TWI608323B - Laser processing method, device and program - Google Patents

Description

Laser processing method, device and program

The present invention relates to a laser processing method, apparatus and program, and more particularly to the case of processing a plurality of holes in a substrate by irradiating laser light, and setting an optimum path during irradiation of laser light. A laser processing method and apparatus for processing, and a laser processing program executed in the laser processing apparatus.

As such a technique, for example, the inventions described in Patent Documents 1 and 2 are known. Among them, Patent Document 1 proposes a laser drilling path determination method that can shorten the calculation time required for the path determination, and applies a tour salesman problem based on the position information of a plurality of predetermined opening holes (traveling). The way of the salesman problem (TSP) determines the path that specifies the order in which the laser light is irradiated. The invention has the following features: the path determination by the tour salesman problem includes the steps of dividing the processing area including the irradiation position of the laser light into a plurality of buckets, and determining in which order the tour is divided. a step of the circuit of the plurality of zones, a step of determining a starting point of the start point of the laser light irradiation and a terminal point of the end of the laser light irradiation, and a starting point of each of the divided zones The step of the laser light irradiation position between the point and the terminal point determines the optimal path, and is connected to the beginning end of the area to be patrolled at the terminal point of the area.

On the other hand, Patent Document 2 proposes a laser aperture method in which a wave can be suppressed even when a sheet member having low heat resistance is opened at a narrow pitch. The generation of grain deformation and the like. The invention is a method for performing hole drilling by sequentially irradiating a plurality of predetermined portions of the opening of the sheet member with laser light, and has the following feature: for at least a part of the plurality of predetermined portions of the opening, the one After the predetermined portion of the opening is irradiated with the laser light, a predetermined portion of the opening in a predetermined range is skipped from the predetermined portion of the opening, and the predetermined portion of the opening outside the predetermined range is irradiated with the laser light.

Patent Document 1: Japanese Special Open 2001-195112

Patent Document 2: JP-A-2008-049398

According to the invention described in Patent Document 1, a single processing region is divided into a plurality of regions, and a nearest neighbor method and a 2-opt method are applied to determine a shortest path, thereby increasing the processing speed. However, in the invention described in Patent Document 1, in order to perform laser processing on the shortest path and to perform laser irradiation on the adjacent opening portion, there is a fear that the adjacent aperture is set by the influence of the accumulated heat. The problem that the pore diameter becomes large and the processing quality is lowered.

Therefore, in the invention described in Patent Document 2, in order to eliminate the influence of the accumulated heat, the hole processing is performed without performing laser irradiation on a predetermined portion of the adjacent opening.

However, in the invention described in Patent Document 2, since the predetermined portion of each of the openings is processed, it is impossible to perform the laser irradiation with the shortest path, and accordingly, the processing path becomes long, and the processing efficiency is lowered.

Therefore, the problem to be solved by the present invention is to reduce the unevenness of the pore diameter due to heat to a minimum and to improve the processing quality even when the processing path is the shortest.

In order to solve the above problems, the present invention is a laser processing method, which has a scanning means for scanning laser light emitted from a laser light source in the X direction and the Y direction on a surface of a printed substrate, and moving the printed substrate in the X direction and the Y direction. a moving laser processing method, wherein the printed substrate is processed by the laser beam by the laser light, and the printed circuit board for scanning the laser light is divided into a plurality of scanning regions The order of the openings in the scanning area is sorted in such a manner that the scanning path is the shortest; the Nth hole and the N+1th hole in the hole sorted by the sorting means are judged (where N is "1" The distance between the maximum number of ≦N≦ openings and the integer of −1′′ is less than the preset threshold value, and it is determined that the N+1th hole is not the maximum number of the openings, and the N+1th is exchanged. Replacing the order of the holes and the N+2 holes; determining that the distance between the Nth hole and the N+1th hole exchanged by the switching means is less than the threshold value, After the Nth hole is processed, stop it with a preset heat dissipation time. work.

Thereby, even if the processing path is minimized, the unevenness of the pore diameter due to heat can be suppressed to a minimum.

According to the present invention, even when the processing path is minimized, the unevenness of the pore diameter due to heat can be suppressed to a minimum, and the processing quality can be improved.

1‧‧‧Laser light source

2‧‧‧Laser light

3a, 3b‧‧‧ galvanometer mirror

4‧‧‧f θ lens

5‧‧‧Printing substrate

6‧‧‧XY platform

7‧‧‧Scanning area

8‧‧‧Control device

100‧‧‧ Laser processing equipment

A‧‧‧ sorting

B‧‧‧Reordering

C‧‧‧Processing

H‧‧‧ hole

L‧‧‧ distance

LM‧‧‧ threshold

T‧‧‧ stop time

Fig. 1 is a view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention.

Fig. 2 is a view showing an example of a laser processing path of the laser processing apparatus in the embodiment of the present invention.

Figure 3 is a version executed by a CPU (Central Processing Unit) A flow chart of the main routine of the hole processing in the embodiment.

Fig. 4 is a flow chart showing the processing sequence of the subroutine of the sorting process.

Fig. 5 is a flow chart (1) showing the processing sequence of the subroutine of the reordering process.

Fig. 6 is a flow chart (2) showing the processing sequence of the subroutine of the reordering process.

Fig. 7 is a flow chart (3) showing the processing sequence of the subroutine of the reordering process.

Fig. 8 is a flow chart (1) showing the processing sequence of the subroutine of the processing.

Fig. 9 is a flow chart (2) showing the processing sequence of the subroutine of the processing.

Fig. 10 is a view showing the result of measuring the unevenness of the pore diameter when the distance is changed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Fig. 1 is a view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. In the figure, the laser processing apparatus 100 basically consists of a laser light source 1, a first and a second galvanometer mirror 3a, 3b, an f θ lens 4, an XY stage 6, and a control device 8. Composition.

In the laser processing apparatus 100 having such a basic configuration, the laser light 2 is emitted from the laser light source 1, and the laser light 2 is fixed to the XY via the first and second galvanometer mirrors 3a, 3b and the f θ lens 4. The printed substrate 5 on the stage 6 is scanned in the X direction and the Y direction. That is, the laser light 2 is irradiated onto the surface of the printed circuit board 5 through the f θ lens 4, and at this time, it is scanned in the X direction by the first galvanometer mirror 3a, and is Y in the second galvanometer mirror 3b. Directional scanning. The XY stage moves the printed substrate 5 in the X direction and the Y direction. The first and second galvanometer mirrors 3a and 3b are driven by a galvanometer scanner (not shown), and the angle of the mirror changes (shakes). The control device 8 includes a CPU and a memory (not shown) as control means for the laser The light source 1, the galvanometer scanner, and the XY stage 6 are controlled.

Further, the CPU includes a control unit and a calculation unit, and the control unit controls the flow of the interpretation of the command and the control of the program, and the calculation unit performs the calculation. Further, the program is stored in a memory not shown, and the command to be executed (arrangement of a numerical value or value) is taken out from the memory in which the program is placed, and the program is executed.

Fig. 2 is a view showing an example of a laser processing path of the laser processing apparatus in the embodiment. This figure is a plan view showing a state in which the printed substrate 5 fixed on the XY stage 6 is placed on the XY plane, and shows the first to sixth holes H(1) to H in the scanning area 7 on the printed substrate 5. 6) The position and the state of the machining path.

In the example shown in FIG. 2, the first to sixth six holes H(1)1 to H(6) are disposed in the divided scanning region 7 in the region on the surface of the printed substrate 5. The size of the scanning area 7 is determined by the size of the f θ lens 4. A path (indicated by a solid line) in which the positions of the holes in the scanning area 7 are minimized is a path in which the first holes H(1) to the sixth holes H(6) are connected in order of increasing numbers. L1, L2, L3, L4, L5. In order to prevent the distance between the first hole H(1) and the second hole H(2) from being short, the heat of processing the first hole H(1) affects the second hole (2) and changes the path of the connection L1', L2 ', L3', L4, L5. The L1' is a path from the first hole H(1) toward the third hole H(3), and the L2' is a path from the third hole H(3) toward the second hole H(2), and the L3' is The path from the second hole H(2) toward the fourth hole H(4). Further, in the memory referred to by the CPU when the program is executed, the coordinate values of the holes H(1) to H(6) are input for processing.

Fig. 3 is a flow chart showing the main routine of the hole processing in the present embodiment executed by the CPU.

In the main routine of FIG. 3, first, the entire printed circuit board 5 is divided into scan areas 7 (the total number of ME) determined by the size of the f θ lens 4 (step S1), and the shift to the sort processing A is often performed. formula. In the sorting process A, the order of processing the holes in the scanning area 7 is sorted so that the machining path is the shortest (step S2). Next, the subroutine of the reordering process B is executed (step S3), and after the reordering process B is completed, the subroutine of the process C is executed (step S4). Then, the processing of steps S1 to S4 is repeated until the processing of all the printed substrates 5 set on the XY stage 6 is completed (step S5), and the processing of the main routine is ended when the processing of all the printed substrates 5 is completed. .

4 is a flow chart showing the processing sequence of the subroutine of the sorting process A. In the sorting process A, first, the variable M indicating the number of the divided scanning areas 7 is set to 1 (step S201), and the scanning area is sorted by using the local search method such as the 2-opt method and the processing path becomes the shortest. The order of the holes in 7 (step S202), the sorted holes are the holes H (NE) from the first hole H (1) to the last (the NE, wherein NE is an integer of 2 or more) (step S203) The coordinates of the first to NEth holes H(1) to H(NE) are stored in the control device (memory) 8 (step S204). Thereafter, it is judged whether or not it is the last scan area ME (step S205). With this judgment, if the variable M is smaller than the ME, the variable M is incremented by 1 (step S206), the process proceeds to step S202, and the subsequent processes are repeated. Then, in step S205, the sorting process is ended when the variable M becomes the ME point (the time point when the last scan area ME is reached).

5, 6, and 7 are flowcharts showing the processing procedure of the subroutine of the reordering process B. In the reordering process, after the sorting process A is completed (step S205: Y), the variable M is set to 1 (step S301), and the hole number N is set to 1 (step S302), and the Nth hole H is obtained. (N) The distance L from the (N+1)th hole H(N+1) (step S303). If distance L If it is equal to or greater than the preset threshold LM (step S304: Y), it is determined whether N+1 is the last hole number (step S305), and when it is not the last hole (step S305: N), the hole number is When 1 is added and N=N+1 is set (step S306), the process returns to step S303, and the subsequent processes are repeated. Further, once the next hole is continuously processed one time after the one hole before the processing, the threshold LM system aperture becomes a large distance due to the influence of heat.

In step S304, if the distance L does not reach the threshold value LM (step S304: N), the flow proceeds to the flowchart of Fig. 6, and it is determined whether or not the number N+1 is the last hole (step S307). By this judgment, when the case is not the last hole (step S307: N), the N+1th hole H(N+1) and the N+2th hole H(N+2) are exchanged (step) After S308), the distance L between the Nth hole H(N) and the N+1th hole H(N+1) is obtained again (step S309). Then, the distance L is compared with the threshold LM (step S310), and if the distance L is equal to or greater than the threshold LM, the process returns to the process of step S306 and the subsequent processes are repeated. On the other hand, if the distance L does not reach the threshold value LM (step S310: N), the stop time (heat dissipation time) T for heat dissipation after the processing of the Nth hole H(N) is added to the machining program (step S311). The process returns to the process of step S306 and the subsequent processes are repeated.

When it is determined in step S307 that N+1 is the last hole number NE, the stop time T for heat dissipation after the processing of the Nth hole H(N) is added to the processing program (step S312), and the flow is shifted to the map. In step S313 of step 7, it is determined in step S313 whether there is a scanning area 7 to be processed next, that is, whether or not M=ME is determined, and if there is a scanning area 7 to be processed next (step S313: In the case of N), the variable M is incremented by 1 and M=M+1 is set (step S314), and the process proceeds to step S302, and the subsequent processes are repeated. If there is no scan area 7 to be processed next in step S313 (step S313: Y), the reordering is ended. Reason.

8 and 9 are flowcharts showing the processing procedure of the subroutine of the processing process C. In the processing C, first, the variable M indicating the scanning area 7 is set to 1 (step S401), the hole number N is set to 1 (step S402), and the Nth hole H(N) is processed (step S403). . After that, if the stop time T for heat dissipation after the processing of the Nth hole H(N) is set in the processing program (step S404: Y), the processing is stopped at time T (step S405), and if the stop time is not set. T (step S404: N), it is not stopped, and it is judged whether N is the last hole number NE (step S406).

By this determination, N is the last hole number NE (step S406: Y), and when there is no scan region 7 to be processed next (step S408: Y), the processing C is ended, and the process proceeds to step S5. When there is a scan area 7 to be processed next (step S408: N), M=M+1 is set (step S409), and the process returns to step S402, and the subsequent processes are repeated. If N is not the last hole number NE in step S406 (step S406: N), N is added to 1 (step S407), the process returns to step S403, and the process after step S403 is repeated.

Fig. 10 is a view showing the result of measuring the unevenness of the pore diameter when the distance L is changed. The unevenness of the aperture of the vertical axis is laser processing with a hole diameter of 65 μm, and the value after the aperture is 65 μm is subtracted from the measured value of the processed aperture.

The unevenness of the aperture of the quality is 0.4 μm or less. In order to make the aperture unevenness 0.4 μm or less, the threshold LM of the distance L is preferably about 800 μm or more from FIG. Further, it is experimentally known that even when the distance L is less than 800 μm, if the stop time T is set to 10 msec or more, the aperture unevenness is 0.4 μm or less.

In addition, the threshold LM and the stop time T are preset for each machine in real time. The printed substrate measurement aperture, the threshold value LM, and the stop time T to be processed are stored, and the result is stored in the memory in which the coordinate value is input. The measurement result is held in the memory as a table, for example, and the CPU is used as needed to reflect the value of the table in the control.

As described above, according to the present embodiment, the order of the holes H in the scanning region 7 is sorted so that the processing path is the shortest, and the distance L of the holes which are the targets of the two consecutive openings is shorter than the threshold LM. At the time of moving to the next hole, the processing is stopped by heat dissipation for a predetermined time T. Therefore, even if the processing path is minimized, the unevenness of the aperture due to heat can be minimized. And the processing quality can be improved.

In addition, the laser light source in the patent application scope corresponds to the symbol 1 in the present embodiment, the laser light corresponds to the symbol 2, and the scanning means corresponds to the first and second galvanometer mirrors 3a, 3b and the f θ lens 4, and the XY platform corresponding symbol. 6. The printed substrate corresponds to the symbol 5, the laser processing device corresponds to the symbol 100, the distance corresponding symbol L, the threshold corresponding symbol LM, the heat dissipation time corresponds to the stop time T, the dividing step corresponds to the step S1, and the sorting step corresponds to the sorting process of the steps S201 to S206. A (step S2), the switching step corresponds to steps S303 to S308 (reordering process B: step S3), and the machining stop step corresponds to step S404 and step S405 (processing process C). Further, the dividing step, the sorting step, the changing step, and the processing stopping step are set as the program of the CPU of the control device 8, and are executed by the CPU.

Further, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention, and all of the technical matters included in the technical idea described in the claims are the invention. Object. The above embodiments are preferred, but those skilled in the art can implement various alternatives, modifications, modifications, or improvements in accordance with the disclosure of the present disclosure, and Application The technical scope described in the patent scope.

S1~S5‧‧‧Step S1~Step S5

Y‧‧‧Yes

N‧‧‧No

Claims (3)

A laser processing method includes a scanning means for scanning a laser beam emitted from a laser light source in a X direction and a Y direction on a surface of a printed substrate, and an XY stage for moving the printed substrate in the X direction and the Y direction, and The printed substrate is processed by the plurality of holes by the laser light, wherein the printed circuit board for scanning the laser light is divided into a plurality of scanning regions; and the order of the openings in the scanning region is in a scanning path The distance is the shortest way to sort; to determine the distance between the Nth hole and the N+1th hole in the sorted hole (where N is an integer of "1≦N≦ the largest number of openings-1") If the threshold value is less than the preset threshold, and it is determined that the N+1th hole is not the maximum number of the openings, the order of the N+1th hole and the N+2 hole is reversed; The distance between the N holes and the replaced N+1th hole is less than the threshold value, and after processing the Nth hole, the processing is stopped with a preset heat dissipation time. A laser processing apparatus comprising: a control unit that executes the laser processing method of the first application of the patent scope. A laser processing program is characterized in that a control unit of a laser processing apparatus executes a laser processing method of the first application of the patent scope.