CN109803495B - Circuit board processing method, processing device for same and circuit board holder - Google Patents
Circuit board processing method, processing device for same and circuit board holder Download PDFInfo
- Publication number
- CN109803495B CN109803495B CN201811366811.8A CN201811366811A CN109803495B CN 109803495 B CN109803495 B CN 109803495B CN 201811366811 A CN201811366811 A CN 201811366811A CN 109803495 B CN109803495 B CN 109803495B
- Authority
- CN
- China
- Prior art keywords
- processing
- circuit board
- electronic component
- center
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The purpose of the present application is to improve the accuracy of a processing position when processing a circuit board such as a printed circuit board on which electronic components such as LSIs are mounted. A method for processing a circuit board, wherein a position of the circuit board on which an electronic component is mounted, which is designated by processing position designation information, is processed by reading a top view image of the electronic component by a camera, processing image data from the camera to determine a reference position for processing the circuit board, and processing the position designated by the processing position designation information with the reference position as a reference.
Description
Technical Field
The present application relates to a method for processing a circuit board such as a printed circuit board on which electronic components such as LSI are mounted, a processing apparatus therefor, and a circuit board holder used therein.
Background
Conventionally, as disclosed in patent document 1, for example, an opening to a printed board is performed by reading an alignment mark provided on the printed board, and taking the read alignment mark as a reference.
However, in the method of processing the holes with the alignment marks as the reference, in the case of punching the printed board on which the electronic component has been mounted, since it is not ensured that the electronic component is always mounted with the alignment marks as the reference, there is a problem that the positional deviation of the holes with respect to the mounting position of the electronic component occurs, and when the relationship between the actual position of the electronic component and the hole position becomes important, the accuracy of the processing position becomes poor.
Patent document 1: japanese patent application laid-open No. 2008-246660.
Disclosure of Invention
Problems to be solved by the application
Therefore, an object of the present application is to improve the accuracy of a processing position when processing a circuit board such as a printed circuit board on which electronic components such as LSI are mounted.
Means for solving the problems
A typical method for processing a substrate disclosed in the present application is a method for processing a circuit board, which is characterized in that a camera reads a top view image of an electronic component, processes image data from the camera to obtain a reference position for processing the circuit board, and processes a position specified by processing position specification information based on the reference position.
Further, a typical substrate processing apparatus disclosed in the present application is a circuit board processing apparatus for processing a position designated by processing position designation information of a circuit board on which an electronic component is mounted, and is characterized by comprising a camera for reading a top view image of the electronic component, and an image processing unit for processing image data from the camera to obtain a reference position for processing the circuit board, wherein the circuit board processing apparatus processes the position designated by the processing position designation information with reference to the reference position.
Effects of the application
According to the present application, when a circuit board such as a printed circuit board on which electronic components such as LSI are mounted is processed, the accuracy of the processing position can be improved.
Drawings
Fig. 1 is a view for explaining the processing performed in example 1 of the present application, fig. 1 (a) is a plan view of a printed board after the hole forming processing, and fig. 1 (b) is a sectional view A-A of fig. 1 (a).
Fig. 2 is a view for explaining the processing performed in example 2 of the present application, fig. 2 (a) is a plan view of a printed circuit board after the hole forming processing, and fig. 2 (B) is a B-B cross-sectional view of fig. 2 (a).
Fig. 3 is a diagram for explaining the processing performed in example 3 of the present application, and shows a plan view of a printed board before outline processing.
Fig. 4 is a structural diagram of a laser drilling apparatus according to embodiment 1 of the present application.
Fig. 5 is a structural diagram of a laser drilling apparatus according to embodiment 4 of the present application.
Detailed Description
Hereinafter, embodiments of the present application will be described with reference to the drawings.
Example 1
Fig. 4 is a structural diagram of a laser drilling apparatus according to embodiment 1 of the present application. The respective constituent elements and connection lines are mainly considered to be structures required for explaining the present embodiment, and not all of the structures required for the laser drilling device are shown.
In the laser drilling apparatus of fig. 4, a printed board 1 to be drilled is placed on a processing table 22, and laser light emitted from a laser oscillator 23 is deflected by a galvanometer scanner (galvanometer scanner) 24 and irradiated onto the printed board 1, thereby drilling. Reference numeral 25 denotes a CCD camera for optically reading a desired portion from above. Reference numeral 27 denotes an overall control unit implemented by a processing device controlled by a program, for example, and the overall control unit incorporates an image processing unit for performing image processing on read data from the CCD camera 25 to perform necessary detection, and controls operations of the machining table 22, the laser oscillator 23, and the galvanometer scanner 24 in accordance with a machining program. The overall control unit 27 is configured mainly by a processing device controlled by a program, for example, and each of the constituent elements and the connection lines includes a logical configuration. Further, a part of each component may be provided separately from the overall control unit 27.
Fig. 1 is a view for explaining the processing performed in example 1 of the present application, fig. 1 (a) is a plan view of a printed board after the hole forming processing, and fig. 1 (b) is a sectional view A-A of fig. 1 (a).
In fig. 1, 1 is a printed circuit board on which an electric wiring network is formed as a circuit board, and LSI2 is mounted thereon. The LSI2 has a square shape when viewed from above. The holes 4A to 4F are formed in the printed circuit board 1 by the laser drilling apparatus of fig. 4, but these holes 4A to 4F are located at predetermined distances in the X direction and the Y direction with respect to the center 5 of the LSI2, respectively, and are used for electrically connecting the printed circuit board 1 to other components, for example.
The holes 4A to 4F are processed as follows.
The coordinates of the approximate mounting position of the LSI2 are registered in the laser drilling apparatus in advance, and based on this, the processing table 22 is relatively moved to a position where the top view image of the LSI2 is read by the CCD camera 25.
Next, the top view image of the LSI2 is read by the CCD camera 25, and the image data is sent to the image processing unit 26. The image processing unit 26 calculates the area center of gravity from the image data, and obtains the coordinates of the center 5 of the LSI2.
The center 5 of the LSI2 is obtained from the area center of gravity of the plan view image, but this method is not necessarily required as long as the center is obtained.
The processing position specification information of which position of the printed circuit board 1 is to be processed is stored in advance as processing data in the overall control unit 27. The machining position specification information is coordinate information indicating the relative positions of the holes 4A to 4F with respect to the center 5. Therefore, the processing table 22 is moved relative to the laser irradiation system based on the coordinate information of the holes 4A to 4F with respect to the coordinates of the center 5, and the laser is irradiated to each position to open the holes 4A to 4F.
According to embodiment 1 above, since the holes 4A to 4F can be processed with reference to the actual mounting position of the LSI2, when the positional relationship between the actual mounting position of the LSI2 and the holes 4A to 4F is important, the accuracy of the processing positions of the holes 4A to 4F improves.
Example 2
Fig. 2 is a view for explaining the processing performed in example 2 of the present application, fig. 2 (a) is a plan view of a printed circuit board after the hole forming processing, and fig. 2 (b) is a sectional view A-A of fig. 2 (a).
In fig. 2, the same reference numerals as in fig. 1 denote the same elements as in fig. 1. Unlike embodiment 1 of fig. 1, 4 LSIs 2 are mounted.
When processing the printed circuit board 1, the coordinates of the approximate mounting positions of the respective LSIs 2 are registered in the laser drilling apparatus in advance, and the top view image of each LSI2 is read by the CCD camera 25. The image processing unit 26 obtains the coordinates of the center 6 of each LSI2 and further obtains the coordinates of the center 7 among them.
Coordinate information indicating the relative positions of the holes 4A to 4F with respect to the center 7 is stored in the laser drilling apparatus in advance as machining data in the same manner as in example 1. Therefore, the processing table 22 is moved relative to the laser irradiation system based on the coordinate information of the holes 4A to 4F with respect to the coordinates of the center 7, and laser light is irradiated to each position to open the holes 4A to 4F.
Example 3
Fig. 3 is a diagram for explaining the processing performed in example 3 of the present application, and shows a plan view of a printed board before outline processing.
In fig. 3, the same reference numerals as in fig. 1 denote the same elements as in fig. 1. 8 denotes a cutting line for so-called outline processing for changing the outline of the printed circuit board 1.
The cutting wire 8 is processed as follows.
The coordinates of the center 5 of the LSI2 are obtained in the same manner as in the case of the embodiment of fig. 1.
The coordinate information indicating the relative position of the cutting line 8 with respect to the center 5 is stored in the laser drilling apparatus in advance as machining data in the same manner as in example 1. Therefore, the processing table 22 is moved relative to the laser irradiation system based on the coordinate information of the cutting line 8 with respect to the coordinates of the center 5, and laser light is irradiated to each position, whereby the printed circuit board 1 is cut at the position of the cutting line 8.
According to embodiment 3 above, since the outline processing can be performed with reference to the actual mounting position of the LSI2, when the positional relationship between the actual mounting position of the LSI2 and the cutting wire 8 is important, the processing position accuracy of the cutting wire 8 is improved.
Example 4
In some cases, the accuracy of the electronic component mounted on the substrate is improved when the electronic component is brought into an operating state by the intended processing, and this will be described as example 4.
As shown in fig. 5, the substrate holder 28 is mounted on the processing table 22, and a plurality of printed boards 1 on which electronic components are mounted are arranged in a planar manner and placed on the substrate holder 28. When the printed boards 1 are processed one by one in sequence, the board holder 28 supplies power only to the electronic components mounted on the processed printed boards 1 by the control signal given from the overall control unit 27 to bring the electronic components into an operating state, and stops the power supply to bring the electronic components into a non-operating state if the processing is completed.
When the electronic component is a light emitting element such as an LED, for example, the current supply to the LED mounted on the processed printed board 1 is turned on, and a top view image of the LED in a light emitting state is read by the CCD camera 25. In this case, the number of LEDs mounted on each of the printed boards 1 may be one or a plurality, and in the latter case, the image processing unit 26 may process a top view image of the entire plurality of LED groups, for example, detect the center position.
The present application has been specifically described based on the embodiments, but the present application is not limited to the foregoing embodiments, and it is needless to say that various modifications are possible within the scope not departing from the gist thereof, including various modifications.
For example, the case of laser processing has been described, but the cutting by the hole forming or outline processing is not necessarily laser, and other processing tools such as a drill may be used.
In the case of the holes, the locations and the number thereof may be arbitrary, and the purpose of the holes may be used for constructing a circuit in a substrate or for fixing the substrate to another structure, and the purpose is not limited.
Description of the reference numerals
1: a printed substrate; 2: an LSI;4A to 4F: a hole; 5. 6, 7: a center; 8: cutting off the wire; 9: an LED;22: a processing table; 23: a laser oscillator; 24: a galvanometer scanner; 25: a CCD camera; 26: an image processing section; 27: an overall control unit; 28: a substrate holder.
Claims (6)
1. A method for processing a circuit board, which processes a position designated by processing position designating information of the circuit board on which electronic parts are mounted,
reading a top view image of the electronic component by a camera, processing image data from the camera to obtain a reference position for processing the circuit board, and processing a position specified by the processing position specification information based on the reference position;
here the number of the elements is the number,
the center of the electronic component obtained from the area center of gravity of the plan view image of the electronic component is set as the reference position, the machining position specification information is coordinate information indicating a relative position of a machining position with respect to the center of the electronic component,
when a plurality of electronic components are mounted on the same surface of the circuit board, a center of each of the plurality of electronic components obtained from an area center of gravity of a top view image of each of the plurality of electronic components mounted on the same surface is set as the reference position, and the processing position specification information is coordinate information indicating a relative position of a processing position with respect to the center of each of the plurality of electronic components.
2. The method for manufacturing a circuit board according to claim 1, wherein,
the electronic component is capable of emitting light, and the camera reads a top view image of the electronic component in a light emitting state.
3. The method for manufacturing a circuit board according to claim 2, wherein,
when a plurality of circuit boards are sequentially processed, the electronic components are sequentially set to a light-emitting state for each circuit board.
4. A processing device for a circuit board, which processes a position designated by processing position designating information of the circuit board on which electronic parts are mounted,
the electronic component processing device is provided with a camera and an image processing part, wherein the camera reads a top view image of the electronic component, the image processing part processes image data from the camera to obtain a reference position for processing the circuit board, and the processing device of the circuit board processes a position specified by the processing position specification information by taking the reference position as a reference;
here the number of the elements is the number,
the image processing unit detects a center of the electronic component obtained from an area center of gravity of a top view image of the electronic component as the reference position, and the processing position specification information is coordinate information indicating a relative position of a processing position with respect to the center of the electronic component,
when a plurality of the electronic components are mounted on the same surface of the circuit board, the image processing unit detects a center of each of the plurality of electronic components, which is obtained from an area center of gravity of a top view image of each of the plurality of electronic components mounted on the same surface, as the reference position, and the processing position specification information is coordinate information indicating a relative position of a processing position with respect to the center of each of the plurality of electronic components.
5. The apparatus for processing circuit board according to claim 4, wherein,
the electronic component is capable of emitting light, and the camera reads a top view image of the electronic component in a light emitting state.
6. A circuit board holder for use in the processing apparatus for circuit boards according to claim 4, characterized in that,
the plurality of circuit boards on which the electronic components capable of emitting light are mounted are arranged and mounted on the circuit board holder, and the circuit board holder is mounted on a processing table provided in the processing device for processing the circuit boards, and the circuit board holder has a power supply control function for sequentially placing the electronic components in a light emitting state for each circuit board when the circuit boards are sequentially processed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-221554 | 2017-11-17 | ||
| JP2017221554 | 2017-11-17 | ||
| JP2018-162312 | 2018-08-31 | ||
| JP2018162312A JP7163110B2 (en) | 2017-11-17 | 2018-08-31 | Circuit board processing method, processing apparatus therefor, and circuit board holder used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109803495A CN109803495A (en) | 2019-05-24 |
| CN109803495B true CN109803495B (en) | 2023-09-01 |
Family
ID=66556293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811366811.8A Active CN109803495B (en) | 2017-11-17 | 2018-11-16 | Circuit board processing method, processing device for same and circuit board holder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109803495B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111451732A (en) * | 2020-05-06 | 2020-07-28 | 宝利根（东莞）电子科技有限公司 | Integral combined machining process for parts |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11221690A (en) * | 1998-02-09 | 1999-08-17 | Mitsubishi Electric Corp | Laser beam machine, and laser beam machining method |
| JP2000183492A (en) * | 1998-12-15 | 2000-06-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed circuit board |
| JP2007012651A (en) * | 2005-06-28 | 2007-01-18 | Hitachi High-Tech Instruments Co Ltd | Method and device for updating mounting coordinate data in electronic component mounter |
| WO2015166543A1 (en) * | 2014-04-28 | 2015-11-05 | 株式会社小滝電機製作所 | Manufacturing method and manufacturing apparatus for substrate with positioning hole, and a plurality of substrates each with positioning hole |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4328409B2 (en) * | 1999-04-12 | 2009-09-09 | 富士フイルム株式会社 | Light emitting device bonding equipment |
-
2018
- 2018-11-16 CN CN201811366811.8A patent/CN109803495B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11221690A (en) * | 1998-02-09 | 1999-08-17 | Mitsubishi Electric Corp | Laser beam machine, and laser beam machining method |
| JP2000183492A (en) * | 1998-12-15 | 2000-06-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed circuit board |
| JP2007012651A (en) * | 2005-06-28 | 2007-01-18 | Hitachi High-Tech Instruments Co Ltd | Method and device for updating mounting coordinate data in electronic component mounter |
| WO2015166543A1 (en) * | 2014-04-28 | 2015-11-05 | 株式会社小滝電機製作所 | Manufacturing method and manufacturing apparatus for substrate with positioning hole, and a plurality of substrates each with positioning hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109803495A (en) | 2019-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10993304B2 (en) | Wire, stripping method and light strip | |
| JP5283195B2 (en) | LED wiring board and light irradiation device | |
| JP7163110B2 (en) | Circuit board processing method, processing apparatus therefor, and circuit board holder used therefor | |
| US20020109775A1 (en) | Back-lighted fiducial recognition system and method of use | |
| US10548231B2 (en) | Apparatus for depositing conductive and nonconductive material to form a printed circuit | |
| CN108541400A (en) | For the method by the positioning of at least one electronic unit on circuit boards | |
| US11596071B2 (en) | Apparatus for depositing conductive and nonconductive material to form a printed circuit | |
| US10178820B2 (en) | Board work machine and recognition method | |
| EP3379912A1 (en) | Substrate working machine and insertion method | |
| CN109803495B (en) | Circuit board processing method, processing device for same and circuit board holder | |
| CN113597132B (en) | Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board) | |
| CN112867266B (en) | PCB grooving process method | |
| JP4823605B2 (en) | Exposure apparatus, exposure method, and pattern manufacturing system | |
| JP6232188B2 (en) | Electronic circuit production history management system, electronic circuit production history management method, and computer program | |
| KR20100056234A (en) | Product control system using 2d barcode and methode the same | |
| CN113366935B (en) | Reference mark determination device and reference mark determination method | |
| EP3490361B1 (en) | Substrate work machine | |
| EP2448391A2 (en) | Positioning device for inserting pin into PCB, method and apparatus for inserting pin into PCB | |
| KR102302345B1 (en) | Method for positioning a carrier with electronic components and electronic component produced with such method | |
| JP2016112864A (en) | Metal mask data output device and output method | |
| US20180047179A1 (en) | Recognition device and recognition method | |
| EP3823428B1 (en) | Template creating device and component mounting machine | |
| US20240057260A1 (en) | Circuit board manufacturing system and method | |
| JP2001105387A (en) | V-cutting method and v-cutting device | |
| WO2021038850A1 (en) | Work machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |