser beam closes bundle hole-drilling system.It is described below in conjunction with Fig. 2 hole-drilling system that the present embodiment is provided.
May refer to previous embodiment 1, the present embodiment adds laser refraction scan module 5 on the basis of embodiment 1, through hole and blind hole processing due to some field in practice, need aperture consecutive variations within the specific limits, in order to solve this situation, as shown in Figure 2, in order to increase high speed fine adjustment boring aperture function, add laser refraction scan module 5, described laser refraction scan module 5 is between laser bundling device 4 and vibration mirror scanning f-theta module 6, refraction scan module the second electric machine main shaft 503 couples with refraction scan module the second motor 504, second refractive optics prism 502 is arranged on 603, first refractive optical prism 501 is installed on the first electric machine main shaft (not indicating in figure), first electric machine main shaft (does not indicate) space crossed with the second electric machine main shaft 503 in figure.Incident second refractive optics prism 502 after the incident first refractive optical prism 501 of rotation axes of symmetry horizontal bore laser beam group 44, output compound motion boring laser beam group 505, the incident vibration mirror scanning f-theta module 6 of described compound motion boring laser beam group 505.All Beam rotation axis of symmetry parallel (containing coaxial) or less parallel (containing approximate coaxial) in described compound motion boring laser beam group 505.Described first electric machine main shaft and the second electric machine main shaft 503 swing same angle, the deflection angle of transmitted light beam is far smaller than the reflecting mirror deflection angle to reflection light beam by refracting prisms optical element, therefore Fig. 2 of the present embodiment introduces laser refraction scan module 5, it is possible to improve the precision of light beam beat compound motion greatly.When institute's hole diameter is not at discrete aperture designed in embodiment 1, described laser drill synchronization control module controls laser refraction scan module 5 and transmitted light beam carries out compound beat motion, solves original aperture and can not adjust problem continuously.
Embodiment 3, two boring laser beam closes hole-drilling system.Illustrate below in conjunction with Fig. 3 system that the present embodiment is provided.
The present embodiment is the mutation of embodiment 1, laser array 1 remains S-polarization end laser array 12, accordingly, laser beam expander group 2 remains S-polarization end laser beam expander group 22, laser beam Rotating Modulator group 3 retains S-polarization end laser beam rotation modulation group 32, laser bundling device 4 remains S-polarization end laser bundling device 42, adds the 3rd reflection light combination mirror 426.Heating is heated with cleaning laser instrument 201 output and cleans laser beam 200, and reflect light combination mirror 426 reflection conjunction bundle through the 3rd, output optical axis and the boring parallel heating of laser beam rotation axes of symmetry with clean laser beam 202, heating and cleaning laser beam 202 beam diameter 1.5 millimeters, reflect through vibration mirror scanning f-theta module 6, obtain heating and the cleaning laser beam 203 of vibration mirror scanning output, the heating of described vibration mirror scanning output with clean that laser beam 203 is parallel with the rotation axes of symmetry of the rotary light beam in vibration mirror scanning light beam group 7 or less parallel (described less parallel (coaxial containing being similar to) refer to described rotary motion hole laser beam the optical axis Space Rotating axis of symmetry between space angle less than 1 milliradian), therefore the heating of vibration mirror scanning output with clean laser beam 203 with vibration mirror scanning light beam group 7 after f-theta mirror 8 focuses on, the laser spot center corresponding with cleaning laser beam 203 of heating of vibration mirror scanning output is in center or the approximate center of rotary laser focused spot group movement locus corresponding to f-theta drilling beams group 9, but owing to the heating of vibration mirror scanning output is only small with the beam diameter cleaning laser beam 203, therefore, it is very big that what vibration mirror scanning exported heats the focal beam spot corresponding with cleaning laser beam 203, and be more than or equal to the rotary laser focused spot group movement locus profile of f-theta drilling beams group 9 correspondence.
It should be noted that the laser bundling device that the present embodiment uses, it is possible to use polarization beam combiner, it is possible to use unpolarized bundling device, polarization beam combiner and unpolarized bundling device, be all based on polarization spectro and unpolarized light-splitting device reversely or part use.Wherein, polarization is relevant has planar splitter and cube beam splitter two types with the unrelated beam splitter of polarization, is all based on thin film light splitting.
The present embodiment workflow is as follows:
Described laser drill synchronization control module notice or control the 3rd laser beam Rotating Modulator the 321, the 4th laser beam Rotating Modulator 322 are in running order, for instance 180,000 revs/min, namely 3000 revolutions per seconds；Workpiece to be processed 10 is in correct locus, and namely workpiece to be processed location is complete, and is in the focal plane of f theta lenses 8；Described laser drill synchronization control module (does not have to indicate) scanning galvanometer the first reflecting mirror 606 controlling vibration mirror scanning f-theta module 6 in figure and scanning galvanometer the second reflecting mirror 602 is in and determines position so that rotary laser focused spot group (not indicating in figure) is in position hole to be drilled；Described laser drill synchronization control module (does not have sign) in figure control vibration mirror scanning f-theta module 6 positions each laser beam in the complete laser beam group of keyhole immediately and goes out light simultaneously, or selectivity goes out light or successively goes out light；Once boring laser beam rotates complete, described laser drill synchronization control module (does not indicate) the boring laser beam of control correspondence immediately and closes light in figure, and control described LASER HEATING and go out light with cleaning laser instrument 201, described rotary laser focused spot group institute drilling blind hole is carried out laser cleaning.The present embodiment can also before described boring rotary laser focused spot group (not indicating in figure) goes out photoscanning boring, adopt LASER HEATING, with cleaning laser beam, workpiece to be processed 10 carries out surface and remove spot and heat treated, be more beneficial for described boring rotary laser focused spot group (not indicating in figure) and workpiece to be processed 10 is carried out efficient drilling.Once blind hole is cleaned complete, described laser drill synchronization control module (does not indicate in figure) and controls described LASER HEATING immediately and clean laser instrument 201 to close light, and control vibration mirror scanning f-theta module 6 next position, hole to be processed is positioned, repeat above procedure.
Described heating is the laser beam of 1.5 millimeters for diameter with cleaning laser beam 200, its relevant parameter is as follows: optical maser wavelength 355 nanometers, beam quality factor is less than 1.1, hot spot circularity is more than 90 percent, 4 watt of 5 KHz of mean power, single mode gauss laser (horizontal field intensity is Gauss distribution), range of pulse repetition frequency 0 to 10 KHz.LASER HEATING and the spot diameter of cleaning hot spot that described heating is corresponding with cleaning laser beam 200 are 200 microns, depth of focus 1300 microns, if needing bigger hot spot, heating can out of focus use with cleaning laser beam.
Embodiment 4, double; two hollow electric spindle parallel connection rotary laser dual-beam close bundle hole-drilling system.Illustrate below in conjunction with Fig. 4 and Fig. 8 system that the present embodiment is provided.
The present embodiment remains the mutation of embodiment 1.As shown in Figure 4, the laser array 1 in the present embodiment comprises P polarization end laser array 11 and comprises the first boring laser instrument 111, output the first boring laser beam 113 with S-polarization end laser array 12, described 11；Described S-polarization end laser array 12 comprises the 4th boring laser instrument 122, output the 4th boring laser beam 124.
Described laser beam expander group 2 comprises P polarization end beam expander group 21 and S-polarization end beam expander group 22, described P polarization end beam expander group 21 comprises the first laser beam expander 211, and described first boring laser beam 113 expands output first through the first laser beam expander 211 and expands laser beam 213；Described S-polarization end beam expander group 22 comprises the 4th laser beam expander 222, and described 4th boring laser beam 124 expands output the 4th through the 4th laser beam expander 222 and expands laser beam 224.
Described laser beam Rotating Modulator group 3 comprises P polarization end laser beam rotation modulation group 31 and S-polarization end laser beam rotation modulation group 32, described P polarization end laser beam rotation modulation group 31 comprises the first laser beam Rotating Modulator 311, described first expands laser beam 213 through described first laser beam Rotating Modulator 311 rotation modulation, exports the first rotary drilling laser beam 313；Described S-polarization end laser beam Rotating Modulator group 32 comprises the 4th laser beam Rotating Modulator 322, and the described 4th expands laser beam 224 through described 4th laser beam Rotating Modulator 322 rotation modulation, exports the 4th rotary drilling laser beam 324.
Described laser bundling device 4 comprises polarization laser and closes bundle element 43, and the polarization laser in the present embodiment closes bundle element 43 and is based on the polarization coupling sheet of optical thin film.Described first rotary drilling laser beam 313 reflects light combination mirror 411 plane reflection through described first, it is thus achieved that P polarization end swashs combiner incident beam 415.Described P polarization end swashs combiner incident beam 415 and exports the parallel or approximately parallel boring laser beam group 44 of rotation axes of symmetry with the 4th rotary drilling laser beam 324 through polarization laser conjunction bundle element 43.
Described laser refraction scan module 5 is between laser bundling device device 4 and vibration mirror scanning f-theta module 6, refraction scan module the second electric machine main shaft 503 is installed on refraction scan module the second motor 504, second refractive optics prism 502 is arranged on refraction scan module the second electric machine main shaft 503, first refractive optical prism 501 is installed on the first electric machine main shaft (not indicating in figure), and the first electric machine main shaft (does not indicate) space crossed with the second electric machine main shaft 503 in figure.Incident second refractive optics prism 502 after the incident first refractive optical prism 501 of rotation axes of symmetry horizontal bore laser beam group 44, output compound motion boring laser beam group 505, the incident vibration mirror scanning f-theta module 6 of described compound motion boring laser beam group 505, incident scanning galvanometer the first reflecting mirror 606, output scanning galvanometer first reflects light beam 603, described scanning galvanometer first reflects incident scanning galvanometer the second reflecting mirror 602 of light beam 603, exports vibration mirror scanning light beam group 7.Described scanning galvanometer the first reflecting mirror 606 is fixed on the first electric machine main shaft 605 of scanning galvanometer the first motor 604, described scanning galvanometer the second reflecting mirror 602 is fixed on scanning galvanometer the second electric machine main shaft 601, described scanning galvanometer the first electric machine main shaft 605 and the space crossed placement of scanning galvanometer the second electric machine main shaft 601.
Described vibration mirror scanning light beam group 7 focuses on through f-theta mirror 8, output f-theta drilling beams group 9, f-theta drilling beams group 9 is focused to boring laser beam laser focusing focal group (not indicating in figure) on workpiece to be processed 10, the laser spot of all of laser focusing focal group is all used for processing position, unified hole, and movement locus is concentric circular or approximate concentric circular, described approximate concentric circular refers to that the center of circle dispersion of each rotary drilling laser beam focus focus center motion circular trace is less than 50 microns, described concentric circular or approximate concentrically ringed diameter are less than 300 microns.Each laser spot spot size of described rotary drilling laser focusing focal group can be identical, it is also possible to different；The diameter of the motion circular trace at each laser spot center of described rotary drilling laser focusing focal group can be identical, it is possible to different.When described fraction of laser light focussing movement circular trace diameter is identical or close to time, the workpiece to be processed that different materials superposition is formed by different optical maser wavelength is adopted to hole more for advantage, now different wavelength laser focuses can successively be used for processing the material of different levels, play various wavelength to certain material more for the advantage of working ability, improve processing quality and efficiency.When described laser spot motion circular trace diameter difference, laser spot spot size is taken into account, all laser spot movement locus form donut or approximate donut, process blind hole or through hole so that the form of great circle ring set small circle ring is disposable, greatly improve blind hole penetration rate.
In the present embodiment, described workpiece to be processed 10 is 100 micron thickness double-side flexible printed circuit boards, and wherein two-layer layers of copper is 15 micron thickness copper, has the insulating barriers such as polyimides between two-layer copper.
Described f-theta drilling beams group 9 is focused into the rotary laser focused spot group comprising two focal beam spots on workpiece to be processed surface, and the diameter of each focused spot hot spot is 20 microns, and depth of focus is 200 microns.
Embodiment 5, hollow electric spindle compress galvanometer rotary laser dual-beam in parallel conjunction bundle hole-drilling system with pivot angle.Illustrate below in conjunction with Fig. 5 and Fig. 8 system that the present embodiment is provided.
The present embodiment is to have carried out some on the basis of previous embodiment 4 to improve, on the basis of previous embodiment 4, mainly add heating and clean laser instrument 201, and decrease laser refraction scan module 5, before heating and cleaning laser instrument 201 are arranged at laser bundling device 4, heating sends heating with cleaning laser instrument 201 and cleans laser beam 200, described heating swashs combiner element 413 beam splitting with cleaning laser beam 200 through first, 50% is reflected into P polarization end laser catcher 414, and 50% transmission becomes P polarization end and swashs a part for combiner incident beam 415；Described P polarization end swashs combiner incident beam 415 and exports the parallel or approximately parallel boring laser beam group 44 of rotation axes of symmetry with the 4th rotary light beam 324 through polarization laser conjunction bundle element 43.
The present embodiment adopts high speed rotating module (i.e. laser beam Rotating Modulator group 3) that the first boring laser beam 113 is modulated, for the core of processing blind hole；High-speed vibrating mirror is adopted to be modulated carrying out the filling rotation sweep in larger diameter region to the 4th boring laser beam 124, solve blind hole telecentricity segment beam scanning a difficult problem (if telecentricity part vibration mirror scanning, then owing to scanning curvature is excessive, galvanometer does not accomplish that high-precision high-speed scans).Separately utilize the characteristic that laser beam angle is compressed by laser beam expander when expanding, 4th rotary drilling laser beam 324 is carried out laser beam expanding and optical axis rotates pivot angle compression, the light beam rotating pivot angle amplitude compression is formed after the pivot angle amplitude of light beam being compressed, namely the angle of the 4th boring laser beam 124 modulation is in 0.2 milliradian between 40 milliradians by high-speed vibrating mirror, so can allow high-velocity scanning galvanometer work in galvanometer high frequency sweep interval (normal light beam steering be 0.2 milliradian between 40 milliradians time, galvanometer possesses the highest round rate of scanning), 10 times of compressions through beam expander 222, the 4th rotation pivot angle expanding laser beam 224 becomes 0.02 milliradian between 4 milliradians, so, the high-velocity scanning galvanometer high frequency of macroscopic view comes and goes the microcosmic scanning obtaining fine angle resolution after being scanned across described light beam pivot angle compression module, rate of scanning can either be improved, obtain again fine angle scans resolution, it is very suitable for laser accurate micro Process.The present embodiment solves the galvanometer problem (83 parts asking for an interview in Fig. 8) in the high-velocity scanning of fine field, also solve galvanometer round is that scanning is too big in center of circle partial scan curvature simultaneously, the limitation (center of circle part high-speed rotating scanning asks for an interview 84 parts in Fig. 8) that speed and precision do not increase.
The double; two galvanometer parallel connection rotary laser dual-beam of embodiment 6, pivot angle compression closes bundle hole-drilling system.Illustrate below in conjunction with Fig. 6 and Fig. 8 system that the present embodiment is provided.
The present embodiment is the mutation of previous embodiment 5, change heating and the conjunction bundle position cleaning laser instrument 201, first laser beam Rotating Modulator 311 is also instead based on traditional galvanometer of reflecting mirror, wherein, heating and the position cleaning laser instrument 201 referring to previous embodiment 3, can not be repeated.
In a word, the rotary light beam group hole-drilling system that a kind of center of rotational symmetry axle that the utility model proposes is parallel, its important feature is: the laser beam group of high speed rotating, after sharp combiner, forms rotation axes of symmetry parallel (containing coaxial) or the rotary drilling laser beam group of less parallel (containing approximate coaxial)；Described rotary drilling laser beam group, after f-theta mirror focuses on, forms rotary laser focused spot group on focal plane；In described rotary laser focused spot group, each laser spot centrode is concentric circular or approximate concentric circular；In described rotary laser focused spot group, position, same hole is carried out Drilling operation by each laser spot in the time and space, greatly improves single hole drilling efficiency from two dimensions of the time and space；It is aided with vibration mirror scanning, rotary laser focused spot group is quickly switched into another position, hole from position, a hole, greatly improve intensive group hole capillary processing efficiency, particularly group hole blind hole working (machining) efficiency.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within protection domain of the present utility model.

Claims (10)

1. the rotary light beam group hole-drilling system that a rotation axes of symmetry is parallel, it is characterised in that include laser array, laser beam Rotating Modulator group, laser bundling device, vibration mirror scanning f-theta module, laser drill synchronization control module and workpiece to be processed；
Described laser array, including at least one laser instrument, restraints above boring laser beam for launching two bundles or two；
Described laser beam Rotating Modulator group, including two or more laser beam Rotating Modulators, the corresponding a branch of boring laser beam of each laser beam Rotating Modulator, each described laser beam Rotating Modulator, for corresponding boring laser beam is carried out space modulation, obtain corresponding rotary drilling laser beam, and incident laser bundling device, wherein, the angle between optical axis and the rotation axes of symmetry of this rotary drilling laser beam of every a branch of rotary drilling laser beam more than 0 radian less than 20 milliradians；
Described laser bundling device, for carrying out closing bundle to incident multi beam rotary drilling laser beam, output rotary drilling laser beam group, wherein, closing space parallel (containing coaxial) or less parallel (containing approximate coaxial) between the multi beam rotary drilling laser beam optical axis Space Rotating axis of symmetry in the rotary drilling laser beam group after bundle, described less parallel (containing approximate coaxial) refers in described rotary drilling laser beam group that the space angle between the optical axis rotation axes of symmetry between each rotary drilling laser beam is less than 1 milliradian；
Described vibration mirror scanning f-theta module, including scanning galvanometer and scanning f-theta mirror, vibration mirror scanning light beam group is exported after described rotary drilling laser beam group incidence scanning galvanometer, described vibration mirror scanning light beam group incidence scanning f-theta mirror, obtain rotary laser focused spot group, wherein, in described rotary laser focused spot group, the movement locus at each laser spot center is concentric circular or approximate concentric circular, described approximate concentric circular refers to that in rotary laser focused spot group, the center of circle dispersion of each laser spot central motion circular trace is less than 50 microns, described concentric circular or approximate concentrically ringed diameter are less than 300 microns；Described scanning galvanometer, between the difference processing position, hole of workpiece to be processed, switching at a high speed is carried out for controlling the switching at a high speed of vibration mirror scanning light beam group and then control rotary laser focused spot group, or, for rotary laser focused spot group being carried out assisted movement modulation one of workpiece to be processed processing position, hole；
Described laser drill synchronization control module, is used for controlling co-operating between described laser array, laser beam Rotating Modulator group and vibration mirror scanning f-theta module.
2. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 1 is parallel, it is characterized in that, described laser beam Rotating Modulator is that acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic reflecting mirror or galvanometer drive reflecting mirror or electric spindle motor to drive to rotate refraction prism optical element or any one or multiple tandem compound that galvanometer swings in refracting prisms optical element.
3. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 2 is parallel, it is characterized in that, also include laser beam expander group, described laser beam expander group includes the laser beam expander of two or more than two, the corresponding laser beam expander of the every a branch of boring laser beam in described boring laser beam group；
When described laser beam Rotating Modulator is that acousto-optic deflection device or electro-optic deflector or Piezoelectric Ceramic reflecting mirror or electric spindle motor drive and rotate refraction prism optical element or when any one or multiple tandem compound that galvanometer swings in refracting prisms optical element, described laser beam expander group, between described laser array and laser beam Rotating Modulator group, expands for the multi beam boring laser beam that laser array is launched；Or, described laser beam expander group is between laser rotary manipulator group and laser bundling device, for multi beam rotary drilling laser beam is expanded；Or, described laser beam expander group, between laser bundling device and described scanning f-theta module, expands for the rotary drilling laser beam group after involutory bundle；
When described laser beam Rotating Modulator is galvanometer driving reflecting mirror, described laser beam expander group is between laser rotary manipulator group and laser bundling device, for multi beam rotary drilling laser beam is expanded；Or, described laser beam expander group, between laser bundling device and described scanning f-theta module, expands for the rotary drilling laser beam group after involutory bundle.
4. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 3 is parallel, it is characterized in that, when described laser beam Rotating Modulator group is that electric spindle motor drives the parallel combination rotating refraction prism optical element and galvanometer driving reflecting mirror, or when described laser beam Rotating Modulator group is the parallel combination that electric spindle motor drives rotation refraction prism optical element and galvanometer driving refracting prisms optical element, described rotary laser focused spot group inner laser focus rotates in the concentric circular or approximate concentric circular tracks formed, the circular trace at center is driven rotation refraction prism optical element that lens bore laser beam is rotated by electric spindle motor and is formed, other circular trace is driven reflecting mirror that the boring laser beam rotation of reflection is formed by galvanometer or the boring laser beam of transmission is rotated and formed by galvanometer driving refracting prisms optical element.
5. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 1 is parallel, it is characterized in that, laser refraction scan module is sealed between described laser bundling device and described vibration mirror scanning f-theta module, described laser refraction scan module, transparent prism optical element including two or more series connection, each transparent prism optical element is arranged on the galvanometer motor main shaft of correspondence, for swinging under the driving of galvanometer motor, to adjust the deviation angle variable quantity of the rotary drilling laser beam group after closing bundle, and under the control of described laser drill synchronization control module, rotary drilling laser beam group after involutory bundle carries out compound scan motion.
6. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 1 is parallel, it is characterised in that also include heating and clean laser instrument；
Before described heating and cleaning laser instrument are arranged at described laser bundling device, it is used for launching heating and cleaning laser beam；
Described heating and cleaning laser beam are when laser bundling device enters described vibration mirror scanning f-theta module, and the angle between the optical axis rotation axes of symmetry of its optical axis and arbitrary rotary drilling laser beam is less than 1 milliradian；Described heating obtains LASER HEATING after described vibration mirror scanning f-theta module focuses on cleaning laser beam and cleans hot spot, and wherein, the movement locus of described rotary laser focused spot group is in this LASER HEATING and cleans within the scope of hot spot；
When workpiece to be processed is scanned holing by described rotary laser focused spot group, scanning boring region is carried out LASER HEATING and the cleaning pretreatment of space-time synchronous by described LASER HEATING and cleaning laser facula before described rotary laser focused spot group goes out light or when going out light；Or, when described rotary laser focused spot group goes out light or Guan Guanghou to scanning boring region carry out space-time synchronous laser irradiate clean.
7. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 1 is parallel, it is characterised in that described laser bundling device is any one or multiple combination in plane bundling device or cube bundling device or plane mirror.
8. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 1 is parallel, it is characterized in that, described laser drill synchronization control module can control simultaneously or selectivity controls the laser switch light sequential of each laser beam of holing in described boring laser beam group, the laser pulse repetition frequency of each laser beam of holing, the pulsed laser energy of each laser beam of holing, the laser pulse width of boring laser beam, the laser pulse shape parameter of each laser beam of holing, wherein, described laser switch light sequential refers to that each boring laser beam can go out light simultaneously, also light can successively be gone out, can open the light simultaneously, also can successively open the light.
9. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 8 is parallel, it is characterized in that, described workpiece to be processed is formed by stacking by different types of thin material, described boring laser array launches the multi beam boring laser beam of different wave length, the order of the laser switch light of the multi beam boring laser beam of the different wave length of described laser drill synchronization control module keyhole laser array output so that the different material layer in the processing hole of workpiece to be processed is processed by the boring laser beam of different wave length.
10. the rotary light beam group hole-drilling system that a kind of rotation axes of symmetry as claimed in claim 8 is parallel, it is characterized in that, under described laser drill synchronization control module controls, corresponding boring laser beam is carried out multipurpose rotary modulation by described laser beam Rotating Modulator, and boring laser beam corresponding in the process can change with different pulsed laser energies or different laser pulse widths or different laser pulse shapes or different pulse recurrence frequencies and light.
CN201620134229.9U 2016-02-19 2016-02-19 Parallel rotatory beam group drilling system of rotation axes of symmetry Withdrawn - After Issue CN205342240U (en)

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CN105562947A (en) * 2016-02-19 2016-05-11 武汉铱科赛科技有限公司 Drilling system and method through rotary laser beam sets with parallel rotary symmetry axes
CN107470786A (en) * 2017-09-14 2017-12-15 深圳市牧激科技有限公司 More laser head assemblies
CN108067756A (en) * 2016-11-07 2018-05-25 三星显示有限公司 The control method of Laser crystallization equipment and crystallization laser beam
CN108994452A (en) * 2018-07-12 2018-12-14 上海航天设备制造总厂有限公司 A kind of multiple beam processes light path system and its method with optical axis
CN110198804A (en) * 2017-01-25 2019-09-03 松下知识产权经营株式会社 Laser Machining head and the laser processing device for using it
CN110695523A (en) * 2019-06-19 2020-01-17 西安中科微精光子制造科技有限公司 Laser scanning device
CN112775549A (en) * 2021-02-01 2021-05-11 山东鹰联光电科技股份有限公司 Laser welding device and welding method thereof
CN113857699A (en) * 2021-10-22 2021-12-31 广东中科微精光子制造科技有限公司 Blind hole drilling equipment and drilling method
CN114952039A (en) * 2021-02-20 2022-08-30 雷科股份有限公司 Laser rapid drilling device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105562947A (en) * 2016-02-19 2016-05-11 武汉铱科赛科技有限公司 Drilling system and method through rotary laser beam sets with parallel rotary symmetry axes
CN108067756A (en) * 2016-11-07 2018-05-25 三星显示有限公司 The control method of Laser crystallization equipment and crystallization laser beam
CN108067756B (en) * 2016-11-07 2021-11-05 三星显示有限公司 Laser crystallization apparatus and method for controlling crystallized laser beam
CN110198804A (en) * 2017-01-25 2019-09-03 松下知识产权经营株式会社 Laser Machining head and the laser processing device for using it
CN110198804B (en) * 2017-01-25 2020-12-08 松下知识产权经营株式会社 Laser processing head and laser processing device using same
CN107470786A (en) * 2017-09-14 2017-12-15 深圳市牧激科技有限公司 More laser head assemblies
CN108994452A (en) * 2018-07-12 2018-12-14 上海航天设备制造总厂有限公司 A kind of multiple beam processes light path system and its method with optical axis
CN110695523A (en) * 2019-06-19 2020-01-17 西安中科微精光子制造科技有限公司 Laser scanning device
CN112775549A (en) * 2021-02-01 2021-05-11 山东鹰联光电科技股份有限公司 Laser welding device and welding method thereof
CN114952039A (en) * 2021-02-20 2022-08-30 雷科股份有限公司 Laser rapid drilling device
CN113857699A (en) * 2021-10-22 2021-12-31 广东中科微精光子制造科技有限公司 Blind hole drilling equipment and drilling method

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