CN108994452A - A kind of multiple beam processes light path system and its method with optical axis - Google Patents
A kind of multiple beam processes light path system and its method with optical axis Download PDFInfo
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- CN108994452A CN108994452A CN201810765646.7A CN201810765646A CN108994452A CN 108994452 A CN108994452 A CN 108994452A CN 201810765646 A CN201810765646 A CN 201810765646A CN 108994452 A CN108994452 A CN 108994452A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention provides a kind of multiple beams to process light path system with optical axis, it is characterized in that, it include: laser emission element, including at least one laser, at least one bundling device, bundling device is for being merged into the same optical axis light beam for the laser beam that laser emits and carrying out being transmitted to a laser scan unit；Laser beam is reflexed to processing plane and is scanned processing to workpiece by laser scan unit for receiving the laser beam of laser emission element, and by the galvanometer component in laser scan unit；Galvanometer component includes multiple groups XY scanning galvanometer, and multiple groups XY scanning galvanometer realizes big width laser processing technology for increasing scanning breadth using independent scan or cooperation scanning；During Laser beam propagation, bundling device and galvanometer inter-module are additionally provided with focus lamp；Control unit, the control card including IPC industrial personal computer, the control card of laser and galvanometer component；For controlling timesharing, the division of labor work of galvanometer and/or laser.
Description
Technical field
The present invention relates to laser processing manufacturing fields, and in particular to the coaxial large format system of processing of different mode multi-laser beam
And method.
Background technique
Field is fabricated in laser fast shaping, residual stress is big in usual molding metal works and physics, mechanics
Performance is bad.At present generally use in this field multi-pass system or substrate heating method realize, multi-pass system compared with
Mostly use area coincidence control or realize effect realization processing before and after hot spot on machining locus, it is complicated there are process and also when
The deficiencies of empty span is big, function and effect are bad, system architecture is complicated；And basal plate preheating is used, coupling factor is more, heat-affected zone
Greatly, the advantage of excessive temperature limitation laser accurate system processing, it is difficult to further apply.
Therefore, the laser that present invention design can use different-waveband in process carries out coaxial processing such as Nd:
YAG laser and CO2 laser etc. are then melted and are preheated respectively by this two beams laser of Time-sharing control, may finally
Realize that the residual stress of workpiece reduces, further, it is also possible to which carrying out melting bath stirring using the laser of different working modes makes liquid
Crystal grain refinement, the even tissue of state metal material, so that metal works intensity, hardness are high, plasticity and toughness are better.
On the other hand, the surface of 3D printing is rougher, and surface smoothness Ra is greater than 12.5, therefore can complete it in workpiece
Certain heat treatment is carried out to its surface afterwards, so that the surface quality of metal works is more preferable.Further, it is also possible to utilize ultraviolet laser
Device carries out skin processing, so that the performances such as workpiece surface roughness are more preferable.
In current 3D printing equipment, breadth is relatively more less than the equipment of 300mm × 300mm, therefore the present invention provides
A kind of multiple beam with shaft multifunctional large format 3D printing device, can solve rapid shaping processing in frequency dividing timesharing it is coaxially complete
At preheating, fusing, stirring, reinforcing and finishing, so that workpiece performance is more preferable, print size is bigger, while can integrate ultraviolet
Laser beam carries out material surface the post-processing operation such as to clean.
Summary of the invention
The embodiment of the invention provides a kind of multiple beams with optical axis large format 3D printing system, realizes in coaxial optical path more
Function processing, and propose the printing that large format is realized in single light path system.Include: in the system
Laser emission element, including at least one laser, at least one bundling device, the bundling device are used to swash described
The laser beam of light device transmitting is merged into the same optical axis light beam and carries out being transmitted to a laser scan unit；
The laser scan unit for receiving the laser beam of the laser emission element, and passes through the laser
Laser beam is reflexed to processing plane and is scanned processing to workpiece by the galvanometer component in scanning element；
The galvanometer component includes multiple groups XY scanning galvanometer, and the multiple groups XY scanning galvanometer is swept using independent scan or cooperation
It retouches, for increasing scanning breadth, realizes big width laser processing technology；
During Laser beam propagation, the bundling device and the galvanometer inter-module are additionally provided with focus lamp；
Control unit, the control card including IPC industrial personal computer, the control card of the laser and the galvanometer component；With
In the timesharing, the division of labor work that control the galvanometer and/or the laser.
Preferably, the timesharing, division of labor work include that at least one described laser concurrently or separately works, and are used for timesharing
The laser for controlling multiple and different types completes the laser processing of different function.
Preferably, it works together after the laser frequency dividing control worked at the same time including different wave length.
Preferably, the laser emission element further includes a collimator, and the light beam for handling the bundling device becomes
For collimated light beam.
Preferably, the bundling device realizes the reflection and/or transmission of laser beam by using different plated films.
Preferably, the laser number be one when, the bundling device does not work, for realizing material molding, beat
Mark laser processing technology.
Preferably, described control unit frequency dividing control controls the laser by bus mode by the IPC industrial personal computer
Control card and the galvanometer control card, control strategy use aptitude manner, based on microcosmic and the macroscopic view that is situated between molten bath and geometric form
Looks feedback technique realizes closed-loop control.
Another embodiment of the invention additionally provides a kind of multiple beam suitable for the system with optical axis processing method,
Include:
At least beam of laser light beam of the same optical axis for processing is obtained, the laser beam is by laser emission element
It provides, the laser emission element includes at least one laser, at least one bundling device, the bundling device is used for will be described sharp
The laser beam of light device transmitting is merged into the same optical axis light beam and carries out being transmitted to a laser scan unit；
The laser scan unit receives the laser beam of the laser emission element, and passes through the laser scanning list
Laser beam is reflexed to processing plane and is scanned processing to workpiece by the galvanometer component in member；；Wherein, the galvanometer component
Including multiple groups XY scanning galvanometer, the multiple groups XY scanning galvanometer is using independent scan or cooperation scanning, for increasing scanning breadth,
Realize big width laser processing technology；
Wherein, scanning mode includes that at least one described laser concurrently or separately works, and passes through control unit timesharing control
The laser for making multiple and different types completes the laser processing of different function.
It is an object of the invention to which the laser of different mode, wavelength to be integrated in a light path system, then pass through
Time-sharing work completes the processes such as the preheating, fusing, stirring, reinforcing and the finishing that need during 3D printing, can be subtracted significantly with this
The installation and debugging difficulty of skinny device.
Detailed description of the invention
Fig. 1 is to process light path system schematic diagram with shaft multifunctional for multiple beam；
Fig. 2 is the working time schematic diagram that multi-beam laser divides Time-sharing control；
The working time schematic diagram of Fig. 3 multi-beam laser frequency dividing Time-sharing control；
Fig. 4 is that the high efficiency large format list galvanometer system of another embodiment of the present invention processes light path schematic diagram.
Specific embodiment
This method is mainly used in material increasing field and is carried out in advance using different laser beams coaxials to the same area timesharing
Multiple beam, can be coaxially integrated with a light path system and be realized above functions by heat, fusing, melting bath stirring and surface treatment,
Reduce the design installation and debugging of multi-pass system to be conducive to obtain for molten bath and the multimode laser processing of machining area multi-space
Obtain comprehensive laser processing effect.
One kind of the invention for 3D printing multiple beam with shaft multifunctional process light path system by the following embodiments and the accompanying drawings and
Attached drawing provides.
As shown in Figure 1, being a kind of multiple beam of the embodiment of the present invention with optical axis system of processing, comprising:
Laser emission element, including at least one laser, at least one bundling device, the bundling device are used to swash described
The laser beam of light device transmitting is merged into the same optical axis light beam and carries out being transmitted to a laser scan unit.
In the present embodiment, laser can choose continuous wave laser, also can choose pulse laser.In other implementations
In example, the wave band of laser can also be replaced according to actual needs；Even, more light beams are added by the method.Example
Such as, it is changed when the output time of each laser beam, operating power, impulse form can be according to actual processings.Laser
Quantity, operating mode, wave band and function are not limited to proposed by the present invention.
In the present embodiment, the laser emission element further includes a collimator, for handle the bundling device
Light beam becomes collimated light beam.
As shown in Figure 1, in the present embodiment, laser assembly 1 includes first laser device 11, second laser 12, third
Laser 13.Bundling device component 2 includes the first bundling device 21 and the second bundling device 22.Galvanometer component 5 includes the first galvanometer 51, the
Two galvanometers 52, third galvanometer 53 and the 4th galvanometer 54.Wherein, first laser device 11 and second laser 12 can pass through first
The light that bundling device 21 synthesizes a branch of same optical axis is transmitted, and the quantity of laser can be increased according to processing,
Such as further include laser 13, add second bundling device 22 that the conjunction of laser 13 can be realized again after the first bundling device 21
Beam.The bundling device realizes the reflection and/or transmission of laser beam by using different plated films.
The laser scan unit for receiving the laser beam of the laser emission element, and passes through the laser
Laser beam is reflexed to processing plane and is scanned processing to workpiece by the galvanometer component 5 in scanning element.It is passed in laser beam
In defeated process, focus lamp 4 is additionally provided between the bundling device 22 and the galvanometer component 5.
The galvanometer component includes multiple groups XY scanning galvanometer, and the multiple groups XY scanning galvanometer is swept using independent scan or cooperation
It retouches, for increasing scanning breadth, realizes big width laser processing technology.
As shown in Figure 1, the laser beam that focus lamp 4 exports emits to XY galvanometer 51, the laser light that XY galvanometer 51 reflects
Beam can be both reflexed to by XY galvanometer 53 in processing plane 6, can also be reflexed to by XY galvanometer 54 in processing plane 6, and
Four XY galvanometers with timesharing or can work at the same time.
In the present embodiment, collimator, galvanometer and focus lamp can penetrate after special plated film and reflect specified wavelength,
Collimator and focus lamp effect are respectively that light beam is become directional light and focusing.
Control unit, the control card including IPC industrial personal computer, the control card of the laser and the galvanometer；For controlling
Make timesharing, the division of labor work of the galvanometer and/or the laser.
In the present embodiment, described control unit frequency dividing control is passed through described in bus mode control as the IPC industrial personal computer
Laser control card and the galvanometer control card, control strategy use aptitude manner, based on it is microcosmic and be situated between macroscopic view molten bath and
Geometrical morphology feedback technique realizes closed-loop control, to effectively solve the Forming Quality control problem of existing 3D printing.
It is coaxial by couple with working process light by laser sending optical signal first, through paths and act on
Backspace laser afterwards, laser is interior to be arranged sensor, can be by synchronously feeding back microcosmic molten bath (70 μm~100 μ out with processing
M) and the information of cooling post-processing part geometrical morphology (250mm × 250mm), in order to guarantee that validity needs to build using intellectual technology
The relationship of microcosmic and the macroscopic view that is situated between molten bath and geometrical morphology and the mechanical performance and dimensional accuracy product that increase material product is found, and is passed through
Intelligent control method carries out prediction and judgement processing, to realize the mechanical performance and dimensional accuracy for increasing material product in technical process
The closed-loop process of product.
In the present embodiment, timesharing, division of labor work include that at least one described laser concurrently or separately works, for dividing
When control the lasers of multiple and different types, complete the laser processing of different function.Wherein, described to work at the same time including different waves
It works together after long laser frequency dividing control.When laser number is one, the bundling device does not work, for realizing material
The molding of material, mark laser processing technology.
It is provided in an embodiment of the present invention to share the same light the original of shaft multifunctional processing method and light path system for 3D printing multiple beam
Reason are as follows: sweeping for different function may be implemented by the bundling device optical element of special plated film and the system of industrial control system frequency dividing control
System of processing is retouched, different types of laser is merged into an optical axis light beam by bundling device first and is transmitted, and passes through standard
Straight device, XY scanning galvanometer and focus lamp, the laser beam of last multiple wavelength all focus on working face and are scanned forming.
Scanning galvanometer system provided in an embodiment of the present invention is led to for realizing the molding of substantially surface parts in 3D printing equipment
Control of the industrial control system to 51 corner of X galvanometer is crossed, realizes light in the reflection of X galvanometer 52 and different Y galvanometers 53/54, thus real
The now scanning of more large format.Wherein, XY galvanometer can be configured according to specific processing scanning direction.
In the embodiment of the present invention, in order to improve large format 3D printing efficiency, can increase several groups of identical light path systems into
Enter into single sweep galvanometer system, as shown in Fig. 4.
As shown in figure 4, including two independent laser scanning optical paths.Every scanning optical path separately includes one group of XY galvanometer.
For example, a wherein scanning optical path are as follows: first laser device 11a, second laser 12a, third laser 13a, the first bundling device
21a, the second bundling device 22a, collimator 31a, focus lamp 41a and X galvanometer 54 and Y galvanometer 53.
Every processing optical path can work at the same time or time-sharing work.
The following are added using the coaxial Multi-functional scanning molding light path system of multi-laser beam provided in an embodiment of the present invention
The example of work, such as:
In the processing of metal material rapid shaping, since the fusing point of metal material is high, the inside workpiece in powder fusing
Residual stress is larger, and easily there is a situation where buckling deformations.Therefore system controls what CO2 laser melted needs before melting
Region carries out pre- thermosetting steady temperature field to reduce the size of residual stress.Pass through another beam YAG laser of system Time-sharing control
Device carry out preheated zone fusing, due to metal powder be preheated, and different metal fusing point is different, therefore melt when it is required
Energy is different, i.e., laser can change in the time of a certain regional work according to the difference of metal material.In metal powder
After molten, the molten bath melted is stirred using adjustable pulse laser, keeps component distributing in metallic solution more evenly, golden
It is thinner to belong to crystal grain, to improve the performance of metal works.It, can be with wherein since the surface of workpiece of rapid shaping is of poor quality
A certain light beam polishes surface, if necessary to finer processing, can carry out Precision Machining using ultraviolet laser.
Another embodiment of the invention also proposed a kind of multiple beam with optical axis processing method, comprising:
At least beam of laser light beam of the same optical axis for processing is obtained, the laser beam is by laser emission element
It provides, the laser emission element includes at least one laser, at least one bundling device, the bundling device is used for will be described sharp
The laser beam of light device transmitting is merged into the same optical axis light beam and carries out being transmitted to a laser scan unit；
The laser scan unit receives the laser beam of the laser emission element, and passes through the laser scanning list
Laser beam is reflexed to processing plane and is scanned processing to workpiece by the galvanometer component in member；；Wherein, the galvanometer component
Including multiple groups XY scanning galvanometer, the multiple groups XY scanning galvanometer is using independent scan or cooperation scanning, for increasing scanning breadth,
Realize big width laser processing technology；
Wherein, scanning mode includes that at least one described laser concurrently or separately works, and passes through control unit timesharing control
The laser for making multiple and different types completes the laser processing of different function.
Different wave length not only may be implemented in this method and the laser of operating mode works independently, and can also realize different waves
It works together after long laser frequency dividing control.
Wherein, the laser of single type is processed, which is similar to the scanning of single laser beam, and at this time the
One bundling device 21, the second bundling device 22 do not work, and the laser such as molding, the mark of metal material and nonmetallic materials may be implemented and add
Work technique.
But the problems such as inadequate, residual stress is big since there are workpiece consistency in Single wavelength process, it is therefore desirable to
The laser that multiple and different types are swashed by Time-sharing control makes it complete the laser processing of different function.Such as CO2 laser and
The functions such as preheating, fusing, melting bath stirring may be implemented in the frequency dividing control of Nd:YAG laser.Further, it is also possible to realize reinforcing and
The post-processing functions such as finishing, workpiece surface post-processing can integrate ultraviolet laser and processed.
In addition, the type of each laser, watt level and control mode can be according to different metal powder and practical need
Change, obtains multiple beam and share the same light shaft multifunctional processing technology.
The invention will be further described for 1- attached drawing 3 with reference to the accompanying drawing.Wherein, first laser device is CO2 laser, the
Dual-laser device is Nd:YAG laser.
CO2 laser major function in the light path system is the stirring of material molding preheating and molten bath, and YAG laser
For melting powder, what it is due to two-beam effect is the same area, and two beam laser are focused.As shown in Figure 1,
This example is carried out using square-wave pulse mode, but a kind of not limited to this pulse mode of the present invention.
When multiple beam can be coaxially integrated by one light path system, as shown in Fig. 2, dividing timesharing in control in time t
Act on laser 1, laser 2 and the interior operating distance S and movement speed V1 and time by vibration mirror scanning linkage control of laser n, time t
T meets equation of motion S=V1 × t.
By the control card industrial control system connected by IPC with bus, the frequency dividing work and vibration of multiple laser are realized
The scan time delay of mirror system.
Coaxially divide Time-sharing control as Fig. 3 (a) is shown in the light of two beam laser, first control laser 1 go out light can be with
Realize powder preheating, then laser 2 carries out out light and melts to the region of preheating, and laser 1 is then controlled its work
Mode is that pulse is exported melting bath stirring, finally carries out finishing with laser 2 in molded surface, including Surface heat-treatent, reinforcing,
Polishing etc..
Fig. 3 (b) is that multi-beam laser device controls out time of light, every beam laser goes out the time of light, laser power can be with
It is modified according to actual process needs.
The present invention provide it is a kind of share the same light shaft multifunctional large format processing 3D printing light path system for 3D printing multiple beam, should
Method is by refocusing after a branch of same optical axis of the laser beam of different working modes and wavelength synthesis by bundling device to same work
Region carries out multiple beam timesharing processing, realizes the molding multi-functional processing of metal powder.It is processed that the present invention is suitable for 3D printing
Reduce shaping workpiece residual stress in journey, and the performances such as the intensity, toughness of workpiece are increased by melting bath stirring, passes through particular form
It can also be achieved finishing processing.
In conclusion the present invention is unique in similar product and practicability, so proposing patent application in accordance with the law.On
Example is stated, is only used for illustrating the present invention, in the range for not departing from spirit of that invention, those who are familiar with this art make with it
Various modifications, modification and application, should be included in the scope of the present invention.
Claims (8)
1. a kind of multiple beam processes light path system with optical axis characterized by comprising
Laser emission element, including at least one laser, at least one bundling device, the bundling device are used for the laser
The laser beam of transmitting is merged into the same optical axis light beam and carries out being transmitted to a laser scan unit；
The laser scan unit for receiving the laser beam of the laser emission element, and passes through the laser scanning
Laser beam is reflexed to processing plane and is scanned processing to workpiece by the galvanometer component in unit；
The galvanometer component includes multiple groups XY scanning galvanometer, and the multiple groups XY scanning galvanometer is scanned using independent scan or cooperation,
Breadth is scanned for increasing, realizes big width laser processing technology；
During Laser beam propagation, the bundling device and the galvanometer inter-module are additionally provided with focus lamp；
Control unit, the control card including IPC industrial personal computer, the control card of the laser and the galvanometer component；For controlling
Make timesharing, the division of labor work of the galvanometer and/or the laser.
2. the system as claimed in claim 1, which is characterized in that the timesharing, division of labor work include at least one described laser
Device concurrently or separately works, and for the laser of the multiple and different types of Time-sharing control, completes the laser processing of different function.
3. system as claimed in claim 2, which is characterized in that the laser frequency dividing control worked at the same time including different wave length
It works together after system.
4. the system as claimed in claim 1, which is characterized in that the laser emission element further includes a collimator, is used for
The light beam that the bundling device is handled is become into collimated light beam.
5. the system as claimed in claim 1, which is characterized in that the bundling device realizes laser beam by using different plated films
Reflection and/or transmission.
6. the system as claimed in claim 1, which is characterized in that when the laser number is one, the bundling device not work
Make, molding, mark laser processing technology for realizing material.
7. the system as claimed in claim 1, which is characterized in that described control unit frequency dividing control is led to by the IPC industrial personal computer
It crosses bus mode and controls the laser control card and the galvanometer control card, control strategy uses aptitude manner, based on micro-
Closed-loop control is realized in the molten bath and geometrical morphology feedback technique of sight and the macroscopic view that is situated between.
8. a kind of multiple beam suitable for system described in claim 1-7 is the same as optical axis processing method characterized by comprising
At least beam of laser light beam of the same optical axis for processing is obtained, the laser beam is mentioned by laser emission element
It include at least one laser for, the laser emission element, at least one bundling device, the bundling device is used for the laser
The laser beam of device transmitting is merged into the same optical axis light beam and carries out being transmitted to a laser scan unit；
The laser scan unit receives the laser beam of the laser emission element, and by the laser scan unit
Galvanometer component, by laser beam reflex to processing plane processing is scanned to workpiece；；Wherein, the galvanometer component includes
Multiple groups XY scanning galvanometer, the multiple groups XY scanning galvanometer are realized using independent scan or cooperation scanning for increasing scanning breadth
Big width laser processing technology；
Wherein, scanning mode includes that at least one described laser concurrently or separately works, more by control unit Time-sharing control
A different types of laser, completes the laser processing of different function.
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| CN109894737A (en) * | 2019-04-17 | 2019-06-18 | 深圳信息职业技术学院 | A kind of the laser polishing device and method of metal curved surface |
| CN111906306A (en) * | 2020-06-10 | 2020-11-10 | 上海航天设备制造总厂有限公司 | Multi-wavelength laser processing optical path system of melting additive manufacturing equipment |
| WO2022053005A1 (en) * | 2020-09-14 | 2022-03-17 | 华中科技大学 | Double-beam slm forming device and method considering both forming efficiency and forming precision |
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| CN112338202A (en) * | 2020-10-15 | 2021-02-09 | 上海交通大学 | Metal material 3D printing method, system and equipment based on mixed laser source |
| CN112775443A (en) * | 2020-12-02 | 2021-05-11 | 上海航天设备制造总厂有限公司 | Single-laser large-breadth galvanometer movable 3D printing device and method |
| CN115446462A (en) * | 2022-08-31 | 2022-12-09 | 哈尔滨工业大学 | Femtosecond laser-based optical element surface microstructure two-step processing method |
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Application publication date: 20181214 |