CN204725015U - A kind of polyethylene board absorption platform for laser cutting device - Google Patents
A kind of polyethylene board absorption platform for laser cutting device Download PDFInfo
- Publication number
- CN204725015U CN204725015U CN201520301936.8U CN201520301936U CN204725015U CN 204725015 U CN204725015 U CN 204725015U CN 201520301936 U CN201520301936 U CN 201520301936U CN 204725015 U CN204725015 U CN 204725015U
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- Prior art keywords
- absorption platform
- polyethylene board
- laser cutting
- cutting device
- sheet metal
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 48
- 239000004698 Polyethylene Substances 0.000 title claims abstract description 41
- 229920000573 polyethylene Polymers 0.000 title claims abstract description 40
- -1 polyethylene Polymers 0.000 title claims abstract description 35
- 238000003698 laser cutting Methods 0.000 title claims abstract description 24
- 238000010276 construction Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 25
- 230000003746 surface roughness Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 33
- 238000003763 carbonization Methods 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000004804 winding Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000001413 cellular effect Effects 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The utility model discloses a kind of polyethylene board absorption platform for laser cutting device, comprise flat board and gripper shoe; Described flat board is the polyethylene board it offering multiple circular hole; Described flat board is positioned at the top of described gripper shoe, and the sidewall of described gripper shoe and/or bottom offer the vent constructions for connecting pump-line.Absorption platform of the present utility model, use the polyethylene board of band circular hole as flat board, PE plate presents milky usually, vestige like faint yellow cut is only produced after laser cutting, dust and the particle of carbonization can not be produced, therefore can not stick to contaminated materials on cut material, more can not cause solder joint and winding displacement part micro-short circuit and affect performance.Absorption platform of the present utility model can solve the cutting pollution problem of traditional absorption platform.
Description
[technical field]
The utility model relates to absorption platform, particularly relates to a kind of polyethylene board absorption platform for laser cutting device.
[background technology]
Have the multiple type of focusing in Laser Processing, conventional have focus lamp directly to focus on to add two kinds, flat field mirror with galvanometer, and wherein galvanometer adds the advantages such as the combination process velocity of flat field mirror is fast, method is flexible and is widely used.It without particular/special requirement, can carry the laser instrument of various wavelength, pulsewidth type for lasing light emitter.Rapidoprint, mainly in thinner plate material, comprises thin polymer film, glass, corrosion resistant plate, metallic film thin plate etc.
As shown in Figure 1, for galvanometer adds the structural representation of flat field mirror laser cutting device.Primary structure comprises board 1, motion platform 2, absorption platform 3, laser instrument and light path 4 (beam expanding lens, speculum, galvanometer, flat field mirror etc.) four parts.Wherein, absorption platform 3, for being placed on it by material to be cut, utilizing getter device to produce negative pressure of vacuum to adsorb immobilization material, then utilizes Laser Focusing to cut in material to be cut.
As shown in Figures 2 and 3, schematic top plan view and the schematic side view of laser cutting device is respectively.Absorption platform comprises peripheral support plate 302 and top hollowed-out board 301.Peripheral support plate 302 inside is cavity, connects outside pump-line, in internal cavities, form negative pressure by blow vent 7.Hollowed-out board 301 is for offering the flat board of the through hole of circle, hexagon or rectangular shape.Gripper shoe 302 covers hollowed-out board 301 be used for supporting cut material 9.The operation principle of absorption platform connects outside pump-line, suction system by blow vent 7, regulates suction by suction system, produces the object that negative pressure of vacuum reaches the fixing cut material 9 of absorption.
A shortcoming of this absorption platform is: material to be processed is placed on absorption platform after laser cutting, and the carbonization of normal generation hollowed-out board blackout consequently pollutes material to be processed, makes the phenomenon of rapidoprint degraded appearance.Time more serious, if pollution occurs in the position such as solder joint, golden finger also can produce micro-short circuit, converted products is caused to scrap.
[utility model content]
Technical problem to be solved in the utility model is: make up above-mentioned the deficiencies in the prior art, a kind of polyethylene board absorption platform for laser cutting device is proposed, when rapidoprint is placed on it and cuts, cut material can not be polluted or cause material micro-short circuit.
Technical problem of the present utility model is solved by following technical scheme:
For a polyethylene board absorption platform for laser cutting device, comprise flat board and gripper shoe; Described flat board is the polyethylene board it offering multiple circular hole; Described flat board is positioned at the top of described gripper shoe, and the sidewall of described gripper shoe and/or bottom offer the vent constructions for connecting pump-line.
In preferred technical scheme,
The diameter of the circular hole on described polyethylene board is at 2 ~ 5 millimeters, and multiple circular hole is array arrangement on described polyethylene board, and the line space of array arrangement and column pitch are 8 ~ 10 millimeters, and the surface roughness of described polyethylene board is less than 50 microns.
Described polyethylene board absorption platform also comprises cell structure, and described cell structure is arranged in the internal cavities of described gripper shoe; Described cell structure comprises staggered multiple sheet metal structure anyhow, and described sheet metal structure is the sheet metal being provided with multiple hole and groove, and described groove is arranged between two holes, for being mutually fitted together to for two sheet metal structures.
The beneficial effect that the utility model is compared with the prior art is:
Absorption platform of the present utility model, use the polyethylene board (PE plate) of band circular hole as dull and stereotyped, PE plate presents milky usually, vestige like faint yellow cut is only produced after laser cutting, dust and the particle of carbonization can not be produced, therefore can not stick to contaminated materials on cut material, more can not cause solder joint and winding displacement part micro-short circuit and affect performance.Further, the surface roughness of the PE plate used is less than 50 microns, and the line space of the diameter of circular hole on it and array of circular apertures arrangement, column pitch meet certain size requirement, make flat board itself on the one hand comparatively smooth, during placement cutting material, material is all more smooth everywhere, on polyethylene board, hole area accounts for the ratio of whole plate area about 30% on the other hand, much smaller than the hollow out ratio of traditional cellular hollowed-out board 95%, also depressed phenomenon is not had when material is placed on it, comparatively smooth, when finally guaranteeing that material is adsorbed, flatness is higher.Like this, when thinner or that focusing is comparatively responsive material is placed on absorption platform, also can effectively cut.
[accompanying drawing explanation]
Fig. 1 is the structural representation that galvanometer of the prior art adds flat field mirror laser cutting device;
Fig. 2 is the plan structure schematic diagram that galvanometer of the prior art adds flat field mirror laser cutting device
Fig. 3 is the side-looking structural representation that galvanometer of the prior art adds flat field mirror laser cutting device;
Fig. 4 is the structural representation of the absorption platform of the utility model detailed description of the invention;
Fig. 5 is the structural representation of the flat board of the absorption platform of the utility model detailed description of the invention;
Fig. 6 is the schematic diagram of the lattice structure in the absorption platform of the utility model detailed description of the invention;
Fig. 7 is the schematic diagram of the sheet metal structure in the absorption platform of the utility model detailed description of the invention;
Fig. 8 is that the sheet metal structure shown in Fig. 7 is staggered and forms the view of lattice structure.
[detailed description of the invention]
Contrast accompanying drawing below in conjunction with detailed description of the invention the utility model is described in further details.
As shown in Figure 4, be the structural representation of the absorption platform of this detailed description of the invention.Absorption platform comprises flat board 100, gripper shoe 102.Dull and stereotyped 100 is the polyethylene board it offering multiple circular hole, and flat board 100 is positioned at the top of gripper shoe 102, and the sidewall of gripper shoe 102 and/or bottom offer the vent constructions 7 for connecting pump-line.Wherein, vent constructions 7 can be set in side or the bottom surface of absorption platform, and quantity can be one and arrive multiple.
Preferably, as shown in Figure 5, the diameter of the circular hole on dull and stereotyped 100 is at 2 ~ 5 millimeters, multiple circular hole array arrangement on polyethylene board, the column pitch of array arrangement, also namely the distance of center circle of transversely adjacent two circular holes is from D1, and the line space of array arrangement, also namely longitudinally the distance of center circle of upper adjacent two circular holes is 8 ~ 10 millimeters from D2.It should be noted that, except the form of arranging according to square formation shown in figure, the form of any other dot matrix arrangement all can be used for herein, as long as line space and column pitch meet above-mentioned area requirement, such as, after circular hole arrangement peripherally form diamond shape, the staggered in the lateral or vertical direction latticed form of inner circular aperture also can be used for herein.The surface roughness of polyethylene board is less than 50 microns.
The absorption platform of this detailed description of the invention; upper flat plate adopts polyethylene (PE) material; cellular PC (Merlon) or PP (polypropylene) plastics are adopted relative to traditional platform; it can produce serious blackout carbonization phenomenon after being subject to laser cutting; the dust of carbonization and particle can stick on cut material, and contaminated materials makes degraded appearance.And PE plate presents milky usually, after laser cutting, only produce vestige like faint yellow cut, dust and the particle of carbonization can not be produced, therefore can not stick to contaminated materials on cut material, more can not cause solder joint and winding displacement part micro-short circuit and affect performance.Adopt the microporous polyethylene plate absorption platform of this detailed description of the invention, the cutting pollution problem of traditional absorption platform can be solved.Further, the surface roughness of the PE plate used is less than 50 microns, and the line space of the diameter of circular hole on it and array of circular apertures arrangement, column pitch meets certain size requirement, make flat board itself on the one hand comparatively smooth, during placement cutting material, material is all more smooth everywhere, on polyethylene board, hole area accounts for the ratio of whole plate area about 30% on the other hand, much smaller than the hollow out ratio of traditional cellular hollowed-out board 95%, also depressed phenomenon is not had when material is placed on it, comparatively smooth, when when the final flatness from flat board self and material are placed, flatness two aspects of material guarantee that material is adsorbed, flatness is higher.Like this, when thinner or that focusing is comparatively responsive material is placed on absorption platform, also can effectively cut.
As shown in Figure 4, preferably, adsorb flat board and also comprise cell structure 104.Cell structure 104 is positioned at the cavity of gripper shoe 102 inside.
As shown in Figure 6, be the schematic perspective view of cell structure.As shown in Figure 7, be the partial schematic diagram of sheet metal structure.Cell structure comprises staggered multiple sheet metal structure anyhow.Sheet metal structure is the sheet metal being provided with multiple hole 201 and groove 202, and groove 202 is arranged between two holes, for being fitted together to each other for two sheet metal structures.Shown in Fig. 6, a strip metal chip architecture offers in 17 holes 201, Fig. 7 and intercept local signal.Hole 201 is circular, and diameter can in 10 ~ 30mm.As shown in Figure 8, be the view that sheet metal structure is fitted together to each other, a sheet metal structure is longitudinally arranged, and another sheet metal structure is transversely arranged, and both are embedded by groove structure back-off, in right-angled intersection state.Cell structure is formed after multiple sheet metal structure of longitudinally setting and the sheet metal structure of multiple horizontally set intersect.Preferably, each grid of formation is cube structure, and its length of side is 15 ~ 40mm.If the grid length of side intersected to form is greater than 40mm, then effect is improved uniformly by not obvious to absorption affinity, be less than 15mm, then the too close absorption affinity of grid can be caused to diminish.
In above-mentioned lattice structure, the quantity in the hole that sheet metal is offered, the diameter in hole, the segmentation number of cavities that remote-effects are formed and volume thereof, in conjunction with the power of getter device, the parameters such as the size of blow vent, can arrange in pairs or groups each other by regulating these parameters, the size of the absorption affinity in cavity can be controlled.
In above-mentioned preferred version, lattice structure is set up in gripper shoe internal cavities, negative pressure cavity is divided into some little cavitys, be connected by the hole in lattice structure between cavity, flow velocity even in each little cavity can be made like this, make absorption affinity in whole cavity even, solve the problem of diverse location absorption affinity great disparity.The absorption platform of traditional structure, in internal cavities, the areas adjacent gas flow rate near apart from blow vent is high, therefore the cavity area suction near blow vent is large, cavity area suction away from blow vent is little, cause dull and stereotyped some region upper to adsorb material to be cut, some region then can not effectively be adsorbed.And in this detailed description of the invention, by the setting of lattice structure, making absorption affinity in cavity even, on flat board, various loci absorption affinity is even, even if adsorb some materials that are bending or warpage, also can adsorb smooth.
Above content is in conjunction with concrete preferred embodiment further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, make some substituting or obvious modification without departing from the concept of the premise utility, and performance or purposes identical, all should be considered as belonging to protection domain of the present utility model.
Claims (8)
1. for a polyethylene board absorption platform for laser cutting device, it is characterized in that: comprise flat board and gripper shoe; Described flat board is the polyethylene board it offering multiple circular hole; Described flat board is positioned at the top of described gripper shoe, and the sidewall of described gripper shoe and/or bottom offer the vent constructions for connecting pump-line.
2. the polyethylene board absorption platform for laser cutting device according to claim 1, it is characterized in that: the diameter of the circular hole on described polyethylene board is at 2 ~ 5 millimeters, multiple circular hole is array arrangement on described polyethylene board, the line space of array arrangement and column pitch are 8 ~ 10 millimeters, and the surface roughness of described polyethylene board is less than 50 microns.
3. the polyethylene board absorption platform for laser cutting device according to claim 1, is characterized in that: described polyethylene board absorption platform also comprises cell structure, and described cell structure is arranged in the internal cavities of described gripper shoe; Described cell structure comprises staggered multiple sheet metal structure anyhow, and described sheet metal structure is the sheet metal being provided with multiple hole and groove, and described groove is arranged between two holes, for being mutually fitted together to for two sheet metal structures.
4. the polyethylene board absorption platform for laser cutting device according to claim 3, is characterized in that: the hole on described sheet metal is for circular.
5. the polyethylene board absorption platform for laser cutting device according to claim 4, is characterized in that: the diameter in described hole is 10 ~ 30mm.
6. the polyethylene board absorption platform for laser cutting device according to claim 3, is characterized in that: the quantity in the hole on described sheet metal is 10 ~ 20.
7. the polyethylene board absorption platform for laser cutting device according to claim 3, is characterized in that: the described anyhow grid that staggered multiple sheet metal structure is formed is square.
8. the polyethylene board absorption platform for laser cutting device according to claim 7, is characterized in that: the length of side of described square is 15 ~ 40mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520301936.8U CN204725015U (en) | 2015-05-11 | 2015-05-11 | A kind of polyethylene board absorption platform for laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520301936.8U CN204725015U (en) | 2015-05-11 | 2015-05-11 | A kind of polyethylene board absorption platform for laser cutting device |
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| Publication Number | Publication Date |
|---|---|
| CN204725015U true CN204725015U (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520301936.8U Expired - Fee Related CN204725015U (en) | 2015-05-11 | 2015-05-11 | A kind of polyethylene board absorption platform for laser cutting device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106141796A (en) * | 2016-08-18 | 2016-11-23 | 苏州市华宁机械制造有限公司 | A kind of band adsorbs the cutting bed of scrappy part |
| CN106141519A (en) * | 2016-08-31 | 2016-11-23 | 株洲天瑞精密钣金有限公司 | A kind of negative-pressure adsorption welder and negative-pressure adsorption welding method |
| CN112236030A (en) * | 2020-08-28 | 2021-01-15 | 北京德鑫泉物联网科技股份有限公司 | Universal multi-layout sheet adsorption mechanism and working method |
| CN113787267A (en) * | 2021-10-28 | 2021-12-14 | 广东中科微精光子制造科技有限公司 | Golden finger laser cutting system and cutting method |
-
2015
- 2015-05-11 CN CN201520301936.8U patent/CN204725015U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106141796A (en) * | 2016-08-18 | 2016-11-23 | 苏州市华宁机械制造有限公司 | A kind of band adsorbs the cutting bed of scrappy part |
| CN106141519A (en) * | 2016-08-31 | 2016-11-23 | 株洲天瑞精密钣金有限公司 | A kind of negative-pressure adsorption welder and negative-pressure adsorption welding method |
| CN112236030A (en) * | 2020-08-28 | 2021-01-15 | 北京德鑫泉物联网科技股份有限公司 | Universal multi-layout sheet adsorption mechanism and working method |
| CN113787267A (en) * | 2021-10-28 | 2021-12-14 | 广东中科微精光子制造科技有限公司 | Golden finger laser cutting system and cutting method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151028 |
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| CF01 | Termination of patent right due to non-payment of annual fee |