CN113787267A - Golden finger laser cutting system and cutting method - Google Patents
Golden finger laser cutting system and cutting method Download PDFInfo
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- CN113787267A CN113787267A CN202111265122.XA CN202111265122A CN113787267A CN 113787267 A CN113787267 A CN 113787267A CN 202111265122 A CN202111265122 A CN 202111265122A CN 113787267 A CN113787267 A CN 113787267A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 259
- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000003698 laser cutting Methods 0.000 title claims abstract description 45
- 239000000428 dust Substances 0.000 claims abstract description 122
- 238000001179 sorption measurement Methods 0.000 claims abstract description 81
- 241001270131 Agaricus moelleri Species 0.000 claims abstract description 36
- 230000000694 effects Effects 0.000 claims abstract description 17
- 238000003763 carbonization Methods 0.000 claims abstract description 11
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- 230000003287 optical effect Effects 0.000 claims description 17
- 238000007493 shaping process Methods 0.000 claims description 7
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a golden finger laser cutting system, which comprises a light path processing device, a cutting jig device and an ion wind dust removal device, wherein the cutting jig device comprises an adsorption system and a special cutting jig, the special cutting jig comprises an adsorption plane and a cutting groove concavely arranged on the adsorption plane, airflow through holes are uniformly formed in the adsorption plane and the bottom of the cutting groove, when the special cutting jig bears a golden finger, the cutting part of the golden finger is suspended above the cutting groove, and the golden finger is adsorbed on the adsorption plane through the airflow through holes under the action of the adsorption system; the light path processing device comprises a light source module and a control processing module, wherein the control processing module is used for controlling the ultrafast flat-top laser beam generated by the light source module to move along the axial direction of the cutting groove so as to cut the golden finger, and carbonized dust generated in the cutting process is removed through the ion wind dust removal device. The invention ensures the appearance and effect of processing and realizes efficient non-carbonization cutting. The invention also discloses a laser cutting method for the golden finger.
Description
Technical Field
The invention relates to the technical field of golden finger processing, in particular to a laser non-carbonization cutting system and a laser non-carbonization cutting method for a golden finger of an FPC (flexible printed circuit) board.
Background
In the flexible circuit (FPC) board industry, efficient high-quality cutting of gold fingers is usually achieved by selecting a laser processing mode. However, since the distance between the gold fingers is extremely short (usually 35 to 100um), the density is high, and the inter-finger insulating material is easily ablated to form carbonized substances, substances such as carbonized substances and dust are easily generated by laser cutting the gold fingers, and thus a circuit path is easily formed around the gold fingers, resulting in a very short inter-finger distance.
In order to solve the short circuit problem caused by laser processing of the golden finger, research and improvement are continuously carried out in the industry. For example, in the laser cutting method disclosed in chinese patent CN102211255A, the oxygen is blown to the cut part of the workpiece to rapidly vaporize the workpiece material and remove the oxide and the vaporized matter, but this method will directly damage the anti-oxidation protection layer on the gold finger surface and may generate more carbonized substances. In the laser cutting method for the golden fingers of the circuit board disclosed in the chinese invention patent CN10994028A, the laser of low peak power density is used to cut the inter-finger insulating layer, and the golden fingers are cut by the laser of high peak power density, so as to realize laser non-carbonization cutting of the golden fingers, but the method can also damage the anti-oxidation protection layer on the surface of the golden fingers, and expose the golden fingers to influence the appearance, and the processing procedure of the method is complex. In another method for cutting a golden finger of a flexible circuit board by using ultraviolet laser disclosed in chinese patent CN102179632A, PI film surface is cut by using ultraviolet laser with high repetition frequency and low energy density, and the golden finger surface is cut by using ultraviolet laser with low repetition frequency and high energy density, so as to realize laser non-carbonization cutting of the golden finger.
Therefore, it is necessary to provide a laser non-carbonization cutting system and a cutting method with high processing efficiency and capable of ensuring the appearance and effect of the processing, so as to solve the above problems.
Disclosure of Invention
The invention aims to provide a golden finger laser cutting system which has high processing efficiency, can ensure the appearance and effect of processing and realizes non-carbonization cutting.
Another object of the present invention is to provide a laser cutting method for a gold finger, which has high processing efficiency, can ensure the appearance and effect of processing, and can realize non-carbonization cutting.
In order to achieve the purpose, the technical scheme of the invention is as follows: the golden finger laser cutting system comprises a light path processing device, a cutting jig device and an ion wind dust removal device; the special cutting jig is used for bearing a golden finger, enabling the cutting part of the golden finger to be suspended above the cutting groove, and adsorbing the golden finger on the adsorption plane through the airflow through holes under the action of the adsorption system; the light path processing device comprises a light source module and a control processing module, wherein the light source module is used for generating an ultrafast flat-top laser beam with extremely short pulse width, proper light spot diameter and uniformly distributed light spot energy, and the control processing module is used for controlling the energy of the ultrafast flat-top laser beam and enabling the ultrafast flat-top laser beam to move along the axial direction of the cutting groove so as to cut the golden finger; ion wind dust collector locates cutting tool device's top and including special dust excluding hood and ion wind system, special dust excluding hood has the gas hole, the gas hole with ion wind system links to each other, ion wind system is used for producing the required ion wind that removes dust, special dust excluding hood is in the carbonization dust that produces in the cutting process is clear away under ion wind system's the effect.
Preferably, the light source module includes an ultrafast laser, a variable-power beam expander and a beam shaper, the ultrafast laser is used for emitting an ultrafast laser beam with a very short pulse width, the variable-power beam expander is arranged at an output end of the ultrafast laser and is used for amplifying a spot diameter of the ultrafast laser beam emitted by the ultrafast laser, and the beam shaper is arranged at an output end of the variable-power beam expander and is used for shaping the ultrafast laser beam emitted after the spot diameter is amplified by the variable-power beam expander so as to obtain the ultrafast flat-top laser beam.
Preferably, the wave band of the ultrafast laser is from green light to ultraviolet light, the pulse width is from picoseconds to femtosecond level, and the multiple of the variable-power beam expander is 2-10 times.
Preferably, the control processing module includes a laser control system and a high-speed scanning galvanometer, the high-speed scanning galvanometer is disposed at an output end of the light source module and is used for controlling the ultrafast flat-top laser beam to scan and cut the golden finger along an axial direction of the cutting groove, and the laser control system is used for controlling an output energy of the ultrafast flat-top laser beam.
Preferably, the optical path processing device further includes a plurality of reflectors and a telecentric field lens, the reflectors are disposed between the output end of the light source module and the input end of the high-speed scanning galvanometer and are used for changing the transmission path of the light beam, and the telecentric field lens is disposed at the output end of the high-speed scanning galvanometer and is used for focusing the ultrafast flat-top laser beam emitted by the high-speed scanning galvanometer and enabling the laser focuses to be located on the same focal plane.
Preferably, the special dust hood is further provided with a gas suction hole arranged opposite to the gas blowing hole, the gas suction hole is connected with the adsorption system, and the adsorption system and the ion wind system jointly act to form an ion wind flow, so that carbonized dust generated on the surface of a sample in the processing process is removed completely
Preferably, special dust excluding hood still includes a blowing cover and an air suction cover of relative setting, the blowing cover form a dust removal groove between the air suction cover, it has seted up a plurality ofly evenly to blow on the cover, it has seted up a plurality ofly evenly to breathe in on the cover the air suction hole, the ionic wind that the ion wind system produced is followed the air blowing hole blows to in the dust removal groove to carbide dust with the dust removal inslot forms the ionic dust, adsorption system is right the air suction hole produces the adsorption affinity, thereby will the ionic dust of dust removal inslot is followed the air suction hole is siphoned away.
Preferably, the high-speed scanning galvanometer is used for controlling the ultrafast flat-top laser beam to perform single-line cutting or multi-line cutting on the golden finger, and each cutting line is located in the cutting groove during multi-line cutting.
Correspondingly, the invention also provides a golden finger laser cutting method using the golden finger laser cutting system, which comprises the following steps:
(1) operating a light source module of the optical path processing device to generate an ultrafast flat-topped laser beam;
(2) placing the golden finger on a special cutting jig, enabling the golden finger surface to be upward, and enabling the cutting part of the golden finger to be suspended above the cutting groove, so that the cutting direction of the golden finger is consistent with the axial direction of the cutting groove;
(3) enabling an adsorption system to operate to provide adsorption force, so that the golden finger is adsorbed on the adsorption plane of the special cutting jig through the airflow through hole;
(4) enabling a control processing module of the optical path processing device to operate to control the ultrafast flat-topped laser beam to move along the axial direction of the cutting groove so as to cut the golden finger;
(5) the ion wind system of the ion wind dust removal device is operated, and the ion wind generated by the ion wind system is blown in from the air blowing hole of the special dust hood, so that the carbonized dust generated in the cutting process forms ion dust, and the ion dust is removed by the special dust hood.
Preferably, in the gold finger laser cutting method of the present invention, the step (1) specifically includes the following steps:
(11) adjusting the ultrafast laser to emit an ultrafast laser beam;
(12) adjusting a zoom beam expander to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser;
(13) shaping the ultrafast laser beam which is emitted after the diameter of the light spot is amplified by the zooming beam expander through a beam shaper to obtain the ultrafast flat-top laser beam.
Preferably, in the golden finger laser cutting method of the present invention, the step (4) is single line cutting or multi-line cutting, and each cutting line is located in the cutting groove during multi-line cutting.
Preferably, in the gold finger laser cutting method of the present invention, the step (5) further includes the following steps:
(6) and enabling the adsorption system to generate adsorption force on the air suction hole of the special dust hood, and enabling the adsorption system and the ion wind system to act together to form an ion wind airflow so as to suck the ion dust away from the air suction hole.
Compared with the prior art, the golden finger laser cutting system comprises a special cutting jig of a cutting jig device, wherein the special cutting jig comprises an adsorption plane and a cutting groove which is concavely arranged on the adsorption plane, airflow through holes are uniformly formed in the adsorption plane and the bottom of the cutting groove, and the special cutting jig is used for bearing a golden finger, enabling the cutting part of the golden finger to be suspended above the cutting groove and adsorbing the golden finger on the adsorption plane through the airflow through holes under the action of the adsorption system; secondly, an ultrafast laser beam with extremely short pulse width is generated by the optical path processing device, the ultrafast flat-top laser beam with proper light spot diameter and uniformly distributed light spot energy is obtained after adjustment, the ultrafast flat-top laser beam is controlled to move along the axial direction of the cutting groove so as to cut the golden finger, and the golden finger can be stably adsorbed on a special cutting jig without shaking caused by strong air flow adsorption in the cutting process, so that the consistency of the cutting effect is ensured, and meanwhile, the cutting part of the golden finger is suspended above the cutting groove and is not polluted by cutting dust on the special cutting jig; moreover, the ion wind dust removal device can effectively remove a large amount of carbonized dust generated in the processing process in time, reduce the carbonized pollution of the carbonized dust to the product and greatly reduce the situation of small finger space; in addition, the optical path processing device can ensure the cutting efficiency.
Correspondingly, the golden finger laser cutting method using the golden finger laser cutting system provided by the invention has the same technical effect.
Drawings
FIG. 1 is a schematic structural diagram of a golden finger laser cutting system according to the present invention.
Fig. 2 is a schematic structural view of the special cutting jig of the present invention.
FIG. 3 is a schematic structural diagram of the special dust hood of the present invention.
FIG. 4 is a schematic diagram of the cutting state of the golden finger according to the present invention.
Detailed Description
Embodiments of the present invention will now be described with reference to the drawings, wherein like element numerals represent like elements.
Referring to fig. 1 to 4, the golden finger laser cutting system 1 of the present invention includes a light path processing device 100, a cutting fixture device, and an ion wind dust removing device. The cutting jig device includes a special cutting jig 200 and an adsorption system (not shown), the special cutting jig 200 is used for carrying the golden finger 400, the cutting portion 400a of the golden finger 400 is suspended on the cutting groove 220, the golden finger 400 is adsorbed on the special cutting jig 200 through the air flow through hole 230 under the action of the adsorption system, and the size of the air flow of the adsorption system can be adjusted. The top of cutting tool device is located to ion wind dust collector, and this ion wind dust collector includes special dust excluding hood 300 and ion wind system (not shown), and wherein, the top of cutting special tool 200 is located compactly to special dust excluding hood 300, and the concrete position of special dust excluding hood 300 is adjustable, ion wind system is used for producing the required ion wind that removes dust, ion wind system's air current size can be adjusted according to the processing effect. The optical path processing device 100 comprises a light source module 110 and a control processing module 130, wherein the light source module 110 is used for generating an ultrafast laser beam with an extremely short pulse width, and adjusting the ultrafast laser beam to obtain an ultrafast flat-top laser beam with a proper spot diameter and uniformly distributed spot energy, the control processing module 130 is used for controlling the energy of the ultrafast flat-top laser beam and cutting the golden finger 400 by using the ultrafast flat-top laser beam, and in the cutting process, an ion wind dust removal device is used for absorbing carbonized dust generated in the cutting process, so that the carbonized pollution of the golden finger 400 is reduced.
It should be noted that the adsorption system and the ion wind system according to the present invention are all conventional in the art, and therefore, the structures and specific operation principles of the adsorption system and the ion wind system are not described in detail.
The following mainly describes specific structures of the optical path processing apparatus 100, the special cutting jig 200, and the special dust hood 300 according to the present invention, with reference to fig. 1 to 4.
Referring to fig. 1-2 and 4, in an embodiment of the invention, the special cutting tool 200 includes an adsorption plane 210 and a cutting groove 220 recessed in the adsorption plane 210, and the adsorption plane 210 and the bottom of the cutting groove 220 are both provided with air flow holes 230, under the action of an adsorption system, the golden finger 400 can be adsorbed on the adsorption plane 210 of the special cutting tool 200 through the air flow holes 230, and meanwhile, the cutting portion 400a of the golden finger 400 is suspended above the cutting groove 220, specifically, the cutting direction of the golden finger 400 is the same as the axial direction of the cutting groove 220, so that the cutting portion 400a of the golden finger 400 is suspended above the cutting groove 220, and the optical path processing device 100 cuts the golden finger 400 along the axial direction of the cutting groove 220. In this embodiment, through the setting of cutting groove 220 and air current through-hole 230, the cutting position 400a of gold finger 400 both can guarantee not to receive the pollution of the cutting dust on the special tool 200 of cutting, can avoid receiving again and adsorb strong air current and take place the influence of shake, guarantee clean steady to guarantee the uniformity of cutting effect.
More specifically, because the FPC board is generally characterized by thinness and strong flexibility, the special cutting jig 200 of the present invention has a plurality of air flow through holes 230 uniformly formed on the adsorption plane 210 thereof, and a plurality of air flow through holes 230 are also uniformly formed at the bottom of the cutting groove 220, so that after the special cutting jig 200 adsorbs the gold finger 400 through the air flow through holes 230 under the action of the adsorption system, the gold finger 400 can be ensured to be kept stable all the time in the cutting process, and will not be affected by strong adsorption air flow to cause shaking.
Referring to fig. 2 and 4 again, in the present invention, the length of the cutting groove 220 of the special cutting jig 200 is h1, and the width of the cutting groove 220 is d, which is specifically shown in fig. 2; in addition, the depth of the cutting groove 220 should generally be not less than 2mm, and the specific depth can be flexibly set according to the needs, and is not limited herein. Referring to fig. 4, the cutting length of the gold finger 400 in the cutting direction is h2, the length h1 of the cutting groove 220 of the special cutting jig 200 is equal to or greater than the cutting length h2 of the gold finger 400, and in the present embodiment, the length h1 of the cutting groove 220 is preferably equal to the cutting length h2 of the gold finger 400. Meanwhile, the width d of the cutting groove 220 needs to ensure that all the cutting lines of the golden finger 400 are in the cutting groove 220, that is, the width d of the cutting groove 220 needs to be greater than the width of the cutting portion 400a of the golden finger 400, so that when the golden finger 400 is multi-line cut, all the cutting lines of the golden finger 400 are ensured to be located in the cutting groove 220.
Specifically referring to fig. 4, during single-line cutting, cutting is performed along a cutting line P1; when multi-line cutting is performed, the gold finger 400 is cut along the cutting line P2 to obtain the finished product area 400b and the waste area 400c, and then the finished product area 400b is retracted by a certain distance to perform the laser cleaning process, but the cutting lines of the gold finger 400 cut twice are all performed in the cutting portion 400a and the corresponding cutting groove 220.
Referring to fig. 1, a specific arrangement of the optical path processing apparatus 100 according to the present invention will be described. In this embodiment, the light source module 110 includes an ultrafast laser 111, a variable-power beam expander 112, and a beam shaper 113. The ultrafast laser 111 is used for emitting ultrafast laser beams with extremely short pulse widths; the variable-power beam expander 112 is arranged at the output end of the ultrafast laser 111 and is used for flexibly amplifying the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111 according to actual requirements; the beam shaper 113 is disposed between the output end of the variable-power beam expander 112 and the input end of the high-speed scanning galvanometer 132, and is configured to shape the ultrafast laser beam, which is emitted after the spot diameter is amplified by the variable-power beam expander 112, into an ultrafast flat-top laser beam with uniformly distributed spot energy, and emit the ultrafast flat-top laser beam to the control processing module 130.
With continued reference to fig. 1, the ultrafast laser 111 of the present invention has a wavelength band from green light to ultraviolet light, wherein the green light wavelength band is preferably 532nm, the ultraviolet light wavelength band is preferably 355nm, and the pulse width is picoseconds to femtosecond level, so that it can provide a pulse laser with a short pulse width and a high peak power, and provide a necessary technical basis for laser cold working.
More specifically, the ultrafast laser beam output by the ultrafast laser 111 is a gaussian beam with gaussian distribution of spot energy, and since the irradiation cross section of the gaussian beam decreases symmetrically with increasing distance from the center, that is, the irradiation intensity of the gaussian beam is strong in the center region and weak in the edge region, the optical power distribution characteristic of the gaussian beam may cause excessive processing energy in the center region when precision laser processing is performed on a material, and the processing energy in the edge region is too low, thereby reducing the precision processing effect and energy utilization efficiency of the material. In contrast, the flat-top beam can maintain a constant irradiance value throughout the irradiation cross section, which enables the energy of the flat-top beam to be more clearly contained in a given region, which can achieve higher processing accuracy and reduce damage to the peripheral region. Therefore, in the present invention, a beam shaper 113 is disposed at the output end of the variable-magnification beam expander 112 to shape the gaussian beam (i.e., the ultrafast laser beam) emitted from the ultrafast laser 111, as will be described in detail later.
With reference to fig. 1, in the present invention, the variable-magnification beam expander 112 is used to amplify the spot diameter of the ultrafast laser beam emitted from the ultrafast laser 111, and preferably, the variable-magnification beam expander can realize a magnification change of 2-10, and the specific magnification can be flexibly adjusted according to actual requirements. More specifically, since the smaller focused spot can increase the energy density of the spot, and on the other hand, can obtain a fine cutting track, and reduce the processing heated area, in an embodiment of the present invention, after the diameter of the spot of the ultrafast laser beam emitted from the ultrafast laser 111 is properly amplified by the variable-magnification beam expander 112, a focused spot with a diameter of 20um can be obtained by focusing under the telecentric field lens 140 (described in detail later), so as to ensure the effect of cold processing of the laser, and of course, the magnification of the variable-magnification beam expander 112 and the diameter of the finally obtained focused spot are not limited in this embodiment, and can be flexibly selected as needed.
Referring to fig. 1 again, in the present invention, a beam shaper 113 is disposed at the output end of the variable-power beam expander 112, and the ultrafast laser beam with the spot diameter amplified by the variable-power beam expander 112 is shaped by the beam shaper 113 to obtain an ultrafast flat-top laser beam with uniformly distributed spot energy, so that the processing energy can be effectively utilized and the processing effect can be optimized.
Referring to fig. 1 again, the control processing module 130 includes a laser control system 131 and a high-speed scanning galvanometer 132, where the high-speed scanning galvanometer 132 is disposed at an output end of the beam shaper 113, and the high-speed scanning galvanometer 132 controls the ultrafast flat-top laser beam generated and adjusted by the light source module 110 to perform high-speed cutting on the gold finger 400 at a high scanning speed, so as to improve cutting efficiency and cutting quality, and during the cutting process, the laser control system 131 controls the output energy of the ultrafast flat-top laser beam.
With continued reference to fig. 1, the optical path processing apparatus 100 further includes a plurality of mirrors 120 and a telecentric field lens 140. The reflecting mirror 120 is disposed between the output end of the beam shaper 113 and the input end of the high-speed scanning galvanometer 132, and is used for changing the transmission path of the light beam. The number of the reflecting mirrors 120 is not particularly limited herein, and may be set according to the requirements of a specific light beam transmission path. The telecentric field lens 140 is disposed at the output end of the high-speed scanning galvanometer 132, and the telecentric field lens 140 is configured to focus the ultrafast flat-topped laser beam transmitted by the high-speed scanning galvanometer 132 on the special cutting jig 200, and enable laser focal points to be located on the same focal plane within the processing range thereof, and principal rays of the focused laser beam are perpendicular to the same focal plane under any field angle.
Referring to fig. 3, in the present invention, the special dust removing hood 300 includes a blowing hood 310 and a suction hood 320 which are oppositely disposed, a plurality of blowing holes 311 are uniformly formed on the blowing hood 310, a plurality of suction holes 321 are uniformly formed on the suction hood 320, a dust removing groove 330 is formed between the blowing hood 310 and the suction hood 320, in addition, the blowing hood 310 is connected to an ion wind system, the suction hood 320 is connected to an adsorption system, and the ion wind system can cooperate with the adsorption system to form an ion wind flow, as shown in the direction of the arrow in fig. 3, so as to clean the carbonized dust generated on the surface of the sample during the processing. In the present invention, the suction cover 320 and the special cutting tool 200 share one adsorption system, which can simplify the equipment, but not limited thereto.
More specifically, the ion wind system blows the generated ion wind into the dust removing tank 330 through the blowing holes 311 on the blowing hood 310, so that the carbonized dust in the dust removing tank 330 forms ion dust; meanwhile, the adsorption system sucks the ion dust in the dust removing tank 330 through the suction holes 321 of the suction cover 320. Therefore, the ion wind system and the adsorption system work together to form an ion wind airflow, so that carbonized dust generated on the surface of a sample in the processing process is removed. Thus, when the golden finger 400 is cut, the ion wind blown by the ion wind system is blown into the cutting area under the dust removing groove 330 through the blowing holes 311 to form ion dust from the carbonized dust of the cut sample product, and at the same time, the adsorption system sucks the ion dust formed in the cutting area under the dust removing groove 330 through the suction holes 321, as shown by the arrow direction in fig. 3, thereby timely and effectively removing a large amount of carbonized dust generated during the processing and reducing the thermal influence of the laser on the product.
The working principle and process of the golden finger laser cutting system 1 of the present invention will be described with reference to fig. 1-4 again.
First, the ultrafast laser beam emitted from the ultrafast laser 111 is power-adjusted to obtain a suitable processing energy. Specifically, when the processing energy is too high, more carbon powder particles and vaporized particles are generated to greatly increase the risk of shortening, and when the processing energy is too low, the cutting times are increased to cause accumulation of carbon powder particles and vaporized particles, so that the power of the ultrafast laser beam emitted from the ultrafast laser 111 is adjusted to obtain the appropriate processing energy to laser cut the gold finger 400.
Next, beam expansion is performed. Specifically, the diameter of the spot of the ultrafast laser beam emitted from the ultrafast laser 111 is enlarged by the variable-power beam expander 112, and the specific enlargement factor is adjusted according to the size of the focused spot under the telecentric field lens 140.
Then, beam shaping is performed. Specifically, since the ultrafast laser beam emitted from the ultrafast laser 111 is a gaussian beam with gaussian distribution of energy, in order to effectively utilize the processing energy and optimize the processing effect, the beam shaper 113 is disposed behind the variable-magnification beam expander 112 to shape the flat-top beam profile, so as to obtain a flat-top laser beam with uniformly distributed spot energy, and the flat-top laser beam enters the high-speed scanning galvanometer 132 after being reflected by the plurality of reflectors 140, and is emitted to the telecentric field lens 140 through the high-speed scanning galvanometer 132 to be focused on the special cutting jig 200, so as to wait for cutting the golden finger 400.
Then, the golden finger 400 is placed on the jig 200 for exclusive use in cutting with the golden finger facing upward, specifically, the golden finger 400 with the golden finger facing upward is placed on the adsorption plane 210 of the jig 200 for exclusive use in cutting, while the cutting portion 400a of the golden finger 400 is suspended above the cutting groove 220, and then the golden finger 400 is stably adsorbed on the adsorption plane 210 through the air flow through hole 230 under the action of the adsorption system.
Finally, the high-speed scanning galvanometer 132 is actuated to cut the golden finger 400, specifically referring to fig. 4, the cutting mode may be single-line cutting or multi-line cutting; wherein, the single line cutting is the process of directly cutting along the cutting line P1; the multi-line cutting is a process of cutting the gold finger 400 along a cutting line P2 at the cutting portion 400a to obtain a finished product area 400b and a waste area 400c, and then performing laser cleaning by retracting a certain distance into the finished product area 400 b. During the cutting process, the scanning processing speed of the high-speed scanning galvanometer 132 is increased, and the processing at the focus is selected, so that the heat accumulation can be reduced, and the characteristics of the ultra-fast laser cold processing can be better exerted.
In addition, in the cutting process, a large amount of carbonized dust can be generated, if the carbonized dust is not removed in time, the risk of micro-short can be greatly increased, even the micro-short of the golden finger 400 can be directly caused, in the invention, the ion wind dust removal device is started in the laser cutting process, the ion wind system blows ion wind into the dust removal groove 330 through the blowing holes 311 on the blowing cover 310, so that the carbonized dust generated in the cutting process forms ion dust, and meanwhile, the adsorption system completely adsorbs the ion dust formed in the cutting processing area under the dust removal groove 330 through the suction holes 321 on the suction cover 320, thereby effectively reducing the micro-short influence of the carbonized dust on the product.
Referring to fig. 1 to 4 again, the present invention further provides a golden finger laser cutting method, which uses the golden finger laser cutting system 1, and the method specifically includes the following steps:
(1) operating the light source module 110 of the optical path processing apparatus 100 to generate an ultrafast flat-topped laser beam;
referring specifically to fig. 1, since in the laser processing, if the processing energy is too high, more carbon powder particles and vaporized particles are generated, thereby greatly increasing the risk of micro-shortening, and if the processing energy is too low, the cutting times are increased, thereby causing the accumulation of carbon powder particles and vaporized particles. Therefore, in the cutting method of the present invention, the power adjustment, beam expansion and beam shaping of the ultrafast laser beam generated by the light source module 110 are sequentially implemented through the operation of the light source module, so as to obtain an ultrafast flat-top laser beam with an extremely short pulse width, an appropriate spot diameter and uniformly distributed spot energy.
(2) Placing the golden finger 400 on the special cutting jig 200 with the golden finger facing upwards, suspending the cutting part 400a of the golden finger 400 above the cutting groove 220, and making the cutting direction of the golden finger 400 consistent with the axial direction of the cutting groove 220;
referring to fig. 4, the gold finger 400 has a substrate 410 formed of an insulating material and a plurality of conductive contacts 420 formed thereon, and during the laser processing of the gold finger 400, since the laser processing threshold of copper is much higher than that of insulating materials such as Polyimide (PI), Polyethylene (PE), and glue, the insulating material is usually over-ablated by laser to form a carbonized substance, and the conductive contacts 420 of the gold finger 400 of the FPC board have short pitch and high density. In the present invention, in order to prevent vaporized particles generated during the laser processing of the gold finger 400 from adhering to the periphery of the gold finger 400, and thus, the gold finger 400 is subjected to laser processing from the gold finger surface, in the method of the present invention, the gold finger surface of the gold finger 400 is placed upward on the adsorption plane 210 of the cutting jig 200, and meanwhile, in order to prevent the gold finger 400 from being secondarily damaged by the cutting jig 200, the cutting portion 400a of the gold finger 400 is positioned right above the cutting groove 220, that is, the cutting portion 400a of the gold finger 400 is suspended.
Furthermore, the cutting length of the gold finger 400 in the cutting direction is h2, and the cutting length h2 of the gold finger 400 is less than or equal to the length h1 of the cutting groove 220 of the special cutting jig 200; the width of the cutting portion 400a of the gold finger 400 is smaller than the width d of the cutting groove 220, as shown in fig. 2 and 4. Therefore, it is possible to ensure that all the cutting lines of the gold finger 400 are located in the cutting groove 220.
(3) Operating the adsorption system to provide adsorption force to adsorb the gold finger 400 on the adsorption plane 210 thereof through the air flow through hole 230 on the special cutting jig 200;
referring to fig. 4, since the FPC board is generally thin and flexible, the invention uniformly arranges a plurality of air flow through holes 230 on the absorption plane 210 of the special cutting jig 200 and the bottom of the cutting groove 220, and the gold finger 400 of the FPC board is absorbed on the absorption plane 210 by the absorption force provided by the absorption system through the cooperation of the absorption system and the special cutting jig 200, so as to ensure that the gold finger 400 is kept stable all the time in the cutting process and is not shaken by the influence of strong absorption air flow.
(4) Enabling the control processing module 130 of the optical path processing device 100 to operate to control the ultrafast flat-topped laser beam to move along the axial direction of the cutting groove 220 to cut the golden finger 400;
specifically, referring to fig. 1 and 4, firstly, the high-speed scanning galvanometer 132 of the processing module 130 is controlled to operate, and the high-speed scanning galvanometer 132 receives the ultrafast flat-topped laser beam and emits the beam to the telecentric field lens 140 to focus on the special cutting jig 200, so as to cut the golden finger 400.
With continued reference to fig. 4, in the cutting method of the present invention, the cutting in this step may be single-wire cutting or multi-wire cutting, and each cutting wire is located in the cutting groove 220 during multi-wire cutting. More specifically, a single-line cutting, i.e., a process of directly cutting along the cutting line P1, i.e., a process of directly cutting along the cutting line P1 within the cutting portion 400 a; the multi-line cutting is a process of cutting the gold finger 400 along a cutting line P2 at the cutting portion 400a to obtain a finished product area 400b and a waste area 400c, and then performing laser cleaning by retracting a certain distance into the finished product area 400 b.
In the cutting process, the high-speed scanning galvanometer 132 is improved to perform high-speed cutting on the golden finger 400 at a higher scanning speed, so that the cutting efficiency and the cutting quality can be improved, and meanwhile, the heat accumulation can be reduced by selecting the in-focus processing, so that the characteristic of ultra-fast laser cold processing can be better exerted; and, the magnitude of the output energy of the ultrafast flat-topped laser beam is controlled by the laser control system 131.
(5) The ion wind system of the ion wind dust removing device is operated, and the ion wind generated by the ion wind system is blown in from the air blowing hole 311 of the special dust hood 300, so that the carbonized dust generated in the cutting process forms ion dust, and the ion dust is removed by using the special dust hood 300.
As shown in fig. 1 and fig. 3, since a lot of dust is generated during the laser cutting process in the step (4), if the dust is not removed in time, the risk of short fingers is greatly increased and even the short fingers 400 are directly short. Therefore, in the laser cutting method of the present invention, the ion wind system blows the ion wind to the special dust hood 300, and in one embodiment, the ion wind system blows the ion wind into the dust removing groove 330 of the special dust hood 300 through the blowing holes 311 on the blowing hood 310, so that the carbonized dust generated in the cutting process forms ion dust, and the ion dust generated in the cutting process is removed by the special dust hood 300.
In order to better remove the carbonized dust, in a more preferred embodiment of the golden finger laser cutting method of the present invention, the method further comprises the following steps after the step (5):
(6) the adsorption system generates an adsorption force on the air suction holes 321 of the special dust hood 300, and the adsorption system and the ion wind system cooperate to form an ion wind airflow, so that the ion dust is sucked from the air suction holes 321.
With continued reference to fig. 3, since the special dust hood 300 of the present invention further includes the air suction hood 320, the air suction hood 320 is opposite to the air blowing hood 310 and is spaced apart from the air blowing hood 310, and the air blowing hood 320 is uniformly provided with a plurality of air suction holes 321, and the air blowing hood 310 is connected to the ion wind system, and the air suction hood 320 is connected to the adsorption system, the ion wind system and the adsorption system can cooperate to form an ion wind flow. Therefore, in the cutting method of the present invention, while the ion wind system blows air into the dust removing groove 330, the adsorption system is operated to generate an adsorption force on the air suction holes 321, and therefore, the adsorption system and the ion wind system operate simultaneously to form an ion wind flow flowing from the air blowing cover 310 to the air suction cover 320, as shown by the arrow direction in fig. 3, so as to suck the ion dust in the dust removing groove 330 from the air suction holes 321, ensure that the dust removal suction force is large enough to timely and effectively remove a large amount of carbonized dust generated in the processing process, reduce the influence of the carbonized dust on the carbonized pollution of the product, and effectively reduce the occurrence of a short condition.
Referring to fig. 1 again, in the gold finger laser cutting method of the present invention, the step (1) specifically includes the following steps:
(11) adjusting the power of the ultrafast laser 111 to emit an ultrafast laser beam;
specifically, since too high processing energy will generate more carbon powder particles and vaporized particles, thereby greatly increasing the risk of shortening, and too low processing energy will cause the number of cutting times to increase, thereby causing the accumulation of carbon powder particles and vaporized particles, the power of the ultrafast laser 111 is adjusted to obtain appropriate energy to perform laser cutting on the gold finger 400, and after the adjustment is completed, the ultrafast laser 111 emits ultrafast laser beams with ultrashort pulses having gaussian distribution of spot energy.
(12) Adjusting a zoom beam expander 112 to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111;
specifically, the diameter of the spot of the ultrafast laser beam emitted from the ultrafast laser 111 is enlarged by the variable-power beam expander 112, and the specific enlargement factor is adjusted according to the size of the focused spot under the telecentric field lens 140.
(13) Shaping the ultrafast laser beam emitted after the spot diameter is amplified by the variable-magnification beam expander 112 by a beam shaper 113 to obtain the ultrafast flat-topped laser beam.
Specifically, since the ultrafast laser beam emitted from the ultrafast laser 111 is a gaussian beam with gaussian distribution of energy, in order to effectively utilize the processing energy and optimize the processing effect, a beam shaper 113 is disposed behind the variable-magnification beam expander 112 to shape the flat-top beam profile, thereby obtaining the ultrafast flat-top laser beam with uniformly distributed spot energy.
In summary, in the gold finger laser cutting system 1 of the present invention, firstly, the special cutting jig 200 includes an adsorption plane 210 and a cutting groove 220 concavely disposed on the adsorption plane 210, and the bottoms of the adsorption plane 210 and the cutting groove 220 are both uniformly provided with air flow through holes 230, the special cutting jig 200 is used for carrying a gold finger 400 and suspending a cutting portion 400a of the gold finger above the cutting groove 220, and then the gold finger 400 is adsorbed on the adsorption plane 210 through the air flow through holes 230 under the action of the adsorption system; secondly, the light path processing device 100 is used for generating an ultrafast flat-top laser beam with extremely short pulse width, proper light spot diameter and uniformly distributed light spot energy, and controlling the flat-top laser beam to move along the axial direction of the cutting groove 220 so as to cut the golden finger 400, during the cutting process, the golden finger 400 can be stably adsorbed on the special cutting jig 200 without shaking caused by strong air flow adsorption, so that the consistency of the cutting effect is ensured, and meanwhile, the cutting part 400a of the golden finger 400 is suspended above the cutting groove 220 without being polluted by cutting dust on the special cutting jig 200; moreover, the ion wind dust removal device can effectively remove a large amount of carbonized dust generated in the processing process in time, so that carbonization is not easily generated in the cutting process, and the situation of finger space shortening is greatly reduced; in addition, the optical path processing apparatus 100 of the present invention can secure the cutting efficiency.
Correspondingly, the golden finger laser cutting method using the golden finger laser cutting system 1 of the invention also has the same technical effect.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (12)
1. A golden finger laser cutting system, comprising:
the special cutting jig device comprises a special cutting jig and an adsorption system, the special cutting jig comprises an adsorption plane and a cutting groove concavely arranged on the adsorption plane, airflow through holes are uniformly formed in the adsorption plane and the bottom of the cutting groove, the special cutting jig is used for bearing the golden finger, enabling the cutting part of the golden finger to be suspended above the cutting groove, and adsorbing the golden finger on the adsorption plane through the airflow through holes under the action of the adsorption system;
the light path processing device comprises a light source module and a control processing module, wherein the light source module is used for generating an ultrafast flat-top laser beam, and the control processing module is used for controlling the energy of the ultrafast flat-top laser beam and enabling the ultrafast flat-top laser beam to move along the axial direction of the cutting groove so as to cut the golden finger;
ion wind dust collector, it is located the top of cutting tool device and including special dust excluding hood and ion wind system, special dust excluding hood has the gas hole, the gas hole with ion wind system links to each other, ion wind system is used for producing the required ion wind that removes dust, special dust excluding hood is in the carbonization dust that produces in the cutting process is clear away to the effect of ion wind system down.
2. The golden finger laser cutting system according to claim 1, wherein the light source module comprises an ultrafast laser, a variable-power beam expander and a beam shaper, the ultrafast laser is used for emitting an ultrafast laser beam, the variable-power beam expander is arranged at an output end of the ultrafast laser and is used for amplifying a spot diameter of the ultrafast laser beam emitted by the ultrafast laser, and the beam shaper is arranged at an output end of the variable-power beam expander and is used for shaping the ultrafast laser beam emitted after the spot diameter is amplified by the variable-power beam expander so as to obtain the ultrafast flat-topped laser beam.
3. The laser cutting system for golden finger according to claim 2, wherein the wave band of the ultrafast laser is green light to ultraviolet light wave band, the pulse width is picosecond to femtosecond level, and the multiple of the variable power beam expander is 2-10 times.
4. The laser cutting system for golden fingers according to claim 1, wherein the control processing module comprises a laser control system and a high-speed scanning galvanometer, the high-speed scanning galvanometer is arranged at the output end of the light source module and is used for controlling the ultrafast flat-top laser beam to scan and cut the golden fingers along the axial direction of the cutting groove, and the laser control system is used for controlling the output energy of the ultrafast flat-top laser beam.
5. The golden finger laser cutting system according to claim 4, wherein the optical path processing device further comprises a plurality of reflectors and a telecentric field lens, the reflectors are disposed between the output end of the light source module and the input end of the high-speed scanning galvanometer and are used for changing the transmission path of the laser beam, and the telecentric field lens is disposed at the output end of the high-speed scanning galvanometer and is used for focusing the ultrafast flat-topped laser beam emitted from the high-speed scanning galvanometer and enabling the laser focuses to be located on the same focal plane.
6. The laser cutting system for golden fingers according to claim 1, wherein the special dust hood is further provided with a gas suction hole arranged opposite to the gas blowing hole, the gas suction hole is connected with the adsorption system, and the adsorption system and the ion wind system cooperate to form an ion wind flow, so that carbonized dust generated on the surface of the sample in the processing process is removed.
7. The laser cutting system according to claim 6, wherein the special dust hood further comprises a blowing hood and a suction hood disposed opposite to each other, a dust removing groove is formed between the blowing hood and the suction hood, the blowing hood is uniformly provided with a plurality of blowing holes, the suction hood is uniformly provided with a plurality of suction holes, ion wind generated by the ion wind system is blown into the dust removing groove from the blowing holes, so that the carbonized dust in the dust removing groove is formed into ion dust, and the adsorption system generates an adsorption force on the suction holes, so that the ion dust in the dust removing groove is sucked away from the suction holes.
8. The laser cutting system for golden fingers according to claim 1, wherein the high-speed scanning galvanometer is used for controlling the ultrafast flat-topped laser beam to perform single-line cutting or multi-line cutting on the golden fingers, and each cutting line is located in the cutting groove during multi-line cutting.
9. A golden finger laser cutting method using the golden finger laser cutting system according to any one of claims 1 to 8, comprising the steps of:
(1) operating a light source module of the optical path processing device to generate an ultrafast flat-topped laser beam;
(2) placing the golden finger on a special cutting jig, enabling the golden finger surface to be upward, and enabling the cutting part of the golden finger to be suspended above the cutting groove, so that the cutting direction of the golden finger is consistent with the axial direction of the cutting groove;
(3) enabling an adsorption system to operate to provide adsorption force, so that the golden finger is adsorbed on the adsorption plane of the special cutting jig through the airflow through hole;
(4) enabling a control processing module of the optical path processing device to operate to control the ultrafast flat-topped laser beam to move along the axial direction of the cutting groove so as to cut the golden finger;
(5) the ion wind system of the ion wind dust removal device is operated, and the ion wind generated by the ion wind system is blown in from the air blowing hole of the special dust hood, so that the carbonized dust generated in the cutting process forms ion dust, and the ion dust is removed by the special dust hood.
10. The laser cutting method of the golden finger according to claim 9, wherein the step (1) specifically comprises the following steps:
(11) adjusting the ultrafast laser to emit an ultrafast laser beam;
(12) adjusting a zoom beam expander to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser;
(13) shaping the ultrafast laser beam which is emitted after the diameter of the light spot is amplified by the zooming beam expander through a beam shaper to obtain the ultrafast flat-top laser beam.
11. The laser cutting method for golden finger according to claim 9, wherein in the step (4), the cutting is performed by single line cutting or multi-line cutting, and each cutting line is located in the cutting groove during multi-line cutting.
12. The laser cutting method of golden finger according to claim 9, characterized in that the step (5) is followed by the following steps:
(6) and enabling the adsorption system to generate adsorption force on the air suction hole of the special dust hood, and enabling the adsorption system and the ion wind system to act together to form an ion wind airflow so as to suck the ion dust away from the air suction hole.
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