CN109940284A - A kind of circuit board golden finger laser cutting method and system - Google Patents
A kind of circuit board golden finger laser cutting method and system Download PDFInfo
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- CN109940284A CN109940284A CN201910075323.XA CN201910075323A CN109940284A CN 109940284 A CN109940284 A CN 109940284A CN 201910075323 A CN201910075323 A CN 201910075323A CN 109940284 A CN109940284 A CN 109940284A
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Abstract
The present invention relates to a kind of circuit board golden finger laser cutting method and systems.This method comprises: using referring to that an insulating layer removes laser beam and golden finger cutting laser beam projects to wiring board region to be cut is scanned processing, the laser peak power density that insulating layer removes the projection hot spot in laser beam insulating layer between finger region to be cut between finger is less than golden finger material laser processing threshold value, and insulating layer material laser machines threshold value between being greater than or equal to finger, golden finger cuts laser beam and is greater than or equal to golden finger material laser processing threshold value in the laser peak power density of the projection hot spot in golden finger region to be cut；Insulating layer removing laser beam is used for the insulating layer region processing to be cut between finger and forms cavity between finger, and golden finger cutting laser beam forms joint-cutting for processing in the circuit board, and empty both sides of the edge are located at the both sides of the edge outside of joint-cutting.When technical solution of the present invention can solve wiring board and is cut by laser, the micro-short circuit problem that is generated on golden finger.
Description
Technical field
The present invention relates to technical field of laser processing, and in particular to a kind of circuit board golden finger laser cutting method and is
System.
Background technique
The continuous growth of portable electronic product demand, push wiring board from single side develop to two-sided, multilayer, it is flexible with
And rigid-flex combined board, and constantly develop to high-precision, high density and high reliability direction.Flex circuit application (FPC plate) substrate
For copper, assist side matrix is needed to cover one layer of cover film, covering membrane material is generally polyimides, and solid glue will be covered at high temperature
Epiphragma is combined closely with circuit board substrate, is pressed together on circuit board substrate surface and is played a protective role.And the later period of FPC plate production needs
Shape is processed, has row's golden finger for being attached with other electronic products at shape.
So-called golden finger, also referred to as winding displacement or line row, refer to the square pad of the equidistant arranged distribution of a row, because of its surface layer
The conduction through copper facing, tin plating, gold-plated or nickel plating, shaped like finger, therefore be known as " golden finger ", be chiefly used in computer memory, Control card,
LCD display driving and other function connects components etc..
As the raising of integration level of electronic equipment connects to save the space of golden finger component connection and improving quality of connection
Size of the interpolating unit position from edges of boards is reduced constantly, and golden finger refers to that a spacing constantly reduces, and has been narrowed down to 100 microns at present and has been arrived
25 microns.It is required however, traditional numerical control processing and mould punching is difficult to reach to be die cut, the highly dense distribution of the route of golden finger,
The subtle offset of position will make golden finger misplace in this connection, will lead to golden finger signal communication exception, so that
Yields is not high.
The method that industry mainly uses laser cutting golden finger at present, but for this high density golden finger, whether
Ultraviolet nanosecond laser or ultra-short pulse laser lead to copper since polyimides and copper foil are different from laser interaction mechanism
Foil laser machines the laser processing threshold value that threshold value is much larger than polyimides, there are problems that the carbonization of golden finger insulating materials, and lead
Micro-short circuit occurs between causing golden finger to refer to, influences the quality of golden finger or even electronic equipment.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of circuit board golden finger laser cutting method and system.
In a first aspect, the present invention provides a kind of circuit board golden finger laser cutting methods, this method comprises:
Using referring to that insulating layer removes laser beam and golden finger cuts laser beam projects to wiring board region to be cut and carries out
Scanning machining, wherein insulating layer removes the projected light in insulating layer to be cut region of the laser beam between golden finger between the finger
The laser peak power density of spot is less than golden finger material laser processing threshold value, and is greater than or equal to insulating layer material laser between finger
Threshold value is processed, the golden finger cutting laser beam is big in the laser peak power density of the projection hot spot in golden finger region to be cut
In or equal to the golden finger material laser processing threshold value；Insulating layer is removed laser beam and is used between golden finger between the finger
Insulating layer region processing to be cut forms cavity, and the golden finger cutting laser beam forms joint-cutting for processing in the circuit board,
Wherein, the both sides of the edge in the cavity are located on the outside of the both sides of the edge of the joint-cutting.
Second aspect, the present invention provides a kind of circuit board golden finger laser cutting system, which includes:
Light source module swashs for generating to be projected to wiring board region to be cut and be scanned insulating layer between the finger of processing and remove
Light beam and golden finger cut laser beam, wherein it is to be cut to remove insulating layer of the laser beam between golden finger for insulating layer between the finger
The laser peak power density for cutting the projection hot spot in region is less than golden finger material laser processing threshold value, and is greater than or equal between finger
Insulating layer material laser machines threshold value, laser of the golden finger cutting laser beam in the projection hot spot in golden finger region to be cut
Peak power density is greater than or equal to the golden finger material laser processing threshold value.
Machining control module, it is to be cut for insulating layer of the insulating layer removing laser beam between golden finger between controlling the finger
It cuts region processing and forms cavity, control golden finger cutting laser beam and process in the circuit board and form joint-cutting, wherein the sky
The both sides of the edge in hole are located on the outside of the both sides of the edge of the joint-cutting.
The beneficial effect of circuit board golden finger laser cutting method provided by the invention and system is, low peak power is close
Insulating layer is removed laser beam spot and is combined with the golden finger of peak power density cutting laser beam spot between the finger of degree, complete
During at golden finger wiring board laser cutting, the gold of laser beam flying cutting non-metal material is removed by insulating layer between referring to
Insulating layer material between Fingers refers to that laser beam without influencing golden finger, and is cut by golden finger in an insulating layer cavity to be formed
The golden finger material of scan incision metal material, to form joint-cutting and cut off golden finger.In the Vertical Square of laser scanning direction
To since the both sides of the edge in cavity are located on the outside of the both sides of the edge of joint-cutting, that is, the width of joint-cutting is less than the width in cavity,
In addition, multiple cavities and joint-cuttings also with multiple successively cross arrangements golden finger and refer to an insulating layer region and present and successively hand over
Pitch the form of arrangement.That is, the golden finger cutting laser beam spot of peak power density can cut golden finger but not
Insulating layer material between the finger of empty periphery can be cut to, therefore not will cause golden finger and refer to a height for insulating layer cavity skirt materials
Temperature decomposes carbonization and golden finger evaporated metal particle is attached between referring on insulating materials cutting end face, to will not cause
Golden finger refers to a micro-short circuit.
In addition, the present invention also provides a kind of circuit board golden finger laser cutting methods, this method comprises:
When wiring board is single side golden finger wiring board, it is opposite that laser beam face where with golden finger is removed using insulating layer
Wiring board another side be projected on the insulating layer in wiring board region to be cut and carry out scanning machining, laser is cut using golden finger
The golden finger that beam is projected to wiring board region to be cut is scanned processing, wherein it is peak value that the insulating layer, which removes laser beam,
Power is greater than or equal to the ultra-short pulse laser of insulating layer material laser processing threshold value；The insulating layer is removed laser beam and is used for
Processing forms cavity on the insulating layer at the golden finger back side, and the golden finger cutting laser beam on golden finger for processing shape
At joint-cutting, wherein the both sides of the edge in the cavity are located on the outside of the both sides of the edge of the joint-cutting.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is single side golden finger wiring board sectional view；
Fig. 2 is single side golden finger wiring board top view；
Fig. 3 is two-sided golden finger wiring board sectional view；
Fig. 4 is that circuit board golden finger is cut by laser effect diagram in the prior art；
Fig. 5 is a kind of flow diagram of circuit board golden finger laser cutting method of the embodiment of the present invention；
Fig. 6 is a kind of flow diagram of circuit board golden finger laser cutting method of the embodiment of the present invention；
Fig. 7 is that the circuit board golden finger of the embodiment of the present invention is cut by laser effect diagram；
Fig. 8 is that the circuit board golden finger of the embodiment of the present invention is cut by laser effect diagram；
Fig. 9 is that the circuit board golden finger of the embodiment of the present invention is cut by laser effect diagram；
Figure 10 is a kind of flow diagram of circuit board golden finger laser cutting method of the embodiment of the present invention；
Figure 11 is that the single side golden finger wiring board of the embodiment of the present invention is cut by laser effect diagram；
Figure 12 is a kind of structural schematic diagram of circuit board golden finger laser cutting system of the embodiment of the present invention；
Figure 13 is a kind of structural schematic diagram of circuit board golden finger laser cutting system of the embodiment of the present invention.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
It as depicted in figs. 1 and 2, is single side golden finger wiring board schematic diagram, wherein golden finger 2 is usually equally spaced
On 1 one side surface of insulating layer.Golden finger 2 is generally 25 microns of wide copper billets, and surface is gold-plated again, forms conducting block.Insulating layer 1
The usually materials such as polyimides (PI), modified polyimide (MPI), liquid crystal engineering plastics (LCP) and Teflon.
Two-sided golden finger wiring board is as shown in figure 3, be usually used two-sided copper foil etching plating, about 1 insulating layer
The symmetrical golden finger 2 being equidistantly spaced from surface.
The processing object that wiring board with golden finger is constituted for metal and nonmetallic composite, and the gold of metal material
Finger material laser processing threshold value is typically much deeper than insulating layer material laser processing threshold value between the finger of non-metallic material.Currently, past
Wiring board is cut toward using beam of laser, cutting effect is as shown in figure 4, refer to an insulating materials cutting end face 8 and golden hand
Refer to that cutting end face 9 is generally aligned in the same plane.Since laser peak power is greater than golden finger material laser processing threshold value, also greater than
Insulating layer material laser machines threshold value between finger.When carrying out laser scanning manufacturing, golden finger and refer to an insulating layer material by together
Cutting causes insulating layer material pyrolytic between the finger of golden finger to be carbonized, and golden finger cutting evaporated metal particle will adhere to
Between finger on insulating materials cutting end face 8, carbonized particles and metal evaporation particle will cause golden finger and refer to a micro-short circuit.
As shown in figure 5, a kind of circuit board golden finger laser cutting method of the embodiment of the present invention includes:
S100, using referring to that insulating layer removes laser beam and golden finger cuts laser beam projects to wiring board region to be cut
It is scanned processing, wherein insulating layer removes the throwing in insulating layer to be cut region of the laser beam between golden finger between the finger
The laser peak power density of shadow hot spot is less than golden finger material laser processing threshold value, and is greater than or equal to insulating layer material between finger
Threshold value is laser machined, the golden finger cutting laser beam is close in the laser peak power of the projection hot spot in golden finger region to be cut
Degree is greater than or equal to the golden finger material laser processing threshold value；Between the finger insulating layer remove laser beam be used for golden finger it
Between insulating layer region processing to be cut form cavity, the golden finger cutting laser beam is formed for processing in the circuit board to be cut
Seam, wherein the both sides of the edge in the cavity are located on the outside of the both sides of the edge of the joint-cutting.
In the present embodiment, insulating layer between the finger of low peak power density is removed into laser beam spot and high-peak power is close
The golden finger cutting laser beam spot of degree combines, during completing golden finger wiring board laser cutting, by exhausted between referring to
The golden finger that edge layer removes laser beam flying cutting non-metal material refers to an insulating layer material, refer to insulating layer cavity to be formed and
Golden finger is not influenced, and the golden finger material that metal material is cut in laser beam flying is cut by golden finger, to form joint-cutting simultaneously
Golden finger is cut off.In the vertical direction of laser scanning direction, since the both sides of the edge in cavity are located at the two sides of joint-cutting
On the outside of edge, that is, the width of joint-cutting is less than the width in cavity, in addition, multiple cavities and joint-cutting are also with multiple successively cross arrangements
Golden finger and refer to an insulating layer region and the form of successively cross arrangement be presented.That is, the gold of peak power density
Finger cutting laser beam spot can cut golden finger but not cut to insulating layer material between empty peripheral finger, therefore will not
Golden finger is caused to refer to that the pyrolytic carbonization of an insulating layer cavity skirt materials and golden finger evaporated metal particle are attached to finger
Between insulating materials cutting end face on, so that golden finger will not be caused to refer to a micro-short circuit.
Wherein, empty process is formed positioned at using golden finger cutting laser using referring to that an insulating layer removing laser beam is processed
Shu Jiagong is formed after the process of joint-cutting, or to be formed the process in cavity using referring to that insulating layer is removed a laser beam and processed and be located at and adopt
Before processing the process to form joint-cutting with golden finger cutting laser beam, or uses and refer to that an insulating layer removes a laser beam and processes to be formed
Empty process is located at the synchronous progress of process processed using golden finger cutting laser beam and to form joint-cutting.
It should be noted that on insulating layer cavity use the lower laser of peak power process, laser with
When insulating layer material interacts, the insulating layer material of scanning area absorbs laser and is heated, empty surrounding insulating layer material temperature
Degree can be controlled in material carburizing temperature hereinafter, making empty surrounding insulation material not to be carbonized decomposition, therefore can to insulate
The empty edge of layer does not have carbonized particles, and then can be to avoid golden finger micro-short circuit.
Preferably, as shown in fig. 6, a kind of circuit board golden finger laser cutting method of the embodiment of the present invention includes following step
It is rapid:
S111 removes laser beam assist side region to be cut using insulating layer between the finger and is scanned processing, described
Insulating layer removes insulating layer to be cut region processing of the laser beam between golden finger and forms the cavity between finger.Wherein,
The cavity surrounding insulation material edge is without conductive particle, or not will lead to golden finger at least and refer to a micro-short circuit.
S112 is scanned processing, the gold hand using golden finger cutting laser beam assist side region to be cut
Refer to that cutting laser beam is used for the processing on the golden finger of the empty side and forms the joint-cutting.
Specifically, refer to that an insulating layer is removed a laser beam assist side region 4 to be cut and carried out as shown in fig. 7, using first
Scanning machining, it should be noted that wiring board region 4 to be cut is shown as a center line in figure, it means that laser beam can
Once to cut completion along this center line, can also be continually scanned for along a plurality of straight line with this centerline parallel, to complete to cut.
Since the peak power density of insulating layer removing laser beam spot between referring to is relatively low, removing laser beam by insulating layer between referring to can
To control the temperature in the region to be cut of insulating layer 1, so that material melts to form cavity 3, carbonization, and peak power are reduced to the greatest extent
Insulating layer, which removes laser beam spot, between the relatively low finger of density can not also cut golden finger 2, reduce the influence to golden finger 2,
Or on golden finger 2 have injury but influence it is limited, belong to can tolerance range can also receive.For example, by using picosecond or femtosecond arteries and veins
Insulating layer removes laser beam between wide laser serves as finger, it, which can quickly be removed, refers to that an insulating layer material forms cavity, still
Due to pulse energy very little, the rate for removing golden finger metal is especially slow, has injury to golden finger 2 but influence is limited, belonging to can
Tolerance range.
Then processing is scanned using golden finger cutting laser beam assist side region 4 to be cut, due to usually primary
Or cutting is repeated several times golden finger 2 can be cut off, golden finger cut laser beam can only center line in figure carry out it is primary or
Scanning is repeated several times in person.As shown in figure 8, corresponding joint-cutting 5 is formed on golden finger 2, at this point, the width of joint-cutting 5 is cut with golden finger
The diameter that laser beam is cut in the projection hot spot in golden finger region to be cut is identical.Since insulating layer removes laser beam between first passing through finger
Cavity 3 is processed, and the width of joint-cutting 4 is less than the width in cavity 3, then golden finger cutting laser beam will not be cut between finger
Insulating layer 1, and then not will cause 1 pyrolytic of insulating layer carbonization, meanwhile, golden finger cutting laser beam cutting golden finger 2 draw
The evaporated metal particle risen is attached to refer between the probability in insulating layer cavity 3 will also be lower.
As shown in figure 9, insulating materials cutting end face 6 between the finger of the golden finger wiring board after cutting, that is, cavity 3
End face has inside contracted certain distance to non-material to be cut direction relative to golden finger cutting end face 7, this will to a certain extent
Between avoiding 2 evaporated metal particle of golden finger from being attached to finger on insulating materials cutting end face 6, reduce micro- short between the finger of golden finger 2 occurs
A possibility that road.
Preferably, as shown in Figure 10, a kind of circuit board golden finger laser cutting method of the embodiment of the present invention includes as follows
Step:
S121 is scanned processing, the gold hand using golden finger cutting laser beam assist side region to be cut
Refer to that insulating layer to be cut region processing of the cutting laser beam on golden finger between golden finger forms joint-cutting.
S122 removes laser beam assist side region to be cut using insulating layer between the finger and is scanned processing, described
Insulating layer removing laser beam is used to be formed in the region processing that insulating layer region to be cut includes the joint-cutting described between finger
Cavity.Wherein, the empty surrounding insulation material edge is without conductive particle, or not will lead at least golden finger refer between it is micro- short
Road.
Specifically, processing is scanned using golden finger cutting laser beam assist side region to be cut first, due to gold
The peak power density that finger cuts laser beam spot is relatively high, between usually once cutting can will include golden finger and refer to absolutely
The wiring board of edge layer is cut off, in the circuit board, more specifically, the insulating layer region to be cut between golden finger and golden finger
Processing forms joint-cutting.At this point, the projection hot spot of the width of joint-cutting and golden finger cutting laser beam in golden finger region to be cut
Diameter is identical.
Then it uses and refers to that an insulating layer removes a laser beam assist side region to be cut and is scanned processing, waited in insulating layer
Cutting region includes that the region processing of above-mentioned joint-cutting forms cavity.That is, insulating layer is to be cut after processing forms cavity
Region will process the joint-cutting formed without before.
Since the peak power density of insulating layer removing laser beam spot between referring to is relatively low, first, refer to that an insulating layer is clear
Except laser beam can not cut golden finger, golden finger will not be impacted, second, removing laser beam by insulating layer between referring to can be with
The temperature in insulating layer region to be cut is controlled, so that material melts to form cavity, reduces carbonization to the greatest extent, third is formed in processing
In the process in cavity, the particulate matter being already attached on insulating layer material joint-cutting end face can be removed, further decreases the golden hand of generation
A possibility that referring to micro-short circuit.
Preferably, the specific implementation of a kind of circuit board golden finger laser cutting method of the embodiment of the present invention includes:
It uses simultaneously and refers to that an insulating layer removes laser beam and golden finger cutting laser beam assist side region to be cut carries out
Scanning machining is processed on golden finger by golden finger cutting laser beam and forms the joint-cutting, by insulating between the finger
Layer removes insulating layer to be cut region processing of the laser beam between golden finger and forms the cavity.Wherein, around the cavity
Insulating materials edge is without conductive particle, or not will lead to golden finger at least and refer to a micro-short circuit.
Specifically, refer to that an insulating layer removes laser beam and golden finger cutting laser beam while irradiating wiring board area to be cut
Domain, golden finger cutting laser beam are used to cut golden finger, refer to that an insulating layer removes a laser beam and refers to an insulating layer cavity for processing,
And the latter can carry out laser heating and laser cleaning in the former cutting process to the golden finger cut, further assist
Golden finger cutting laser beam is improved to the cutting efficiency of golden finger.
Twice laser beam can be cut always simultaneously, it is, referring to that an insulating layer removes laser beam and golden finger is cut
It cuts laser beam and to the golden finger on wiring board and refers to that an insulating layer is scanned processing, due to peak power difference, between referring to absolutely
Edge layer, which removes laser beam, will not influence the processing of golden finger, can preheat instead to golden finger, improve golden finger cutting
The processing efficiency of laser beam.Twice laser beam can also be spaced and be cut, it is, assist side region to be cut is come
It when flyback retrace campaign, when region to be cut by golden finger, is cut using only golden finger cutting laser beam, and works as and pass through
Between finger insulating layer band cutting region when, using only between finger insulating layer remove laser beam cut, can also according to the actual situation,
When by a certain region, cut two beam laser beams.It not only can solve golden finger and refer to asking for a micro-short circuit
Topic, also can be improved processing efficiency.
Preferably, the method also includes following steps:
After completing the processing in the joint-cutting and the cavity, laser beam is removed to the sky using insulating layer between the finger
The edge in hole carries out laser cleaning.
It can be empty side on insulating layer to insulating layer material side wall, more specifically that insulating layer, which removes laser beam, between finger
Edge slope carries out laser cleaning, removes possible carbon dust and metallic particles on slope, micro-short circuit occurs between avoiding golden finger from referring to.
Preferably, the spot diameter that insulating layer removes laser beam between the finger is less than or equal to 500 microns, the golden finger
The spot diameter for cutting laser beam is less than or equal to 40 microns, and the spot diameter that insulating layer removes laser beam between the finger is greater than institute
State the spot diameter of golden finger cutting laser beam.
If using referring to that an insulating layer removes laser beam and golden finger cutting laser beam is only once cut, cavity
Width remove that the spot diameter of laser beam is identical with insulating layer is referred to, the hot spot that width of slit and golden finger cut laser beam is straight
Diameter is identical.The spot diameter that the spot diameter that insulating layer removes laser beam between finger is greater than golden finger cutting laser beam will make cavity
Width is greater than the width of joint-cutting, can avoid insulating layer material carbonization and golden finger evaporated metal particle between referring to and insulate between being attached to finger
Material cuts the problem on end face, so that golden finger be avoided to refer to a micro-short circuit.
For example, golden finger cuts laser beam and refers to that an insulating layer removes a laser beam and is all made of 355 nanometers of ultraviolet lasers hairs
It penetrates, wherein it is 10W@50KHz that golden finger, which cuts laser beam laser power, is 20 microns, between referring in golden finger surface focal beam spot
It is 5W@50KHz that insulating layer, which removes laser beam laser power, and surface of insulating layer hot spot is 100 microns between finger.Then width of slit is
20 microns, empty width is 100 microns, and insulating layer cavity end face is 40 microns relative to golden finger joint-cutting end face distance between referring to.
Insulating layer is removed laser beam and golden finger cutting laser beam and can be issued by same light source between finger, can also be by difference
Light source issues.
It, can be by adjusting focusing focal position of laser, pulsed laser energy, laser arteries and veins when the two is issued by same light source
At least one realization rushed in width and laser pulse repetition frequency refers to that an insulating layer removes laser beam and golden finger cutting laser
The switching of beam.
When the two is issued by different light sources, golden finger cuts laser beam and refers to that an insulating layer removes a laser beam assist side
On the distance between spot center be not more than 40 millimeters.Two laser beams that can be switched fast are configured in this way, being equivalent to
The cutting processing efficiency of golden finger wiring board can be improved in cutter.
More specifically, refer to that an insulating layer removes laser beam and golden finger cutting laser beam closes Shu Houjing and crosses a f-theta
The spot center that spot center and the golden finger that insulating layer removes laser beam between mirror refers to after focusing cut laser beam is overlapped, or between referring to
It is micro- that the dispersion of spot center and the spot center of golden finger cutting laser beam that insulating layer removes laser beam is less than or equal to 100
Rice, that is, the two center spacing are less than or equal to 100 microns.In this way, two beam laser can go out light simultaneously, realize that golden finger is cut
Stitch and refer to the processing in insulating layer cavity.If joint-cutting shifts to an earlier date completion of processing, golden finger cut laser beam can elder generation Guan Guang,
Between finger insulating layer remove laser beam continue out light until cavity completes the process.
Preferably, when the wiring board is single side golden finger wiring board, between the finger insulating layer remove laser beam from
The opposite wiring board another side in face where golden finger is projected between finger and is processed on insulating layer.
It is irradiated from the back side of golden finger institute's assist side side, refers to that an insulating layer removes laser beam and removes insulating layer material
It can be easier to avoid the golden finger surface of injury another side when material.And if subsequent be related to cutting laser beam pair using golden finger
Golden finger is cut, and has just been lacked a layer insulating material, i.e. the cutting workload of insulating layer material below golden finger, can have been mentioned
High processing efficiency.
The circuit board golden finger laser cutting method of the embodiment of the present invention, using the insulation of large spot low peak power density
Layer removes laser beam and refers to that an insulating layer region forms cavity in golden finger, but does not injure golden finger, and use small light spot peak value
Golden finger between the golden finger cutting laser beam cutting cavity of power density, both can achieve the purpose of cutting golden finger,
Since empty width is greater than golden finger width of slit, thus during cut golden finger, golden finger cutting laser contact less than
Insulating layer material between finger not will cause empty edge insulation layer pyrolytic carbonization between finger, and can substantially reduce and be attached between finger
Insulating layer cuts end face, that is, the splatter object at empty edge, can effectively solve to produce in circuit board golden finger cutting process
Raw micro-short circuit problem.
A kind of circuit board golden finger laser cutting method of another embodiment of the present invention includes:
When wiring board is single side golden finger wiring board, it is opposite that laser beam face where with golden finger is removed using insulating layer
Wiring board another side be projected on the insulating layer in wiring board region to be cut and carry out scanning machining, laser is cut using golden finger
The golden finger that beam is projected to wiring board region to be cut is scanned processing, wherein it is peak value that the insulating layer, which removes laser beam,
Power is greater than or equal to the ultra-short pulse laser of insulating layer material laser processing threshold value；The insulating layer is removed laser beam and is used for
Processing forms cavity on the insulating layer at the golden finger back side, and the golden finger cutting laser beam on golden finger for processing shape
At joint-cutting, wherein the both sides of the edge in the cavity are located on the outside of the both sides of the edge of the joint-cutting.
In the present embodiment, it when wiring board is single side golden finger wiring board, can be used never with light source module sending
Insulating layer removes laser beam and golden finger cutting laser beam is processed from the insulation level of wiring board.For example, two beam laser can
It is irradiated respectively from wiring board two in face of it, beam of laser irradiates the surface of insulating layer of route back, and another beam of laser is shone
Penetrate the positive golden finger surface of wiring board；Two beam laser can also irradiate the surface of insulating layer of route back, respectively to insulation
Layer material and golden finger are processed.Wherein, it is ultra-short pulse laser that insulating layer, which removes laser beam, and peak power is high, laser
Pulse width less than 10 nanoseconds, preferably or so 1 nanosecond, or by picosecond, femto-second laser generate.For route plate insulating layer material
For material, processing is carried out using short-pulse laser and belongs to laser cold working, can not generate carbonization with direct gasification insulating layer material
Particle.
It is processed it should be noted that using the high ultra-short pulse laser of peak power to cavity on insulating layer,
When ultra-short pulse laser and insulating layer material interact, the insulating layer material direct boiling of scanning area has little time carbon
Change and decompose, therefore insulating layer cavity edge can be made not have carbonized particles, and then can be to avoid golden finger micro-short circuit.
As shown in figure 11, insulating layer removes laser beam and golden finger cutting laser beam distinguishes assist side region 4 to be cut
It is scanned processing, insulating layer is removed laser beam and only processed on one side from the insulating layer 1 of not set golden finger 2, the sky of generation
Hole 3 is continuous, it is, not only removing the insulating layer material between golden finger 2, while also by the exhausted of 2 back side of golden finger
Edge layer material is removed.Cutting for golden finger 1 can be generated using nanosecond laser, picosecond laser or femto-second laser
Laser beam carry out the cutting of small light spot high-peak power, to form corresponding joint-cutting (not shown), complete golden finger cutting.
In the vertical direction of laser scanning direction, since the both sides of the edge in cavity are located at outside the both sides of the edge of joint-cutting
Side, that is, the width of joint-cutting is less than the width in cavity.That is, golden finger cutting laser beam can cut golden finger but not
The insulating layer material of empty periphery is cut to, therefore not will cause the pyrolytic carbonization of insulating layer cavity skirt materials, and
Golden finger evaporated metal particle is attached on insulating materials cutting end face, so that golden finger will not be caused to refer to a micro-short circuit.
Preferably, laser beam is removed using the insulating layer and processes the process to form the cavity positioned at using the golden hand
Refer to that cutting laser beam is processed after the process to form the joint-cutting, or laser beam is removed using the insulating layer and processes to form institute
The process for stating cavity is located at is processed before the process to form the joint-cutting using golden finger cutting laser beam, or uses institute
State insulating layer remove laser beam process to be formed the cavity process be located at using the golden finger cut laser beam process to be formed
The process of the joint-cutting is synchronous to be carried out.
Preferably, the method also includes following steps:
After completing the processing in the joint-cutting and the cavity, laser beam is removed to the cavity using the insulating layer
Edge carries out laser cleaning.
A kind of circuit board golden finger laser cutting system of the embodiment of the present invention includes:
Light source module swashs for generating to be projected to wiring board region to be cut and be scanned insulating layer between the finger of processing and remove
Light beam and golden finger cut laser beam, wherein it is to be cut to remove insulating layer of the laser beam between golden finger for insulating layer between the finger
The laser peak power density for cutting the projection hot spot in region is less than golden finger material laser processing threshold value, and is greater than or equal between finger
Insulating layer material laser machines threshold value, laser of the golden finger cutting laser beam in the projection hot spot in golden finger region to be cut
Peak power density is greater than or equal to the golden finger material laser processing threshold value.
Machining control module, it is to be cut for insulating layer of the insulating layer removing laser beam between golden finger between controlling the finger
It cuts region processing and forms cavity, control golden finger cutting laser beam and process in the circuit board and form joint-cutting, wherein the sky
The both sides of the edge in hole are located on the outside of the both sides of the edge of the joint-cutting.
Preferably, the machining control module is also used to:
By adjusting focusing focal position of laser, pulsed laser energy, laser pulse width and laser pulse repetition frequency
In at least one of realize that insulating layer between described finger removes the switching of laser beam and golden finger cutting laser beam.
Preferably, the light source module includes:
First light source unit removes laser beam for insulating layer between generating the finger.
Second light source unit, for generating the golden finger cutting laser beam.
Specifically, as shown in figure 12, when light source module 21 only includes a light source unit 211, it can produce processing and swash
Light beam 212, and the first machining control module 22 is incident to through optic path.First machining control module 22 includes scanning galvanometer
221 and be mounted on galvanometer outlet telecentricity flat field mirror 222, telecentricity flat field mirror 222 be used for processing laser beam 212 gather
Coke to form focus on light beam 223, and is swept on 23 surface of golden finger wiring board to be cut for controlling focus on light beam 223
Retouch movement.Second machining control module 24 is controllable to change 223 laser spot of focus on light beam and golden finger wiring board 23 to be cut
The relative position on surface, i.e. defocusing amount size, that is, can be cut with mutual cooperations such as telecentricity flat field mirrors 222 with completing golden finger
It cuts laser beam and refers to that an insulating layer removes the switching of laser beam, and be respectively completed the processing of joint-cutting and cavity.
Wherein, the second machining control module 24 can be the lifting platform of clamping golden finger wiring board 23 to be cut, with
Golden finger wiring board 23 to be cut is driven to move along 223 transmission direction of focus on light beam；It is also possible to be connected in series to swashing in optical path
Light light beam dynamic focusing regulating device or spatial beam shaping device etc..
As shown in figure 13, when light source module 21 includes two light source units, that is, first light source unit 211 and the second light
When source unit 213, the two generates different processing laser beams, such as first light source unit 211 generates golden finger and cuts laser beam
212, the generation of second light source unit 213 refers to that an insulating layer removes laser beam 214.Insulating layer removes laser beam 214 through reflecting between finger
After mirror 216 reflects, after laser beam mirror 215 and golden finger cutting laser beam 212 close beam, obtains and close beam laser beam 217, warp
It crosses optic path and is incident to machining control module 22.Machining control module 22 includes scanning galvanometer 221 and is mounted on galvanometer and goes out
The telecentricity flat field mirror 222 of mouth, telecentricity flat field mirror 222 is focused for pairing beam laser beam 217, to form focus on light beam 223,
And movement is scanned on 23 surface of golden finger wiring board to be cut for controlling focus on light beam 223.Due to focus on light beam 223
In to include that peak power is different be respectively used to cutting golden finger and refer to the laser beam of an insulating layer, pass through focus on light beam 223
Scanning motion can synchronize the processing realized to joint-cutting and cavity.
Reader should be understood that in the description of this specification reference term " one embodiment ", " is shown " some embodiments "
The description of example ", specific examples or " some examples " etc. mean specific features described in conjunction with this embodiment or example, structure,
Material or feature are included at least one embodiment or example of the invention.In the present specification, above-mentioned term is shown
The statement of meaning property need not be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described
It may be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this
The technical staff in field can be by the spy of different embodiments or examples described in this specification and different embodiments or examples
Sign is combined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (14)
1. a kind of circuit board golden finger laser cutting method, which is characterized in that the described method includes:
Using referring to that insulating layer removes laser beam and golden finger cutting laser beam projects to wiring board region to be cut is scanned
Processing, wherein insulating layer removes the projection hot spot in insulating layer to be cut region of the laser beam between golden finger between the finger
Laser peak power density is less than golden finger material laser processing threshold value, and is greater than or equal to insulating layer material laser processing between finger
The laser peak power density of threshold value, projection hot spot of the golden finger cutting laser beam in golden finger region to be cut be greater than or
Equal to the golden finger material laser processing threshold value；Insulating layer removes laser beam for the insulation between golden finger between the finger
Layer region processing to be cut forms cavity, and the golden finger cutting laser beam forms joint-cutting for processing in the circuit board, wherein
The both sides of the edge in the cavity are located on the outside of the both sides of the edge of the joint-cutting.
2. circuit board golden finger laser cutting method according to claim 1, which is characterized in that the method includes as follows
Step:
Laser beam assist side region to be cut is removed using insulating layer between the finger first and is scanned processing, golden finger it
Between insulating layer region processing to be cut form the cavity；
Processing is then scanned using golden finger cutting laser beam assist side region to be cut, in the empty side
Golden finger on processing form the joint-cutting.
3. circuit board golden finger laser cutting method according to claim 1, which is characterized in that the method includes as follows
Step:
Processing is scanned using golden finger cutting laser beam assist side region to be cut first, it is on golden finger and golden
Insulating layer region processing to be cut between finger forms joint-cutting；
Laser beam assist side region to be cut is then removed using insulating layer between the finger and is scanned processing, in the insulation
Layer region to be cut includes that the region processing of the joint-cutting forms the cavity.
4. circuit board golden finger laser cutting method according to claim 1, which is characterized in that the specific reality of the method
Now include:
It uses simultaneously and refers to that an insulating layer removes laser beam and golden finger cutting laser beam assist side region to be cut is scanned
Processing is processed on golden finger by golden finger cutting laser beam and forms the joint-cutting, clear by insulating layer between the finger
Except insulating layer of the laser beam between golden finger region processing to be cut forms the cavity.
5. circuit board golden finger laser cutting method according to any one of claims 1 to 4, which is characterized in that the finger
Between insulating layer remove the spot diameter of laser beam and be less than or equal to 500 microns, the spot diameter of golden finger cutting laser beam
Less than or equal to 40 microns, the spot diameter that insulating layer removes laser beam between the finger is greater than golden finger cutting laser beam
Spot diameter.
6. circuit board golden finger laser cutting method according to claim 5, which is characterized in that insulating layer is clear between the finger
Except the spot center of spot center and the golden finger cutting laser beam of laser beam is overlapped or the finger between insulating layer remove it is sharp
The dispersion of the spot center of light beam and the spot center of golden finger cutting laser beam is less than or equal to 100 microns.
7. circuit board golden finger laser cutting method according to any one of claims 1 to 4, which is characterized in that when described
When wiring board is single side golden finger wiring board, insulating layer removes laser beam from the route opposite with face where golden finger between the finger
Plate another side is projected between finger and is processed on insulating layer.
8. circuit board golden finger laser cutting method according to any one of claims 1 to 4, which is characterized in that the side
Method further includes following steps:
After completing the processing in the joint-cutting and the cavity, laser beam is removed to the cavity using insulating layer between the finger
Edge carries out laser cleaning.
9. a kind of circuit board golden finger laser cutting method, which is characterized in that the described method includes:
When wiring board is single side golden finger wiring board, laser beam is removed from the line opposite with face where golden finger using insulating layer
Road plate another side, which is projected on the insulating layer in wiring board region to be cut, carries out scanning machining, is thrown using golden finger cutting laser beam
The golden finger for being incident upon wiring board region to be cut is scanned processing, wherein it is peak power that the insulating layer, which removes laser beam,
More than or equal to the ultra-short pulse laser of insulating layer material laser processing threshold value；The insulating layer removes laser beam for being located at
Processing formation cavity on the insulating layer at the golden finger back side, the golden finger cutting laser beam are used for the processing formation on golden finger and cut
Seam, wherein the both sides of the edge in the cavity are located on the outside of the both sides of the edge of the joint-cutting.
10. circuit board golden finger laser cutting method according to claim 9, which is characterized in that use the insulating layer
Remove laser beam process to be formed the cavity process be located at using the golden finger cut laser beam process to form the joint-cutting
Process after, or using the insulating layer remove laser beam process to be formed the cavity process be located at using it is described gold hand
Refer to that cutting laser beam is processed before the process to form the joint-cutting, or laser beam is removed using the insulating layer and processes to form institute
It states empty process and is located at the synchronous progress of process processed using golden finger cutting laser beam and to form the joint-cutting.
11. circuit board golden finger laser cutting method according to claim 9 or 10, which is characterized in that the method is also
Include the following steps:
After completing the processing in the joint-cutting and the cavity, laser beam is removed to the edge in the cavity using the insulating layer
Carry out laser cleaning.
12. a kind of circuit board golden finger laser cutting system, which is characterized in that the system comprises:
Light source module, for generate be projected to wiring board region to be cut be scanned the finger of processing between insulating layer remove laser beam
Laser beam is cut with golden finger, wherein insulating layer removes insulating layer to be cut area of the laser beam between golden finger between the finger
The laser peak power density of the projection hot spot in domain is less than golden finger material laser processing threshold value, and insulate more than or equal between finger
Layer material laser machines threshold value, laser peak of the golden finger cutting laser beam in the projection hot spot in golden finger region to be cut
Power density is greater than or equal to the golden finger material laser processing threshold value；
Machining control module removes insulating layer to be cut area of the laser beam between golden finger for insulating layer between controlling the finger
Domain processes to form cavity, controls golden finger cutting laser beam and process in the circuit board and forms joint-cutting, wherein described empty
Both sides of the edge are located on the outside of the both sides of the edge of the joint-cutting.
13. circuit board golden finger laser cutting system according to claim 12, which is characterized in that the machining control mould
Block be also used to the system also includes:
By adjusting in focusing focal position of laser, pulsed laser energy, laser pulse width and laser pulse repetition frequency
At least one realizes the switching of insulating layer removing laser beam and golden finger cutting laser beam between the finger.
14. circuit board golden finger laser cutting system according to claim 12, which is characterized in that the light source module packet
It includes:
First light source unit removes laser beam for insulating layer between generating the finger；
Second light source unit, for generating the golden finger cutting laser beam.
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| CN201910075323.XA CN109940284B (en) | 2019-01-25 | 2019-01-25 | Circuit board golden finger laser cutting method and system |
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| CN201910075323.XA CN109940284B (en) | 2019-01-25 | 2019-01-25 | Circuit board golden finger laser cutting method and system |
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| CN113419190A (en) * | 2021-06-15 | 2021-09-21 | 安捷利（番禺）电子实业有限公司 | Method for detecting micro short circuit after laser cutting and application thereof |
| CN113787267A (en) * | 2021-10-28 | 2021-12-14 | 广东中科微精光子制造科技有限公司 | Golden finger laser cutting system and cutting method |
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| CN109940284B (en) | 2021-04-27 |
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