TW201924516A - Circuit board processing method, processing device thereof, and circuit board holder therefor capable of improving the accuracy of a processing position when processing a circuit board on which an electronic component is mounted - Google Patents

Abstract

An object of the present invention is to improve the accuracy of a processing position when processing a circuit board such as a printed circuit board on which an electronic component such as an LSI is mounted. To solve the problem, in a circuit board processing method for processing a position specified by the processing position specifying information of a circuit board on which an electronic component is mounted, it is characterized in using a camera to read a top view image of the electronic component and processing image data from the camera to obtain a reference position for processing the circuit board; and using the reference position as a reference to process the position specified by the processing position specifying information. In addition, in a circuit board processing device for processing a position specified by the processing position specifying information of a circuit board on which an electronic component is mounted, it is characterized by comprising: a camera for reading a top view image of the electronic component; and an image processing part for processing image data from the camera to obtain a reference position for processing the circuit board, wherein the reference position is used as a reference to process the position specified by the processing position specifying information.

Description

Circuit board processing method, processing device therefor and circuit board holder therefor

The present invention relates to a circuit board processing method, a processing apparatus therefor, and a circuit board holder therefor, which are used for processing a circuit board such as a printed circuit board carrying electronic parts such as LSI.

Conventionally, the opening of the printed circuit board is read by, for example, the method disclosed in Patent Document 1, and the alignment mark provided on the printed circuit board is read and used as a reference. However, in the method of performing hole processing based on the alignment mark, when the printed circuit board on which the electronic component has been mounted is opened, there is no guarantee that the electronic component will be mounted with the alignment mark as a reference. When the position of the hole is shifted from the position of the mounting of the electronic component, when the relationship between the actual position of the electronic component and the position of the hole becomes important, there is a disadvantage that the accuracy of the machining position is deteriorated. [Practical Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-246660

[Problems to be Solved by the Invention] Therefore, an object of the present invention is to improve the accuracy of a processing position in the case of processing a circuit board such as a printed circuit board on which an electronic component such as an LSI is mounted.

[Technical means for solving the problem] The representative substrate processing method disclosed in the present invention is characterized in that, in a circuit board processing method for processing a position specified by a processing position specifying information of a circuit board carrying an electronic component, Reading a top view image of the electronic component by a camera, processing image data from the camera, and determining a reference position for processing the circuit board, and specifying the information by specifying the information based on the reference position The position is processed.

Further, a typical substrate processing apparatus disclosed in the present invention is characterized in that a circuit board processing apparatus for processing a position specified by a processing position specifying information of a circuit board on which an electronic component is mounted is provided with a camera. Reading a top view image of the electronic component; and an image processing unit that processes image data from the camera and determines a reference position for processing the circuit board; and based on the reference position and the processing position Specify the location specified by the information for processing.

[Effect of the Invention] According to the present invention, in the case of processing a circuit board such as a printed circuit board carrying an electronic component such as an LSI, the processing position accuracy can be improved.

Hereinafter, embodiments of the present invention will be described using the drawings.

(Embodiment 1) Fig. 4 is a view showing the configuration of a laser aperture opening device according to a first embodiment of the present invention. Each component or connecting line is mainly shown for the purpose of explaining the present embodiment, and does not show all the components necessary as the laser opening device. In the laser hole drilling apparatus of Fig. 4, the printed substrate 1 to be subjected to the drilling process is placed on the processing table 22, and the laser beam emitted from the laser oscillator 23 is scanned by a galvanometer (GALVANO SCANNER) 24 It is deflected and irradiated to the printed substrate 1 to perform opening. 25 is a CCD camera for optically reading a necessary portion from above. 27 is an overall control unit realized by, for example, a program-controlled processing device, and includes an image processing unit for performing image processing on the read data from the CCD camera 25 and performing necessary detection, and controlling the processing table according to the processing program. 22. Operation of the laser oscillator 23 and the scanning galvanometer 24. The overall control unit 27 is configured, for example, mainly by a program-controlled processing device, and each of the constituent elements or connecting lines includes logical objects. Further, the components of the respective components may be provided separately from the overall control unit 27.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining processing according to a first embodiment of the present invention, wherein (a) is a plan view of a printed circuit board after hole drilling, and (b) is a cross-sectional view taken along line A-A of (a). In Fig. 1, reference numeral 1 denotes a printed circuit board on which an electronic distribution network is formed as a circuit board, and an LSI 2 is carried thereon. The shape viewed from above the LSI 2 is a square. On the printed circuit board 1, the holes 4A to 4F are opened by the laser hole opening device of FIG. 4, and the holes 4A to 4F are respectively spaced apart from the center 5 of the LSI 2 by a predetermined distance in the X direction and the Y direction. It is also used to perform electrical connection between, for example, the printed substrate 1 and other parts.

The processing of the holes 4A to 4F is carried out as follows. The coordinates of the rough placement position of the LSI 2 are previously registered in the laser aperture device, and accordingly, the processing table 22 is relatively moved to a position where the LSI camera 25 can read the image of the LSI 2 in a plan view. Next, the overhead image of the LSI 2 is read by the CCD camera 25, and the image data is sent to the image processing unit 26. The image processing unit 26 calculates the area center of gravity based on the image data, and obtains the coordinates of the center 5 of the LSI 2. In addition, although the center 5 of the LSI 2 is obtained from the center of gravity of the area of the overhead image, it is not limited to this method as long as the center can be obtained.

The processing position specifying information for processing which position of the printed substrate 1 is to be processed is stored in advance as the processing data in the overall control unit 27. This machining position designation information becomes coordinate information indicating the relative position of the holes 4A to 4F with respect to the center 5. Then, based on the coordinates of the center 5, the processing table 22 relatively moves relative to the laser irradiation system based on the coordinate information of the holes 4A to 4F, and irradiates the laser beams at respective positions to open the holes 4A to 4F.

According to the first embodiment, the holes 4A to 4F can be processed based on the actual position of the LSI 2, and when the positional relationship between the actual placement position of the LSI 2 and the holes 4A to 4F is important, the holes 4A to 4F are lifted. Processing position accuracy.

(Second Embodiment) Fig. 2 is a view for explaining processing according to a second embodiment of the present invention, wherein (a) is a plan view of a printed circuit board after hole drilling, and (b) is a cross-sectional view taken along line A-A of (a). In FIG. 2, the same reference numerals as in FIG. 1 denote the same as those in FIG. 1. The difference from Embodiment 1 of FIG. 1 is that four LSIs 2 are carried. When the printed circuit board 1 is processed, the coordinates of the approximate placement position of each LSI 2 are registered in advance in the laser aperture device, and the overhead image of each LSI 2 is read by the CCD camera 25. The image processing unit 26 obtains the coordinates of the center 6 of each LSI 2, and further obtains the coordinates of the center 7 among them.

The coordinate information indicating the relative positions of the holes 4A to 4F with respect to the center 7 is the same as that of the first embodiment, and is stored in advance as a processing material in the laser hole opening device. Then, based on the coordinates of the center 7, the processing table 22 relatively moves relative to the laser irradiation system based on the coordinate information of the holes 4A to 4F, and irradiates the laser beams at respective positions to open the holes 4A to 4F.

(Embodiment 3) FIG. 3 is a view for explaining processing according to Embodiment 3 of the present invention, and shows a plan view of a printed circuit board before contour processing. In FIG. 3, the same reference numerals as in FIG. 1 denote the same as those in FIG. 1. 8 is a cutting line for changing the outer shape of the printed substrate 1, that is, so-called contour processing.

The processing of the cutting line 8 is performed as follows. The coordinates of the center 5 of the LSI 2 can be obtained in the same manner as in the case of the embodiment of Fig. 1 . The coordinate information indicating the relative position with respect to the cutting line 8 of the center 5 is the same as that of the first embodiment, and is stored in advance as a processing material in the laser opening device. Then, based on the coordinates of the center 5, the processing table 22 relatively moves relative to the laser irradiation system based on the coordinate information of the cutting line 8, and irradiates the laser at each position to cut the printing at the position of the cutting line 8. Substrate 1.

According to the third embodiment, since the contour processing can be performed based on the position of the actual LSI 2, the positional relationship between the actual placement position of the LSI 2 and the cutting line 8 is important, and the processing position of the cutting line 8 is raised. Accuracy.

(Embodiment 4) According to the processing of the electronic component carried on the substrate for the purpose of the operation state, the accuracy is improved. This case will be described below as the fourth embodiment. As shown in FIG. 5, the substrate holder 28 is mounted on a processing table 22 in which a plurality of printed substrates 1 carrying electronic components are placed side by side in a planar manner. When the printed circuit board 1 is sequentially processed one by one, the substrate holder 28 supplies only the power supply to the electronic component carried by the printed circuit board 1 by the control signal given by the overall control unit 27 to make it operate. The power supply is stopped at the end of the machining to make the electronic component inoperative.

When the electronic component is a light-emitting element such as an LED, the current supplied to the LED of the printed substrate 1 during processing is turned on, and the CCD camera 25 reads the overhead image in the LED light-emitting state. In this case, the number of LEDs carried on each of the printed circuit boards 1 may be one or more. In the latter case, the image processing unit 26 processes the top view images of the plurality of LED groups as a whole, for example, the center position may also be detected. .

The present invention has been specifically described with reference to the embodiments, but the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, although the case of processing by laser is described, the cutting of the opening or the contour processing is not necessarily laser, and other processing tools such as a drill may be used. In addition, the position and the number of the holes may be arbitrary, and the use of the holes may be used for constructing a line in the substrate, or may be used for fixing the substrate to other structures, and the use is not limited.

1‧‧‧Printing substrate

2‧‧‧ LSI

4A～4F‧‧‧ hole

5, 6, 7 ‧ ‧ Center

8‧‧‧ cut line

9‧‧‧LED

22‧‧‧Processing table

23‧‧‧Laser oscillator

24‧‧‧ scanning galvanometer

25‧‧‧CCD camera

26‧‧‧Image Processing Department

27‧‧‧General Control Department

28‧‧‧Substrate holder

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining processing according to a first embodiment of the present invention, wherein (a) is a plan view of a printed circuit board after hole drilling, and (b) is a cross-sectional view taken along line A-A of (a). Fig. 2 is a view for explaining processing according to a second embodiment of the present invention, wherein (a) is a plan view of the printed circuit board after the hole drilling process, and (b) is a B-B cross-sectional view of (a). Fig. 3 is a view for explaining processing according to Embodiment 3 of the present invention, showing a plan view of a printed circuit board before contour processing. Fig. 4 is a view showing the configuration of a laser aperture opening device according to a first embodiment of the present invention. Fig. 5 is a view showing the configuration of a laser aperture opening device according to a fourth embodiment of the present invention.

Claims (10)

A circuit board processing method for processing a position specified by a processing position specifying information of a circuit board carrying an electronic component, wherein the camera reads a top view image of the electronic component, and processes image data from the camera and A reference position for processing the board is determined, and a position specified by the processing position specifying information is processed based on the reference position. The method of processing a circuit board according to claim 1, wherein a center of a top view image of the electronic component is used as the reference position. The method of processing a circuit board according to claim 1, wherein when the plurality of electronic components are carried on the circuit board, a center of a center of a top view image of each of the electronic components is used as the Base position. The method of processing a circuit board according to claim 1, wherein the electronic component is a person capable of emitting light, and the camera reads a top view image of the electronic component in a light-emitting state. The method of processing a circuit board according to claim 4, wherein, when the plurality of circuit boards are sequentially processed, the electronic components are sequentially illuminated in accordance with the respective circuit boards. A circuit board processing apparatus for processing a position specified by processing position specifying information of a circuit board carrying an electronic component, comprising: a camera that reads a top view image of the electronic component; and an image processing unit, The image data from the camera is processed to determine a reference position for processing the board; and the position specified by the processing position specifying information is processed based on the reference position. The circuit board processing apparatus according to claim 6, wherein the image processing unit detects the center of the overhead image of the electronic component as a reference position. The circuit board processing apparatus according to claim 6, wherein the image processing unit is a center of a top view image of each of the electronic components when the electronic component is loaded on the circuit board. The center is detected as a reference position. The circuit board processing apparatus according to claim 6, wherein the electronic component is a person capable of emitting light, and the camera reads a top view image of the electronic component in a light-emitting state. A circuit board holder for placing a plurality of circuit boards carrying illuminable electronic components side by side, characterized in that: a power supply control function is provided, and the power supply control function is installed in the circuit board holder for processing When each of the circuit boards is sequentially processed on the processing table provided in the processing apparatus of the circuit board, the electronic components are sequentially turned on in accordance with the respective circuit boards.