CN101898278A - Laser processing method - Google Patents
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- CN101898278A CN101898278A CN 200910107653 CN200910107653A CN101898278A CN 101898278 A CN101898278 A CN 101898278A CN 200910107653 CN200910107653 CN 200910107653 CN 200910107653 A CN200910107653 A CN 200910107653A CN 101898278 A CN101898278 A CN 101898278A
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Abstract
The invention provides a laser processing method, and belongs to the field of laser processing. The method comprises the following steps of: forming a water-soluble protective film on a surface of a workpiece to be processed; carrying out laser processing on the workpiece containing the water-soluble protective film; and removing the water-soluble protective film on the laser processing surface after the laser processing. The laser processing method provided by the invention overcomes the defects that an oxide layer is generated on the surface of the workpiece in the laser processing and molten slag is difficult to remove, so the method is not only suitable for electronic product shells of metal products made from different materials and also suitable for electronic product shells subjected to various surface decorations.
Description
Technical field
The present invention relates to a kind of laser processing technology, relate in particular to a kind of laser processing that the Laser Processing surface of the work is protected.
Background technology
Laser processing technology is the high characteristics of power density of utilizing laser, with its focusing, makes rapidoprint moment be heated fusing, vaporization; Because Laser Processing shines laser beam the local surfaces of object, the temperature of working position is very high, this hot operation characteristic of Laser Processing makes the edge of machining area the oxide layer of a circle blackout can occur, especially for electronic product metal shell, can have a strong impact on the apparent effect of metal shell through incrustation.Simultaneously, melted material is squeezed out by the residual compression of steam, and that discharges from the processing district dissolves or the rapidoprint of gaseous form, in process and after the process owing to cool off and stick on the surface of processing work.This slag adhesiveness of solidifying again is stronger, is difficult to dispose.
Summary of the invention
To be Laser Processing produce oxide layer and the slag that is difficult for removing influence the defective of the apparent effect of workpiece at surface of the work to the technical problem to be solved in the present invention, thereby a kind of slag that surface of the work does not produce oxide layer and generation when making Laser Processing laser processing of removal easily is provided.
The invention provides a kind of laser processing; the surface that this method is included in workpiece to be processed forms water-soluble diaphragm; then the workpiece that contains water-soluble diaphragm is carried out Laser Processing, after described Laser Processing, remove the water-soluble diaphragm on Laser Processing surface.
Laser processing provided by the invention, overcome the defective of Laser Processing at surface of the work generation oxide layer and the difficult slag of removing, not only be widely used in the electronic product casing (comprising stainless steel, aluminium alloy, copper etc.) of the metallic article of unlike material, also be applicable to through the electronic product casing (comprising sandblast, wire drawing, anodic oxidation, PVD and plating etc.) behind the various incrustations.
Description of drawings
Fig. 1 be embodiment 1 laser boring and remove diaphragm after 50 times of the amplifications of workpiece the time metallograph;
Fig. 2 be Comparative Examples 1 laser boring and remove diaphragm after 50 times of the amplifications of workpiece the time metallograph;
Fig. 3 be embodiment 1 laser boring and remove diaphragm after 200 times of the amplifications of workpiece the time metallograph;
Fig. 4 be Comparative Examples 1 laser boring and remove diaphragm after 200 times of the amplifications of workpiece the time metallograph.
The specific embodiment
The invention provides a kind of laser processing; the surface that this method is included in workpiece to be processed forms water-soluble diaphragm; then the workpiece that contains water-soluble diaphragm is carried out Laser Processing, after described Laser Processing, remove the water-soluble diaphragm on Laser Processing surface.
According to laser processing of the present invention, the thickness of described water-soluble diaphragm is relevant with the size aperture that needs processing, and in the preferred case, the thickness of described water-soluble diaphragm is 0.001～2mm.If thickness greater than 2mm, can be wasted laser energy; If thickness is less than 0.001mm, the diaphragm work in-process may be destroyed, can not protect the processing work surface fully.
According to laser processing of the present invention, in the preferred case, the method for the water-soluble diaphragm of described formation has a variety of, and the present invention is the aqueous solution that applies one deck water-soluble polymer at surface of the work, and baking forms diaphragm then.The method of described coating can be various technology as well known to those skilled in the art, and embodiments of the invention are preferably the wet method of drenching or spraying.
Laser processing of the present invention, in the preferred case, the mean molecule quantity of described water soluble (CO) polymers is 2000～300000, and the mean molecule quantity of water-soluble polymer is in above-mentioned scope, and water-soluble polymer has better water solubility.
According to laser processing of the present invention, in the preferred case, described water soluble (CO) polymers is polyethylene glycol and/or polyvinyl alcohol.Described polyethylene glycol and polyvinyl alcohol have good water-solubility and film forming, and they still are common chemical raw materials simultaneously, easily obtain, and cost is low.
According to laser processing of the present invention, in the preferred case, comprise that also the aqueous solution with water-soluble polymer stirs under 50～120 ℃ of temperature, the speed of stirring is 60～200r/min.In this temperature range, help the dissolving of water-soluble polymer, in this mixing speed scope, can stir rapidly, and generation bubble that can be few as far as possible.
According to laser processing of the present invention, in the preferred case, also comprise the bubble of the aqueous solution of removing water-soluble polymer.The method of removing bubble can be a various technology known in those skilled in the art, and what the present invention was used is the method for the centrifugal removal bubble of centrifuge or the generation that adds defoamer inhibition bubble.
According to laser processing of the present invention, in the preferred case, the temperature of described baking is 65～70 ℃, and the time of baking is 15～40min.Water-soluble polymer film forming rapidly in the scope at this moment, if the time is too short, solution is film forming not also, the time, oversize words were lost time and energy very much.
According to laser processing of the present invention; in the preferred case; it is of the present invention that the workpiece that contains water-soluble diaphragm is carried out Laser Processing is to adopt laser-beam drilling machine that the workpiece that is coated with diaphragm is carried out Laser Processing as requested; the embodiment of the invention is that workpiece is carried out capillary processing, obtains the pattern that is formed by a plurality of arrays of openings.The bore dia of the capillary processing of the embodiment of the invention is the 0.007-0.35 millimeter, and pitch of holes is the 0.1-0.79 millimeter.The power of laser boring is 20 watts, and speed is 300 mm/second, and frequency is 20 hertz.
According to laser processing of the present invention; in the preferred case; the method of removing the water-soluble diaphragm on Laser Processing surface after described Laser Processing of the present invention is put into deionized water for ultrasonic for the workpiece that Laser Processing is intact and was cleaned 10-20 minute; put into baking box then, under 60-70 ℃ temperature, dry.
Below will the invention will be further described by embodiment.
Embodiment 1
1, the preparation of the preparation of the aqueous solution of water-soluble polymer and water-soluble diaphragm
(molecular formula is HOCH with polyethylene glycol
2(CH
2O CH
2)
NCH
2OH, mean molecule quantity are 4000) 1000g/L, stirred 30 minutes at 50 ℃ temperature lower magnetic forces, rotating speed is 100r/min, puts into the centrifugal 10min of centrifuge obtains water-soluble polymer with the bubble of sloughing solution the aqueous solution then.
With wet mode of drenching the aqueous solution of water-soluble polymer is coated on 0.7 millimeter the surface of aluminium alloy (model is 5052); Put into baking box, baking is 15 minutes under 70 ℃ temperature, and finally forming thickness on aluminum alloy surface is the water-soluble surface protection film of 0.05mm.
2, the Laser Processing of electronic product casing
Adopt laser-beam drilling machine (model of Chinese workers' laser production is the LSF20 laser-beam drilling machine) that the aluminium alloy that contains diaphragm that obtains in the step 1 is carried out capillary processing, obtain the rectangular patterns that forms by a plurality of arrays of openings.The bore dia of described through hole is 0.35 millimeter, and pitch of holes is 0.79 millimeter.The power of laser boring is 20 watts, and speed is 300 mm/second, and frequency is 20 hertz.
3, the removal of water-soluble surface protection film
Aluminium alloy after the Laser Processing is put into deionized water for ultrasonic cleaned 10 minutes, put into baking box, under 65 ℃ temperature, dry.As accompanying drawing 1 and shown in Figure 3, the laser micropore edge that applies water-soluble surface protection film is smooth, and surperficial non-oxidation layer, is smooth to the touch.
Embodiment 2
1, the preparation of the preparation of the aqueous solution of water-soluble polymer and water-soluble diaphragm
With the polyvinyl alcohol of 55g/L, mean molecule quantity is 25000, stirs dissolving in 35 minutes under 95 ℃ temperature, and the speed of stirring is 95r/min, puts into centrifuge then and sloughs the aqueous solution that the solution bubble obtains water-soluble polymer in centrifugal 15 minutes.
With the mode of spraying the aqueous solution of water-soluble polymer being coated in thickness is that (model: 5052) on the surface, put into baking box, baking is 15 minutes under 65 ℃ temperature, finally forms thickness and be 0.01 micron water-soluble surface protection film for 0.6 millimeter aluminium alloy.
2, the Laser Processing of electronic product casing
Adopting laser-beam drilling machine (model of Chinese workers' laser production is the laser-beam drilling machine of LSF20) to carry out aluminum alloy base material after step 1 is handled carries out capillary processing and obtains the pattern that formed by a plurality of arrays of openings, the bore dia of described through hole is 0.007 millimeter, and pitch of holes is 0.1 millimeter.The power of laser boring is 20 watts, and speed is 300 mm/second, and frequency is 20 hertz.
3, the removal of water-soluble surface protection film
Aluminium alloy after the Laser Processing is put into deionized water for ultrasonic cleaned 10 minutes, put into baking box, under 65 ℃ temperature, dry.The laser micropore edge that applies water-soluble surface protection film is smooth, and surperficial non-oxidation layer, is smooth to the touch.
Embodiment 3
1, the preparation of the preparation of the aqueous solution of water-soluble polymer and water-soluble diaphragm
Polyvinyl alcohol with 60g/L; mean molecule quantity is 78000; under 95 ℃ temperature, stir dissolving in 35 minutes; rotating speed is 200r/min, adds the octanol of defoamer 0.05%, when containing defoamer in the poly-vinyl alcohol solution; defoamer particle can destroy the elastic membrane of bubble; suppress the generation of foam, continue to stir 10 minutes, slough the aqueous solution that bubble in the solution obtains water-soluble polymer.
Be coated on the surface that thickness is 0.6 millimeter aluminium alloy (model is 5052) with the aqueous solution of the mode that sprays water-soluble polymer; put into baking box; baking is 20 minutes under 70 ℃ temperature, finally forms thickness and be 0.001 millimeter water-soluble surface protection film.
2, the Laser Processing of electronic product casing
Adopt laser-beam drilling machine (model of Chinese workers' laser production is the laser-beam drilling machine of LSF20) that the aluminum alloy base material that contains diaphragm that obtains in the step 1 is carried out capillary processing and obtain the pattern that forms by a plurality of arrays of openings; the bore dia of described through hole is 0.007 millimeter, and pitch of holes is 0.1 millimeter.The power of laser boring is 20 watts, and speed is 300 mm/second, and frequency is 20 hertz.
3, the removal of water-soluble surface protection film
Aluminium alloy after the Laser Processing is put into deionized water for ultrasonic cleaned 12 minutes, put into baking box, under 68 ℃ temperature, dry.The laser micropore edge that applies water-soluble surface protection film is smooth, and surperficial non-oxidation layer, is smooth to the touch.
Comparative Examples 1
1, the Laser Processing of electronic product casing
Employing laser-beam drilling machine (model of Chinese workers' laser production is the LSF20 laser-beam drilling machine) is 0.7 millimeter aluminium alloy (model: 5052) carry out capillary processing, obtain the rectangular patterns that is formed by a plurality of arrays of openings to thickness.The bore dia of described through hole is 0.35 millimeter, and pitch of holes is 0.79 millimeter.The power of laser boring is 20 watts, and speed is 300 mm/second, and frequency is 20 hertz.
2, the removal of alloy surface residue
The workpiece that Laser Processing is intact is put into deionized water for ultrasonic and was cleaned 10 minutes, puts into baking box, dries under 65 ℃ temperature.As accompanying drawing 2 and shown in Figure 4, the obscurity boundary of laser micropore, and there are visual oxide layer, feel hairiness defect in the surface.
Method of testing
Metallograph: (model: Axio Imager.Alm) take, multiplication factor is respectively 50 times and 200 times, and the multiplication factor of Fig. 1 and Fig. 2 is 50, and the multiplication factor of Fig. 3 and Fig. 4 is 200 with the ZEISS metallographic microscope.
Claims (8)
1. laser processing; it is characterized in that; the water-soluble diaphragm of formation that this method is included in the workpiece to be processed surface carries out Laser Processing to the workpiece that contains water-soluble diaphragm then, removes the water-soluble diaphragm on Laser Processing surface after described Laser Processing.
2. laser processing according to claim 1, the thickness of described water-soluble diaphragm are 0.001～2mm.
3. laser processing according to claim 1, the method for the water-soluble diaphragm of described formation are the aqueous solution that applies one deck water-soluble polymer at surface of the work, and baking forms diaphragm then.
4. laser processing according to claim 3, the mean molecule quantity of described water-soluble polymer are 2000～300000.
5. laser processing according to claim 3, described water-soluble polymer are polyethylene glycol and/or polyvinyl alcohol.
6. laser processing according to claim 3 comprises that also the aqueous solution with water-soluble polymer stirs under 50～120 temperature, the speed of described stirring is 60～200r/min.
7. laser processing according to claim 3 also comprises the bubble of the aqueous solution of removing water-soluble polymer.
8. laser processing according to claim 3, the temperature of described baking are 65～70 ℃, and the time of baking is 15～40min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910107653 CN101898278A (en) | 2009-05-27 | 2009-05-27 | Laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910107653 CN101898278A (en) | 2009-05-27 | 2009-05-27 | Laser processing method |
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|---|---|
| CN101898278A true CN101898278A (en) | 2010-12-01 |
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|---|---|---|---|
| CN 200910107653 Pending CN101898278A (en) | 2009-05-27 | 2009-05-27 | Laser processing method |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741798A (en) * | 2015-03-24 | 2015-07-01 | 张立国 | Composite focus space-time synchronized drilling system and method |
| CN105234565A (en) * | 2015-09-14 | 2016-01-13 | 维沃移动通信有限公司 | Hole machining method for electronic equipment shell and electronic equipment |
| CN105499812A (en) * | 2016-01-08 | 2016-04-20 | 常州英诺激光科技有限公司 | Method for increasing laser processing quality of ceramic radiating substrate |
| CN110587157A (en) * | 2019-08-28 | 2019-12-20 | 东莞南玻太阳能玻璃有限公司 | Solar patterned glass laser drilling auxiliary liquid and preparation method thereof |
| CN111408530A (en) * | 2019-12-25 | 2020-07-14 | 丽水市正阳电力设计院有限公司 | Surface treatment method of weathering resistant steel |
| CN111745890A (en) * | 2020-06-09 | 2020-10-09 | 余新军 | Method for injection molding of TPU (thermoplastic polyurethane) on surface of leather |
| CN112122797A (en) * | 2020-09-24 | 2020-12-25 | 松山湖材料实验室 | Laser processing slag removal method, system, computer device and readable storage medium |
| CN112853458A (en) * | 2021-01-08 | 2021-05-28 | 常州晶业液态金属有限公司 | Method for processing amorphous alloy by electrochemical material removal |
| CN114134654A (en) * | 2021-12-31 | 2022-03-04 | 东莞市新菲林纺织有限公司 | 3D embroidery and embroidery method thereof |
| CN114901420A (en) * | 2020-02-06 | 2022-08-12 | 东洋制罐株式会社 | Method for producing decorated aluminum substrate and decorated aluminum substrate |
| CN115305464A (en) * | 2022-08-23 | 2022-11-08 | 江门市安诺特炊具制造有限公司 | Surface treatment method of aluminum alloy cooker and aluminum alloy cooker |
-
2009
- 2009-05-27 CN CN 200910107653 patent/CN101898278A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741798A (en) * | 2015-03-24 | 2015-07-01 | 张立国 | Composite focus space-time synchronized drilling system and method |
| CN104741798B (en) * | 2015-03-24 | 2016-06-08 | 张立国 | A kind of complex foci space-time synchronous hole-drilling system and method |
| CN105234565A (en) * | 2015-09-14 | 2016-01-13 | 维沃移动通信有限公司 | Hole machining method for electronic equipment shell and electronic equipment |
| CN105234565B (en) * | 2015-09-14 | 2017-05-17 | 维沃移动通信有限公司 | Hole machining method for electronic equipment shell and electronic equipment |
| CN105499812A (en) * | 2016-01-08 | 2016-04-20 | 常州英诺激光科技有限公司 | Method for increasing laser processing quality of ceramic radiating substrate |
| CN110587157A (en) * | 2019-08-28 | 2019-12-20 | 东莞南玻太阳能玻璃有限公司 | Solar patterned glass laser drilling auxiliary liquid and preparation method thereof |
| CN111408530A (en) * | 2019-12-25 | 2020-07-14 | 丽水市正阳电力设计院有限公司 | Surface treatment method of weathering resistant steel |
| CN111408530B (en) * | 2019-12-25 | 2022-05-10 | 丽水市正阳电力设计院有限公司 | Surface treatment method of weathering resistant steel |
| CN114901420A (en) * | 2020-02-06 | 2022-08-12 | 东洋制罐株式会社 | Method for producing decorated aluminum substrate and decorated aluminum substrate |
| CN111745890A (en) * | 2020-06-09 | 2020-10-09 | 余新军 | Method for injection molding of TPU (thermoplastic polyurethane) on surface of leather |
| CN112122797A (en) * | 2020-09-24 | 2020-12-25 | 松山湖材料实验室 | Laser processing slag removal method, system, computer device and readable storage medium |
| CN112853458A (en) * | 2021-01-08 | 2021-05-28 | 常州晶业液态金属有限公司 | Method for processing amorphous alloy by electrochemical material removal |
| CN114134654A (en) * | 2021-12-31 | 2022-03-04 | 东莞市新菲林纺织有限公司 | 3D embroidery and embroidery method thereof |
| CN115305464A (en) * | 2022-08-23 | 2022-11-08 | 江门市安诺特炊具制造有限公司 | Surface treatment method of aluminum alloy cooker and aluminum alloy cooker |
| CN115305464B (en) * | 2022-08-23 | 2024-02-06 | 江门市安诺特炊具制造有限公司 | Surface treatment method of aluminum alloy cooker and aluminum alloy cooker |
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Application publication date: 20101201 |
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