CN206643499U - A kind of controllable laser-processing system of focal position of laser dynamic - Google Patents

A kind of controllable laser-processing system of focal position of laser dynamic Download PDF

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CN206643499U
CN206643499U CN201720419832.6U CN201720419832U CN206643499U CN 206643499 U CN206643499 U CN 206643499U CN 201720419832 U CN201720419832 U CN 201720419832U CN 206643499 U CN206643499 U CN 206643499U
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laser
focus
laser beam
angle
mirror
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张立国
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Wuhan Excel Science And Technology Ltd
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Wuhan Excel Science And Technology Ltd
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Abstract

The utility model provides a kind of focal position of laser dynamic controllable laser-processing system, and described system includes laser light source module, laser beam divergent angle Dynamic control module and Laser Focusing and focus handover module.The utility model introduces laser beam divergent angle Dynamic control module in whole laser-processing system, dynamic control is carried out to the angle of divergence for processing laser beam, so as to change locus of the laser spot after the Laser Focusing and focus handover module focus on workpiece to be processed, realize the laser spot defocus motion of high speed, and can enough ensures that Laser Focusing focus center and laser defocus focus center are in the positional precision of workpiece to be processed before and after high defocus, and it ensure that good focusing effect before and after defocus without additional aberration is introduced before and after defocus.

Description

A kind of controllable laser-processing system of focal position of laser dynamic
Technical field
Technical field of laser processing is the utility model is related to, it is controllable more particularly, to a kind of focal position of laser dynamic Laser-processing system.
Background technology
In laser drill field, laser spot switches between hole and hole, and vibration mirror scanning is the most fast of comparative maturity at present Switching mode, performance acceleration and deceleration, displacement linear velocity and locating speed.
But blind holes of circuit board drilling at present, all it is the laser ablation copper sheet using a kind of special parameter without exception, so Change the distance between the scanning focused mirror of flat field and circuit board afterwards so as to obtain laser defocus of the laser spot relative to circuit board, Bottom hole material is removed using the large spot of defocus.
Because this defocus mode is using the acquisition of the distance between f-theta mirror and circuit board is changed, in laser plus During work, change the distance between f-theta mirror and circuit board, easily bring the error of Laser Processing, it is prior It is to reach the purpose of defocus by constantly changing the distance between f-theta mirror and circuit board, the efficiency of such defocus is too low, Delay very much.
Utility model content
The utility model provides a kind of laser spot position for overcoming above mentioned problem or solving the above problems at least in part The controllable laser-processing system of dynamic is put, the focusing of adjustment Laser Focusing is reached by the change to processing laser-beam divergence angle Focus realizes the laser spot defocus motion of high speed in the locus of workpiece to be processed.
According to one side of the present utility model, including laser light source module, laser beam divergent angle Dynamic control module With Laser Focusing and focus handover module;
The laser light source module, laser beam is processed for producing, and by the incident laser beam hair of optic path Dissipate angle Dynamic control module;
The laser beam divergent angle Dynamic control module, the angle of divergence for the processing laser beam to incidence enter Mobile state Control, the controlled first laser light beam of the output angle of divergence, and the incident Laser Focusing and focus handover module;
The Laser Focusing and focus handover module, are focused for the first laser beam controlled to the angle of divergence, with shape Into focus on light beam, wherein, for the different first laser light beam of the angle of divergence, the focal position of the focus on light beam of formation is different;Also For controlling the laser spot of the focus on light beam to be switched over or one between the different machining cells of workpiece to be processed Laser spot scans motion at individual machining cell to the focus on light beam carries out motion control;
The laser beam divergent angle Dynamic control module includes polarized light splitting device, quarter-wave phase delay device And reflective optical devices;
Processing laser beam transmission-polarizing light-splitting device, the incident quarter-wave phase delay device successively, described four The polarization state of the output beam of/mono- wavelength phases delayer rotates 45 degree or approximation 45 relative to the processing laser beam Degree, the incident reflective optical devices of the beam orthogonal or near normal of output, and by the reflective optical devices it is vertical or Person's near normal reflects, and re-shoots the quarter-wave phase delay device, the quarter-wave phase delay device is defeated The polarization state of the light beam gone out is rotated by 90 ° relative to the processing laser beam or 90 degree of approximation, then through the polarized light splitting device Reflection, obtains the controlled first laser beam of the angle of divergence;
Or it is described processing laser beam reflected by polarized light splitting device after incident quarter-wave phase delay device, institute The polarization state for stating the output beam of quarter-wave phase delay device processes 45 degree of laser beam rotation or near relative to described Seemingly 45 degree, the incident reflective optical devices of beam orthogonal or near normal of output, and hung down by the reflective optical devices The reflection of straight or near normal, re-shoots the quarter-wave phase delay device, the quarter-wave phase delay The polarization state of the output beam of device is rotated by 90 ° relative to the processing laser beam or 90 degree of approximation, and transmits the polarization point Optical device, obtain the controlled first laser beam of the angle of divergence.
Wherein, by changing the reflecting surfaces of the reflective optical devices in the laser beam divergent angle Dynamic control module The beam divergence angle of first laser beam described in curvature control, the laser spot of the focus on light beam of different spatial is formed, realized Laser spot controls relative to the dynamic through-focus of workpiece to be processed.
The polarization state of the output beam of the quarter-wave phase delay device is relative to the quarter-wave appearance The polarization state of position delayer inputs light beam rotates 45 degree or 45 degree of approximation.It should be noted that 45 degree of the approximation in the application With 90 degree of approximation, refer in the range of 45 degree of predetermined deviation, such as, in the range of the degree of -5 degree~+5, and near normal Refer in the deviation range of the degree of -5 degree~+5.
The beneficial effects of the utility model are:Swashing for focus on light beam is adjusted by the change to processing laser-beam divergence angle Optical focus realizes the laser spot defocus motion of high speed in the position of optical axis direction.Sent out by the light beam of dynamic control laser beam Angle is dissipated, when being processed to composite, if the different materials of different layers need different Laser Processing hot spots or difference Laser peak power density when, can be by controlling the laser spot of focus on light beam to be controlled in the defocusing amount of workpiece to be processed Laser beam workpiece to be processed surface laser facula size, so as to realize the accurately and accurately Laser Processing to composite; Rapidoprint can also be treated using peak value laser power density in focal position of laser and carry out retrofit, then using low Peak laser power density defocus large spot carries out the micro- cleaning of laser to finished region.Furthermore it is also possible to dynamic is controlled Position of the laser spot of the scanning focused mirror of flat field processed on beam Propagation direction, it is possible to achieve significantly facial plane dynamic mark; Motion of the laser spot in optical axis direction is controlled with reference to the control of laser beam divergent angle, it is possible to achieve 3 D stereo laser is swept Retouch work.
On the basis of above-mentioned technical proposal, the utility model can also improve as follows.
Further, the quarter-wave phase delay device is that quarter-wave slide or quarter-wave are reflective Phase delay circular polarizer or quarter-wave prism.
Wherein, quarter-wave phase delay device can be quarter-wave wave plate, all to produce o light and e light The wave plate of the additional light path of λ/4 is referred to as quarter-wave plate.If quarter-wave plate is impinged perpendicularly on linearly polarized light, and it shakes Dynamic direction and chip optical axis included angle θ=45 °, then the light for transmiting wave plate is circularly polarized light;Conversely, circularly polarized light passes through a quarter It is changed into linearly polarized light after wave plate.
Wherein, quarter-wave phase delay device can also be the reflective phase delay circular polarizer of quarter-wave, Linearly polarized light polarization direction and plane of incidence are impinged upon on reflective circular polarizer into 45 degree, then with 45 degree of incidence angles, reflected light Circularly polarized light will be changed into.
In addition, quarter-wave phase delay device can also be quarter-wave prism.Quarter-wave prism Interior laser experiences total internal reflection, the relative phase between s and p-polarization component can change, and fresnel prism just make use of this former Reason.Fresnel rhomb prism delayer is acted on as broadband waveplate, and λ/4 or λ/2 can be provided in very wide wave-length coverage Phase delay, and wave-length coverage is more wider than birefringent wave plate.It can be substituted for broadband, multi-wavelength or tunable laser Delay wave plate in light source.Rhombic prism design makes each internal reflection produce 45 ° of phase differences, so as to provide the phase delay of λ/4. Because phase difference is with caused by slowly varying rhombic prism dispersion, so delay variation will be much caused by different wave length Less than other types of delayer.Half-wave ratarder is made up of two quarter-wave delayers, by controlling water chestnut mirror Geometry, it becomes possible to produce quarter-wave or half-wave retardation, or the device of any desired WaWlSrigtW upsiloneflaf.
Further, during laser spot dynamic through-focus, the optical axis of the focus on light beam keeps constant or substantially not Become, the laser spot of different spatial is located on focus on light beam optical axis.
Further, the Laser Focusing includes scanning galvanometer peace field scan focus lamp with focus handover module;
When the reflective optical devices are plane mirror, the first laser beam is not changed relative to the processing laser The beam divergence angle of beam, so as to which the Laser Focusing focus after the Laser Focusing and focus handover module focus on is located at flat field The normal work distance of scanning focused mirror;
When the laser reflection face of the reflective optical devices is convex mirror, increase the first laser beam relative to described The beam divergence angle of laser beam is processed, so as to the Laser Focusing focus after the Laser Focusing and focus handover module focus on Positioned at the negative defocus position of the scanning focused mirror of flat field;
When the laser reflection face of the reflective optical devices is concave mirror, reduce the first laser beam relative to described The beam divergence angle of laser beam is processed, so as to the Laser Focusing focus after the Laser Focusing and focus handover module focus on Positioned at the positive out of focus position of the scanning focused mirror of flat field;
Wherein, the incident ray axis of the laser reflection face on convex surface or the laser reflection face of concave surface and corresponding reflected light Beam optical axis included angle is less than 0.4 radian.
It is described further to have the beneficial effect that:By the curvature for the laser reflection face for changing optical reflection element, to change The angle of divergence of first laser beam, and then change defocusing amount of the focus on light beam on workpiece to be processed surface, it is adapted to composite Efficient Laser Processing.
In addition, the symmetrical centre surface method of the incident ray axis and laser reflection face of concave surface or convex surface laser reflection face The angle of line is less than 0.2 radian, in other words, the incident ray axis of the laser reflection face on convex surface or the laser reflection face of concave surface It is less than 0.4 radian with corresponding the reflected beams optical axis included angle so that the transmission direction of the controlled first laser beam optical axis of the angle of divergence Do not deviated by before and after the change of first laser beam divergence angle too remote.It is poly- in flat field scanning for the scanning focused mirror of flat field The workpiece to be processed surface laser focal beam spot displacement of burnt mirror focal plane and the incident beam of scanning f-theta mirror scan Angle is directly proportional.If the incident beam optical axis of concave surface or convex surface laser reflection face is with corresponding the reflected beams optical axis included angle Zero degree is very close 0 degree (the reflecting surface deformation direction of adjustable reflecting optics obtains), then, the motion of laser spot defocus The incident angle of the scanning focused mirror incident beam of front and rear flat field keeps constant or is held essentially constant, so as to focus on laser beam At the defocused spot center on workpiece to be processed surface with the focusing laser beam before focusing laser beam defocus on workpiece to be processed surface Laser spot center between theoretically overlap, so greatly improve laser facula before and after laser spot defocus Center and will not produce additional aberration in the positional precision on workpiece to be processed surface, ensure that good focusing effect before and after defocus Fruit.
Further, the transmission direction of the scanning galvanometer first laser beam controlled to the angle of divergence carries out deflection compensated so that When the reflecting surface curvature change of reflective optical devices, the incident angle of the incident beam of the scanning focused mirror of flat field keeps constant Or be basically unchanged, laser beam is focused at the defocused spot center on workpiece to be processed surface with focusing on laser beam defocus so as to control Dispersion of the prefocusing light beam between the laser spot center on workpiece to be processed surface, and then control focus on light beam defocus Positional precision of the laser spot center on workpiece to be processed surface afterwards.
Further, the polarized light splitting device is that 45 degree of polarization spectro plain films or Brewster's angle are divided plain film or 45 Spend polarization splitting prism or Brewster's angle Amici prism.
Further, by using directly or indirectly plane mirror machinery tension and compression are caused plane mirror occur circle pair Claim deformation, to realize the change of the laser reflection face curvature of the reflective optical devices;Wherein, driven using electrostriction element And/or directly or indirectly to act on plane anti-for magnetostriction element driving and/or motor driving and/or mechanism lifting temperature control mode Mirror is penetrated to realize to plane mirror machinery tension and compression.Wherein, typical electrostriction element is piezoelectric ceramic actuator.
Referring to Fig. 6, Fig. 6 is that piezoelectric ceramics pushes plane of reflection mirror bump diagrams, optical reflection element 301 it is a diameter of 25.4mm, thickness 6.4mm, the original state of optical reflection element 301 is plane mirror, installed in the inside of housing 13, pressure Circle 11 compresses the eyeglass of optical reflection element 301, and the non-reflecting surface of optical reflection element 301 couples with piezoelectric ceramics 12, presses Electroceramics 12 couples with housing 13.
When piezoelectric ceramics 12 does not extend, optical reflection element 301 is plane mirror, when piezoelectric ceramics 12 extends, The non-reflecting surface of optical reflection element 301 is under pressure, the reflecting surface outwardly convex of optical reflection element 301, and it is anti-to form convex surface Penetrate face.The different elongation of piezoelectric ceramics 12, the reflecting surface outwardly convex degree of optical reflection element 301 is different, is formed different Curvature convex curved reflecting surfaces.
Described indirectly-acting, refer to increase by one layer of excessive object, Ke Yishi between drive mechanism and plane mirror Metal or nonmetallic, such as ceramics, etc..
Because processing laser beam is that circle is symmetrical, and wishes plane mirror and circle symmetric deformation, therefore plane reflection occurs Mirror is preferably circular, and circular surrounding is fixed, plane mirror central protuberance or depression, plane mirror central protuberance or Person's depression can use piezoelectric ceramics to draw plane mirror center or press and realize, can also use motor drive machinery device Plane mirror center is drawn or pressed and is realized, the thermal expansion that mechanical structure is realized to mechanical device heating temperature control can also be used Plane mirror center is drawn or pressed and is realized.
It is described further to have the beneficial effect that:Circle symmetric deformation occurs for plane mirror, can cause circular Gaussian laser Beam is not distorted, so that Laser Focusing effect keeps good, avoids aberration to the unfavorable of focusing.In addition, using pressure The mode High-speed Control plane reflection eyeglass such as electroceramics or high-speed servo motor deforms upon, and it is burnt can to obtain high laser The defocus speed of point, i.e. movement velocity of the Laser Focusing focus in optical axis direction.Obtain and swashed before and after high laser defocus simultaneously Optical focus workpiece to be processed surface positional precision, i.e., after laser spot defocus, focus on laser beam on workpiece to be processed surface Defocused spot center with focus on laser beam defocus prefocusing light beam the laser spot center on workpiece to be processed surface it Between dispersion.
Further, using plane mirror as a sealing surface of closed vessel or near-hermetic face, change is passed through The Fluid pressure size of sealed container interior, change the shape in sealing surface or near-hermetic face, and then change the plane reflection The curvature of mirror.
Further, the laser reflection of plane mirror is faced outwardly to a surface for being adhered to closed vessel, by changing The Fluid pressure size become inside closed vessel changes the curvature of the plane mirror mounting surface of closed vessel, and then described in change The curvature of plane mirror.
Further, by by the non-reflecting surface negative-pressure adsorption of plane mirror on concave face plate or on rased panel or not Absorption, realizes the setting of the curvature of plane mirror.
Further, in addition to beam motion modulation module, the laser light source module and the laser beam are arranged at Between angle of divergence Dynamic control module, or it is arranged at the laser beam divergent angle Dynamic control module and the Laser Focusing Between focus handover module;
The beam motion modulation module, modulated for the motion to processing laser beam or first laser beam, wherein, institute Beam motion modulation module is stated using audio-optical deflection modulation, electro-optical deflection modulation, motor driving mirror deflection modulation or prism Swing refractive deflection modulation, Piezoelectric Ceramic mirror deflection modulation in one or more modes be processed laser beam or The motion modulation of person's first laser beam.
Further, the incident beam diameter of the reflective optical devices is between 2 millimeters to 20 millimeters.
Such benefit is change of the controlled first laser beam of the angle of divergence relative to the angle of divergence of processing laser beam to anti- Penetrate the change rdativery sensitive of the reflecting surface curvature of optical element.
Further, when reflective optical devices are plane mirror, using the laser spot of focus on light beam to work to be processed Part carries out retrofit;When reflective optical devices are convex mirror or concave mirror, using the defocused spot of focus on light beam to be added Finished region or track carry out the micro- cleaning of laser on work workpiece.
Further, the workpiece to be processed comprises at least the machined layer of two kinds of different materials, wherein, the processing of different materials Layer is processed using the focusing laser of different defocusing amounts, wherein, the defocusing amount for focusing on laser can be by reflective optical devices Reflector curvature is adjusted.
Such benefit is the spot size in material surface to be processed by defocusing amount control focus on light beam, so as to control Laser peak power density in the laser facula, it may adapt to different material processing.
The operation principle of the application is as follows:
The scanning focused mirror of flat field is the scanning focused mirror of common flat field or the scanning focused mirror of telecentricity flat field, and common flat field scans After focus lamp or the scanning focused mirror of telecentricity flat field are focused to light beam, laser beam focal is burnt flat in the scanning focused mirror of flat field Displacement on face is directly proportional to the scanning focused mirror focal length of flat field, and is swept with the inlet beam of the scanning focused mirror of flat field and flat field The angle retouched between the optical axis of focus lamp is directly proportional.Once the scanning focused mirror of flat field is selected, the focal length of the scanning focused mirror of flat field is just Determine, then displacement of the laser beam focal on the scanning focused mirror focal plane of flat field is only poly- with flat field scanning in theory Angle between the optical axis of the inlet beam peace field scan focus lamp of burnt mirror is directly proportional.
Therefore, as long as the angle between the optical axis of the inlet beam peace field scan focus lamp of the scanning focused mirror of flat field is kept It is constant, that is, parallel or less parallel or coincidence or approximate coincidence between all inlet beams of the scanning focused mirror of flat field are ensured, Focused spot center superposition or approximate coincidence of the focus on light beam so formed on workpiece to be processed surface.For focus on light beam For optical axis, focus on light beam optical axis is straight line, the focused spot center of focus on light beam in the position of workpiece to be processed once It is determined that changing reflective optical devices surface curvature, relative to workpiece to be processed optical axis direction occurs for the laser spot of focus on light beam Positive out of focus motion or bear defocus motion, then defocused spot center is still within workpiece to be processed surface, also certainly in poly- On the optical axis of defocused laser beam.Therefore the focus center of focus on light beam is weight in the position on workpiece to be processed surface with defocused spot center What conjunction or approximation overlapped, its position is exactly the intersection point for assembling beam optical axis and material surface to be processed, so as to realize laser Jiao The high-speed motion in focus on light beam optical axis is put, and in the focus on light beam defocused spot that focus on light beam intersects with material surface to be processed The heart keeps constant or approximate constant in material surface position to be processed.
See Fig. 3-a, the processing laser beam (not marked in figure with icon) of parallel collimation is by S type polarized light splitting devices After 308 reflections, the first incident beam 306 of identical parallel collimation is obtained, the first incident beam 306 of parallel collimation is vertical or near Like vertical incidence quarter-wave slide 304, quarter-wave slide 304 is emitted the second incident beam of parallel collimation 303 polarization state rotates 45 degree or approximate rotation 45 relative to the first incident beam 306 of processing laser beam or parallel collimation Degree.Second incident beam 303 of parallel collimation is vertically or near normal incidence reflection optical element 301 is (this moment anti-for plane Penetrate mirror), and by reflective optical devices 301 are vertical or near normal reflection obtains the second the reflected beams 302 of parallel collimation, put down Second the reflected beams 302 of row collimation transmit quarter-wave slide 304 again, obtain the first the reflected beams of parallel collimation 305, the polarization state of the first the reflected beams 305 of parallel collimation rotates relative to processing laser beam or the first incident beam 306 90 degree or approximation are rotated by 90 °, and the first the reflected beams 305 transmission S types polarized light splitting device 308 of parallel collimation, obtain light beam hair It is also parallel collimation to dissipate the controlled first laser beam 4 in angle.See Fig. 3-b, scanning galvanometer (not indicated in figure) exports parallel standard The 3rd straight the reflected beams 503, the 503 incident scanning focused mirror 508 of flat field of the 3rd the reflected beams of parallel collimation, flat field scanning are poly- Burnt mirror 508 exports focus on light beam 509, and the focusing task that the laser spot of focus on light beam 509 is located at the scanning focused mirror 508 of flat field is put down Face, that is, the surface of workpiece to be processed 6.
See Fig. 4-a and Fig. 4-b, optic path order is identical with Fig. 3-a, unlike, reflective optical devices 301 swash Light reflection surface is convex surface, and particularly symmetrical circular convex is preferred, surface normal and the parallel collimation of convex surface symmetrical centre point The optical axis coincidence of second incident beam 303 or close coincidence, the second incident beam 303 of parallel collimation is through convex curved reflecting surfaces The reflection of reflective optical devices 301 obtains the second the reflected beams 302 of diverging, and the optical axis of the second the reflected beams 302 of diverging is with putting down The optical axis coincidence of second incident beam 303 of row collimation is either close to overlapping or parallel or close to parallel, and the second of diverging The reflected beams 302 transmit quarter-wave slide 304 again, obtain the first the reflected beams 305 of diverging, the first reflection of diverging The laser polarization state of light beam 305 is relative to processing laser beam or the first incident beam 306 is rotated by 90 ° or approximation is rotated by 90 °, The transmission-polarizing light-splitting device 308 of the first the reflected beams 305 of diverging, obtain the controlled first laser beam 4 of the angle of divergence and diverging 's.See Fig. 4-c, the 3rd the reflected beams 503 of scanning galvanometer (not indicated in figure) output diverging, the 3rd the reflected beams of diverging The 503 incident scanning focused mirrors 508 of flat field, the scanning focused mirror 508 of flat field export focus on light beam 509, and the laser of focus on light beam 509 is burnt Point position 7 below the focusing task plane 6 of the scanning focused mirror 508 of flat field.
See Fig. 5-a, optic path order is identical with Fig. 3-a, unlike, the reflecting surface of reflective optical devices 301 is Concave surface, particularly symmetrical circular concave are preferred, the surface normal of concave surface symmetrical centre point and the second incident light of parallel collimation The optical axis coincidence of beam 303 is first close to coincidence, reflection optics of second incident beam 303 through concave reflection face of parallel collimation The reflection of part 301 obtains the second the reflected beams 302 of convergence, the optical axis and the second incident beam of the second the reflected beams 302 of convergence For 303 optical axis coincidence either close to overlapping or parallel or close to parallel, the second the reflected beams 302 of convergence transmit four again / mono- wavelength slide 304, obtain the first the reflected beams 305 of convergence, the laser polarization state of the first the reflected beams 305 of convergence Relative to processing laser beam or the first incident beam 306 is rotated by 90 ° or approximation is rotated by 90 °, the first the reflected beams of convergence 305 transmission S types polarized light splitting devices 308, it is also convergence to obtain the controlled first laser beam 4 of the angle of divergence.See Fig. 5-b, sweep Retouch the 3rd the reflected beams 503 of galvanometer (not indicated in figure) output convergence, the 503 incident flat field scanning of the 3rd the reflected beams of convergence Focus lamp 508, the scanning focused mirror 508 of flat field export focus on light beam 509, and the laser spot of focus on light beam 509 is located at flat field scanning Position 8 above the focusing task plane 6 of focus lamp 508.
So, present invention take advantage of that scanning the special focusing rule of f-theta mirror, it make use of quarter-wave phase The change of extender (particularly quarter-wave slide), polarized light splitting device and level crossing surface face type, realizes height Fast dynamic through-focus, and keep focus on light beam and workpiece to be processed surface intersection point center constant in workpiece to be processed surface location, it is non- It is very suitable for trickle local priority same to workpiece to be processed to process using different spot sizes, such as pcb board blind hole adds Work, the application such as laser cleaning is carried out after laser cutting immediately.
The application principle can also use another structure, and see Fig. 1, the processing laser beam 2 of parallel collimation polarizes with respect to p-type After light-splitting device 307 is with 45 degree of angle incidences, the first incident beam 306 of the identical parallel collimation of acquisition, the first of parallel collimation Incident beam 306 is vertical or near normal incidence quarter-wave slide 304, and quarter-wave slide 304 is emitted parallel The polarization state of second incident beam 303 of collimation is revolved relative to the first incident beam 306 of processing laser beam or parallel collimation Turn 45 degree or approximate 45 degree of rotation, the 303 vertical or near normal incidence reflection optics of the second incident beam of parallel collimation Element 301 (being this moment plane mirror), and it is vertical by reflective optical devices 301 or near normal reflection obtains parallel collimation The second the reflected beams 302, the second the reflected beams 302 of parallel collimation transmit quarter-wave slide 304, obtain parallel again First the reflected beams 305 of collimation, the laser polarization states of the first the reflected beams 305 of parallel collimation relative to processing laser beam or Person's light beam 306 is rotated by 90 ° or approximation is rotated by 90 °, and the first the reflected beams 305 of parallel collimation are by p-type polarized light splitting device 307 reflections, it is also parallel collimation to obtain the controlled first laser beam 4 of the angle of divergence.If the reflecting surface of reflective optical devices 301 becomes For convex surface, then the relative processing laser beam 2 of the angle of divergence of the controlled first laser beam 4 of the angle of divergence increases;If reflect optics member The reflecting surface of part 301 is changed into concave surface, then the relative processing laser beam 2 of the angle of divergence of the controlled first laser beam 4 of the angle of divergence is reduced.
Drilled for flexible circuit board blind hole, blind hole size is generally 30~100 micron diameters, can first use Laser Focusing Focus is carried out to flexible PCB except copper sheet processing is (in 30~100 micron diameter ranges).Then added using the laser of the application Work system positive out of focus quickly can be carried out to laser spot or negative defocus is handled, but positioned at the focus on light beam of flexible PCB Defocused spot can continue to having removed the blind of copper sheet still in the position for above having removed copper sheet, such defocused spot Hole is removed the work of circuit isolation layer.In a word, the application is maintaining the position of workpiece to be processed surface laser spot center Under the premise of putting precision, the action of laser defocus can be carried out at high speed, aggregation light beam is in workpiece to be processed surface spot center position essence Degree keeps constant or is basically unchanged, and maintains good Laser Focusing characteristic.
Brief description of the drawings
Fig. 1 is that a kind of laser drilling system structure of two-sided copper foil flexible PCB of the utility model one embodiment is shown It is intended to;
Fig. 2 is a kind of hyperfine index carving system of three-dimensional laser of another embodiment of the utility model;
Fig. 3-a are the light path schematic diagram when laser reflection face of plane mirror is plane;
Fig. 3-b are the focal position of laser schematic diagram when laser reflection face of plane mirror is plane;
Fig. 4-a are the light path schematic diagram when laser reflection face of plane mirror is convex surface;
Fig. 4-b are the principle of reflection figure when laser reflection face of plane mirror is convex surface;
Fig. 4-c are the focal position of laser schematic diagram when laser reflection face of plane mirror is convex surface;
Fig. 5-a are the light path schematic diagram when laser reflection face of plane mirror is concave surface;
Fig. 5-b are the focal position of laser schematic diagram when laser reflection face of plane mirror is concave surface;
Fig. 6 is that piezoelectric ceramics pushes plane of reflection mirror bump diagrams.
In accompanying drawing, the component names representated by each label are as follows:
1st, laser light source module, 101, lasing light emitter, 2, processing laser beam, 3, laser beam divergent angle Dynamic control module, 301st, reflective optical devices, the 302, second the reflected beams, the 303, second incident beam, 304, quarter-wave slide, 305, First the reflected beams, the 306, first incident beam, 307, p-type polarized light splitting device, 308, S type polarized light splitting devices, 4, diverging The controlled first laser beam in angle, 5, Laser Focusing and focus handover module, the electric machine main shaft of the 501, second motor, 502, second is anti- Penetrate eyeglass, the 503, the 4th the reflected beams, the 504, the 3rd the reflected beams, the 505, first reflecting optics, the electricity of the 506, first motor 507 Owner's axle, the 507, first motor, 508, telecentric scanning f-theta mirror, 509, focus on light beam, 6, workpiece to be processed, 11, trim ring, 12nd, piezoelectric ceramics, 13, housing.
Embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below Embodiment is used to illustrate the utility model, but is not limited to the scope of the utility model.
Embodiment 1:
Fig. 1 is two-sided copper foil flexible PCB laser drilling system structural representation, as shown in Figure 1:Two-sided copper foil is flexible Circuit board laser drill system mainly includes laser light source module 1, laser beam divergent angle Dynamic control module 3 and Laser Focusing With focus handover module 5.
Laser light source module 1 includes lasing light emitter 101, and some optic path transformation devices (not indicated in figure), example Such as expand, reflect, the device such as refraction.
Laser beam divergent angle Dynamic control module 3 includes reflective optical devices 301, quarter-wave slide 304, P Polarized light splitting device 307 or S-polarization light-splitting device 308.The laser reflection face of reflective optical devices 301 is set perpendicular to light path, Relatively good understanding when reflecting surface is plane, reflecting surface is concave surface or convex surface is that the local surfaces at its reflector space center are vertical In light path.Quarter-wave slide 304 is generally perpendicular to light path setting, P polarization light-splitting device 307 or S-polarization light-splitting device 308 are set according to its design angle, such as 45 degree of polarized light splitting devices, and its plane of polarization is set with light path into 45 degree of angles.
Laser Focusing and focus handover module 5 are vibration mirror scanning f-theta unit, vibration mirror scanning f-theta unit bag Scanning galvanometer and scanning f-theta mirror are included, scanning f-theta mirror is that the scanning focused mirror of common flat field or the scanning of telecentricity flat field are poly- The types such as burnt mirror.In the present embodiment, scanning f-theta mirror uses telecentric scanning focus lamp 508, the scanning focused mirror of telecentricity flat field 508 focal length is 100 millimeters, 40 millimeters × 40 millimeters of f-theta scope.Scanning galvanometer includes the first reflecting optics 505 and the Two-mirror piece 502.
First reflecting optics 505 of scanning galvanometer are arranged on the electric machine main shaft 506 of the first motor 507 of scanning galvanometer, Second reflecting optics 502 of scanning galvanometer are arranged on the electric machine main shaft 501 of the second motor of scanning galvanometer.
Workpiece to be processed 6 is 62 micron thickness double-faced flexible copper foils, and machined layer outside in is respectively:18 micron copper foils + 2 microns of micron copper foils of epoxide-resin glue+18 of+2 microns of micrometer polyamide of epoxide-resin glue+22 resins.
Light path flow in the apparatus structure of whole double-faced flexible copper foil laser drill is as follows:
Laser light source module 1 exports the processing laser beam 2 of parallel collimation, and the processing laser beam 2 of parallel collimation is inclined with respect to p-type After light-splitting device 307 shake with 45 degree of angle incidences, the first incident beam 306 of identical parallel collimation is obtained, the of parallel collimation One incident beam, 306 vertical or near normal incidence quarter-wave slide 304, what quarter-wave slide 304 was emitted The polarization state of second incident beam 303 of parallel collimation rotates 45 degree relative to processing laser beam or parallel collimated beam 306, Second incident beam 303 of parallel collimation is vertically or near normal incidence reflection optical element 301 (is this moment plane reflection Mirror), and by reflective optical devices 301 are vertical or near normal reflection obtains the second the reflected beams 302 of parallel collimation, it is parallel Second the reflected beams 302 of collimation transmit quarter-wave slide 304 again, obtain the first the reflected beams 305 of parallel collimation, The laser polarization state of first the reflected beams 305 of parallel collimation rotates relative to processing laser beam or the first incident beam 306 90 degree, the first the reflected beams 305 of parallel collimation are reflected by p-type polarized light splitting device 307, obtain the angle of divergence it is controlled first swash Light beam 4 is also parallel collimation.Scanned the first reflecting optics of galvanometer 505 of the controlled first laser beam 4 of the angle of divergence obtain the 3rd The reflected beams 504, the second reflecting optics 502 of 504 scanned galvanometer of the 3rd the reflected beams obtain the 4th the reflected beams 503, the Four the reflected beams 503 are focused through the scanning focused mirror 508 of telecentricity flat field, obtain focus on light beam 509, and focus on light beam 509 is direct Workpiece to be processed 6 is acted on, now workpiece to be processed 6 is on the focal plane of flat field scanning mirror.
If the laser reflection face of reflective optical devices 301 is changed into convex surface, then the controlled first laser beam 4 of the angle of divergence The relative processing laser beam 2 of the angle of divergence increases, the laser spot of focus on light beam 509 by below the surface of workpiece to be processed 6, this When to fall on the surface of workpiece to be processed 6 be defocus focus, laser spot in this case is relative to the surface of workpiece to be processed 6 Negative defocus, its spot size defer to Gaussian beam focusing rule.If the reflecting surface of reflective optical devices 301 is changed into concave surface, then The relative processing laser beam 2 of the angle of divergence of the controlled first laser beam 4 of the angle of divergence is reduced, and the laser spot of focus on light beam 509 will be located More than the surface of workpiece to be processed 6, it is defocus focus, in this case, laser now to fall on the surface of workpiece to be processed 6 Focus is positive out of focus relative to the surface of workpiece to be processed 6, and its spot size defers to Gaussian beam focusing rule.
Wherein, processing laser beam 2 is a diameter of 7 millimeters of incident beam-expanding collimation light beam.
The relevant parameter of focus on light beam 509 is as follows:355 nanometers of optical maser wavelength, beam quality factor are less than 1.2, hot spot circle Degree is more than 90 percent, 12 watts of mean power, single mode gauss laser (horizontal field strength is Gaussian Profile), pulse recurrence frequency 100 KHzs.
The two panels reflecting optics of scanning galvanometer are that the first reflecting optics 505 are engaged with the second reflecting optics 502 so that poly- Defocused laser beam 509 carries out motion drilling on the surface of workpiece to be processed 6.In drilling blind hole, at least it is divided into two steps, the first step, removes copper removal Skin, second step, the insulating barrier below copper sheet is removed, expose bottom copper, form blind hole.When removing copper sheet, laser beam divergent angle The reflecting surface of the reflective optical devices 301 of Dynamic control module 3 is arranged to plane, and the controlled first laser beam 4 of the angle of divergence is defined Collimated optical beam, the laser spot of focus on light beam 509 just fall on the copper sheet on the surface of workpiece to be processed 6, the focusing of focus on light beam 509 Focus does concentric circular motion or spiral motion in required processing blind hole diameter range, efficiently removes copper sheet.Bored During blind hole second step, laser light off, the reflecting surface of the reflective optical devices 301 of laser beam divergent angle Dynamic control module 3 is Convex surface or concave surface, then laser open the light, the controlled first laser beam 4 of the angle of divergence is divergent beams or converging beam, is focused on The focal position of laser of light beam 509 is left on the copper sheet on workpiece to be processed surface 6, is formed negative defocus or positive out of focus, is so fallen Laser facula in blind hole is exactly the defocused spot being relatively large in diameter, and the defocused spot of scanning galvanometer driving focus on light beam 509 exists Moved in the blind hole of workpiece to be processed 6, can efficiently remove bottom hole insulating materials, and do not hinder bottom copper.
Scanned in principle at one in breadth, the reflective optical devices 301 of laser beam divergent angle Dynamic control module 3 Reflecting surface is arranged to plane, and the focal beam spot of scanning galvanometer driving focus on light beam 509 first successively can remove all blind hole copper sheets Remove.Then the reflecting surface of the reflective optical devices 301 of laser beam divergent angle Dynamic control module 3 is arranged to curved surface, scanning The defocused spot of galvanometer driving focus on light beam 509 again successively gets rid of all hole bottoms insulating materials.
Certainly, beam motion modulation module can also be included in laser-processing system, may be disposed at laser light source module 1 Between laser beam divergent angle Dynamic control module 3, or it is arranged at laser beam divergent angle Dynamic control module 3 and laser Focus between focus handover module 5.Beam motion modulation module, for the motion to processing laser beam or first laser beam Modulation, the i.e. modulation to processing laser beam or the movement locus of first laser beam.Wherein, beam motion modulation module uses sound Light modulation, Electro-optical Modulation, motor driving speculum or prism wobble modulations, Piezoelectric Ceramic speculum modulation in one kind or Various ways are processed the motion modulation of laser beam or first laser beam.Now scanning galvanometer is only responsible for hole position switching, light Shu Yundong modulation modules are responsible for aggregation hot spot and motion of the laser defocused spot in blind hole of laser.
It is scanning focused as the scanning focused means of flat field, including common flat field that the present embodiment employs the scanning focused mirror of flat field Mirror and the scanning focused mirror of telecentricity flat field, the scanning focused mirror of common flat field or the scanning focused mirror of telecentricity flat field are focused to light beam Afterwards, displacement of the laser spot on the scanning focused mirror focal plane of flat field is directly proportional to the scanning focused mirror focal length of flat field, and with The changing value of angle or angle between the optical axis of the inlet beam peace field scan focus lamp of the scanning focused mirror of flat field is into just Than.Once the scanning focused mirror of flat field is selected, the focal length of the scanning focused mirror of flat field determines that, then laser spot scans in flat field Displacement on focus lamp focal plane in theory only with the inlet beam peace field scan focus lamp of the scanning focused mirror of flat field Angle or angle change value between optical axis is directly proportional.All collimated laser beams in the scanning focused mirror of incident same flat field and When the orientation (angle and displacement) of collimated laser beam incidence f-theta mirror is in the scanning focused mirror scope of design of flat field, own Parallel incident laser beam focuses on same point on the scanning focused mirror focal plane of flat field.Therefore, laser beam divergent angle moves Change of the state control module to beam divergence angle to laser spot the focussing plane of the scanning focused mirror of flat field displacement Contribute, the light beam translation brought while beam divergence angle is changed, to laser spot f-theta mirror focussing plane Displacement do not contribute.
The range of work of the scanning focused mirror of telecentricity flat field is still limited after all, if processing breadth is big not enough, actually Workpiece to be processed 6 can also be placed on mobile platform, can so realize large-scale Laser Processing, be laser machined in practice Scanning range area is generally more than 200 millimeters × 200 millimeters of commonly referred to as large area.
The present embodiment be very suitable for circuit board laser blind hole drilling because circuit board typically be provided with it is a variety of of different nature The sandwich construction that material is formed, the different laser parameter of needs is processed per layer of material, particularly different laser faculas is big Small and laser peak power density.Such as small light spot and high-peak power are needed when removing blind hole copper sheet, remove hole bottom Large spot and low peak power density are needed when insulating materials.The former realizes that the latter passes through laser defocus by Laser Focusing Realize, but high accuracy at high speed is needed because blind holes of circuit board drills, thus the benefit of this processing mode of the present embodiment is, The laser spot defocus motion of high speed can either be realized, and can enough ensures Laser Focusing focus center before and after high defocus and swashed Light defocus focus center workpiece to be processed positional precision, and before and after defocus without introduce additional aberration, ensure that defocus Front and rear good focusing effect.
Embodiment 2:
Fig. 2 is a kind of hyperfine index carving system of three-dimensional laser of the utility model embodiment 2, except laser beam divergent angle Dynamic control module 3 and Fig. 1 has any different, other identical.
Workpiece to be processed 6 in Fig. 2 is the stainless steel thin slice of 100 microns of thickness.The present embodiment light path flow and embodiment 1 It is similar, it refer to above-mentioned true 1.
The reflective optical devices 301 of laser beam divergent angle Dynamic control module 3 reflect for circular flat in the present embodiment Mirror, surrounding are fixed in one plane, and non-reflecting surface center couples with piezoelectric ceramics displacement driver push rod, and cylindricality is piezoelectric actuated When device does not apply strength to reflective optical devices 301,301 be plane mirror.Cylindricality piezoelectric actuator does not apply pressure to 301 When, 301 be that reflecting surface is convex reflecting mirror, and protrusion degree is relevant with the stroke of cylindricality piezoelectricity promoters.It is worth noting that, such as Fruit is reasonable in design, focuses on the laser spot defocus frequency of laser beam 509 and can accomplish 20~40KHz, this is most fast since the dawn of human civilization Laser spot defocus speed.
Piezoelectric ceramics actuator is the element based on piezoelectric ceramics, is packaged by outside mechanical structure, and export Displacement and output.Using Harbin company's core tomorrow VS10 cylindricality piezoelectric actuator, its parameter such as table 1 below:
Table 1
Nominal travel is the displacement stroke under 0~150V driving voltage, for highly reliable long-term use, it is proposed that is driven Dynamic voltage is in 0~120V, selection closed-loop control, the linearity, repetitive positioning accuracy height.
, can be with order to prevent the non-reflecting surface of reflective optical devices 301 from being weighed wounded or being worn by piezoelectric ceramics actuator push rod Reflective optical devices 301 are arranged on elastic sheet, piezoelectric ceramics actuator push rod pushes to thin slice.Or due to Ceramic block is harder and wear-resisting, and the non-reflecting surface of reflective optical devices 301 installs a ceramic block, piezoelectric ceramics actuator push rod pair Thin slice is pushed.
The benefit of this processing mode is that laser spot defocus speed most fast since the dawn of human civilization is obtained using piezoelectric ceramics. See Fig. 4-c, if the beam divergence angular difference of the second the reflected beams 302 and the second incident beam 303 is 1 milliradian, then Focal position of laser corresponding to second the reflected beams 302 and the second incident beam 303 differs 2 millimeters, if the second reflection The laser spot of light beam 302 is in the surface of workpiece to be processed 6, then the laser spot of the second incident beam 303 is in be processed The position of workpiece surface 2 millimeters above or below.The reflecting surface projection of reflective optical devices 301 is very small to be can reach The purpose of laser spot defocus, therefore this embodiment scheme can realize very fast defocus speed.
If the present embodiment drills for blind holes of circuit board, now there is copper foil on workpiece to be processed two sides, and there is insulating barrier centre, Helix or concentric circular fashion removal copper foil can be carried out to workpiece to be processed surface copper foil by focusing on laser beam, and then laser closes 1 millisecond or so of light, laser beam divergent angle Dynamic control module control laser spot defocus, and now laser opens the light.Now focus on The defocused spot of laser beam to the blind hole region for having eliminated copper sheet above workpiece to be processed move and cleaning hole bottom is exhausted Edge material.At this moment Laser Focusing controls laser beam deflection to prepare next to next hole position position to be processed with focus handover module The Drilling operation of individual hole position.
If cutting of the present embodiment for thin-film material, focusing on laser beam can be to workpiece to be processed table in focal position Face carries out fine micro Process, then laser light off, laser beam divergent angle Dynamic control module control laser spot defocus, now Laser opens the light, focus on region that the defocused spot of laser beam crosses to Laser Micro-Machining above workpiece to be processed or track carry out it is big Hot spot quickly scans but does not destroy material substrate to be processed, realizes laser cleaning.
Above-described embodiment is the typical case of the application, and actually its principle application is not limited to situation above.
The laser-processing system that the present embodiment provides can apply to the recombination laser of Laser Micro-Machining and the micro- cleaning of laser Manufacture field, treat rapidoprint in focal position of laser and carry out retrofit, then using defocus large spot to processed The region crossed or track carry out the micro- cleaning of laser.The present embodiment can also be applied to the processing of multiple-layer stacked composite, wherein Workpiece to be processed be made up of the machined layer of at least two different materials, different layers machined layer can use different defocusing amounts Focus on laser to be processed, most fast defocus speed can be reached using this embodiment scheme, when being drilled applied to soft board, from During general 2mm of defocus distance or so, its defocus speed is up to 100 musec orders.
For high-rate laser Three-dimension process, scanning galvanometer is responsible for two dimensional surface scanning machining, laser beam divergent angle dynamic Control module dynamic control laser spot is along focus on light beam axis movement, in this manner it is achieved that laser spot is in song to be processed High-rate laser processing is carried out on face, here it is high-rate laser Three-dimension process.
For big width laser plane machining, the scanning focused mirror breadth of flat field is limited, normally gathers in the scanning focused mirror of flat field Beyond burnt region breadth, the laser spot for focusing on laser beam is defocus for scanning focused plane, i.e., in this region laser Focus is not on focussing plane is focused on, and laser beam divergent angle Dynamic control module dynamic control laser spot is along focus on light beam Axis movement so that the laser spot in the region beyond the scanning focused mirror normal scanning area of flat field also reaches scanning focused flat Face, scanning galvanometer are responsible for two dimensional surface scanning machining, are so achieved that the Laser Light Plane Scanning processing of large format.
In a word, the utility model proposes a kind of controllable laser-processing system of focal position of laser dynamic, introduce laser Beam divergence angle Dynamic control module, drilled for circuit board laser blind hole, for high-rate laser Three-dimension process, for large format Laser plane is processed, and the utility model can either realize the laser spot defocus motion of high speed, and and can enough ensures high defocus Front and rear Laser Focusing focus center and laser defocus focus center and do not have before and after defocus in the positional precision of workpiece to be processed Additional aberration is introduced, ensure that good focusing effect before and after defocus.
In the description of this specification, reference term " embodiment one ", " example ", " specific example " or " some examples " Deng description mean to combine specific method, device or the feature that the embodiment or example describe be contained in it is of the present utility model extremely In few one embodiment or example.In this manual, identical is necessarily directed to the schematic representation of above-mentioned term Embodiment or example.Moreover, specific features, method, apparatus or the feature of description can in any one or more embodiments or Combined in an appropriate manner in example.In addition, in the case of not conflicting, those skilled in the art can illustrate this Different embodiments or example and the feature of different embodiments or example described in book are combined and combined.
Preferred embodiment of the present utility model is the foregoing is only, it is all in this practicality not to limit the utility model Within new spirit and principle, any modification, equivalent substitution and improvements made etc., guarantor of the present utility model should be included in Within the scope of shield.

Claims (11)

1. the controllable laser-processing system of a kind of focal position of laser dynamic, it is characterised in that including laser light source module, laser Beam divergence angle Dynamic control module and Laser Focusing and focus handover module;
The laser light source module, laser beam is processed for producing, and by the incident laser beam divergent angle of optic path Dynamic control module;
The laser beam divergent angle Dynamic control module, the angle of divergence for the processing laser beam to incidence enter Mobile state control System, the controlled first laser light beam of the output angle of divergence, and the incident Laser Focusing and focus handover module;
The Laser Focusing and focus handover module, are focused for the first laser beam controlled to the angle of divergence, poly- to be formed Defocused laser beam, wherein, for the different first laser light beam of the angle of divergence, the focal position of the focus on light beam of formation is different;It is additionally operable to The laser spot of the focus on light beam is controlled to switch between the different machining cells of workpiece to be processed or add at one Laser spot scans motion at work order member to the focus on light beam carries out motion control;
The laser beam divergent angle Dynamic control module includes polarized light splitting device, quarter-wave phase delay device and anti- Penetrate optical element;
Processing laser beam transmission-polarizing light-splitting device, the incident quarter-wave phase delay device successively, described four/ The polarization state of the output beam of one wavelength phases delayer rotates 45 degree or 45 degree of approximation relative to the processing laser beam, defeated The incident reflective optical devices of beam orthogonal or near normal gone out, and it is vertical or approximate by the reflective optical devices Vertical reflection, re-shoot the quarter-wave phase delay device, the light of the quarter-wave phase delay device output The polarization state of beam is rotated by 90 ° relative to the processing laser beam or 90 degree of approximation, then is reflected through the polarized light splitting device, Obtain the controlled first laser beam of the angle of divergence;
Or it is described processing laser beam reflected by polarized light splitting device after incident quarter-wave phase delay device, described four The polarization state of the output beam of/mono- wavelength phases delayer rotates 45 degree or approximation 45 relative to the processing laser beam Degree, the incident reflective optical devices of the beam orthogonal or near normal of output, and by the reflective optical devices it is vertical or Person's near normal reflects, and re-shoots the quarter-wave phase delay device, the quarter-wave phase delay device The polarization state of output beam is rotated by 90 ° relative to the processing laser beam or 90 degree of approximation, and transmits the polarizing beam splitter Part, obtain the controlled first laser beam of the angle of divergence;
Wherein, by changing the reflecting surface curvatures of the reflective optical devices in the laser beam divergent angle Dynamic control module The beam divergence angle of the first laser beam is controlled, the laser spot of the focus on light beam of different spatial is formed, realizes laser Focus controls relative to the dynamic through-focus of workpiece to be processed.
2. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 1, it is characterised in that described four points One of wavelength phases delayer be quarter-wave slide or the reflective phase delay circular polarizer of quarter-wave or four points One of wavelength prism.
3. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 1, it is characterised in that burnt in laser During point dynamic through-focus, the optical axis of the focus on light beam keeps constant or is basically unchanged, and the laser of different spatial is burnt Point is on the optical axis of focus on light beam.
4. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 1, it is characterised in that the laser Focus on includes scanning galvanometer peace field scan focus lamp with focus handover module;
When the reflective optical devices are plane mirror, the first laser beam is not changed relative to the processing laser beam Beam divergence angle, so as to which the Laser Focusing focus after the Laser Focusing and focus handover module focus on is located at flat field scanning The normal work distance of focus lamp;
When the laser reflection face of the reflective optical devices is convex mirror, increase the first laser beam relative to the processing The beam divergence angle of laser beam, so as to which the Laser Focusing focus after the Laser Focusing focuses on focus handover module is located at The negative defocus position of the scanning focused mirror of flat field;
When the laser reflection face of the reflective optical devices is concave mirror, reduce the first laser beam relative to the processing The beam divergence angle of laser beam, so as to which the Laser Focusing focus after the Laser Focusing focuses on focus handover module is located at The positive out of focus position of the scanning focused mirror of flat field;
Wherein, the incident ray axis of the laser reflection face on convex surface or the laser reflection face of concave surface and corresponding the reflected beams light Axle clamp angle is less than 0.4 radian.
5. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 4, it is characterised in that the scanning The transmission direction of the galvanometer first laser beam controlled to the angle of divergence carries out deflection compensated so that the reflection of the reflective optical devices During surface curvature change, the incident angle of the incident beam of the scanning focused mirror of flat field keeps constant or is basically unchanged, from And control focus on light beam focus on light beam is to be processed before the defocused spot center on workpiece to be processed surface and focus on light beam defocus Dispersion between the laser spot center of workpiece surface, and then laser spot center is being treated after control focus on light beam defocus The positional precision on workpieces processing surface.
6. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 1, it is characterised in that the polarization Light-splitting device is that 45 degree of polarization spectro plain films or Brewster's angle are divided plain film or 45 degree of polarization splitting prisms or Brewster Angle Amici prism.
7. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 5, it is characterised in that by using Directly or indirectly cause plane mirror that circle symmetric deformation occurs to plane mirror machinery tension and compression, to realize the reflection optics The change of the laser reflection face curvature of element;Wherein, using electrostriction element driving and/or magnetostriction element driving and/ Or motor driving and/or mechanism lifting temperature control mode directly or indirectly act on plane mirror and realized to plane mirror machinery Tension and compression.
8. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 5, it is characterised in that plane is anti- Mirror is penetrated as a sealing surface of closed vessel or near-hermetic face, it is big by the Fluid pressure for changing sealed container interior It is small, to change the shape in sealing surface or the near-hermetic face, and then change the curvature of the plane mirror.
9. the controllable laser-processing system of focal position of laser dynamic as claimed in claim 5, it is characterised in that plane is anti- The laser reflection for penetrating mirror faces outwardly a surface for being adhered to closed vessel, big by changing Fluid pressure inside closed vessel The curvature of the small plane mirror mounting surface for changing closed vessel, and then change the curvature of the plane mirror.
10. the controllable laser-processing system of focal position of laser as claimed in claim 5 dynamic, it is characterised in that pass through by The non-reflecting surface of plane mirror, on concave face plate or on rased panel or non-adsorbable mode, realizes plane using negative-pressure adsorption The setting of the curvature of speculum.
11. the controllable laser-processing system of focal position of laser dynamic as described in claim any one of 1-10, its feature exist In, in addition to beam motion modulation module, it is arranged at the laser light source module and the laser beam divergent angle dynamic control Between module, or it is arranged at the laser beam divergent angle Dynamic control module and the Laser Focusing and focus handover module Between;
The beam motion modulation module, modulated for the motion to processing laser beam or first laser beam, wherein, the light Shu Yundong modulation modules are swung using audio-optical deflection modulation, electro-optical deflection modulation, motor driving mirror deflection modulation or prism One or more modes in refractive deflection modulation, the modulation of Piezoelectric Ceramic mirror deflection are processed laser beam or the The motion modulation of one laser beam.
CN201720419832.6U 2017-04-20 2017-04-20 A kind of controllable laser-processing system of focal position of laser dynamic Withdrawn - After Issue CN206643499U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106994557A (en) * 2017-04-20 2017-08-01 武汉铱科赛科技有限公司 A kind of dynamic controllable laser-processing system and method for focal position of laser
CN113634961A (en) * 2021-10-18 2021-11-12 武汉逸飞激光股份有限公司 Method and device for obtaining welding focal length compensation value, electronic equipment and storage medium
CN115319275A (en) * 2022-10-17 2022-11-11 武汉引领光学技术有限公司 Method for cutting coated glass by laser beam combination

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106994557A (en) * 2017-04-20 2017-08-01 武汉铱科赛科技有限公司 A kind of dynamic controllable laser-processing system and method for focal position of laser
CN106994557B (en) * 2017-04-20 2018-10-19 武汉铱科赛科技有限公司 A kind of laser-processing system and method that focal position of laser dynamic is controllable
CN113634961A (en) * 2021-10-18 2021-11-12 武汉逸飞激光股份有限公司 Method and device for obtaining welding focal length compensation value, electronic equipment and storage medium
CN113634961B (en) * 2021-10-18 2021-12-28 武汉逸飞激光股份有限公司 Method and device for obtaining welding focal length compensation value, electronic equipment and storage medium
CN115319275A (en) * 2022-10-17 2022-11-11 武汉引领光学技术有限公司 Method for cutting coated glass by laser beam combination
CN115319275B (en) * 2022-10-17 2023-01-13 武汉引领光学技术有限公司 Method for cutting coated glass by laser beam combination

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