CN105234565B - Hole machining method for electronic equipment shell and electronic equipment - Google Patents
Hole machining method for electronic equipment shell and electronic equipment Download PDFInfo
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- CN105234565B CN105234565B CN201510582958.0A CN201510582958A CN105234565B CN 105234565 B CN105234565 B CN 105234565B CN 201510582958 A CN201510582958 A CN 201510582958A CN 105234565 B CN105234565 B CN 105234565B
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Abstract
The embodiment of the invention discloses a hole machining method for an electronic equipment shell. The method includes the steps that a protective film is attached to the corresponding position of the shell; laser etching is performed on the corresponding position of the shell through laser so as to form a through hole; and sand blasting is performed and the protective film is removed. The invention further provides corresponding electronic equipment. The method is used for solving the problems of high cost and long time of hole machining of electronic equipment shells in the prior art.
Description
Technical field
The present invention relates to the hole forming method and electronic equipment of material processing field, especially a kind of electronic equipment shell.
Background technology
In the prior art, electronic equipment often realizes that the outer of sound is put using the form of speaker net or sender.And mesh
Front plastic surface micropore technique uses machined form, the machining process be by cutter outside electronic equipment
The relevant position punching of shell.
Because machining needs to prepare cutter, and each cutter can only process 200~300 holes, cause to be processed into
This height, long processing time.
The content of the invention
The embodiment of the present invention provides the hole forming method and electronic equipment of a kind of electronic equipment shell, to solve existing skill
The hole machined high cost of electronic equipment casing and the problems such as the long time in art.
The hole forming method of a kind of electronic equipment shell provided in an embodiment of the present invention, including：
Protecting film is attached to into the relevant position of the shell；
Using laser, laser carving forms through hole in the relevant position of the shell；
Blasting treatment；
Remove the protecting film.
The embodiment of the present invention additionally provides a kind of electronic equipment, and the electronic equipment casing is added using above-mentioned hole forming method
Work.
The hole forming method of electronic equipment casing provided in an embodiment of the present invention, by the way that protecting film is attached to into the shell
Relevant position, through hole is formed in the relevant position of the shell using laser boring, it is described logical using blasting craft process
Internal surface of hole, removes the protecting film, and with the laser boring hole forming method that simultaneously sandblasting is cleaned inexpensive, efficient mesh is realized
's.
Description of the drawings
Technical scheme in order to be illustrated more clearly that the embodiment of the present invention, below will be to making needed for embodiment description
Accompanying drawing is briefly described, and drawings in the following description are only the accompanying drawing of some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, can be attached to obtain others according to these accompanying drawings
Figure.
Fig. 1 is the schematic flow sheet of the hole forming method of the electronic equipment casing of the embodiment of the present invention；
Fig. 2 is that the employing blasting craft of the hole forming method of the electronic equipment casing of the embodiment of the present invention processes the through hole
The schematic flow sheet of inner surface；
Fig. 3 is the perforated area structural representation of the electronic equipment casing of the embodiment of the present invention.
Specific embodiment
In order that technical problem solved by the invention, technical scheme and beneficial effect become more apparent, below in conjunction with
Drawings and Examples, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
In describing the invention, it is to be understood that term " longitudinal direction ", " radial direction ", " length ", " width ", " thickness
Degree ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", the side of the instruction such as " outward "
Position or position relationship are, based on orientation shown in the drawings or position relationship, to be for only for ease of the description present invention and simplify description,
Rather than indicate or imply indication device or element must have specific orientation, with specific azimuth configuration and operation, because
This is not considered as limiting the invention.In describing the invention, unless otherwise stated, " multiple " be meant that two or
Two or more.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Whole description, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Referring to Fig. 1, it is the schematic flow sheet of the hole forming method of the electronic equipment casing of the present invention.The embodiment of the present invention
Hole forming method comprise the following steps：
S11, by protecting film the relevant position of shell is attached to.
In the present embodiment, protecting film is attached to the relevant position of the needs punching of electronic equipment casing, can play and keep away
The peripheral position for exempting from the hole machined region of shell is damaged by mistake by laser and sandblasting.Specifically, the material of the electronic equipment casing is modeling
Material or metal.Wherein, front and back of the electronic equipment casing in hole machined relevant position should all stick protecting film.Wherein,
The front of shell for normally use when the palp face of user, and the back side then for be assemblied in it is interior, normally use when user can not touch
And face.Usually, the protecting film includes plastic sheeting, and the plastic sheeting is firmly attached to shell, and does not stay when tearing
The glue of residual.
In the present embodiment, the protecting film is mylar, preferably high temperature resistance polyester thin film.High temperature resistance polyester thin film has
Excellent physical property, chemical property and dimensional stability, the transparency, recuperability, can clean in laser boring and sandblasting
During play reasonable protective effect.Specifically, above-mentioned high temperature resistance polyester thin film is preferably poly terephthalic acid second two
Ester (PET) plastics, its fatigue resistance and rub resistance are good, wear away it is little and hardness is high, with thermoplastic maximum it is tough
Property；It is that the hole forming method of the present embodiment is cost-effective also, PET is cheap.More specifically, the thickness of the PET film
For 80 μ, preferably high-viscosity product.
S12, using laser, laser carving forms through hole in the relevant position of shell.
In this step, formed from the relevant position laser carving of the needs punching at the electronic equipment casing back side using laser-beam drilling machine
Small through hole.The laser beam of laser boring step high concentration on room and time, using lens focuss, can be by light
Spot diameter narrows down to micron order so as to obtain 105~1015W/cm2Laser power density.So high power density is in plastics
Or laser boring is carried out on metal shell, and compared with other methods such as machine drilling, spark machined routine punching means, tool
There is following significant advantage:Laser boring speed is fast, and efficiency high is good in economic efficiency.Further, swashing in the embodiment of the present invention
The punching number of times of light punch out step is 2~5 times, preferably 3 times；Trepanning velocity is 280~390mm/s, preferably 330mm/s；
The empty hop rate degree of punching is 250~350mm/s, preferably 300mm/s；Laser laser carving Q frequency is 5~13kHz, preferably 8kHz；
Power is 40~80W, preferably 60W.Preferably, the laser boring step in the present embodiment be using power density be l07~
109W/cm2High energy laser beam snap is carried out to plastics or metal shell, there was only 10-3-10-5s action time, because
This laser boring speed is very fast.
Further, the laser boring step in the embodiment of the present invention is by high-effect laser instrument and high-precision lathe and control
System processed coordinates, and by microprocessor programme-control is carried out, and realizes high efficiency punching；With electric spark-erosion perforation and machine drilling phase
Than efficiency improves l0~1000 times.
Further, the technical process of the laser boring of the embodiment of the present invention also needs to arrange air extractor, sharp to take away
Dust produced by light punching, while Manufacturing Worker needs to wear protective mask and protective glassess.
S13, using blasting craft processing enclosure.
In the embodiment of the present invention, because laser boring can all be produced in the positive and negative of through-hole inner surface or shell perforated area
Black yellow vestige, affects the outward appearance of electronic equipment casing.The present embodiment eliminates above-mentioned black yellow vestige by blasting craft.Specifically
Ground, the blasting craft adopts compressed air for power, and at a high speed abrasive material is ejected into into electronic equipment casing to form high velocity spray beam
The inner surface in the front, reverse side and through hole of perforated area, due to impact and shear action of the abrasive material to surface of the work, makes workpiece
Surface obtain certain cleannes and different roughness.
Referring to Fig. 2, it is that the employing blasting craft of the hole forming method of the electronic equipment casing of the embodiment of the present invention is processed
The schematic flow sheet of through-hole inner surface.Wherein, step S13 includes：
S131, by shell sand blasting jig is fixed on.
In this step, shell is fixed on into sand blasting jig, the preferably sand blasting jig on streamline.The sand blasting jig includes
Upper and lower two parts, the sand blasting jig is clamped in shell on streamline.
Sandblasting machine in the embodiment of the present invention is pipeline-type sandblasting machine, is compared compared with the sandblasting machine in technology, the stream
The features such as pipeline type sandblasting machine has high efficiency, high qualification rate, concordance is high.
S132, abrasive material is spurted in through hole at a high speed from the back side of shell and front.
In this step, blasting craft adopts compressed air for power, is at a high speed ejected into abrasive material with forming high velocity spray beam
The obverse and reverse of electronic equipment casing perforated area, while spurting in through hole at a high speed, the black yellow trace that laser carving step is produced
Mark pin grinds, and makes obverse and reverse, the through-hole inner surface of the perforated area in naturally light grey.In addition, the nozzleman of this step
Skill can process the right angle in through hole exit, be allowed to more mellow and fuller, not only be beneficial to sound, also improve profile.
In the embodiment of the present invention, above-mentioned abrasive material includes white fused alumina micropowder, copper ore, quartz sand, corundum, iron ore, Hainan
At least one in sand, preferably white fused alumina micropowder.The white fused alumina micropowder is white, and cutting force is stronger, and chemical stability is good, tool
There is good insulating properties, and have the advantages that not affect that the color of workpiece, process velocity are fast and quality is high.
S133, shell is unloaded from sand blasting jig.
After the sandblasting step of S132 is completed, shell is unloaded from sand blasting jig.
S134, cleans the case surface and through-hole inner surface of electronic equipment.
After the shell to electronic equipment carries out blasting treatment, in addition it is also necessary to clean the abrasive material of case surface.
In this step, the present embodiment is using ultrasonic cleaning technology or blowing technique cleaning case surface；It is preferably ultrasonic
Ripple cleaning technique, can avoid scratch shell from leaving scar.Ultrasonic cleaning technology is that the cavitation using ultrasound wave in a liquid is made
Liquid and dirt directly, are indirectly acted on, acceleration effect and direct flow effect, disperseed crud layer, emulsifying, stripping
And reach cleaning purpose.After ultrasonic clean shell, also need to carry out baking operation.
When the sheathing material of the present embodiment is harder, case surface can be cleaned using high wind.Harder material is cleaned using high wind
The case surface of material will not produce the problem of scratching case surface.
S14, removes protecting film.
In the embodiment of the present invention, after laser boring and blasting craft is completed, the protecting film that S11 is attached is removed.
The hole forming method of electronic equipment casing provided in an embodiment of the present invention, by the phase that protecting film is attached to shell
Answer position, it is to avoid damage of the punch out step to case surface；Formed in the relevant position of shell using the method for laser laser carving
Through hole, it is more more efficient than traditional drilling method, finer；Using the positive and negative and through-hole inner surface of blasting craft processing enclosure,
The yellow black vestige that laser laser carving micropore is formed effectively is removed, realizes that to prepare through hole (such as bellmouth orifice) in electronic equipment casing low
Cost, high efficiency, outward appearance are good, the purpose of high-fineness.
Above the embodiment of the hole forming method of the electronic equipment casing of the present invention is made to be discussed in detail.Below will be corresponding
It is further elaborated in the electronic equipment casing of said method.
The shell of the electronic equipment is processed using above-mentioned hole forming method.
Referring to Fig. 3, it is the perforated area structural representation of the electronic equipment casing of the embodiment of the present invention.As illustrated,
Sender 2 is distributed on shell 1.Sender on shell is processed using above-mentioned hole forming method, the diameter of sender
For 0.4~0.5mm.Wherein, arranging rule of the shape of the shell shown in figure and sender etc. only as an example, specifically should
There can also be other embodiments with, arrangement of the shape to shell and sender etc. herein is not restricted.
Electronic equipment provided in an embodiment of the present invention, it includes shell, and the shell is punched and sprayed using above-mentioned laser laser carving
The processing method punching of sand cleaning, obtains the through hole that outward appearance is good, fineness is high, realizes inexpensive, efficient purpose.
Above disclosed is only a kind of preferred embodiment of the invention, can not limit the power of the present invention with this certainly
Sharp scope, one of ordinary skill in the art will appreciate that all or part of flow process of above-described embodiment is realized, and according to present invention power
Profit requires made equivalent variations, still falls within the covered scope of invention.
Claims (2)
1. the hole forming method of a kind of electronic equipment shell, including：
Mylar is attached to into the relevant position of the shell, the material of the shell includes plastics or metal；
Using laser, laser carving forms through hole in the relevant position of the shell；
The relevant position of through hole described in blasting treatment；
Remove the mylar；
Characterized in that, the punching number of times of the laser carving step be 2~5 times, trepanning velocity be 280~390mm/s, empty hop rate degree
For 250~350mm/s, Q frequencies are 5~13kHz, and power is 40~80W；The laser beam power density of the laser carving step is l07
~109W/cm2；
Include the step of the relevant position of through hole described in the blasting treatment：
The shell is fixed on into sand blasting jig；
Abrasive material is spurted in the through hole at a high speed from the shell rear surface；
The shell is unloaded from the sand blasting jig；
Cleaning treatment, using ultrasonic technology case surface and through-hole inner surface are cleaned.
2. a kind of electronic equipment, it is characterised in that the electronic equipment includes shell, the shell includes sender, it is described go out
Sound hole is processed using the hole forming method of claim 1, a diameter of 0.4~0.5mm of the sender.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510582958.0A CN105234565B (en) | 2015-09-14 | 2015-09-14 | Hole machining method for electronic equipment shell and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510582958.0A CN105234565B (en) | 2015-09-14 | 2015-09-14 | Hole machining method for electronic equipment shell and electronic equipment |
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| CN105234565A CN105234565A (en) | 2016-01-13 |
| CN105234565B true CN105234565B (en) | 2017-05-17 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107309608B (en) * | 2017-06-16 | 2019-11-22 | 昆山市杰尔电子科技股份有限公司 | A kind of speaker net manufacture craft |
| CN110919203B (en) * | 2019-12-02 | 2021-09-10 | 东莞信柏结构陶瓷股份有限公司 | Ceramic surface pattern processing method, ceramic and electronic equipment shell |
| CN113042901A (en) * | 2019-12-10 | 2021-06-29 | 北京小米移动软件有限公司 | Manufacturing method of metal shell sound guide hole, metal shell and electronic device |
| CN111745890A (en) * | 2020-06-09 | 2020-10-09 | 余新军 | Method for injection molding of TPU (thermoplastic polyurethane) on surface of leather |
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| CN101898278A (en) * | 2009-05-27 | 2010-12-01 | 比亚迪股份有限公司 | Laser processing method |
| CN102020417A (en) * | 2009-09-16 | 2011-04-20 | 昆山汉白精密设备有限公司 | Process for processing glass for electronic product |
| CN202123437U (en) * | 2011-05-31 | 2012-01-25 | 应华精密表面处理(苏州)有限公司 | Sand blasting jig |
| CN102404424A (en) * | 2010-09-17 | 2012-04-04 | 比亚迪股份有限公司 | Mobile phone shell and manufacturing method thereof |
| CN204392695U (en) * | 2015-01-19 | 2015-06-10 | 武汉华工激光工程有限责任公司 | A kind of needs carry out the plastic shell structure punched |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001315411A (en) * | 2000-05-08 | 2001-11-13 | Ricoh Co Ltd | Plate for fixing apparatus |
| TWI501373B (en) * | 2012-06-06 | 2015-09-21 | Cmsc Inc | Pre-mold cavity holder with layout |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101898278A (en) * | 2009-05-27 | 2010-12-01 | 比亚迪股份有限公司 | Laser processing method |
| CN102020417A (en) * | 2009-09-16 | 2011-04-20 | 昆山汉白精密设备有限公司 | Process for processing glass for electronic product |
| CN102404424A (en) * | 2010-09-17 | 2012-04-04 | 比亚迪股份有限公司 | Mobile phone shell and manufacturing method thereof |
| CN202123437U (en) * | 2011-05-31 | 2012-01-25 | 应华精密表面处理(苏州)有限公司 | Sand blasting jig |
| CN204392695U (en) * | 2015-01-19 | 2015-06-10 | 武汉华工激光工程有限责任公司 | A kind of needs carry out the plastic shell structure punched |
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Effective date of registration: 20180622 Address after: 523850 No. 281 BBK Avenue, Changan Town, Changan, Guangdong. Patentee after: Weaver Communications Technology Co., Ltd. Address before: 523000 No. 283 BBK Avenue, Changan Town, Changan, Guangdong. Patentee before: VIVO MOBILE COMMUNICATION CO., LTD. |
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Effective date of registration: 20210309 Address after: No.168 Jinghai East Road, Chang'an Town, Dongguan City, Guangdong Province Patentee after: VIVO MOBILE COMMUNICATION Co.,Ltd. Address before: 523850 No. 281 BBK Avenue, Changan Town, Changan, Guangdong. Patentee before: VIVO COMMUNICATION TECHNOLOGY Co.,Ltd. |
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