CN114273777A - Laser processing system for improving drilling efficiency of circuit board - Google Patents
Laser processing system for improving drilling efficiency of circuit board Download PDFInfo
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- CN114273777A CN114273777A CN202111531705.2A CN202111531705A CN114273777A CN 114273777 A CN114273777 A CN 114273777A CN 202111531705 A CN202111531705 A CN 202111531705A CN 114273777 A CN114273777 A CN 114273777A
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Abstract
The invention provides a laser processing system for improving the drilling efficiency of a circuit board, which comprises a nanosecond laser (1), a first zoom beam expander (2), a first half wave plate (3), a first reflector group, a picosecond laser (5), a second zoom beam expander (6), a second half wave plate (7), a polarization splitting flat plate (8), a light gate (9), a second reflector group, a vibrating mirror (11) and a telecentric field lens (12). On the basis of single nanosecond laser beam processing, a picosecond laser beam is added for simultaneous processing, residues in a hole and slag at the edge of the hole can be cleaned, the efficiency and the quality are improved, the thermal influence of picoseconds on an insulating layer is low, and the insulating layer is not shrunk inwards; the limitation of processing can be overcome, nanosecond laser and picosecond laser all have solitary intensity control module, and two bundles of light can be according to the respective luminous power of processing requirement adjustment, can satisfy the processing of multiclass product, reduce cost.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser processing system for drilling a circuit board.
Background
Flexible circuit boards, also known as flexible circuit boards, wherein a double-sided copper foil flexible board is composed of two layers of copper foil, which form the base layer of the circuit, and an insulating film sandwiched between the layers, which also serves as a protective cover to insulate the circuit from dust and moisture and to reduce stress during flexing, the copper foil forming a conductive layer. There are many types of insulating film materials, but polyimide and polyester materials are most commonly used. The thickness of a common copper foil is about 15um generally, the thickness of an insulating film is about 20um generally, and a conducting hole or a blind guiding hole is processed on a copper foil flexible board because the copper layers need to be conductive. At present, a machining mode of a galvanometer and a field lens is generally adopted, so that the positioning precision is high, and the drilling efficiency is high. The laser is generally an ultraviolet nanosecond laser, and an ultraviolet nanosecond laser focusing light spot is generally 7-10um, so that the power density can be improved, and the copper layer can be effectively processed.
However, in the processing process, some holes are not drilled completely or residues exist, and the phenomenon can be improved by increasing the power, but the excessive power can cause the heat to be too high, so that copper residue accumulation and insulation film retraction at the edge of the hole are caused, and the difficulty and cost of the subsequent process are increased; the phenomenon can be improved by increasing the times, but the processing efficiency can be greatly influenced, the time cost is increased, and the problem of how to efficiently process the high-quality copper foil soft board becomes a problem to be broken through.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a laser processing system for improving the drilling efficiency of a circuit board, which comprises a nanosecond laser, a first zoom beam expander, a first half wave plate, a first reflector group, a picosecond laser, a second zoom beam expander, a second half wave plate, a polarization beam splitter, an optical gate, a second reflector group, a vibrating mirror and a telecentric field lens; a first zoom beam expander is arranged at an outlet of the nanosecond laser, a first half wave plate is arranged behind the first zoom beam expander, and a first reflector group is arranged behind the first half wave plate; the second variable-power beam expander is placed at the exit of the picosecond laser, a second half wave plate is arranged behind the second variable-power beam expander, a polarization beam splitting flat plate is placed behind the second half wave plate, a beam combining part of the reflection part of the nanosecond light beam and the transmission part of the picosecond light beam is arranged below the polarization beam splitting flat plate, a beam combining part of the right nanosecond light beam and the reflection part of the picosecond light beam is blocked by an optical gate, a beam combining part below the polarization beam splitting flat plate is reflected into a vibrating mirror through a second reflector group, and then the double-sided copper foil soft plate is drilled through the telecentric field lens.
As a further improvement of the invention, the light focused to the double-sided copper foil soft plate by the telecentric field lens has nanosecond light beams and picosecond light beams, the sizes of focusing light spots of the two light beams are consistent, the focusing positions are overlapped, and the scanning paths are overlapped.
As a further improvement of the invention, the first variable-power beam expander and the second variable-power beam expander are matched and debugged according to the spot size of the nanosecond laser beam and the spot size of the picosecond laser beam, so that the spot sizes of the two paths of light beams and the divergence angle of the light beams are kept consistent.
As a further improvement of the present invention, the first reflecting mirror group is a first 45 ° reflecting mirror.
As a further improvement of the present invention, the second mirror group is a second 45 ° mirror.
As a further improvement of the invention, the polarization beam splitter is replaced by a beam combiner.
As a further improvement of the invention, the polarization beam splitter is a 45-degree incident beam splitter.
The invention has the beneficial effects that:
the system device has the following characteristics:
on the basis of single nanosecond laser beam processing, a picosecond laser beam is added for simultaneous processing, residues in a hole and slag at the edge of the hole can be cleaned, the efficiency and the quality are improved, the thermal influence of picoseconds on an insulating layer is low, and the insulating layer is not shrunk inwards;
the limitation of processing can be overcome, nanosecond laser and picosecond laser all have solitary intensity control module, and two bundles of light can be according to the respective luminous power of processing requirement adjustment, can satisfy the processing of multiclass product, reduce cost.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the light splitting principle of a polarization beam splitter;
FIG. 3 is a graph of single nanosecond laser drilling effect;
FIG. 4 is a graph of the effect of drilling the nanosecond laser process parameters of FIG. 3 with a picosecond laser;
FIG. 5 is a diagram of the drilling effect of a single nanosecond laser machining double-sided copper foil soft plate;
FIG. 6 is a graph of the effect of increasing the drilling rate and decreasing the number of holes drilled by the picosecond laser of FIG. 5.
The names of the components in the figure are as follows:
the device comprises a nanosecond laser 1, a first variable-power beam expander 2, a first half wave plate 3, a first 45-degree reflector 4, a picosecond laser 5, a second variable-power beam expander 6, a second half wave plate 7, a polarization beam splitting flat plate 8, an optical gate 9, a second 45-degree reflector 10, a vibrating mirror 11, a telecentric field lens 12 and a double-sided copper foil soft plate 13.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The design scheme adopted by the invention is as follows:
the utility model provides a laser processing system of promotion circuit board drilling efficiency, includes nanosecond laser 1, first variable power beam expander 2, first half wave plate 3, first 45 speculum 4, picosecond laser 5, second variable power beam expander 6, second half wave plate 7, polarization beam splitting plain film 8, optical gate 9, second 45 speculum 10, galvanometer 11, telecentric mirror 12 and two-sided copper foil soft board 13. A first zoom beam expander 2 is arranged at an outlet of the nanosecond laser 1, a first half wave plate 3 is arranged behind the first zoom beam expander 2, and a first 45-degree reflector 4 is arranged behind the first half wave plate 3; a second variable-power beam expander 6 is arranged at an outlet of the picosecond laser 5, a second half wave plate 7 is arranged behind the second variable-power beam expander 6, a polarization splitting flat plate 8 is arranged behind the second half wave plate 7, a beam of a reflection part of the nanosecond light beam and a beam of a transmission part of the picosecond light beam are combined below the polarization splitting flat plate 8, a beam of a transmission part of the right nanosecond light beam and a beam of a reflection part of the picosecond light beam are combined, the right combined beam is blocked by an optical gate 9, a beam combining part below the polarization splitting flat plate is reflected into a vibrating mirror 11 through a second 45-degree reflecting mirror 10, and then the double-sided copper foil soft plate 13 is drilled through a telecentric field lens 12.
The light path is formed by combining two paths into one path, wherein the other path is a light beam emitted by the nanosecond laser 1, and the other path is a light beam emitted by the picosecond laser 5.
The first variable-power beam expander 2 and the second variable-power beam expander 6 need to be matched and debugged according to the spot size of the light beam of the nanosecond laser 1 and the spot size of the light beam of the picosecond laser 5, and the purpose is to enable the spot sizes of the two paths of light beams to be consistent with the divergence angle of the light beams.
The first half wave plate 3 and the second half wave plate 7 need to be matched with the polarization beam splitter plate 8 for use, and the first half wave plate 3 and the second half wave plate 7 are rotated according to different power requirements. The polarization beam splitter plate 8 may be replaced by a beam combiner.
The polarization beam splitter is SP (beam splitter) with 45-degree incidence, and the proportion of transmitted energy and reflected energy can be changed by adjusting the polarization state of incident light;
the light focused to the double-sided copper foil flexible board 13 by the telecentric field lens 12 has nanosecond light beams and picosecond light beams, the sizes of focusing light spots of the two light beams are consistent, the focusing positions are overlapped, and the scanning paths are overlapped;
the power of the nanosecond light beam reaching the double-sided copper foil soft plate 13 is common nanosecond processing power, and the power of the picosecond light beam reaching the double-sided copper foil soft plate 13 can be debugged according to specific processing environment and processing requirements;
the invention adopts a double-light-path beam combination mode, combines a nanosecond laser beam and a picosecond laser beam into one beam, and simultaneously carries out drilling processing on a double-sided copper foil soft plate.
On the basis of single nanosecond laser beam machining, a picosecond laser beam is added for simultaneous machining, residues in a hole and slag at the edge of the hole can be cleaned, the efficiency and the quality are improved, the thermal influence of picoseconds on an insulating layer is low, and the insulating layer is not shrunk inwards.
1. The single nanosecond laser drilling effect is shown in fig. 3:
in fig. 3, it can be seen that the hole has no residue to clean, and the drilling effect is shown in fig. 4 when the same nanosecond laser processing parameters are added to the picosecond laser: in fig. 4, the residue was cleaned after the picosecond laser was applied.
2. Changing nanosecond laser processing parameters to enable the single nanosecond laser to process the double-sided copper foil soft board, wherein the drilling effect is shown in figure 5.
And meanwhile, picosecond laser is added, the drilling speed is increased, the drilling frequency is reduced, and the drilling effect is as shown in figure 6: in fig. 6, it is found that the efficiency is improved, the normal processing is also possible, and the insulating layer does not shrink inward;
the experimental data can prove that the nanosecond plus picosecond simultaneous drilling processing of the double-sided copper foil soft plate can not only improve the efficiency and the quality, but also can not damage the insulating layer.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (7)
1. The utility model provides a promote laser beam machining system of circuit board drilling efficiency which characterized in that: the device comprises a nanosecond laser (1), a first zoom beam expander (2), a first half wave plate (3), a first reflector group, a picosecond laser (5), a second zoom beam expander (6), a second half wave plate (7), a polarization beam splitting flat plate (8), an optical gate (9), a second reflector group, a vibrating mirror (11) and a telecentric field lens (12); a first zoom beam expander (2) is arranged at an outlet of the nanosecond laser (1), a first half wave plate (3) is arranged behind the first zoom beam expander (2), and a first reflector group is arranged behind the first half wave plate (3); second variable power beam expander (6) are placed to picosecond laser instrument (5) exit, second variable power beam expander (6) rear is second half wave plate (7), place polarization beam splitting plain film (8) behind second half wave plate (7), polarization beam splitting plain film (8) below is the beam that closes of reflection part and the transmission part of picosecond light beam of nanosecond light beam, the beam that closes of transmission part and the reflection part of picosecond light beam of right-hand nanosecond light, right-hand beam that closes is kept off by optical gate (9), the beam portion that closes in the below is reflected into galvanometer (11) through second mirror group, then carry out drilling processing through telecentric field lens (12) to two-sided copper foil soft board (13).
2. The laser processing system for improving the drilling efficiency of the circuit board according to claim 1, wherein: the light focused to the double-sided copper foil soft plate (13) through the telecentric field lens (12) has nanosecond light beams and picosecond light beams, the sizes of focusing light spots of the two light beams are consistent, the focusing positions are overlapped, and the scanning paths are overlapped.
3. The laser processing system for improving the drilling efficiency of the circuit board according to claim 1, wherein: the first variable-power beam expander (2) and the second variable-power beam expander (6) are matched and debugged according to the spot size of the light beam of the nanosecond laser (1) and the spot size of the light beam of the picosecond laser (5), so that the spot sizes of the two paths of light beams and the divergence angle of the light beams are kept consistent.
4. The laser processing system for improving the drilling efficiency of the circuit board according to claim 1, wherein: the first reflector group is a first 45-degree reflector (4).
5. The laser processing system for improving the drilling efficiency of the circuit board according to claim 1, wherein: the second reflector group is a second 45-degree reflector (10).
6. The laser processing system for improving the drilling efficiency of the circuit board according to claim 1, wherein: the polarization beam splitter (8) is replaced by a beam combiner.
7. The laser processing system for improving the drilling efficiency of the circuit board according to claim 1, wherein: the polarization beam splitter (8) is a 45-degree incident beam splitter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111531705.2A CN114273777A (en) | 2021-12-14 | 2021-12-14 | Laser processing system for improving drilling efficiency of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111531705.2A CN114273777A (en) | 2021-12-14 | 2021-12-14 | Laser processing system for improving drilling efficiency of circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114682934A (en) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | Multi-pulse width composite printed circuit board laser processing device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741798A (en) * | 2015-03-24 | 2015-07-01 | 张立国 | Composite focus space-time synchronized drilling system and method |
| CN104889576A (en) * | 2015-06-26 | 2015-09-09 | 中国工程物理研究院上海激光等离子体研究所 | Preparation method and preparation device of high-depth-diameter ratio micropores |
| CN105397314A (en) * | 2015-12-31 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Composite pulse laser drilling method and device |
| CN110640338A (en) * | 2019-08-21 | 2020-01-03 | 江苏大学 | Composite pulse laser deep hole processing device based on Bessel light beam |
| CN111390380A (en) * | 2019-01-01 | 2020-07-10 | 达航科技股份有限公司 | Laser processing method for printed circuit board and laser processing machine thereof |
| CN113271729A (en) * | 2021-05-27 | 2021-08-17 | 武汉铱科赛科技有限公司 | Circuit board through hole drilling method, device and system capable of avoiding hole blockage |
| CN214800093U (en) * | 2021-05-27 | 2021-11-19 | 武汉铱科赛科技有限公司 | Circuit board through hole drilling equipment and system capable of avoiding hole blockage |
| CN214867994U (en) * | 2021-04-14 | 2021-11-26 | 曾宪方 | Laser processing device and wafer processing equipment |
-
2021
- 2021-12-14 CN CN202111531705.2A patent/CN114273777A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741798A (en) * | 2015-03-24 | 2015-07-01 | 张立国 | Composite focus space-time synchronized drilling system and method |
| CN104889576A (en) * | 2015-06-26 | 2015-09-09 | 中国工程物理研究院上海激光等离子体研究所 | Preparation method and preparation device of high-depth-diameter ratio micropores |
| CN105397314A (en) * | 2015-12-31 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Composite pulse laser drilling method and device |
| CN111390380A (en) * | 2019-01-01 | 2020-07-10 | 达航科技股份有限公司 | Laser processing method for printed circuit board and laser processing machine thereof |
| CN110640338A (en) * | 2019-08-21 | 2020-01-03 | 江苏大学 | Composite pulse laser deep hole processing device based on Bessel light beam |
| CN214867994U (en) * | 2021-04-14 | 2021-11-26 | 曾宪方 | Laser processing device and wafer processing equipment |
| CN113271729A (en) * | 2021-05-27 | 2021-08-17 | 武汉铱科赛科技有限公司 | Circuit board through hole drilling method, device and system capable of avoiding hole blockage |
| CN214800093U (en) * | 2021-05-27 | 2021-11-19 | 武汉铱科赛科技有限公司 | Circuit board through hole drilling equipment and system capable of avoiding hole blockage |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114682934A (en) * | 2022-06-01 | 2022-07-01 | 杭州凌像科技有限公司 | Multi-pulse width composite printed circuit board laser processing device |
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